JP6097569B2 - Substrate processing apparatus and substrate processing row control method - Google Patents

Description

The present invention relates to a substrate processing apparatus and a substrate processing column control method for processing a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a substrate for an optical disk (hereinafter simply referred to as a substrate).

  Conventionally, as this type of apparatus, there is an apparatus including a plurality of substrate processing units and a control unit. Each substrate processing unit includes a processing unit and a main transport mechanism that transports the substrate to the processing unit, and performs a series of processes on the substrate. The control unit controls each substrate processing unit based on transfer order information (flow recipe) that defines the order of processing units to which the substrate is transferred. By this control, each substrate processing unit transports the substrates to the plurality of processing units in a predetermined order. According to such an apparatus, since each substrate processing part can perform substrate processing in parallel, substrate processing capability (throughput) can be improved (for example, refer to patent documents 1 and 2).

JP 2009-10291 A JP 2005-93922 A

However, the conventional example having such a configuration has the following problems.
The transport order information normally defines the order of processing units for producing a substrate (product) that has been subjected to a predetermined process. Here, when some substrate processing units are suspended, the transfer order information is changed so that the substrates are not transferred to all the processing units belonging to some substrate processing units.

  However, since the conveyance order information is information that defines the order for producing products and is directly related to the quality of products, it is not preferable to frequently change the conveyance order information.

  Further, since the transport order information is basically information in which the transport order and the processing units are associated with each other, the changed part of the transport order information is equal to or more than the number of processing units and is relatively large. For this reason, the operation | work which corrects conveyance order information becomes complicated.

The present invention has been made in view of such circumstances, and can easily and independently stop and operate a plurality of substrate processing rows without changing the transfer order information. And it aims at providing a substrate processing sequence control method.

In order to achieve such an object, the present invention has the following configuration.
That is, the present invention is a substrate processing apparatus, comprising: a plurality of substrate processing rows for performing a series of processes on a substrate; and a control unit that controls the plurality of substrate processing rows , wherein the substrate processing rows include a plurality of substrate processing rows . A processing unit; and a main transport mechanism that transports the substrate to the processing unit, and the control unit selects transport order information that defines an order of the processing units to which the substrate is transported, and a substrate processing row to be operated. The substrate processing apparatus operates the substrate processing sequence selected by the selection information in accordance with the transfer order information based on the selection information for stopping the substrate processing sequence not selected by the selection information.

[Operation / Effect] According to the substrate processing apparatus of the present invention, the control unit operates the substrate processing sequence selected by the selection information in accordance with the transfer order information, and selects the substrate processing sequence not selected by the selection information. The operation is suspended regardless of the conveyance order information. Here, the selection information and the conveyance order information are separate and independent information, and the change of the selection information is not accompanied by the change of the conveyance order information. Therefore, the substrate processing rows can be individually operated or stopped without changing the transfer order information. Further, since the selection information is information related to the substrate processing sequence , the number of information to be changed in the selection information is about the same as the number of substrate processing sequences to be switched between operation and stop, and is relatively small. In this way, the substrate processing rows can be individually operated and stopped without changing the transfer order information.

Furthermore, when the substrate processing row is operated, the control unit basically controls based on the conveyance order information. Therefore, even when the selection information is changed when an arbitrary substrate processing row is in operation, there is no need to temporarily stop the substrate processing row in operation. That is, even when an arbitrary substrate processing row is in operation, the selection information can be changed without hindrance. Note that when the selection information is changed, switching of the control content by the control unit is not always executed immediately.

In the above-described invention, the selection information is preferably information in which identification information of each substrate processing sequence is associated with setting information indicating whether or not the substrate processing sequence to be operated is specified. According to this, by changing the setting information, it is possible to collectively change the selection information regarding an arbitrary substrate processing column .

In the above-described invention, when the other substrate processing sequence is in operation when switching the operation / stop of a part of the substrate processing sequence based on the selection information, the control unit operates the other substrate processing sequence . It is preferable to switch the operation / stop of some substrate processing rows without interrupting the process . According to this, when switching operation / stop of some substrate processing rows , the operation of other substrate processing rows can be continued. Therefore, it is possible to prevent the operating rate of the substrate processing apparatus from being significantly reduced.

In the above-described invention, an indexer unit that transports a substrate from a container accommodating a substrate to each substrate processing column is provided, and the control unit switches between operation and stop of the substrate processing column when the container is updated. It is preferable to carry out. According to this, the timing of switching the control content for the substrate processing row is limited only when the container is updated. Therefore, it can suppress that process quality varies between several board | substrates in the same container.

In the above-described invention, it is preferable that the control unit refers to the selection information and determines a substrate processing row into which a substrate is to be loaded for each container. According to this, since the transport destination of the substrate is determined for each container, the transport destination of the substrate in the container does not change during the loading of the substrate from one container into the substrate processing row . Therefore, it can suppress that process quality varies between several board | substrates in the same container.

  In the above-described invention, it is preferable that an input unit for setting or changing selection information is provided. According to this, the selection information can be easily changed by the user operating the input unit.

  In the above-described invention, it is preferable that the transfer order information defines the order of processing units to which the substrates are transferred when producing a substrate as a product subjected to a predetermined process.

In addition, the present invention is a control method for controlling a plurality of substrate processing rows for transferring a substrate to a plurality of processing units and performing a series of processing on the substrate, and for specifying the order of processing units to which the substrates are transferred. A step of controlling each substrate processing sequence based on the order information and selection information for selecting a substrate processing sequence to be operated, and the controlling step selects a substrate processing sequence selected by the selection information; substrate based on the portion of the conveying sequence information is operated, and, ignoring the portion of the conveying order information corresponding to the substrate treatment line which is not selected, not selected by the selection information corresponding to the substrate treatment line which is This is a substrate processing sequence control method for stopping the operation of the processing sequence .

[ Operation / Effect] According to the substrate processing sequence control method of the present invention, the controlling step controls each substrate processing sequence based on the transfer order information and the selection information. Specifically, the portion obtained by multiplying the transfer order information and the selection information is regarded as valid, and the substrate processing row selected based on this valid portion is operated. On the other hand, the part out of the part considered to be valid in the transport order information is regarded as invalid, and the substrate processing row not selected is stopped. Here, the selection information and the conveyance order information are separate and independent information, and the change of the selection information is not accompanied by the change of the conveyance order information. Therefore, only a part of the substrate processing rows can be operated or stopped without changing the transfer order information. Further, since the selection information is information related to the substrate processing sequence , the number of information to be changed in the selection information is about the same as the number of substrate processing sequences to be switched between operation and stop, and is relatively small. In this way, the substrate processing rows can be individually operated and stopped without changing the transfer order information.

Further, when the substrate processing row is operated, the control process is basically controlled based on the conveyance order information. Therefore, even when an arbitrary substrate processing row is operating, the selection information can be changed without hindrance.

In the above-described invention, the selection information is preferably information in which identification information of each substrate processing sequence is associated with setting information indicating whether or not the substrate processing sequence to be operated is specified. According to this, by changing the setting information, it is possible to collectively change the selection information regarding an arbitrary substrate processing column .

In the above-described invention, the step of controlling, when other substrate treatment lines when switching the operation and stop of the portion of the substrate treatment lines based on the selection information is in operation, the operation of the other substrate treatment lines It is preferable to switch the operation / stop of some substrate processing rows without stopping the operation. According to this, it is possible to switch operation / stop of some substrate processing columns without interrupting the operation of other substrate processing columns . Therefore, it is possible to prevent the substrate processing capability from being significantly reduced.

In the above-described invention, the method further includes a step of loading the substrate from the container that accommodates the substrate into the substrate processing row , and the step of controlling the switching of operation / stop of the substrate processing row when the container is updated. Is preferably performed. According to this, switching of the control content of the substrate processing sequence is limited only when the container is updated. Therefore, it can suppress that process quality varies between several board | substrates in the same container.

In the above-described invention, it is preferable that the loading step determines a substrate processing row into which a substrate is loaded based on the selection information every time the container is updated. According to this, since the loading destination of the substrate in the container is determined at an appropriate timing, the loading destination of the substrate does not change midway with respect to each individual container. Therefore, it can suppress that process quality varies between several board | substrates in a container.

In the above-described invention, when the substrate processing sequence whose selection is canceled in the selection information is operating at the time of the cancellation, the controlling step is all in the container that accommodates the substrate being processed in the substrate processing sequence. It is preferable to continue the operation of the substrate processing sequence until the processing is completed for the substrate, and then stop the operation of the substrate processing sequence . According to this, it can suppress that process quality varies between each board | substrate in a container.

In the above-described invention, when the selection of the substrate processing row is canceled in the selection information, it is preferable that the loading step does not insert the substrate from the new container into the substrate processing row after the cancellation. According to this, it is possible to quickly stop the operation of the substrate processing row whose selection is canceled while suppressing the processing quality from being varied among the substrates in the container.

  In the above-described invention, it is preferable to further include a step of setting or changing selection information. According to this, selection information can be changed suitably.

  In the above-described invention, it is preferable that the transfer order information defines the order of processing units to which the substrates are transferred when producing a substrate as a product subjected to a predetermined process.

The present specification also discloses the invention relating to the following substrate processing apparatus and substrate processing row control method.

(1) It is preferable that the control unit ignores a portion corresponding to the unselected substrate processing row in the transfer order information and considers only a portion corresponding to the selected substrate processing row as valid.

According to the above (1), it is possible to suitably switch the operation / stop of only a part of the substrate processing rows without changing the transfer order information.

(2) When the selection information is changed, the control unit preferably changes the control of each substrate processing row based on the transfer order information and the changed selection information without changing the transfer order information. .

(3) In the controlling step, when the selection information is changed, it is preferable to change the control of each substrate processing row based on the transfer order information and the changed selection information without changing the transfer order information. .

  According to the above (2) and (3), the operation / stop of some of the processing units can be suitably switched without changing the conveyance order information.

(4) When the substrate processing sequence whose selection is canceled in the selection information is operating at the time of the cancellation, the control unit, when the substrate processing sequence is operated, all the substrates in the container that accommodates the substrate being processed in the substrate processing sequence It is preferable to continue the operation of the substrate processing row until the processing is completed, and then stop the operation of the substrate processing row .

  According to the description in (4), it is possible to suppress variation in processing quality between the substrates in the container.

(5) When the selection of the substrate processing row is canceled in the selection information, it is preferable that the control unit prohibits starting a substrate transfer from the new container to the substrate processing row after the release.

According to the above (5), it is possible to quickly stop the operation of the substrate processing row whose selection has been canceled while suppressing the processing quality from varying among the substrates in the container.

  (6) It is preferable that the input unit accepts a command for setting or changing setting information.

  According to said (6), selection information can be changed suitably.

  (7) It is preferable to further include a step of receiving a command for setting or changing the selection information.

  According to (7), the user can easily change the selection information.

(8) It is preferable that the control unit includes a controller that controls a plurality of substrate processing rows and a setting unit that sets / changes selection information.

  According to (8) above, since the control unit includes the setting unit, the selection information can be suitably set / changed.

  (9) The transport order information is preferably information in which processing unit identification information is associated with the transport order.

  According to said (9), conveyance order information can be comprised suitably.

According to the substrate processing apparatus and the substrate processing sequence control method of the present invention, it is possible to easily operate and stop the substrate processing sequence individually without changing the transfer order information.

It is a top view which shows schematic structure of the substrate processing apparatus which concerns on an Example. It is a schematic side view which shows arrangement | positioning of a processing unit. It is a schematic side view which shows arrangement | positioning of a processing unit. It is each vertical sectional drawing of the aa arrow in FIG. It is a control block diagram of the substrate processing apparatus which concerns on an Example. It is a schematic diagram which shows the structure of a flow recipe. It is a flowchart which shows the procedure which controls an ID part and a board | substrate process sequence. It is a flowchart which shows the procedure which controls the ID part which concerns on a modified example, and a board | substrate process sequence.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view illustrating a schematic configuration of a substrate processing apparatus according to an embodiment. FIGS. 2 and 3 are schematic side views illustrating an arrangement of processing units included in the substrate processing apparatus. FIG. It is each vertical sectional view of aa arrow in.

[Configuration of substrate processing unit, etc.]
The substrate processing apparatus 1 processes each substrate (for example, a semiconductor wafer) W. The substrate processing apparatus 1 includes an indexer unit (hereinafter referred to as “ID unit”) 3, a plurality of substrate processing rows 5 and 6, and an interface unit (hereinafter referred to as “IF unit”) 7. As shown in FIGS. 2 to 4, the substrate processing rows 5 and 6 are stacked so as to be lined up and down. The ID unit 3 is provided adjacent to one side of each of the substrate processing rows 5 and 6. The IF unit 7 is provided so as to be adjacent to the other side of each of the substrate processing rows 5 and 6. As shown in FIG. 1, the IF unit 7 is further adjacent to an exposure machine EXP that is an external device separate from the substrate processing apparatus 1. Each of the substrate processing rows 5 and 6 corresponds to a substrate processing unit in the present invention. Hereinafter, the ID unit 3, the substrate processing rows 5 and 6, and the IF unit 7 will be described in order.

The ID unit 3 throws the substrate W into the substrate processing rows 5 and 6. The ID unit 3 includes a mounting table 4 and an ID transport mechanism T _ID . The mounting table 4 can mount a plurality (four) of cassettes C. The cassette C accommodates a plurality of substrates W. The ID transport mechanism T _ID is configured to be movable in the horizontal direction and the vertical direction, and transports the substrate W to the cassette C and the substrate processing rows 5 and 6 mounted on the mounting table 4. The cassette C corresponds to the container in the present invention.

  Each of the substrate processing rows 5 and 6 performs a series of processing on the substrate W. The series of processes is, for example, a process of forming a resist film or the like on the substrate W and developing the exposed substrate W. In the following, since the substrate processing columns 5 and 6 have substantially the same configuration, the substrate processing column 5 will be described, and the substrate processing column 6 will be denoted by the same reference numerals and description thereof will be omitted.

The substrate processing row 5 includes a plurality of processing units and main transport mechanisms T ₁ and T ₂ that transport the substrate W to these processing units. The main transport mechanisms T ₁ and T ₂ are arranged in a direction connecting the ID unit 3 and the IF unit 7. Each main transport mechanism T ₁ , T ₂ is movable in the horizontal direction and the vertical direction. The main transport mechanism T _1, along with receiving and transferring the substrates W in both directions between the ID's transport mechanism T _ID and main transport mechanisms T _2, transports the substrate W to the processing unit. The main transport mechanism _{T 2,} together with the receiving and transferring the substrates W between the main transport mechanisms _{T 1} and IF section 7 (IF's transport mechanisms _{T IF1} described later), transports the substrate W to the processing unit. As a result, the substrate processing array 5 reciprocates the substrate W between the ID unit 3 and the IF unit 7.

Between the ID transport mechanism T _ID and the main transport mechanism T ₁ , a placement unit PASS ₁ for placing the substrate W is disposed. Similarly, between the main transport mechanism _{T 1} and the main transport mechanism _{T 2,} and between the main transport mechanism _{T 2} and IF's transport mechanisms _{T IF1,} respectively, the mounting portion PASS ₂ and mounting part PASS ₃ Has been placed. The transport mechanisms T _ID , T ₁ , T ₂ , and T _IF1 deliver the substrate W to another transport mechanism by temporarily placing the substrate W on the placement units PASS _{1 to} PASS ₃ .

Please refer to FIG. The placement unit PASS ₁ includes a placement unit PASS _1A and a placement unit PASS _1B . The placement units PASS _1A and PASS _1B are selectively used depending on the transport direction of the substrate W. For example, the mounting portion PASS _1A, is placed the substrate W is transported from the _ID transport mechanism _{T ID} to the main transport mechanism _{T 1,} the mounting portion PASS _1B, conveying ID from the main transport mechanism _{T 1} A substrate W to be transported to the mechanism T _ID is placed. The same applies to the placement part PASS ₂ and the placement part PASS ₃ .

Please refer to FIG. Processing unit having a substrate treatment line 5, a processing unit main transport mechanism T ₁ is to bear the transportation of the substrate W, the main transport mechanism T ₂ is roughly divided into a processing unit to bear the transportation of the substrate W.

First, the former will be described. A processing unit main transport mechanism T ₁ is to bear the transport of the substrate W, the coating unit 11 for forming a coating film on the substrate W, a heat treatment unit 13 for heat-treating the wafers W. Coating unit 11 is disposed on one side of the main transport mechanism T _1, the heat treatment unit 13 is disposed on the other side of the main transport mechanism T _1.

  As shown in FIG. 2, the coating processing unit 11 is specifically an antireflection film coating processing unit BARC and a resist film coating processing unit RESIST. The antireflection film coating processing unit BARC performs a process of applying an antireflection film material to the substrate W and forming an antireflection film on the surface of the substrate W. The resist film application processing unit RESIST performs a process of applying a resist to the substrate W and forming a resist film on the surface of the substrate W.

  Please refer to FIG. Each coating processing unit 11 is a so-called rotary coating processing unit, and includes a nozzle 15 and a scattering prevention cup 17. The nozzle 15 discharges the processing liquid onto the substrate W. The splash prevention cup 17 receives and collects the processing liquid splashed from the substrate W. Furthermore, the coating processing unit 11 includes a holding unit (not shown) that holds a single substrate W rotatably in a substantially horizontal posture.

  As shown in FIG. 3, the heat treatment unit 13 is specifically a cooling unit CP, a heating / cooling unit PHP, and an adhesion processing unit AHL. The cooling unit CP cools the substrate W. The heating / cooling unit PHP performs the heating process and the cooling process continuously. The adhesion processing unit AHL performs heat treatment in a steam atmosphere of HMDS (hexamethylsilazane) in order to improve the adhesion between the substrate W and the coating.

Referring to FIG. 1, the main transport mechanism T ₂ will be described the processing units bear the transport of the substrate W. The processing units are a development processing unit DEV, a heat treatment unit 23, and an edge exposure unit EEW (see FIG. 3 for the edge exposure unit EEW). Developing units DEV are arranged at one side of the main transport mechanism T _2, the heat-treating units 23 and edge exposing unit EEW are arranged in the other side of the main transport mechanism T _2.

  The development processing unit DEV performs development processing on the substrate W. The development processing unit DEV includes a nozzle 25 and a scattering prevention cup 27. The nozzle 25 discharges the processing liquid onto the substrate W. The splash prevention cup 27 receives and collects the processing liquid splashed from the substrate W. Further, the development processing unit DEV includes a holding unit (not shown) that holds a single substrate W rotatably in a substantially horizontal posture.

As shown in FIG. 3, the heat treatment unit 23 is a heating unit HP and a cooling unit CP. The heating unit HP heats the substrate W. For the heating / cooling unit PHP arranged on the IF unit 7 side, the IF unit 7 (IF transport mechanism T _IF1 ) bears the transport of the substrate W. The edge exposure unit EEW exposes the periphery of the substrate W. Although not shown, the edge exposure unit EEW includes a holding unit that holds the substrate W, a motor that rotates the holding unit, a light irradiation unit that irradiates the substrate W with light, and the like.

Please refer to FIG. The IF unit 7 transports the substrate W to the substrate processing rows 5 and 6 and the exposure machine EXP. The IF unit 7 includes a plurality of IF transport mechanisms T _IF1 and T _IF2 that transport the substrate W. The IF transport mechanism _TIF1 delivers the substrate W between the substrate processing rows 5 and 6 and the IF transport mechanism _TIF2 , and transports the substrate W to the heating and cooling unit PHP described above. In addition to the IF transport mechanism _TIF1 , the IF transport mechanism _TIF2 further transports the substrate W to and from the exposure apparatus EXP.

Between the IF transport mechanisms T _IF1 and T _IF2 , a placement unit PASS-CP for placing and cooling the substrate W is disposed. A placement unit PASS _{4 on} which the substrate W is placed is disposed below the placement unit PASS-CP. The substrate W to be transported from the IF transport mechanism _TIF1 to the IF transport mechanism _TIF2 is placed on the placement unit PASS-CP. The mounting portion PASS _4, the substrate W transported from the IF's transport mechanism _{T IF2} to the IF's transport mechanism _{T IF1} is placed.

[Control system configuration]
FIG. 5 is a control block diagram of the substrate processing apparatus according to the embodiment.

  As shown in the figure, the substrate processing apparatus 1 includes a control unit 31, a storage unit 35, and a touch panel 37. The control unit 31 includes a controller 32 and a setting unit 33. The controller 32 comprehensively controls the ID unit 3, the substrate processing rows 5 and 6, and the IF unit 7 based on various types of information stored in the storage unit 35. The setting unit 33 sets and changes various information stored in the storage unit 35. The touch panel 37 receives a command for setting and changing various information and sends the command to the setting unit 33.

  The storage unit 35 stores a flow recipe FR and selection information SL. The flow recipe FR is information that defines the order of processing units to which the substrate W is transported. The selection information SL is information for selecting the substrate processing rows 5 and 6 to be operated.

  The flow recipe FR will be described with reference to FIG. FIG. 6 is a schematic diagram showing the configuration of the flow recipe FR. As shown in the figure, the flow recipe FR is associated with category and processing unit identification information (hereinafter referred to as “processing unit identification information” as appropriate) in the transport order. In the present embodiment, the flow recipe FR is set in advance so as to define the order of processing units when producing a substrate W (product) subjected to a predetermined process, and is stored in the storage unit 35. .

  The category is information indicating the type of processing unit. In FIG. 6, the processing units included in each of the substrate processing rows 5 and 6 are classified into seven categories of “cp”, “barc”, “php”, “resist”, “eew”, “dev”, “hp” An example of classification is shown.

The processing unit identification information is information that can uniquely identify each processing unit. In FIG. 6, “U _T1 ”, “U _T2 ”... “U _T29 ” are processing unit identification information associated with all the processing units included in the substrate processing row 5. For example, “U _T1 ” is information indicating a specific cooling unit CP provided in the substrate processing row 5, and “U _T2 ” indicates a specific antireflection film coating processing unit BARC provided in the substrate processing row 5. Information. On the other hand, “U _B1 ”, “U _B2 ”... “U _B29 ” is processing unit identification information assigned to each processing unit included in the substrate processing row 6. Accordingly, in FIG. 6, a part _PT is a part of the flow recipe FR corresponding to the substrate processing line 5, and a part P _B is a part of the flow recipe FR corresponding to the substrate processing line 6.

In the flow recipe FR shown in FIG. 6, in the substrate processing row 5, the first (first) substrate W is transferred to the cooling unit CP corresponding to “U _T1 ”. The subsequent second transport destination is the antireflection film coating unit BARC corresponding to either “U _T2 ” or “U _T3 ”. The subsequent third transport destination is the heating / cooling unit PHP corresponding to any one of “U _T4 ”, “U _T5 ”, “U _T6 ”, and “U _T7 ”. Thereafter, similarly, according to the transfer order, it is transferred to the processing unit associated with each transfer order. In the case where a plurality of processing units are associated with the transport order, they are transported to any one of the processing units. The same applies to the substrate processing row 6. The flow recipe FR corresponds to the conveyance order information in the present invention.

The selection information SL will be described with reference to FIG. In the selection information SL, the identification information of each substrate processing row (hereinafter referred to as “substrate processing row identification information”) is associated with setting information indicating whether or not the substrate processing row to be operated is designated. The substrate processing column identification information “L _T ” and “L _B ” mean the substrate processing columns 5 and 6, respectively. When the substrate processing row to be operated is specified (set to “select”), the setting information is “1”. When it is not specified in the substrate processing row to be operated (“Select” is canceled / “Not selected” is set), the setting information is “0”. The setting information is constituted by a flag, for example. The selection information SL is set in advance, but is set and changed as appropriate by the setting unit 33.

  Next, the touch panel 37 will be described with reference to FIG. The touch panel 37 is disposed on the side wall of the substrate processing apparatus 1 and is operated by the user. The touch panel 37 displays buttons (GUI. Buttons) 37a and 37b on the screen. A command for switching “selection” and cancellation of the substrate processing columns 5 and 6 can be input by the buttons 37a and 37b. The touch panel 37 corresponds to the input unit in the present invention.

The control target of the controller 32 will be described with reference to FIG. The target controlled by the controller 32 in the ID unit 3 is the ID transport mechanism T _ID . Control targets in the substrate processing column 5 are main transport mechanisms T ₁ and T ₂ and each processing unit included in the substrate processing column 5. The same applies to the control target of the substrate processing array 6. Control objects in the IF unit 7 are IF transport mechanisms T _IF1 and T _IF2 and a heating and cooling unit PHP.

  The control unit 31 and the storage unit 35 are a storage medium such as a central processing unit (CPU) that executes various processes, a RAM (Random-Access Memory) that is a work area for arithmetic processes, and a fixed disk that stores various types of information. Etc. are realized.

  Next, the operation of the substrate processing apparatus 1 according to the embodiment will be described.

[Basic operation of substrate processing apparatus 1]
First, the basic operation of the substrate processing apparatus 1 will be described. Here, a case where both the substrate processing rows 5 and 6 are operated is taken as an example. In the following description, the conveyance from the ID unit 3 to the IF unit 7 and the conveyance from the IF unit 7 to the ID unit 3 will be described separately.

<Transport from ID section 3 to IF section 7>
The ID transport mechanism T _ID unloads the substrate W from the cassette C and transports the unloaded substrate W to the substrate processing rows 5 and 6 alternately.

Each substrate processing row 5/6 operates in the same manner. First, the main transport mechanism T ₁ is to be conveyed to as specified substrate W received from the ID unit 3 to the conveyance order 1 to 7 of the flow recipe FR. Specifically, the substrate W is transferred in the order of the cooling unit CP, the antireflection film coating processing unit BARC, the heating / cooling unit PHP, the cooling unit CP, the resist film coating processing unit RESIST, the heating / cooling unit PHP, and the cooling unit CP. To do. Each processing unit performs a predetermined process on the substrate W. Thereby, the coating process for forming the antireflection film and the resist film is performed on the substrate W. Then, the main transport mechanism _{T 1,} passes the substrate W to the main transport mechanism _{T 2.} The main transport mechanism _{T 2} transports the wafer W received in the edge exposing unit EEW (transport order 8). The edge exposure unit EEW exposes the peripheral edge of the substrate W. The main transport mechanism T < _b > ₂ carries the substrate W that has been subjected to the edge exposure process to the IF unit 7.

The IF transport mechanism _TIF1 alternately receives the substrates W from the substrate processing rows 5 and 6, and passes them to the IF transport mechanism _TIF2 . The IF transport mechanism _TIF2 sends the received substrate W to the exposure apparatus EXP.

<Transfer from IF section 7 to ID section 3>
The IF transport mechanism _TIF2 receives the exposed substrate W from the exposure apparatus EXP and passes it to the IF transport mechanism _TIF1 . The IF transport mechanism _TIF1 transports the received substrate W to the heating / cooling unit PHP (transport order 9). The heating / cooling unit PHP performs a post-exposure bake on the substrate W. The IF transport mechanism _{TIF1 unloads} the substrate W that has been subjected to post-exposure heat treatment to the substrate processing rows 5 and 6.

Each substrate treatment line 5/6, the main transport mechanism _{T 2} receives a wafer W from the IF unit 7, the developing units DEV, the heating units HP, in the order of the cooling units CP, transports the substrate W (the transport order 10 to 13 ). Thereby, a development process for developing the substrate W is performed. The main transport mechanism T _2, and passes the wafer W development process has been performed to the main transport mechanism T _1. The main transport mechanism T ₁ transports the received substrate W to the ID unit 3.

The ID transport mechanism T _ID alternately receives the substrates W from the substrate processing rows 5 and 6 and carries them into the cassette C.

  In this way, each of the substrate processing rows 5 and 6 performs a series of processes consisting of 13 processes on the substrate W while reciprocating the substrate W. In addition, the conveyance to the exposure machine EXP is performed between the conveyance order 8 and the conveyance order 9 of the flow recipe FR.

[Operation of Setting Unit 33—Step of Accepting Command, Step of Setting or Changing Selection Information]
Next, an operation in which the setting unit 33 sets / changes the selection information SL will be described.

  When the user inputs a command for setting / changing the selection information SL to the touch panel 37, the touch panel 37 outputs the command to the setting unit 33. The setting unit 33 rewrites the selection information SL stored in the storage unit 35 based on this command.

  Note that the selection information SL is information independent of the flow recipe FR, and the controller 32 basically controls based on the flow recipe FR. Therefore, even when the substrate processing rows 5 and 6 are operating. The selection information SL can be set and changed without any trouble.

  Even if the selection information SL is set / changed, the controller 32 does not immediately change the control contents of the ID unit 3 and the substrate processing rows 5 and 6. As will be described below, the change of the control content of the controller 32 is limited only when the cassette C is updated.

[Operation of Controller 32]
Next, the operation of the controller 32 will be described.
Please refer to FIG. FIG. 7 is a flowchart showing a procedure for controlling the ID section and the substrate processing sequence.

<Step S1> Is it a new cassette?
The ID unit 3 loads the substrate W while updating the cassette C to a new cassette C as needed. More specifically, when the ID unit 3 puts the substrate W into at least one of the substrate processing rows 5 and 6, every time the substrate W in the cassette C is completely loaded, the empty cassette C is not loaded. In place of the new cassette C in which the processing substrate W is accommodated, the loading of the substrate W from the new cassette C is resumed. The controller 32 monitors the update of the cassette C and proceeds to step S2 every time it is updated to a new cassette C. Otherwise, the process returns to step S1.

<Step S2> Identification of Selected Substrate Processing Line The controller 32 refers to the selection information SL and determines whether the substrate processing line 5 is selected as the substrate processing line to be operated and whether the substrate processing line 6 is It is determined whether or not the substrate processing row to be operated is selected. Thereby, the selected substrate processing row is specified. Then, the process proceeds to step S3.

<Step S3> Control of ID Unit and Substrate Processing Row The controller 32 determines the substrate processing row selected as the loading destination of the substrate W in the new cassette C based on the identification result of step S2. Based on this determination, the ID unit 3 is controlled to transport the substrate W in the new cassette C to the determined substrate processing row. Further, the controller 32 determines to operate the selected substrate processing row and to stop the operation of the unselected substrate processing row based on the identification result of step S2. Based on this determination, the controller 32 individually operates or stops the substrate processing rows 5 and 6.

  As a result, when the selection information SL is changed, switching of the control contents for at least one of the substrate processing rows 5 and 6 is executed when the selection information SL is updated to a new cassette C. Further, when the other of the substrate processing columns 5 and 6 is operating when switching the control contents of one of the substrate processing columns 5 and 6, without interrupting the operation of the other substrate processing columns 5 and 6, The control content of one of the substrate processing rows 5 and 6 is switched.

  Hereinafter, the control contents of the substrate processing columns 5 and 6 according to the selection information SL will be described separately in four cases.

1. When both of the substrate processing columns 5 and 6 are selected In the selection information SL, the substrate processing columns 5 and 6 are respectively selected as the substrate processing columns to be operated. Specifically, the setting information corresponding to each of the substrate processing rows 5 and 6 is set to “1”. In this case, the controller 32 distributes and transports the substrates W in the cassette C to the substrate processing rows 5 and 6. Further, the controller 32 regards the parts PT and PB of the flow recipe FR as valid. Then, the substrate processing array 5 is operated according to the part PT, and the substrate processing array 6 is operated according to the part PB.

2. When only the substrate processing column 5 is selected In the selection information SL, the substrate processing column 5 is selected as the substrate processing column to be operated, and the substrate processing column 6 is not selected as the substrate processing column to be operated. Specifically, the setting information corresponding to each substrate processing column 5 is “1”, and the setting information corresponding to each substrate processing column 6 is “0”. In this case, the controller 32 puts the substrate W in the cassette C only into the substrate processing row 5. Further, the controller 32 regards the part _PT as valid and regards the part P _B as invalid (ignored). Then, the substrate processing row 5 is operated according to the portion _PT, and the operation of the substrate processing row 6 is stopped.

3. When only the substrate processing column 6 is selected In the selection information SL, the designation of “selection” is canceled for the substrate processing column 5 and the selection of the substrate processing column 6 is “selection”. In this case, the controller 32 puts the substrate W in the cassette C into only the substrate processing row 6. Further, the controller 32 ignores the portion P _T to stop the substrate treatment lines 5, thereby driving the substrate treatment lines 6 on the basis of the part P _B.

4). When both of the substrate processing columns 5 and 6 are not selected In the selection information SL, the substrate processing columns 5 and 6 are not selected. In this case, the controller 32 does not transfer the substrate W in the cassette C to any of the substrate processing rows 5 and 6. Further, the controller 32 ignores the portions P _T and P _B of the flow recipe FR and stops the substrate processing rows 5 and 6, respectively.

  As is clear from the above description, the control content for each of the substrate processing rows 5 and 6 can be individually changed depending on the selection information SL. Since the selection information SL and the flow recipe FR are separate and independent information, the contents of the flow recipe FR are exactly the same in any of the four cases described above. Note that step S3 corresponds to the “process for loading a substrate” and the “process for controlling the substrate processing unit” of the present invention.

Thus, according to the present embodiment, the controller 32 controls the substrate processing rows 5 and 6 based on the flow recipe FR and the selection information SL. Specifically, the controller 32, the flow of the recipe FR, part _{(P T,} P _B) which corresponds to the substrate treatment line which is selected by the selection information SL regarded as valid, otherwise part (P _T, P _B ) is considered invalid. Then, the substrate processing sequence (5, 6) is operated based only on the effective portion, and the unselected substrate processing sequence (5, 6) is stopped. For this reason, the substrate processing rows 5 and 6 can be individually operated and stopped without changing the flow recipe FR.

  Further, since the selection information SL is information related to the substrate processing columns 5 and 6, one setting information may be changed in order to switch operation / stop of the substrate processing columns 5 and 6, respectively. Therefore, the substrate processing rows 5/6 can be individually operated and stopped easily.

  In particular, in this embodiment, the selection information SL is information in which the substrate processing sequence identification information and the setting information are associated one-to-one. Therefore, by changing the setting information, an arbitrary substrate processing sequence 5/6 is selected. The selection information SL regarding can be collectively changed.

Incidentally, if it is attempted to switch the operation / stop of the substrate processing rows 5 and 6 by changing the flow recipe FR, it becomes extremely complicated. This is because the flow recipe FR is changed by inputting or deleting a large number of processing unit identification information corresponding to each processing unit belonging to the substrate processing row 5/6. For example, when the selection information SL related to the substrate processing column 5 is set / changed, 29 processing unit identification information items “U _T1 ” to “U _T29 ” are input / deleted.

  Further, when operating the substrate processing line 5/6, the controller 32 basically controls based on the flow recipe FR. Therefore, even when the selection information SL is changed when an arbitrary substrate processing sequence 5/6 is operating, it is not necessary to temporarily stop the substrate processing sequence 5/6 that is operating. That is, even if the arbitrary substrate processing row 5/6 is operating, the selection information SL can be changed without hindrance.

  Further, when the other of the substrate processing columns 5 and 6 is operating when switching the control contents of one of the substrate processing columns 5 and 6, the substrate processing column 5 and 6 are continuously operated while the other substrate processing columns 5 and 6 are operated. The control content of one of the processing rows 5 and 6 is switched. Therefore, it is possible to prevent the operating rate of the substrate processing apparatus 1 from being lowered when the control content is switched.

  Further, every time the cassette C is updated to a new cassette C, the controller 32 specifies the substrate processing row selected with reference to the selection information SL, so that the change of the selection information SL is preferably used as the control content. It can be reflected.

  In addition, since the timing of switching the control contents for the substrate processing row 5/6 is when the cassette C is updated to a separate cassette C, it is possible to suppress variation in processing quality among a plurality of substrates W in the same cassette C. it can.

  For example, when a substrate W in a certain cassette C1 is loaded into the substrate processing row 5 and the selection of the substrate processing row 5 is canceled while the substrate W is being processed in the substrate processing row 5, all of the cassette C1 The operation of the substrate processing row 5 is continued until the processing is completed for the substrate W. For this reason, it can suppress that process quality varies between each board | substrate W in cassette C1. After that, when the cassette C1 is updated to another new cassette C2, the operation of the substrate processing row 5 is stopped. For this reason, it is possible to quickly stop the substrate processing column 5 whose selection is canceled by the selection information SL.

  In addition, the controller 32 refers to the selection information SL and determines the substrate processing row 5/6 for loading the substrate W for each cassette C. Therefore, the substrate W is loaded from the cassette C to the substrate processing row 5/6. The transfer destination of the substrate W in the cassette C does not change midway. Therefore, it is possible to suppress variation in processing quality between the plurality of substrates W in the same cassette C. When the selection of the substrate processing row 5/6 is canceled by the selection information SL, the substrate W is not transferred from the cassette C updated after the release to the substrate processing row 5/6. Therefore, it is possible to smoothly stop the substrate processing row 5 whose selection is canceled by the selection information SL.

  Moreover, since the setting unit 33 is provided, the selection information SL can be set and changed appropriately.

  Further, since the input unit 37 is provided, the user can easily change the selection information SL. Further, the input unit 37 can switch between “selection” and cancellation of each of the substrate processing columns 5 and 6 by turning on and off one button 37a and 37b. Therefore, the user can change the selection information SL very easily.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In the above-described embodiment, the flow recipe FR in which the conveyance order, the processing unit identification information, and the category are associated with each other is illustrated, but the configuration of the flow recipe FR is not limited thereto. For example, it may be changed to a flow recipe that does not include a category, or may be changed to a flow recipe that includes other information.

(2) In the above-described embodiment, the selection information SL in which the setting information is associated with the substrate processing column identification information L _T and L _B is exemplified, but the present invention is not limited thereto. The information may be changed to selection information including other information.

  (3) In the above-described embodiment, the change of the control content by the controller 32 is limited only when the cassette C is updated, but is not limited thereto. For example, the control content may be changed at other timings.

  (4) In the above-described embodiment, the touch panel 37 is exemplified as the input unit, but the present invention is not limited to this. Instead of the touch panel 37, the input unit may be configured by a physical button switch or the like.

  (5) In the above-described embodiment, the substrate W is distributed and conveyed from the same cassette C to the substrate processing rows 5 and 6 when the substrate processing rows 5 and 6 are operating. However, the present invention is not limited to this. That is, the cassette C that supplies the substrate W to the substrate processing row 5 and the cassette C that supplies the substrate W to the substrate processing row 6 may be different. In this case, the controller 32 can separately control the substrate processing rows 5 and 6 independently.

  Please refer to FIG. FIG. 8 is a flowchart illustrating a procedure for controlling the ID unit and the substrate processing sequence according to the modified embodiment. As shown in FIG. 8, the controller 32 monitors the update of the cassette C for the substrate processing row 5 and determines whether or not the substrate processing row 5 is selected by the selection information SL every time the cassette C is updated. Specify (steps ST1 and ST2). Based on the identification result, the control contents of the ID unit 3 and the substrate processing line 5 are determined and controlled (step ST3). On the other hand, the controller 32 controls the substrate processing sequence 6 in the same procedure (steps SB1 to SB3). That is, every time the cassette C for the substrate processing row 6 is updated, the control relating to the ID unit 3 and the substrate processing row 6 is determined and executed.

(6) In the above-described embodiment, the substrate processing rows 5 and 6 include the two main transport mechanisms T ₁ and T ₂ , but the present invention is not limited to this. For example, it may be changed to a substrate processing unit provided with one main transfer mechanism, or may be changed to a substrate processing unit provided with three or more main transfer mechanisms.

  (7) In the above-described embodiments, the various processing units are basically processing units that process the substrates W one by one (so-called “single-wafer processing units”), but are not limited thereto. For example, the processing unit may be changed to a processing unit (so-called “batch processing unit”) that processes a plurality of substrates W at once.

  (8) In the above-described embodiments, the substrate processing rows 5 and 6 perform the same processing, but are not limited thereto. That is, the substrate processing rows 5 and 6 may be changed to perform different processes.

  (9) In the above-described embodiment, the substrate processing columns 5 and 6 perform a process of forming a resist film or the like on the substrate W and developing the substrate W. The processing content is not limited to this. The processing contents of the substrate processing rows 5 and 6 may be changed to various processing contents according to the substrate W to be processed.

  (9) In the above-described embodiment, the substrate processing apparatus 1 includes the two substrate processing rows 5 and 6, but is not limited thereto. That is, you may change so that three or more substrate processing parts may be provided.

  (10) You may change so that each structure of each Example mentioned above and each modification may be combined suitably.

DESCRIPTION OF SYMBOLS 1 ... Substrate processing apparatus 3 ... Indexer part (ID part)
5, 6 ... Substrate processing line (substrate processing section)
8, 9 ... processing unit 31 ... control unit 32 ... controller 33 ... setting unit 37 ... touch panel (input unit)
C ... Cassette (container)
FR ... Flow recipe (conveyance order information)
PT, PB ... Flow recipe part SL ... Selection information T ₁ , T ₂ ... Main transport mechanism W ... Substrate

Claims (16)

A substrate processing apparatus,
A plurality of substrate processing rows for performing a series of processing on the substrate ;
A control unit for controlling a plurality of substrate processing rows ;
With
The substrate processing sequence is:
Multiple processing units;
A main transport mechanism for transporting the substrate to the processing unit;
Have
Wherein the control unit includes a conveying order information defining the order of processing units in which the substrate is conveyed, based on the selection information for selecting the substrate treatment lines for driving, the substrate treatment lines selected by the selection information A substrate processing apparatus that operates according to transport order information and stops a substrate processing row that is not selected by selection information. The substrate processing apparatus according to claim 1,
The selection information is a substrate processing apparatus which is information in which identification information of each substrate processing sequence is associated with setting information indicating whether or not the substrate processing sequence to be operated is specified. The substrate processing apparatus according to claim 1, wherein:
If the other substrate processing sequence is in operation when switching the operation / stop of a part of the substrate processing sequence based on the selection information, the control unit does not interrupt the operation of the other substrate processing sequence. A substrate processing apparatus for switching operation / stop of a part of the substrate processing rows . In the substrate processing apparatus according to claim 1,
An indexer unit that transports a substrate from a container that accommodates a substrate to each substrate processing row ,
The control unit is a substrate processing apparatus that executes switching between operation and stop of a substrate processing sequence when the container is updated. The substrate processing apparatus according to claim 4,
The control unit refers to the selection information, and determines a substrate processing row for loading a substrate for each container. In the substrate processing apparatus in any one of Claim 1 to 5,
A substrate processing apparatus comprising an input unit for setting or changing selection information.   In the substrate processing apparatus according to any one of claims 1 to 6,
  The transport order information is a substrate processing apparatus that defines the order of processing units to which a substrate is transported when producing a substrate as a product subjected to a predetermined process. A control method for controlling a plurality of substrate processing rows for transferring a substrate to a plurality of processing units and performing a series of processing on the substrate ,
A step of controlling each substrate processing row based on transfer order information defining the order of processing units to which the substrate is transferred and selection information for selecting a substrate processing row to be operated;
Control to step a substrate treatment line which is selected by the selection information, then operation based on the portion of the conveying order information corresponding to the substrate treatment line that has been selected, and, corresponding to the substrate treatment lines is not selected A substrate processing sequence control method that disregards the part of the transport sequence information and stops the operation of the substrate processing sequence that is not selected by the selection information. The substrate processing sequence control method according to claim 8 ,
The substrate processing sequence control method, wherein the selection information is information in which identification information of each substrate processing sequence is associated with setting information indicating whether the substrate processing sequence to be operated is specified. The substrate processing sequence control method according to claim 8 or 9 ,
If the other substrate processing rows are in operation when switching the operation / stop of some substrate processing rows based on the selection information, the controlling step is performed without stopping the operation of other substrate processing rows. A substrate processing sequence control method for switching operation / stop of some substrate processing sequences . In the substrate processing sequence control method according to any one of claims 8 to 10 ,
Furthermore, it comprises a step of throwing a substrate into a substrate processing row from a container that accommodates the substrate,
The controlling step is a substrate processing sequence control method for executing switching of operation / stop of the substrate processing sequence when the container is updated. The substrate processing sequence control method according to claim 11 ,
The loading process is a substrate processing sequence control method for determining a substrate processing sequence for loading a substrate based on selection information every time the container is updated. The substrate processing sequence control method according to claim 11 or 12 ,
When the substrate processing row whose selection is canceled in the selection information is operating at the time of the release, the controlling step is performed for all the substrates in the container that accommodates the substrate being processed in the substrate processing row . process is continued operation of the substrate treatment lines to completion, the substrate treatment lines control method for subsequently stop the operation of the substrate treatment lines. In the substrate processing sequence control method according to any one of claims 11 to 13 ,
The step of loading is a substrate processing row control method in which, when the selection of the substrate processing row is canceled in the selection information, the substrate is not put into the substrate processing row from the new container after the release. The substrate processing sequence control method according to any one of claims 8 to 14 ,
Furthermore, the substrate processing row | line control method provided with the process of setting or changing selection information.   In the substrate processing sequence control method according to any one of claims 8 to 15,
  The transport order information is a substrate processing sequence control method that defines the order of processing units to which a substrate is transported when producing a substrate as a product subjected to a predetermined process.

Images