JP6050959B2 - Adhesive sheet and method for producing adhesive sheet - Google Patents

Description

  The present invention relates to an adhesive sheet and a method for producing the adhesive sheet.

Conventionally, for example, a protective member (adhesive sheet) to be attached to a semiconductor wafer on which bumps are formed (hereinafter sometimes referred to as “wafer”) is known (see, for example, Patent Document 1).
The protective member of Patent Document 1 includes an outer peripheral sticking portion that is attached to an outer peripheral region of a wafer on which no bumps are formed, a bump protective portion that is surrounded by the outer peripheral sticking portion to support and protect the bumps, and an outer peripheral sticking. And a concave portion formed by the bump protection portion, and all the bumps are accommodated in the concave portion so that a part of the adhesive does not remain in the bump.

JP 2005-109433 A

  By the way, when a protective member such as Patent Document 1 is attached to a wafer on which a pattern such as a bump or a circuit is formed, for example, it is necessary to align the region where the pattern is formed with the concave portion. In order to identify the recess, it is difficult to distinguish between the outer peripheral adhesive part and the bump protective part, and the sensor for specifying the boundary between the outer peripheral adhesive part and the bump protective part. It was necessary to increase the threshold and the accuracy of image processing. However, there is a limit to the adjustment of the threshold value and accuracy, and if the threshold value and accuracy are increased too much, noise is easily identified, and there is a problem that it is difficult to specify the exact position of the recess.

  The objective of this invention is providing the manufacturing method of the adhesive sheet and adhesive sheet which can pinpoint the exact position of the adhesive sheet with respect to a to-be-adhered body.

In order to achieve the above object, the adhesive sheet of the present invention is an adhesive sheet in which a transparent or translucent substrate sheet is provided on one surface of an adhesive layer, and the adhesive layer has a predetermined A processing unit that has been subjected to processing is provided, between the adhesive layer and the base sheet, and outside the processing unit, with a predetermined direction based on a predetermined position of the processing unit, And the specific part which specifies the position of the said process part in the position separated by predetermined distance is provided , and the identification process for identifying the said specific part is performed to the said base sheet side surface of the said specific part. Is adopted.

On the other hand, the method for manufacturing an adhesive sheet of the present invention is a method for manufacturing an adhesive sheet capable of forming an adhesive sheet provided with a specific portion for specifying the position of a processing portion that has been subjected to a predetermined process, and is a strip-like release sheet forms a step of preparing a raw, which is temporarily attached to one surface of a strip-shaped adhesive layer, a first cut is reached in the adhesive layer from the release sheet side, surrounded by the first cut A step of forming the specific portion inside the formed region , a step of peeling the release sheet other than the specific portion from the adhesive layer, a predetermined direction with reference to a predetermined position of the specific portion, and A step of forming a treatment portion on the adhesive layer at a predetermined distance, and a transparent or semi-transparent substrate sheet is affixed to the one surface of the adhesive layer exposed by peeling the release sheet The process of having the process to do is employ | adopted.

  According to the present invention as described above, since the specific part is provided between the adhesive layer and the transparent or translucent base sheet and outside the processing part, without increasing the threshold value of the sensor or the accuracy of the image processing. The specific part can be easily detected, and the position of the processing part can be accurately specified when the adhesive sheet is attached to the adherend. Compared with the case where a specific part is provided by applying a label or marking on the front or back surface of the adhesive sheet, the adhesive sheet can be removed without causing the label to be displaced during printing of the adhesive sheet or to be thinned by printing. The position of the processing unit when pasting on the adherend can be accurately specified.

  At this time, if the identification process is performed on the surface of the specific part facing the base sheet, the specific part can be detected more easily depending on the presence or absence of the identification process.

  Furthermore, according to the manufacturing method of the adhesive sheet of the present invention, the specific portion is provided between the adhesive layer and the transparent or translucent base sheet and outside the processing portion while keeping the distance between the processing portion and the specific portion constant. Can be reliably formed.

(A) is a top view of the original fabric which concerns on one Embodiment of this invention, (B) is X arrow sectional drawing of (A). (A)-(E) are explanatory drawings of the manufacturing method of an original fabric. (A) (B) is a figure explaining the position detection procedure of an adhesive sheet.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
First, the raw fabric RS as an adhesive sheet will be described. In FIG. 1, an original fabric RS is temporarily attached to an adhesive sheet AS in which a transparent or translucent base sheet BS is provided on one surface AD1 of the adhesive layer AD, and the other surface AD2 of the adhesive layer AD. And a second release sheet RL2. The adhesive layer AD of the adhesive sheet AS is provided with an opening AS1 as a processing part from which the adhesive layer AD as a predetermined process has been removed, and between the adhesive layer AD and the base sheet BS, and A specifying unit AS2 is provided that specifies the position of the opening AS1 outside the opening AS1, in a predetermined direction and at a predetermined distance from the predetermined position of the opening AS1.

Further, the surface of the specific portion AS2 on the base sheet BS side is roughened by forming irregularities that scatter visible light, and as identification processing for identifying the specific portion AS2 and the adhesive layer AD. Matte treatment is applied.
Examples of the mat processing method include sand mat processing, mat coating processing, and kneading mat processing. The surface roughness of the mat treatment is not particularly limited as long as it is within a range in which a detection means such as an existing optical sensor or CCD camera can easily distinguish between the mat treatment surface and the base sheet BS, It can be appropriately changed depending on the detection capability of the detection means used.

Next, the manufacturing method of original fabric RS is demonstrated.
In manufacturing the raw fabric RS, as shown in FIG. 2 (A), the back surface of the first release sheet RL1 as a strip-shaped release sheet whose surface is matted is one surface of the strip-shaped adhesive layer AD. An original fabric RS0 that is temporarily attached to AD1 and temporarily attached to the second release sheet RL2 is prepared. Then, as shown by a solid line in FIG. 2 (A), the first cut forming means 11 forms the first cut CU1 reaching the adhesive layer AD from the surface side of the first release sheet RL1, and the first cut The specific part AS2 is formed inside the embedded CU1.

Next, as shown in FIG. 2B, the roller 13 as the first peeling means peels the first release sheet RL1 other than the specific portion AS2 from the one surface AD1 of the adhesive layer AD, so that a predetermined interval is obtained. One surface AD1 of the adhesive layer AD provided with the specific portion AS2 is exposed.
Next, as shown in FIG. 2C, between the adjacent specific portions AS2, in the longitudinal direction of the strip-shaped adhesive layer AD with a predetermined distance from the center of the specific portion AS2 as a reference. The second cut forming means 12 forms a second cut CU2 that reaches the second release sheet RL2 from the one surface AD1 side of the adhesive layer AD, inside the second cut CU2 and outside the specific part AS2. A circular unnecessary adhesive layer AD0 corresponding to the opening AS1 is formed.
Then, as shown in FIG. 2D, the second peeling means 14 sucks the unnecessary adhesive layer AD0 and peels it from the second peeling sheet RL2, thereby forming the opening AS1.
Thereafter, by repeating the same operation as described above, the specific portion AS2 and the opening portion AS1 are formed at predetermined intervals.
Next, as shown in FIG. 2 (E), the roller 15 as a sticking means sticks the base sheet BS on one surface AD1 of the adhesive layer AD that is peeled off and exposed from the first release sheet RL1. Thus, the raw fabric RS can be formed.

Next, a method for calculating the feeding position of the adhesive sheet AS will be described with reference to FIG.
The feeding position calculation method is substantially the same as that disclosed in Japanese Patent Application No. 2011-071693 filed by the present applicant. Accordingly, the following description will be given schematically and detailed description will be omitted.

First, at the time before the feeding of the adhesive sheet AS is completed, the control means identifies the first and second reference marks SP1 and SP2 provided on the peeling plate 41, and the intermediate point connecting them is a virtual reference mark SP0. Remember as. Further, the distance between the first and second reference signs SP1 and SP2 stored in advance in the control means is digitized, and a reference for outputting the deviation amount as a numerical value is calculated. Next, as shown in FIG. 3A, when the adhesive sheet AS is fed out, the control unit drives an imaging device (not shown) to image the adhesive sheet AS from the base sheet side. And the 1st, 2nd specific part AS21, AS22 provided mutually separated along the orthogonal direction B orthogonal to the feeding direction A between the opening parts AS1 adjacent to the feeding direction A was identified, and these were connected. An intermediate point is memorize | stored as virtual specific part AS20. Here, since the mat processing is performed on the surface of the first and second specific parts AS21 and AS22 facing the base sheet BS, the first and second specific parts AS21 and AS22 can be easily detected. .
Then, based on the calculated deviation amount along the feeding direction A and the orthogonal direction B between the virtual reference sign SP0 and the virtual identification part AS20, the control means detects the relative position between the peeling means and the adhesive sheet AS. At this time, as shown in FIG. 3B, when the adhesive sheet AS is fed out while being inclined in the feeding direction A, the straight line connecting the first and second specifying portions AS21 and AS22 and the first and first The inclination θ with respect to the straight line connecting the two reference signs SP1 and SP2 is calculated, and the control means detects the relative rotation angle between the peeling means and the adhesive sheet AS based on the inclination θ. Then, based on the detected relative position and relative rotation angle between the peeling means and the adhesive sheet AS, and the known distance from the virtual specific part AS20 to the virtual center point DC that is the center of the opening part AS1, the control means performs a virtual reference. The position of the virtual center point DC with respect to the sign SP0, that is, the feeding position of the adhesive sheet AS is calculated.

  According to the embodiment as described above, since the specifying part AS2 for specifying the position of the opening AS1 is provided on the adhesive sheet AS, the position of the opening AS1 can be accurately specified when the adhesive sheet AS is attached to the wafer. .

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, the identification process for identifying the specific unit AS2 is not limited to the mat process, and may be a corona process that is a process in which irregular reflection of light occurs. Moreover, the coloring process by printing etc. may be sufficient and the 1st peeling sheet colored beforehand may be utilized. Furthermore, the identification process may be performed on both surfaces of the specific part AS2, or a first release sheet that has been previously subjected to the identification process may be used.
Further, the adhesive layer AD may be transparent or translucent.
Furthermore, the shape of the opening AS1 as the processing unit may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or a geometric pattern.
In addition, the processing unit is not limited to the opening AS1, for example, using an adhesive layer AD that cures the adhesive by irradiating ultraviolet rays, and irradiating the ultraviolet rays to partially adhere to the adhesive layer AD. It may be a process of weakening or eliminating.
Furthermore, when the second release sheet RL2 is not provided, the second cut CU2 may be formed from the other surface AD2 side, and the opening AS1 may be formed inside the second cut CU2.

Further, four specific portions AS2 surrounding the opening AS1 may be provided, and an intersection of the specific portions AS2 located on the diagonal lines connected in an X shape may be set as the center of the opening AS1.
Furthermore, as a method of using the specific part AS2, it can be applied to any method that requires the detection of the opening AS1, for example, the raw fabric RS is cut between the openings AS1 based on the detection result of the specific part AS2, You may apply to the method of manufacturing the sheet-like adhesive sheet AS. Further, the sheet-like adhesive sheet AS may or may not include the specific part AS2, but when the specific part AS2 is included, by using the same position detection method as in the above embodiment, The sheet-like adhesive sheet AS can be attached to the wafer without being displaced.

  Further, the type and material of the adhesive sheet AS in the present invention are not particularly limited, and examples thereof include those having a transparent or translucent intermediate layer provided between the base sheet BS and the adhesive layer AD, and others. Three or more layers such as having a transparent or translucent layer may be used. The semiconductor wafer can be exemplified by a silicon semiconductor wafer, a compound semiconductor wafer, and the like. The adhesive sheet to be attached to such a semiconductor wafer is not limited to a protective sheet, dicing tape, and die attach film, but any other sheet or film. A sheet having an arbitrary use and shape such as a tape can be applied. Further, the adherend may be an optical disk substrate, and the adhesive sheet may have a resin layer constituting the recording layer. Moreover, as a to-be-adhered body, not only a glass plate, a steel plate, a resin plate, a board | substrate etc., and other members but the member, articles | goods, etc. of arbitrary forms can also be made into object. Furthermore, it is also possible to target a wafer in which a pattern circuit is formed on the surface of the wafer.

AD ... Adhesive layer AS ... Adhesive sheet AS1 ... Opening (treatment part)
AS2 ... specific part BS ... base material sheet CU1, CU2 ... first and second cuts RL1 ... first release sheet RS0 ... raw fabric (adhesive sheet)

Claims (2)

An adhesive sheet in which a transparent or translucent base sheet is provided on one surface of the adhesive layer,
The adhesive layer is provided with a processing portion that has been subjected to a predetermined processing,
The processing is performed between the adhesive layer and the base sheet and outside the processing unit in a predetermined direction and a predetermined distance with respect to a predetermined position of the processing unit. A specific part that specifies the position of the part is provided,
An identification sheet for performing identification processing for identifying the specific part on a surface of the specific part on the base sheet side. A method for producing an adhesive sheet capable of forming an adhesive sheet provided with a specific part for specifying a position of a processing part subjected to a predetermined process,
A step of preparing an original fabric in which a strip-shaped release sheet is temporarily attached to one surface of the strip-shaped adhesive layer;
A step of forming the peeling off the first cut is reached in the adhesive layer is formed from a sheet side, the specific portion inside the region surrounded by the first cut,
Peeling the release sheet other than the specific part from the adhesive layer;
Forming a treatment portion in an adhesive layer at a predetermined direction and a predetermined distance with reference to a predetermined position of the specific portion; and
And a step of sticking a transparent or translucent substrate sheet on the one surface of the adhesive layer that is exposed by peeling the release sheet.

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