JP6108210B2 - 電子部品用積層配線膜 - Google Patents

電子部品用積層配線膜 Download PDF

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Publication number
JP6108210B2
JP6108210B2 JP2012277916A JP2012277916A JP6108210B2 JP 6108210 B2 JP6108210 B2 JP 6108210B2 JP 2012277916 A JP2012277916 A JP 2012277916A JP 2012277916 A JP2012277916 A JP 2012277916A JP 6108210 B2 JP6108210 B2 JP 6108210B2
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Japan
Prior art keywords
layer
coating layer
wiring film
film
main conductive
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Active
Application number
JP2012277916A
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English (en)
Japanese (ja)
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JP2013179265A (ja
Inventor
村田　英夫
英夫 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Metals Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP2012277916A priority Critical patent/JP6108210B2/ja
Publication of JP2013179265A publication Critical patent/JP2013179265A/ja
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Publication of JP6108210B2 publication Critical patent/JP6108210B2/ja
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  • Engineering & Computer Science (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2012277916A 2012-01-31 2012-12-20 電子部品用積層配線膜 Active JP6108210B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012277916A JP6108210B2 (ja) 2012-01-31 2012-12-20 電子部品用積層配線膜

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012018170 2012-01-31
JP2012018170 2012-01-31
JP2012277916A JP6108210B2 (ja) 2012-01-31 2012-12-20 電子部品用積層配線膜

Publications (2)

Publication Number Publication Date
JP2013179265A JP2013179265A (ja) 2013-09-09
JP6108210B2 true JP6108210B2 (ja) 2017-04-05

Family

ID=48837569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012277916A Active JP6108210B2 (ja) 2012-01-31 2012-12-20 電子部品用積層配線膜

Country Status (4)

Country Link
JP (1) JP6108210B2 (zh)
KR (1) KR101421881B1 (zh)
CN (1) CN103227195B (zh)
TW (1) TWI482256B (zh)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62290150A (ja) * 1986-06-09 1987-12-17 Fujitsu Ltd 半導体装置及びその製造方法
JPH05102155A (ja) * 1991-10-09 1993-04-23 Sony Corp 銅配線構造体及びその製造方法
JP4432206B2 (ja) * 2000-05-18 2010-03-17 株式会社ブリヂストン 積層膜の形成方法
US6727593B2 (en) * 2001-03-01 2004-04-27 Kabushiki Kaisha Toshiba Semiconductor device with improved bonding
CN101090123A (zh) * 2006-06-16 2007-12-19 台湾薄膜电晶体液晶显示器产业协会 具铜导线结构的薄膜晶体管及其制造方法
KR101043508B1 (ko) * 2006-10-13 2011-06-23 가부시키가이샤 고베 세이코쇼 박막 트랜지스터 기판 및 표시 디바이스
EP2096666A4 (en) * 2006-12-28 2015-11-18 Ulvac Inc METHOD FOR PRODUCING A WIRING FOIL, TRANSISTOR AND ELECTRONIC DEVICE
CN101529567B (zh) * 2006-12-28 2012-07-04 株式会社爱发科 布线膜的形成方法、晶体管以及电子装置
CN101971349B (zh) * 2008-04-25 2013-03-27 株式会社爱发科 薄膜晶体管的制造方法、薄膜晶体管
JP5354781B2 (ja) 2009-03-11 2013-11-27 三菱マテリアル株式会社 バリア層を構成層とする薄膜トランジスターおよび前記バリア層のスパッタ成膜に用いられるＣｕ合金スパッタリングターゲット
JP2011091364A (ja) * 2009-07-27 2011-05-06 Kobe Steel Ltd 配線構造およびその製造方法、並びに配線構造を備えた表示装置

Also Published As

Publication number Publication date
TW201332076A (zh) 2013-08-01
TWI482256B (zh) 2015-04-21
CN103227195B (zh) 2015-10-28
JP2013179265A (ja) 2013-09-09
CN103227195A (zh) 2013-07-31
KR20130088768A (ko) 2013-08-08
KR101421881B1 (ko) 2014-07-22

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