JP2016029732A5 - - Google Patents
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- Publication number
- JP2016029732A5 JP2016029732A5 JP2015200794A JP2015200794A JP2016029732A5 JP 2016029732 A5 JP2016029732 A5 JP 2016029732A5 JP 2015200794 A JP2015200794 A JP 2015200794A JP 2015200794 A JP2015200794 A JP 2015200794A JP 2016029732 A5 JP2016029732 A5 JP 2016029732A5
- Authority
- JP
- Japan
- Prior art keywords
- emitting device
- lead
- lead frame
- light emitting
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 30
- 239000011347 resin Substances 0.000 claims 30
- 238000004519 manufacturing process Methods 0.000 claims 12
- 238000007789 sealing Methods 0.000 claims 6
- 239000000463 material Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 238000000926 separation method Methods 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 150000003918 triazines Chemical class 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015200794A JP6056934B2 (ja) | 2015-10-09 | 2015-10-09 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015200794A JP6056934B2 (ja) | 2015-10-09 | 2015-10-09 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014081908A Division JP5825390B2 (ja) | 2014-04-11 | 2014-04-11 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016237775A Division JP6164355B2 (ja) | 2016-12-07 | 2016-12-07 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016029732A JP2016029732A (ja) | 2016-03-03 |
| JP2016029732A5 true JP2016029732A5 (https=) | 2016-10-27 |
| JP6056934B2 JP6056934B2 (ja) | 2017-01-11 |
Family
ID=55435484
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015200794A Active JP6056934B2 (ja) | 2015-10-09 | 2015-10-09 | 発光装置、樹脂パッケージ、樹脂成形体並びにこれらの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6056934B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019059703A2 (ko) * | 2017-09-22 | 2019-03-28 | 엘지이노텍 주식회사 | 발광소자 패키지 및 조명 모듈 |
| US10873015B2 (en) | 2018-03-01 | 2020-12-22 | Nichia Corporation | Light emitting device and method of manufacturing the light emitting device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100533723C (zh) * | 2002-08-05 | 2009-08-26 | 奥斯兰姆奥普托半导体有限责任公司 | 电引线架的制造方法,表面安装的半导体器件的制造方法和引线架带 |
| US6879040B2 (en) * | 2002-09-18 | 2005-04-12 | Agilent Technologies, Inc. | Surface mountable electronic device |
| JP5232369B2 (ja) * | 2006-02-03 | 2013-07-10 | 日立化成株式会社 | 光半導体素子搭載用パッケージ基板の製造方法およびこれを用いた光半導体装置の製造方法 |
| JP5168152B2 (ja) * | 2006-12-28 | 2013-03-21 | 日亜化学工業株式会社 | 発光装置 |
-
2015
- 2015-10-09 JP JP2015200794A patent/JP6056934B2/ja active Active
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