JP6818169B2 - Suspension board with circuit - Google Patents

Description

The present invention relates to a suspension board with a circuit, specifically, a suspension board with a circuit used for a hard disk drive, and a method for manufacturing the same.

Conventionally, a suspension board with a circuit on which a slider having a magnetic head is mounted is mounted on a hard disk drive.

In such a suspension board with a circuit, the terminal on the head side is electrically connected to the terminal of the magnetic head of the slider by a solder ball (see, for example, Patent Document 1).
).

Japanese Unexamined Patent Publication No. 2012-099204

However, in the suspension board with a circuit described in Patent Document 1 described above, the head side terminal and the magnetic head terminal are separated in the thickness direction, and when the degree is large, when the solder ball is melted. In addition, the contact area between the head side terminal and the magnetic head terminal cannot be secured, which may cause poor contact.

An object of the present invention is to provide a suspension board with a circuit capable of reliably connecting the connection terminals to the terminals of the slider, and a method for manufacturing the suspension board with a circuit.

In the present invention [1], a metal support substrate, a base insulating layer arranged on one side in the thickness direction of the metal support substrate, and a connection arranged on one side in the thickness direction of the base insulating layer and electrically connected to a slider. A conductor layer including terminals is provided, and the base insulating layer has at least a terminal area that overlaps with the connection terminal when projected in the thickness direction, and a peripheral area that does not overlap with the terminal area and is around the terminal area. However, the thickness of the terminal region includes the suspension substrate with a circuit that is thicker than the thickness of the peripheral region.

According to such a configuration, since the thickness of the terminal region is thicker than the thickness of the peripheral region, the connection terminal can be brought close to the terminal of the slider in the thickness direction.

Therefore, the connection terminal and the terminal of the slider can be reliably connected.

On the other hand, since the thickness of the peripheral region is thinner than the thickness of the terminal region, the suspension substrate with a circuit can be made lighter and thinner.

In the present invention [2], the base insulating layer covers the first base insulating layer arranged on one side in the thickness direction of the metal supporting substrate and the first base insulating layer, and is arranged on one side in the thickness direction of the metal supporting substrate. The terminal region is composed of a first base insulating layer, and is composed of a first terminal region insulating layer arranged on one side in the thickness direction of the metal support substrate and a second base insulating layer. The second terminal region insulating layer is provided on one side in the thickness direction of the first terminal region insulating layer, and the peripheral region is composed of the second base insulating layer and is arranged on one side in the thickness direction of the metal support substrate. It includes a suspension substrate with a circuit according to the above [1], which includes at least a second peripheral region insulating layer.

According to such a configuration, the peripheral region includes the second peripheral region insulating layer composed of the second base insulating layer, whereas the terminal region includes the first terminal region insulating layer composed of the first base insulating layer. And a second terminal region insulating layer composed of a second base insulating layer is provided.

Therefore, as compared with the case where the terminal region is formed from one base insulating layer, the thickness of the terminal region is formed from two layers, that is, the first terminal region insulating layer and the second terminal region insulating layer. It can be easily made thicker than the thickness of the peripheral region.

As a result, the connection terminal can be brought close to the slider terminal, so that the connection terminal and the slider terminal can be connected more reliably.

The present invention [3] further includes a cover insulating layer that covers a conductor layer so as to expose the connection terminals and is arranged on one side in the thickness direction of the base insulating layer, and a pedestal that supports the slider. A first base pedestal layer composed of a first base insulating layer and arranged on one side in the thickness direction of the metal support substrate, and a first base pedestal layer composed of a second base insulating layer and arranged on one side in the thickness direction of the first base pedestal layer. The suspension substrate with a circuit according to the above [2] is included, which includes a two-base pedestal layer and a cover pedestal layer which is composed of a cover insulating layer and is arranged on one side in the thickness direction of the second base pedestal layer.

According to such a configuration, the first base pedestal layer is composed of the first base insulating layer, the second base pedestal layer is composed of the second base insulating layer, and the cover pedestal layer is composed of the cover insulating layer, so that the slider is supported. The pedestal can be formed without separately providing a member for the purpose.

In the present invention [4], the base insulating layer is a first base insulating layer arranged on one side in the thickness direction of the metal support substrate and a second base insulating layer arranged on one side in the thickness direction of the first base insulating layer. The terminal region is composed of a first base insulating layer, a first terminal region insulating layer arranged on one side in the thickness direction of the metal support substrate, and a second base insulating layer, and is insulated from the first terminal region. A second terminal region insulating layer arranged on one side in the thickness direction of the layer is provided, and the peripheral region is composed of a first base insulating layer, and the first peripheral region insulating layer arranged on one side in the thickness direction of the metal support substrate. The suspension substrate with a circuit according to the above [1] is included.

According to such a configuration, the peripheral region includes a first peripheral region insulating layer made of a first base insulating layer, whereas the terminal region is a first terminal region insulating layer made of a first base insulating layer. And a second terminal region insulating layer composed of a second base insulating layer is provided.

Therefore, as compared with the case where the terminal region is formed from one base insulating layer, the thickness of the terminal region is formed from two layers, that is, the first terminal region insulating layer and the second terminal region insulating layer. It can be easily made thicker than the thickness of the peripheral region.

As a result, the connection terminal can be brought close to the slider terminal, so that the connection terminal and the slider terminal can be connected more reliably.

The present invention [5] further includes a cover insulating layer that covers a conductor layer so as to expose the connection terminals and is arranged on one side in the thickness direction of the base insulating layer, and a pedestal that supports the slider. A first base pedestal layer composed of a first base insulating layer and arranged on one side in the thickness direction of the metal support substrate, and a first base pedestal layer composed of a second base insulating layer and arranged on one side in the thickness direction of the first base pedestal layer. The suspension substrate with a circuit according to the above [4] is included, which comprises a two-base pedestal layer, a cover insulating layer, and a cover pedestal layer arranged on one side in the thickness direction of the second base pedestal layer.

According to such a configuration, the first base pedestal layer is composed of the first base insulating layer, the second base pedestal layer is composed of the second base insulating layer, and the cover pedestal layer is composed of the cover insulating layer, so that the slider is supported. The pedestal can be formed without separately providing a member for the purpose.

The present invention [6] is the method for manufacturing a suspension substrate with a circuit according to the above [3], wherein a step of preparing a metal support substrate, a first terminal region insulating layer on one side in the thickness direction of the metal support substrate, and the like. A step of forming a first base insulating layer so that at least the first base pedestal layer is arranged on one side in the thickness direction of the metal support substrate, and second terminal region insulation on one side in the thickness direction of the first terminal region insulating layer. A second base insulating layer is formed so as to arrange the layer, the second peripheral region insulating layer on one side in the thickness direction of the metal support substrate, and the second base pedestal layer on one side in the thickness direction of the first base pedestal layer. The step of forming a conductor layer having a connection terminal on one side in the thickness direction of the base insulating layer, and exposing the connection terminals so as to arrange the cover pedestal layer on one side in the thickness direction of the second base pedestal layer. It also includes a method of manufacturing a suspension substrate with a circuit, which comprises a step of forming a cover insulating layer that covers the conductor layer.

According to such a method, it is possible to manufacture a suspension board with a circuit in which the thickness of the terminal region is thicker than the thickness of the peripheral region and the connection terminals can be brought close to the terminals of the slider in the thickness direction. ..

Further, in the step of forming the second terminal region insulating layer and the second peripheral region insulating layer, the second base pedestal layer can be formed at the same time.

Therefore, the pedestal can be efficiently formed without increasing the number of steps, while the connection terminal can be surely brought close to the terminal of the slider.

The present invention [7] is the method for manufacturing a suspension substrate with a circuit according to the above [5], wherein a step of preparing a metal support substrate, a first terminal region insulating layer on one side in the thickness direction of the metal support substrate, and the like. The first step of forming the first base insulating layer so that the first peripheral region insulating layer is arranged on one side in the thickness direction of the metal supporting substrate and the first base pedestal layer is arranged on one side in the thickness direction of the metal supporting substrate. A second base insulating layer is formed so that at least a second terminal region insulating layer is arranged on one side in the thickness direction of the terminal region insulating layer and a second base pedestal layer is arranged on one side in the thickness direction of the first base pedestal layer. The step of forming a conductor layer having a connection terminal on one side in the thickness direction of the base insulating layer, and exposing the connection terminals so as to arrange the cover pedestal layer on one side in the thickness direction of the second base pedestal layer. It also includes a method of manufacturing a suspension substrate with a circuit, which comprises a step of forming a cover insulating layer that covers the conductor layer.

According to such a method, it is possible to manufacture a suspension board with a circuit in which the thickness of the terminal region is thicker than the thickness of the peripheral region and the connection terminals can be brought close to the terminals of the slider in the thickness direction. ..

Further, in the step of forming the first terminal region insulating layer and the first peripheral region insulating layer, the first base pedestal layer can be formed at the same time.

Therefore, the pedestal can be efficiently formed without increasing the number of steps, while the connection terminal can be surely brought close to the terminal of the slider.

According to the suspension board with a circuit of the present invention and the manufacturing method thereof, the connection terminals can be reliably connected to the terminals of the slider.

FIG. 1 shows a plan view of a first embodiment of a suspension substrate with a circuit of the present invention. FIG. 2 shows a plan view of a gimbal portion of the suspension substrate with a circuit shown in FIG. FIG. 3A shows a cross-sectional view of the gimbal portion shown in FIG. 2 along the line AA. FIG. 3B shows a cross-sectional view of the gimbal portion shown in FIG. 2 along the line BB. 4A to 4C are process diagrams for explaining the manufacturing method of the suspension substrate with a circuit shown in FIG. 3B, FIG. 4A is a process of preparing a metal support substrate, and FIG. 4B is a first base insulating layer. FIG. 4C shows a step of forming the second base insulating layer. 5D to 5F are process diagrams for explaining a method of manufacturing a suspension substrate with a circuit shown in FIG. 3B, following FIG. 4C. FIG. 5D is a process of forming a conductor layer, and FIG. 5E is a cover. The process of forming the insulating layer, FIG. 5F, shows the process of externally processing the metal support substrate. 6G to 6I are process diagrams for explaining the manufacturing method of the suspension substrate with a circuit shown in FIG. 3B, following FIG. 5F, and FIG. 6G is a process of partially removing the first base insulating layer. 6H shows a step of forming a plating layer, and FIG. 6I shows a step of mounting a slider. FIG. 7A is a cross-sectional view of a second embodiment of the suspension substrate with a circuit of the present invention, and shows a cross-sectional view corresponding to FIG. 3A. FIG. 7B is a cross-sectional view of a second embodiment of the suspension substrate with a circuit of the present invention, and shows a cross-sectional view corresponding to FIG. 3B.

<First Embodiment>
The suspension board 1 with a circuit shown in FIG. 1 mounts a slider 4 on which a magnetic head 3 is mounted and a piezo element 5, is connected to an external board 6 and a power supply 7, and is mounted on a hard disk drive (not shown). To.

In FIG. 1, the left-right direction of the paper surface is the front-rear direction (first direction), the left side of the paper surface is the front side (one side of the first direction), and the right side of the paper surface is the rear side (the other side of the first direction). The vertical direction of the paper surface is the left-right direction (width direction, second direction), the upper side of the paper surface is the left side (one side in the width direction, one side in the second direction), and the lower side of the paper surface is the right side (the other side in the width direction, the second). The other side of the direction). The paper thickness direction is the vertical direction (thickness direction, third direction), the front side of the paper surface is the upper side (one side in the thickness direction, one side in the third direction), and the back side of the paper surface is the lower side (the other side in the thickness direction, The other side in the third direction). Specifically, it conforms to the direction arrows in each figure.

Further, in FIG. 1, the base insulating layer 9 (described later) other than the crosslinked portion 36 (described later) and the cover insulating layer 11 are omitted. Further, in FIG. 2, the base insulating layer 9 (first base insulating layer 26 (described later), second base insulating layer 27 (described later)) is shown, and the cover insulating layer 11 (described later) is omitted.

As shown in FIG. 1, the suspension substrate 1 with a circuit is formed in a flat band shape extending in the front-rear direction. As shown in FIGS. 3A and 3B, the suspension substrate 1 with a circuit includes a metal support substrate 8, a base insulating layer 9 formed on the metal support substrate 8, and a conductor layer 10 formed on the base insulating layer 9. , A cover insulating layer 11 formed so as to cover the conductor layer 10 on the base insulating layer 9, and a plurality of terminals (external side terminal 57, head side terminal 58, piezo side terminal 59) of the conductor layer 10 described later. ) Is provided with a plating layer 12 for covering the surface thereof.

As shown in FIG. 1, the metal support substrate 8 is formed in a flat band shape extending in the front-rear direction, and integrally includes a main body portion 13 and a gimbal portion 14 formed on the front side of the main body portion 13. ing.

The main body 13 is formed in a substantially rectangular shape in a plan view extending in the front-rear direction. The main body 13 is supported by a load beam (not shown) of the hard disk drive when the suspension board 1 with a circuit is mounted on the hard disk drive.

As shown in FIG. 2, the gimbal portion 14 is formed so as to extend from the tip end side of the main body portion 13.

The gimbal portion 14 includes a pair of outrigger portions 17, a mounting portion 18, and a pair of connecting portions 19.

The outrigger portions 17 have an elongated rectangular shape in a plan view, and are formed as a pair so as to extend linearly from both ends in the width direction of the main body portion 13 toward the front side.

The mounting portions 18 are arranged so as to be spaced inward in the width direction with respect to the pair of outrigger portions 17 and spaced in the front-rear direction with respect to the tip edge of the main body portion 13. The mounting portion 18 is formed in a substantially H-shape in a plan view that opens toward both sides in the width direction. That is, the mounting portion 18 is cut out (opened) at both ends in the width direction of the central portion in the front-rear direction. Specifically, the mounting portion 18 integrally includes a base portion 21, a stage 22, and a central portion 23.

The base portion 21 is arranged at the rear end portion of the mounting portion 18, and is formed in a substantially rectangular shape in a plan view extending long in the width direction.

The stages 22 are arranged on the front side of the base 21 at intervals, and are formed in a substantially rectangular shape in a plan view extending long in the width direction. Further, the stage 22 includes a stage opening 25.

As shown in FIGS. 2 and 3A, the stage opening 25 is formed so as to penetrate the stage 22 in a substantially rectangular shape in a plan view in the thickness direction.

As shown in FIG. 2, the central portion 23 connects the base portion 21 and the center of the stage 22 in the width direction, and is formed in a slender rectangular shape in a plan view extending in the front-rear direction. The central portion 23 is formed to be narrow enough to be curved in the width direction.

In the mounting portion 18, the notched portion is partitioned as a pair of communication spaces 24. The pair of communication spaces 24 are partitioned on both sides of the central portion 23 in the width direction, and are formed so as to penetrate the metal support substrate 8 in the thickness direction.

Each of the pair of connecting portions 19 extends obliquely rearward in the width direction from the respective tip portions of the pair of outrigger portions 17 so as to be connected to both ends in the width direction of the base portion 21. As a result, the pair of connecting portions 19 connects the pair of outrigger portions 17 and the mounting portion 18.
Further, as a result, a substantially U-shape that opens toward the front side in a plan view between the pair of connecting portions 19 and the pair of outrigger portions 17 and between the mounting portion 18 and the main body portion 13. The substrate opening 16 is open.

The metal support substrate 8 is formed of, for example, a metal material such as stainless steel, 42 alloy, aluminum, copper-beryllium, or phosphor bronze. Preferably, it is made of stainless steel.

The thickness of the metal support substrate 8 is, for example, 5 μm or more, preferably 10 μm or more, and for example, 30 μm or less, preferably 25 μm or less.

The base insulating layer 9 is formed on the upper surface of the metal support substrate 8 in a pattern corresponding to the conductor layer 10. The base insulating layer 9 includes a first base insulating layer 26 and a second base insulating layer 27.

The first base insulating layer 26 is arranged on the upper surface of the metal support substrate 8. The first base insulating layer 26 is a pair of a first terminal region insulating layer 28, a pair of first front base layers 29 as an example of the first base pedestal layer, and a pair as an example of the first base pedestal layer. It includes a first rear base layer 30.

The first terminal region insulating layer 28 is formed on the front side of the stage opening 25 in the stage 22. The first terminal region insulating layer 28 is formed in a substantially rectangular shape in a plan view extending outward in the width direction from both ends in the width direction of the stage opening 25. As shown in FIGS. 2 and 3A, the trailing edge of the first terminal region insulating layer 28 coincides with the front edge of the stage opening 25.

Each of the pair of first front base layers 29 is arranged on the stage 22 between the pair of connected spaces 24 and the stage opening 25. The first front base layer 29 is formed in a substantially rectangular shape in a plan view. The pair of first front base layers 29 are arranged at intervals from each other in the width direction.

Each of the pair of first rear base layers 30 is located above the central portion 23, as shown in FIGS. 2 and 3B. The first rear base layer 30 is formed in a substantially rectangular shape in a plan view.
The pair of first rear base layers 30 are spaced apart from each other in the front-rear direction.

The first base insulating layer 26 insulates, for example, a synthetic resin such as a polyimide resin, a polyamideimide resin, an acrylic resin, a polyether nitrile resin, a polyether sulfone resin, a polyethylene terephthalate resin, a polyethylene naphthalate resin, or a polyvinyl chloride resin. It is made of material. Preferably, it is made of a polyimide resin.

Specifically, the thickness of the first base insulating layer 26 is 1 μm or more, preferably 3 μm or more, for example, 30 μm or less, preferably 15 μm or less.

The second base insulating layer 27 is arranged on the metal support substrate 8 so as to cover the first base insulating layer 26. The second base insulating layer 27 includes a main body insulating layer 31 corresponding to the main body 13 and a gimbal insulating layer 32 corresponding to the gimbal 14.

The main body insulating layer 31 is formed so as to correspond to the conductor layer 10 (specifically, the external terminal 57 and the wiring 60, which will be described later) in the main body 13 shown in FIG.

As shown in FIG. 2, the gimbal portion insulating layer 32 includes a substrate opening insulating layer 34 corresponding to the substrate opening 16, a mounting portion insulating layer 35 corresponding to the mounting portion 18, and a cross-linked portion 36. ..

The substrate opening insulating layer 34 is formed so as to straddle the substrate opening 16 in the front-rear direction. Specifically, the substrate opening insulating layer 34 extends from the tips of both ends in the width direction of the main body insulating layer 31 toward the front side so as to continuously pass through the substrate opening 16. The rear side of the 16 is branched on both sides in the width direction, is united on the rear side of the base 21, and is formed in a substantially Y-shape in plan view extending halfway in the front-rear direction of the base 21.

The mounting portion insulating layer 35 is formed in a substantially H shape in a plan view corresponding to the mounting portion 18. Specifically, the mounting portion insulating layer 35 includes a base insulating layer 38, a stage insulating layer 39, and a central insulating layer 40.

The base insulating layer 38 is formed corresponding to the conductor layer 10 in the base 21 of the mounting portion 18. The base insulating layer 38 is formed on the front side of the base 21 of the mounting portion 18 in a substantially rectangular shape in a plan view extending from the substrate opening insulating layer 34 to both outer sides in the width direction. Further, the base insulating layer 38 is formed so as to extend beyond the tip edge of the base 21. In the base insulating layer 38, a portion exposed from the communication space 24 across the central portion 23 of the mounting portion 18 is partitioned as a pair of rear piezo side terminal forming portions 43.

The stage insulating layer 39 is formed corresponding to the conductor layer 10 in the stage 22 of the mounting portion 18. The stage insulating layer 39 is arranged at intervals on the front side of the base insulating layer 38, and is formed in a substantially rectangular shape in a plan view extending from the front side of the stage 22 of the mounting portion 18 to the rear of the rear end edge of the stage 22. Has been done. In the stage insulating layer 39, a portion exposed from the communication space 24 across the central portion 23 of the mounting portion 18 is partitioned as a pair of front piezo side terminal forming portions 44. Further, in the stage insulating layer 39, a portion overlapping the first terminal region insulating layer 28 when projected in the thickness direction is partitioned as a second terminal region insulating layer 54, and a portion other than the second terminal region insulating layer 54 is formed. , The second peripheral region is partitioned as an insulating layer 55. Further, in the stage insulating layer 39, when projected in the thickness direction, the portion overlapping each of the pair of the first front base layers 29 is a pair of the second front bases as an example of the second base pedestal layer. It is partitioned as layer 50. That is, the second front base layer 50 is arranged so as to be spaced apart from each other in the width direction. Further, the stage insulating layer 39 includes a connection terminal opening 45 corresponding to the stage opening 25, and a plurality (two) grounding openings 46.

As shown in FIGS. 2 and 3A, the connection terminal opening 45 is formed so as to penetrate the stage insulating layer 39 in a substantially rectangular shape in the thickness direction. The widthwise both ends and the trailing edge of the connection terminal opening 45 coincide with the widthwise both edges and the trailing edge of the stage opening 25 when projected in the thickness direction. The tip edge of the connection terminal opening 45 is located behind the tip edge of the stage opening 25.

The grounding opening 46 is formed so as to penetrate the stage insulating layer 39 in the thickness direction at a portion of the mounting portion 18 that overlaps with the rear end portion of the stage 22 when projected in the thickness direction.

As shown in FIG. 2, the central insulating layer 40 is formed corresponding to the conductor layer 10 in the central portion 23 of the mounting portion 18. The central insulating layer 40 connects the center of the base insulating layer 38 and the stage insulating layer 39 in the width direction, and is formed in a slender rectangular shape extending in the front-rear direction. The central portion insulating layer 40 is narrower than the central portion 23 and is formed so as to be bendable in the width direction. Further, in the central insulating layer 40, when projected in the thickness direction, the portion overlapping each of the pair of first rear base layers 30 is a pair of second rear sides as an example of the second base pedestal layer. It is partitioned as a base layer 51. That is, the second rear base layer 51 is arranged at a distance from each other in the front-rear direction.

The pair of rear piezo side terminal forming portions 43 and the pair of front piezo side terminal forming portions 44 are combined to form a piezo side terminal forming portion 47.

The piezo-side terminal forming portion 47 includes a terminal opening 49 as shown in FIGS. 2 and 3A.

One terminal opening 49 is formed in each of the pair of rear piezo side terminal forming portions 43 of the base insulating layer 38 and one in each of the pair of front piezo side terminal forming portions 44 of the stage insulating layer 39. ing. The terminal opening 49 is formed so as to penetrate the rear piezo side terminal forming portion 43 and the front piezo side terminal forming portion 44 in a substantially rectangular shape in the thickness direction.

As shown in FIG. 2, the bridging portion 36 is composed of a pair of curved portions 52 and a pair of outrigger portions 17 that curvedly connect the tips of the pair of outrigger portions 17 and both ends in the width direction of the stage 22. It is provided with an E-shaped portion 53 that connects the tip and the tip of the stage 22.

The curved portion 52 extends in a curved shape from the tip of the outrigger portion 17 toward the diagonally front side inward in the width direction, and reaches both ends in the width direction of the stage 22.

The E-shaped portion 53 has a substantially E-shaped shape in a plan view, and specifically, extends from the tips of both outrigger portions 17 toward the front side, then bends inward in the width direction, and extends inward in the width direction. After becoming one, it bends to the rear side and reaches the center of the tip of the stage 22 in the width direction.

The second base insulating layer 27 is formed of the same insulating material as the insulating material forming the first base insulating layer 26.

The thickness of the second base insulating layer 27 is, for example, 20% or more, preferably 40% or more, and for example, 500% or less, preferably 300%, based on 100% of the thickness of the first base insulating layer 26. It is as follows. Specifically, the thickness of the second base insulating layer 27 is, for example, 1 μm or more, preferably 3 μm or more, and for example, 30 μm or less, preferably 15 μm or less.

In the base insulating layer 9, the region where the first terminal region insulating layer 28 and the second terminal region insulating layer 54 are formed is partitioned as the terminal region 62, and when projected in the thickness direction, it overlaps with the terminal region 62. All regions (regions in which the second peripheral region insulating layer 55 is formed) other than the terminal region 62 in the base insulating layer 9 are partitioned as peripheral regions 63.

As shown in FIG. 1, the conductor layer 10 includes an external terminal 57, a head-side terminal 58 as an example of a connection terminal, a piezo-side terminal 59, and a wiring 60.

A plurality (six) of the external terminals 57 are arranged at the rear end of the main body insulating layer 31 corresponding to the main body 13. The external terminal 57 includes a signal terminal 57A and a power supply terminal 57B.

The signal terminals 57A are four arranged at the rear of the plurality (six) of the external terminals 57, and are arranged at intervals in the width direction. The signal terminal 57A is electrically connected to the external substrate 6.

The power supply terminals 57B are two arranged in the front of the plurality (six) of the external terminal 57, and are arranged at intervals in the width direction. The power supply terminal 57B is electrically connected to the power supply 7.

As shown in FIG. 2, a plurality (four) of head-side terminals 58 are provided on the upper surface of the tip end portion of the stage insulating layer 39 corresponding to the stage 22, and are spaced apart from each other in the width direction.
As shown in FIGS. 3A and 3B, the head-side terminal 58 extends in the front-rear direction so as to straddle the tip edge of the stage opening 25 and the tip edge of the connection terminal opening 45. The head-side terminal 58 is electrically connected to the magnetic head 3 via a head bonding material 66 described later. The head side terminal 58 includes a front side portion 58A, a central portion 58B, and a rear side portion 58C.

The front side portion 58A is a portion on the head side terminal 58 that is ahead of the tip edge of the stage opening 25. When projected in the thickness direction, the front side portion 58A overlaps the metal support substrate 8, the first terminal region insulating layer 28 of the first base insulating layer 26, and the second base insulating layer 27. That is, the front side portion 58A overlaps with the terminal region 62 when projected in the thickness direction. In other words, the terminal region 62 overlaps the front side portion 58A when projected in the thickness direction.
The front side portion 58A supports the head side terminal 58.

The central portion 58B is a portion between the tip edge of the stage opening 25 in the head side terminal 58 and the tip edge of the connection terminal opening 45. The central portion 58B extends continuously from the rear end portion of the front side portion 58A. The central portion 58B overlaps with the second base insulating layer 27 when projected in the thickness direction. The central portion 58B is arranged in the stage opening 25, but is supported by the second base insulating layer 27.

The rear side portion 58C is a portion on the head side terminal 58 that is rearward from the tip edge of the connection terminal opening 45. The rear side portion 58C is continuous from the rear end portion of the central portion 58B, bends downward, and then extends rearward. As a result, a step is formed between the upper surface of the rear side portion 58C and the upper surface of the central portion 58B. The lower surface of the rear side portion 58C is flush with the lower surface of the second base insulating layer 27 located in the stage opening 25. The rear side portion 58C is arranged in the stage opening 25 and can be located closer to the magnetic head 3.

A plurality (four) of the piezo side terminals 59 are arranged in the piezo side terminal forming portion 47 of the base insulating layer 9 in the communication space 24. Specifically, the piezo-side terminal 59 is a pair of terminal openings 49 of the rear piezo-side terminal forming portion 43 of the base insulating layer 38 and a pair of front piezo-side terminal forming portions of the stage insulating layer 39. Each terminal opening 49 of 44 is depressed and filled. As shown in FIGS. 2 and 3A, in the piezo side terminal 59, the piezo side terminal 59 filled in each terminal opening 49 of the pair of rear piezo side terminal forming portions 43 is designated as the rear piezo side terminal 59A. The piezo side terminal 59 filled in each terminal opening 49 of the pair of front piezo side terminal forming portions 44 is referred to as a front piezo side terminal 59B. The piezo side terminal 59 is electrically connected to the piezo element 5 via a piezo bonding material 68 described later.

As shown in FIG. 1, the wiring 60 is provided in the width direction in the main body insulating layer 31 (see FIG. 2) corresponding to the main body 13 and the gimbal insulating layer 32 (see FIG. 2) corresponding to the gimbal portion 14. A plurality (six) are formed at intervals of each other. The wiring 60 includes a signal wiring 60A and a power supply wiring 60B.

The signal wirings 60A are four inside in the width direction of the plurality (six) wirings 60, and are electrically connected to the signal terminal 57A and the head side terminal 58. The signal wiring 60A transmits an electric signal between the magnetic head 3 (see FIGS. 3A and 3B) and the external substrate 6.

Specifically, the signal wiring 60A extends from the signal terminal 57A toward the front side at the rear end of the main body insulating layer 31 (see FIG. 2) corresponding to the main body 13, and then is shown in FIG. It is formed so as to sequentially pass over the substrate opening insulating layer 34 and the mounting portion insulating layer 35 to reach the head side terminal 58.

The signal wiring 60A overlaps with the pair of the first rear base layer 30 of the first base insulating layer 26 when projected in the thickness direction in the central insulating layer 40 of the mounting portion insulating layer 35.
Further, the signal wiring 60A overlaps the first front base layer 29 and the first terminal region insulating layer 28 when projected in the thickness direction in the stage insulating layer 39 of the mounting portion insulating layer 35.

As shown in FIG. 1, the power supply wiring 60B is two of the plurality of (six) wirings 60 on both outer sides in the width direction of the signal wiring 60A, and is connected to the power supply terminal 57B and the rear piezo side terminal 59A. It is electrically connected. The power supply wiring 60B supplies electric power to the piezo element 5 from the power supply 7.

Specifically, the power supply wiring 60B extends from the power supply terminal 57B toward the front side at the rear end portion of the main body portion insulating layer 31 (see FIG. 2) corresponding to the main body portion 13, as shown in FIG. It is formed so as to sequentially pass through the substrate opening insulating layer 34 and the mounting portion insulating layer 35 to reach the rear piezo side terminal 59A.

Further, the wiring 60 includes ground wiring 60C formed in a plurality (two) of the gimbal portion insulating layer 32 corresponding to the gimbal portion 14 at intervals in the width direction.

The ground wiring 60C is provided to ground the front piezo side terminal 59B. Specifically, as shown in FIGS. 2 and 3A, the ground wiring 60C extends from the front piezo side terminal 59B toward the front side, and falls into the ground opening 46 on the rear side of the signal wiring 60A and is filled. It is bent downward so as to be in contact with the metal support substrate 8.

The conductor layer 10 is formed of, for example, a conductor material such as copper, nickel, gold, solder, or an alloy thereof. Preferably, it is made of copper.

The thickness of the conductor layer 10 is 10% or more, preferably 30%, based on 100% of the thickness of the base insulating layer 9 (the sum of the thickness of the first base insulating layer 26 and the thickness of the second base insulating layer 27). The above is, for example, 200% or less, preferably 100% or less. Specifically, the thickness of the conductor layer 10 is, for example, 3 μm or more, preferably 5 μm or more, and for example, 50 μm or less, preferably 20 μm or less.

The cover insulating layer 11 is formed over the main body portion 13 and the gimbal portion 14, as shown in FIG. 1, and is arranged on the base insulating layer 9 as shown in FIGS. 3A and 3B, and is a conductor in a plan view. It is formed in a pattern including the layer 10.

Specifically, the cover insulating layer 11 is formed in a pattern that covers the upper surface of the wiring 60 and exposes the upper surface of the external terminal 57 (see FIG. 1) and the head side terminal 58.

Further, in the cover insulating layer 11, when projected in the thickness direction, a portion overlapping the pair of the first front base layer 29 and the pair of the second front base layer 50 is 1 as an example of the cover pedestal layer. It is partitioned as a pair of front slider contact layers 78.

Then, the first pedestal 88 as an example of the pedestal is formed from the first front base layer 29, the second front base layer 50, and the front slider contact layer 78. That is, a pair of first pedestals 88 is provided. A pair of first pedestals 88 are arranged apart from each other in the width direction.

Further, in the cover insulating layer 11, a portion overlapping the pair of the first rear base layer 30 and the pair of the second rear base layer 51 when projected in the thickness direction is 1 as an example of the cover pedestal layer. It is partitioned as a pair of rear slider contact layers 79.

A second pedestal 89 as an example of the pedestal is formed from the first rear base layer 30, the second rear base layer 51, and the rear slider contact layer 79. That is, a pair of second pedestals 89 is provided. A pair of second pedestals 89 are arranged at intervals from each other in the front-rear direction. The pair of second pedestals 89 is located behind the pair of first pedestals 88 and is arranged substantially in the center of the pair of first pedestals 88 in the width direction. As a result, either one of the pair of the second pedestals 89 and the pair of the first pedestals 88 are arranged in a substantially triangular shape having each as the apex.

The cover insulating layer 11 is formed of the same insulating material as the insulating material forming the base insulating layer 9 (first base insulating layer 26 and second base insulating layer 27). The thickness of the cover insulating layer 11 is, for example, 50% or more, preferably 80% or more, and for example, 200% or less, preferably 150% or less, based on 100% of the thickness of the first base insulating layer 26. is there. The thickness of the cover insulating layer 11 is, for example, 10% or more, preferably 30% or more, and for example, 100% or less, preferably 70%, based on 100% of the thickness of the second base insulating layer 27. It is as follows. Specifically, the thickness of the cover insulating layer 11 is, for example, 1 μm or more, preferably 3 μm or more, and for example, 40 μm or less, preferably 10 μm or less.

The plating layer 12 is formed on the surfaces of a plurality of terminals, specifically, an external terminal 57, a head terminal 58, and a piezo side terminal 59. The plating layer 12 is formed by, for example, electroless plating, electrolytic plating or the like, preferably electrolytic plating. The plating layer 12 is formed of, for example, a metal material such as nickel or gold, and is preferably formed of gold.
The thickness of the plating layer 12 is, for example, 5% or more, preferably 10% or more, and for example, 100% or less, preferably 50% or less, based on 100% of the thickness of the conductor layer 10. Specifically, the thickness of the plating layer 12 is, for example, 0.1 μm or more, preferably 1 μm or more, and for example, 8 μm or less, preferably 4 μm or less.

The slider 4 is equipped with a magnetic head 3 capable of reading and writing information on the hard disk at its tip, and is formed in a substantially rectangular box shape in a plan view. At the tip of the magnetic head 3, a plurality of (four) head terminals 65 are provided corresponding to the plurality of head-side terminals 58.

The head terminal 65 is arranged on the front end surface of the magnetic head 3, is located above the lower end of the magnetic head 3, has a length in the thickness direction, and is provided so as to face the front side.

The slider 4 is mounted on a pair of first pedestals 88 and a pair of second pedestals 89 via an adhesive or the like, and the head terminal 65 faces the upper surface of the head side terminal 58 on the head side. It is arranged on the upper side of the terminal 58 at a minute interval.

A head joining material 66 is provided on the upper surface of the head side terminal 58.

The head bonding material 66 is formed of, for example, a conductive material such as solder or a conductive adhesive. Preferably, it is made of low melting point solder. Examples of the low melting point solder include solder made of an alloy of tin, silver and copper, solder made of an alloy of tin, silver, bismuth and indium, solder made of an alloy of tin and zinc, and an alloy of tin and bismuth. Examples thereof include solder, tin, bismuth, and solder made of an alloy of silver. The melting point of low melting point solder is preferably 220 ° C. or lower. In addition, examples of the conductive adhesive include silver paste and the like.

The head bonding material 66 electrically connects the head side terminal 58 and the head terminal 65 of the magnetic head 3.

In this way, in the terminal region 62, the first terminal region insulating layer 28 of the first base insulating layer 26 and the second terminal region insulating layer 54 of the second base insulating layer 27 are formed on the head side. The terminal 58 is brought close to the head terminal 65 of the magnetic head 3 mounted on the slider 4.

The piezo element 5 is an actuator that can expand and contract in the front-rear direction, and is formed in a substantially rectangular shape in a plan view extending in the front-rear direction. The piezo element 5 expands and contracts when electric power is supplied and the voltage is controlled. A piezo terminal 67 is provided on each of the front side and the rear side of the upper portion of the piezo element 5. As shown in FIGS. 2 and 3A, the piezo elements 5 are arranged in pairs at intervals in the width direction. At this time, in the piezo element 5, the rear piezo side terminal 59A and the front piezo side terminal 59B are erected from below with respect to the suspension board 1 with a circuit, and the piezo terminal 67 is provided with respect to the lower surface of the piezo side terminal 59. It is arranged so that it faces.

A piezo bonding material 68 is provided on the upper surface of the piezo side terminal 59. The piezo bonding material 68 is formed of, for example, the same conductive material as the conductive material forming the head bonding material 66.

The piezo bonding material 68 electrically connects the piezo side terminal 59 and the piezo terminal 67 of the piezo element 5.

Next, a method of manufacturing the suspension substrate 1 with a circuit will be described with reference to FIGS. 4A to 6I.

In this method, as shown in FIG. 4A, first, the metal support substrate 8 is prepared.

Next, as shown in FIG. 4B, the first base insulating layer 26 is formed on the metal support substrate 8.

Specifically, the first base insulating layer 26 is applied to the first terminal region insulating layer 28, a pair of first front base layers 29 (see FIG. 3A), and a pair of first rear base layers 30. As a corresponding pattern, it is formed on the metal support substrate 8.

To form a first base insulating layer 26 comprising a first terminal region insulating layer 28, a pair of first front base layers 29 (see FIG. 3A), and a pair of first rear base layers 30. A varnish of a photosensitive insulating material is applied onto the metal support substrate 8 and dried to form a base film.

Then, the base film is exposed through a photomask (not shown). The photomask is provided with a light-shielding portion and a light-shielding portion in a pattern, a light-shielding portion is provided in a portion forming the first base insulating layer 26, and a light-shielding portion is provided in a portion not forming the first base insulating layer 26. Is placed facing the base film and exposed.

Then, the base film is developed and, if necessary, heat-cured to form a first terminal region insulating layer 28, a pair of first front base layers 29 (see FIG. 3A), and a pair of first rear bases. The base insulating layer 9 including the layer 30 is formed in the above-mentioned pattern.

Next, as shown in FIG. 4C, the second base insulating layer 27 is formed on the metal support substrate 8 so as to cover the first base insulating layer 26.

Specifically, the second base insulating layer 27 is formed on the metal support substrate 8 as a pattern corresponding to the main body insulating layer 31 (see FIG. 1) and the gimbal insulating layer 32. In the gimbal portion insulating layer 32, the second terminal region insulating layer 54, the second peripheral region insulating layer 55, the pair of second front base layers 50 (see FIG. 3A), and the pair of second rear sides. It is formed as a pattern including a base layer 51 and a connection terminal opening 45.

To form the second base insulating layer 27 on which the connection terminal opening 45 is formed, a varnish of a photosensitive insulating material is applied onto the metal support substrate 8 and the first base insulating layer 26 and dried. Form a base film.

Then, the base film is exposed through a photomask (not shown). The photomask is provided with a light-shielding portion and a light-transmitting portion in a pattern, and a portion that forms the base insulating layer 9 (excluding the portion forming the connection terminal opening 45) is provided with a light-transmitting portion and base insulation. A light-shielding portion is arranged to face the base film in the portion where the layer 9 is not formed and the portion where the connection terminal opening 45 is formed, and is exposed.

Then, the base film is developed and, if necessary, heat-cured to cause a second terminal region insulating layer 54, a second peripheral region insulating layer 55, a pair of second front base layers 50, and a pair of second rear sides. The base layer 51 and the base insulating layer 9 provided with the connection terminal opening 45 are formed in the above pattern.

Next, as shown in FIG. 5D, the conductor layer 10 is formed on the upper surface of the base insulating layer 9. Specifically, the conductor layer 10 is formed on the upper surface of the base insulating layer 9 by a pattern forming method such as an additive method or a subtractive method, preferably an additive method.

As a result, as shown in FIG. 1, the conductor layer 10 is formed so as to include an external terminal 57, a head terminal 58, a piezo side terminal 59, and a wiring 60 on the upper surface of the base insulating layer 9. Ru. The rear side portion 58C of the head side terminal 58 is formed so as to drop into the upper surface of the first terminal region insulating layer 28.

Then, as shown in FIG. 5E, the cover insulating layer 11 is placed on the second base insulating layer 27 with a pair of front slider contact layers 78 (see FIG. 3A) and a pair of rear slider contact layers. It is formed as a pattern including 79. To form a cover insulating layer 11 with a pair of front slider contact layers 78 (see FIG. 3A) and a pair of rear slider contact layers 79, on top of the second base insulating layer 27 and the conductor layer 10. After applying a varnish of a photosensitive insulating material and drying it to form a cover film, the cover film is exposed, and then developed and heat-cured to form the above-mentioned pattern.

As a result, as shown in FIG. 3A, the pair of front slider contact layers 78 are the pair of second front base layers 50 of the corresponding second base insulation layers 27 and the first base insulation layer. Together with a pair of 26 first front base layers 29, it constitutes a first pedestal 88.

Further, as shown in FIG. 5E, the pair of rear slider contact layers 79 is a pair of the second rear base layer 51 of the corresponding second base insulating layer 27 and one of the first base insulating layer 26. Together with the pair of first rear base layers 30, it constitutes a second pedestal 89.

Next, as shown in FIG. 5F, the metal support substrate 8 is externally processed so that the substrate opening 16 (see FIGS. 1 and 2) and the stage opening 25 are formed by, for example, etching. ..

As a result, the lower surface of the rear end portion of the first terminal region insulating layer 28 is exposed from the stage opening 25.

Next, as shown in FIG. 6G, in the base insulating layer 9, the rear end portion of the first terminal region insulating layer 28 exposed from the stage opening 25 is removed. Specifically, it is removed by etching, preferably wet etching or the like.

As a result, the lower surface of the rear end portion of the second terminal region insulating layer 54 is exposed, and the lower surface of the rear side portion 58C of the head side terminal 58 is exposed.

Next, as shown in FIG. 6H, a plating layer 12 is formed on the surfaces of the plurality of terminals, specifically, the external terminal 57, the head terminal 58, and the piezo terminal 59.

Specifically, the plating layer 12 is formed by plating such as electroless plating or electrolytic plating, preferably electrolytic plating.

As a result, the suspension board 1 with a circuit is completed.

Next, as shown in FIG. 6I, when connecting the slider 4 on which the magnetic head 3 is mounted to the suspension substrate 1 with a circuit, first, the head bonding material 66 is placed on the head side terminal 58 (plating layer 12). To form. Specifically, the head bonding material 66 is formed by printing the above-mentioned conductive material with a known printing machine or applying it with a dispenser.

Next, the slider 4 on which the magnetic head 3 is mounted is supported by a pair of first pedestals 88 (see FIGS. 2 and 3A) and a pair of second pedestals 89, and the head terminal 65 is head-side terminal 58. It is arranged above the suspension substrate 1 with a circuit so as to be located above the above.

Then, the head bonding material 66 is heated to a temperature equal to or higher than the melting temperature by a laser (Xe lamp laser) irradiation or a heating method such as a soldering iron. Preferably, the head bonding material 66 is heated by laser irradiation.

As a result, as shown in FIGS. 3A and 3B, the head bonding material 66 is melted and flows, and the head side terminal 58 and the head terminal 65 of the magnetic head 3 are electrically connected.

At this time, since the head bonding material 66 forms a fillet, the head bonding material 66 can be reliably arranged up to the upper end portion of the head terminal 65, and the head side terminal 58 and the head terminal 65 can be reliably electrically arranged. Can be connected to.

Further, as shown in FIG. 3A, when the piezo element 5 is connected to the suspension substrate 1 with a circuit, first, the piezo bonding material 68 is formed under the piezo side terminal 59. Specifically, the above-mentioned conductive material is printed by a known printing machine or applied with a dispenser to form the piezo bonding material 68.

Then, the pair of piezo elements 5 are arranged below the suspension substrate 1 with a circuit so that the piezo terminals 67 are located below the corresponding piezo side terminals 59.

Next, the gimbal portion 14 of the suspension substrate 1 with a circuit in which the piezo element 5 is arranged is placed in a reflow furnace and heated to reflow the piezo bonding material 68.

The reflow temperature is equal to or higher than the temperature at which the piezo bonding material 68 melts, for example, 100 ° C. or higher, preferably 130 ° C. or higher, and for example, 350 ° C. or lower, preferably 300 ° C. or lower.

The reflow time is, for example, 5 seconds or more, preferably 10 seconds or more, and for example, 500 seconds or less, preferably 300 seconds or less.

As a result, the piezo bonding material 68 flows by melting, and the piezo side terminal 59 and the piezo terminal 67 of the piezo element 5 are adhered to each other.

The piezo element 5 is supplied with electric power from the power source 7 via the piezo side terminal 59, and the voltage is controlled to expand and contract in the front-rear direction. The position of the slider 4 can be finely adjusted by expanding and contracting the piezo element 5.

According to the suspension substrate 1 with a circuit, as shown in FIGS. 3A and 3B, the thickness of the terminal region 62 is thicker than the thickness of the peripheral region 63. Therefore, in the thickness direction, the head side terminal 58 is magnetized by the slider 4. It can be brought close to the head terminal 65 of the head 3.

Therefore, the head terminal 58 and the head terminal 65 can be reliably connected.

On the other hand, since the thickness of the peripheral region 63 is thinner than the thickness of the terminal region 62, the suspension substrate 1 with a circuit can be made lighter and thinner.

According to the suspension substrate 1 with a circuit, as shown in FIGS. 3A and 3B, the peripheral region 63 includes the second peripheral region insulating layer 55 composed of the second base insulating layer 27, whereas the terminal region 62 includes a first terminal region insulating layer 28 made of a first base insulating layer 26 and a second terminal region insulating layer 54 made of a second base insulating layer 27.

Therefore, as compared with the case where the terminal region 62 is formed from the one-layer base insulating layer 9, the thickness of the terminal region 62 is increased from two layers, that is, from the first terminal region insulating layer 28 and the second terminal region insulating layer 54. By forming it, it can be easily made thicker than the thickness of the peripheral region 63.

As a result, the head-side terminal 58 can be brought close to the terminal of the slider 4, so that the head-side terminal 58 and the head terminal 65 of the magnetic head 3 of the slider 4 can be more reliably connected.

According to the suspension substrate 1 with a circuit, as shown in FIGS. 3A and 3B, the pair of the first front base layer 29 and the pair of the first rear base layer 30 are composed of the first base insulating layer 26. A pair of second front base layers 50 and a pair of second rear base layers 51 are composed of a second base insulating layer 27, a pair of front slider contact layers 78 and a pair of rear slider contact layers. Since 79 is composed of the cover insulating layer 11, a pair of first pedestal 88 and a pair of second pedestal 89 are formed so as to cover the wiring 60 without separately providing a member for supporting the slider 4. can do.

According to the manufacturing method of the suspension substrate 1 with a circuit, as shown in FIGS. 3A and 3B, the thickness of the terminal region 62 is thicker than the thickness of the peripheral region 63, and the head side terminal 58 is slider 4 in the thickness direction. It is possible to manufacture a suspension substrate 1 with a circuit that can be brought close to the terminals of.

Further, as shown in FIG. 4C, in the step of forming the second terminal region insulating layer 54 and the second peripheral region insulating layer 55, a pair of the second front base layer 50 and a pair of the second rear side are formed. The base layer 51 can be formed at the same time.

Therefore, the head side terminal 58 can be surely brought close to the terminal of the slider 4, and the pair of the first pedestal 88 and the pair of the second pedestal 89 can be efficiently formed without increasing the number of separate steps. it can.

<Second Embodiment>
Next, the suspension substrate 1 with a circuit of the second embodiment of the present invention will be described with reference to FIGS. 7A and 7B. In the second embodiment, the same members as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

In the first embodiment described above, the first base insulating layer 26 includes only the first terminal region insulating layer 28, a pair of first front base layers 29, and a pair of first rear base layers 30. The 2 base insulating layer 27 includes a main body insulating layer 31 corresponding to the main body 13 and a gimbal insulating layer 32 corresponding to the gimbal portion 14.

On the other hand, in the second embodiment, the first base insulating layer 26 includes a main body insulating layer 31 corresponding to the main body 13 and a gimbal insulating layer 32 corresponding to the gimbal portion 14, and the second base insulating layer. 27 does not include a second peripheral region insulating layer 55, but includes only a second terminal region insulating layer 54, a pair of second front base layers 50, and a pair of second rear base layers 51. ..

Then, in the stage insulating layer 39 of the first base insulating layer 26, a portion overlapping with the second terminal region insulating layer 54 is partitioned as the first terminal region insulating layer 28. In other words, the second terminal region insulating layer 54 is arranged on the first terminal region insulating layer 28. Further, in the first base insulating layer 26, a portion other than the first terminal region insulating layer 28 is partitioned as a first peripheral region insulating layer 95.

In the base insulating layer 9, the region where the first terminal region insulating layer 28 and the second terminal region insulating layer 54 are formed is partitioned as the terminal region 62, and when projected in the thickness direction, it overlaps with the terminal region 62. All regions (regions in which the first peripheral region insulating layer 95 is formed) other than the terminal region 62 in the base insulating layer 9 are partitioned as peripheral regions 63.

In order to manufacture such a suspension substrate 1 with a circuit, in the step of forming the first base insulating layer 26 of the first embodiment described above on the metal support substrate 8, in the second embodiment, the first base insulation The layer 26 is formed on the metal support substrate 8 as a pattern corresponding to the main body insulating layer 31 (see FIG. 1) and the gimbal insulating layer 32. In the gimbal portion insulating layer 32, the first terminal region insulating layer 28, the first peripheral region insulating layer 95, a pair of first front base layers 29, and a pair of first rear base layers 30. It is formed as a pattern including the connection terminal opening 45.

Further, in the step of forming the second base insulating layer 27 of the first embodiment on the metal support substrate 8 so as to cover the first base insulating layer 26, in the second embodiment, the second base The insulating layer 27 is placed on the first base insulating layer 26 as a pattern including a second terminal region insulating layer 54, a pair of second front base layers 50, and a pair of second rear base layers 51. To form.

The suspension substrate 1 with a circuit is manufactured by the same manufacturing method as in the first embodiment except for the above steps.

As described above, the suspension board 1 with a circuit of the second embodiment is completed.

According to the suspension substrate 1 with a circuit, as shown in FIGS. 7A and 7B, the peripheral region 63 includes the first peripheral region insulating layer 95 composed of the first base insulating layer 26, whereas the terminal region 62 includes a first terminal region insulating layer 28 made of a first base insulating layer 26 and a second terminal region insulating layer 54 made of a second base insulating layer 27.

Therefore, as compared with the case where the terminal region 62 is formed from the one-layer base insulating layer 9, the thickness of the terminal region 62 is increased from two layers, that is, from the first terminal region insulating layer 28 and the second terminal region insulating layer 54. By forming it, it can be easily made thicker than the thickness of the peripheral region 63.

As a result, the head-side terminal 58 can be brought close to the head terminal 65 of the magnetic head 3 of the slider 4, so that the head-side terminal 58 and the head terminal 65 can be more reliably connected.

According to the suspension substrate 1 with a circuit, as shown in FIGS. 7A and 7B, the pair of the first front base layer 29 and the pair of the first rear base layer 30 are composed of the first base insulating layer 26. A pair of second front base layers 50 and a pair of second rear base layers 51 are composed of a second base insulating layer 27, a pair of front slider contact layers 78 and a pair of rear slider contact layers. Since 79 is composed of the cover insulating layer 11, a pair of first pedestal 88 and a pair of second pedestal 89 are formed so as to cover the wiring 60 without separately providing a member for supporting the slider 4. can do.

According to the manufacturing method of the suspension substrate 1 with a circuit, as shown in FIGS. 7A and 7B, the thickness of the terminal region 62 is thicker than the thickness of the peripheral region 63, and the head side terminal 58 is slider 4 in the thickness direction. It is possible to manufacture a suspension substrate 1 with a circuit that can be brought close to the terminals of.

Further, in the step of forming the first terminal region insulating layer 28 and the first peripheral region insulating layer 95, a pair of the first front base layer 29 and a pair of the first rear base layer 30 are simultaneously formed. be able to.

Therefore, the head side terminal 58 can be surely brought close to the terminal of the slider 4, and the pedestal can be efficiently formed without increasing the number of separate steps.

<Modification example>
In the first and second embodiments described above, the suspension board 1 with a circuit includes a first pedestal 88 and a second pedestal 89 for supporting the slider 4, but the first pedestal 88 and the second pedestal The slider 4 may be supported by an adhesive layer or the like without the 89.

Even in such a modified example, the same effects as those of the first embodiment and the second embodiment can be obtained.

1 Suspension board with circuit 4 Slider 8 Metal support board 9 Base insulation layer 10 Conductor layer 11 Cover insulation layer 26 1st base insulation layer 27 2nd base insulation layer 28 1st terminal area insulation layer 29 1st destination base layer 30th 1 Rear base layer 50 2nd front base layer 51 2nd rear base layer 54 2nd terminal area insulation layer 55 2nd peripheral area insulation layer 58 Head side terminal 62 Terminal area 63 Peripheral area 78 Front slider contact layer 79 Rear slider contact layer 88 1st pedestal 89 2nd pedestal 95 1st peripheral area insulation layer

Claims (2)

A conductor including a metal support substrate, a base insulating layer arranged on one side of the metal support substrate in the thickness direction, and a connection terminal arranged on one side of the base insulation layer in the thickness direction and electrically connected to a slider. A suspension board with a circuit that has layers.
The base insulating layer is
When projected in the thickness direction, at least the terminal area that overlaps with the connection terminal,
It does not overlap with the terminal area and has a peripheral area around the terminal area.
The thickness of the terminal region is thicker than the thickness of the peripheral region.
The base insulating layer is
A first base insulating layer arranged on one side of the metal support substrate in the thickness direction,
A second base insulating layer that covers the first base insulating layer and is arranged on one side of the metal support substrate in the thickness direction is provided.
The terminal area is
A first terminal region insulating layer composed of the first base insulating layer and arranged on one side of the metal support substrate in the thickness direction.
It is composed of the second base insulating layer, and includes a second terminal region insulating layer arranged on one side in the thickness direction of the first terminal region insulating layer.
The thickness of the terminal region is the total thickness of the first terminal region insulating layer and the second terminal region insulating layer.
The peripheral region comprises the second base insulating layer, and includes a second peripheral region insulating layer arranged on one side of the metal support substrate in the thickness direction.
The thickness of the peripheral region is the thickness of the second peripheral region insulating layer.
The suspension board with a circuit further includes a pedestal for supporting the slider.
The pedestal includes the first base insulating layer or the second base insulating layer.
The peripheral area does not include the pedestal
A suspension substrate with a circuit, wherein the conductor layer is not located between the first base insulating layer and the second base insulating layer in the entire region of the base insulating layer. A conductor including a metal support substrate, a base insulating layer arranged on one side of the metal support substrate in the thickness direction, and a connection terminal arranged on one side of the base insulation layer in the thickness direction and electrically connected to a slider. A suspension board with a circuit that has layers.
The base insulating layer is
When projected in the thickness direction, at least the terminal area that overlaps with the connection terminal,
It does not overlap with the terminal area and has a peripheral area around the terminal area.
The thickness of the terminal region is thicker than the thickness of the peripheral region.
The base insulating layer is
A first base insulating layer arranged on one side of the metal support substrate in the thickness direction,
A second base insulating layer arranged on one side of the first base insulating layer in the thickness direction,
With
The terminal area is
A first terminal region insulating layer composed of the first base insulating layer and arranged on one side of the metal support substrate in the thickness direction.
It is composed of the second base insulating layer, and includes a second terminal region insulating layer arranged on one side of the first terminal region insulating layer in the thickness direction.
The thickness of the terminal region is the total thickness of the first terminal region insulating layer and the second terminal region insulating layer.
The peripheral region comprises the first base insulating layer, and includes a first peripheral region insulating layer arranged on one side of the metal support substrate in the thickness direction.
The thickness of the peripheral region is the thickness of the first peripheral region insulating layer.
The suspension board with a circuit further includes a pedestal for supporting the slider.
The pedestal includes the first base insulating layer or the second base insulating layer.
The peripheral area does not include the pedestal
A suspension substrate with a circuit, wherein the conductor layer is not located between the first base insulating layer and the second base insulating layer in the entire region of the base insulating layer.

Images