JP6090458B2 - Manufacturing method of laminated electronic component - Google Patents

Description

  The present invention relates to a method for manufacturing a laminated electronic component, and in particular, a conductor is embedded by laminating, pressing and cutting a plurality of ceramic sheets each having a conductor pattern formed on a main surface and filled with a conductive paste in a through hole. The present invention also relates to a method for manufacturing a laminated electronic component, in which a laminated electronic component having an electrode exposed on a side surface is produced.

  When manufacturing a ferrite multilayer substrate with a built-in inductor, first, a through hole is formed in a ceramic sheet coated and formed on a PET film, and a conductor pattern forming a coil conductor is printed on the main surface of the ceramic sheet. The through hole is filled with a conductive paste forming a via-hole conductor or a side electrode. The ceramic sheet is then fired through lamination and pressure bonding, whereby an inductor built-in type ferrite multilayer substrate is obtained.

JP-A-7-79081

  In recent years, such a multilayer ferrite substrate is required to cope with a large current in addition to downsizing and low profile. However, it is necessary to increase the thickness of the coil conductor in order to cope with a large current, and it is necessary to reduce the thickness of the ceramic sheet in order to reduce the height.

  Here, since the opening area of the through hole forming the side electrode is relatively large, the filling property of the conductive paste deteriorates as the ceramic sheet becomes thinner. The deterioration of the filling property causes thinning of the side electrode to be conducted from the top surface to the bottom surface of the ferrite multilayer substrate, and in the worst case, the ferrite multilayer substrate is electrically nonconductive.

  Therefore, a main object of the present invention is to provide a method for manufacturing a multilayer electronic component capable of avoiding poor formation of side electrodes.

  A method of manufacturing a multilayer electronic component according to the present invention (10: reference numerals corresponding to the examples; the same applies hereinafter) includes a plurality of ceramic sheets (BS1 to BS1) each having a main surface on which a common boundary line (BL) is defined. BS4) preparation step, conductor pattern formation step of forming a plurality of conductor patterns (CP1 to CP4) in a part of the main surface of each of the plurality of ceramic sheets to avoid the boundary line, a plurality of ceramic sheets A plurality of ceramic sheets at a plurality of positions including a coating step of applying ceramic paste (SPS) to other partial regions across the boundary line of each of the main surfaces, and a position of the ceramic paste applied by the coating step. Through hole forming process for forming through holes (HL11 to HL41, HL2a to HL4a, HL2b to HL4b), a filling process for filling the through holes formed in the through hole forming process with a conductive paste (CPS), and a filling process Multiple ceramic sheets after By cutting the door in laminated and border comprising a manufacturing step of manufacturing a plurality of multilayer electronic components (10).

  Preferably, the through hole formed by the through hole forming step is formed at a position where the first through hole (HL11 to HL41) formed at a position across the boundary line and a position overlapping with each of the plurality of conductor patterns. Includes through holes (HL2b to HL4b).

  In one aspect, the ceramic paste is partially applied to the boundary line side of the conductor pattern.

  In another aspect, the second through hole is smaller than the first through hole.

  In another aspect, the plurality of conductor patterns form an inductor together with the conductive paste filled in the second through hole, and at least a part of the plurality of ceramic sheets has magnetism.

  Preferably, the manufacturing process includes a lamination process of laminating a plurality of ceramic sheets, a firing process of firing the multilayer substrate (BL1) obtained by the lamination process, and a cutting in which the fired substrate obtained by the firing process is cut at a boundary line Process.

  Preferably, the production process includes a lamination process of laminating a plurality of ceramic sheets, a cutting process of cutting the multilayer substrate (BL1) obtained by the lamination process at a boundary line, and a plurality of laminates obtained by the cutting process Including a firing step.

  Preferably, there is further provided a mounting step of mounting another electronic component (14, 16) on each main surface of the plurality of laminated electronic components manufactured by the manufacturing step.

  Preferably, each of the plurality of ceramic sheets is supported by a plurality of carrier sheets (PF), and the manufacturing step includes a peeling step of peeling the ceramic sheets from the plurality of carrier sheets.

  The enlargement of the through-hole formed at the position across the boundary line causes deterioration of the filling property of the conductive paste in combination with the thinning of the ceramic sheet. In addition, an increase in the thickness of the conductor pattern formed on the main surface of the ceramic sheet causes a decrease in the adhesion of the ceramic sheet in the vicinity of the boundary line in combination with the thinning of the ceramic sheet.

  However, in this invention, the thickness of the position where the through hole is formed is increased by the ceramic paste. This increases the thickness of the conductive paste filled in the through holes, and further increases the adhesion of the ceramic sheet in the vicinity of the boundary line. As a result, the formation defect of the side electrode can be avoided.

  The above object, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

It is an exploded view which shows the state which decomposed | disassembled the multilayer inductor element of this Example. (A) is a plan view and AA sectional view showing an example of a ceramic sheet SH0 forming a multilayer inductor element, and (B) is a plan view showing an example of a ceramic sheet SH1 forming a multilayer inductor element. It is BB sectional drawing, (C) is a top view and CC sectional view which show an example of ceramic sheet SH2 which forms a multilayer inductor element, (D) is a ceramic sheet which forms multilayer inductor element It is the top view and DD sectional view which show an example of SH3. (A) is a plan view showing an example of a ceramic sheet SH4 forming a multilayer inductor element and EE cross-sectional view, and (B) is a plan view showing an example of a ceramic sheet SH5 forming a multilayer inductor element; It is FF sectional drawing, (C) is a top view and GG sectional drawing which show an example of ceramic sheet SH6 which forms a multilayer inductor element. It is a perspective view which shows the external appearance of the state which mounted another electronic component in the multilayer inductor element of this Example. It is HH sectional drawing of the multilayer inductor element shown in FIG. 4, and another electronic component. (A) is process drawing which shows a part of manufacturing process of ceramic sheet SH0, (B) is a process drawing which shows another part of manufacturing process of ceramic sheet SH0, (C) is ceramic sheet SH0. It is process drawing which shows the other part of a manufacturing process, (D) is process drawing which shows another part of manufacturing process of ceramic sheet SH0. (A) is process drawing which shows the other part of the manufacturing process of ceramic sheet SH0, (B) is process drawing which shows the other part of manufacturing process of ceramic sheet SH0. (A) is process drawing which shows a part of manufacturing process of ceramic sheet SH1, (B) is a process drawing which shows another part of manufacturing process of ceramic sheet SH1, (C) is a process drawing of ceramic sheet SH1. It is process drawing which shows the other one part of a manufacturing process, (D) is process drawing which shows another part of manufacturing process of ceramic sheet SH1. (A) is process drawing which shows the other part of the manufacturing process of ceramic sheet SH1, (B) is process drawing which shows the other part of manufacturing process of ceramic sheet SH1, (C) is a ceramic sheet. It is process drawing which shows a part of others of the manufacturing process of SH1. (A) is process drawing which shows a part of manufacturing process of ceramic sheet SH2, (B) is a process drawing which shows another part of manufacturing process of ceramic sheet SH2, (C) is a process drawing of ceramic sheet SH2. It is process drawing which shows the other one part of a manufacturing process, (D) is process drawing which shows another part of manufacturing process of ceramic sheet SH2. (A) is process drawing which shows the other part of the manufacturing process of ceramic sheet SH2, (B) is process drawing which shows another part of the manufacturing process of ceramic sheet SH2, (C) is a ceramic sheet. It is process drawing which shows further another part of the manufacturing process of SH2, (D) is a process drawing which shows the other part of the manufacturing process of ceramic sheet SH2. (A) is process drawing which shows a part of manufacturing process of ceramic sheet SH3, (B) is a process drawing which shows another part of manufacturing process of ceramic sheet SH3, (C) is a process drawing of ceramic sheet SH3. It is process drawing which shows the other part of a manufacturing process, (D) is a process figure which shows further another part of the manufacturing process of ceramic sheet SH3. (A) is process drawing which shows the other part of the manufacturing process of ceramic sheet SH3, (B) is process drawing which shows another part of the manufacturing process of ceramic sheet SH3, (C) is a ceramic sheet. It is process drawing which shows the other part of SH3 manufacturing process, (D) is a process figure which shows another part of the manufacturing process of ceramic sheet SH3. (A) is process drawing which shows a part of manufacturing process of ceramic sheet SH4, (B) is process drawing which shows another part of manufacturing process of ceramic sheet SH4, (C) is ceramic sheet SH4. It is process drawing which shows the other part of a manufacturing process, (D) is process drawing which shows the other part of manufacturing process of ceramic sheet SH4. (A) is process drawing which shows the other part of the manufacturing process of ceramic sheet SH4, (B) is process drawing which shows another part of the manufacturing process of ceramic sheet SH4, (C) is a ceramic sheet. It is process drawing which shows further another part of the manufacturing process of SH4, (D) is a process figure which shows the other part of the manufacturing process of ceramic sheet SH4. (A) is process drawing which shows a part of manufacturing process of ceramic sheet SH5, (B) is a process drawing which shows another part of manufacturing process of ceramic sheet SH5, (C) is a process drawing of ceramic sheet SH5. It is process drawing which shows the other one part of a manufacturing process, (D) is process drawing which shows another part of manufacturing process of ceramic sheet SH5. (A) is process drawing which shows the other part of the manufacturing process of ceramic sheet SH5, (B) is process drawing which shows another part of the manufacturing process of ceramic sheet SH5, (C) is a ceramic sheet | seat. It is process drawing which shows a part of others of the manufacturing process of SH5. (A) is process drawing which shows a part of manufacturing process of ceramic sheet SH6, (B) is process drawing which shows another part of manufacturing process of ceramic sheet SH6, (C) is ceramic sheet SH6. It is process drawing which shows the other one part of a manufacturing process, (D) is process drawing which shows a further another part of manufacturing process of ceramic sheet SH6. (A) is process drawing which shows the other part of the manufacturing process of ceramic sheet SH6, (B) is process drawing which shows another part of the manufacturing process of ceramic sheet SH6, (C) is a ceramic sheet | seat. It is process drawing which shows further another part of the manufacturing process of SH6, (D) is a process figure which shows the other part of the manufacturing process of ceramic sheet SH6. (A) is process drawing which shows an example of the process of preparing a magnetic ceramic sheet, (B) is process drawing which shows an example of the process of printing a magnetic ceramic paste on a magnetic ceramic sheet, (C) is magnetic ceramic It is process drawing which shows an example of the process of forming a through-hole in the position of a paste, (D) is process drawing which shows an example of the process of filling a through-hole with a conductive paste. (A) is process drawing which shows an example of the process of preparing a nonmagnetic ceramic sheet, (B) is process drawing which shows an example of the process of printing a nonmagnetic ceramic paste on a nonmagnetic ceramic sheet, (C) These are process drawings which show an example of the process of forming a through-hole in the position of a nonmagnetic ceramic paste, (D) is process drawing which shows an example of the process of filling a through-hole with a conductive paste. (A) is process drawing which shows a part of manufacturing process of a multilayer inductor element, (B) is process drawing which shows another part of manufacturing process of a multilayer inductor element, (C) is a multilayer type It is process drawing which shows the other one part of the manufacturing process of an inductor element, (D) is process drawing which shows an example of the process of mounting another electronic component on the top | upper surface of a multilayer inductor element. (A) is process drawing which shows a part of manufacturing process of ceramic sheet SH0 which forms the multilayer inductor element of another Example, (B) is the ceramic sheet which forms the multilayer inductor element of another Example. It is process drawing which shows the other part of the manufacturing process of SH0, (C) is a process figure which shows the other part of the manufacturing process of ceramic sheet SH0 which forms the multilayer inductor element of another Example, FIG. 6D is a process diagram illustrating still another part of the manufacturing process of the ceramic sheet SH0 that forms the multilayer inductor element of another embodiment. It is process drawing which shows a part of other manufacturing process of ceramic sheet SH0 which forms the multilayer inductor element of another Example. It is a top view which shows the multilayer inductor element of another Example, and another electronic component mounted in this. (A) is process drawing which shows a part of manufacturing process of the multilayer inductor element of another Example, (B) is a process which shows another part of the manufacturing process of the multilayer inductor element of another Example. FIG. 4C is a process diagram illustrating another part of the manufacturing process of the multilayer inductor element of another embodiment, and FIG. 4D is a diagram separately from the top surface of the multilayer inductor element of another embodiment. It is process drawing which shows an example of the process of mounting this electronic component.

  Referring to FIG. 1, a multilayer inductor element 10 of this embodiment is used as an inductor element for a micro DC-DC converter, and ceramic sheets SH <b> 0 whose main surfaces are laminated with a common size and shape. ~ SH6 included. The ceramic sheets SH0 to SH6 are laminated in this order. Moreover, all the main surfaces of the ceramic sheets SH0 to SH6 have a shape in which four sides forming a square are cut out into a rectangle. Furthermore, the ceramic sheets SH0, SH3, and SH6 are non-magnetic, while the remaining ceramic sheets SH1, SH2, SH4, and SH5 are magnetic.

  The laminated body 12 has a substantially rectangular parallelepiped shape, the magnetic layer 12a is formed by the ceramic sheets SH1 to SH2, the magnetic layer 12b is formed by the ceramic sheets SH4 to SH5, and the nonmagnetic layer 12c is formed by the ceramic sheet SH0. A nonmagnetic layer 12d is formed by the ceramic sheet SH3, and a nonmagnetic layer 12e is formed by the ceramic sheet SH6.

  That is, the multilayer body 12 constituting the multilayer inductor element 10 has a multilayer structure in which the magnetic layer 12a is sandwiched between the nonmagnetic layers 12c and 12d and the magnetic layer 12b is sandwiched between the nonmagnetic layers 12d and 12e. . Each side of the rectangle circumscribing the outline of the main surface (= top surface or bottom surface) of the stacked body 12 extends along the X axis or the Y axis, and the thickness of the stacked body 12 increases along the Z axis.

  2A, the ceramic sheet SH0 has a shape in which rectangular cutouts CT01 to CT04 are provided on four sides of a square sheet. An electrode EL01 is formed on the side where the notch CT01 is provided so as to extend inwardly of the notch CT01. An electrode EL02 is formed on the side where the notch CT02 is provided so as to extend inwardly of the notch CT02.

  An electrode EL03 is formed on the side where the cutout CT03 is provided so as to extend inward of the cutout CT03. An electrode EL04 is formed on the side where the cutout CT04 is provided so as to extend inward of the cutout CT04.

  Further, the thickness of the ceramic sheet SH0 partially increases in the vicinity of each of the cutouts CT01 to CT04 (strictly, the region outside the one-dot chain line). In addition, the AA cross section of ceramic sheet SH0 is shown in the lower stage of FIG.

  2B, the ceramic sheet SH1 has a shape in which rectangular cutouts CT11 to CT14 are provided on four sides of a square sheet. On the side where the cutout CT11 is provided, the electrode EL11 is formed so as to extend inward from the cutout CT11. An electrode EL12 is formed on the side where the cutout CT12 is provided so as to extend inwardly of the cutout CT12.

  An electrode EL13 is formed on the side where the cutout CT13 is provided so as to extend inwardly of the cutout CT13. An electrode EL14 is formed on the side where the cutout CT14 is provided so as to extend inwardly of the cutout CT14.

  A loop-shaped conductor pattern CP1 is formed on the upper surface of the ceramic sheet SH1. The loop forming the conductor pattern CP1 starts at the center position of the upper surface of the ceramic sheet SH1 and ends at the position on the negative side of the center of the upper surface in each of the X-axis direction and the Y-axis direction. Extend to.

  The conductor pattern CP1 first extends from the start end to the negative side in the X-axis direction, and bends to the positive side in the Y-axis direction before reaching the electrode EL14. The bent conductor pattern CP1 is further bent to the positive side in the X-axis direction at a position inside the notch CT11 and extends to the positive side in the X-axis direction without overlapping the electrode EL11.

  The conductor pattern CP1 extending to the positive side in the X-axis direction is bent again to the negative side in the Y-axis direction at a position inside the notch CT12 and extends to the negative side in the Y-axis direction without overlapping the electrode EL12. The conductor pattern CP1 extending to the negative side in the Y-axis direction is further bent to the negative side in the X-axis direction at a position inside the notch CT13. The bent conductor pattern CP1 extends to the negative side in the Y-axis direction without overlapping the electrode EL13 and reaches the end.

  Further, the thickness of the ceramic sheet SH1 partially increases in the vicinity of each of the notches CT11 to CT14 (strictly, the region outside the one-dot chain line). In addition, the BB cross section of ceramic sheet SH1 is shown in the lower stage of FIG.

  2C, the ceramic sheet SH2 has a shape in which rectangular cutouts CT21 to CT24 are provided on four sides of a square sheet. On the side where the cutout CT21 is provided, an electrode EL21 is formed so as to extend inward of the cutout CT21. An electrode EL22 is formed on the side where the cutout CT22 is provided so as to extend inward of the cutout CT22.

  An electrode EL23 is formed on the side where the cutout CT23 is provided so as to extend inward of the cutout CT23. An electrode EL24 is formed on the side where the cutout CT24 is provided so as to extend inwardly of the cutout CT24.

  Via hole conductors VH2a to VH2b and a loop-shaped conductor pattern CP2 reaching the lower surface are formed on the upper surface of the ceramic sheet SH2. The via-hole conductor VH2a is provided at a position that overlaps the start end of the conductor pattern CP1 when the ceramic sheet SH2 is laminated on the ceramic sheet SH1. The via-hole conductor VH2b is provided at a position that overlaps the end of the conductor pattern CP1 when the ceramic sheet SH2 is laminated on the ceramic sheet SH1.

  The loop forming the conductor pattern CP2 starts from the position where the via-hole conductor VH2b is formed and ends at a position slightly shifted to the positive side in the X-axis direction from this position, and extends the upper surface of the ceramic sheet SH2 in the clockwise direction. Exists.

  The conductor pattern CP2 first extends from the start end to the positive side in the Y-axis direction, and bends to the positive side in the X-axis direction at a position inside the notch CT21. The bent conductor pattern CP2 is further bent to the negative side in the Y-axis direction at a position inside the notch CT22 and extends to the negative side in the Y-axis direction without overlapping the electrode EL22. The conductor pattern CP2 extending to the negative side in the Y-axis direction is bent again to the negative side in the X-axis direction at a position inside the notch CT23. The bent conductor pattern CP2 extends to the negative side in the X-axis direction without overlapping the electrode EL23 and reaches the end.

  Further, the thickness of the ceramic sheet SH2 partially increases in the vicinity of each of the notches CT21 to CT24 (strictly, the region outside the one-dot chain line). In addition, CC section of ceramic sheet SH2 is shown in the lower stage of FIG.

  2D, the ceramic sheet SH3 has a shape in which rectangular cutouts CT31 to CT34 are provided on four sides of a square sheet. An electrode EL31 is formed on the side where the cutout CT31 is provided so as to extend inward of the cutout CT31. An electrode EL32 is formed on the side where the cutout CT32 is provided so as to extend inwardly of the cutout CT32.

  An electrode EL33 is formed on the side where the cutout CT33 is provided so as to extend inward of the cutout CT33. An electrode EL34 is formed on the side where the cutout CT34 is provided so as to extend inwardly of the cutout CT34.

  On the upper surface of the ceramic sheet SH3, via-hole conductors VH3a to VH3b reaching the lower surface and a loop-shaped conductor pattern CP3 are formed. The via-hole conductor VH3a is provided at a position that overlaps with the via-hole conductor VH2a when the ceramic sheet SH3 is laminated on the ceramic sheet SH2. The via-hole conductor VH3b is provided at a position that overlaps the end of the conductor pattern CP2 when the ceramic sheet SH3 is laminated on the ceramic sheet SH2.

  The loop forming the conductor pattern CP3 starts from the position where the via-hole conductor VH3b is formed and ends at a position slightly shifted to the positive side in the X-axis direction from this position, and extends the upper surface of the ceramic sheet SH3 in the clockwise direction. Exists.

  The conductor pattern CP3 first extends from the start end to the negative side in the X-axis direction, and bends to the positive side in the Y-axis direction at a position inside the notch CT34. The bent conductor pattern CP3 extends to the positive side in the Y-axis direction without overlapping the electrode EL34, and is further bent to the positive side in the X-axis direction at a position inside the notch CT31.

  The bent conductor pattern CP3 extends to the positive side in the X-axis direction without overlapping the electrode EL31, and is bent again to the negative side in the Y-axis direction at a position inside the notch CT32. The bent conductor pattern CP3 extends to the negative side in the Y-axis direction without overlapping the electrode EL32, and is further bent to the negative side in the X-axis direction at a position inside the notch CT33. The bent conductor pattern CP3 then reaches the end.

  Further, the thickness of the ceramic sheet SH3 partially increases in the vicinity of each of the cutouts CT31 to CT34 (strictly, the region outside the one-dot chain line). A DD cross section of the ceramic sheet SH3 is shown in the lower part of FIG.

  3A, the ceramic sheet SH4 has a shape in which rectangular cutouts CT41 to CT44 are provided on four sides of a square sheet. An electrode EL41 is formed on the side where the cutout CT41 is provided so as to extend inward of the cutout CT41. An electrode EL42 is formed on the side where the cutout CT42 is provided so as to extend inside the cutout CT42.

  An electrode EL43 is formed on the side where the cutout CT43 is provided so as to extend inward of the cutout CT43. An electrode EL44 is formed on the side where the cutout CT44 is provided so as to extend inward of the cutout CT44.

  Via hole conductors VH4a to VH4b and a looped conductor pattern CP4 reaching the lower surface are formed on the upper surface of the ceramic sheet SH4. The via-hole conductor VH4a is provided at a position overlapping the via-hole conductor VH3a when the ceramic sheet SH4 is laminated on the ceramic sheet SH3. The via-hole conductor VH4b is provided at a position that overlaps the end of the conductor pattern CP3 when the ceramic sheet SH4 is laminated on the ceramic sheet SH3.

  The loop forming the conductor pattern CP4 starts from the position where the via-hole conductor VH4b is formed and ends at a position slightly shifted to the positive side in the X-axis direction from this position, and extends the upper surface of the ceramic sheet SH4 in the clockwise direction. Exists.

  The conductor pattern CP4 first extends from the start end to the negative side in the X-axis direction, and bends to the positive side in the Y-axis direction at a position inside the notch CT44. The bent conductor pattern CP4 extends to the positive side in the Y-axis direction without overlapping the electrode EL44, and is further bent to the positive side in the X-axis direction at a position inside the notch CT41. The bent conductor pattern CP4 extends to the positive side in the X-axis direction without overlapping the electrode EL41, and bends again to the negative side in the Y-axis direction at a position inside the notch CT42. The bent conductor pattern CP3 extends to the negative side in the Y-axis direction without overlapping the electrode EL42 and reaches the end.

  Further, the thickness of the ceramic sheet SH4 partially increases in the vicinity of each of the cutouts CT41 to CT44 (strictly, the region outside the one-dot chain line). In addition, the EE cross section of ceramic sheet SH4 is shown in the lower stage of FIG.

  3B, the ceramic sheet SH5 has a shape in which rectangular cutouts CT51 to CT54 are provided on four sides of a square sheet. An electrode EL51 is formed on the side where the cutout CT51 is provided so as to extend inward of the cutout CT51. An electrode EL52 is formed on the side where the cutout CT52 is provided so as to extend inward of the cutout CT52.

  An electrode EL53 is formed on the side where the cutout CT53 is provided so as to extend inward of the cutout CT53. An electrode EL54 is formed on the side where the cutout CT54 is provided so as to extend inward of the cutout CT54.

  Via hole conductors VH5a to VH5b reaching the lower surface are formed on the upper surface of the ceramic sheet SH5. The via-hole conductor VH5a is provided at a position that overlaps the via-hole conductor VH4a when the ceramic sheet SH5 is laminated on the ceramic sheet SH4. In addition, the via-hole conductor VH5b is provided at a position that overlaps the end of the conductor pattern CP4 when the ceramic sheet SH5 is laminated on the ceramic sheet SH4.

  Further, the thickness of the ceramic sheet SH5 partially increases in the vicinity of each of the cutouts CT51 to CT54 (strictly, the region outside the one-dot chain line). In addition, the FF cross section of ceramic sheet SH5 is shown in the lower stage of FIG.

  3C, the ceramic sheet SH6 has a shape in which rectangular cutouts CT61 to CT64 are provided on four sides of a square sheet. An electrode EL61 is formed on the side where the cutout CT61 is provided so as to extend inward of the cutout CT61. An electrode EL62 is formed on the side where the cutout CT62 is provided so as to extend inward of the cutout CT62.

  An electrode EL63 is formed on the side where the cutout CT63 is provided so as to extend inward of the cutout CT63. An electrode EL64 is formed on the side where the notch CT64 is provided so as to extend inwardly of the notch CT64.

  Via hole conductors VH6a to VH6b reaching the lower surface are formed on the upper surface of the ceramic sheet SH6. The via-hole conductor VH6a is provided at a position overlapping the via-hole conductor VH5a when the ceramic sheet SH6 is laminated on the ceramic sheet SH5. The via-hole conductor VH6b is provided at a position that overlaps the via-hole conductor VH5b when the ceramic sheet SH6 is laminated on the ceramic sheet SH5.

  A conductor pattern CP6 is formed on the upper surface of the ceramic sheet SH6. The conductor pattern CP6 is formed by a plurality of dispersed electrodes EP1 to EP8. The electrode EP1 is provided at a position covering the via-hole conductor VH6a, and the electrode EP2 is provided at a position covering the via-hole conductor VH6b. The electrodes EP3 to EP6 are connected to the electrodes EL61 to EL64, respectively, and the electrodes EP7 and EP8 are provided independently.

  Further, the thickness of the ceramic sheet SH6 partially increases in the vicinity of each of the cutouts CT61 to CT64 (strictly, the region outside the one-dot chain line). A GG section of the ceramic sheet SH6 is shown in the lower part of FIG.

  Since the ceramic sheets SH1 to SH6 are configured as described above, the conductor patterns CP1 to CP4 and the via-hole conductors VH2a to VH6a and VH2b to VH6b are connected in a coil shape, thereby winding the Z axis as a winding axis. A body is formed inside the laminate 12. Since the magnetic body exists inside and outside the wound body, the wound body functions as an inductor.

  The multilayer inductor element 10 thus manufactured is configured as shown in FIG. Here, the side electrode SEL1 is formed by the electrodes EL01 to EL61, and the side electrode SEL2 is formed by the electrodes EL02 to EL62. The side electrode SEL3 is formed by the electrodes EL03 to EL63, and the side electrode SEL2 is formed by the electrodes EL04 to EL64. An IC 14 and passive elements (for example, capacitors) 16 and 18 are mounted on the top surface of the multilayer inductor element 10. Moreover, the HH cross section of the mounting state shown in FIG. 4 has the structure shown in FIG.

  The ceramic sheets SH0, SH3, and SH6 are made of non-magnetic (relative magnetic permeability: 1) ferrite and have a thermal expansion coefficient in the range of “8.5” to “9.0”. Further, the ceramic sheets SH1, SH2, SH4 and SH5 are made of magnetic (relative magnetic permeability: 100 to 120) ferrite, and their thermal expansion coefficients are in the range of “9.0” to “10.0”. Further, the side electrodes SEL1 to SEL4, the conductor patterns CP1 to CP4, and the via-hole conductors VH2a to VH6a and VH2b to VH6b are made of silver and have a thermal expansion coefficient of “20”.

  The aggregate of the ceramic sheets SH0 is produced as shown in FIGS. 6 (A) to 6 (D) and FIGS. 7 (A) to 7 (B). First, a ceramic sheet made of a nonmagnetic ferrite material is prepared as a mother sheet BS0 (see FIG. 6A). Here, a plurality of broken lines (boundary lines) BL, BL,... Extending in the X-axis direction and the Y-axis direction indicate cutout positions. Each of the plurality of rectangles defined by the broken line BL is defined as a “divided unit”.

  Next, a nonmagnetic ceramic paste SPS is applied by screen printing to a partial region (region surrounded by a one-dot chain line) straddling the broken line BL (see FIG. 6B). Specifically, the ceramic paste SPS is applied in a circle so as to straddle each side of the rectangle forming the division unit.

  Subsequently, a plurality of through holes HL01, HL01... Each having a rectangular shape are formed in a region where the ceramic paste SPS is applied (see FIG. 6C). A mechanical puncher device is used to form the through hole HL01, and the through hole HL01 is formed so as to straddle the broken line BL. The short side of the rectangle forming the through hole HL01 extends along the broken line BL across the through hole HL01, and the long side of the rectangle forming the through hole HL01 extends in a direction orthogonal to the broken line BL across the through hole HL01.

  The formed through holes HL01, HL01,... Are then filled with a conductive paste CPS (see FIG. 6D). The filled conductive paste CPS forms electrodes EL01 to EL04.

  When the filled conductive paste CPS is dried, a plurality of through holes HL02, HL02,... Each having a rectangular shape are formed in a region where the ceramic paste SPS is applied (see FIG. 7A). The through hole HL02 is also formed by a mechanical puncher device so as to straddle the broken line BL. Further, the size of the through hole HL02 matches the size of the through hole HL01. However, the short side of the rectangle forming the through hole HL02 extends in a direction perpendicular to the broken line BL over the through hole HL02, and the long side of the rectangle forming the through hole HL02 extends along the broken line BL over the through hole HL02. Therefore, a part of the conductive paste CPS remains in the mother sheet BS0 even after the through hole HL02 is formed.

  When the through hole HL02 is formed, grooves GR0, GR0,... Extending along broken lines BL, BL,... Are formed on the upper surface and the lower surface of the mother sheet BS0 (see FIG. 7B). The groove width formed on the lower surface is wider than the groove width formed on the upper surface.

  The aggregate of the ceramic sheets SH1 is produced in the manner shown in FIGS. 8A to 8D and FIGS. 9A to 9C. First, a ceramic sheet made of a magnetic ferrite material is prepared as a mother sheet BS1 (see FIG. 8A). Here, a plurality of broken lines (boundary lines) BL, BL,... Extending in the X-axis direction and the Y-axis direction indicate cutout positions.

  Next, a conductor pattern CP1 extending in a loop shape is formed on the upper surface of each divided unit by screen printing (see FIG. 8B). When the printing of the conductor pattern CP1 is completed, the magnetic ceramic paste SPS is applied by screen printing to a part of the region (region surrounded by the alternate long and short dash line) across the broken line BL (see FIG. 8C). Specifically, the ceramic paste SPS is applied in a circle so as to straddle each side of the rectangle forming the division unit.

  Subsequently, a plurality of through holes HL11, HL11... Each having a rectangular shape are formed in a region where the ceramic paste SPS is applied (see FIG. 8D). A mechanical puncher device is used to form the through hole HL11, and the through hole HL11 is formed so as to straddle the broken line BL. The short side of the rectangle forming the through hole HL11 extends along the broken line BL across the through hole HL11, and the long side of the rectangle forming the through hole HL11 extends in a direction orthogonal to the broken line BL across the through hole HL11.

  The formed through holes HL11, HL11,... Are then filled with a conductive paste CPS (see FIG. 9A). The filled conductive paste CPS forms electrodes EL11 to EL14.

  When the filled conductive paste CPS is dried, a plurality of through holes HL12, HL12,... Each having a rectangular shape are formed in the region where the ceramic paste SPS is applied (see FIG. 9B). The through hole HL12 is also formed by a mechanical puncher device so as to straddle the broken line BL. The size of the through hole HL12 matches the size of the through hole HL11. However, the short side of the rectangle forming the through hole HL12 extends in a direction orthogonal to the broken line BL over the through hole HL12, and the long side of the rectangle forming the through hole HL12 extends along the broken line BL over the through hole HL12. Therefore, a part of the conductive paste CPS remains in the mother sheet BS1 even after the through hole HL12 is formed.

  When the through hole HL12 is formed, grooves GR1, GR1,... Extending along broken lines BL, BL,... Are formed on the upper surface and the lower surface of the mother sheet BS1 (see FIG. 9C). The groove width formed on the lower surface is wider than the groove width formed on the upper surface.

  The aggregate | assembly of ceramic sheet SH2 is produced in the way shown to FIG. 10 (A)-FIG. 10 (D) and FIG. 11 (A)-FIG. 11 (D). First, a ceramic sheet made of a magnetic ferrite material is prepared as a mother sheet BS2 (see FIG. 10A). Here, a plurality of broken lines (boundary lines) BL, BL,... Extending in the X-axis direction and the Y-axis direction indicate cutout positions.

  Next, a conductor pattern CP2 extending in a loop shape is formed on the upper surface of each divided unit by screen printing (see FIG. 10B). When the printing of the conductor pattern CP2 is completed, the magnetic ceramic paste SPS is applied by screen printing to a partial region (region surrounded by a one-dot chain line) straddling the broken line BL (see FIG. 10C). Specifically, the ceramic paste SPS is applied in a circle so as to straddle each side of the rectangle forming the division unit.

  Subsequently, a plurality of through holes HL21, HL21... Each having a rectangular shape are formed in a region where the ceramic paste SPS is applied (see FIG. 10D). A mechanical puncher device is used to form the through hole HL21, and the through hole HL21 is formed so as to straddle the broken line BL. The short side of the rectangle forming the through hole HL21 extends along the broken line BL across the through hole HL21, and the long side of the rectangle forming the through hole HL21 extends in a direction orthogonal to the broken line BL across the through hole HL21.

  Further, a through hole HL2a is formed at the center of each divided unit, and a through hole HL2b is formed at the position of the starting end of the conductor pattern CP2 (see FIG. 11A). A laser device is used to form the through holes HL2a and HL2b.

  .., HL2a, HL2a,..., HL2b, HL2b,... Are then filled with a conductive paste CPS (see FIG. 11B). The conductive paste CPS filled in the through holes HL21, HL21,... Forms the electrodes EL21 to EL24, the conductive paste CPS filled in the through holes HL2a forms the via-hole conductor VH2a, and the conductive paste CPS filled in the through holes HL2b. A via hole conductor VH2b is formed.

  When the filled conductive paste CPS is dried, a plurality of through holes HL22, HL22,... Each having a rectangular shape are formed in the region where the ceramic paste SPS is applied (see FIG. 11C). The through hole HL22 is also formed by a mechanical puncher device so as to straddle the broken line BL. Further, the size of the through hole HL22 matches the size of the through hole HL21. However, the short side of the rectangle forming the through hole HL22 extends in a direction perpendicular to the broken line BL over the through hole HL22, and the long side of the rectangle forming the through hole HL22 extends along the broken line BL over the through hole HL22. Therefore, a part of the conductive paste CPS remains in the mother sheet BS2 even after the through hole HL22 is formed.

  When the through hole HL22 is formed, grooves GR2, GR2,... Extending along the broken lines BL, BL,... Are formed on the upper surface and the lower surface of the mother sheet BS2 (see FIG. 11D). The groove width formed on the lower surface is wider than the groove width formed on the upper surface.

  The aggregate of the ceramic sheets SH3 is produced in the manner shown in FIGS. 12 (A) to 12 (D) and FIGS. 13 (A) to 13 (D). First, a ceramic sheet made of a nonmagnetic ferrite material is prepared as a mother sheet BS3 (see FIG. 12A). Here, a plurality of broken lines (boundary lines) BL, BL,... Extending in the X-axis direction and the Y-axis direction indicate cutout positions.

  Next, a conductor pattern CP3 extending in a loop shape is formed on the upper surface of each divided unit by screen printing (see FIG. 12B). When the printing of the conductor pattern CP3 is completed, the nonmagnetic ceramic paste SPS is applied by screen printing to a partial region (region surrounded by a one-dot chain line) straddling the broken line BL (see FIG. 12C). Specifically, the ceramic paste SPS is applied in a circle so as to straddle each side of the rectangle forming the division unit.

  Subsequently, a plurality of through holes HL31, HL31... Each having a rectangular shape are formed in a region where the ceramic paste SPS has been applied (see FIG. 12D). A mechanical puncher device is used to form the through hole HL31, and the through hole HL31 is formed so as to straddle the broken line BL. The short side of the rectangle forming the through hole HL31 extends along the broken line BL over the through hole HL31, and the long side of the rectangle forming the through hole HL31 extends in a direction orthogonal to the broken line BL over the through hole HL31.

  Further, a through hole HL3a is formed at the center of each divided unit, and a through hole HL3b is formed at the position of the starting end of the conductor pattern CP3 (see FIG. 13A). A laser device is used to form the through holes HL3a and HL3b.

  .., HL3a, HL3a,..., HL3b, HL3b,... Are then filled with a conductive paste CPS (see FIG. 13B). The conductive paste CPS filled in the through holes HL31, HL31,... Constitutes the electrodes EL31 to EL34, the conductive paste CPS filled in the through hole HL3a constitutes the via-hole conductor VH3a, and the conductive paste CPS filled in the through hole HL3b is The via hole conductor VH3b is formed.

  When the filled conductive paste CPS is dried, a plurality of rectangular through holes HL32, HL32,... Are formed in the region where the ceramic paste SPS is applied (see FIG. 13C). The through hole HL32 is also formed by a mechanical puncher device so as to straddle the broken line BL. Further, the size of the through hole HL32 matches the size of the through hole HL31. However, the short side of the rectangle forming the through hole HL32 extends in a direction perpendicular to the broken line BL across the through hole HL32, and the long side of the rectangle forming the through hole HL32 extends along the broken line BL across the through hole HL32. Therefore, a part of the conductive paste CPS remains in the mother sheet BS3 even after the through hole HL32 is formed.

  When the through hole HL32 is formed, grooves GR3, GR3,... Extending along the broken lines BL, BL,... Are formed on the upper surface and the lower surface of the mother sheet BS3 (see FIG. 13D). The groove width formed on the lower surface is wider than the groove width formed on the upper surface.

  The aggregate of the ceramic sheets SH4 is produced in the manner shown in FIGS. 14 (A) to 14 (D) and FIGS. 15 (A) to 15 (D). First, a ceramic sheet made of a magnetic ferrite material is prepared as a mother sheet BS4 (see FIG. 14A). Here, a plurality of broken lines (boundary lines) BL, BL,... Extending in the X-axis direction and the Y-axis direction indicate cutout positions.

  Next, a conductor pattern CP4 extending in a loop shape is formed on the upper surface of each divided unit by screen printing (see FIG. 14B). When the printing of the conductor pattern CP4 is completed, the magnetic ceramic paste SPS is applied by screen printing to a part of the region (region surrounded by the alternate long and short dash line) across the broken line BL (see FIG. 14C). Specifically, the ceramic paste SPS is applied in a circle so as to straddle each side of the rectangle forming the division unit.

  Subsequently, a plurality of through holes HL41, HL41... Each having a rectangular shape are formed in a region where the ceramic paste SPS is applied (see FIG. 14D). A mechanical puncher device is used to form the through hole HL41, and the through hole HL41 is formed so as to straddle the broken line BL. The short side of the rectangle forming the through hole HL41 extends along the broken line BL over the through hole HL41, and the long side of the rectangle forming the through hole HL41 extends in a direction perpendicular to the broken line BL over the through hole HL41.

  Further, a through hole HL4a is formed at the center of each divided unit, and a through hole HL4b is formed at the position of the starting end of the conductor pattern CP4 (see FIG. 15A). A laser device is used to form the through holes HL4a and HL4b.

  .., HL4a, HL4a,..., HL4b, HL4b,... Are then filled with a conductive paste CPS (see FIG. 15B). The conductive paste CPS filled in the through holes HL41, HL41,... Constitutes the electrodes EL41 to EL44, the conductive paste CPS filled in the through hole HL4a constitutes the via-hole conductor VH4a, and the conductive paste CPS filled in the through hole HL4b is The via hole conductor VH4b is formed.

  When the filled conductive paste CPS is dried, a plurality of through holes HL42, HL42,... Each having a rectangular shape are formed in the region where the ceramic paste SPS is applied (see FIG. 15C). The through hole HL42 is also formed by a mechanical puncher device so as to straddle the broken line BL. Further, the size of the through hole HL42 matches the size of the through hole HL41. However, the short side of the rectangle forming the through hole HL42 extends in a direction perpendicular to the broken line BL across the through hole HL42, and the long side of the rectangle forming the through hole HL42 extends along the broken line BL over the through hole HL42. Therefore, a part of the conductive paste CPS remains in the mother sheet BS4 even after the through hole HL42 is formed.

  When the through hole HL42 is formed, grooves GR4, GR4,... Extending along broken lines BL, BL,... Are formed on the upper surface and the lower surface of the mother sheet BS4 (see FIG. 15D). The groove width formed on the lower surface is wider than the groove width formed on the upper surface.

  The aggregate of the ceramic sheets SH5 is produced in the manner shown in FIGS. 16 (A) to 16 (D) and FIGS. 17 (A) to 17 (C). First, a ceramic sheet made of a magnetic ferrite material is prepared as a mother sheet BS5 (see FIG. 16A). Here, a plurality of broken lines (boundary lines) BL, BL,... Extending in the X-axis direction and the Y-axis direction indicate cutout positions.

  Next, a magnetic ceramic paste SPS is applied by screen printing to a partial region (region surrounded by a one-dot chain line) straddling the broken line BL (see FIG. 16B). Specifically, the ceramic paste SPS is applied in a circle so as to straddle each side of the rectangle forming the division unit.

  Subsequently, a plurality of through holes HL51, HL51... Each having a rectangular shape are formed in a region where the ceramic paste SPS is applied (see FIG. 16C). A mechanical puncher device is used to form the through hole HL51, and the through hole HL51 is formed so as to straddle the broken line BL. The short side of the rectangle forming the through hole HL51 extends along the broken line BL over the through hole HL51, and the long side of the rectangle forming the through hole HL51 extends in a direction orthogonal to the broken line BL over the through hole HL51.

  Furthermore, a through hole HL5a is formed at the center of each divided unit, and a through hole HL5b is formed at a position on the positive side in the X axis direction and on the negative side in the Y axis direction from the position of the through hole HL5a (FIG. 16 ( D)). A laser device is used to form the through holes HL5a and HL5b.

  .., HL5a, HL5a,..., HL5b, HL5b,... Are then filled with a conductive paste CPS (see FIG. 17A). The conductive paste CPS filled in the through holes HL51, HL51,... Forms the electrodes EL51 to EL54, the conductive paste CPS filled in the through holes HL5a forms the via-hole conductor VH5a, and the conductive paste CPS filled in the through holes HL5b A via hole conductor VH5b is formed.

  When the filled conductive paste CPS is dried, a plurality of through holes HL52, HL52,... Each having a rectangular shape are formed in the region where the ceramic paste SPS is applied (see FIG. 17B). The through hole HL52 is also formed by a mechanical puncher device so as to straddle the broken line BL. Further, the size of the through hole HL52 matches the size of the through hole HL51. However, the short side of the rectangle forming the through hole HL52 extends in a direction perpendicular to the broken line BL across the through hole HL52, and the long side of the rectangle forming the through hole HL52 extends along the broken line BL over the through hole HL52. Therefore, a part of the conductive paste CPS remains in the mother sheet BS5 even after the through hole HL52 is formed.

  When the through hole HL52 is formed, grooves GR5, GR5,... Extending along broken lines BL, BL,... Are formed on the upper surface and the lower surface of the mother sheet BS5 (see FIG. 17C). The groove width formed on the lower surface is wider than the groove width formed on the upper surface.

  The aggregate | assembly of ceramic sheet SH6 is produced in the way shown to FIG. 18 (A)-FIG. 18 (D) and FIG. 19 (A)-FIG. 19 (D). First, a ceramic sheet made of a nonmagnetic ferrite material is prepared as a mother sheet BS6 (see FIG. 18A). Here, a plurality of broken lines (boundary lines) BL, BL,... Extending in the X-axis direction and the Y-axis direction indicate cutout positions.

  Next, a nonmagnetic ceramic paste SPS is applied by screen printing to a part of the region (a region surrounded by a one-dot chain line) straddling the broken line BL (see FIG. 18B). Specifically, the ceramic paste SPS is applied in a circle so as to straddle each side of the rectangle forming the division unit.

  Subsequently, a plurality of through holes HL61, HL61... Each having a rectangular shape are formed in a region where the ceramic paste SPS is applied (see FIG. 18C). A mechanical puncher device is used to form the through hole HL61, and the through hole HL61 is formed so as to straddle the broken line BL. The short side of the rectangle forming the through hole HL61 extends along the broken line BL across the through hole HL61, and the long side of the rectangle forming the through hole HL61 extends in a direction orthogonal to the broken line BL across the through hole HL61.

  Furthermore, a through hole HL6a is formed at the center of each divided unit, and a through hole HL6b is formed at a position on the positive side in the X-axis direction and on the negative side in the Y-axis direction from the position of the through-hole HL6a (FIG. D)). A laser device is used to form the through holes HL6a and HL6b.

  .., HL6a, HL6a,..., HL6b, HL6b,... Are then filled with a conductive paste CPS (see FIG. 19A). The conductive paste CPS filled in the through holes HL61, HL61,... Constitutes the electrodes EL61 to EL64, the conductive paste CPS filled in the through hole HL6a constitutes the via hole conductor VH6a, and the conductive paste CPS filled in the through hole HL6b is A via-hole conductor VH6b is formed.

  When the filled conductive paste CPS is dried, a conductor pattern CP6 is formed on the upper surface of each divided unit by screen printing (see FIG. 19B). When the printing of the conductor pattern CP6 is completed, a plurality of through holes HL62, HL62,... Each having a rectangular shape are formed in the region where the ceramic paste SPS is applied (see FIG. 19C).

  The through hole HL62 is also formed by a mechanical puncher device so as to straddle the broken line BL. In addition, the size of the through hole HL62 matches the size of the through hole HL61. However, the short side of the rectangle forming the through hole HL62 extends in a direction perpendicular to the broken line BL over the through hole HL62, and the long side of the rectangle forming the through hole HL62 extends along the broken line BL over the through hole HL62. Therefore, a part of the conductive paste CPS remains in the mother sheet BS6 even after the through hole HL62 is formed.

  When the through hole HL62 is formed, grooves GR6, GR6,... Extending along the broken lines BL, BL,... Are formed on the upper surface and the lower surface of the mother sheet BS6 (see FIG. 19D). The groove width formed on the lower surface is wider than the groove width formed on the upper surface.

  The magnetic mother sheets BS1 to BS2, BS4 to BS5 are prepared in a state of being supported by a pet film (carrier sheet) PF (see FIG. 20A), and the nonmagnetic mother sheets BS0, BS3 and BS6 are also pet film PF. (See FIG. 21A). When the ceramic paste SPS is applied in the manner described above, the thickness from the upper surface of the pet film PF partially increases (see FIGS. 20B and 21B). As a result, the heights of the through holes HL01 to HL61 formed in the region where the ceramic paste SPS is applied are also increased (see FIGS. 20C and 21C). The conductive paste CPS fills the through holes HL01 to HL61 thus formed with the squeegee SQ (see FIGS. 20D and 21D). A recess is formed in the center of the filled conductive paste CPS. The depth of the recess becomes deeper as the diameters of the through holes HL01 to HL61 are enlarged.

  The mother sheets BS0 to BS6 created as described above are stacked and pressure-bonded in this order. The pet film PF is peeled off when the mother sheets BS0 to BS6 are laminated. Further, the stacking position is adjusted so that the broken lines BL, BL,... Assigned to the sheets overlap when viewed from the Z-axis direction. As a result, the multilayer substrate LB1 shown in FIG. The laminated substrate LB1 thus manufactured is then fired (see FIG. 22B).

  When the firing is completed, as shown in FIG. 22C, the laminated substrate LB1 is inverted in the vertical direction, and is divided (divided) into divided units along the broken line BL. As a result, a plurality of multilayer inductor elements 10, 10,... Are obtained. Thereafter, an IC 14 and two passive elements 16 and 16 are mounted on each multilayer inductor element 10 (see FIG. 22D).

  As can be understood from the above description, first, mother sheets BS1 to BS4 each having a main surface on which common broken lines (boundary lines) BL, BL,... Are defined are prepared together with other mother sheets BS0, BS5 to BS6. (Preparation process) The conductor patterns CP1 to CP4 are formed in a part of the main surfaces of the mother sheets BS1 to BS4 that avoid the broken line BL (conductor pattern forming step). The ceramic paste SPS is applied to other partial regions across the broken line BL among the main surfaces of the mother sheets BS1 to BS4 (application step).

  The through holes HL11 to HL41 are formed in the mother sheets BS1 to BS4 corresponding to the positions where the ceramic paste SPS is applied, and the through holes HL2a to HL4a are formed in the mother sheets BS2 to BS4 corresponding to the center positions of the divided units. The through holes HL2b to HL4b are formed in the mother sheets BS2 to BS4 corresponding to the positions of the start ends of the conductor patterns CP2 to CP4 (through hole forming step).

  The conductive paste CPS is filled in each of the through holes HL11 to HL41, HL2a to HL4a, and HL2b to HL4b thus formed (filling step). The multilayer inductor element 10 is manufactured by stacking the mother sheets BS0 to BS6 after filling with the conductive paste CPS and cutting along the broken line BL (manufacturing process).

  The enlargement of the through holes HL11 to HL41 formed at the position across the broken line BL causes a deterioration in the filling property of the conductive paste CPS in combination with the thinning of the mother sheets BS1 to BS4. Further, the increase in the thickness of the conductor patterns CP1 to CP4 formed on the main surfaces of the mother sheets BS1 to BS4 is coupled with the thinning of the mother sheets BS1 to BS4, and the mother sheets BS1 to BS4 in the vicinity of the broken line BL. Causes a decrease in adhesion.

  However, in this embodiment, the thickness of the position where the through holes HL11 to HL41 are formed is increased by the ceramic paste SPS. Thereby, the thickness of the conductive paste CPS filled in the through holes HL11 to HL41 is increased, and the adhesion of the mother sheets BS1 to BS4 in the vicinity of the broken line BL is further increased. As a result, poor formation of the side electrodes SEL1 to SEL4 can be avoided.

  In this embodiment, four side electrodes SEL1 to SEL4 are provided on the four side surfaces of the multilayer inductor element 10 (see FIG. 4). In addition, the laminated substrate LB1 is singulated after firing (see FIGS. 22B to 22C). However, each of the side electrodes SEL1 to SEL4 provided in the multilayer inductor element 10 may be divided into a plurality of electrode pieces. In this case, for example, the aggregate of the ceramic sheets SH0 is produced in the manner shown in FIGS.

  First, a ceramic sheet made of a nonmagnetic ferrite material is prepared as a mother sheet BS0 (see FIG. 23A). Here, a plurality of broken lines (boundary lines) BL, BL,... Extending in the X-axis direction and the Y-axis direction indicate cutout positions.

  Next, a nonmagnetic ceramic paste SPS is applied by screen printing to a part of the region (a region surrounded by an alternate long and short dash line) straddling the broken line BL (see FIG. 23B). Specifically, the ceramic paste SPS is applied to the upper surface of the mother sheet BS0 so that three ellipses are drawn on each side of the rectangle forming the division unit.

  Subsequently, a plurality of through holes HL01, HL01... Each having a rectangular shape are formed in an elliptical region to which the ceramic paste SPS is applied (see FIG. 23C). A mechanical puncher device is used to form the through hole HL01, and the through hole HL01 is formed so as to straddle the broken line BL. The short side of the rectangle forming the through hole HL01 extends along the broken line BL across the through hole HL01, and the long side of the rectangle forming the through hole HL01 extends in a direction orthogonal to the broken line BL across the through hole HL01. The formed through holes HL01, HL01,... Are then filled with a conductive paste CPS (see FIG. 23D).

  When the filling of the conductive paste CPS is completed, grooves GR0, GR0,... Extending along broken lines BL, BL,... Are formed on the upper surface and the lower surface of the mother sheet BS0 (see FIG. 24). The groove width formed on the lower surface is wider than the groove width formed on the upper surface.

  Other mother sheets BS1 to BS6 are created in the same manner. The mother sheets BS0 to BS6 created in this way are laminated and pressure-bonded in this order. The pet film PF is peeled off when the mother sheets BS0 to BS6 are laminated. Further, the stacking position is adjusted so that the broken lines BL, BL,... Assigned to the sheets overlap when viewed from the Z-axis direction. As a result, the multilayer substrate LB1 shown in FIG.

  The manufactured laminated substrate LB1 is singulated for each divided unit along the broken line BL (see FIG. 26B), and the singulated laminated body is then fired (see FIG. 26C). . When firing is completed, a plurality of multilayer inductor elements 10, 10,... Are obtained. Then, the IC 14 and a plurality of passive elements 16, 16,... Are mounted on each multilayer inductor element 10 (see FIG. 26D). The IC 14 and the passive elements 16, 16,... Are mounted on the top surface of the multilayer inductor element 10 as shown in FIG. 25 (note that the conductor pattern CP6 is not shown in FIG. 25).

10 ... Multilayer inductor element
SH0 to SH6 Ceramic sheet 12 Laminated body 14 IC (electronic component)
16 ... Passive elements (electronic components)
CP1 to CP4, CP6 ... Conductor patterns HL01 to HL02, HL11 to HL12, HL21 to HL22, HL31 to HL32, HL41 to HL42, HL51 to HL52, HL61 to HL62, HL2a to HL2b, HL3a to HL3b, HL4a to HL4b, L4 HL5b, HL6a to HL6b ... through holes EL01 to EL04, EL11 to EL14, EL21 to EL24, EL31 to EL34, EL41 to EL44, EL51 to EL54, EL61 to EL64 ... electrodes VH2a to VH2b, VH3a to VH3b, VH4a to VH4b, VH5a ~ VH5b, VH6a ~ VH6b ... via hole conductor

Claims (9)

A preparation step of preparing a plurality of ceramic sheets each having a main surface with a common boundary defined;
A conductor pattern forming step of forming a plurality of conductor patterns in a part of the main surface of each of the plurality of ceramic sheets to avoid the boundary line;
An application step of applying a ceramic paste to another part of the main surface of each of the plurality of ceramic sheets across the boundary line,
A through hole forming step of forming a through hole in each of the plurality of ceramic sheets at a plurality of positions including the position of the ceramic paste applied by the applying step;
A filling step of filling the through-holes formed in the through-hole forming step with a conductive paste; and, after the filling step, laminating the plurality of ceramic sheets and cutting at the boundary lines to produce a plurality of laminated electronic components A method for manufacturing a laminated electronic component, comprising a manufacturing process.   The through hole formed by the through hole forming step includes a first through hole formed at a position across the boundary line, and a second through hole formed at a position overlapping each of the plurality of conductor patterns. The manufacturing method of the multilayer electronic component of Claim 1.   The method for manufacturing a laminated electronic component according to claim 2, wherein the ceramic paste is partially applied to the boundary line side of the conductor pattern.   The method for manufacturing a multilayer electronic component according to claim 2, wherein the second through hole is smaller than the first through hole. The plurality of conductor patterns form an inductor together with a conductive paste filled in the second through hole,
The method for manufacturing a multilayer electronic component according to claim 2, wherein at least some of the plurality of ceramic sheets have magnetism.   The production process includes a laminating process for laminating the plurality of ceramic sheets, a firing process for firing the laminated substrate obtained by the laminating process, and a cutting process for cutting the fired substrate obtained by the firing process at the boundary line. The manufacturing method of the multilayer electronic component in any one of Claims 1 thru | or 5 containing these.   The manufacturing step includes firing a plurality of laminated bodies obtained by the laminating step of laminating the plurality of ceramic sheets, a cutting step of cutting the laminated substrate obtained by the laminating step, and the cutting step. The manufacturing method of the multilayer electronic component in any one of Claims 1 thru | or 5 including a baking process.   The manufacturing method of the multilayer electronic component according to any one of claims 1 to 7, further comprising a mounting step of mounting another electronic component on each main surface of the plurality of multilayer electronic components manufactured by the manufacturing step. The plurality of ceramic sheets are each supported by a plurality of carrier sheets,
The method for manufacturing a laminated electronic component according to claim 1, wherein the manufacturing step includes a peeling step of peeling the ceramic sheets from the plurality of carrier sheets.

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