JP6129492B2 - Laminated sheet - Google Patents

Description

  The present invention relates to a laminated sheet, and more particularly to a laminated sheet in which a plurality of types of adhesive sheets used in the same process of processing an adherend are laminated.

A semiconductor wafer (hereinafter sometimes simply referred to as “wafer”) is a non-processed surface treatment that is not performed when a surface treatment such as an etching process or a grinding process is performed in the process of forming a semiconductor chip. A protective sheet is affixed to the non-treated surface so that the surface is not damaged or contaminated by foreign substances such as chemicals, water, shavings, and dust. Also, the wafer is supported so that the wafer is not damaged or the semiconductor chip is not scattered in a wafer transfer process, a wafer singulation process, a bonding process in which the separated semiconductor chip is bonded to a lead frame, etc. At this time, the wafer is mounted on a frame member via a mounting sheet.
Patent Document 1 discloses a protective sheet (protective tape), and Patent Document 2 discloses a mounting sheet (dicing tape).

JP-A-5-206104 JP 2000-124169 A

The protective sheets and mounting sheets as described above are used for packaging each packaging sheet, release sheet for protecting each adhesive layer, and related materials such as paper tubes for winding each in a roll shape. There is a disadvantage that it is necessary and related materials are wasted.
Further, when the protective sheet and the mounting sheet are divided into small parts, a large space is required when transporting or storing them, and there is a disadvantage that transportation efficiency and storage efficiency are reduced.

[Object of invention]
An object of the present invention is to provide a laminated sheet that can prevent wasteful consumption of related materials related to a plurality of types of adhesive sheets used in the process of forming a semiconductor chip, an optical disk, or the like.
Furthermore, another object of the present invention is to provide a laminated sheet that can prevent a reduction in transport efficiency and storage efficiency related to a plurality of types of adhesive sheets used in the process of forming semiconductor chips, optical disks, and the like. It is in.

In order to achieve the above object, the present invention is a laminated sheet obtained by laminating a first adhesive sheet and a second adhesive sheet, which are used in the same process of applying predetermined processing to an adherend, in a peelable state ,
The laminated sheet has at least a first adhesive sheet having a first base sheet and a first adhesive layer , at least a second base sheet and a second adhesive layer, and without interposing a release sheet. A second adhesive sheet laminated on the first adhesive sheet ,
One of the first adhesive sheet and the second adhesive sheet is an adhesive sheet to be attached to the adherend,
The other of the first adhesive sheet and the second adhesive sheet is an adhesive sheet that integrates the adherend and the frame member.

  In the present invention, the second adhesive sheet may have a configuration in which a division groove is formed and a pre-cut sheet is formed inside the division groove.

  Further, the second adhesive sheet may be configured such that a third adhesive sheet to be attached to a predetermined adherend is further laminated.

Furthermore, in the present invention, when one of the first adhesive sheet and the second adhesive sheet performs a surface treatment on the adherend from one surface side of the adherend, the other surface of the adherend the is an adhesive sheet to protect against foreign objects, the other of the first adhesive sheet and the second adhesive sheet may have a structure wherein an adhesive sheet to integrate the adherend and the frame member.

Further, the present invention is a laminated sheet in which the first adhesive sheet and the second adhesive sheet used in the same process of applying a predetermined process to the adherend are laminated in a peelable state,
The laminated sheet has at least a first adhesive sheet having a first base sheet and a first adhesive layer, at least a second base sheet and a second adhesive layer, and without interposing a release sheet. A second adhesive sheet laminated on the first adhesive sheet,
The adherend Ri disk substrate der, one of the first adhesive sheet and the second adhesive sheet, a resin sheet for forming a record layer on disc substrate, wherein the first adhesive sheet and the the other of the second adhesive sheet may be affixed to one surface and a cover sheet to protect configuration before Kide disk substrate.

According to the present invention, since the second adhesive sheet is laminated on the first adhesive sheet, related materials related to a plurality of types of adhesive sheets used in the same process of performing predetermined processing on the adherend are wasted. Can be prevented.
Moreover, since the 2nd adhesive sheet was laminated | stacked on the 1st adhesive sheet, it becomes unnecessary to package them separately and it can prevent that transport efficiency and storage efficiency reduce.
In particular, for example, in the same process, such as a production process of a semiconductor chip or an optical disk, where the frequency of use is substantially the same in an area where the distance is not so much, that is, for one wafer or disk substrate By laminating the materials used one by one in a peelable state, they can be easily reused and either one of the first adhesive sheet and the second adhesive sheet is insufficient, There is no inconvenience that either one of them is left over.
Further, when a pre-cut sheet is formed by forming a split groove in the second adhesive sheet, the second adhesive sheet is attached to the adherend and the frame member, and then the second adhesive sheet is aligned along the shape of the frame member. The step of cutting can be omitted.
In the configuration in which the third sheet is laminated, for example, if the third sheet is a die attach film (die bonding sheet, DAF), the second adhesive sheet is pasted after the die attach film is pasted on the wafer. Such a process can be omitted.

(A) is a schematic perspective view of the lamination sheet which concerns on 1st Embodiment, (B) is the AA arrow sectional drawing. (A) is a schematic diagram of a grinding process, (B) is a schematic diagram of an individualization process. (A) is a schematic perspective view of the lamination sheet which concerns on 2nd Embodiment. (B) is the BB arrow sectional drawing. (A)-(D) are sectional drawings which show a modification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this embodiment, for example, when directions such as up and down are shown without giving a reference figure, all of FIG. 1B is a normal direction (a direction in which the number assigned is an appropriate direction). It is based on the case where it sees from.

[First Embodiment]
As shown in FIGS. 1 and 2, the laminated sheet 10 in the first embodiment is subjected to surface treatment on the wafer WF from the processing surface WF1 side as one surface of the wafer WF as an adherend. The non-processed surface WF2 as the other surface of the wafer WF is protected on a protective sheet PS as a first adhesive sheet that protects the foreign material such as chemical liquid, water, shavings, dust and the like, and the wafer WF is applied as a ring frame RF as a frame member. The mounting sheet MS as the second adhesive sheet to be mounted is laminated in a peelable state, and the release sheet RL is temporarily attached to the lower surface side of the protective sheet PS and wound around the core 12.

The protective sheet PS includes a first base sheet BS1 and a first adhesive layer AD1 provided on the lower surface side thereof. For example, as shown in FIG. 2 (A), the protective sheet PS rotates a grindstone 21 with a rotation motor 22 and performs a surface treatment process such as a back surface grinding process by a grinding means 20 for grinding the back surface of the wafer WF. At the time of a surface treatment process such as an etching process or a circuit surface forming process of the wafer WF, it is affixed to the non-processed surface WF2 that is not subjected to the surface treatment so that the non-processed surface WF2 is not damaged or contaminated by foreign matter. Are provided with properties capable of protecting the non-treated surface WF2. In addition, the 1st adhesive bond layer AD1 can use what the adhesive force falls by irradiating energy rays, such as an ultraviolet-ray and infrared rays.
The mounting sheet MS includes a second base sheet BS2 and a second adhesive layer AD2 provided on the lower surface side thereof. For example, as shown in FIG. 2 (B), the mounting sheet MS is rotated by rotating the cutting blade 31 with a rotation motor 32 to separate the wafer WF into individual pieces (dicing step). In the wafer transfer process, in the bonding process in which the semiconductor chip WF3 formed by separating the wafer WF is bonded to an adherend such as a substrate or a lead frame, the wafer WF is damaged or the semiconductor chip WF3 is scattered. In order to avoid this, the wafer WF or the semiconductor chip WF3 is mounted on the ring frame RF (integrated with the ring frame RF). In addition, as the second adhesive layer AD2, a layer whose adhesive strength is reduced when irradiated with energy rays such as ultraviolet rays and infrared rays can be used.

  The laminated sheet 10 according to the present embodiment is housed in a box such as a resin case or a cardboard case (not shown), and is transported, for example, under a tape sticking device as disclosed in JP-A-2-142156 (Prior Art Document 1). (The numbering with () is the numbering of the example document). That is, the laminated sheet 10 is supported by the tape roll (26) of the tape sticking apparatus, and the laminated sheet 10 fed out is peeled off from the mounting sheet MS and the protective sheet PS by the guide roller (27). Sheet MS is affixed to tray (1) and wafer (3). The affixed mounting sheet MS is cut with a cutter (42). The protective sheet PS after the mounting sheet MS is peeled off is wound up by the release paper roller (30).

  The protective sheet PS wound up by the release paper roller (30) as described above can be reused in a sheet sticking apparatus as disclosed in, for example, JP 2007-19239 (Prior Art Reference 2). That is, the protective sheet PS is supported by the support roller (20) of the sheet sticking apparatus, and the protective sheet PS that has been fed out is peeled off from the protective sheet PS and the release sheet RL by the peel plate (22). Is affixed to the wafer (W). The affixed protective sheet PS is cut with a cutter (15). The release sheet RL after the protective sheet PS is peeled off is wound up by the collection roller (23) and the take-up roller (81). In addition, the sheet sticking apparatus like conventional example literature 2 is arrange | positioned in the upstream of the tape sticking apparatus like conventional example literature 1 on both sides of the back surface grinding process shown to FIG. 2 (A).

Therefore, according to the first embodiment, since the mounting sheet MS is laminated on the protective sheet PS, a box (not shown) for packaging each, and a release sheet RL for protecting each adhesive layer, respectively. There is no need to prepare related materials such as paper tubes 12 for winding in rolls for each sheet, and the amount of these related materials can be halved, and multiple types of bonding used in the process of forming semiconductor chips It is possible to prevent the related materials related to the sheet from being wasted.
Further, since the mounting sheet MS is laminated on the protective sheet PS, it is not necessary to divide them, and it is possible to prevent the transportation efficiency and the storage efficiency from being reduced.
In particular, in the same process such as the production process of the semiconductor chip, as in the first embodiment, it is not so long as a tape sticking device like the conventional example document 1 and a sheet sticking device like the conventional example document 2. In a region that is not separated (in the case of the above embodiment, a region that only sandwiches the back grinding step shown in FIG. 2A), one for each wafer (3) and (W). By integrating the used materials in a peelable state, they can be easily reused, and either one of the protective sheet PS and the mounting sheet MS is insufficient, or either one is There will be no inconvenience of surplus.

[Second Embodiment]
As shown in FIG. 3, the laminated sheet 10 according to the second embodiment is arranged along the sheet extending direction on the mounting sheet MS as the second adhesive sheet laminated on the protective sheet PS as the first adhesive sheet. A continuous dividing groove 13 is formed, and a precut sheet CS is formed at predetermined intervals inside the divided groove 13. In the case of the present embodiment, a spacer sheet SS having the same plane height as the upper surface of the mounting sheet MS is formed outside the dividing groove 13.

  Such a laminated sheet 10 in the second embodiment is housed in a box such as a resin case or a cardboard case (not shown), and is, for example, under a bonding apparatus as shown in JP-A-2005-136306 (Prior Art Reference 3). Used to be transported to. That is, the laminated sheet 10 is supported by the support roller (11) of the same laminating apparatus, and the pre-cut sheet CS and the protective sheet PS are peeled off from the laminated sheet 10 fed out by the peel plate (41). CS is affixed to the ring frame (R) and the wafer (W). The protective sheet PS after the pre-cut sheet CS is peeled off is taken up by the take-up roller (115). The spacer sheet SS is wound up by the residue winding roller (22).

The protective sheet PS taken up by the take-up roller (115) as described above is used, for example, in a sheet sticking apparatus as shown in the above-mentioned conventional example document 2, and the protective sheet PS is the wafer (W) as described above. Affixed to
In the second embodiment, the dividing groove 13 is given a predetermined width, and the pre-cut sheet CS is formed on the inner side. However, similarly to the conventional example 3, the dividing groove 13 has a predetermined width. You may employ | adopt what does not have a width | variety (almost no width | variety).

According to the second embodiment, in addition to the effects obtained in the first embodiment, the cutting device for the mounting sheet MS used in the first embodiment can be made unnecessary.
In addition, by providing the spacer sheet SS, not only the precut sheet CS but also the protective sheet PS, when the laminated sheet 10 is wound, the step of the precut sheet CS that overlaps in the radial direction causes a scratch or a push. The inconvenience of forming a mark can be avoided.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary, and can adopt various configurations shown below.

That is, the configuration shown in FIG. 4A is obtained by removing the spacer sheet SS in the second embodiment in advance.
4B is a structure in which a third adhesive sheet AS3 is laminated on the lower surface side of the second adhesive layer AD2, and as the third adhesive sheet AS3, a pressure-sensitive adhesive sheet or die bonding is used. Examples thereof include a heat-sensitive adhesive sheet such as a sheet, and a pressure-sensitive adhesive sheet having an adhesive force and composition different from those of the second adhesive layer AD2, and the third adhesive sheet AS3 is attached to the wafer WF. The mounting sheet MS is affixed to the ring frame RF. According to this configuration, for example, by cutting the third adhesive sheet AS3 together with the wafer WF in the dicing process, the chip is mounted on the substrate or the like via the cut third adhesive sheet AS3, or for mounting. It is possible to make a difference between the adhesive force with which the sheet MS adheres to the wafer WF and the adhesive force with which the sheet MS adheres to the ring frame RF.
Furthermore, the configuration of FIG. 4C is obtained by removing the second adhesive layer AD2 corresponding to at least the region where the third adhesive sheet AS3 is laminated. According to this configuration, as described in FIG. 4B, when the chip is mounted on the substrate or the like via the cut third adhesive sheet AS3, the second adhesive layer AD2 becomes an impurity, It can prevent that the adhesive force with 3rd adhesive sheet AS3 falls.
In FIG. 4D, a protective sheet PS having a predetermined shape smaller than the width of the mounting sheet MS is laminated on the mounting sheet MS at predetermined intervals. The protective sheet PS may be a belt.

Furthermore, the laminated sheet 10 in the present invention is attached to an optical disk substrate as an adherend, and one of the first adhesive sheet and the second adhesive sheet is attached to the optical disk substrate to form a recording layer. It is a resin sheet (for example, a resin layer used in JP-A-2005-15160), and the other of the first adhesive sheet and the second adhesive sheet is attached to one surface of the optical disk substrate to protect the one surface A first cover sheet (for example, a cover sheet used in Japanese Patent Laid-Open No. 2007-313765) may be used. In addition to these, a third cover sheet may be a second cover sheet that is attached to the other surface of the optical disk substrate to protect the other surface.
Moreover, as an adherend, not only other adherends, such as a glass plate, a steel plate, earthenware, a wooden board, or a resin plate, but also an arbitrary form of member or article can be targeted. In short, the present invention provides a laminated sheet in which adhesive sheets having different properties are laminated, and can share related materials, and can be easily used in the same process for processing an adherend. Anything that can be reused is sufficient.
Furthermore, the laminated sheet 10 in the present invention may be a single sheet instead of a continuous belt.
In addition, the present invention does not limit the number of three layers of the protective sheet PS, the mounting sheet MS, and the third adhesive sheet AS3, and may be a laminated sheet including four or more adhesive sheets.
Furthermore, the height of the spacer sheet SS may not be the same height as the upper surface of the mounting sheet MS, and may be higher or lower than the upper surface of the mounting sheet MS.
Moreover, it is good also as a structure laminated | stacked in the state which can peel the protection sheet PS on the sheet | seat for mounting MS.
In addition to the ring frame RF, the frame member may be, for example, a ring-shaped or non-annular member, a polygonal frame member, or the like.
Further, the pre-cut sheet CS does not have to be circular, and may have an appropriate shape according to the shape of the adherend or the frame member.
Further, the first base sheet BS1 and the second base sheet BS2 may be the same (same composition, configuration, material) or different (different composition, configuration, material), and the same. It may be a thickness or a different thickness. Further, the first adhesive layer AD1 and the second adhesive layer AD2 may be the same (same composition, configuration, material) or different (different composition, configuration, material), and the same. It may be a thickness or a different thickness. In short, the first base sheet BS1 and the first adhesive layer AD1 are laminated to form the protective sheet PS, and the second base sheet BS2 and the second adhesive layer AD2 are laminated to form the mounting sheet MS. The protective sheet PS and the mounting sheet MS need only have different characteristics.

  The types and materials of the adherend, the first adhesive sheet, and the second adhesive sheet in the present invention are not particularly limited. For example, the protective sheet PS and the mounting sheet MS include the first and second base sheet BS1, Three or more layers such as those having an intermediate layer between BS2 and the first and second adhesive layers AD1, AD2, and having a cover layer on the upper surface of the first and second base sheet BS1, BS2, and more May be a so-called double-sided adhesive sheet that can peel the first and second base material sheets BS1 and BS2 from the first and second adhesive layers AD1 and AD2, and such double-sided adhesive As a sheet | seat, you may have a single layer or a multilayer intermediate layer, or a single layer or a multilayer without an intermediate layer. Furthermore, examples of the semiconductor wafer include a silicon semiconductor wafer and a compound semiconductor wafer. Examples of the optical disk (substrate) include CD (compact disk), DVD (digital versatile disk, LD (laser disk), and BD (Blu-ray disk).

10 Laminated Sheet 13 Divided Groove AS3 Third Adhesive Sheet CS Precut Sheet MS Mount Sheet (Second Adhesive Sheet)
PS protective sheet (first adhesive sheet)
RF ring frame (frame member)
WF Semiconductor wafer (Substrate)
WF1 treated surface (one surface)
WF2 Non-treated surface (the other surface)

Claims (3)

A laminated sheet in which the first adhesive sheet and the second adhesive sheet used in the same process of applying a predetermined process to the adherend are laminated in a peelable state
The laminated sheet has at least a first adhesive sheet having a first base sheet and a first adhesive layer , at least a second base sheet and a second adhesive layer, and without interposing a release sheet. A second adhesive sheet laminated on the first adhesive sheet ,
One of the first adhesive sheet and the second adhesive sheet is an adhesive sheet to be attached to the adherend,
The other of the first adhesive sheet and the second adhesive sheet is an adhesive sheet that integrates the adherend and a frame member . One of the first adhesive sheet and the second adhesive sheet is an adhesive that protects the other surface of the adherend from foreign matter when the surface of the adherend is subjected to surface treatment from the one surface side of the adherend. Sheet ,
The first adhesive sheet and the other of the second adhesive sheet, laminated sheet according to claim 1 Symbol placement, wherein the an adhesive sheet to integrate the adherend and the frame member. A laminated sheet in which the first adhesive sheet and the second adhesive sheet used in the same process of applying a predetermined process to the adherend are laminated in a peelable state
The laminated sheet has at least a first adhesive sheet having a first base sheet and a first adhesive layer, at least a second base sheet and a second adhesive layer, and without interposing a release sheet. A second adhesive sheet laminated on the first adhesive sheet,
The adherend Ri disk substrate der,
One of the first adhesive sheet and the second adhesive sheet, a resin sheet for forming a record layer on disc substrate,
The first adhesive sheet and the other of the second adhesive sheet, before Kide disc product layer sheet characterized in that is affixed to one surface of the substrate is a cover sheet to protect.

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