JP6029813B2 - Suspension board with circuit - Google Patents

Description

  The present invention relates to a suspension board with circuit, and more particularly to a suspension board with circuit used for a hard disk drive.

  Conventionally, in order to finely adjust the position and angle of a magnetic head, it is known to provide a microactuator on a suspension board with circuit on which the magnetic head is mounted.

  For example, a head gimbal assembly including a tongue portion having a stage and a trace formed thereon, a head slider fixed to the stage, and a piezoelectric element provided in the tongue portion and rotatably supporting the stage. Has been proposed (see, for example, Patent Document 1).

  In the head gimbal assembly of Patent Document 1, the stage and the head slider are rotated by the expansion / contraction operation of the piezo element. The trace is routed so as to bypass the end of the head slider during rotation.

JP 2010-146631 A

  However, if the trace is disposed so as to bypass the head slider, it is difficult to reduce the size of the suspension board with circuit and the density of the trace.

  On the other hand, when the trace is arranged so as to overlap the head slider in the thickness direction, there is a problem that the end of the head slider rubs against the trace when the head slider rotates, and the trace is damaged.

  The object of the present invention is to enable the slider to be mounted so as to be movable relative to the conductor region, and to finely adjust the position and angle of the magnetic head, while achieving miniaturization and higher density of the conductor layer. It is another object of the present invention to provide a suspension board with circuit that can prevent a conductor layer from being damaged.

In order to achieve the above object, a suspension board with circuit of the present invention includes a mounting region for mounting a conductor region on which a conductor layer is formed and a slider for mounting a magnetic head electrically connected to the conductor layer. A suspension board with circuit, wherein the mounting area is mounted so that the slider can move relative to the conductor area, and the conductor area moves when the slider moves relative to the conductor area. And an anti-damage part for preventing damage to the counter area by the slider.

  According to this suspension board with circuit, the mounting area can be mounted so that the slider can move relative to the conductor area, and the position and angle of the magnetic head can be adjusted precisely.

  In addition, since the conductor region includes the opposing region, it is possible to reduce the size of the suspension board with circuit and increase the density of the conductor layer.

  Furthermore, since the suspension board with circuit includes a damage preventing portion, it is possible to prevent damage to the opposing region by the slider.

  In the suspension board with circuit of the present invention, it is preferable that the damage preventing portion is a separation portion that separates the slider that moves relative to the conductor region and the opposing region in the thickness direction. .

  In this suspension board with circuit, the slider and the opposed region are separated in the thickness direction by the separating portion, so that damage to the opposed region by the slider can be reliably prevented.

  In the suspension board with circuit of the present invention, it is preferable that the separation portion is a thin region that is thinner than the conductor region other than the opposing region.

  In this suspension board with circuit, since the thin region is thinner than the conductor region other than the opposing region, a sufficient distance in the thickness direction from the slider can be secured when the slider is relatively moved. Therefore, it is possible to more reliably prevent damage to the opposing area by the slider.

  Further, in the suspension board with circuit of the present invention, the mounting region has the slider mounted so that one end of the slider is fixed and the other end is movable relative to the conductor region, and the thin region is When projected in the thickness direction, it is preferable to face the other end of the slider during relative movement with respect to the conductor region.

  Further, in this suspension board with circuit, the conductor region covers a base insulating layer, the conductor layer formed on the base insulating layer, and the conductor layer on the base insulating layer. The insulating cover layer is formed, and the thickness of at least one layer selected from the group consisting of the insulating base layer, the conductive layer, and the insulating cover layer in the thin region is at least in the conductive region other than the facing region It is preferable that the thickness is smaller than that of the first layer.

  In the suspension board with circuit, it is preferable that the separating portion is a pedestal for supporting the slider so as to be relatively movable.

  According to the suspension board with circuit, the pedestal supports the slider so as to be relatively movable, so that the distance from the slider in the thickness direction can be secured when the slider is relatively moved. Therefore, it is possible to more reliably prevent damage to the opposing area by the slider.

  In the suspension board with circuit of the present invention, it is preferable that the pedestal is slidably in contact with the slider before and after relative movement of the slider.

  In this suspension board with circuit, the pedestal slidably contacts the slider before and after the relative movement of the slider, thereby ensuring a smooth relative movement of the slider, and thereby in the thickness direction between the opposed region and the slider. An interval can be ensured reliably.

  In the suspension board with circuit of the present invention, it is preferable that the pedestal is formed so as to extend along a moving direction of the slider.

  In this suspension board with circuit, since the pedestal is formed so as to extend along the moving direction of the slider, the moving slider is reliably supported, thereby ensuring a gap in the thickness direction between the facing region and the slider. Can be secured.

  In the suspension board with circuit of the present invention, the slider can be mounted so as to be movable relative to the conductor region, and the position and angle of the magnetic head can be precisely adjusted, and the size and density of the conductor layer can be increased. In addition, it is possible to prevent damage to the opposing region by the slider.

FIG. 1 shows a plan view of an embodiment (an embodiment in which a thin region is provided) of a suspension board with circuit of the present invention. FIG. 2 is an enlarged plan view of the gimbal portion of the suspension board with circuit shown in FIG. FIG. 3 is a cross-sectional view taken along line AA of the gimbal portion shown in FIG. FIG. 4 is a cross-sectional view taken along line BB of the gimbal portion shown in FIG. FIG. 5 is a plan view showing a state where the stage of the gimbal portion shown in FIG. 2 is swung. 6 shows a cross-sectional view of the state where the stage of the gimbal portion shown in FIG. 2 is swung. FIG. 7 is a process diagram for explaining a method of manufacturing a suspension board with circuit, where (a) is a process of preparing a metal support board, (b) is a process of preparing an insulating base layer, and (c). These are the process of forming a conductor layer, (d) shows the process of preparing a cover insulating layer, (e) shows the process of forming a board | substrate opening part. FIG. 8: shows sectional drawing of the thin part (mode provided with a thin cover part) of other embodiment of the suspension board | substrate with a circuit of this invention. FIG. 9 shows a cross-sectional view of a thin portion (an aspect including a thin cover portion and a thin base portion) of another embodiment of the suspension board with circuit of the present invention. FIG. 10 shows a cross-sectional view of a thin-walled portion (an embodiment including a thin-walled conductor portion) of another embodiment of the suspension board with circuit of the present invention. FIG. 11 is a cross-sectional view of a thin portion (an aspect including a thin conductor portion and a thin base portion) of another embodiment of the suspension board with circuit of the present invention. FIG. 12 shows a cross-sectional view of a thin portion (an aspect including a thin cover portion and a thin conductor portion) of another embodiment of the suspension board with circuit of the present invention. FIG. 13 shows a plan view of another embodiment (an aspect in which a pedestal is provided) of the suspension board with circuit of the present invention. FIG. 14 is a plan view of the gimbal portion of the suspension board with circuit shown in FIG. FIG. 15 shows a bottom view of the gimbal portion of the suspension board with circuit shown in FIG. FIG. 16 is a sectional view taken along line CC of the gimbal portion shown in FIGS. 14 and 15. FIG. 17 is a plan view of the gimbal portion shown in FIG. 14 and shows a plan view clearly showing the first base insulating layer. FIG. 18 is a bottom view of the gimbal portion shown in FIG. 15 and shows a bottom view clearly showing the second base insulating layer. 19A and 19B are process diagrams for explaining a method of manufacturing a suspension board with circuit, wherein FIG. 19A is a process of preparing a metal support board, and FIG. 19B is a process of forming a first base insulating layer. (C) shows the process of forming a 1st conductor pattern, (d) shows the process of forming a 1st cover insulating layer, (e) shows the process of forming a conduction | electrical_connection opening part in a metal support substrate. FIG. 20 is a process diagram for explaining the manufacturing method of the suspension board with circuit, following FIG. 19, wherein (f) is a process of forming the second base insulating layer, and (g) is the second conductor. The process of forming a pattern is shown. FIG. 21 is a process diagram for explaining the manufacturing method of the suspension board with circuit, following FIG. 20, wherein (h) is the process of forming the second cover insulating layer, and (i) is the substrate opening. And a step of forming a communication space. FIG. 22 is a plan view showing a state where the stage of the gimbal portion shown in FIG. 14 is swung. FIG. 23 is a sectional view showing a state where the stage of the gimbal portion shown in FIG. 16 is swung.

  FIG. 1 is a plan view of an embodiment of the suspension board with circuit of the present invention (an aspect in which a thin region is provided), FIG. 2 is an enlarged plan view of a gimbal portion of the suspension board with circuit shown in FIG. 4 is a cross-sectional view taken along lines AA and BB of the gimbal portion shown in FIG. 2, and FIGS. 5 and 6 are plan views showing a state where the stage of the gimbal portion shown in FIG. Sectional drawing and FIG. 7 show process drawing for demonstrating the manufacturing method of a suspension board with a circuit.

  1, 2, and 5, a base insulating layer 7 and a cover insulating layer 8 to be described later are omitted in order to clearly show a relative arrangement of a conductor layer 6 and a slider 26 to be described later.

  1 and 2, the suspension board with circuit 1 has a slider 26 (virtual line in FIG. 2 and solid line in FIG. 3) and a piezo element 23 on which a magnetic head 27 (FIG. 3) is mounted, and a hard disk drive. (Not shown).

  In the suspension board with circuit 1, the conductor layer 6 is supported on the metal support board 5.

  The metal support substrate 5 is formed in a substantially rectangular flat band shape in plan view extending in the longitudinal direction, and includes a main body portion 3 and a gimbal portion 4 formed on the front side of the main body portion 3 (one side in the longitudinal direction, hereinafter the same). Is integrated.

  The main body 3 is formed in a substantially rectangular shape in plan view.

  The gimbal part 4 is formed so as to extend from the front end of the main body part 3 to the front side. The gimbal portion 4 is formed with a substrate opening 11 having a substantially rectangular shape in plan view that penetrates the thickness direction.

  The gimbal portion 4 includes an outrigger portion 34 that is partitioned outside the width direction of the substrate opening 11 (a direction orthogonal to the front-rear direction), and a tongue portion 12 that is coupled to the outrigger portion 34.

  The outrigger portion 34 is formed so as to extend linearly from both ends in the width direction of the main body portion 3 toward the front side.

  As shown in FIG. 2, the tongue portion 12 is provided on the inner side in the width direction of the outrigger portion 34, and is connected to the outrigger portion via a first connecting portion 35 that extends obliquely rearward in the width direction from the tip portion of the outrigger portion 34. 34. The tongue portion 12 is formed in a substantially H shape in a plan view, and is disposed at a distance from the base portion 15 having a substantially rectangular shape in a plan view extending in the width direction and a front side of the base portion 15 and extending in the width direction. A stage 17 having a substantially rectangular shape in plan view, and a central part 16 having a substantially rectangular shape in plan view that is long in the front-rear direction are integrally connected to the base 15 and the center of the stage 17 in the width direction.

  The center in the width direction and the center in the front-rear direction of the stage 17 are a mounting area 28 where the slider 26 is mounted. Further, the stage 17 is connected to the outrigger portion 34 by the second connecting portion 20.

  The second connecting portion 20 is an E-shape that connects the tip of each outrigger portion 34, the bending portion 21 that connects both ends in the width direction of the stage 17 in a curved shape, the tip of each outrigger portion 34, and the tip of the stage 17. Part 22.

  The bending portion 21 extends in a curved shape from the front end of the outrigger portion 34 toward the diagonally inner side in the width direction, and reaches both ends of the stage 17 in the width direction.

  The E-shaped portion 22 is substantially E-shaped in plan view, and specifically, extends from the tip of both outrigger portions 34 toward the front side, then bends inward in the width direction, and extends inward in the width direction. After becoming one, it bends to the rear side and reaches the tip of the stage 17.

  The central portion 16 is formed with a narrow width that can be bent in the width direction.

  As shown in FIG. 1, the conductor layer 6 includes an external terminal 10, a head side terminal 18, a piezo tip side terminal 24 (FIG. 2), a piezo back side terminal 25 (FIG. 2), and a wiring 9. I have.

  A plurality of (six) external terminals 10 are provided at the rear end of the main body 3 and are spaced apart from each other in the front-rear direction.

  As shown in FIG. 2, the head-side terminals 18 are provided at the tip of the stage 17, and a plurality (four) of the head-side terminals 18 are arranged at intervals in the width direction.

  The piezo tip side terminals 24 are formed so as to protrude rearward from the rear end edge of the outer side portion of the stage 17 in the width direction, and a plurality (two) of the piezo tip side terminals 24 are arranged on both outer sides in the width direction of the central portion 16 with a space therebetween. Has been.

  Specifically, the piezo tip side terminal 24 is formed such that a wiring 9 (described later) at the rear end portion of the stage 17 protrudes from the rear end edge of the stage 17 toward the rear side and bulges in the width direction. ing. As will be described later, as shown in FIG. 3, the base insulation formed under the wiring 9 at the rear end portion of the stage 17 is provided at the peripheral end portion of the conductor layer 6 forming the piezoelectric tip side terminal 24. The layer 7 is continuously formed in a frame shape in plan view, and the conductor layer 6 falls into the frame of the insulating base layer 7.

  As shown in FIG. 2, the piezo rear side terminals 25 are formed corresponding to the piezo front side terminals 24, and are formed on the rear side of each piezo front side terminal 24 with an interval. The piezoelectric rear side terminals 25 are formed so as to protrude forward from the front end edge of the width direction outer side portion of the base portion 15, and a plurality (two) of the piezoelectric rear side terminals 25 are arranged at intervals in the width direction.

  Specifically, the piezoelectric rear terminal 25 is formed such that the conductor layer 6 protrudes from the front end edge of the base portion 15 toward the front side and bulges in the width direction. As will be described later, as shown in FIG. 3, a base insulating layer 7 is formed in a frame shape in plan view at the peripheral end of the conductor layer 6 that forms the piezoelectric rear terminal 25. 6 falls into the frame of the base insulating layer 7. The piezoelectric rear terminal 25 is provided independently of the wiring 9 and is grounded via a ground wiring (not shown).

  As shown in FIGS. 1 and 2, the wiring 9 continues to the external terminal 10, the head-side terminal 18, and the piezoelectric tip-side terminal 24, and electrically connects them.

  As shown in FIG. 1, a plurality of (six) wirings 9 are formed in the main body 3 at intervals in the width direction.

  Specifically, the wiring 9 extends from the external terminal 10 toward the front side at the rear end portion of the main body 3, and is branched into two bundles toward both sides in the width direction in the front-rear direction of the main body 3. 2 is bent toward the front side at both ends in the width direction and extends along the outer edge in the width direction toward the tip of the main body 3. As shown in FIG. After passing through the portion 11 and the first connecting portion 35, and subsequently passing between the piezo tip side terminal 24 and the piezo back side terminal 25, it converges in the middle of the center portion 16 in the front-rear direction and bends to the front side. Then, it extends to the front side along the central portion 16, and then bends in two bundles toward the both sides in the width direction at the rear end portion of the stage 17, and then along the peripheral edge of the stage 17. And then folded back to the head side terminal 18 and the piezo tip side It is formed so as to extend to the child 24.

  In addition, in the wiring 9, the part (equivalent to the wiring 9 which forms the thin area | region 30 mentioned later) constructed between the 1st connection part 35 and the center part 16 is formed in the linear form along the width direction. .

  Further, as shown in FIG. 3, a base insulating layer 7 and a cover insulating layer 8 are formed around the wiring 9 in a cross-sectional view, and the wiring 9 includes the base insulating layer 7 and the cover insulating layer 8. A conductor region 2 is formed.

  The suspension board with circuit 1 includes a metal supporting board 5, a base insulating layer 7 formed on the metal supporting board 5, a conductor layer 6 formed on the base insulating layer 7, and a base insulating layer 7. In addition, an insulating cover layer 8 is provided so as to cover the conductor layer 6.

  As shown in FIG. 1, the metal support substrate 5 is formed in a shape corresponding to the outer shape of the suspension board with circuit 1. The metal support substrate 5 is made of a metal material such as stainless steel, 42 alloy, aluminum, copper-beryllium, phosphor bronze, and the like. Preferably, it is formed from stainless steel. The thickness of the metal supporting board 5 is 15-50 micrometers, for example, Preferably, it is 20-30 micrometers.

  As shown in FIGS. 1 and 2, the base insulating layer 7 is formed over the main body portion 3 and the gimbal portion 4, and corresponds to the portion where the conductor layer 6 is formed as shown in FIG. Is formed. The insulating base layer 7 forms the conductor region 2 together with the conductor layer 6.

  Specifically, the base insulating layer 7 is formed on the metal support substrate 5 in the main body 3, while inside the substrate opening 11 of the gimbal portion 4 and on the first connecting portion 35 and the central portion 16. In addition, it is formed along the wiring 9.

  Furthermore, the base insulating layer 7 protrudes rearward from the metal support substrate 5 of the stage 17, is formed in a substantially rectangular frame shape in plan view at the peripheral end portion of the piezoelectric tip side terminal 24, and the metal support substrate 5 of the base portion 15. And is formed in a substantially rectangular frame shape in plan view at the peripheral end of the piezoelectric rear terminal 25.

  Further, the base insulating layer 7 is also formed as a pattern for forming the second connecting portion 20 as shown in FIG.

  The base insulating layer 7 is made of an insulating material such as a synthetic resin such as polyimide resin, polyamideimide resin, acrylic resin, polyethernitrile resin, polyethersulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, or polyvinyl chloride resin. Is formed. Preferably, it is formed from a polyimide resin.

  The insulating base layer 7 has a thickness of, for example, 1 to 35 μm, or preferably 3 to 33 μm.

  As described above, the conductor layer 6 is formed as a pattern including the external terminal 10 (FIG. 1), the head terminal 18, the piezoelectric tip terminal 24, the piezoelectric rear terminal 25, and the wiring 9.

  As shown in FIG. 3, the piezoelectric front terminal 24 and the piezoelectric rear terminal 25 are formed so as to fall inside the base insulating layer 7 formed in a substantially frame shape in plan view. Further, the lower surface of the piezoelectric rear terminal 25 is exposed downward from the base insulating layer 7.

  Further, the lower surface of the piezo tip side terminal 24 is formed flush with the lower surface of the base insulating layer 7 formed at the peripheral end in the width direction and the front-rear direction. Further, the lower surface of the piezoelectric rear terminal 25 is formed flush with the lower surface of the base insulating layer 7 formed at the peripheral end in the width direction and the front-rear direction.

  The conductor layer 6 is made of a conductor material such as copper, nickel, gold, solder, or an alloy thereof. The thickness of the conductor layer 6 is 3-50 micrometers, for example, Preferably, it is 5-20 micrometers.

  The width | variety of the wiring 9 is 5-200 micrometers, for example, Preferably, it is 8-100 micrometers. Further, the width and length (length in the longitudinal direction) of the external side terminal 10, the head side terminal 18, the piezo front side terminal 24, and the piezo back side terminal 25 are, for example, 20 to 1000 μm, and preferably 30 to 800 μm. .

  As shown in FIG. 1, the insulating cover layer 8 is formed over the main body 3 and the gimbal 4, and is formed in a pattern including the conductor layer 6 in a plan view as shown in FIG. 3. The insulating cover layer 8 forms the conductive region 2 together with the conductive layer 6 and the insulating base layer 7.

  Specifically, the insulating cover layer 8 covers the upper surfaces of the wiring 9, the piezoelectric front terminal 24 and the piezoelectric rear terminal 25, and exposes the upper surfaces of the external terminal 10 (see FIG. 1) and the head terminal 18. It is formed in a pattern.

  The insulating cover layer 8 is made of an insulating material similar to the insulating material forming the insulating base layer 7. The insulating cover layer 8 has a thickness of, for example, 1 to 40 μm, preferably 3 to 10 μm.

  The slider 26 and the piezo element 23 are mounted on the suspension board with circuit 1.

  As shown in the phantom line of FIG. 2 and FIG. 3, the slider 26 is formed in a substantially rectangular box shape in plan view, and the tip of the slider 26 is made of a known adhesive in the mounting region 28 of the stage 17. Bonding is performed via an adhesive layer 37.

  The thickness of the adhesive layer 37 is, for example, substantially the same as the total thickness of the base insulating layer 7, the conductor layer 6, and the cover insulating layer 8.

  Thereby, the tip of the slider 26 is fixed to the mounting area 28.

  As shown in FIG. 2, the leading edge of the slider 26 is formed along the head-side terminal 18, and specifically, is formed on the rear side of the head-side terminal 18 with a minute interval. As a result, as shown in FIG. 3, the magnetic head 27 mounted on the tip of the slider 26 is electrically connected by the head-side terminal 18 and the solder ball 83 or the like.

  As shown in FIG. 2, the rear end edge of the slider 26 is arranged so as to cross between the piezo front side terminal 24 and the piezo rear side terminal 25 and the middle of the central portion 16 in the front-rear direction. Specifically, the rear end edge of the slider 26 extends along a conductor region 2 (a thin region 30 described later) that extends in a straight line along the width direction between the first connecting portion 35 and the central portion 16. When arranged in the thickness direction and projected in the thickness direction, the conductor regions 2 are arranged in parallel with a minute gap therebetween.

  The slider 26 is mounted so as to include the conductor region 2 along the central portion 16 and the conductor region 2 at the rear end portion of the stage 17 in plan view.

  The piezo element 23 is mounted so that each piezo front side terminal 24 and each piezo back side terminal 25 are installed so as to be extendable in the front-rear direction. Specifically, the front end portion and the rear end portion of each piezo element 23 are electrically connected to the piezo tip side terminal 24 and the piezo back side terminal 25 and are fixed to them.

  The piezo element 23 expands and contracts when electricity is supplied through the piezo tip side terminal 24 and the voltage is controlled.

  In FIGS. 3 and 4, the conductor region 2 laid between the first connecting portion 35 and the central portion 16 is illustrated on the upper surface of the piezo element 23. Are provided with a minute interval between them.

  Next, swinging of the slider 26 due to expansion and contraction of the piezo element 23 will be described with reference to FIGS. 2, 3, 5, and 6.

  First, electricity is supplied to the piezo element 23 via the piezo tip side terminal 24, and one of the piezo elements 23 contracts by controlling the voltage of electricity. Then, the piezoelectric front side terminal 24 and the piezoelectric rear side terminal 25 for fixing one piezoelectric element 23 are relatively close to each other. That is, one piezoelectric front terminal 24 moves rearward with respect to one piezoelectric rear terminal 25 supported by the base 15.

  At the same time, electricity is supplied through the piezoelectric tip side terminal 24, and the voltage of the electricity is controlled, so that the other piezoelectric element 23 expands. Then, the piezoelectric front side terminal 24 and the piezoelectric rear side terminal 25 that fix the other piezoelectric element 23 are relatively separated from each other. That is, the other piezoelectric front terminal 24 moves forward with respect to the other piezoelectric rear terminal 25 supported by the base 15.

  As a result, the stage 17 moves toward the one side in the width direction, with the rear end of the center portion 16 as a fulcrum, while the tip of the center portion 16 and the middle in the front-rear direction curve toward the one side in the width direction (left side in FIG. 5). Swing. At the same time, the slider 26 swings toward one side in the width direction.

  Then, as shown in FIGS. 5 and 6, one end in the width direction of the rear end of the slider 26 is opposed to the conductor region 2 laid between the first connecting portion 35 and the central portion 16 in the thickness direction. To do. On the other hand, the other end in the width direction of the rear end of the slider 26 is separated from the conductor region 2 described above.

  If one of the piezo elements 23 is extended and the other is contracted, the slider 26 swings in the opposite direction (the other side in the width direction, the right side in FIG. 5).

  In this suspension board with circuit 1, in FIG. 5, when the slider 26 swings, the portion of the conductor region 2 that faces the slider 26 in the thickness direction is the facing region 29.

  The facing area 29 is formed in a conductor area 2 (thin area 30 described later) laid between the first connecting portion 35 and the center section 16, a conductor area 2 along the center section 16, and a rear end portion of the stage 17. Conductor region 2.

  In the suspension board with circuit 1, the conductor region 2 provided between the first connecting portion 35 and the central portion 16 is a thin region 30.

  As shown in FIGS. 3 and 4, the thin region 30 is formed to be thinner than the conductor region 2 other than the facing region 29. For example, the thickness of the thin region 30 is, for example, 2 to 45 μm thinner, preferably 5 to 40 μm thinner than the thickness of the conductor region 2 other than the opposing region 29.

  Specifically, the thickness of the thin region 30 is, for example, 5 to 48 μm, or preferably 8 to 45 μm.

  Moreover, the thickness of the conductor area | region 2 other than the opposing area | region 29 is 10-50 micrometers, for example, Preferably, it is 13-35 micrometers.

  Specifically, the thickness of the base insulating layer 7 in the thin region 30 is thinner than the thickness of the base insulating layer 7 in the conductor region 2 other than the opposing region 29, specifically, for example, 2 to 30 μm thinner, preferably It is formed 5 to 30 μm thin. The thickness of the base insulating layer 7 in the thin region 30, that is, the thin base portion 31 is, for example, 1 to 33 μm, preferably 3 to 30 μm.

  In order to obtain the suspension board with circuit 1, first, a metal support board 5 is prepared as shown in FIG.

  Next, as shown in FIG. 7B, the base insulating layer 7 is formed on the metal support substrate 5. In order to form the base insulating layer 7, a varnish of a photosensitive insulating material is applied onto the metal support substrate 5 and dried to form a base film.

  Thereafter, the base film is exposed through a gradation exposure photomask (not shown) (gradation exposure). The gradation exposure photomask has a light-shielding portion, a light semi-transmissive portion, and a light total-transmissive portion in a pattern, and light is applied to a portion where the base insulating layer 7 (excluding the portion where the thin base portion 31 is formed) is formed. The total transmission part is disposed opposite to the base film with the light semi-transmission part in the part where the thin base part 31 is formed and the light-shielding part in the part where the base insulating layer 7 is not formed.

  Thereafter, the base film is developed and cured as necessary, thereby forming the base insulating layer 7 having the thin base portion 31 with the above-described pattern.

  Next, as shown in FIG. 7C, the conductor layer 6 is formed on the metal supporting substrate 5 and the base insulating layer 7 by a pattern forming method such as an additive method or a subtractive method.

  Next, as shown in FIG. 7D, the insulating cover layer 8 is formed on the insulating base layer 7. In order to form the cover insulating layer 8, a varnish of a photosensitive insulating material is applied and dried to form a cover film, and then the cover film is exposed, followed by development and heat curing. The pattern is formed as described above.

  Next, as shown in FIG. 7E, the metal support substrate 5 is subjected to external processing by, for example, etching to form the substrate opening 11.

  According to the suspension board with circuit 1 described above, the mounting region 28 can mount the slider 26 so as to be movable relative to the conductor region 2, and the position and angle of the magnetic head 27 can be adjusted precisely.

  Further, since the conductor region 2 includes the facing region 29, the suspension board with circuit 1 can be reduced in size and the conductor layer 6 can be increased in density.

  Furthermore, since the thin region 30 is thinner than the conductor region 2 other than the opposing region 29, a sufficient distance in the thickness direction from the slider 26 when swinging can be secured.

  Specifically, since the thickness of the thin base portion 31 is thinner than the thickness of the base insulating layer 7 in the conductor region 2 other than the opposing region 29, the vertical position of the upper surface of the conductor layer 6 in the thin region 30 is the opposing region 29. It is lower than the vertical position of the upper surface of the conductor layer 6 in the conductor region 2 other than the above.

  Therefore, as shown in FIG. 6, even when the thin region 30 is projected in the thickness direction, even if it overlaps with the slider 26, it can be a separation portion that is separated from the slider 26 in the thickness direction.

  Therefore, since the slider 26 and the opposing region 29 are separated in the thickness direction by the thin region 30, damage to the opposing region 29 by the slider 26 can be reliably prevented.

  Accordingly, it is possible to effectively prevent the conductor layer 6 in the thin region 30 and the lower surface of the slider 26 from contacting each other.

  That is, the thin region 30 can be used as a damage prevention unit for preventing the conductor layer 6 from being damaged in the facing region 29 by the slider 26.

  On the other hand, as shown by the phantom line in FIG. 6, when the thin region 30 is formed thick, it comes into contact with the lower surface of the slider 26 at the time of swinging. That is, the thin region 30 and the slider 26 cannot be separated in the thickness direction, and further, damage to the conductor layer 6 by the slider 26 cannot be prevented.

  However, in the suspension board with circuit 1, the contact between the thin region 30 and the slider 26 can be effectively prevented, and damage to the wiring 9 due to such contact can be prevented.

  Further, in the suspension board with circuit 1, the rear end portion of the slider 26 swings more with respect to the thin region 30 than the front end portion, and accordingly, is easily in contact with the conductor region 2. However, in the suspension board with circuit 1 described above, it is possible to effectively prevent the contact between the slider 26 and the thin region 30 when swinging with respect to the conductor region 2 and to prevent the wiring 9 from being damaged due to such contact. .

  Further, in the above description, the thin region 30 is the conductor region 2 constructed between the first connecting portion 35 and the central portion 16 in the opposing region 29. For example, although not shown, in addition to the above, Alternatively, instead of the above, the conductor region 2 along the central portion 16 and / or the conductor region 2 at the rear end portion of the stage 17 may be the thin region 30.

  FIGS. 8-12 shows sectional drawing of the thin part of other embodiment of the suspension board | substrate with a circuit of this invention.

  In addition, about the member corresponding to each above-mentioned part, the same referential mark is attached | subjected in each subsequent drawing, and the detailed description is abbreviate | omitted.

  In the above description, the thin region 30 includes the thin base portion 31 of the base insulating layer 7. For example, the thin region 30 may additionally or independently include the thin cover portion 32 and / or the thin conductor portion 33. it can.

  In FIG. 8, the thin region 30 includes a thin cover portion 32 that is thinner than the cover insulating layer 8 in the conductor region 2 other than the facing region 29.

  In FIG. 9, the thin region 30 includes a thin base portion 31 other than the facing region 29 and a thin cover portion 32.

  In FIG. 10, the thin region 30 includes a thin conductor portion 33 that is thinner than the conductor layer 6 in the conductor region 2.

  In FIG. 11, the thin region 30 includes a thin base portion 31 and a thin conductor portion 33.

  In FIG. 12, the thin region 30 includes a thin conductor portion 33 and a thin cover portion 32.

  In order to form the thin conductor portion 33 shown in FIGS. 10 to 12, for example, in the subtractive method, after forming the conductor layer 6 in a pattern, an etching resist is laminated on portions other than the thin conductor portion 33, The conductor layer 6 exposed from the etching resist is half-etched, and then the etching resist is removed.

  In order to form the insulating cover layer 8 having the thin cover portion 32 shown in FIGS. 8, 9 and 12, for example, a varnish of a photosensitive insulating material is applied on the insulating base layer 7 and dried. To form a cover film.

  Thereafter, the cover film is exposed through a gradation exposure photomask (not shown) (gradation exposure). The gradation exposure photomask has a light-shielding portion, a light semi-transmissive portion, and a light transmissive portion in a pattern, and light is applied to a portion where the cover insulating layer 8 (excluding the portion where the thin cover portion 32 is formed) is formed. The light transmitting portion is disposed opposite to the cover film, and the light transmitting portion is disposed in the portion where the thin cover portion 32 is formed, and the light shielding portion is disposed in the portion where the cover insulating layer 8 is not formed.

  Thereafter, the cover film is developed and cured as necessary, thereby forming the insulating cover layer 8 including the thin cover portion 32 in the above-described pattern.

  8, the vertical position of the upper surface of the conductor layer 6 is the same as the vertical position of the upper surface of the conductor layer 6 in the conductor region 2 other than the facing region 29. However, since the thin cover portion 32 is thin, the conductor layer 6 in the thin region 30 is prevented from being damaged due to damage to the insulating cover layer 8 due to contact between the lower surface of the slider 26 and the thin cover portion 32. be able to.

  FIG. 13 is a plan view of another embodiment of the suspension board with circuit of the present invention (a mode in which a pedestal is provided), and FIGS. 14 and 15 are plan views of a gimbal portion of the suspension board with circuit shown in FIG. FIG. 16 is a bottom view, FIG. 16 is a cross-sectional view taken along line CC of the gimbal part shown in FIGS. 14 and 15, and FIG. 17 is a plan view of the gimbal part shown in FIG. FIG. 18 is a bottom view of the gimbal portion shown in FIG. 15, and a bottom view clearly showing the second base insulating layer. FIGS. 19 to 21 are steps for explaining a method of manufacturing a suspension board with circuit. FIG. 22 is a plan view of the state where the stage of the gimbal part shown in FIG. 14 is swung, and FIG. 23 is a sectional view of the state where the stage of the gimbal part shown in FIG. 16 is swung.

  In FIG. 13, FIG. 14 and FIG. 22, a first base insulating layer 51 and a first cover insulating layer 53 which will be described later are omitted in order to clearly show the relative arrangement of the first conductor pattern 52 which will be described later.

  In FIG. 15, the second base insulating layer 71 and the second cover insulating layer 73 described later are omitted to clearly show the relative arrangement of the second conductor pattern 72 described later.

  Further, in FIG. 17, a first cover insulating layer 53 described later is omitted in order to clearly show a relative arrangement of a first conductor pattern 52 and a first base insulating layer 51 described later.

  Further, in FIG. 15, a second cover insulating layer 73 described later is omitted in order to clearly show a relative arrangement of a second conductor pattern 72 and a second base insulating layer 71 described later.

  13 and 16, the suspension board with circuit 1 is mounted on a hard disk drive (not shown) on which a slider 26 and a piezoelectric element 23 on which a magnetic head 27 is mounted are mounted.

  As shown in FIG. 13, the suspension board with circuit 1 is formed in a flat band shape extending in the front-rear direction, and integrally includes a main body portion 3 and a gimbal portion 4.

  The main body 3 is formed in a substantially rectangular shape in plan view extending in the front-rear direction. When the suspension board with circuit 1 is mounted on a hard disk drive, the main body 3 is supported by an external circuit board 46 (virtual line) such as a read / write board while being supported by a load beam (not shown) of the hard disk drive. And it is electrically connected to the power supply 47 (virtual line).

  The gimbal portion 4 is formed with a substrate opening 11 having a substantially rectangular shape in plan view that penetrates the thickness direction.

  As shown in FIG. 14, the gimbal portion 4 includes an outrigger portion 34 and a tongue portion 12.

  The tongue portion 12 is integrally provided with a base portion 15, a stage 17, and a central portion 16.

  A rear end portion of the stage 17 is a mounting area 28 where the slider 26 is mounted.

  In addition, in the front-rear direction, the communication space 14 is partitioned as a space surrounded by the width direction both ends of the base portion 15 and the width direction end portion of the stage 17.

  That is, the communication space 14 is partitioned on both sides in the width direction of the central portion 16, and each communication space 14 is formed so as to penetrate the thickness direction of the suspension board with circuit 1.

  In the stage 17, a wiring folded portion 55 is defined at the center in the front-rear direction.

  The wiring folded portion 55 is partitioned into a substantially rectangular shape in plan view that is long in the width direction as a region where a first conductor pattern 52 (to be described later) is folded on the stage 17.

  Further, the stage 17 is connected to the outrigger portion 34 by the second connecting portion 20. The second connecting portion 20 includes a bending portion 21 and an E-shaped portion 22.

  The central portion 16 is formed with a narrow width that can be bent in the width direction. In addition, the center part 16 is formed with the width | variety which ensures the area | region where the 2nd base 92 demonstrated below is installed.

  The tongue portion 12 is provided with a pedestal 90 for supporting the slider 26.

  The pedestal 90 includes a first pedestal 91 provided in the base portion 15 and a second pedestal 92 provided in the central portion 16.

  The first pedestal 91 is disposed at the front side portion of the base portion 15, and specifically, is disposed so as not to overlap a first conductor pattern 52 described later when projected in the thickness direction. A plurality (two) of the first pedestals 91 are arranged opposite to each other at an interval in the width direction. Each first pedestal 91 is formed so as to extend in the width direction, and specifically, is formed in a substantially rectangular shape in plan view that is long in the width direction.

  On the other hand, the second pedestal 92 has a substantially circular shape in plan view, and is provided on the front side of the first pedestal 91 with a space therebetween. Specifically, the second pedestal 92 is disposed at a central portion in the front-rear direction of the central portion 16. The second pedestal 92 is arranged so as to overlap the first conductor pattern 52 in the central portion 16 in the thickness direction.

  As shown in FIG. 16, the pedestal 90 is formed so that the vertical positions of the upper surface are the same height as each other. Specifically, the upper surfaces of the first pedestal 91 and each second pedestal 92 are in the front-rear direction. Or it forms so that it may become linear shape when it projects in the width direction.

  Moreover, the upper surface of the 1st base 91 and each 2nd base 92 is formed in flat shape.

  Therefore, the base 90 can contact the slider 26 so that sliding is possible.

  The suspension board with circuit 1 includes a metal support board 5, a first base insulating layer 51 formed on the metal support board 5, and a first conductor layer formed on the first base insulating layer 51. One conductive pattern 52 and a first cover insulating layer 53 formed on the first insulating base layer 51 so as to cover the first conductive pattern 52 are provided.

  As shown in FIG. 13, the metal support board 5 extends in the front-rear direction, and is formed in an outer shape substantially the same as the outer shape of the suspension board with circuit 1 described above.

  Further, as shown in FIG. 16, a conductive opening 59 is formed in the metal support substrate 5.

  A plurality (four) of conductive openings 59 are provided at intervals in the base 15 and the stage 17 as shown in FIG. Specifically, the conduction openings 59 are respectively formed at both ends in the width direction of the base portion 15 and both ends in the width direction of the stage 17. Each conduction opening 59 is formed in a substantially circular shape in plan view that penetrates the metal support substrate 5 in the thickness direction.

  As shown in FIGS. 16 and 17, the first insulating base layer 51 is formed so as to correspond to a portion where the first conductor pattern 52 is formed.

  Specifically, the first base insulating layer 51 is formed on the upper surfaces of the main body portion 3 and the gimbal portion 4. More specifically, the first insulating base layer 51 exposes the top edge (excluding the central portion in the width direction) and the rear edge of the metal support substrate 5 of the base portion 15, and the metal support substrate 5 of the central portion 16. Are formed in a pattern that exposes the upper surface of both edges in the width direction and the upper surface of the leading edge of the stage 17 and both edges in the width direction.

  The first insulating base layer 51 is formed so as to cover the tip of the communication space 14.

  That is, the first base insulating layer 51 corresponding to the stage 17 has the rear end edge 65 protruding rearward from the front end edge of the communication space 14 when projected in the thickness direction.

  Note that the first base insulating layer 51 corresponding to the base portion 15 is disposed on the rear side of the rear end edge of the communication space 14 when the front end edge 63 is projected in the thickness direction.

  The first insulating base layer 51 forms the conductor region 2 together with the first conductor pattern 52 described below.

  Further, the first base insulating layer 51 forms the second connection part 20.

  Furthermore, as shown in FIG. 16, the first insulating base layer 51 covers the peripheral edge of each conductive opening 59 of the metal support substrate 5 in an annular shape. Thereby, a plurality of (four) first base through holes 64 corresponding to each conduction opening 59 are formed in the first base insulating layer 51 in a substantially circular shape in plan view sharing the center with the conduction opening 59. Has been.

  As shown in FIGS. 13 and 17, the first conductor pattern 52 is electrically connected to the head-side pattern 57 that is electrically connected to the magnetic head 27 (FIG. 16) and to the piezo element 23 (FIG. 16). The element side pattern 58 is provided.

  The head side pattern 57 is integrally provided with a head side terminal 18, an external side terminal 10 (FIG. 13), and a signal wiring 62 for connecting the head side terminal 18 and the external side terminal 10.

  As shown in FIGS. 14 and 17, a plurality (four) of the head-side terminals 18 are arranged at the rear end portions of both ends in the width direction of the stage 17. Specifically, each head-side terminal 18 has a substantially rectangular shape in plan view, is disposed on the rear side of the wiring folded portion 55, and is aligned and spaced from each other in the width direction. Further, the head-side terminals 18 are arranged at intervals on both sides in the width direction of the central portion 16 when projected in the front-rear direction.

  As shown in FIGS. 16 and 17, the rear end edge 87 of the head-side terminal 18 is disposed so as to be retracted further forward than the rear end edge 65 of the first base insulating layer 51 in the stage 17.

  As shown in FIG. 13, a plurality of (four) external terminals 10 are arranged at the rear end portion of the main body portion 3 so as to be spaced apart from each other in the width direction and correspond to the head side terminals 18. It has been. An external circuit board 46 indicated by a virtual line is connected to the external terminal 10.

  Each signal wiring 62 is formed in a plurality (four) at a distance from each other so as to connect the corresponding head side terminal 18 and the external terminal 10.

  Specifically, the rear end of the signal wiring 62 is continuous with the external terminal 10. Specifically, the signal wiring 62 extends from the external terminal 10 toward the front side at the rear end portion of the main body 3, and is branched into two bundles toward the both sides in the width direction in the middle of the front-rear direction of the main body 3. Bend. Thereafter, the signal wiring 62 is bent forward at both ends in the width direction in the middle of the body portion 3 in the front-rear direction, and extends along the outer edge in the width direction toward the tip portion of the body portion 3. 14 and 17, after passing through the substrate opening portion 11, the first connecting portion 35 is reached.

  After that, the signal wiring 62 extends inward in the rearward diagonal width direction along the first connecting portion 35, reaches both ends in the width direction of the base portion 15, bends inward in the width direction, and then unites at the center in the width direction of the base portion 15. To do. Thereafter, the signal wiring 62 extends toward the front side along the central portion 16, and is bent into two bundles in two bundles toward the both sides in the width direction at the wiring folded portion 55 of the stage 17. After extending toward the outer side in the width direction along the edge, and then folded back to the rear side, the head side terminal 18 is connected to the front end portion.

  In addition, the signal wiring 62 is arrange | positioned in the base 15 at the back side of the 1st base 91 at intervals, and is formed in the linear form along the width direction.

  As shown in FIGS. 13, 14, and 16, the element side pattern 58 includes a supply side terminal 36, a front side conductive portion 13, and a front side power supply wiring 68 for connecting the supply side terminal 36 and the front side conductive portion 13. Is integrated.

  As shown in FIG. 13, a plurality (four) of supply-side terminals 36 are provided on the front end side of the external-side terminal 10 at a rear end portion of the main body portion 3 with a space therebetween. Each supply-side terminal 36 has a substantially rectangular shape in plan view, and is arranged in a line in the width direction with an interval. A power supply 47 indicated by a virtual line is connected to the supply side terminal 36.

  As shown in FIG. 16, a plurality (four) of the front side conductive portions 13 are formed so as to be filled in the first base through holes 64.

  As shown in FIGS. 13 and 14, a plurality (four) of the front-side power wirings 68 are formed at intervals from each other so as to be connected to the front-side conduction unit 13 and the supply-side terminal 36. Further, the front-side power supply wiring 68 is disposed outside the signal wiring 62 across the main body portion 3 and the gimbal portion 4 with a space therebetween.

  The first insulating base layer 51 and the first insulating cover layer 53 are formed around the first conductor pattern 52, specifically, the signal wiring 62, the front-side conductive portion 13, and the front-side power supply wiring 68 in a cross-sectional view. Has been. The signal wiring 62, the front conductive portion 13, and the front power supply wiring 68 together with the first base insulating layer 51 and the first cover insulating layer 53 form the conductor region 2.

  As shown in FIG. 16, the first insulating cover layer 53 is formed corresponding to a portion where the first conductor pattern 52 is formed.

  Specifically, the first insulating cover layer 53 is formed in a pattern that exposes the external terminal 10 (see FIG. 13) and the head terminal 18 and covers the signal wiring 62 corresponding to the head pattern 57. ing. Further, the first cover insulating layer 53 is formed in a pattern that exposes the supply-side terminal 36 (see FIG. 13) and covers the front-side power supply wiring 68 and the front-side conductive portion 13 corresponding to the element-side pattern 58. .

  Further, the first base insulating layer 51, the first conductor pattern 52, and the first cover insulating layer 53 described above form each pedestal 90 together with the front side support layer 93 (described later).

  That is, as shown in FIG. 16, the pedestal 90 has the first base insulating layer 51, the first conductor pattern 52 formed thereon, and the first conductor pattern 52 on the first base insulating layer 51. A first cover insulating layer 53 formed so as to cover and a front support layer 93 formed on the first cover insulating layer 53 are provided.

  In the pedestal 90, the front support layer 93 is formed slightly smaller than the first cover insulating layer 53 in plan view.

  The suspension board with circuit 1 includes a second base insulating layer 71 formed under the metal support substrate 5, a second conductor pattern 72 formed under the second base insulating layer 71, and a second base insulating layer. A second cover insulating layer 73 formed so as to cover the second conductor pattern 72 is provided below the layer 71.

  As shown in FIGS. 16 and 18, the second insulating base layer 71 is formed corresponding to a portion where a second conductor pattern 72 described below is formed.

  Specifically, the second insulating base layer 71 is formed so as to face the communication space 14 from the base 15 and the stage 17. Specifically, four second insulating base layers 71 are provided corresponding to the four conductive openings 59. Each of the second base insulating layers 71 is independently arranged at intervals in the front-rear direction and the width direction, and specifically, is disposed at both ends of the base portion 15 and the stage 17 in the width direction.

  In addition, each second base insulating layer 71 is formed in a substantially rectangular shape extending long in the front-rear direction so as to include each conduction opening 59 in a bottom view.

  The second insulating base layer 71 corresponding to the base portion 15 is formed across the width direction both ends of the base portion 15 and the rear end portion of the communication space 14.

  Further, the leading edge 69 of the second base insulating layer 71 corresponding to the base portion 15 is more forward than the rear end edge of the communication space 14 when projected in the thickness direction at the gimbal portion 4 (that is, the communication space 14. Projecting toward the center of the front-rear direction). That is, the second insulating base layer 71 corresponding to the base portion 15 is formed so as to cross the front edge 84 of the metal support substrate 5 along the width direction in the front-rear direction when projected in the thickness direction.

  The second insulating base layer 71 corresponding to the stage 17 is formed across both ends in the width direction of the stage 17 and the tip of the communication space 14. The second insulating base layer 71 corresponding to the stage 17 is formed so that the rear edge 70 overlaps the rear edge 65 of the first insulating base layer 51 when projected in the thickness direction.

  That is, the rear end edge 70 of the second insulating base layer 71 is rearward of the leading edge of the communication space 14 when projected in the thickness direction at the gimbal portion 4 (that is, at the center in the front-rear direction of the communication space 14). Protruding).

  That is, the second insulating base layer 71 corresponding to the stage 17 is formed so as to cross the rear edge 85 of the metal support substrate 5 along the width direction in the front-rear direction when projected in the thickness direction.

  In FIG. 16, the second insulating base layer 71 covers the peripheral edge of each conductive opening 59 of the metal supporting board 5 in an annular shape in the base 15 and the stage 17. As a result, a plurality (four) of second base through holes 77 corresponding to the respective conductive openings 59 are formed in the second base insulating layer 71 in a substantially circular shape in plan view sharing the center with the conductive openings 59. Has been.

  As shown in FIG. 18, the second insulating base layer 71 forms the second connecting portion 20 together with the first insulating base layer 51.

  In FIG. 15, the second conductor pattern 72 is integrally provided with a back-side conduction portion 74, an element-side terminal 75, and a back-side power supply wiring 76 for connecting the back-side conduction portion 74 and the element-side terminal 75.

  In FIG. 16, a plurality (four) of the back side conducting portions 74 are formed so as to be filled in the respective second base through holes 77.

  Thereby, the front side conduction | electrical_connection part 13 and the back side conduction | electrical_connection part 74 contact directly in the 1st base through-hole 64 and the 2nd base through-hole 77, and are electrically connected to the thickness direction.

  In FIG. 15, the element-side terminal 75 is disposed independently at the front end portion of the second base insulating layer 71 corresponding to the base portion 15 and the rear end portion of the second base insulating layer 71 corresponding to the stage 17. . Each element-side terminal 75 faces the communication space 14, and a plurality (four) of the element-side terminals 75 are provided at intervals in the width direction and the front-rear direction so as to correspond to the respective back-side conductive portions 74. Each element-side terminal 75 has a substantially rectangular bottom surface, and both end edges in the width direction are formed at the same positions as those of the second base insulating layer 51 when projected in the thickness direction.

  The element-side terminal 75 includes an element-side rear terminal 80 provided at the rear end portion of the communication space 14 and an element-side front terminal 81 provided at a distance from the front side of the element-side front terminal 50. .

  A plurality (two) of element-side rear terminals 80 are arranged in parallel at the base portion 15 at intervals in the width direction.

  A plurality (two) of element side front terminals 81 are arranged in parallel on the stage 17 at intervals in the width direction. Each element-side front terminal 81 is provided corresponding to the outermost head-side terminal 18 in the width direction. Specifically, as shown in FIG. 16, when projected in the thickness direction, the outermost in the width direction It arrange | positions so that it may overlap with the rear side part of the head side terminal 18 of this.

  As shown in FIG. 15, the element-side rear terminal 80 on one side in the width direction and the element-side front terminal 81 on one side in the width direction are provided in pairs with the communication space 14 on the one side in the width direction of the center portion 16. It has been. The element-side rear terminal 80 on the other side in the width direction and the element-side front terminal 81 on the other side in the width direction are provided as a pair with the communication space 14 on the other side in the width direction of the center portion 16 therebetween.

  As shown in FIG. 16, the leading edge 78 of the element-side rear terminal 80 is substantially flush with the leading edge 69 of the second insulating base layer 71 corresponding to the base portion 15 when projected in the thickness direction. Has been placed.

  The rear end edge 79 of the element side front terminal 81 is disposed so as to be substantially flush with the rear end edge 70 of the second base insulating layer 71 corresponding to the stage 17 when projected in the thickness direction.

  In addition, the rear end edge 79 of the element side front terminal 81 is disposed close to the rear side of the rear end edge 87 of the head side terminal 18 with a minute gap.

  As shown in FIGS. 16 and 18, a plurality (four) of the back-side power supply wirings 76 are formed at a distance from each other so as to connect the corresponding back-side conductive portions 74 and the element-side terminals 75.

  As shown in FIG. 16, the second cover insulating layer 73 is formed in the gimbal portion 4 so as to correspond to the second conductor pattern 72. Specifically, the second cover insulating layer 73 is formed so as to expose the element-side terminal 75 and cover the back-side power supply wiring 76 and the back-side conductive portion 74.

  Then, as shown in FIGS. 14 and 16, a slider 26 (virtual line in FIG. 14) and a piezo element 23 are mounted on the suspension board with circuit 1.

  The slider 26 is mounted together with the suspension board with circuit 1 at the tip of a load beam (not shown) of a hard disk drive (not shown). When the hard disk drive (not shown) is driven, a magnetic disk (not shown) is mounted. Z)), the aircraft is levitated with a small interval while running relatively.

  The slider 26 has a substantially rectangular shape in a plan view and a substantially rectangular shape in a side sectional view, and when projected in the thickness direction as indicated by an imaginary line in FIG. And the rear end portion thereof is arranged so as to overlap the front end portion of the base portion 15. Further, the slider 26 is arranged so that when projected in the thickness direction, the middle part in the front-rear direction and the middle part in the width direction overlap the central part 16.

  Furthermore, the slider 26 is disposed so that the middle part and the rear end part in the front-rear direction include the base 90 when projected in the thickness direction.

  Specifically, the rear end edge of the slider 26 is arranged along the conductor region 2 (opposed region 29 described later) formed along the width direction in the base portion 15 and is applied when projected in the thickness direction. The conductor region 2 is arranged in parallel with a minute interval on the front side.

  Further, as shown in FIG. 16, a magnetic head 27 is mounted on the entire end of the slider 26 in the thickness direction. The magnetic head 27 is electrically connected in the front-rear direction by the head-side terminal 18 and the solder ball 83.

  Thereby, the tip of the slider 26 is fixed to the stage 17. Specifically, the slider 26 is fixed to the stage 17 so that the leading edge thereof faces the mounting area 28 of the stage 17 in the thickness direction.

  The rear end portion of the slider 26 is supported so as to be slidable (swingable) in the surface direction (direction orthogonal to the thickness direction) with respect to the base portion 15.

  That is, the slider 26 is provided such that the lower surface thereof is slidably in contact with the upper surface of each pedestal 90.

  The rear end of the slider 26 overlaps with the element-side rear terminal 80 when projected in the thickness direction.

  As shown in FIGS. 14 and 15, the piezo element 23 can be expanded and contracted in the front-rear direction, and is formed in a substantially rectangular shape in plan view that is long in the front-rear direction. In addition, as shown in FIG. 16, the piezo elements 23 are arranged below the slider 26 with a space therebetween.

  Further, the piezoelectric element 23 is disposed in the communication space 14 when projected in the thickness direction, and is disposed so as to straddle the communication space 14 in the front-rear direction.

  Specifically, as shown in FIGS. 14 and 15, the piezo element 23 is formed between two pairs of element side terminals 75 (element side front terminal 81 and element side rear terminal 80) sandwiching the communication space 14 in the front-rear direction. It is mounted so as to be erected on.

  More specifically, as shown in FIG. 16, the terminal at the tip of each piezo element 23 is joined to the lower surface of the element-side front terminal 81, and they are electrically connected via a solder ball 83. Yes. Further, the terminal at the rear end of each piezo element 23 is joined to the lower surface of the element-side rear terminal 80, and these are electrically connected via the solder ball 83.

  Thereby, each piezoelectric element 23 is fixed to the element side front terminal 81 and the element side rear terminal 80, respectively.

  Further, as shown in FIG. 14, the piezo element 23 overlaps the slider 26 when projected in the thickness direction. Specifically, the piezo element 23 is projected when projected in the thickness direction. All included.

  The piezo element 23 expands and contracts when electricity is supplied from the power source 47 (virtual line in FIG. 13) via the element side pattern 58 and the second conductor pattern 72 and the voltage is controlled.

  Next, a method for manufacturing the suspension board with circuit 1 will be described with reference to FIGS.

  In this method, first, a metal support substrate 5 is prepared as shown in FIG.

  Next, as shown in FIG. 19B, a photosensitive insulating material varnish is applied onto the metal support substrate 5 and dried, then exposed to light, developed, and heat-cured to form the first base. The insulating layer 51 is formed with the pattern described above.

  At the same time, the first insulating base layer 51 corresponding to the base 90 (see FIG. 19D) is formed.

  Examples of the material for forming the first insulating base layer 51 include polyimide resin, polyamideimide resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. An insulating material such as a synthetic resin can be used. Preferably, a polyimide resin is used.

  The thickness of the 1st base insulating layer 51 is 1-35 micrometers, for example, Preferably, it is 3-15 micrometers.

  The diameter of each first base through hole 64 is, for example, 20 to 280 μm, or preferably 40 to 200 μm.

  Next, as shown in FIG. 19C, a first conductor pattern 52 is formed on the first insulating base layer 51 by an additive method or a subtractive method.

  At the same time, a first conductor pattern 52 corresponding to the base 90 (see FIG. 19D) is formed on the first base insulating layer 51.

  Examples of the material forming the first conductor pattern 52 include conductor materials such as copper, nickel, gold, solder, and alloys thereof, and preferably copper.

  The thickness of the 1st conductor pattern 52 is 3-50 micrometers, for example, Preferably, it is 5-20 micrometers.

  The width of each signal line 62 and front side power supply line 68 is, for example, 5 to 200 μm, preferably 8 to 100 μm.

  The interval between the signal wirings 62 (interval in the width direction, the same applies hereinafter) is, for example, 5 to 1000 μm, or preferably 8 to 100 μm. Moreover, the space | interval between the signal wiring 62 and the front side power supply wiring 68 is 5-1000 micrometers, for example, Preferably, it is 8-100 micrometers.

  Further, the width of each head side terminal 18, each external side terminal 10 (see FIG. 13) and each supply side terminal 36 (see FIG. 13) is, for example, 15 to 1000 μm, preferably 20 to 800 μm.

  Moreover, the space | interval between each head side terminal 18 and the space | interval between each external side terminal 10 (refer FIG. 13) are 15-1000 micrometers, for example, Preferably, it is 20-800 micrometers.

  Moreover, as FIG. 14 is referred to, the front-rear direction length (width) L1 of the first conductor pattern 52 corresponding to each first pedestal 91 is, for example, 5 to 200 μm, preferably 10 to 150 μm. The width direction length (length) L2 is, for example, 5 to 200 μm, or preferably 10 to 150 μm. Furthermore, the space | interval L3 between each 1st base 91 is 50-300 micrometers, for example, Preferably, it is 80-200 micrometers.

  Furthermore, the maximum length (diameter) of the first conductor pattern 52 corresponding to the second pedestal 92 is, for example, 5 to 200 μm, or preferably 10 to 150 μm. The front-rear direction interval L4 between the first pedestal 91 and the second pedestal 92 is, for example, 50 to 600 μm, or preferably 100 to 200 μm.

  Next, as shown in FIG. 19D, a photosensitive insulating material varnish is applied and dried on the first base insulating layer 51 so as to cover the first conductive pattern 52, and then exposed. Then, the first cover insulating layer 53 is formed in the above-described pattern by developing and heat-curing.

  At the same time, the first insulating cover layer 53 corresponding to the pedestal 90 is formed on the first insulating base layer 51 so as to cover the first conductive pattern 52.

  As a material for forming the first insulating cover layer 53, an insulating material similar to the insulating material of the first insulating base layer 51 described above can be used. The thickness of the first insulating cover layer 53 is, for example, 1 to 40 μm, preferably 1 to 10 μm.

  Subsequently, as shown in FIG. 19D, the front support layer 93 is formed on the first cover insulating layer 53 corresponding to the pedestal 90. The front side support layer 93 is formed by, for example, a known forming method from the above-described insulating material or metal material.

  The thickness of the front side support layer 93 is, for example, 1 μm or more, preferably 2 μm or more, more preferably 3 μm or more, and usually 10 μm or less, for example. When the thickness of the front support layer 93 is less than the lower limit, there may be a case where a sufficient distance in the thickness direction between the facing region 29 and the slider 26 described later may not be secured.

  Next, as shown in FIG. 19 (e), each conduction opening 59 is formed in the metal support substrate 5.

  Each conductive opening 59 is formed by an etching method such as dry etching (for example, plasma etching) or wet etching (for example, chemical etching), for example, drill drilling, for example, laser processing. Preferably, it is formed by an etching method.

  As a result, the lower surface of the first insulating base layer 51 and the lower surface of the front conductive portion 13 are exposed from the conductive opening 59 of the metal support substrate 5.

  The internal diameter of each conduction | electrical_connection opening part 59 is 50-300 micrometers, for example, Preferably, it is 100-250 micrometers.

  Next, as shown in FIG. 20 (f), the lower surface of the metal support substrate 5 (including the lower surface of the first base insulating layer 51 exposed from each conductive opening 59 and the lower surface of the front-side conductive portion 13) is photosensitive. After applying and drying a varnish of a conductive insulating material, the second base insulating layer 71 is formed in the above-described pattern by exposure and development, and heat curing.

  As a material for forming the second insulating base layer 71, an insulating material similar to the insulating material of the first insulating base layer 51 described above can be used.

  The thickness of the second insulating base layer 71 is, for example, 1 to 35 μm, or preferably 8 to 15 μm.

  The diameter of each second base through hole 77 is, for example, 20 to 280 μm, or preferably 40 to 200 μm.

  Next, as shown in FIG. 20G, a second conductor pattern 72 is formed on the lower surface of the second insulating base layer 71 by an additive method or a subtractive method.

  Examples of the material for forming the second conductor pattern 72 include the same conductor material as that of the first conductor pattern 52.

  The thickness of the 2nd conductor pattern 72 is 3-50 micrometers, for example, Preferably, it is 5-20 micrometers.

  The width of each back side power supply wiring 76 is, for example, 5 to 200 μm, or preferably 8 to 100 μm.

  Moreover, the width | variety of each element side terminal 75 is 15-1000 micrometers, for example, Preferably, it is 20-800 micrometers.

  Next, as shown in FIG. 21 (h), a varnish of a photosensitive insulating material is applied and dried on the back surface of the second insulating base layer 71 so as to cover the second conductive pattern 72 on the back side. The second cover insulating layer 73 is formed in the above-described pattern by exposure and development, and heat curing.

  Examples of the material for forming the second cover insulating layer 73 include the same insulating material as the insulating material of the first base insulating layer 51 described above. The thickness of the second insulating cover layer 73 is, for example, 1 to 40 μm, preferably 1 to 10 μm.

  Next, as shown in FIG. 21 (i), the substrate opening 11 (see FIG. 13) and the communication space 14 are formed in the metal support substrate 5.

  The communication space 14 and the substrate opening 11 are formed by wet etching such as chemical etching, for example.

  At this time, in order to form the communication space 14, the etching time is set to be relatively long, and the metal support substrate 5 is over-etched, so that the space between the first base insulating layer 51 and the second base insulating layer 71 is formed. Yes, the metal support substrate 5 corresponding to the stage 17 is etched to the front side (overetching), and the metal support substrate 5 below the second insulating base layer 71 and corresponding to the base portion 15 is etched to the rear side (overetching). Etch).

  Accordingly, as shown in FIG. 16, the rear end edge 85 of the metal support substrate 5 in the stage 17 is the rear end edge 65 of the first base insulating layer 51 and the rear end of the second base insulating layer 71 corresponding to the stage 17. It arrange | positions rather than the edge 79 ahead.

  That is, the rear end edge 65 of the first insulating base layer 51 and the rear end edge 79 of the second insulating base layer 71 protrude into the communication space 14 from the rear end edge 85 of the metal support substrate 5.

  Further, the leading edge 84 of the metal support substrate 5 in the base portion 15 protrudes into the communication space 14 from the leading edge 69 of the second base insulating layer 71 corresponding to the base portion 15.

  Next, the metal supporting board 5 is subjected to external processing to obtain the suspension board with circuit 1.

  Thereafter, the slider 26 provided with the magnetic head 27 is placed on the upper surface of the base 90 on the upper side of the suspension board with circuit 1.

  Subsequently, the solder balls 83 are provided on the head-side terminals 18 so that the solder balls 83 are in contact with the terminals (side terminals) of the magnetic head 27.

  At the same time, the front end portion and the rear end portion of the piezo element 23 are joined to the element side front terminal 81 and the element side rear terminal 80 on the lower side of the suspension board with circuit 1. That is, the solder balls 83 are provided on the head side terminals 18 and the element side terminals 75, respectively.

  Then, by melting each solder ball 83, the head-side terminal 18 is fixed to the magnetic head 27 and electrically connected.

  Thereby, the slider 26 is supported by the pedestal 90 so as to be swingable (slidable) in the surface direction.

  Further, each piezo element 23 is mounted on the suspension board with circuit 1 so as to be bridged between a pair of element side terminals 75 (element side front terminal 81 and element side rear terminal 80).

  At the same time, the element side terminal 75 is fixed and electrically connected to the piezo element 23.

  As shown in FIG. 13, the external terminal 10 is electrically connected to the external circuit board 46 and the supply terminal 36 is electrically connected to the power supply 47.

  Thereby, the slider 26 and the piezoelectric element 23 are mounted on the suspension board with circuit 1.

  Next, swinging of the slider 26 due to expansion and contraction of the piezo element 23 will be described with reference to FIGS.

  First, electricity is supplied to the piezo element 23 from the power supply 47 (FIG. 13) via the element side terminal 75, and one of the piezo elements 23 is contracted by controlling the voltage of electricity. Then, the element-side front terminal 81 and the element-side rear terminal 80 that fix one piezoelectric element 23 are relatively close to each other. That is, one element-side front terminal 81 supported by the stage 17 moves rearward with respect to one element-side rear terminal 80 supported by the base portion 15.

  At the same time, electricity is supplied from the power source 47 (FIG. 13) via the element-side terminal 75, and the other piezoelectric element 23 is extended by controlling the voltage of electricity. Then, the element side front terminal 81 and the element side rear terminal 80 for fixing the other piezoelectric element 23 are relatively separated from each other. That is, the other element side front terminal 81 supported by the stage 17 moves to the front side with respect to the other element side rear terminal 80 supported by the base portion 15.

  As a result, the stage 17 swings toward the one side in the width direction with the rear end of the center portion 16 as a fulcrum, while the front end of the center portion 16 and the middle in the front-rear direction curve to the one side (left side) in the width direction. . At the same time, the front portion of the slider 26 swings toward one side in the width direction.

  On the other hand, although not shown, when one piezo element 23 is extended and the other piezo element 23 is contracted, the front side portion of the slider 26 swings in the opposite direction (the other side in the width direction, the right side).

  In the suspension board with circuit 1, when the slider 26 swings, the portion of the conductor region 2 that faces the slider 26 in the thickness direction is the facing region 29.

  The facing region 29 includes the conductor region 2 along the width direction in the base portion 15 and the conductor region 2 in the central portion 16.

  Of the opposing region 29, the conductor region 2 along the width direction in the base 15 does not face the slider 26 when projected in the thickness direction before the slider 26 swings, while the conductor 26 after the slider 26 swings (or swings). In the middle of movement), it faces the slider 26.

  On the other hand, the upper surface of the pedestal 90 is slidably in contact with the upper surface of the slider 26 before and after the slider 26 swings.

  In the suspension board with circuit 1, the pedestal 90 can be a separation portion that separates the slider 26 and the facing region 29 in the thickness direction when the slider 26 swings.

  Therefore, since the slider 26 and the facing area 29 are separated in the thickness direction by the pedestal 90, damage to the facing area 29 by the slider 26 can be reliably prevented.

  Thereby, it is possible to effectively prevent the first conductor pattern 52 in the facing region 29 from contacting the lower surface of the slider 26.

  That is, the pedestal 90 can be used as a damage prevention unit for preventing the first conductor pattern 52 from being damaged in the facing region 29 by the slider 26.

  Further, since the pedestal 90 is slidably in contact with the slider 26 before and after the swing of the slider 26, the smooth swing of the slider 26 is ensured, whereby the thickness direction between the opposed region 29 and the slider 26 is increased. The space | interval in can be ensured reliably.

  In the embodiment of FIGS. 14 and 22, the first pedestal 91 is formed so as to extend along the width direction, but the shape thereof is not particularly limited. For example, although not illustrated, It can also be formed in a rectangular shape extending along the front-rear direction.

  Preferably, the first pedestal 91 is formed so as to extend along the swinging direction of the slider 26, that is, the width direction. According to this, it is possible to reliably support the slider 26 that swings along the width direction, and thereby to ensure a gap in the thickness direction between the facing region 29 and the slider 26.

  Further, in the above-described embodiment, the thin region 30 is provided in FIG. 3 or the pedestal 90 is provided in FIG. 16 as the damage preventing portion and the separation portion. Both the base 90 can be provided.

  Accordingly, the slider 26 and the facing area 29 can be more reliably separated in the thickness direction, so that the damage to the facing area 29 by the slider 26 can be prevented more reliably.

DESCRIPTION OF SYMBOLS 1 Suspension board with circuit 2 Conductor area 6 Conductor layer 7 Base insulating layer 8 Cover insulating layer 26 Slider 27 Magnetic head 28 Mounting area 29 Opposite area 30 Thin area 90 Pedestal 91 First pedestal 92 Second pedestal

Claims (10)

A conductor region in which a conductor layer is formed;
A suspension board with circuit, comprising a mounting region for mounting a slider for mounting a magnetic head electrically connected to the conductor layer,
The mounting area is mounted so that the slider can move relative to the conductor area;
The conductor region includes a facing region facing the slider in a thickness direction when the slider moves relative to the conductor region;
A damage prevention unit for preventing damage to the opposing region by the slider;
The damage prevention unit includes a base insulating layer, the conductor layer formed on the base insulating layer, and a cover insulating layer formed on the base insulating layer so as to cover the conductor layer. ,
The damage preventing portion does not face the slider in the thickness direction before the slider moves relative to the conductor region, but faces the slider in the thickness direction when the slider moves relative to the conductor region. Suspension board with circuit. 2. The suspension board with circuit according to claim 1, wherein the damage prevention portion is a separation portion that separates the slider that moves relative to the conductor region and the opposing region in a thickness direction. . 3. The suspension board with circuit according to claim 2, wherein the spaced-apart portion is a thin region that is thinner than the conductor region other than the opposing region. The mounting area mounts the slider so that one end of the slider is fixed and the other end is movable relative to the conductor area.
4. The suspension board with circuit according to claim 3, wherein the thinned region faces the other end of the slider during relative movement with respect to the conductor region when projected in the thickness direction. 5. The conductor region includes the base insulating layer, the conductor layer, and the cover insulating layer,
The thickness of at least one layer selected from the group consisting of the base insulating layer, the conductor layer, and the cover insulating layer in the thin region is larger than at least the one layer in the conductor region other than the opposing region. The suspension board with circuit according to claim 3 or 4, characterized in that the suspension board is thin. The insulating base layer of the damage preventing portion is opposed to the piezo element ;
The piezoelectric element is disposed opposite to the lower side of the slider, and sandwiches the slider and the damage prevention portion in a thickness direction when the slider moves relative to the conductor region . The suspension board with circuit according to claim 5. The metal support substrate includes an opening,
The suspension board with circuit according to any one of claims 1 to 6, wherein the damage preventing portion is included in the opening when projected in the thickness direction. The suspension board with circuit according to any one of claims 2 to 5, wherein the separation portion is a base for supporting the slider so as to be relatively movable. The suspension board with circuit according to claim 8, wherein the pedestal is slidably in contact with the slider before and after relative movement of the slider. The suspension board with circuit according to claim 9, wherein the pedestal is formed so as to extend along a moving direction of the slider.

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