JP6068209B2 - Cutting method - Google Patents

Description

  The present invention relates to a cutting method. The present invention also relates to a multi-stage cutting method used for cutting a workpiece such as sapphire, SiC, ceramics, glass, metal, etc., which has a high load for cutting with a cutting blade.

  For example, sapphire substrates used as optical device wafers, SiC substrates, ceramics and metal substrates that are frequently used as various electronic components, glass used as optical components, etc. are mounted with a cutting blade known as a dicer. It is a relatively difficult material to cut. In addition, when a cutting blade is mounted on a cutting device to form or divide a groove of a desired depth in such a material, the cutting blade or the work piece is chipped or the cutting blade is abnormally worn. For this reason, a so-called multi-stage cutting method is widely known in which a single groove is formed by repeatedly cutting two or more times while changing the height of the cutting blade (see, for example, Patent Document 1). .

  The cutting blade maintains the sharpness by the self-generated blade action that wears the tip of the cutting blade as the workpiece is cut. The amount of wear at the tip is relatively large. When the amount of wear at the tip of the cutting blade increases, the actual cutting amount becomes smaller than the set cutting amount, so that it may be impossible to form a cutting groove according to a desired depth. In order to prevent cutting grooves from being formed at the desired depth, when a single groove is formed by repeatedly cutting two or more times, the wear amount of the cutting blade is measured during the repeated cutting process. And the processing method which compensates for the amount of wear is also known (for example, refer to patent documents 2).

JP 2003-124151 A JP 61-071968 A

  In the case of such multi-stage cutting, when the amount of wear of the cutting blade is measured after the first cutting, and the cutting groove formed by the first cutting is cut again, the measured amount of friction is set to the set cutting amount. When cutting with the added cutting depth, there is a possibility that an excessive load is applied to the cutting blade, and there is a possibility that abnormal wear of the cutting blade or damage to the workpiece may occur.

  The present invention has been made in view of the above, and provides a cutting method capable of suppressing an excessive load from being applied to a cutting blade when a cutting groove having a desired depth is formed on a workpiece. For the purpose.

  In order to solve the above-described problems and achieve the object, the cutting method of the present invention has a chuck table for holding a workpiece and a cutting blade for cutting the workpiece held on the chuck table on the outer periphery. Cutting means provided with a cutting blade for rotation, processing feed means for relatively processing and feeding the chuck table and the cutting means, and cutting feed means for cutting and feeding the cutting blade of the cutting blade in a direction perpendicular to the machining feed direction A cutting method for forming a cutting groove of a desired depth in a workpiece whose cutting amount is regulated, using a cutting device configured at least from a measuring means for measuring the wear amount of the cutting blade of the cutting blade. The cutting amount setting step for setting the cutting amount by operating the cutting feed means within a range not exceeding the cutting amount regulation, and the cutting set from the surface of the workpiece A cutting blade with a cutting edge positioned in the amount of cut, a cutting groove forming step for forming a cutting groove on the surface of the work piece by operating the processing feed means, and the total value of the set cutting depth is the desired depth A repetition step that repeats the cutting amount setting step and the cutting groove forming step until the value reaches the value, and a wear amount measurement step that measures the wear amount of the cutting blade of the cutting blade by operating the measurement means after performing the repetition step; The cutting feed means is actuated to set the wear amount as the cut amount, and at least a finishing step of cutting the bottom of the cutting groove formed by the repetition step is characterized.

  Further, in the above cutting method, when the wear amount measured in the wear amount measurement step exceeds the regulated cut amount, a cut amount setting step and a cutting groove forming step are performed in addition to the repeat step, and a finishing step It is preferable that the cut amount set in step 1 is an amount obtained by removing the cut amount set in the cut amount setting step performed after the repetition step from the wear amount measured in the wear amount measurement step.

  Moreover, in the said cutting method, it is preferable to cut | disconnect a workpiece by the cutting groove of desired depth.

  According to the cutting method of the present invention, when the cutting groove is repeatedly cut with a cutting depth that does not exceed the regulation, if the set value of the cutting depth reaches a desired depth, the wear of the cutting blade In order to compensate the amount, the bottom of the cutting groove is cut with a cutting amount set in a range not exceeding the regulation, so that the cutting groove is not repeatedly cut by adding an abrasion amount to the cutting amount. That is, since the cutting amount does not increase by the wear amount, it is possible to suppress an excessive load from being applied to the cutting blade.

FIG. 1 is a diagram illustrating a schematic configuration example of a processing apparatus according to an embodiment. FIG. 2 is a perspective view for explaining the cutting method according to the embodiment. FIG. 3 is a flowchart of the cutting method according to the embodiment. FIG. 4 is a schematic diagram illustrating a cutting blade and a workpiece in the cutting method according to the embodiment. FIG. 5 is an explanatory diagram of the cutting method according to the first embodiment. FIG. 6 is an explanatory diagram of a cutting method according to the second embodiment.

  DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. In addition, various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
FIG. 1 is a diagram illustrating a schematic configuration example of a processing apparatus according to an embodiment. FIG. 2 is a perspective view for explaining the cutting method according to the embodiment. As shown in FIG. 1, the cutting device 1 according to the first embodiment includes a chuck table 10 that holds a workpiece W (see FIG. 2), a cutting unit 20 that cuts the workpiece W, and an alignment adjustment image. Imaging means 30 for generating data, processing feeding means 40 for processing and feeding the chuck table 10, indexing feeding means 50 for indexing and feeding the cutting means 20, a cutting and feeding means 60 for cutting and feeding the cutting means 20, and a chuck table 10 includes a θ-axis rotating unit 70 that rotates 10, a measuring unit 80 that measures the wear amount of the cutting blade 21, and a control unit 90 that controls the operation of the cutting apparatus 1.

In the present embodiment, the workpiece W is a processing material in which the amount of wear of the cutting blade 21 is likely to increase, and the processing material in which the cutting amount of the cutting blade 21 is regulated so that the load on the cutting blade 21 is not excessive. It is. The workpiece W as such a processing material is, for example, a sapphire (Al ₂ O ₃ ) substrate used as an optical device wafer, a silicon carbide (SiC) substrate, a ceramic or metal substrate frequently used as various electronic components, optical Glass or the like used as a part.

  As shown in FIG. 1, the chuck table 10 has a disk shape in which a portion constituting the holding surface 11 is formed of porous ceramic or the like, and a workpiece W placed on the holding surface 11 is not illustrated with a vacuum suction source (not shown). Hold by suction.

  The cutting means 20 includes a cutting blade 21, a spindle 22, a spindle housing 23, and a nozzle 24. The cutting means 20 performs cutting while supplying a cutting fluid to the workpiece W held on the chuck table 10. Further, the cutting unit 20 cuts a region to be processed of the workpiece W based on the image data captured by the imaging unit 30. The cutting blade 21 is an annular ultra-thin cutting grindstone. As shown in FIG. 2, the cutting blade 21 has a cutting edge 21 a for cutting the workpiece W on the outer periphery. The cutting blade 21 is detachably attached to one end of the spindle 22. As the cutting blade 21, an electroformed blade, a resin bond blade, a metal bond blade, a vitrified bond blade, or the like can be used. The nozzle 24 supplies cutting fluid to a processing point of the workpiece W during processing of the workpiece W by the cutting blade 21.

  The imaging means 30 is, for example, a camera using a CCD (Charge Coupled Device) image sensor. The imaging unit 30 images the surface of the workpiece W to generate alignment adjustment image data, and outputs the image data to the control unit 90.

  As shown in FIG. 1, the machining feed means 40 corresponds to an X-axis moving means for machining and feeding the chuck table 10 relative to the apparatus body 2 in the X-axis direction, and the chuck table 10 and the cutting means 20 are connected. Process feed relatively. The machining feed means 40 includes an X-axis movement base 41, an X-axis pulse motor 42, an X-axis ball screw 43, a pair of X-axis guide rails 44, an X-axis position detection scale 45, and an X-axis position detection. Sensor 46. The machining feed means 40 rotates and drives the X-axis ball screw 43 by the rotational force of the X-axis pulse motor 42, thereby guiding the X-axis moving base 41 with the pair of X-axis guide rails 44 with respect to the apparatus main body 2. To move in the X-axis direction. In the present embodiment, the X-axis direction is a direction orthogonal to the rotation axis of the cutting blade 21 and is a direction orthogonal to the vertical direction.

  The index feeding means 50 corresponds to a Y-axis moving means for indexing and feeding the cutting means 20 relative to the apparatus body 2 in the Y-axis direction, and relatively indexes and feeds the cutting means 20. The index feeding means 50 includes a Y-axis movement base 51, a Y-axis pulse motor 52, a Y-axis ball screw 53, a pair of Y-axis guide rails 54, a Y-axis position detection scale 55, and a Y-axis position detection. Sensor 56. The index feeding means 50 rotates and drives the Y-axis ball screw 53 by the rotational force of the Y-axis pulse motor 52, thereby guiding the Y-axis moving base 51 with the pair of Y-axis guide rails 54 with respect to the apparatus main body 2. To move in the Y-axis direction. In the present embodiment, the Y-axis direction is the direction of the rotation axis of the cutting blade 21 and is a direction orthogonal to the vertical direction.

  The cutting and feeding means 60 corresponds to a Z-axis moving means that relatively cuts and feeds the cutting means 20 relative to the apparatus body 2 in the Z-axis direction, that is, the direction in which the cutting blade 21 approaches and leaves the chuck table 10. Cut 20 and feed. The cutting feed means 60 includes a Z-axis moving member 61, a Z-axis pulse motor 62, a Z-axis ball screw 63, and a Z-axis guide rail 64. The cutting feed means 60 rotates the Z-axis ball screw 63 by the rotational force of the Z-axis pulse motor 62, thereby guiding the Z-axis moving member 61 with the Z-axis guide rail 64 and the Z-axis with respect to the apparatus main body 2. Move in the direction. Thereby, the cutting feed means 60 cuts and feeds the cutting blade 21a of the cutting blade 21 in a direction orthogonal to the machining feed direction (X-axis direction). In the present embodiment, the Z-axis direction is the vertical direction.

  Further, the cutting feed means 60 includes a Z-axis position detection mechanism (not shown) that detects the position of the cutting means 20 in the Z-axis direction. The Z-axis position detection mechanism includes, for example, a Z-axis position detection scale and a Z-axis position detection sensor.

  The θ axis rotation means 70 includes a θ axis rotation motor 71 and a table 72. The table 72 mounts the chuck table 10 and is supported by the X-axis movement base 41 via a θ-axis rotation motor 71 so that the table 72 can rotate around the central axis of the chuck table 10. The table 72 can cause the chuck table 10 to rotate at an arbitrary angle or continuously rotate with respect to the cutting blade 21 around the central axis thereof.

  The measuring means 80 is disposed in the vicinity of the chuck table 10, for example, on the movable table 12 that holds the chuck table 10. In the present embodiment, the measuring unit 80 is disposed at the corner of the moving table 12 that is the end in the + X direction and the end in the −Y direction. The measuring unit 80 includes, for example, a light emitting unit and a light receiving unit (not shown), and the cutting edge 21a of the cutting blade 21 blocks the light beam from the light emitting unit, whereby the tip 21b ( 4) is detected. The measuring unit 80 outputs a measurement signal corresponding to the intensity of the light received by the light receiving unit to the control unit 90. Further, the measuring means 80 uses the Z-axis position detection scale of the Z-axis position detection mechanism and the Z-axis position detection sensor, so that the Z-axis position before and after the cutting of the tip 21b of the cutting blade 21a of the cutting blade 21 is measured. From this, the amount of wear of the cutting blade 21 is measured.

  The control means 90 is an electronic control device having a computer. The control means 90 is connected to the machining feed means 40, the index feed means 50, the cutting feed means 60, the θ-axis rotation means 70 and the measurement means 80, respectively, and controls each means 40-80.

  As shown in FIGS. 1 and 2, the cutting apparatus 1 configured as described above generates an alignment adjustment image data by imaging the workpiece W sucked and held on the chuck table 10 by the imaging means 30. Based on this image data, the alignment between the cutting means 20 and the workpiece W is adjusted. Next, the cutting apparatus 1 rotates the cutting blade 21 of the cutting means 20 at a high speed and causes the cutting means 20 to be cut and fed relative to the chuck table 10 in the Z-axis direction by the cutting and feeding means 60. In contrast, the chuck table 10 is relatively fed in the X-axis direction by the machining feed means 40, and the cutting means 20 is relatively indexed and fed in the Y-axis direction by the index feeding means 50 to the chuck table 10. Thereby, the cutting device 1 can cut the division | segmentation scheduled line of the workpiece W, and can form the cutting groove Wb. Further, the cutting apparatus 1 cuts all the lines to be divided in the same direction, and then rotates the chuck table 10 by 90 degrees by the θ-axis rotating unit 70 and repeats the same cutting process by the cutting unit 20. Cutting grooves Wb can be formed in a grid pattern on the workpiece W.

  Next, a cutting method of the cutting apparatus 1 according to the present embodiment will be described with reference to FIGS. FIG. 3 is a flowchart of the cutting method according to the embodiment. FIG. 4 is a schematic diagram illustrating a cutting blade and a workpiece in the cutting method according to the embodiment. FIG. 5 is an explanatory diagram of the cutting method according to the first embodiment.

  First, as shown in FIG. 3, the cutting device 1 detects the position of the cutting edge of the cutting blade 21 based on a processing instruction by an operator such as an operator (step ST1). The step ST1 will be described in detail. The control unit 90 of the cutting apparatus 1 rotates the cutting blade 21 at a high speed, and the tip 21b (the cutting edge 21a of the cutting blade 21a by the light emitting unit and the light receiving unit (not shown) of the measuring unit 80. 4), and the Z-axis position of the tip 21b is detected by a Z-axis position detection scale (not shown) of the cutting feed means 60 and a Z-axis position detection sensor, so that the Z-axis of the cutting edge of the cutting blade 21 is detected. Detect position. Further, the control means 90 stores the cutting edge of the cutting blade 21, that is, the Z-axis position of the tip 21b in a storage means (not shown). The control means 90 also adjusts the origin position of the cutting blade 21 by setting the Z-axis position of the tip 21b as the origin position. That is, in this step ST1, the control means 90 sets the height of the cutting blade 21.

  Next, as shown in FIGS. 3 and 4, the cutting device 1 sets a desired depth D of the cutting groove Wb formed in the workpiece W (step ST2). If this step ST2 is demonstrated in detail, the control means 90 of the cutting device 1 will finally give the desired depth D of the cutting groove Wb formed in the workpiece W inputted by the operator to the workpiece W. Is set as the amount of cutting from the bottom Wc of the cutting groove Wb to be formed to the surface Wa.

  Next, the cutting device 1 sets the cutting amount S1 from the desired depth D (step ST3). If this step ST3 is demonstrated in detail, the control means 90 of the cutting device 1 will set the cutting amount S1 of the cutting blade 21, as shown in FIG. The cutting amount S1 is set within a range not exceeding the regulation of the cutting amount, that is, the regulation cutting amount K (S1 <K). Further, the control means 90 operates the cutting feed means 60 to position the cutting blade 21 at a predetermined height. In the present embodiment, the cut amount S1 is obtained by dividing the desired depth D into four equal parts (S1 = D / 4) as shown in FIG. The regulated cut amount K is a cut amount that does not apply an excessive load to the cutting blade 21 during cutting. The regulation cut amount K is determined in advance according to the rotational speed of the cutting blade 21, the material of the workpiece W, and the like, and is stored in advance in a storage unit (not shown) of the control unit 90. The regulated cutting amount K is, for example, the number of rotations of the cutting blade 21, the type of the cutting blade 21, the cutting feed speed of the cutting blade 21, the type of the workpiece W, the machining conditions input by the operator, Is selected from a control map (regulation cut-in amount control map) that defines the correlation. That is, in the present embodiment, it is possible to repeatedly cut the workpiece W, that is, to perform multi-stage cutting, while suppressing an excessive load from being applied to the cutting blade 21a of the cutting blade 21 in one cutting. . The restriction cut amount control map is created by, for example, a cutting test with an actual machine.

  In the present embodiment, step ST3 is referred to as a cutting amount setting step. The cutting amount setting step is to set the cutting amount S1 by operating the cutting feeding means 60 at least within a range not exceeding the regulation of the cutting amount (regulated cutting amount K). In the cutting amount setting step, the cutting feed means 60 is operated to position the cutting blade 21 at a predetermined height.

  Next, the cutting device 1 forms the cutting groove Wb with the cutting amount S1 (step ST4). The step ST4 will be described in detail. As shown in FIG. 5A, the control unit 90 of the cutting apparatus 1 cuts and feeds the cutting blade 21 with the cut amount S1 by the cut feed unit 60 in the cut amount setting step. By cutting and feeding the chuck table 10 by the machining feed means 40, a cutting groove Wb is formed in the workpiece W. Here, since the cutting blade 21a is worn with the formation of the cutting groove Wb, the cutting blade 21 forms the cutting groove Wb with an actual cutting amount shallower than the cutting amount S1, that is, the actual cutting amount f1 (f1). <S1). That is, in the cutting groove Wb, the depth from the surface Wa to the bottom Wc is the actual cutting amount f1.

  In the present embodiment, step ST4 is referred to as a cutting groove forming step. In the cutting groove forming step, at least the cutting blade 21 in which the cutting blade 21a is positioned at the cutting amount S1 set from the surface Wa of the workpiece W is operated by operating the processing feeding means 40 to the surface Wa of the workpiece W. The cutting groove Wb is formed on the surface. Further, the cutting amount setting step and the cutting groove forming step are performed continuously.

  Next, the cutting device 1 determines whether or not the total value of the cutting amounts S1 has reached a desired depth D value (step ST5). When this step ST5 is described in detail, the control means 90 of the cutting apparatus 1 determines the number of times that the step ST3 and the step ST4 are repeated in the step ST3 and the step ST4 by using the cutting amount S1 set in the step ST3. By integrating the minutes, it is determined whether or not the sum of the cut amounts S1 has reached the desired depth D set in step ST2. The determination may be made based on whether or not the preset number of times n (four times in the present embodiment) has been cut.

  Further, as shown in (B) to (D) of FIG. 5, the cutting device 1 determines that the total value of the cutting amounts S1 has not reached the desired depth D (No in step ST5) and the above-described step. The processes of ST3 and step ST4 are performed. If this step ST5 negation is described in detail, the control device 90 of the cutting device 1 performs the second cutting on the workpiece W as shown in FIG. In this second cutting, the bottom Wc of the cutting groove Wb formed with the actual cutting amount f1 is obtained by cutting the cutting blade 21 with the cutting amount S1 into the cutting groove Wb formed with the actual cutting amount f1. Cutting is performed with a cutting depth f2. In this second cutting, the total value of the cutting amount S1 is (S1 × 2), and the cutting amount of the cutting groove Wb is (f1 + f2). Further, as shown in FIG. 5C, the control device 90 performs the third cutting by cutting the cutting blade 21 with the cutting amount S1 as in the second cutting. In the third cutting, the total value of the cutting amount S1 is (S1 × 3), and the cutting amount of the cutting groove Wb is (f1 + f2 + f3). Further, as shown in FIG. 5D, the control device 90 performs the fourth cutting by cutting the cutting blade 21 with the cutting amount S1 as in the third cutting. In the fourth cutting, the total value of the cutting amount S1 is (S1 × 4), and the cutting amount of the cutting groove Wb is (f1 + f2 + f3 + f4). That is, in the fourth cutting, the total value (S1 × 4) of the cutting depth S1 reaches the desired depth D (S1 × 4 = D).

  In the present embodiment, steps ST3 and ST4 that are repeated until step ST5 is negative are referred to as repetition steps. The repeating step repeats the cutting groove forming step at least until the total value of the set cutting amounts S1 reaches a desired depth D value.

  Further, when the cutting device 1 determines that the total value of the set cutting amounts S1 has reached the desired depth D (Yes in step ST5), the cutting device 1 measures the wear amount m of the cutting blade 21 (step ST6). ). The step ST6 will be described in detail. The control unit 90 of the cutting apparatus 1 detects the tip 21b of the cutting blade 21a of the cutting blade 21 by a light receiving unit and a light emitting unit (not shown) of the measuring unit 80, and illustrates the cutting feed unit 60. The Z-axis position of the tip 21b is detected by the Z-axis position detection scale and the Z-axis position detection sensor. Further, the control unit 90 sets the difference between the Z-axis position detected in step ST6 and the Z-axis position detected in step ST1 and stored in the storage unit (not shown) as the wear amount m of the cutting blade 21. . The wear amount m is also the difference between the desired depth D and the actual cut amount (f1 + f2 + f3 + f4) of the cutting groove Wb, as shown in FIG. 5 (D).

  In the present embodiment, step ST6 is referred to as a wear amount measuring step. The wear amount measuring step is to measure the wear amount m of the cutting blade 21a of the cutting blade 21 by operating the measuring means 80 after at least repeating steps.

  Next, the cutting device 1 determines whether or not the wear amount m exceeds the regulation cut amount K (step ST7). If this step ST7 is demonstrated in detail, the control means 90 of the cutting device 1 will control the abrasion amount m of the cutting blade 21 measured at the above-mentioned step ST6, and the regulation of the cutting amount set at the above-mentioned step ST3, that is, the regulation cutting amount K. To determine whether or not the wear amount m of the cutting blade 21 exceeds the regulation cut amount K. For this reason, when the cutting device 1 determines that the wear amount m of the cutting blade 21 has exceeded the regulation cut amount K (Yes in step ST7), the cutting device 1 sequentially performs step ST10 to step ST12 described later. Note that step ST7 can be omitted when the wear amount m of the cutting blade 21 is predicted to be small.

  Next, when the cutting device 1 determines that the wear amount m does not exceed the regulation cut amount K (No in step ST7), the cutting device 1 sets the wear amount m as the cut amount S2 (step ST8). The step ST8 will be described in detail. The control unit 90 of the cutting apparatus 1 sets the wear amount m measured in step ST6 as the cut amount S2 of the cutting blade 21 (S2 = m).

  Next, the cutting device 1 cuts the bottom Wc of the cutting groove Wb with the cutting amount S2 (step ST9). The step ST9 will be described in detail. As shown in FIG. 5E, the control unit 90 of the cutting device 1 applies the cutting groove Wb formed with the actual cutting amount f4 by the fourth cutting in the step ST4. Then, the cutting blade 21 is cut and fed by the cutting amount S2 set in step ST8 by the cutting and feeding means 60, and the bottom Wc of the cutting groove Wb formed with the actual cutting amount f5 is cut. Thereby, the cutting amount of the cutting groove Wb becomes (f1 + f2 + f3 + f4 + f5), and the cutting groove Wb having a desired depth D is formed on the workpiece W. Similarly, a plurality of cutting grooves Wb having a desired depth D are formed in the workpiece W by performing a series of steps from the above step ST1 to the above step ST9 for the other division lines. .

  In the present embodiment, a series of steps from step ST8 to step ST9 is referred to as a finishing step. In the finishing step, at least the cutting feed means 60 is operated to set the wear amount m as the cutting amount S2, and the bottom Wc of the cutting groove Wb formed by the repetition step is cut. That is, the cutting method of the cutting apparatus 1 according to the present embodiment includes at least a cutting amount setting step, a cutting groove forming step, a repetition step, a wear amount measuring step, and a finishing step.

  As described above, according to the cutting method of the cutting device 1 according to the present embodiment, when the cutting groove Wb is repeatedly cut with the cutting amount S1 that does not exceed the regulation cutting amount K in the repetition step, the total value of the cutting amount S1. When the desired depth D is reached, as a finishing step, the wear amount m of the cutting blade 21a of the cutting blade 21 is set as the cut amount S2, and the bottom Wc of the cutting groove Wb is cut with the set cut amount S2. . That is, in the cutting method of the cutting apparatus 1 according to the present embodiment, since the wear amount m is not added to the cut amount S1 and the cutting groove is not cut in the repetition step, the cut amount S1 increases by the wear amount m. There is nothing. That is, since the cutting amount S1 does not increase by the wear amount m, even if the cutting amount S1 + the wear amount m exceeds the regulated cutting amount K, it is possible to prevent an excessive load from being applied to the cutting blade 21a of the cutting blade 21. The effect that it can be done can be produced.

  Moreover, since it can suppress that an excessive load is applied to the cutting blade 21a of the cutting blade 21, it can suppress that the cutting blade 21 and the to-be-processed object W chip, or the cutting blade 21 wears abnormally. . Further, the workpiece W can be repeatedly cut, that is, multistage cut, while suppressing an excessive load on the cutting blade 21a of the cutting blade 21.

  In addition, for example, the amount of wear m of the cutting blade 21 is automatically measured and used for a material such as sapphire, SiC, metal substrate, etc. Even when performing processing for adjusting the depth of the groove Wb by the amount of wear m, it is possible to maintain a predetermined groove depth (desired depth D) and processing quality.

[Embodiment 2]
Next, a cutting method of the cutting apparatus 1 according to the second embodiment will be described. FIG. 6 is an explanatory diagram of a cutting method according to the second embodiment. Since the basic configuration of the cutting method of the cutting device 1 according to the second embodiment is the same as the cutting method of the cutting device 1 according to the first embodiment, description of the configuration of the same portion is omitted.

  The cutting method of the cutting device 1 according to the present embodiment is a cutting method in the case where it is predicted that the wear amount m of the cutting blade 21 is increased. That is, in the cutting method of the cutting apparatus 1 according to the present embodiment, the wear amount m of the cutting blade 21 exceeds the regulated cut amount K when the total value of the cut amounts S1 reaches the desired depth D value. Even in such a case, the workpiece W can be cut in multiple stages without applying an excessive load to the cutting blade 21.

  The cutting method of the cutting device 1 according to the present embodiment, for example, is different from the first embodiment, and sets the cutting amount S1 by dividing the desired depth D into three equal parts. Accordingly, after performing the above-described steps ST1 to ST7, if it is determined that the wear amount m exceeds the regulation cut amount K (Yes in step ST7), the cut amount S3 is set from the wear amount m (step ST10). The bottom Wc of the cutting groove Wb is cut with the amount S3 (step ST11), the amount obtained by subtracting the cutting amount S3 from the wear amount m is set as the cutting amount S4, and the bottom Wc of the cutting groove Wb is cut with the cutting amount S4 (step). ST12).

  Specifically, as shown in FIGS. 3 and 4, the cutting device 1 detects the position of the cutting edge of the cutting blade 21 (step ST <b> 1), and a desired depth of the cutting groove Wb formed in the workpiece W. D is set (step ST2), and the cutting amount S1 of the cutting blade 21 is set for the workpiece W (step ST3). Here, the cutting depth S1 is obtained by dividing the desired depth D into three equal parts (S1 = D / 3).

  Next, the cutting device 1 forms the cutting groove Wb with the cutting amount S1 (step ST4). The cutting groove Wb formed in this step ST4 is formed with an actual cutting amount f1, as shown in FIG. That is, in the cutting groove Wb, the depth from the surface Wa to the bottom Wc is the actual cutting amount f1.

  Next, the cutting device 1 determines whether or not the total value of the cutting amounts S1 has reached a desired depth D value (step ST5), as shown in (B) and (C) in FIG. If it is determined that the total value of the cut amount S1 has not reached the desired depth D (No in step ST5), the processing in step ST3 and step ST4 is performed. In step ST4 performed by negating step ST5, the workpiece W is cut a second time as shown in FIG. 6B. In this second cutting, the bottom Wc of the cutting groove Wb formed with the actual cutting amount f1 is actually cut by cutting the cutting blade 21 with the cutting amount S1 into the cutting groove Wb formed with the actual cutting amount f1. Cutting is performed with an amount f2. In this second cutting, the total value of the cutting amount S1 is (S1 × 2), and the cutting amount of the cutting groove Wb is (f1 + f2). Further, as shown in FIG. 6C, the control device 90 performs the third cutting by cutting the cutting blade 21 with the cutting amount S1 similarly to the second cutting. In the third cutting, the total value of the cutting amount S1 is (S1 × 3), and the cutting amount of the cutting groove Wb is (f1 + f2 + f3). That is, in this third cutting, the total value (S1 × 3) of the cutting amount S1 reaches the desired depth D (S1 × 3 = D).

  Further, when the cutting device 1 determines that the total value of the cutting amounts S1 has reached the desired depth D (Yes in step ST5), the cutting device 1 measures the wear amount m of the cutting blade 21 (step ST6). The wear amount m measured in step ST6 is the difference between the desired depth D and the actual cut amount (f1 + f2 + f3) of the cutting groove Wb, as shown in FIG. 6C.

  Next, the cutting device 1 determines whether or not the wear amount m exceeds the regulation cut amount K (step ST7), and determines that the wear amount m exceeds the regulation cut amount K (Yes in step ST7). The cut amount S3 is set from m (step ST10), and the bottom Wc of the cutting groove Wb is cut with the cut amount S3 (step ST11). The step ST10 and the step ST11 will be described in detail. As shown in FIG. 6D, the control unit 90 of the cutting apparatus 1 performs cutting with respect to the cutting groove Wb formed with the actual cutting amount f3 in step ST4. By cutting the blade 21 with the cutting amount S3, the bottom Wc of the cutting groove Wb formed with the actual cutting amount f3 is cut with the actual cutting amount f4. That is, the control unit 90 performs the fourth cutting on the workpiece W with the cutting amount S3 (that is, S3 <K <m) set in a range not exceeding the regulation cutting amount K and the wear amount m. . In the fourth cutting, the cutting depth of the cutting groove Wb is (f1 + f2 + f3 + f4). If the wear amount m is between the cut amount S1 and the regulated cut amount K (S1 <m <K) in step ST7 affirmation, the regulated cut amount K may be set as the cut amount S3 (S3 = K). ).

  In the present embodiment, step ST10 is referred to as a cutting amount setting step. The step ST11 is referred to as a cutting groove forming step.

  Next, the cutting device 1 sets the amount obtained by removing the cut amount S3 from the wear amount m as the cut amount S4, and cuts the bottom Wc of the cutting groove Wb (step ST12). Describing step 12 in detail, the control means 90 of the cutting apparatus 1 cuts an amount obtained by removing the cutting amount S3 set in step ST10 from the wear amount m of the cutting blade 21 measured in step ST6. The cutting amount S4 of the blade 21 is set (S4 = m−S3).

  In the present embodiment, step ST12 is referred to as a finishing step. In this finishing step (step ST12), a shortage (m-S3) that is insufficient for the desired depth D is cut and compensated. That is, the cut amount S4 in the finishing step is the difference between the wear amount m and the cut amount S3 (S4 = m−S3), and is an actual cut amount f5 corresponding to the shortage, as shown in FIG. The bottom Wc of the cutting groove Wb is cut. Thereby, the cutting amount of the cutting groove Wb becomes (f1 + f2 + f3 + f4 + f5), and the cutting groove Wb having a desired depth D is formed on the workpiece W. Similarly, by performing a series of steps from step ST1 to step ST7 and from step ST10 to step ST12 for other scheduled division lines, a plurality of desired workpieces W can be formed on the workpiece W. A cutting groove Wb having a depth D is formed.

  As described above, according to the cutting method of the cutting apparatus 1 according to the present embodiment, when the wear amount m measured in the wear amount measurement step exceeds the regulated cut amount K, the bottom of the cutting groove Wb is cut with the cut amount S1. In addition to the repetition step of cutting Wc, a cutting amount setting step for setting the cutting amount S3 and a cutting groove forming step for cutting the bottom Wc of the cutting groove Wb with the cutting amount S3 are performed. The shortage (m-S3) that is insufficient for the depth D is cut and compensated. That is, in the cutting method of the cutting apparatus 1 according to the present embodiment, since the wear amount m is not added to the cut amount S1 and the cutting groove Wb is not cut from the repetition step to the finishing step, the cut amount is the wear amount m. There is no increase in minutes. That is, since the cutting amount does not increase by the wear amount m, the workpiece W can be cut in multiple stages while suppressing an excessive load on the cutting blade 21a of the cutting blade 21.

  In the second embodiment, when the wear of the cutting blade 21 is greatly advanced, for example, after the execution of step 11, the wear amount m is at least twice the regulation cut amount K (that is, m ≧ (K × 2)). If there is, it may be cut again with the cut amount S3 as the regulated cut amount K (S3 = K).

  In the above embodiment, the cutting apparatus 1 is a dicer having one spindle, but may be a dicer having two spindles, a so-called dual dicer (for example, a facing dicer or a parallel dual dicer).

  Moreover, in the said embodiment, although the cutting groove Wb is formed in the division | segmentation scheduled line of the workpiece W, the division | segmentation scheduled line of the workpiece W is cut | divided in multiple steps, and it divides | segments into each device (what is called a full cut). May be. As a result, even when the workpiece W is fully cut, it is possible to prevent an excessive load from being applied to the cutting blade 21 when the division schedule line of the workpiece W is cut in multiple stages.

  In the first embodiment, the wear amount m measured in the wear amount measuring step is set as the cut amount in the finishing step. For example, the wear amount m of the cutting blade 21 is set as in the second embodiment. If it is so large that it cannot be ignored, the wear amount (wear level) of the cutting blade 21 with respect to the cut amount is calculated from the correlation between the cut amount and the wear amount of the cutting blade 21, and the cut amount is compensated with the calculated wear amount. Thus, the cutting groove Wb can be accurately formed at the desired depth D in the finishing step. Here, if the step of measuring the wear amount is after the cutting groove forming step, the amount of wear of the cutting blade 21 with respect to the cutting depth can be measured. Can be done during implementation. That is, the execution of the step of measuring the amount of wear may be performed anywhere after the first cutting.

  In the above embodiment, the wear amount m of the cutting blade 21 is measured after the total value of the cut amount S1 reaches the desired depth D value, but the total value of the cut amount S1 is the desired depth. The amount of wear of the cutting blade 21 may be measured before reaching the value D. In this case, it is possible to calculate and set the cut amount in the finishing step by calculating the wear amount worn by one cutting from the measured wear amount.

  In the above embodiment, it is determined whether or not the total value of the cutting depth S1 has reached the desired depth D. However, the Z-axis position detection scale (not shown) of the cutting feed means 60 and the Z-axis are not shown. The determination may be made based on whether or not the Z-axis position detected by the position detection sensor has reached the desired depth D. Thereby, the cutting amount S1 can be directly detected.

In the above-described embodiment, sapphire (Al 2 _{O 3)} substrate, silicon carbide (SiC) substrate, a ceramic or a metal substrate, by cutting by a cutting device 1 for glass, the cutting blade 21 undue Although it is possible to cut multiple stages while suppressing the load, it is also applicable to ductile materials such as semiconductor wafers, optical device wafers, inorganic material substrates, resins, etc., which are based on silicon, gallium arsenide (GaAs), etc. Similarly, multistage cutting is possible.

DESCRIPTION OF SYMBOLS 1 Cutting device 10 Chuck table 20 Cutting means 21 Cutting blade 21a Cutting blade 40 Processing feed means 60 Cutting feed means 80 Measuring means W Workpiece Wa Surface Wb Cutting groove Wc Bottom D Desired depth K Controlled cutting amount (controlled Cutting amount)
S1, S2, S3, S4 Cut amount (set cut amount)
m Wear amount

Claims (3)

A chuck table for holding a workpiece, a cutting means having a cutting blade having a cutting blade for cutting the workpiece held by the chuck table on its outer periphery, and the chuck table and the cutting means Machining feed means for relatively machining and feeding, cutting feed means for cutting and feeding the cutting blade of the cutting blade in a direction orthogonal to the machining feed direction, and measuring means for measuring the amount of wear of the cutting blade of the cutting blade A cutting method of forming a cutting groove having a desired depth in a workpiece whose cutting amount is regulated, using a cutting device configured at least from
A cutting amount setting step of setting the cutting amount by operating the cutting feeding means within a range not exceeding the regulation of the cutting amount;
A cutting groove forming step of forming a cutting groove on the surface of the workpiece by operating the processing feeding means with the cutting blade having a cutting blade positioned at a cutting amount set from the surface of the workpiece;
A repetition step of repeating the cutting amount setting step and the cutting groove forming step until a total value of the set cutting amounts reaches a desired depth value;
After performing the repeating step, a wear amount measuring step of measuring the wear amount of the cutting blade of the cutting blade by operating the measuring means;
A finishing step of operating the cutting feed means to set the amount of wear as a cutting amount and cutting the bottom of the cutting groove formed by performing the repeating step;
A cutting method composed at least of. When the wear amount measured by the wear amount measurement step exceeds a regulated cut amount, in addition to the repetitive step, the cut amount setting step and the cutting groove forming step are performed,
The cut amount set in the finishing step is an amount obtained by removing the cut amount set in the cut amount setting step performed after the repetition step from the wear amount measured in the wear amount measuring step. The cutting method according to claim 1, wherein the cutting method is characterized.   The cutting method according to claim 1 or 2, wherein the workpiece is cut by a cutting groove having a desired depth.

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