JP6100924B2 - 導電膜形成用組成物、導電膜、有機薄膜トランジスタ、電子ペーパー、ディスプレイデバイス、配線板 - Google Patents
導電膜形成用組成物、導電膜、有機薄膜トランジスタ、電子ペーパー、ディスプレイデバイス、配線板 Download PDFInfo
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- JP6100924B2 JP6100924B2 JP2015555867A JP2015555867A JP6100924B2 JP 6100924 B2 JP6100924 B2 JP 6100924B2 JP 2015555867 A JP2015555867 A JP 2015555867A JP 2015555867 A JP2015555867 A JP 2015555867A JP 6100924 B2 JP6100924 B2 JP 6100924B2
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- JWVCLYRUEFBMGU-UHFFFAOYSA-N quinazoline Chemical compound N1=CN=CC2=CC=CC=C21 JWVCLYRUEFBMGU-UHFFFAOYSA-N 0.000 description 1
- SBYHFKPVCBCYGV-UHFFFAOYSA-N quinuclidine Chemical compound C1CC2CCN1CC2 SBYHFKPVCBCYGV-UHFFFAOYSA-N 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- PHICBFWUYUCFKS-UHFFFAOYSA-N spiro[4.4]nonane Chemical compound C1CCCC21CCCC2 PHICBFWUYUCFKS-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 125000003696 stearoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- ILMRJRBKQSSXGY-UHFFFAOYSA-N tert-butyl(dimethyl)silicon Chemical group C[Si](C)C(C)(C)C ILMRJRBKQSSXGY-UHFFFAOYSA-N 0.000 description 1
- NYBWUHOMYZZKOR-UHFFFAOYSA-N tes-adt Chemical compound C1=C2C(C#C[Si](CC)(CC)CC)=C(C=C3C(SC=C3)=C3)C3=C(C#C[Si](CC)(CC)CC)C2=CC2=C1SC=C2 NYBWUHOMYZZKOR-UHFFFAOYSA-N 0.000 description 1
- NMFKEMBATXKZSP-UHFFFAOYSA-N thieno[3,2-b]thiophene Chemical compound S1C=CC2=C1C=CS2.S1C=CC2=C1C=CS2 NMFKEMBATXKZSP-UHFFFAOYSA-N 0.000 description 1
- BRNULMACUQOKMR-UHFFFAOYSA-N thiomorpholine Chemical compound C1CSCCN1 BRNULMACUQOKMR-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/82—Electrodes
- H10K10/84—Ohmic electrodes, e.g. source or drain electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
Landscapes
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Thin Film Transistor (AREA)
- Non-Insulated Conductors (AREA)
- Paints Or Removers (AREA)
- Electrodes Of Semiconductors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014000192 | 2014-01-06 | ||
| JP2014000192 | 2014-01-06 | ||
| PCT/JP2014/083401 WO2015102075A1 (fr) | 2014-01-06 | 2014-12-17 | Composition de formation d'un film conducteur, film conducteur, transistor à couche mince organique, papier électronique, dispositif d'affichage et carte câblée |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6100924B2 true JP6100924B2 (ja) | 2017-03-22 |
| JPWO2015102075A1 JPWO2015102075A1 (ja) | 2017-03-23 |
Family
ID=53493419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015555867A Active JP6100924B2 (ja) | 2014-01-06 | 2014-12-17 | 導電膜形成用組成物、導電膜、有機薄膜トランジスタ、電子ペーパー、ディスプレイデバイス、配線板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6100924B2 (fr) |
| TW (1) | TW201527455A (fr) |
| WO (1) | WO2015102075A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018092762A1 (fr) * | 2016-11-21 | 2018-05-24 | 東洋紡株式会社 | Pâte conductrice, film conducteur, procédé de production de film conducteur, ligne de câblage mince conductrice et procédé de production de ligne de câblage mince conductrice |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003027277A (ja) * | 2001-07-13 | 2003-01-29 | Ishihara Chem Co Ltd | スズメッキ浴、スズメッキ方法及び当該メッキ浴を用いてスズメッキを施した電子部品 |
| JP2006047870A (ja) * | 2004-08-06 | 2006-02-16 | Fuji Xerox Co Ltd | 電子写真感光体及びその製造方法、電子写真装置、並びにプロセスカートリッジ |
| JP2006335995A (ja) * | 2005-06-06 | 2006-12-14 | Hitachi Maxell Ltd | インクジェット用導電性インク、導電性パターンおよび導電体 |
| JP2007518984A (ja) * | 2004-01-09 | 2007-07-12 | ハイポガード・リミテッド | バイオセンサーおよび製造方法 |
| WO2011057745A2 (fr) * | 2009-11-10 | 2011-05-19 | Ami Doduco Gmbh | Procédé pour déposer une couche de palladium adaptée à la métallisation de fils, sur des pistes conductrices d'une plaque porte-circuit et bain de palladium à utiliser pour mettre en oeuvre le procédé |
| JP2013011885A (ja) * | 2011-06-02 | 2013-01-17 | Canon Inc | 電子写真感光体、プロセスカートリッジ、電子写真装置および積層膜 |
| JP2013026089A (ja) * | 2011-07-22 | 2013-02-04 | Fujikura Ltd | 電子線硬化用導電性ペースト及びこれを用いた回路基板の製造方法 |
| WO2014208445A1 (fr) * | 2013-06-27 | 2014-12-31 | 東レ株式会社 | Pâte électroconductrice, procédé de fabrication d'un motif électroconducteur et panneau tactile |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05230400A (ja) * | 1992-02-20 | 1993-09-07 | Kao Corp | 導電性ペーストおよび導電性塗膜 |
| JP4987239B2 (ja) * | 2004-08-30 | 2012-07-25 | 信越ポリマー株式会社 | 導電性組成物 |
| JP5323302B2 (ja) * | 2005-08-10 | 2013-10-23 | 信越ポリマー株式会社 | 導電性高分子塗料の製造方法および導電性塗膜の製造方法 |
| JP2009292909A (ja) * | 2008-06-04 | 2009-12-17 | Sanyo Chem Ind Ltd | 導電性コーティング組成物 |
| JP2014015550A (ja) * | 2012-07-10 | 2014-01-30 | Mitsubishi Rayon Co Ltd | 導電性組成物及び前記導電性組成物を用いた導電体 |
-
2014
- 2014-12-17 JP JP2015555867A patent/JP6100924B2/ja active Active
- 2014-12-17 WO PCT/JP2014/083401 patent/WO2015102075A1/fr active Application Filing
- 2014-12-24 TW TW103145109A patent/TW201527455A/zh unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003027277A (ja) * | 2001-07-13 | 2003-01-29 | Ishihara Chem Co Ltd | スズメッキ浴、スズメッキ方法及び当該メッキ浴を用いてスズメッキを施した電子部品 |
| JP2007518984A (ja) * | 2004-01-09 | 2007-07-12 | ハイポガード・リミテッド | バイオセンサーおよび製造方法 |
| JP2006047870A (ja) * | 2004-08-06 | 2006-02-16 | Fuji Xerox Co Ltd | 電子写真感光体及びその製造方法、電子写真装置、並びにプロセスカートリッジ |
| JP2006335995A (ja) * | 2005-06-06 | 2006-12-14 | Hitachi Maxell Ltd | インクジェット用導電性インク、導電性パターンおよび導電体 |
| WO2011057745A2 (fr) * | 2009-11-10 | 2011-05-19 | Ami Doduco Gmbh | Procédé pour déposer une couche de palladium adaptée à la métallisation de fils, sur des pistes conductrices d'une plaque porte-circuit et bain de palladium à utiliser pour mettre en oeuvre le procédé |
| JP2013011885A (ja) * | 2011-06-02 | 2013-01-17 | Canon Inc | 電子写真感光体、プロセスカートリッジ、電子写真装置および積層膜 |
| JP2013026089A (ja) * | 2011-07-22 | 2013-02-04 | Fujikura Ltd | 電子線硬化用導電性ペースト及びこれを用いた回路基板の製造方法 |
| WO2014208445A1 (fr) * | 2013-06-27 | 2014-12-31 | 東レ株式会社 | Pâte électroconductrice, procédé de fabrication d'un motif électroconducteur et panneau tactile |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201527455A (zh) | 2015-07-16 |
| JPWO2015102075A1 (ja) | 2017-03-23 |
| WO2015102075A1 (fr) | 2015-07-09 |
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