JP6136400B2 - Manufacturing method of color filter - Google Patents

Description

  The present invention relates to a method for producing a color filter capable of efficiently producing a color filter used in an organic electroluminescence display device, a method for producing an organic electroluminescence display device using the same, a color filter, and an organic electroluminescence display device About.

  An organic electroluminescence (hereinafter abbreviated as “organic EL”) display device has high visibility due to self-coloring, and, unlike a liquid crystal display device, is an all-solid-state display, has excellent impact resistance, and has a high response speed. Attention has been focused on advantages such as little influence from temperature changes and a large viewing angle.

  Organic EL display devices have been put to practical use mainly for small screens of about several inches such as in-vehicle navigation, mobile phones, digital cameras, etc., but recently, large screens of, for example, 20 inches or more as represented by flat-screen televisions. Development of computerization has been demanded.

  However, when the organic EL display device has a large screen of, for example, 20 inches or more, the wiring length for supplying drive current to each pixel is extremely different between the outer peripheral portion and the central portion of the screen. For this reason, in the central portion of the screen, the degree of voltage drop is larger than that of the outer peripheral portion of the screen, resulting in inconvenience that luminance unevenness occurs (for example, Patent Documents 1 to 4). This tendency becomes more prominent as the screen becomes larger. In particular, the wiring for supplying the drive current is conducted through a transparent electrode layer such as ITO formed on the organic EL layer including the light emitting layer, and this ITO has a larger resistance than, for example, metal Cu, and therefore ITO. The effect of voltage drop is great.

In addition, there are a passive matrix method and an active matrix method as a driving method of the organic EL display device, but the former has a problem that it is difficult to realize a large-sized and high-definition display device although the structure is simple. In order to increase the size, the latter active matrix system has been actively developed. In the active matrix method, a current flowing in an organic EL element arranged for each pixel is converted into a TFT (Thin in a drive circuit provided for each organic EL element).
It is controlled by Film Transistor).

Japanese Patent No. 4489472 Japanese Patent No. 4367346 JP 2009-26828 A JP 2011-96682 A

As a result of intensive studies in view of the above circumstances, the present inventors have found an organic EL display device 200 having the configuration illustrated in FIG. 12 as an organic EL display device capable of preventing the above-described luminance unevenness. .
That is, the organic EL display device 200 illustrated in FIG. 12 includes a transparent substrate 21, a low reflection layer 22 such as a light-shielding portion formed on the transparent substrate 21, and a coloring formed in the opening of the low reflection layer 22. Layer 23 (in FIG. 12, red colored layer 23R, green colored layer 23G, blue colored layer 23B, white colored layer 23W), low reflection layer 22 and overcoat layer 26 formed as necessary on colored layer 23, The metal electrode layer 24 formed on the low reflection layer 22, the columnar structure 25 formed in a pattern on the metal electrode layer 24, and the metal electrode layer 24 and the columnar structure 25 were formed over the entire surface. Organic EL device comprising a color filter 20 comprising a transparent electrode layer 27, a substrate 71, and an organic EL device 80 having a lower electrode layer 81, an organic EL layer 83, and an upper transparent electrode layer 85 The transparent electrode layer 27 side surface of the color filter 20 and the organic EL element side substrate 70 side surface of the organic EL element side substrate 70 are opposed to each other, and the transparent electrode layer 27 and the upper transparent electrode layer 85 are electrically connected. It is something that is in contact. By having such a configuration, the current from the organic EL element side substrate 70 can be led to the color filter 20 side via the transparent electrode layer 27 and the metal electrode layer 24 and can be released. Brightness unevenness can be prevented.
In addition, the code | symbol which is not demonstrated in FIG. 12 is mentioned later. 13A is a schematic plan view of the color filter 20 in FIG. 12, and FIG. 13B is a cross-sectional view taken along line AA in FIG. In FIG. 13A, the overcoat layer and the transparent electrode layer are omitted.

  However, in manufacturing the color filter 20 illustrated in FIGS. 13A and 13B used in the organic EL display device described above, there are concerns that the number of steps is large and time and cost are required. In recent years, in organic EL display devices, display with high luminance is required. However, since the above-described color filter needs to form a transparent electrode layer on the entire surface, the transmittance of the color filter decreases. There is a concern that a desired luminance cannot be obtained.

Thus, as a result of further intensive studies, the present inventors have found a conductive partition made of a conductive photosensitive resin as an alternative to the above-described laminate of the columnar structure and the transparent electrode layer, thereby completing the present invention. It came to.
When used in an organic EL display device, the present invention can prevent the occurrence of luminance unevenness, and can produce a color filter that can efficiently produce a color filter that can display with good luminance. It is a main object to provide a method, a method for manufacturing an organic EL display device using the method, a color filter, and an organic EL display device.

  In order to solve the above problems, the present invention provides a transparent substrate, a low reflection layer formed on the transparent substrate and having an opening, a colored layer formed in the opening of the low reflection layer on the transparent substrate, And a color filter forming substrate comprising an auxiliary electrode layer formed on the entire surface of the low reflection layer and the colored layer, and an electrically conductive photosensitive material comprising an electrically conductive photosensitive resin on the entire surface of the auxiliary electrode layer. A conductive photosensitive resin layer forming step for forming a conductive resin layer, and after the conductive photosensitive resin layer is exposed and developed, the colored layer is formed so as to overlap the low reflective layer in plan view. A conductive barrier rib forming step for forming a conductive barrier rib having an opening that overlaps in plan view, and an etching step for etching an exposed portion of the auxiliary electrode layer in which the conductive barrier rib is formed. Kara To provide a method of manufacturing a filter.

According to the present invention, by having the conductive partition step, a conductive partition that can be electrically connected to the auxiliary electrode layer can be formed, and the entire surface on the color filter can be electrically connected to each other. Since it is not necessary to form a transparent electrode layer or the like, a color filter having good transmittance can be manufactured with fewer manufacturing steps.
In addition, according to the present invention, since the conductive partition can be used as a resist when the auxiliary electrode layer is etched by having the etching step, a resist for etching the auxiliary electrode layer is separately formed. In addition, it is not necessary to perform the step of removing the resist after etching, and the number of manufacturing steps can be reduced.
Therefore, according to the present invention, by having the conductive partition step and the etching step, it is possible to prevent uneven brightness when used in an organic EL display device, and display with good brightness. The color filter which can be manufactured can be manufactured efficiently.

  The present invention provides a transparent substrate, a low reflection layer formed on the transparent substrate and having an opening, a colored layer formed in the opening of the low reflection layer on the transparent substrate, and the low reflection layer and the coloring Preparing a color filter forming substrate having an auxiliary electrode layer formed on the entire surface of the layer, and forming a conductive photosensitive resin layer composed of a conductive photosensitive resin on the entire surface of the auxiliary electrode layer; A photosensitive resin layer forming step, wherein the conductive photosensitive resin layer is exposed and then developed to form an opening that overlaps the low reflection layer in plan view and overlaps the colored layer in plan view. A color filter forming method comprising: a conductive partition forming step for forming a conductive partition; and an etching step for etching an exposed portion of the auxiliary electrode layer on which the conductive partition is formed. The color filter forming step to be formed, the substrate, the lower electrode layer formed on the substrate, the organic EL layer formed on the lower electrode layer, including the light emitting layer, and the organic EL layer An organic EL element side substrate including an organic EL element having an upper surface transparent electrode layer is prepared, the conductive partition side surface of the color filter is opposed to the organic EL element side surface of the organic EL element side substrate, And a step of assembling the conductive partition and the upper transparent electrode layer so that they are in contact with each other. The method for manufacturing an organic EL display device is provided.

  According to the present invention, by having the color filter forming step, it is possible to prevent the occurrence of luminance unevenness and efficiently manufacture an organic EL display device capable of performing display with good luminance. It becomes.

  The present invention provides a transparent substrate, a low reflection layer formed on the transparent substrate and having an opening, a colored layer formed in the opening of the low reflection layer on the transparent substrate, and the low reflection layer There is provided a color filter comprising: an auxiliary electrode layer formed on the auxiliary electrode layer; and a conductive partition formed on the auxiliary electrode layer and made of a conductive photosensitive resin.

According to the present invention, by providing the conductive partition, when used in an organic EL display device, the conductive partition and the upper surface transparent electrode layer of the organic EL element side substrate are brought into contact with each other so as to be in color. Filters can be placed. For this reason, in the organic EL display device, the conductive partition and the top transparent electrode layer are in contact with each other so that current from the organic EL element side substrate is passed through the conductive partition and the auxiliary electrode layer. Therefore, it is possible to prevent the occurrence of uneven brightness due to a voltage drop.
Moreover, according to this invention, when it uses for an organic electroluminescent display apparatus by providing the said electroconductive partition, the upper surface transparent electrode layer of an organic electroluminescent display apparatus and the auxiliary electrode layer of a color filter are made to conduct and contact. Therefore, since it is not necessary to form a transparent electrode layer on the auxiliary electrode layer, it is possible to display with good luminance and to make a color filter with high productivity.

  The present invention includes a transparent substrate, a low reflection layer formed on the transparent substrate and having an opening, a colored layer formed in the opening of the low reflection layer on the transparent substrate, an auxiliary electrode layer formed on the low reflection layer, And a color filter comprising a conductive partition formed on the auxiliary electrode layer and made of a conductive photosensitive resin, a substrate, a lower electrode layer formed on the substrate, and formed on the lower electrode layer. And an organic EL element side substrate comprising an organic EL element having an organic EL layer including a light emitting layer and an upper transparent electrode layer formed on the organic EL layer, and the conductive partition side surface of the color filter And the organic EL element side substrate of the organic EL element side substrate are disposed so as to face each other, and the conductive partition wall and the upper transparent electrode layer are in contact with each other so as to be conductive. Provide EL display device That.

According to the present invention, since the conductive partition and the upper transparent electrode layer are in contact with each other, the current from the organic EL element side substrate is colored through the conductive partition and the auxiliary electrode layer. Since it can escape to the filter side, it can be set as the organic electroluminescence display which can prevent the brightness nonuniformity by voltage drop.
In addition, according to the present invention, by having the color filter including the conductive partition, the upper transparent electrode layer of the organic EL display device and the auxiliary electrode layer of the color filter are brought into electrical contact with each other. Further, since it is not necessary to form a transparent electrode layer, display can be performed with good luminance, and an organic EL display device with high productivity can be obtained.

The method for producing a color filter of the present invention, when used in an organic EL display device, can prevent the occurrence of luminance unevenness and efficiently produce a color filter capable of performing display with good luminance. There is an effect that can be done.
Moreover, the manufacturing method of the organic EL display device of the present invention has an effect that an organic EL display device capable of preventing the occurrence of luminance unevenness can be efficiently manufactured.

It is a flowchart which shows an example of the manufacturing method of the color filter of this invention. It is process drawing which shows an example of the manufacturing method of the color filter of this invention. It is the schematic which shows an example of the color filter of this invention. It is a schematic sectional drawing which shows an example of the organic electroluminescent display apparatus of this invention. It is a schematic sectional drawing which shows the other example of the color filter of this invention. It is process drawing which shows the other example of the manufacturing method of the color filter of this invention. It is a schematic sectional drawing which shows the other example of the color filter of this invention. It is a flowchart which shows an example of the manufacturing method of the organic electroluminescent display apparatus of this invention. It is process drawing which shows an example of the manufacturing method of the organic electroluminescent display apparatus of this invention. It is a schematic sectional drawing which shows the other example of the organic electroluminescent display apparatus of this invention. It is a schematic sectional drawing which shows the other example of the organic electroluminescent display apparatus of this invention. It is a schematic sectional drawing which shows the other example of the conventional organic EL display apparatus. It is the schematic which shows an example of the conventional color filter. It is a flowchart which shows an example of the manufacturing method of the conventional color filter. It is process drawing which shows an example of the manufacturing method of the conventional color filter.

  Hereinafter, a method for manufacturing a color filter, a method for manufacturing an organic EL display device, a color filter, and an organic EL display device according to the present invention will be described.

A. Manufacturing method of color filter The manufacturing method of the color filter of the present invention is formed on the transparent substrate, the low reflection layer formed on the transparent substrate and having an opening, and the opening of the low reflection layer on the transparent substrate. A color filter forming substrate comprising a colored layer and an auxiliary electrode layer formed on the entire surface of the low reflection layer and the colored layer is prepared, and the entire surface of the auxiliary electrode layer is composed of a conductive photosensitive resin. A conductive photosensitive resin layer forming step for forming a conductive photosensitive resin layer, and after the conductive photosensitive resin layer is exposed and developed, it is formed so as to overlap the low reflective layer in plan view, A conductive partition forming step of forming a conductive partition having an opening overlapping the colored layer in plan view; and an etching step of etching an exposed portion of the auxiliary electrode layer on which the conductive partition is formed. It is a manufacturing method characterized by doing.

The manufacturing method of the color filter of this invention is demonstrated using figures.
FIG. 1 is a flowchart showing an example of a method for producing a color filter of the present invention, and FIGS. 2A to 2E are process diagrams showing an example of a method for producing a color filter of the present invention. In the method for manufacturing a color filter of the present invention, first, as shown in FIG. 2A, a transparent substrate 11, a low reflection layer 12 formed on the transparent substrate 11 and having an opening x, and a low reflection on the transparent substrate 11. The colored layer 13 formed in the opening of the layer 12 (the red colored layer 13R, the green colored layer 13G, the blue colored layer 13B, and the white colored layer 13W in FIG. 2A), the low reflective layer 12 and the colored layer 13 A color filter forming substrate 10 ′ having an auxiliary electrode layer 14 formed on the entire upper surface is prepared. The color filter forming substrate 10 ′ may have an overcoat layer 16 formed between the low reflective layer 12 and the colored layer 13 and the auxiliary electrode layer 14 as necessary. Next, as shown in FIG. 2B, a conductive photosensitive resin layer 15 ′ made of a conductive photosensitive resin is formed on the entire surface of the auxiliary electrode layer 14 (conductive photosensitive resin layer forming step). ). Next, as shown in FIG. 2C, after exposing the conductive photosensitive resin layer 15 ′ by irradiating the exposure light L through the photomask 300, the development is performed as shown in FIG. Thus, the conductive partition 15 is formed so as to overlap with the low reflection layer 12 in plan view and has an opening y overlapping with the colored layer 13 in plan view (conductive partition formation step). Next, as shown in FIG. 2E, the exposed portion of the auxiliary electrode layer 14 on which the conductive partition 15 is formed is etched (etching step). By obtaining the above steps, the color filter 10 can be manufactured.

Next, the color filter manufactured by this invention is demonstrated using figures.
FIG. 3A is a schematic plan view showing an example of a color filter manufactured according to the present invention, and FIG. 3B is a cross-sectional view taken along line AA of FIG. As shown in FIGS. 3A and 3B, the color filter 10 manufactured according to the present invention includes a transparent substrate 11, a low reflective layer 12 formed on the transparent substrate 11 and having an opening x, and a transparent substrate. 11 and the colored layer 13 formed in the opening x of the low reflective layer 12 (in FIG. 3A, etc., the red colored layer 13R, the green colored layer 13G, the blue colored layer 13B, and the white colored layer 13W), and the low reflective The auxiliary electrode layer 14 formed on the layer 12 and the conductive partition wall 15 formed on the auxiliary electrode layer 14 and made of a conductive photosensitive resin are characterized by being provided. As shown in FIG. 3B, the color filter of the present invention includes an overcoat layer 16 formed between the low reflective layer 12 and the colored layer 13 and the auxiliary electrode layer 14 as necessary. You may have.
In FIG. 3A, the overcoat layer is omitted for easy explanation.

The color filter produced by the present invention is used for an organic EL display device. Such an organic EL display device will be described with reference to the drawings.
FIG. 4 is a schematic sectional view showing an example of an organic EL display device using a color filter manufactured according to the present invention. As shown in FIG. 4, the organic EL display device 100 includes a color filter 10, a substrate 71, a bottom electrode layer 81 formed on the substrate 71, an organic layer including a light emitting layer formed on the bottom electrode layer 81. An organic EL element side substrate 70 including an EL layer 83 and an organic EL element 80 having an upper surface transparent electrode layer 85 formed on the organic EL layer 83, and the conductive partition 15 side surface of the color filter 10; The organic EL element side substrate 70 is disposed so as to face the organic EL element 80 side surface, and the conductive partition wall 15 and the upper transparent electrode layer 85 are in contact with each other so as to be conductive. It is. As shown in FIG. 4, the organic EL element side substrate 70 is generally composed of a TFT 75 formed on the substrate 71, a first insulating layer 77 formed on the TFT 75, a lower surface electrode layer 81, and an upper surface transparent electrode layer. In order to prevent contact with 85, a second insulating layer 91 is formed on the substrate 71. An adhesive layer 99 may be formed between the color filter 10 and the organic EL element side substrate 70. Further, the organic EL display device 100 includes a wiring 201 extending from one pole of the power supply P to each TFT 75, a wiring 202-203 extending from the other pole of the power supply P to the upper transparent electrode layer 85, and the other of the power supply P. Wiring 202-204 extending from the pole to the auxiliary electrode layer 14.
Since the color filter 10 in FIG. 4 is the same as the content described in FIG. 3 described above, description thereof is omitted here.

According to the present invention, by having the conductive partition step, a conductive partition that can be electrically connected to the auxiliary electrode layer can be formed, and the entire surface on the color filter can be electrically connected to each other. Since it is not necessary to form a transparent electrode layer or the like, a color filter having good transmittance can be manufactured with fewer manufacturing steps.
In addition, according to the present invention, since the conductive partition can be used as a resist when the auxiliary electrode layer is etched by having the etching step, a resist for etching the auxiliary electrode layer is separately formed. In addition, it is not necessary to perform the step of removing the resist after etching, and the number of manufacturing steps can be reduced.
Therefore, according to the present invention, by having the conductive partition step and the etching step, it is possible to prevent uneven brightness when used in an organic EL display device, and display with good brightness. The color filter which can be manufactured can be manufactured efficiently.

The effects of the color filter manufacturing method of the present invention will be described in comparison with a conventional color filter manufacturing method.
FIG. 14 is a flowchart showing an example of a conventional color filter manufacturing method described above, and FIGS. 15A to 15F are process diagrams showing an example of a conventional color filter manufacturing method.
In the conventional color filter manufacturing method, first, as shown in FIG. 15A, the transparent substrate 21, the low reflective layer 22 having an opening formed on the transparent substrate 21, and the low reflective layer 22 on the transparent substrate 21. The colored layer 23 formed in the opening (in FIG. 15A, etc., the red colored layer 23R, the green colored layer 23G, the blue colored layer 23B, the white colored layer 23W), and the low reflective layer 22 and the colored layer 23 A color filter forming substrate 20 ′ having an auxiliary electrode layer 24 formed on the entire surface is prepared. FIG. 15A shows an example in which the color filter forming substrate 20 ′ further has an overcoat layer 26. Next, in order to pattern the auxiliary electrode layer 24 of the color filter forming substrate 20 according to a predetermined pattern shape, a photosensitive resin layer 28 ′ is formed on the auxiliary electrode layer 24 (photosensitive resin layer forming step). Next, after exposing the photosensitive resin layer 28 ′ by irradiating the exposure light L through the photomask 301 and developing it, although not shown, a resist 28 is formed (resist forming step). Next, as shown in FIG. 15B, the exposed portion of the auxiliary electrode layer 24 on which the resist 28 is formed is etched (etching step). Next, as shown in FIG. 15C, the resist 28 is stripped from the auxiliary electrode layer 24 after etching (resist stripping step). Next, as shown in FIG. 15D, a photosensitive resin layer 25 ′ for forming a columnar structure is formed, exposed by irradiating exposure light L through a photomask 302, and then FIG. The columnar structure 25 is formed by developing and firing as necessary (columnar structure forming step), as shown in FIG. Next, as shown in FIG. 15F, a transparent electrode layer 27 is formed on the entire surface of the color filter forming substrate 20 ′ on which the columnar structures 25 are formed (transparent electrode layer forming step). The color filter 20 can be manufactured through the above steps.

  As described above, the conventional color filter requires a step of forming a resist for etching the auxiliary electrode layer into a predetermined pattern shape before and after the etching step and a step of removing the resist. Since it is necessary to form the columnar structure by exposing and developing the photosensitive resin layer in a separate process from the formation and the like, and to form a transparent electrode layer, a very large number of processes are required. On the other hand, in the present invention, the conductive partition is used as a resist in the etching process of the auxiliary electrode layer, and is used as a conductive member with the upper transparent electrode layer in the organic EL display device. It does not have to be done. Therefore, a color filter can be manufactured with high manufacturing efficiency.

  Hereafter, the detail of the manufacturing method of the color filter of this invention is demonstrated.

I. Conductive photosensitive resin layer forming step The conductive photosensitive resin layer forming step in the present invention includes a transparent substrate, a low reflective layer having an opening formed on the transparent substrate, and the low reflective layer on the transparent substrate. A color filter forming substrate comprising a colored layer formed in an opening and an auxiliary electrode layer formed on the entire surface of the low reflection layer and the colored layer is prepared, and a conductive photosensitive film is formed on the entire surface of the auxiliary electrode layer. This is a step of forming a conductive photosensitive resin layer composed of a conductive resin.

1. Conductive photosensitive resin layer and formation method thereof The conductive photosensitive resin layer formed in this step will be described.
The conductive photosensitive resin layer is formed on the entire surface of the auxiliary electrode layer, and is composed of a conductive photosensitive resin, and is used to form a conductive partition described later.

(1) Material of conductive photosensitive resin layer The conductive photosensitive resin layer contains a conductive photosensitive resin.
Hereinafter, the detail of the material used for a conductive photosensitive resin layer is demonstrated.

(A) Conductive photosensitive resin The conductive photosensitive resin used in the present invention is specifically composed of a photosensitive resin exhibiting conductivity, or composed of a photosensitive resin and a conductive material. And the like. In particular, the conductive photosensitive resin used in the present invention is preferably composed of a photosensitive resin and a conductive material. This is because the conductivity of the conductive photosensitive resin layer can be improved.
Each will be described below.

(I) Photosensitive resin showing conductivity The photosensitive resin showing conductivity is one in which the photosensitive resin itself has conductivity and does not contain a conductive material.
When the conductive photosensitive resin is a photosensitive resin exhibiting conductivity, specifically, the conductive photosensitive resin used in the present invention is Sepulzeda manufactured by Shin-Etsu Polymer Co., Ltd., manufactured by Nagase Chemtech Co., Ltd. Can be mentioned. Moreover, it is preferable to use positive photosensitive resin as the said photosensitive resin which shows electroconductivity. The reason will be described later.

(Ii) Photosensitive resin and conductive material When the conductive photosensitive resin is a photosensitive resin and a conductive material, the photosensitive resin may be a photosensitive resin exhibiting the above-described conductivity. It may be a photosensitive resin having no properties.

  As the photosensitive resin, either a positive photosensitive resin or a negative photosensitive resin can be used. In the case where the conductive photosensitive resin layer contains a conductive material described later, it is preferable to use a positive photosensitive resin. When a positive photosensitive resin is used, the conductive photosensitive resin layer that has not been exposed to exposure light is removed along with the removal of the conductive photosensitive resin layer that has been exposed to exposure light at the time of development in the partition wall forming process described later. Some of the positive photosensitive resin on the surface side can be easily removed, and the conductive material can be exposed on the surface of the conductive partition. Therefore, when the color filter manufactured by this invention is used for an organic EL display device, the upper surface transparent electrode layer of the organic EL display element side substrate and the conductive partition can be more preferably conducted.

  The photosensitive resin in which the photosensitive resin exhibits conductivity has been described in the above-mentioned section “(i) Photosensitive resin that exhibits conductivity”, and thus description thereof is omitted here.

  On the other hand, when the photosensitive resin is a photosensitive resin that does not exhibit conductivity, a general photosensitive resin can be used as the photosensitive resin. More specifically, when the photosensitive resin is a positive photosensitive resin, examples thereof include a phenol epoxy resin, an acrylic resin, a polyimide, and a cycloolefin. Specific examples include IP3500 (manufactured by TOK), PFI27 (manufactured by Sumitomo Chemical), and ZEP7000 (manufactured by Zeon). On the other hand, when the said photosensitive resin is a negative photosensitive resin, an acrylic resin etc. can be mentioned, for example. Specific examples include polyglycidyl methacrylate (PGMA), chemically amplified SAL601 (manufactured by Shipley Co., Ltd.), and the like.

Next, the conductive material used for the conductive photosensitive resin will be described.
The conductive material is not particularly limited as long as desired conductivity can be imparted to a conductive partition described later. As the conductive material in this step, for example, conductive fine particles can be suitably used.

The conductive fine particles are not particularly limited as long as they exhibit a desired conductivity, and may be single conductive fine particles, and the conductive fine particles (core portion) and the conductive particles formed on the surfaces of the insulating fine particles. Conductive fine particles having a core-shell structure provided with a conductive layer (shell portion) having the above-described structure may be used. In the present invention, conductive particles having a core-shell structure are preferable.
Here, in the present invention, it is preferable to expose a part of the conductive fine particles on the surface of the conductive partition from the viewpoint of imparting good conductivity by the conductive partition. The core-shell structure conductive fine particles can be formed by easily adjusting the size of the whole conductive fine particles by adjusting the particle size of the core portion. This is because the conductive fine particles can be easily obtained, and the conductive partition having the above-described form can be suitably formed.

When the conductive fine particles are conductive fine particles having a core-shell structure, examples of the material used for the insulating fine particles (core portion) include resins and non-metallic inorganic substances. Examples of the resin used for the insulating fine particles include an acrylic resin and a melamine resin. Examples of the nonmetallic inorganic substance used for the insulating fine particles include silica, alumina, barium sulfate, and zeolite.
Examples of the material used for the conductive layer (shell portion) include metals, conductive inorganic substances, and conductive polymers. As the metal used for the conductive layer, for example, gold, silver, platinum, copper, tin, palladium, nickel, and aluminum can be suitably used. Examples of the conductive inorganic material used for the conductive layer include metal oxides such as indium tin oxide (ITO) and IZO, graphite, carbon black, and conductive ceramic. Examples of the conductive polymer used for the conductive layer include doped polyaniline, polyphenylene vinylene, polythiophene, polypyrrole, polyparaphenylene, polyacetylene, polyethylenedioxythiophene (PEDOT), triphenyldiamine (TPD), and the like. Can be mentioned. As PEDOT, polyethylenedioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) can be suitably used.
As a method for forming the conductive layer on the insulating fine particles, a known method can be used, and examples thereof include a plating method, a coating method, and an immersion method.

  In this step, when the conductive fine particles are conductive fine particles having a core-shell structure, the conductive fine particles are resin fine particles in which the core portion is made of a resin, and the shell portion is made of a conductive polymer. A conductive polymer layer is preferred.

  In the present invention, the conductive fine particles are preferably a metal layer in which the core portion is the resin fine particles and the shell portion is made of a metal. This is because the conductivity of the conductive fine particles can be improved. The conductive fine particles having the resin fine particles and the metal layer are not particularly limited as long as they have desired conductivity and size. For example, Micropearl AU manufactured by Sekisui Chemical Co., Ltd. can be suitably used.

  On the other hand, when the conductive fine particles are single, the material of the conductive fine particles can be the same as that described in the above-mentioned item of the conductive layer, and thus the description thereof is omitted here.

The shape of the conductive fine particles can be a conventionally known shape. For example, a substantially spherical shape, a spheroid shape, a polyhedron shape, a scale shape, a disk shape, a fiber shape, a needle shape, and the like can be given. In this step, a substantially spherical shape is preferable. This is because the conductivity of the conductive partition can be improved.
In the present invention, the term “substantially spherical” includes not only a substantially spherical shape that can be approximated to a spherical shape but also a true sphere.

The average primary particle size of the conductive fine particles used in the conductive photosensitive resin layer is not particularly limited as long as desired conductivity can be imparted to the conductive partition described later. Specifically, the average primary particle size of the conductive fine particles is preferably in the range of 2 μm to 20 μm, more preferably in the range of 2.5 μm to 18 μm, and particularly preferably in the range of 3 μm to 15 μm. This is because if the average primary particle size of the conductive fine particles is too large, it may be difficult to form the conductive partition itself. If the average primary particle size of the conductive fine particles is too small, This is because it may be difficult to impart desired conductivity.
The average primary particle size of the conductive fine particles can be obtained by a method of directly measuring the size of the primary particles from an electron micrograph. Specifically, the minor axis diameter and major axis diameter of each primary particle can be measured, and the average can be obtained as the particle diameter of the particle. Next, with respect to 100 or more particles, the volume (mass) of each particle is obtained by approximating a rectangular parallelepiped of the obtained particle diameter, and the volume (mass) average particle diameter is obtained and used as the average particle diameter. it can. The same result can be obtained regardless of whether the electron microscope is a transmission type (TEM) or a scanning type (SEM).
In the present invention, the average primary particle diameter of conductive fine particles such as scales, spheroids, and needles other than substantially spherical means the average primary particle diameter of circumscribed spheres.

  The content of the conductive material in the conductive photosensitive resin is appropriately selected according to the size, type, etc. of the conductive fine particles, and is not particularly limited, but with respect to the total solid content of the conductive photosensitive resin, It is preferably in the range of 1% by mass to 50% by mass, especially in the range of 3% by mass to 45% by mass, particularly in the range of 5% by mass to 40% by mass. This is because if the content of the conductive material is too small, it may be difficult for the conductive partition walls described later to exhibit the desired conductivity, and if the content of the conductive material is too large, it will be described later. This is because the adhesion between the conductive partition wall and the auxiliary electrode layer may be lowered.

(B) Other materials In addition to the above-described conductive photosensitive resin, the conductive photosensitive resin layer is added with any material such as a colorant, a photopolymerization initiator, a dispersant, and a surfactant. be able to.
Moreover, when a conductive photosensitive resin layer contains a coloring agent, what can provide light-shielding property to the conductive partition mentioned later, such as a black coloring agent, can be used suitably. In the case where the conductive partition has a light shielding property, in the organic EL display device using the color filter manufactured according to the present invention, the conductive partition can be arranged so as to surround the organic EL element corresponding to each pixel. Color mixing due to the light of the organic EL element corresponding to one pixel entering another pixel, or the light of the organic EL element corresponding to one pixel is different when the organic EL display device is viewed from an oblique direction. This is because it is possible to suitably prevent parallax color mixing observed in pixels.

  Since each of the above additives can be the same as that used for a general photosensitive resin layer, description thereof is omitted here.

(2) Conductive photosensitive resin layer The thickness of the conductive photosensitive resin layer formed in this step is appropriately selected according to the use of the color filter and the like, and is not particularly limited. Usually, it can be formed with a thickness equivalent to the thickness of a conductive partition described later.

  When the conductive photosensitive resin layer contains the above-described conductive material, the amount of the conductive material present in the conductive photosensitive resin layer is appropriately selected according to the type of the conductive material, and is particularly limited. However, when the volume of the conductive photosensitive resin layer is 100% by volume, it is in the range of 1% by volume to 90% by volume, especially in the range of 2% by volume to 80% by volume, especially 3% by volume to 70%. It is preferable to be within the range of volume%. This is because when the amount of the conductive material present in the conductive photosensitive resin layer is within the above range, a conductive partition wall having good conductivity can be obtained.

(3) Method for forming conductive photosensitive resin layer The method for forming the conductive photosensitive resin layer can be the same as the method for forming a general photosensitive resin layer. For example, the method of apply | coating the coating liquid containing the material of the conductive photosensitive resin layer mentioned above on an auxiliary electrode layer, and drying a coating film can be used suitably. About the solvent used for the said coating liquid, since it can be the same as that of what is used in the formation method of a general photosensitive resin layer, description here is abbreviate | omitted.
Further, the application method of the coating liquid is not particularly limited as long as it is a method that can uniformly apply the coating liquid on the auxiliary electrode layer, and is a spin coating method, a dipping method, a spray method, Various methods such as a slide coating method, a bar coating method, a roll coater method, a meniscus coater method, a flexographic printing method, a screen printing method, and a speed coater method can be used.
Moreover, as a drying method of a coating film, vacuum drying, heat drying, these combinations, etc. are mentioned, for example. When drying at normal pressure, it is preferable to dry in a temperature range in which the substrate does not deteriorate. For example, it is preferable to dry within a range of 30 ° C to 110 ° C.

2. Color Filter Forming Substrate The color filter forming substrate used in this step includes a transparent substrate, a low reflective layer formed on the transparent substrate and having an opening, and an opening of the low reflective layer on the transparent substrate. A formed colored layer and an auxiliary electrode layer formed on the entire surface of the low reflection layer and the colored layer are provided.

(1) Auxiliary electrode layer The auxiliary electrode layer used for the color filter forming substrate is formed on the entire surface of the low reflection layer and the colored layer described later.

The auxiliary electrode layer is not particularly limited as long as it can be electrically connected to a conductive partition described later. For example, the auxiliary electrode layer may be a transparent auxiliary electrode layer made of a transparent conductive material, or a metal auxiliary electrode made of metal. It may be a layer. Among these, the auxiliary electrode layer is preferably a metal auxiliary electrode layer.
Here, in the conventional method for manufacturing the color filter 20 shown in FIGS. 15A to 15F, the post-development columnar structure 25 shown in FIG. 15E is fired in the columnar structure formation step. Is preferred. However, when the columnar structure is fired, the exposed portion of the auxiliary electrode layer where the columnar structure is not formed is also fired. Therefore, when the auxiliary electrode layer is a metal auxiliary electrode layer, the exposed portion is in the atmosphere. There is a concern that the resistance of the metal auxiliary electrode layer increases due to the reaction with oxygen and oxidation. On the other hand, in the present invention, since the conductive barrier rib is formed on the entire surface of the metal auxiliary electrode layer in the finally obtained color filter, even when the conductive barrier rib is fired, It is possible to prevent an increase in resistance of the metal auxiliary electrode layer due to reaction with oxygen in the atmosphere.

When the auxiliary electrode layer is a metal auxiliary electrode layer, the metal material used for the metal auxiliary electrode layer may be a metal such as Cu, Ag, Au, Pt, Al, Cr, Co or an APC (alloy containing Ag, Pd, Cu). ) Or the like, or a multilayer metal film represented by MAM (a multilayer metal film in which a molybdenum film, an aluminum-neodymium alloy film, and a molybdenum film are laminated in this order).
In the present invention, it is particularly preferable to use APC. This is because the conductivity of the auxiliary electrode layer can be improved.
On the other hand, when the auxiliary electrode layer is a transparent auxiliary electrode layer, examples of the transparent conductive material used for the auxiliary electrode layer include metal oxides having transparency and conductivity. Examples of such metal oxides include ITO, indium oxide, zinc oxide, and stannic oxide.

  The thickness of the auxiliary electrode layer is not particularly limited as long as it has desired conductivity, but it is preferably in the range of 10 nm to 500 nm, more preferably in the range of 20 nm to 400 nm, and particularly preferably in the range of 30 nm to 300 nm. . If the thickness of the auxiliary electrode layer is too small, the resistance of the auxiliary electrode layer may be increased. If the thickness of the auxiliary electrode layer is too large, it takes a lot of time to form the auxiliary electrode layer, resulting in a manufacturing cost. This is because there is a possibility that becomes higher. Further, the stress of the auxiliary electrode layer is increased, and there is a possibility that cracks and the like are likely to occur.

  As a method for forming the auxiliary electrode layer, a known method can be used as a general method for forming the electrode layer. For example, a method of forming a thin film by a vapor deposition method or a sputtering method can be given.

(2) Low reflective layer The low reflective layer used for the color filter forming substrate is formed on a transparent substrate and has an opening. The low reflection layer is used for suppressing external light reflection.

  The average light reflectance of the low reflective layer is not particularly limited as long as it can sufficiently suppress reflection of external light entering the viewing side in the auxiliary electrode layer, but specifically, it is 380 nm to The average light reflectance in the wavelength region of 800 nm is preferably 10% or less, more preferably 9% or less, and particularly preferably 8% or less. This is because if the light reflectance exceeds the above range, it may be difficult to sufficiently prevent external light reflection by the auxiliary electrode layer. The average light reflectivity is measured by an optical measuring instrument according to JIS K7105. A commercial item can be used for an optical measuring device, for example, HR-100 by Murakami Color Research Laboratory can be used.

Such a low reflection layer may have a light shielding property or may not have a light shielding property, but more preferably has a light shielding property. The low reflection layer can be used as a light-shielding portion, and an organic EL display device with good contrast can be obtained.
When the low reflection layer has light shielding properties, a metal light shielding layer such as chromium or chromium oxide or a resin light shielding layer in which a black colorant such as carbon is dispersed in a binder resin is used as the low reflection layer. Note that the materials used for the metal light-shielding layer and the resin light-shielding layer are not limited to those described above, and known materials can be used as a material for the light-shielding portion of a general color filter. . The thickness of the low reflection layer is not particularly limited as long as external light reflection by the auxiliary electrode layer can be suppressed. When the low reflection layer is a metal light shielding layer, the thickness is set to about 0.2 μm to 0.4 μm, and when the low reflection layer is a resin light shielding layer, the thickness is set to about 0.5 μm to 2 μm.

On the other hand, when the low reflective layer does not have light shielding properties, examples of the low reflective layer include tantalum oxide (TaO), oxynitride (TaNO), boron oxide (TaBO), and boron oxynitride (TaBNO). And a layer formed of a tantalum compound containing oxygen such as silicon oxide (SiO _x ), chromium nitride (CrN), or the like. The thickness of the low reflection layer is not particularly limited as long as external light reflection by the auxiliary electrode layer can be suppressed, but it is used within a range of 5 nm to 30 nm, more preferably within a range of 10 nm to 20 nm.

  The arrangement of the openings of the low reflection layer can be the same as the pixel arrangement used for a general color filter. For example, a known arrangement such as a stripe type, a mosaic type, a triangle type, or a four-pixel arrangement type can be used, and the area of the opening can be arbitrarily set.

  The line width of the low reflection layer can be appropriately selected according to the use of the organic EL display device of the present invention, and is not particularly limited. The line width of the specific low reflection layer is preferably 10 μm or more, more preferably in the range of 12 μm to 100 μm, particularly preferably in the range of 13 μm to 90 μm. If the line width of the low reflective layer is too small, it may be difficult to form the low reflective layer itself, and it will be difficult to form a conductive partition and an auxiliary electrode layer, which will be described later, on the low reflective layer. Because there is a possibility. Moreover, it is because it may become difficult to have the opening part of a desired magnitude | size when the width | variety of a low reflection layer exceeds the said range.

  About the formation method of a low reflection layer, it can be made to be the same as that of a well-known method as what is used for a general color filter. For example, when the low reflection layer is a metal light shielding layer, a method of forming a thin film by a vapor deposition method or a sputtering method and etching using a photolithography method can be exemplified. For example, when the low reflection layer is a resin light-shielding layer, a photolithography method can be suitably used.

(3) Colored layer The colored layer used for the color filter forming substrate is formed in the opening of the low reflective layer on the transparent substrate. Usually, it has three colored layers of three colors, a red colored layer, a green colored layer, and a blue colored layer. Moreover, you may have a colored layer of colors other than the said three colored layers. In the present invention, it is preferable to have a white colored layer in addition to the above-described three colored layers.
Each colored layer is used by being arranged in each pixel in the organic EL display device.

  The colored layer is formed by dispersing or dissolving a colorant such as a pigment or dye of each color in a resin such as a photosensitive resin.

Examples of the colorant used in the red coloring layer include perylene pigments, lake pigments, azo pigments, quinacridone pigments, anthraquinone pigments, anthracene pigments, and isoindoline pigments. These pigments may be used alone or in combination of two or more.
Examples of the colorant used in the green coloring layer include phthalocyanine pigments such as halogen polysubstituted phthalocyanine pigments or halogen polysubstituted copper phthalocyanine pigments, triphenylmethane basic dyes, isoindoline pigments, and isoindolinone pigments. And pigments. These pigments or dyes may be used alone or in combination of two or more.
Examples of the colorant used in the blue colored layer include copper phthalocyanine pigments, anthraquinone pigments, indanthrene pigments, indophenol pigments, cyanine pigments, dioxazine pigments, and the like. These pigments may be used alone or in combination of two or more.
The white colored layer can be formed using only a photosensitive resin. However, in order to perform a desired white display using an organic EL display device, a colorant for toning is dispersed or dissolved. May be. Examples of such a colorant include the above-described red, green, and blue colorants, and colorants such as yellow and black. About a specific coloring agent, since a well-known thing can be used, description here is abbreviate | omitted.

  As a photosensitive resin, since a well-known photosensitive resin can be used as a general coloring layer material, description here is abbreviate | omitted.

  About the pattern arrangement | sequence of the colored layer of several colors, since it can be made to be the same as that of the pattern arrangement | sequence of the opening part of the low reflection layer mentioned above, description here is abbreviate | omitted.

The thickness of the colored layer can be appropriately selected according to the use of the color filter, and is not particularly limited. The specific thickness of the colored layer is preferably in the range of 0.5 μm to 5 μm, more preferably in the range of 0.7 μm to 4 μm, and particularly preferably in the range of 1 μm to 3 μm.
This is because if the thickness of the colored layer is less than the above range or exceeds the above range, it may be difficult to form the colored layer itself.

  As a method for forming a colored layer, a known method can be used as a method for forming a colored layer of a general color filter. In the present invention, among these, the photolithography method can be preferably used.

(4) Transparent substrate The transparent substrate used for the color filter forming substrate is used to support the low reflection layer, the colored layer, and the auxiliary electrode layer described above.

  The transparent substrate is not particularly limited as long as it is a substrate transparent to visible light, and the same transparent substrate used for a general color filter can be used. Specifically, a rigid material such as quartz glass, Pyrex (registered trademark) glass, or synthetic quartz, or a transparent flexible material having flexibility such as a transparent resin film or an optical resin plate can be used.

(5) Other configurations The color filter forming substrate used in this step is not particularly limited as long as it has the above-described configurations, and a configuration other than the above is appropriately selected and used as necessary. Can do.

  The color filter forming substrate used in the present invention may have an overcoat layer 16 formed so as to cover the low reflective layer 12 and the colored layer 13 as shown in FIG. Good. In this case, the auxiliary electrode layer 14 is formed on the overcoat layer 16. In the present invention, when the overcoat layer 16 is provided, the surfaces of the low reflective layer 12 and the colored layer 13 can be planarized, and the auxiliary electrode layer 14 can be formed favorably. In addition, intrusion of oxygen, water vapor, or the like from the color filter side into the organic EL display device can be suppressed.

The material of the overcoat layer is not particularly limited as long as it has a predetermined light transmittance, and may be a photocurable resin or a thermosetting resin.
Examples of the material for such an overcoat layer include general binder resins, monomer components, photopolymerization initiators, thermal polymerization initiators, and the like.

  The thickness of the overcoat layer is not particularly limited as long as a predetermined light transmittance can be obtained and the surface of the colored layer and the low reflection layer can be flattened. It is preferably in the range of 5.0 μm, more preferably in the range of 0.7 μm to 3.0 μm, and particularly preferably in the range of 0.9 μm to 2.0 μm.

  The method for forming the overcoat layer is not particularly limited as long as it can be formed so as to cover the surfaces of the colored layer and the low reflection layer. For example, the spin coat method, the casting method, the dipping method, the bar coat method , Blade coating method, roll coating method, gravure coating method, flexographic printing method, spray coating method and the like.

(6) Color Filter Forming Substrate Forming Method As the color filter forming substrate forming method used in this step, a known method can be used as a general color filter forming substrate forming method. The description in is omitted.

II. Conductive partition wall forming step In the conductive partition wall forming step of the present invention, the conductive photosensitive resin layer is exposed and then developed to overlap the low reflective layer in plan view, and the colored layer and This is a step of forming conductive partition walls having openings that overlap in plan view.

1. Conductive partition The conductive partition formed in this step is formed from the above-described conductive photosensitive resin layer, and is formed so as to overlap the low reflection layer in plan view, and the colored layer and plan view. It has an opening part which overlaps.

The opening of the conductive partition is not particularly limited as long as a desired color display can be performed in the color filter obtained by the production method of the present invention. Usually, as shown in FIG. 5, the opening x of the low reflection layer 12 and the opening y of the conductive partition 15 are equal, or as shown in FIG. 3, the opening x of the low reflection layer 12 is more conductive. The opening y of the conductive partition 15 is provided to be large. In the present invention, as shown in FIG. 3, the opening y of the conductive partition wall 15 is preferably larger than the opening x of the low reflective layer 12.
FIG. 5 is a schematic sectional view showing another example of the color filter manufactured by the manufacturing method of the present invention. The reference numerals not described in FIG. 5 can be the same as the reference numerals described in FIG.

Further, the conductive partition is usually formed on the entire color filter in a pattern along the region where the low reflective layer is formed. The line width of the conductive partition 15 may be equal to the line width of the low reflection layer 12 as shown in FIG. 5 or may be smaller than the line width of the low reflection layer 12 as shown in FIG. .
In the present invention, when the auxiliary electrode layer is a metal auxiliary electrode layer, the line width of the conductive partition wall is preferably smaller than the line width of the low reflection layer. The conductive partition functions as a resist for etching the auxiliary electrode layer in an etching process described later, and the line width of the auxiliary electrode after etching is usually equal to the line width of the conductive partition. When the color filter obtained by the production method of the present invention is used in an organic EL display device, an auxiliary electrode layer is disposed below the low reflective layer and is observed. Therefore, the auxiliary electrode layer is smaller than the line width of the low reflective layer. When the line width is large, the auxiliary electrode layer may be observed. Therefore, in the case of the metal auxiliary electrode layer, there is a possibility that external light is reflected and display is hindered.

The specific line width of the conductive partition can be appropriately selected according to the use of the color filter, and is not particularly limited. Specifically, the line width is 10 μm or more, and particularly within the range of 12 μm to 100 μm, particularly 13 μm. It is preferable to be within a range of ˜90 μm. This is because when the line width of the conductive partition wall is less than the above range, the line width of an auxiliary electrode layer, which will be described later, becomes small, and its electric resistance may not be sufficiently small. In addition, about the upper limit of the line width of an electroconductive partition, it can be set as the line width of a low reflection layer.
Note that the width of the conductive partition refers to the distance indicated by n in FIG.

The thickness of the conductive partition can be appropriately selected according to the use of the color filter and the like, and is not particularly limited, but is in the range of 1 μm to 60 μm, especially in the range of 2 μm to 55 μm, particularly in the range of 3 μm to 50 μm. It is preferable to be within. When the thickness of the conductive partition is less than the above range, when the color filter obtained by the production method of the present invention is used for an organic EL display device, the conductive partition and the upper transparent electrode layer are in contact with each other. This is because other components of the color filter may come into contact with the transparent electrode layer or the like of the organic EL element side substrate to deteriorate the organic EL element. Further, when the thickness of the conductive partition wall exceeds the above range, it may be difficult to form the conductive partition wall itself.
In addition, the thickness of a colored layer means the distance shown by p in FIG.3 (b).

In addition, as the conductive partition, the distance from the low reflective layer side surface of the transparent substrate to the conductive partition surface (the height of the conductive partition) and the distance from the low reflective layer side surface of the transparent substrate to the colored layer surface The difference from (the height of the colored layer) is preferably 1 μm or more, more preferably in the range of 1 μm to 8 μm, particularly preferably in the range of 1 μm to 6 μm. When the difference in height is within the above-described range, a space can be provided between the colored layer and the organic EL element in the organic EL display device using the color filter manufactured according to the present invention. For this reason, foreign substances can be included in the space, and foreign substances can be prevented from entering the contact surfaces of the conductive partition walls and the upper transparent electrode layer, so that deterioration of the organic EL element can be suppressed. It is.
The height of the conductive partition wall refers to the distance indicated by q in FIG. 3 (b), and the height of the colored layer refers to the distance indicated by r in FIG. 3 (b). The difference from the height of the colored layer refers to the distance indicated by s in FIG.

The surface resistivity of the conductive partition is not particularly limited as long as desired conductivity can be exhibited. For example, it is preferably 20Ω / □ or less, more preferably 10Ω / □ or less, and particularly preferably 5Ω / □ or less. When the color filter of the present invention is used in an organic EL display device, the current from the organic EL element side substrate is supplied to the color filter using the conductive partition. This is because it can be guided to the side and easily escaped.
The surface resistivity of the conductive partition wall can be determined by a measuring method based on JIS K 7194. For example, it can be measured using a low resistivity meter (Loresta-GP, manufactured by Dia Instruments Co., Ltd.).

2. Conductive partition wall forming step As a method for exposing the conductive photosensitive resin layer used in this step, a known method can be used. For example, the conductive photosensitive resin layer is irradiated with exposure light through a photomask. The method can be suitably used. As the photomask, a binary mask having a transmissive region and a light shielding region, or a halftone mask having a transmissive region and a semi-transmissive region in which the transmittance of exposure light is limited can be used. When the conductive photosensitive resin layer contains a positive photosensitive resin and a conductive material, exposure is performed using a halftone mask so that the conductive material is exposed on the surface of the conductive partition. It can be performed.
As the exposure light and other exposure conditions, general ones can be used.

  As a developing method of the conductive photosensitive resin layer used in this step, a known method can be used, and examples thereof include a method using a developer. A general developer can be used as the type of the developer, but it is preferable to select appropriately according to the type of the photosensitive resin. Specific examples of the developer include alkali developers such as tetramethylammonium aqueous solution, potassium hydroxide aqueous solution, sodium hydroxide aqueous solution and sodium carbonate aqueous solution, and acids such as hydrochloric acid aqueous solution, acetic acid aqueous solution, sulfuric acid aqueous solution and phosphoric acid aqueous solution. A developing solution etc. can be mentioned.

In this step, it is preferable to fire the obtained conductive partition after development of the conductive photosensitive resin layer. About a baking method, it can be set as a well-known method.
In this step, a conductive partition is formed in a portion of the auxiliary electrode layer used in the color filter, and does not come into contact with the atmosphere or the like. Therefore, when a metal auxiliary electrode layer is used as the auxiliary electrode layer, oxidation of the metal auxiliary electrode layer due to firing can be prevented.

III. Etching Step The etching step in the present invention is a step of etching the exposed portion of the auxiliary electrode layer on which the conductive partition is formed. Moreover, a color filter can be obtained by performing this process.

  As a method for etching the auxiliary electrode layer used in this step, a known method can be used, which may be a wet etching method or a dry etching method. In this step, the wet etching method is particularly preferable. This is because even in a color filter forming substrate having a relatively large area, the auxiliary electrode layer can be etched uniformly, which is advantageous in terms of cost.

  In this step, the color filter may be washed after etching, if necessary.

  The line width and the like of the auxiliary electrode layer obtained by this step are usually the same as the line width and the like of the partition wall described above.

IV. Other Steps The method for producing a color filter of the present invention is not particularly limited as long as it has the above-described conductive photosensitive resin layer forming step, conductive partition wall forming step, and etching step. Other configurations can be selected and added as appropriate. Examples of such a process include a process of forming the color filter forming substrate described above.

V. Color Filter The color filter manufactured by the method for manufacturing a color filter of the present invention can be the same as the content described in the section “C. Color Filter” described later, and thus the description thereof is omitted here.

VI. Others The method for producing a color filter of the present invention includes the conductive partition forming step and the etching step described above, thereby preventing luminance unevenness when used in an organic EL display device, and displaying with good luminance. However, for example, when the following color filter forming substrate is used instead of the above-described color filter forming substrate, the same effect can be obtained. it can.
6A to 6E are process diagrams illustrating another example of the method for producing a color filter of the present invention. In the present invention, first, as shown in FIG. 6A, the transparent substrate 11, the colored layer 13 formed on the transparent substrate 11, the low reflective layer 12 formed on the entire surface of the colored layer 13, and the low A color filter forming substrate 10 ″ having an auxiliary electrode layer 14 formed on the entire surface of the reflective layer 12 is prepared. The color filter forming substrate 10 ″ is provided between the colored layer 13 and the low reflective layer 12. You may have the overcoat layer 16 formed. Next, as shown in FIG. 6B, a conductive photosensitive resin layer 15 ′ made of a conductive photosensitive resin is formed on the entire surface of the electrode layer 14 (conductive photosensitive resin layer forming step). Next, as shown in FIG. 6C, after exposing the conductive photosensitive resin layer 15 ′ by irradiating the exposure light L through the photomask 300, development is performed as shown in FIG. 6D. Thereby, the conductive partition 15 having an opening overlapping the colored layer 13 in plan view is formed (conductive partition formation step). Next, as shown in FIG. 6E, the exposed portion of the laminated body of the auxiliary electrode layer 14 and the low reflective layer 13 on which the conductive partition 15 is formed is etched (etching step). Through the above steps, the color filter 10 shown in FIG. 7 can be manufactured.
FIG. 7 is a schematic cross-sectional view illustrating an example of a color filter manufactured by the above-described manufacturing method.

  In the above-described color filter manufacturing method, the auxiliary electrode layer and the low reflection layer can be etched by having an etching step, so that the low reflection layer can be formed between the colored layers. The low reflective layer having an opening in advance may not be formed in a predetermined pattern shape. Therefore, the color filter can be manufactured with further reduced manufacturing costs.

  In the above-described color filter manufacturing method, it is preferable that the low reflection layer and the auxiliary electrode layer are made of a material that can be etched simultaneously in the etching step. This is because the color filter can be manufactured by a simpler process.

  The configuration and processing method used in each step of the color filter manufacturing method described above can be the same as those already described.

B. Manufacturing method of organic EL display device The manufacturing method of the organic EL display device of the present invention includes a transparent substrate, a low reflection layer having an opening formed on the transparent substrate, and the opening of the low reflection layer on the transparent substrate. And a color filter forming substrate having a colored layer formed on the surface, and an auxiliary electrode layer formed on the entire surface of the low reflection layer and the colored layer, and a conductive photosensitive resin on the entire surface of the auxiliary electrode layer. A conductive photosensitive resin layer forming step for forming a conductive photosensitive resin layer composed of: exposing the conductive photosensitive resin layer and developing the conductive photosensitive resin layer so as to overlap the low reflective layer in plan view; A conductive barrier rib forming step for forming a conductive barrier rib having an opening overlapping the colored layer in plan view, and an etching step for etching an exposed portion of the auxiliary electrode layer on which the conductive barrier rib is formed, A color filter forming step of forming a color filter by a method for forming a color filter, a substrate, a lower electrode layer formed on the substrate, an organic EL formed on the lower electrode layer and including a light emitting layer And an organic EL element side substrate comprising an organic EL element having an upper surface transparent electrode layer formed on the organic EL layer, the conductive partition side surface of the color filter, and the organic EL element side substrate And an assembly step in which the conductive partition and the upper surface transparent electrode layer are placed in contact with each other so as to face each other and face the organic EL element side surface.

FIG. 8 is a flowchart showing an example of the method for manufacturing the organic EL display device of the present invention, and FIGS. 9A to 9C are process diagrams showing an example of the method for manufacturing the organic EL display device of the present invention. is there.
In the present invention, the color filter 10 is formed by performing the conductive photosensitive resin layer forming step, the conductive partition wall forming step, and the etching step as shown in FIG. 9A (color filter forming step). . Note that the color filter forming step can be the same as the content described with reference to FIGS. 2A to 2E described above, and a description thereof is omitted here.
Next, as shown in FIG. 9B, the substrate 71, the lower electrode layer 81 formed on the substrate 71, the organic EL layer 83 formed on the lower electrode layer 81 and including the light emitting layer, and the organic An organic EL element side substrate 70 including an organic EL element 80 having an upper transparent electrode layer 85 formed on the EL layer 83 is prepared. Next, as shown in FIG. 9C, the conductive partition 15 side surface of the color filter 10 and the organic EL element side substrate 70 of the organic EL element side substrate 70 face each other so that the conductive partition 15 and the upper transparent surface are transparent. The electrode layer 85 is placed in contact with the electrode layer 85 (assembly process). Further, normally, in the assembly process, the color filter 10 and the organic EL element side substrate 70 are sealed. As a sealing method, for example, as shown in FIG. 9C, the color filter 10 and the organic EL element are sealed. A method of forming the adhesive layer 99 between the side substrates 70 is used. Through the above steps, the organic EL display device 100 can be obtained.
Note that the organic EL display device obtained by the manufacturing method of the present invention is the same as that described in FIG.

According to the present invention, by having the color filter forming step, it is possible to prevent the occurrence of luminance unevenness and efficiently manufacture an organic EL display device capable of performing display with good luminance. It becomes.
The details of the method for producing the organic EL display device of the present invention will be described below.

I. Color filter forming step The color filter forming step in the present invention is a step of forming a color filter by using a method for forming a color filter having a conductive photosensitive resin layer forming step, a conductive partition wall forming step, and an etching step. is there.

  The method for forming the color filter used in this step can be the same as that described in the section “A. Method for manufacturing color filter” described above, and thus the description thereof is omitted here.

II. Assembling process The assembling process in the present invention is formed on the substrate, the lower electrode layer formed on the substrate, the organic EL layer formed on the lower electrode layer, including the light emitting layer, and the organic EL layer. An organic EL element side substrate including an organic EL element having a transparent electrode layer on the upper surface is prepared, and the conductive partition side surface of the color filter is opposed to the organic EL element side surface of the organic EL element side substrate. The conductive partition and the upper transparent electrode layer are placed in contact with each other so as to be conductive.

1. Organic EL element side substrate The organic EL element side substrate used in this step comprises a substrate and an organic EL element.

(1) Organic EL Element The organic EL element used in the present invention is a bottom electrode layer formed on the substrate, an organic EL layer formed on the bottom electrode layer and including a light emitting layer, and the organic EL layer. It has the upper surface transparent electrode layer formed in this.

(A) Organic EL layer The organic EL layer used in the present invention is formed on a lower electrode layer, which will be described later, and includes a light emitting layer.
Moreover, an organic EL layer is arrange | positioned and used for each pixel in an organic EL display apparatus. Moreover, it is usually arranged so as to face each colored layer of the color filter.

  In addition to the light emitting layer, the organic EL layer is usually composed of a plurality of organic layers, and transports holes to a charge injection layer such as a hole injection layer or an electron injection layer, or to a white light emitting layer. And a charge transport layer such as a hole transport layer for transporting electrons and an electron transport layer for transporting electrons to the white light emitting layer. Hereinafter, each layer constituting the organic EL layer used in the present invention will be described.

(i) Light emitting layer The light emitting layer used in the present invention is not particularly limited as long as desired light emission can be obtained. For example, the light emitting layer may have a white light emitting layer, a red light emitting layer, a blue light emitting layer and a green light emitting layer. The light emitting layer may have three colors of light emitting layers. In the present invention, it is particularly preferable to have a white light emitting layer. Hereinafter, the white light emitting layer which is a preferable embodiment in the present invention will be described.

  The white light emitting layer used as a suitable light emitting layer in the present invention may be any material that can emit white light. Specifically, such a white light emitting layer has at least blue light (430 nm to 470 nm), green light (470 nm to 600 nm), and red light (600 nm to 700 nm) when a voltage is applied to the organic EL layer. As long as it has an emission spectrum in the wavelength range of. Furthermore, the ratio of the maximum emission intensity of the green light (470 nm to 600 nm) peak and the maximum emission intensity of the blue light (430 nm to 470 nm) peak in the emission spectrum (maximum emission intensity of the green light peak / maximum emission intensity of the blue light peak). Is preferably in the range of 0.3 to 0.8, more preferably in the range of 0.3 to 0.7, and particularly preferably in the range of 0.3 to 0.5. preferable.

  When the ratio of the maximum emission intensity of the green light peak and the maximum emission intensity of the blue light peak is within the above range, the power consumption reduction effect due to the large transmittance of the blue pattern can be more effectively exhibited. it can. For red light (600 nm to 700 nm), the ratio of the maximum emission intensity of the red light peak to the maximum emission intensity of the blue light peak (maximum emission intensity of the red light peak / maximum emission intensity of the blue light peak) is 0.3. It is preferable to be within the range of -1.0.

  The material constituting such a white light emitting layer is not particularly limited as long as it emits fluorescence or phosphorescence. In addition, the light emitting material may have a hole transport property or an electron transport property. Examples of the light emitting material include a dye material, a metal complex material, and a polymer material.

  Examples of the dye-based material include cyclopentamine derivatives, tetraphenylbutadiene derivatives, triphenylamine derivatives, oxadiazol derivatives, pyrazoloquinoline derivatives, distyrylbenzene derivatives, distyrylarylene derivatives, silole derivatives, thiophene ring compounds, Examples thereof include pyridine ring compounds, perinone derivatives, perylene derivatives, oligothiophene derivatives, trifumanylamine derivatives, oxadiazole dimers, and pyrazoline dimers.

  In addition, the above metal complex materials include an aluminum quinolinol complex, a benzoquinolinol beryllium complex, a benzoxazole zinc complex, a benzothiazole zinc complex, an azomethylzinc complex, a porphyrin zinc complex, and a europium complex, or a central metal, Al, Examples of the metal complex include Zn, Be, and the like, or rare earth metals such as Tb, Eu, and Dy, and the ligand includes oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, and a quinoline structure. .

  Examples of the polymer material include polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, and the like, polyfluorene derivatives, polyvinylcarbazole derivatives, and the above-described dye materials and metal complexes. Examples include polymerized system materials.

  Examples of the method for forming the white light emitting layer include a vapor deposition method, a printing method, an inkjet method, a spin coating method, a casting method, a dipping method, a bar coating method, a blade coating method, a roll coating method, a gravure coating method, and a flexographic method. Examples thereof include a printing method, a spray coating method, and a self-assembly method (alternate adsorption method, self-assembled monolayer method). Among these, it is particularly preferable to use a vapor deposition method, a spin coating method, and an ink jet method.

  The thickness of the white light emitting layer used in the present invention is usually about 5 nm to 5 μm.

(ii) Hole injection layer In the present invention, even if a hole injection layer is formed between the white light emitting layer and the anode (the lower electrode layer 81 or the upper transparent electrode layer 85 in FIG. 9B). Good. By providing the hole injection layer, the injection of holes into the white light emitting layer is stabilized, and the light emission efficiency can be increased.

  As a material for forming the hole injection layer used in the present invention, a material generally used for a hole injection layer of an organic EL element can be used. The material for forming the hole injection layer may be any material that has either a hole injection property or an electron barrier property.

  Specifically, the hole injection layer forming material includes triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, amino-substituted chalcone derivatives, oxazoles. Examples include derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, stilbene derivatives, silazane derivatives, polysilane-based, aniline-based copolymers, and conductive polymer oligomers such as thiophene oligomers. Furthermore, examples of the material for forming the hole injection layer include porphyrin compounds, aromatic tertiary amine compounds, and styrylamine compounds.

  The thickness of the hole injection layer made of such a material is usually about 5 nm to 1 μm.

(iii) Electron Injection Layer In the present invention, an electron injection layer may be formed between the white light-emitting layer and the cathode (the upper transparent electrode layer 85 or the lower electrode layer 81 in FIG. 9B). This is because by providing the electron injection layer, the injection of electrons into the white light emitting layer is stabilized, and the luminous efficiency can be increased.

  Examples of the material for forming the electron injection layer used in the present invention include heterocyclic tetracarboxylic anhydrides such as nitro-substituted fluorene derivatives, anthraquinodimethane derivatives, diphenylquinone derivatives, thiopyrandioxide derivatives, naphthaleneperylene, carbodiimides, Fluorenylidenemethane derivatives, anthraquinodimethane and anthrone derivatives, oxadiazole derivatives, thiazole derivatives in which the oxygen atom of the oxadiazole ring of the oxadiazole derivative is replaced with a sulfur atom, quinoxaline ring known as an electron withdrawing group Examples thereof include quinoxaline derivatives having bismuth, metal complexes of 8-quinolinol derivatives such as tris (8-quinolinol) aluminum, phthalocyanines, metal phthalocyanines, and distyrylpyrazine derivatives.

  The film thickness of the electron injection layer made of such a material is usually about 5 nm to 1 μm.

(B) Upper surface transparent electrode layer The upper surface transparent electrode layer in this invention is formed on the organic EL layer mentioned above, applies a voltage to the organic EL layer pinched | interposed between the lower surface electrode layers mentioned later, and is a white light emitting layer. Provided to cause light emission. The upper transparent electrode layer may be formed on the entire surface of the substrate or may be formed in a predetermined pattern, but is usually formed on the entire surface of the substrate.

  The upper transparent electrode layer transmits light generated in the white light emitting layer to the color filter side for the organic EL display device. Therefore, as shown in FIG. Is disposed between the organic EL layer 83 and the color filter 10 for an organic EL display device located above the organic EL layer 83.

  Examples of the material for forming the upper transparent electrode layer used in the present invention include metal oxides having transparency and conductivity. Examples of such metal oxides include indium tin oxide (ITO), indium oxide, zinc oxide, and stannic oxide.

  The film thickness of the upper transparent electrode layer made of such a material is usually about 100 nm to 300 nm.

  As a method for forming the upper surface transparent electrode layer, for example, a method of forming a thin film by a vapor deposition method or a sputtering method and then patterning by a photolithography method as necessary is suitably used.

(C) Bottom electrode layer The bottom electrode layer used in the present invention is formed on a substrate, and more specifically, is disposed between the substrate and the organic EL layer. The lower electrode layer forms the other electrode layer for causing the white light emitting layer to emit light, and is configured as an electrode layer having a charge opposite to that of the upper transparent electrode layer.

Examples of the material for forming the lower electrode layer used in the present invention include metals, alloys, and mixtures thereof having a work function as small as about 4 eV or less. Specifically, sodium, sodium - potassium alloy, magnesium, lithium, magnesium and copper mixtures, magnesium and silver mixture, magnesium and aluminum mixture, magnesium and indium mixture, aluminum and aluminum oxide (Al 2 _{O 3)} mixture, indium, Examples include lithium and aluminum mixtures, and rare earth metals. More preferably, magnesium and silver mixture, magnesium and aluminum mixture, magnesium and indium mixture, aluminum and aluminum oxide (Al 2 _{O 3)} mixture, and it can include lithium and aluminum mixture.

  The lower electrode layer preferably has a sheet resistance of several Ω / cm or less. The film thickness of the lower electrode layer is usually about 10 nm to 1 μm.

  As a method for forming the lower electrode layer, for example, a method of forming a thin film by a vapor deposition method or a sputtering method and then etching using a photolithography method is suitably used. Note that a TFT (Thin Film Transistor) for controlling a current flowing through the organic EL element is connected to the lower electrode layer.

(2) Substrate The substrate used in the present invention may be any substrate that can support an organic EL element or the like, and those generally used as a constituent member of an organic EL display device can be used. In addition, since the organic EL display device of the present invention is a so-called top emission system in which light is extracted from the color filter side for the organic EL display device, the substrate of the organic EL element side substrate is transparent or opaque. It may be.

(3) Other configurations The organic EL element side substrate of the present invention is not particularly limited as long as it has the above-described lower electrode layer, organic EL layer, and upper transparent electrode layer, and a necessary configuration is appropriately selected. Can be added.

(A) TFT
The organic EL element side substrate used in the present invention usually has a TFT (Thin Film Transistor) for controlling a current flowing in the organic EL element constituting the pixel.
As illustrated in FIG. 9B and the like, the TFT 75 is arranged and formed for each pixel on the substrate. Further, although not shown in the figure, a gate line, a signal line, and a power supply line are connected to each TFT circuit.

  As for the specific structure and forming method of the TFT, known structures can be used as the structure and forming method of the TFT used in the organic EL display device, and thus description thereof is omitted here.

(B) First Insulating Layer and Second Insulating Layer As shown in FIG. 9B and the like, in the organic EL element side substrate 70 used in the present invention, the first insulating layer 77 is usually formed on the TFT 75. In addition, the second insulating layer 91 is formed on the substrate in order to prevent the lower electrode layer 81 and the upper transparent electrode layer 85 from coming into direct contact.

  The pattern shape of the second insulating layer can be generally linear, and a pattern having, for example, a matrix or stripe-shaped opening can be formed according to the use of the organic EL display device or the like.

  As a material for forming the first insulating layer and the second insulating layer, for example, a photocurable resin such as a photosensitive polyimide resin or an acrylic resin, a thermosetting resin, an inorganic material, or the like can be used.

  Examples of a method for forming the first insulating layer and the second insulating layer include a method in which the above material is applied and patterned by a photolithography method. Also, a printing method or the like can be used.

(C) Sealing layer The organic EL element side substrate used in the present invention may have a sealing layer.
As shown in FIG. 10, the sealing layer 95 is formed in a portion other than the contact portion with the auxiliary electrode layer 14 on the upper surface transparent electrode layer 85 (hereinafter sometimes referred to as a non-contact portion). The The sealing layer 95 is provided as a protective layer that blocks water vapor and oxygen from reaching the organic EL layer 83.
FIG. 10 is a schematic sectional view showing another example of the organic EL display device manufactured by the manufacturing method of the present invention, and details will be described later.

  The sealing layer is not particularly limited as long as it can exhibit a barrier property against water vapor and oxygen and is transparent. For example, a transparent inorganic film, a transparent resin film, an organic-inorganic hybrid film, etc. Is used. Among these, a transparent inorganic film is preferable because of its high barrier property.

  Examples of the material for forming the transparent inorganic film suitably used as the sealing layer include oxides such as aluminum oxide, silicon oxide, and magnesium oxide; nitrides such as silicon nitride; nitride oxides such as silicon nitride oxide; Used. In particular, silicon nitride oxide is preferable because pinholes hardly occur and gas barrier properties are high.

  The sealing layer may be a single layer or a multilayer. For example, when the sealing layer is a multilayer in which a plurality of silicon nitride oxide films are stacked, the barrier property can be further improved. Moreover, when a sealing layer is a multilayer, you may use a different material for each layer, respectively.

  The thickness of the sealing layer may be appropriately determined according to the type of the sealing layer forming material used. Usually, it is about 5 nm to 5 μm. If the sealing layer is too thin, the barrier property tends to be insufficient, and if the sealing layer is too thick, a phenomenon such as cracking due to film stress of the thin film tends to occur.

  When the sealing layer is a transparent inorganic film, the method for forming the transparent inorganic film is not particularly limited as long as it is a film forming method that can be formed in a vacuum state. For example, sputtering, ion plating And vacuum deposition methods such as electron beam (EB) deposition and resistance heating, atomic layer epitaxy (ALE), laser ablation, and chemical vapor deposition (CVD). Among these, the sputtering method, the ion plating method, and the CVD method are preferably used from the viewpoint of productivity.

  As a method of forming the sealing layer in a pattern on the non-contact portion described above, for example, a method of patterning by a photolithography method after forming a thin film of the sealing layer is preferably used.

(4) Method for Forming Organic EL Element Side Substrate As a method for forming the organic EL element side substrate used in the present invention, a method known as a method for forming an organic EL element side substrate used in a general organic EL display device is used. Since it can be used, description here is omitted.

2. Assembling process As arrangement of the color filter and the organic EL element side substrate, the conductive partition side surface of the color filter and the organic EL element side surface of the organic EL element side substrate are opposed to each other, It will not be specifically limited if it can arrange | position so that it may contact with the said upper surface transparent electrode layer.
Here, the conductive partition and the upper transparent electrode layer are brought into contact with each other so as to conduct, not only when the conductive partition and the upper transparent electrode layer are in direct contact, but also the conductive partition and the upper transparent electrode layer. And the like through a conductive layer such as a conductive adhesive layer.

  In this step, usually, the color filter and the organic EL element side substrate are arranged in a desired manner, and the organic EL display device is sealed. As a sealing method of the organic EL display device used in this step, a method of sealing a space between the color filter and the organic EL element side substrate by filling an adhesive layer, a color filter, and the organic EL element side substrate For example, a sealing agent may be disposed and sealed on the outer peripheral portion.

  In the case of sealing an organic EL display device using an adhesive layer, the adhesive is not particularly limited as long as it is transparent, has adhesive strength, and has curability. As an adhesive forming such an adhesive layer, for example, an adhesive having thermosetting property or an adhesive having photo-curing property can be cited as a suitable example. Usually, a type that does not require a solvent is preferable. Also, a film-like adhesive sheet type may be used. Specific examples include epoxy-based, acrylic-based, polyimide-based, and synthetic rubber-based adhesives and adhesive sheets.

On the other hand, when sealing an organic EL display device using a sealant, the gap between the color filter and the organic EL element side substrate is usually left open in an inert gas atmosphere such as nitrogen. Sealing is performed. In this case, a water capturing agent such as barium oxide may be provided in the hollow interior of the organic EL display device.
Since the sealing agent and the sealing method using the same can be the same as those used in a general organic EL display device, description thereof is omitted here.

III. Other Steps The method for producing the organic EL display device of the present invention is not particularly limited as long as it has the above-described color filter forming step and assembly step, and if necessary, a step other than the above is appropriately selected and added. can do.

In the method for manufacturing an organic EL display device of the present invention, a step of providing a wiring connecting the power source of the display device and the organic EL display device is usually performed.
For example, as shown in FIG. 4 and the like, the wiring form from the power source is a wiring 201 from one pole of the power source P to each TFT 75, and a wiring 202 from the other pole of the power source P to the upper transparent electrode layer 85. -203 and wirings 202-204 extending from the other pole of the power source P to the auxiliary electrode layer 14 are configured. The wiring circuit for causing the organic EL element 80 to emit light is the wiring 201 and the wiring 202-203, and the wiring circuit for releasing the current on the TFT side to the auxiliary electrode layer 14 on the color filter side to prevent the voltage drop is wiring. 201 and wirings 204-202.
Since the wiring, installation method, and the like used in the present invention can be the same as those used in a general organic EL display device, description thereof is omitted here.

IV. Organic EL Display Device The organic EL display device obtained by the production method of the present invention can be the same as the contents described in the section “D. Organic EL display device” described later, and the description thereof is omitted here. To do.

C. Color filter The color filter of the present invention comprises a transparent substrate, a low reflection layer formed on the transparent substrate and having an opening, a colored layer formed in the opening of the low reflection layer on the transparent substrate, and the low reflection layer The auxiliary electrode layer is formed on the auxiliary electrode layer, and the conductive partition is formed on the auxiliary electrode layer and is made of a conductive photosensitive resin.

  Examples of the color filter of the present invention include, for example, FIG. 3, FIG. 5, FIG. 3 and the like have been described in the above-mentioned section “A. Color filter manufacturing method”, description thereof is omitted here.

According to the present invention, by providing the conductive partition, when used in an organic EL display device, the conductive partition and the upper surface transparent electrode layer of the organic EL element side substrate are brought into contact with each other so as to be in color. Filters can be placed. For this reason, in the organic EL display device, the conductive partition and the top transparent electrode layer are in contact with each other so that current from the organic EL element side substrate is passed through the conductive partition and the auxiliary electrode layer. Therefore, it is possible to prevent the occurrence of uneven brightness due to a voltage drop.
Moreover, according to this invention, when it uses for an organic electroluminescent display apparatus by providing the said electroconductive partition, the upper surface transparent electrode layer of an organic electroluminescent display apparatus and the auxiliary electrode layer of a color filter are made to conduct and contact. Therefore, since it is not necessary to form a transparent electrode layer on the auxiliary electrode layer, it is possible to display with good luminance and to make a color filter with high productivity.

  Each configuration used in the color filter of the present invention can be the same as the content described in the above-mentioned section “A. Color filter manufacturing method”, and thus the description thereof is omitted here.

  The color filter of the present invention is used in “D. Organic EL display device” described later.

D. Organic EL display device The organic EL display device of the present invention includes a transparent substrate, a low reflection layer formed on the transparent substrate and having an opening, a colored layer formed in the opening of the low reflection layer on the transparent substrate, and a low reflection layer A color filter comprising an auxiliary electrode layer formed thereon, and a conductive partition formed on the auxiliary electrode layer and made of a conductive photosensitive resin, a substrate, and a lower electrode layer formed on the substrate And an organic EL element side substrate comprising an organic EL layer formed on the lower electrode layer and including a light emitting layer, and an organic EL element having an upper transparent electrode layer formed on the organic EL layer, and The conductive partition side surface of the color filter and the organic EL element side surface of the organic EL element side substrate are arranged to face each other, and the conductive partition wall and the upper transparent electrode layer are in contact with each other. Doing things It is characterized by.

Examples of the organic EL display device of the present invention include, for example, FIG. 4, FIG. 10, FIG. Note that FIG. 4 has been described in the above-mentioned section “A. Color Filter Manufacturing Method”, and thus description thereof is omitted here.
10 illustrates an example of an organic EL display device using the color filter 10 illustrated in FIG. 5, and FIG. 11 illustrates an example of an organic EL display device using the color filter 10 illustrated in FIG. The reference numerals which are schematic sectional views and are not described can be the same as those in FIG. 4 and the like, and thus the description thereof is omitted here.

According to the present invention, since the conductive partition and the upper transparent electrode layer are in contact with each other, the current from the organic EL element side substrate is colored through the conductive partition and the auxiliary electrode layer. Since it can escape to the filter side, it can be set as the organic electroluminescence display which can prevent the brightness nonuniformity by voltage drop.
In addition, according to the present invention, by having the color filter including the conductive partition, the upper transparent electrode layer of the organic EL display device and the auxiliary electrode layer of the color filter are brought into electrical contact with each other. Further, since it is not necessary to form a transparent electrode layer, display can be performed with good luminance, and an organic EL display device with high productivity can be obtained.

The color filter used in the present invention can be the same as the contents described in the above-mentioned section “C. Color filter”, and thus the description thereof is omitted here.
The arrangement of the organic EL element side substrate, the color filter and the organic EL element side substrate used in the present invention, and other matters in the organic EL display device are described in the section “B. Manufacturing method of organic EL display device” described above. Since it can be made the same as that of the content demonstrated, description here is abbreviate | omitted.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

  Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples.

[Example]
[Preparation of substrate for color filter formation]
(Preparation of transparent substrate)
A glass substrate having a size of 1500 mm × 1850 mm and a thickness of 0.7 mm was prepared as a transparent substrate.

(Preparation of composition for forming low reflection layer)
First, 63 parts by mass of methyl methacrylate (MMA), 12 parts by mass of acrylic acid (AA), 6 parts by mass of 2-hydroxyethyl methacrylate (HEMA), and 88 parts by mass of diethylene glycol dimethyl ether (DMDG) in the polymerization tank. After the parts were charged, stirred and dissolved, 7 parts by mass of 2,2′-azobis (2-methylbutyronitrile) was added and dissolved uniformly.
Then, it stirred at 85 degreeC under nitrogen stream for 2 hours, and also was made to react at 100 degreeC for 1 hour.
Further, 7 parts by mass of glycidyl methacrylate (GMA), 0.4 parts by mass of triethylamine, and 0.2 parts by mass of hydroquinone were added to the obtained solution, and the mixture was stirred at 100 ° C. for 5 hours to obtain a copolymer resin solution ( A solid content of 50%) was obtained.

Next, the following materials were stirred and mixed at room temperature to prepare a curable resin composition A having the following composition.
<Composition of curable resin composition A>
-Copolymer resin solution (solid content 50%) ... 16 parts by mass-Dipentaerythritol pentaacrylate (Sartomer SR399)
... 24 parts by mass · Ortho-cresol novolac type epoxy resin (Epico Shell Epoxy Epicoat 180S70) · 4 parts by mass · 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one
... 4 parts by mass, diethylene glycol dimethyl ether ... 52 parts by mass

Next, the following components were mixed and sufficiently dispersed with a sand mill to prepare a black pigment dispersion.
<Composition of black pigment dispersion>
Black pigment (Mitsubishi Chemical Corporation # 2600) 20 parts by mass Polymer dispersion (Bic Chemie Japan, Ltd. Disperbyk 111)
... 16 parts by mass, solvent (diethylene glycol dimethyl ether) ... 64 parts by mass

Thereafter, the following components were mixed sufficiently to obtain a composition for forming a low reflection layer.
<Composition of composition for forming low reflection layer>
-Black pigment dispersion liquid: 50 parts by mass-Curable resin composition A: 20 parts by mass-Diethylene glycol dimethyl ether: 30 parts by mass

(Formation of low reflection layer)
Next, the obtained composition for forming a low reflection layer was applied to a transparent substrate, patterned by photolithography, and then baked to form a low reflection layer.

(Formation of colored layer)
Next, a red colored layer forming composition, a green colored layer forming composition, and a blue colored layer forming composition having the following compositions were prepared.

<Red colored layer forming composition>
・ C. I. Pigment Red 254 ... 10 parts by mass, polysulfonic acid type polymer dispersant ... 8 parts by mass, the curable resin composition A ... 15 parts by mass, 3-methoxybutyl acetate ... 67 parts by mass

<Green colored layer forming composition>
・ C. I. Pigment Green 58: 10 parts by mass / C.I. I. Pigment Yellow 138 3 parts by mass, polysulfonic acid type polymer dispersant 8 parts by mass, the curable resin composition A 12 parts by mass, 3-methoxybutyl acetate 67 parts by mass

<Blue colored layer forming composition>
・ C. I. Pigment Blue 1 ... 5 parts by mass, polysulfonic acid type polymer dispersant ... 3 parts by mass, the curable resin composition A ... 25 parts by mass, 3-methoxybutyl acetate ... 67 parts by mass

<White colored layer forming composition>
-The said curable resin composition A ... 33 mass parts-3-methoxybutyl acetate ... 67 mass parts

Next, a red colored layer forming composition was applied by spin coating so as to cover the low reflective layer on the glass substrate, patterned by photolithography, and baked to form a red colored layer.
Then, the green colored layer and the blue colored layer were formed by the same operation using the green colored layer forming composition and the blue colored layer forming composition. As a result, a colored layer in which a red colored layer, a green colored layer, and a blue colored layer were arranged was formed.
The thickness of the colored layer was 1.5 μm for the red colored layer, 1.5 μm for the green colored layer, 1.5 μm for the blue colored layer, and 1.5 μm for the white colored layer.

(Formation of metal auxiliary electrode layer)
Next, an Ag thin film having a thickness of 0.5 μm was formed on the low reflective layer and the colored layer by vapor deposition.
Through the above steps, a color filter forming substrate was produced.

[Production of color filters]
The following composition for conductive photosensitive resin layers was prepared.
<Composition of conductive photosensitive composition>
・ Micropearl AU (average primary particle size 11.5 μm) manufactured by Sekisui Chemical Co., Ltd. 6 parts by mass ・ The above curable resin composition A 58 parts by mass ・ 3-methoxybutyl acetate 36 parts by mass

Next, the said conductive photosensitive resin composition was apply | coated to the whole surface of the colored layer side surface of a color filter, and it was made to dry, and the 10-micrometer-thick conductive photosensitive resin layer was formed.
Next, the conductive photosensitive resin layer is exposed by a photolithography method through a photomask, and then developed to overlap with the low refractive index layer in plan view. A conductive partition wall having an opening overlapping therewith was obtained. The thickness of the conductive partition was the same as that of the conductive photosensitive resin layer, and some of the conductive fine particles were exposed on the surface of the conductive partition. A color filter was produced by the above procedure.

[Production of organic EL display device]
An organic EL element side substrate including a white light-emitting light source was manufactured as follows as an EL element side substrate for manufacturing an organic EL display device facing the color filter substrate.
First, a glass substrate (Corning 1737 glass) having a size of 1500 mm × 1850 mm and a thickness of 0.7 mm was prepared as a substrate. A thin film transistor circuit was produced on this substrate according to a conventional method.
Next, a lower electrode layer made of aluminum is formed on the surface of the substrate on the thin film transistor circuit side so as to correspond to the colored layers of each color of the color filter substrate, and an insulating layer made of polyimide is formed between the lower electrode layers. (Partition wall) was formed. Next, a white light emitting organic EL element (laminated structure of a hole injection layer, a white light emitting layer, and an electron injection layer) is formed in the gap between the insulating layers (partition walls), and indium tin oxide (ITO) is formed thereon. An upper transparent electrode layer was formed.
Thereafter, the conductive partition of the color filter and the organic EL element side surface of the organic EL element side substrate having the upper surface transparent electrode layer are opposed to each other, and the conductive partition and the upper surface transparent electrode layer are brought into contact with each other and bonded. An organic EL display device was produced by pasting together via an agent (NT-01UV manufactured by Nitto Denko Corporation).

[Comparative example]
[Production of color filters]
A color filter forming substrate was produced in the same manner as in the example.
Next, a photosensitive resin layer was formed on the metal auxiliary electrode layer of the color filter forming substrate, and was exposed and developed by photolithography to form a resist having the same pattern as the low reflection layer. Next, after etching the metal auxiliary electrode layer, the resist was peeled off. Thereafter, convex columns (PS) were formed at predetermined locations on the low reflective layer using NN780 (manufactured by JSR) using a photolithography method. The width of the base of the convex column was 40 μm, the width of the top was 20 μm, the height was 20 μm, and the taper angle from the base to the top was 70 °.
Next, an ITO film (ITO) having a thickness of 100 nm was formed on the entire surface of the transparent substrate on the side of the metal auxiliary electrode layer by sputtering, and annealed at 150 ° C. for 40 minutes to form a transparent electrode layer. The color filter was produced by the above procedure.

[Production of organic EL display device]
In the same manner as in the example, an organic EL element side substrate is prepared, and the transparent electrode layer side surface of the color filter and the organic EL element side surface of the organic EL element side substrate are arranged to face each other. An organic EL display device was manufactured by bonding in the same manner as in the example so that the electrode layer was in contact.

[Evaluation]
The occurrence of yield in each step of the color filter of the example and the comparative example was evaluated according to the same evaluation standard, and the yield of the entire color filter was obtained. The results are shown in Table 1. In addition, each structure in Table 1 has shown the process of forming each structure.

  In the example, since the number of manufacturing steps of the color filter can be reduced, it was confirmed that the yield of the entire color filter can be reduced as compared with the comparative example.

DESCRIPTION OF SYMBOLS 10 ... Color filter 10 '... Color filter formation board | substrate 11 ... Transparent substrate 12 ... Low reflection layer 13 ... Colored layer 14 ... Auxiliary electrode layer 15 ... Conductive partition 15' ... Conductive photosensitive resin layer 70 ... Organic EL element side Substrate 71 ... Substrate 80 ... Organic EL element 81 ... Lower electrode layer 83 ... Organic EL layer 85 ... Upper transparent electrode layer 100 ... Organic EL display device x ... Opening of low reflection layer y ... Opening of conductive partition

Claims (4)

A transparent substrate, a low reflection layer formed on the transparent substrate and having an opening, a colored layer formed in the opening of the low reflection layer on the transparent substrate, and the entire surface on the low reflection layer and the colored layer A conductive photosensitive resin layer for preparing a color filter forming substrate having an auxiliary electrode layer formed thereon and forming a conductive photosensitive resin layer made of a conductive photosensitive resin on the entire surface of the auxiliary electrode layer Forming process;
The conductive photosensitive resin layer is exposed and then developed to form a conductive partition that is formed so as to overlap the low reflective layer in plan view and has an opening that overlaps the colored layer in plan view. A conductive partition forming step;
An etching step of etching an exposed portion of the auxiliary electrode layer in which the conductive partition is formed;
Have a, the conductive photosensitive resin comprises a photosensitive resin exhibiting conductivity, but containing no conductive particles, or, characterized in that the containing conductive particles of the photosensitive resin and core-shell structure A method for producing a color filter. A transparent substrate, a low reflection layer formed on the transparent substrate and having an opening, a colored layer formed in the opening of the low reflection layer on the transparent substrate, and the entire surface on the low reflection layer and the colored layer A conductive photosensitive resin layer for preparing a color filter forming substrate having an auxiliary electrode layer formed thereon and forming a conductive photosensitive resin layer made of a conductive photosensitive resin on the entire surface of the auxiliary electrode layer Forming process,
The conductive photosensitive resin layer is exposed and then developed to form a conductive partition that is formed so as to overlap the low reflective layer in plan view and has an opening that overlaps the colored layer in plan view. A color filter forming step of forming a color filter by a color filter forming method comprising: a conductive barrier rib forming step; and an etching step of etching an exposed portion of the auxiliary electrode layer in which the conductive barrier rib is formed;
A substrate, and a bottom electrode layer formed on the substrate, an organic electroluminescence layer formed on the bottom electrode layer and including a light emitting layer, and a top transparent electrode layer formed on the organic electroluminescence layer Prepare an organic electroluminescence element side substrate equipped with an organic electroluminescence element,
The conductive partition side surface of the color filter and the organic electroluminescence element side surface of the organic electroluminescence element side substrate are opposed to each other,
An assembly step of placing the conductive partition wall and the upper transparent electrode layer in contact with each other so as to be conductive;
Have a, the conductive photosensitive resin comprises a photosensitive resin exhibiting conductivity, but containing no conductive particles, or, characterized in that the containing conductive particles of the photosensitive resin and core-shell structure A method for producing an organic electroluminescence display device. A transparent substrate;
A low reflection layer formed on the transparent substrate and having an opening;
A colored layer formed in the opening of the low reflective layer on the transparent substrate;
An auxiliary electrode layer formed on the low reflective layer;
A conductive partition formed on the auxiliary electrode layer and made of a conductive photosensitive resin. The conductive photosensitive resin contains a conductive photosensitive resin and does not contain conductive particles. A color filter comprising a photosensitive resin and conductive particles having a core-shell structure . Transparent substrate, low reflection layer formed on transparent substrate and having opening, colored layer formed on opening of low reflection layer on transparent substrate, auxiliary electrode layer formed on low reflection layer, and auxiliary electrode layer A color filter comprising a conductive partition formed on and formed of a conductive photosensitive resin;
A substrate, and a bottom electrode layer formed on the substrate, an organic electroluminescence layer formed on the bottom electrode layer and including a light emitting layer, and a top transparent electrode layer formed on the organic electroluminescence layer It has an organic electroluminescence element side substrate provided with an organic electroluminescence element,
The conductive filter side surface of the color filter and the organic electroluminescence element side surface of the organic electroluminescence element side substrate are arranged to face each other,
The conductive partition and the upper transparent electrode layer are in contact with each other so as to conduct ,
The conductive photosensitive resin includes a photosensitive resin exhibiting conductivity and does not include conductive particles, or includes a photosensitive resin and conductive particles having a core-shell structure. Luminescence display device.

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