JP6056934B2 - 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 - Google Patents

発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 Download PDF

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Publication number
JP6056934B2
JP6056934B2 JP2015200794A JP2015200794A JP6056934B2 JP 6056934 B2 JP6056934 B2 JP 6056934B2 JP 2015200794 A JP2015200794 A JP 2015200794A JP 2015200794 A JP2015200794 A JP 2015200794A JP 6056934 B2 JP6056934 B2 JP 6056934B2
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Prior art keywords
emitting device
lead
lead frame
light emitting
resin
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JP2015200794A
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Japanese (ja)
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JP2016029732A (ja
JP2016029732A5 (https=
Inventor
博史 市川
博史 市川
林　正樹
林　　正樹
慎平 笹岡
慎平 笹岡
三木　倫英
倫英 三木
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Nichia Corp
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Nichia Corp
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Priority to JP2015200794A priority Critical patent/JP6056934B2/ja
Publication of JP2016029732A publication Critical patent/JP2016029732A/ja
Publication of JP2016029732A5 publication Critical patent/JP2016029732A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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JP2015200794A 2015-10-09 2015-10-09 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 Active JP6056934B2 (ja)

Priority Applications (1)

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JP2015200794A JP6056934B2 (ja) 2015-10-09 2015-10-09 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法

Applications Claiming Priority (1)

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JP2015200794A JP6056934B2 (ja) 2015-10-09 2015-10-09 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法

Related Parent Applications (1)

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JP2014081908A Division JP5825390B2 (ja) 2014-04-11 2014-04-11 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法

Related Child Applications (1)

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JP2016237775A Division JP6164355B2 (ja) 2016-12-07 2016-12-07 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法

Publications (3)

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JP2016029732A JP2016029732A (ja) 2016-03-03
JP2016029732A5 JP2016029732A5 (https=) 2016-10-27
JP6056934B2 true JP6056934B2 (ja) 2017-01-11

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ID=55435484

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JP2015200794A Active JP6056934B2 (ja) 2015-10-09 2015-10-09 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法

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JP (1) JP6056934B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019059703A2 (ko) * 2017-09-22 2019-03-28 엘지이노텍 주식회사 발광소자 패키지 및 조명 모듈
US10873015B2 (en) 2018-03-01 2020-12-22 Nichia Corporation Light emitting device and method of manufacturing the light emitting device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100533723C (zh) * 2002-08-05 2009-08-26 奥斯兰姆奥普托半导体有限责任公司 电引线架的制造方法,表面安装的半导体器件的制造方法和引线架带
US6879040B2 (en) * 2002-09-18 2005-04-12 Agilent Technologies, Inc. Surface mountable electronic device
JP5232369B2 (ja) * 2006-02-03 2013-07-10 日立化成株式会社 光半導体素子搭載用パッケージ基板の製造方法およびこれを用いた光半導体装置の製造方法
JP5168152B2 (ja) * 2006-12-28 2013-03-21 日亜化学工業株式会社 発光装置

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JP2016029732A (ja) 2016-03-03

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