JP6041933B2 - 熱硬化性樹脂シート及び電子部品パッケージの製造方法 - Google Patents

熱硬化性樹脂シート及び電子部品パッケージの製造方法 Download PDF

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Publication number
JP6041933B2
JP6041933B2 JP2015121164A JP2015121164A JP6041933B2 JP 6041933 B2 JP6041933 B2 JP 6041933B2 JP 2015121164 A JP2015121164 A JP 2015121164A JP 2015121164 A JP2015121164 A JP 2015121164A JP 6041933 B2 JP6041933 B2 JP 6041933B2
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Japan
Prior art keywords
thermosetting resin
resin sheet
electronic component
manufacturing
thermosetting
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JP2015121164A
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English (en)
Japanese (ja)
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JP2015178635A5 (https=
JP2015178635A (ja
Inventor
剛 鳥成
剛 鳥成
豊田　英志
英志 豊田
祐作 清水
祐作 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
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Priority to JP2015121164A priority Critical patent/JP6041933B2/ja
Publication of JP2015178635A publication Critical patent/JP2015178635A/ja
Publication of JP2015178635A5 publication Critical patent/JP2015178635A5/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Processes Of Treating Macromolecular Substances (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2015121164A 2012-11-29 2015-06-16 熱硬化性樹脂シート及び電子部品パッケージの製造方法 Active JP6041933B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015121164A JP6041933B2 (ja) 2012-11-29 2015-06-16 熱硬化性樹脂シート及び電子部品パッケージの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012261384 2012-11-29
JP2012261384 2012-11-29
JP2015121164A JP6041933B2 (ja) 2012-11-29 2015-06-16 熱硬化性樹脂シート及び電子部品パッケージの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013240591A Division JP5943898B2 (ja) 2012-11-29 2013-11-21 熱硬化性樹脂シート及び電子部品パッケージの製造方法

Publications (3)

Publication Number Publication Date
JP2015178635A JP2015178635A (ja) 2015-10-08
JP2015178635A5 JP2015178635A5 (https=) 2015-11-19
JP6041933B2 true JP6041933B2 (ja) 2016-12-14

Family

ID=54262890

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JP2015121164A Active JP6041933B2 (ja) 2012-11-29 2015-06-16 熱硬化性樹脂シート及び電子部品パッケージの製造方法

Country Status (1)

Country Link
JP (1) JP6041933B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10600748B2 (en) 2016-06-20 2020-03-24 Samsung Electronics Co., Ltd. Fan-out semiconductor package
KR102441766B1 (ko) 2017-04-28 2022-09-07 쇼와덴코머티리얼즈가부시끼가이샤 봉지용 필름 및 봉지 구조체, 및 이들의 제조 방법
CN116888714A (zh) 2021-02-01 2023-10-13 长濑化成株式会社 电子部件安装基板的密封方法及热固化性片材
WO2024024883A1 (ja) 2022-07-29 2024-02-01 ナガセケムテックス株式会社 モールドアンダーフィル封止用シートおよびこれを用いる電子部品実装基板の封止方法
JP2024019874A (ja) * 2022-08-01 2024-02-14 信越ポリマー株式会社 ドライフィルム、発光型電子部品、及び発光型電子部品の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3796648B2 (ja) * 1999-04-15 2006-07-12 信越化学工業株式会社 エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置
JP4754185B2 (ja) * 2004-05-27 2011-08-24 リンテック株式会社 半導体封止用樹脂シートおよびこれを用いた半導体装置の製造方法
JP5180162B2 (ja) * 2009-08-05 2013-04-10 日東電工株式会社 電子部品封止用シート状エポキシ樹脂組成物およびそれにより得られた電子部品装置集合体ならびに電子部品装置
JP5385247B2 (ja) * 2010-12-03 2014-01-08 信越化学工業株式会社 ウエハモールド材及び半導体装置の製造方法
JP5666335B2 (ja) * 2011-02-15 2015-02-12 日東電工株式会社 保護層形成用フィルム

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JP2015178635A (ja) 2015-10-08

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