JP6041063B1 - フラックス - Google Patents
フラックス Download PDFInfo
- Publication number
- JP6041063B1 JP6041063B1 JP2016069033A JP2016069033A JP6041063B1 JP 6041063 B1 JP6041063 B1 JP 6041063B1 JP 2016069033 A JP2016069033 A JP 2016069033A JP 2016069033 A JP2016069033 A JP 2016069033A JP 6041063 B1 JP6041063 B1 JP 6041063B1
- Authority
- JP
- Japan
- Prior art keywords
- resin
- amino acid
- added
- flux
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 230000004907 flux Effects 0.000 title claims abstract description 54
- 229920005989 resin Polymers 0.000 claims abstract description 104
- 239000011347 resin Substances 0.000 claims abstract description 104
- 235000008206 alpha-amino acids Nutrition 0.000 claims abstract description 21
- 150000001576 beta-amino acids Chemical class 0.000 claims abstract description 18
- 150000001371 alpha-amino acids Chemical class 0.000 claims abstract description 7
- 229940024606 amino acid Drugs 0.000 claims description 20
- 150000001370 alpha-amino acid derivatives Chemical class 0.000 claims description 14
- 235000001014 amino acid Nutrition 0.000 claims description 14
- 150000001413 amino acids Chemical class 0.000 claims description 14
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 10
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 239000004471 Glycine Substances 0.000 claims description 5
- 229940000635 beta-alanine Drugs 0.000 claims description 5
- CKLJMWTZIZZHCS-REOHCLBHSA-N L-aspartic acid Chemical compound OC(=O)[C@@H](N)CC(O)=O CKLJMWTZIZZHCS-REOHCLBHSA-N 0.000 claims description 4
- 235000003704 aspartic acid Nutrition 0.000 claims description 3
- OQFSQFPPLPISGP-UHFFFAOYSA-N beta-carboxyaspartic acid Natural products OC(=O)C(N)C(C(O)=O)C(O)=O OQFSQFPPLPISGP-UHFFFAOYSA-N 0.000 claims description 3
- MTCFGRXMJLQNBG-REOHCLBHSA-N (2S)-2-Amino-3-hydroxypropansäure Chemical compound OC[C@H](N)C(O)=O MTCFGRXMJLQNBG-REOHCLBHSA-N 0.000 claims description 2
- DCXYFEDJOCDNAF-UHFFFAOYSA-N Asparagine Natural products OC(=O)C(N)CC(N)=O DCXYFEDJOCDNAF-UHFFFAOYSA-N 0.000 claims description 2
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 claims description 2
- QNAYBMKLOCPYGJ-REOHCLBHSA-N L-alanine Chemical compound C[C@H](N)C(O)=O QNAYBMKLOCPYGJ-REOHCLBHSA-N 0.000 claims description 2
- DCXYFEDJOCDNAF-REOHCLBHSA-N L-asparagine Chemical compound OC(=O)[C@@H](N)CC(N)=O DCXYFEDJOCDNAF-REOHCLBHSA-N 0.000 claims description 2
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 claims description 2
- ZDXPYRJPNDTMRX-VKHMYHEASA-N L-glutamine Chemical compound OC(=O)[C@@H](N)CCC(N)=O ZDXPYRJPNDTMRX-VKHMYHEASA-N 0.000 claims description 2
- MTCFGRXMJLQNBG-UHFFFAOYSA-N Serine Natural products OCC(N)C(O)=O MTCFGRXMJLQNBG-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 235000004279 alanine Nutrition 0.000 claims description 2
- 235000009582 asparagine Nutrition 0.000 claims description 2
- 229960001230 asparagine Drugs 0.000 claims description 2
- 235000013922 glutamic acid Nutrition 0.000 claims description 2
- 239000004220 glutamic acid Substances 0.000 claims description 2
- ZDXPYRJPNDTMRX-UHFFFAOYSA-N glutamine Natural products OC(=O)C(N)CCC(N)=O ZDXPYRJPNDTMRX-UHFFFAOYSA-N 0.000 claims description 2
- 235000004554 glutamine Nutrition 0.000 claims description 2
- 235000004400 serine Nutrition 0.000 claims description 2
- 230000009477 glass transition Effects 0.000 abstract description 28
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 40
- 230000000052 comparative effect Effects 0.000 description 23
- 230000008719 thickening Effects 0.000 description 21
- 125000003277 amino group Chemical group 0.000 description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 10
- 238000005476 soldering Methods 0.000 description 10
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- 239000012190 activator Substances 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 150000007524 organic acids Chemical class 0.000 description 6
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 229960005261 aspartic acid Drugs 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 3
- 125000002883 imidazolyl group Chemical group 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000000113 differential scanning calorimetry Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- BTCSSZJGUNDROE-UHFFFAOYSA-N gamma-aminobutyric acid Chemical compound NCCCC(O)=O BTCSSZJGUNDROE-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- CKLJMWTZIZZHCS-UHFFFAOYSA-N D-OH-Asp Natural products OC(=O)C(N)CC(O)=O CKLJMWTZIZZHCS-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- CKLJMWTZIZZHCS-UWTATZPHSA-N L-Aspartic acid Natural products OC(=O)[C@H](N)CC(O)=O CKLJMWTZIZZHCS-UWTATZPHSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- 229960002684 aminocaproic acid Drugs 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000006114 decarboxylation reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical class OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229960003692 gamma aminobutyric acid Drugs 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
(a)評価方法
室温下(25℃)に実施例、比較例のフラックスを保管し、加速試験を行った。初期、5時間後、18時間後の粘度を測定して、初期値を100%とした場合の増粘率を算出した。
(b)判断基準
○:樹脂と硬化剤のみを添加した参照例の増粘率を閾値として、5時間後の増粘率については138%以下、18時間後の増粘率については378%以下であった。
×:樹脂と硬化剤のみを添加した参照例の増粘率を閾値として、5時間後の増粘率については138%超、18時間後の増粘率については378%超であった。
(2)フラックスのガラス転移点の検証について
(a)評価方法
DSC(Differential Scanning Calorimetry、示差走査熱量分析)にて、実施例及び比較例のフラックスのガラス転移点を、N2雰囲気において25℃から300℃への昇温を、昇温速度を20℃/minとして行って測定した。
(b)判断基準
○:樹脂と硬化剤のみを添加した参照例のガラス転移点を閾値として、ガラス転移点が140.3℃以上であった。
×:樹脂と硬化剤のみを添加した参照例のガラス転移点を閾値として、ガラス転移点が140.3℃未満であった。
Claims (2)
- α−アミノ酸とβ−アミノ酸のうち少なくとも1種と、熱硬化性樹脂を含み、熱硬化性樹脂が100重量部に対し、α−アミノ酸とβ−アミノ酸のうち少なくとも1種が1重量部以上〜30重量部以下で添加された
ことを特徴とするフラックス。 - 前記α−アミノ酸は、グリシン、アラニン、アスパラギン、アスパラギン酸、グルタミン、グルタミン酸、セリンであり、前記β−アミノ酸は、β−アラニンである
ことを特徴とする請求項1に記載のフラックス。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016069033A JP6041063B1 (ja) | 2016-03-30 | 2016-03-30 | フラックス |
TW106110744A TWI612088B (zh) | 2016-03-30 | 2017-03-30 | 助焊劑 |
PCT/JP2017/013226 WO2017170863A1 (ja) | 2016-03-30 | 2017-03-30 | フラックス |
US16/089,489 US20190091809A1 (en) | 2016-03-30 | 2017-03-30 | Flux |
KR1020187030888A KR101952086B1 (ko) | 2016-03-30 | 2017-03-30 | 플럭스 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016069033A JP6041063B1 (ja) | 2016-03-30 | 2016-03-30 | フラックス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6041063B1 true JP6041063B1 (ja) | 2016-12-07 |
JP2017177173A JP2017177173A (ja) | 2017-10-05 |
Family
ID=57483245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016069033A Active JP6041063B1 (ja) | 2016-03-30 | 2016-03-30 | フラックス |
Country Status (5)
Country | Link |
---|---|
US (1) | US20190091809A1 (ja) |
JP (1) | JP6041063B1 (ja) |
KR (1) | KR101952086B1 (ja) |
TW (1) | TWI612088B (ja) |
WO (1) | WO2017170863A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108274158A (zh) * | 2018-02-02 | 2018-07-13 | 安阳师范学院 | 免清洗助焊剂及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0318498A (ja) * | 1989-06-15 | 1991-01-28 | Senju Metal Ind Co Ltd | 水溶性はんだ付け用フラックス |
JPH0952195A (ja) * | 1995-08-11 | 1997-02-25 | Aoki Metal:Kk | はんだ付け用フラックス |
JP2003010997A (ja) * | 2001-06-29 | 2003-01-15 | Fuji Electric Co Ltd | ハンダ組成物 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4619715A (en) * | 1984-09-11 | 1986-10-28 | Scm Corporation | Fusible powdered metal paste |
JP2001007158A (ja) | 1999-06-25 | 2001-01-12 | Fujitsu Ltd | 半田バンプの接合方法及び半田バンプ接合体 |
JP2001219294A (ja) | 1999-12-03 | 2001-08-14 | Tdk Corp | 熱硬化性はんだ付け用フラックスおよびはんだ付け方法 |
JP3797990B2 (ja) * | 2003-08-08 | 2006-07-19 | 株式会社東芝 | 熱硬化性フラックス及びはんだペースト |
JP2008062253A (ja) * | 2006-09-05 | 2008-03-21 | Denso Corp | はんだ付け用フラックスおよびはんだペースト組成物 |
WO2015114798A1 (ja) * | 2014-01-31 | 2015-08-06 | 千住金属工業株式会社 | フラックスコートボール、はんだペースト、フォームはんだ及びはんだ継手 |
-
2016
- 2016-03-30 JP JP2016069033A patent/JP6041063B1/ja active Active
-
2017
- 2017-03-30 TW TW106110744A patent/TWI612088B/zh active
- 2017-03-30 WO PCT/JP2017/013226 patent/WO2017170863A1/ja active Application Filing
- 2017-03-30 KR KR1020187030888A patent/KR101952086B1/ko active IP Right Grant
- 2017-03-30 US US16/089,489 patent/US20190091809A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0318498A (ja) * | 1989-06-15 | 1991-01-28 | Senju Metal Ind Co Ltd | 水溶性はんだ付け用フラックス |
JPH0952195A (ja) * | 1995-08-11 | 1997-02-25 | Aoki Metal:Kk | はんだ付け用フラックス |
JP2003010997A (ja) * | 2001-06-29 | 2003-01-15 | Fuji Electric Co Ltd | ハンダ組成物 |
Also Published As
Publication number | Publication date |
---|---|
TW201736471A (zh) | 2017-10-16 |
JP2017177173A (ja) | 2017-10-05 |
KR101952086B1 (ko) | 2019-02-25 |
WO2017170863A1 (ja) | 2017-10-05 |
US20190091809A1 (en) | 2019-03-28 |
KR20180120279A (ko) | 2018-11-05 |
TWI612088B (zh) | 2018-01-21 |
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