JP6025194B2 - contact - Google Patents

contact Download PDF

Info

Publication number
JP6025194B2
JP6025194B2 JP2012248606A JP2012248606A JP6025194B2 JP 6025194 B2 JP6025194 B2 JP 6025194B2 JP 2012248606 A JP2012248606 A JP 2012248606A JP 2012248606 A JP2012248606 A JP 2012248606A JP 6025194 B2 JP6025194 B2 JP 6025194B2
Authority
JP
Japan
Prior art keywords
spring member
contact
housing
contact portion
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012248606A
Other languages
Japanese (ja)
Other versions
JP2014096324A (en
Inventor
中村　達哉
達哉 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Priority to JP2012248606A priority Critical patent/JP6025194B2/en
Priority to PCT/JP2013/079756 priority patent/WO2014073495A1/en
Priority to US14/442,125 priority patent/US9735483B2/en
Priority to EP13852428.5A priority patent/EP2919327B1/en
Publication of JP2014096324A publication Critical patent/JP2014096324A/en
Application granted granted Critical
Publication of JP6025194B2 publication Critical patent/JP6025194B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2492—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point multiple contact points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2101/00—One pole

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

本発明は、プリント配線基板の取付対象面に表面実装されて、前記プリント配線基板とは別の導電性部材との間に挟み込まれることにより、前記プリント配線基板の導電パターンと前記導電性部材とを電気的に接続するコンタクトに関する。   The present invention is mounted on a surface to be attached to a printed wiring board, and sandwiched between a conductive member different from the printed wiring board, whereby the conductive pattern of the printed wiring board and the conductive member It is related with the contact which connects electrically.

従来、この種のコンタクトは、導電性及び弾性を有する薄板から構成されたバネ部材を、プリント配線基板の導電パターンと前記導電性部材との間に弾発状に挟み込まれる形状に加工したものが提案されている。ここで、このようなバネ部材は、そのバネ部材の各部の変形方向に交差する方向から押圧されると、そのバネ部材が潰れて使用不能となる。そこで、前記バネ部材を、少なくとも前記バネ部材の各部の変形方向を挟む両側から、樹脂製のハウジングで包囲して保護することが提案されている（例えば、特許文献１参照）。   Conventionally, this type of contact has been obtained by processing a spring member made of a thin plate having conductivity and elasticity into a shape that is elastically sandwiched between a conductive pattern of a printed wiring board and the conductive member. Proposed. Here, when such a spring member is pressed from a direction crossing the deformation direction of each part of the spring member, the spring member is crushed and cannot be used. Thus, it has been proposed to protect the spring member by enclosing it with a resin housing from at least both sides sandwiching the deformation direction of each part of the spring member (see, for example, Patent Document 1).

なお、この特許文献１にはバネ部材とハウジングとの固定方法については詳細に記載されていない。樹脂部材とバネ部材とを強固に固定する構成としては、バネ部材が１枚の金属板からなる例ではあるが、バネ部材を構成する金属の一部を樹脂部材にかしめて固定する構成が提案されている（例えば、特許文献２参照。）。   In addition, this patent document 1 does not describe in detail a method for fixing the spring member and the housing. The configuration in which the resin member and the spring member are firmly fixed is an example in which the spring member is made of a single metal plate, but a configuration in which a part of the metal constituting the spring member is caulked and fixed to the resin member is proposed. (For example, see Patent Document 2).

実用新案登録第３０１２６７７号公報Utility Model Registration No. 3012677 特開２００５−３２６３９号公報JP 2005-32639 A

ところが、バネ部材を樹脂製のハウジングで包囲して、そのハウジングに対してバネ部材をかしめて固定するためには、バネ部材とハウジングとの位置関係を正確に保持した状態でバネ部材をプレス変形させる必要があり、製造には高価な装置が必要となる。   However, in order to surround the spring member with a resin housing and fix the spring member to the housing by caulking, the spring member is press-deformed with the positional relationship between the spring member and the housing accurately maintained. An expensive device is required for manufacturing.

そこで、本発明は、導電性及び弾性を有する薄板から構成されてプリント配線基板の導電パターンと導電性部材との間に弾発状に挟み込まれるバネ部材を、樹脂製のハウジングで包囲した構成を有し、かつ、製造が容易なコンタクトの提供を目的としてなされた。   Therefore, the present invention has a configuration in which a spring member that is formed of a thin plate having conductivity and elasticity and is elastically sandwiched between a conductive pattern of a printed wiring board and a conductive member is surrounded by a resin housing. It has been made for the purpose of providing a contact that is easy to manufacture.

前記目的を達するためになされた本発明のコンタクトは、導電性及び弾性を有する薄板から構成され、プリント配線基板の導電パターンと前記プリント配線基板とは別の導電性部材との間に弾発状に挟み込まれるバネ部材と、前記バネ部材の少なくとも一部を、少なくとも前記バネ部材の各部の変形方向を挟む両側から包囲して、前記バネ部材を前記プリント配線基板上に支持する樹脂製のハウジングと、前記バネ部材と前記ハウジングとにそれぞれ形成され、前記ハウジングが前記バネ部材を包囲する位置に配設されたときに互いに係合して、前記バネ部材の少なくとも一部を前記ハウジングの少なくとも一部に固定する係合部と、を備えたことを特徴としている。   The contact of the present invention made to achieve the above object is composed of a thin plate having conductivity and elasticity, and has a resilient shape between a conductive pattern of a printed wiring board and a conductive member different from the printed wiring board. A spring member sandwiched between and a resin housing that surrounds at least a part of the spring member from both sides sandwiching at least a deformation direction of each part of the spring member, and supports the spring member on the printed circuit board. Each of the spring member and the housing is engaged with each other when the housing is disposed at a position surrounding the spring member, and at least a part of the spring member is at least a part of the housing. And an engaging portion to be fixed to the head.

このように構成された本発明のコンタクトは、次のようなバネ部材とハウジングとから構成されている。バネ部材は、導電性及び弾性を有する薄板から構成され、プリント配線基板の導電パターンと前記プリント配線基板とは別の導電性部材との間に弾発状に挟み込まれる。このため、バネ部材が前記導電パターンと前記導電性部材との間に弾発状に挟み込まれるように本発明のコンタクトを配置すれば、前記導電パターンと前記導電性部材とを電気的に接続することができる。   The contact of the present invention configured as described above includes the following spring member and housing. The spring member is composed of a thin plate having conductivity and elasticity, and is elastically sandwiched between a conductive pattern of the printed wiring board and another conductive member different from the printed wiring board. For this reason, if the contact of the present invention is arranged so that the spring member is elastically sandwiched between the conductive pattern and the conductive member, the conductive pattern and the conductive member are electrically connected. be able to.

また、ハウジングは、樹脂によって構成され、前記バネ部材の少なくとも一部を、少なくとも前記バネ部材の各部の変形方向を挟む両側から包囲して、前記バネ部材を前記プリント配線基板上に支持する。このため、このハウジングでバネ部材を包囲したことにより、そのバネ部材の各部の変形方向に交差する方向から当該バネ部材が押圧されても、そのバネ部材が潰れるのを抑制することができる。   The housing is made of resin, and surrounds at least a part of the spring member from both sides sandwiching at least the deformation direction of each part of the spring member, and supports the spring member on the printed wiring board. For this reason, by enclosing the spring member with this housing, even if the spring member is pressed from the direction intersecting the deformation direction of each part of the spring member, the spring member can be prevented from being crushed.

また、前記バネ部材と前記ハウジングとには、係合部がそれぞれ形成され、前記ハウジングが前記バネ部材を包囲する位置に配設されたときに互いに係合して、前記バネ部材の少なくとも一部を前記ハウジングの少なくとも一部に固定する。このため、バネ部材をハウジングに挿入し、またはハウジングをバネ部材に外嵌して、両者の位置関係を、前記ハウジングが前記バネ部材を包囲する位置関係とするだけで、両者の前記各一部同士を互いに固定することができる。したがって、本発明のコンタクトは、高価な装置を必要とすることなく容易に製造することができる。   The spring member and the housing are each formed with an engaging portion, and engage each other when the housing is disposed at a position surrounding the spring member, so that at least a part of the spring member is engaged. Is fixed to at least a part of the housing. For this reason, the spring member is inserted into the housing, or the housing is externally fitted to the spring member, and the positional relationship between the two is set so that the housing surrounds the spring member. They can be fixed to each other. Therefore, the contact of the present invention can be easily manufactured without requiring an expensive device.

なお、前記バネ部材は、弾性変形されて前記ハウジングに挿入されることにより、前記各係合部に係合方向の付勢力を付与してもよい。その場合、前記バネ部材の弾性を利用して、前記バネ部材の少なくとも一部と前記ハウジングの少なくとも一部とを一層良好に固定することができる。   The spring member may be elastically deformed and inserted into the housing, thereby applying an urging force in the engagement direction to each engagement portion. In that case, it is possible to more favorably fix at least a part of the spring member and at least a part of the housing by utilizing the elasticity of the spring member.

また、前記バネ部材の前記導電パターンと接触する部分を第１接触部とし、前記ハウジングの前記プリント配線基板と当接する部分を基板当接部として、前記各係合部が互いに係合して、かつ、前記バネ部材に前記ハウジング以外からの負荷が掛かっていない状態では、前記第１接触部は前記基板当接部よりも前記プリント配線基板側に突出してもよい。   Further, a portion of the spring member that contacts the conductive pattern is a first contact portion, and a portion of the housing that is in contact with the printed wiring board is a substrate contact portion. In addition, in a state where no load is applied to the spring member from other than the housing, the first contact portion may protrude toward the printed wiring board rather than the substrate contact portion.

その場合、バネ部材とハウジングとの位置決め精度がそれ程高くなくても、バネ部材の第１接触部をプリント配線基板の導電パターンに確実に接触させることができる。なお、この場合、外力が加わらないときはハウジングの基板当接部がプリント配線基板から浮き上がっており、バネ部材またはハウジングに外力が加わったときに基板当接部がプリント配線基板に当接してバネ部材を支持する構成とすることも可能である。その場合、バネ部材をプリント配線基板にハンダ付けする際の効率を次のように向上させることができる。すなわち、樹脂がプリント配線基板に当接していると、ハンダ付けのときに熱が伝わる邪魔になるが、樹脂製のハウジングがプリント配線基板から浮き上がっているので、そのような事態の発生を抑制することができる。   In that case, even if the positioning accuracy between the spring member and the housing is not so high, the first contact portion of the spring member can be reliably brought into contact with the conductive pattern of the printed wiring board. In this case, when no external force is applied, the board contact portion of the housing is lifted from the printed circuit board, and when an external force is applied to the spring member or the housing, the board contact section contacts the printed circuit board and springs. It is also possible to adopt a configuration that supports the member. In that case, the efficiency when soldering the spring member to the printed wiring board can be improved as follows. That is, if the resin is in contact with the printed wiring board, it will be an obstacle to heat transfer during soldering, but the resin housing is lifted from the printed wiring board, so that such a situation is suppressed. be able to.

そして、その場合、前記基板当接部は、前記バネ部材の各部の変形方向を挟んだ両側に、それぞれ２箇所以上配設されていてもよい。このように、基板当接部がバネ部材の各部の変形方向を挟んだ両側に、それぞれ２箇所以上配設されていれば、その基板当接部がプリント配線基板に当接することによって、バネ部材を一層安定して支持することができる。よって、バネ部材と前記導電性部材との接触も一層良好に確保することができる。   And in that case, the said board | substrate contact part may be arrange | positioned at two or more places on both sides which pinched | interposed the deformation | transformation direction of each part of the said spring member, respectively. As described above, if two or more board contact portions are disposed on both sides of the deformation direction of each part of the spring member, the board contact portion contacts the printed wiring board. Can be supported more stably. Therefore, the contact between the spring member and the conductive member can be further ensured.

また、本発明のコンタクトにおいて、前記バネ部材の前記導電性部材と接触する部分を第２接触部として、前記第２接触部は、前記バネ部材が二股に分かれることによって構成され、前記ハウジングは、前記係合部とは別に前記バネ部材の前記二股に分かれた部分にも係合してもよい。その場合、バネ部材にプリント配線基板から引き剥がすような力が加わったとしても、ハウジングがバネ部材の二股に分かれた部分に係合しているので、バネ部材が捲れ上がらない。また、第２接触部が二股に分かれているため、バネ部材と前記導電性部材との接触が多点接点による接触となり、前記導電パターンと前記導電性部材とを一層確実に電気的に接続することができる。   Further, in the contact of the present invention, the portion of the spring member that contacts the conductive member is a second contact portion, the second contact portion is configured by the spring member being divided into two parts, and the housing is In addition to the engaging portion, the spring member may be engaged with the bifurcated portion. In this case, even if a force that causes the spring member to peel off from the printed wiring board is applied, the spring member does not roll up because the housing is engaged with the bifurcated portion of the spring member. Further, since the second contact portion is divided into two parts, the contact between the spring member and the conductive member becomes a contact by a multi-point contact, and the conductive pattern and the conductive member are more reliably electrically connected. be able to.

本発明が適用されたコンタクトの構成を表す平面図（Ａ）、右上斜面図（Ｂ）、左側面図（Ｃ）、正面図（Ｄ）、右側面図（Ｅ）、底面図（Ｆ）、背面図（Ｇ）である。A plan view (A), an upper right slope view (B), a left side view (C), a front view (D), a right side view (E), a bottom view (F), showing a configuration of a contact to which the present invention is applied. It is a rear view (G). 該コンタクトのハウジングの構成を表す平面図（Ａ）、右上斜面図（Ｂ）、左側面図（Ｃ）、正面図（Ｄ）、右側面図（Ｅ）、底面図（Ｆ）、背面図（Ｇ）である。A plan view (A), an upper right slope view (B), a left side view (C), a front view (D), a right side view (E), a bottom view (F), a rear view (a rear view) G). 前記コンタクトのバネ部材の構成を表す平面図（Ａ）、右上斜面図（Ｂ）、左側面図（Ｃ）、正面図（Ｄ）、右側面図（Ｅ）、底面図（Ｆ）、背面図（Ｇ）である。A plan view (A), an upper right slope view (B), a left side view (C), a front view (D), a right side view (E), a bottom view (F), and a rear view showing the configuration of the spring member of the contact. (G).

次に、本発明の実施形態について一例を挙げて説明する。
図１は、本発明の実施形態として例示するコンタクト１の構成を示し、(Ａ)はその平面図、（Ｂ）はその右上斜視図、（Ｃ）はその左側面図、（Ｄ）はその正面図、（Ｅ）はその右側面図、（Ｆ）はその底面図、（Ｇ）は背面図である。 Next, an embodiment of the present invention will be described with an example.
1A and 1B show a configuration of a contact 1 exemplified as an embodiment of the present invention, where FIG. 1A is a plan view thereof, FIG. 1B is a top right perspective view thereof, FIG. 1C is a left side view thereof, and FIG. (E) is the right side view, (F) is the bottom view, and (G) is the back view.

図１に示すように、コンタクト１は、樹脂製のハウジング１０と金属製のバネ部材３０とを組み合わせて構成されている。なお、バネ部材３０は、導電性及び弾性を有する金属（例えばリン青銅，ベリリウム銅，ＳＵＳ等）からなる１枚の薄板を所定形状に打ち抜くと共に折り曲げて形成されている。   As shown in FIG. 1, the contact 1 is configured by combining a resin housing 10 and a metal spring member 30. The spring member 30 is formed by punching and bending a single thin plate made of a metal having conductivity and elasticity (for example, phosphor bronze, beryllium copper, SUS, etc.) into a predetermined shape.

図２は、そのうちのハウジング１０の構成を示し、(Ａ)はその平面図、（Ｂ）はその右上斜視図、（Ｃ）はその左側面図、（Ｄ）はその正面図、（Ｅ）はその右側面図、（Ｆ）はその底面図、（Ｇ）は背面図である。また、図３は、バネ部材３０の構成を示し、(Ａ)はその平面図、（Ｂ）はその右上斜視図、（Ｃ）はその左側面図、（Ｄ）はその正面図、（Ｅ）はその右側面図、（Ｆ）はその底面図、（Ｇ）は背面図である。   FIG. 2 shows the structure of the housing 10, (A) is a plan view thereof, (B) is an upper right perspective view thereof, (C) is a left side view thereof, (D) is a front view thereof, and (E). Is a right side view thereof, (F) is a bottom view thereof, and (G) is a rear view thereof. 3 shows the configuration of the spring member 30, (A) is a plan view thereof, (B) is a perspective view thereof at the upper right, (C) is a left side view thereof, (D) is a front view thereof, (E ) Is a right side view thereof, (F) is a bottom view thereof, and (G) is a rear view thereof.

なお、以下の説明においては、前後左右上下の方向として、図１〜図３に矢印で示した方向を規定して、コンタクト１各部の相対的な位置関係を説明する。ただし、これらの方向は、あくまでもコンタクト１各部の相対的な位置関係を示すための定義にすぎず、コンタクト１を実際に使用する際の取り付け方向などを規定するものではない。   In the following description, the relative positional relationship of each part of the contact 1 will be described with the directions indicated by the arrows in FIGS. However, these directions are merely definitions for indicating the relative positional relationship between the respective parts of the contact 1 and do not prescribe the attachment direction when the contact 1 is actually used.

［ハウジングの構成］
図１及び図２に示すように、ハウジング１０は、右側に配設された一対の脚部１１と左側に配設された一対の脚部１２とによって支持される天板１３を備えている。脚部１１，１２は、それぞれ水平断面が略長方形に構成され、前後方向の幅は同じであるが、左右方向の幅は脚部１１よりも脚部１２の方が大きくなっている。また、天板１３には、後述のバネ部材３０の第２接触部３３Ｃが貫通する一対の貫通穴１３Ｃが形成されている。 [Housing configuration]
As shown in FIGS. 1 and 2, the housing 10 includes a top plate 13 supported by a pair of leg portions 11 disposed on the right side and a pair of leg portions 12 disposed on the left side. Each of the legs 11 and 12 has a substantially rectangular horizontal cross section and has the same width in the front-rear direction, but the width in the left-right direction is larger in the leg 12 than in the leg 11. In addition, the top plate 13 is formed with a pair of through holes 13C through which a second contact portion 33C of a spring member 30 described later passes.

更に、天板１３の前後各辺における左右方向の中央からは、一対の支柱１５が下方に突出している。支柱１５の先端（下端）は、外側に向いて上向きに鉤状（三角形）の係合部１５Ａを構成している。なお、この支柱１５の下端も、脚部１１，１２の前記長方形の下面とほぼ同一面上に配置され、脚部１１，１２によって天板１３及び後述のバネ部材３０をプリント配線基板（図示省略）上に支持する際の補助となる。また、支柱１５と脚部１１との間には、外側に向いて上向きに鉤状（三角形）の係合部１５Ｂが、支柱１５と脚部１２との間には、外側に向いて上向きに鉤状（三角形）の係合部１５Ｃが、それぞれ形成されている。   Further, a pair of support columns 15 protrude downward from the center in the left-right direction on each of the front and rear sides of the top plate 13. The front end (lower end) of the support column 15 forms a hook-shaped (triangular) engaging portion 15A facing outward and upward. Note that the lower end of the support column 15 is also disposed on substantially the same plane as the rectangular lower surface of the leg portions 11 and 12, and the top plate 13 and a spring member 30 to be described later are attached to the printed wiring board (not shown) by the leg portions 11 and 12. ) Helps when supporting on top. Further, a hook-like (triangular) engaging portion 15B faces upward and between the support column 15 and the leg portion 11, and between the support column 15 and the leg portion 12, the engagement portion 15B faces upward and faces upward. A hook-like (triangular) engaging portion 15C is formed.

［バネ部材の構成］
次に、図１及び図３に示すように、バネ部材３０は、下面が後述のハンダ接合面となっている平面視十字型の第１接触部３１を備えており、その第１接触部３１の一端（左端）には弾性接触部３３が連接されている。なお、第１接触部３１は、より詳細には、図３（Ｅ）に示すように、平面視で左右方向に長尺な長方形の四隅を、脚部１１，１２との対向部で切り欠いた十字型形状を有している。弾性接触部３３は、正面視円弧状に湾曲して下端が第１接触部３１の左端に連接された折り返し部３３Ａを備えており、折り返し部３３Ａの上端には、平面部３３Ｂ，第２接触部３３Ｃ，先端部３３Ｄが順次連接されている。 [Configuration of spring member]
Next, as shown in FIGS. 1 and 3, the spring member 30 includes a first contact portion 31 having a cross shape in plan view, the lower surface of which is a solder joint surface described later, and the first contact portion 31. An elastic contact portion 33 is connected to one end (left end) of each. More specifically, as shown in FIG. 3 (E), the first contact portion 31 has four rectangular corners that are elongated in the left-right direction in plan view, and is cut out at portions facing the leg portions 11 and 12. It has a cross shape. The elastic contact portion 33 includes a folded portion 33A that is curved in an arc shape when viewed from the front and has a lower end connected to the left end of the first contact portion 31. The portion 33C and the tip portion 33D are sequentially connected.

平面部３３Ｂは、第１接触部３１と平行な長方形の平板状に構成されている。第２接触部３３Ｃは、平面部３３Ｂと、その平面部３３Ｂと同一平面上に配設された先端部３３Ｄとの間で、正面視略三角形状に上方へ突出し、上端部にはＲ（面取り）が付けられている。先端部３３Ｄは、第２接触部３３Ｃの右端から平面部３３Ｂ方向に折り返されている。更に、弾性接触部３３は、平面部３３Ｂと先端部３３Ｄとの間の第２接触部３３Ｃの部分で二股に分かれている。   The flat surface portion 33 </ b> B is configured as a rectangular flat plate parallel to the first contact portion 31. The second contact portion 33C protrudes upward in a substantially triangular shape when viewed from the front, between the flat surface portion 33B and the tip portion 33D disposed on the same plane as the flat surface portion 33B. ) Is attached. The distal end portion 33D is folded back from the right end of the second contact portion 33C in the plane portion 33B direction. Furthermore, the elastic contact portion 33 is divided into two forks at the portion of the second contact portion 33C between the flat portion 33B and the tip portion 33D.

また、第１接触部３１の前後両端には、上方に向かって立設された一対の側板３５が連接されている。なお、各側板３５の内壁面は、ハウジング１０の一対の支柱１５の前後両端面に当接する位置に配設され、更に、ハウジング１０の係合部１５Ａ，１５Ｂ，１５Ｃと係合する板状の係合部３５Ａ，３５Ｂ，３５Ｃが切り起こされている。   Further, a pair of side plates 35 erected upward are connected to both front and rear ends of the first contact portion 31. In addition, the inner wall surface of each side plate 35 is arrange | positioned in the position contact | abutted to the front-and-rear both end surfaces of a pair of support | pillar 15 of the housing 10, Furthermore, it is plate shape engaged with the engaging parts 15A, 15B, 15C of the housing 10. The engaging portions 35A, 35B, and 35C are cut and raised.

［コンタクトの構成及び効果］
本実施形態のコンタクト１は、ハウジング１０を、一対の支柱１５が一対の側板３５の間に入るようにバネ部材３０の上方から押し込むことによって、完成する。このとき、係合部１５Ａ，１５Ｂ，１５Ｃは係合部３５Ａ，３５Ｂ，３５Ｃに係合する。また、このとき、バネ部材３０の平面部３３Ｂ及び先端部３３Ｄは、ハウジング１０の天板１３の下面によって押圧され、バネ部材３０の弾性変形によって各係合部３５Ａ，３５Ｂ，３５Ｃには係合部１５Ａ，１５Ｂ，１５Ｃとの係合方向に付勢力が加わる。このため、コンタクト１では、バネ部材３０の弾性を利用して、バネ部材３０の係合部３５Ａ，３５Ｂ，３５Ｃの部分とハウジング１０の係合部１５Ａ，１５Ｂ，１５Ｃの部分とを良好に固定することができる。 [Composition and effect of contact]
The contact 1 according to the present embodiment is completed by pushing the housing 10 from above the spring member 30 so that the pair of support columns 15 enter between the pair of side plates 35. At this time, the engaging portions 15A, 15B, and 15C engage with the engaging portions 35A, 35B, and 35C. At this time, the flat surface portion 33B and the distal end portion 33D of the spring member 30 are pressed by the lower surface of the top plate 13 of the housing 10, and are engaged with the engaging portions 35A, 35B, and 35C by elastic deformation of the spring member 30. A biasing force is applied in the direction of engagement with the portions 15A, 15B, and 15C. Therefore, in the contact 1, the elasticity of the spring member 30 is used to satisfactorily fix the engagement portions 35 </ b> A, 35 </ b> B, 35 </ b> C of the spring member 30 and the engagement portions 15 </ b> A, 15 </ b> B, 15 </ b> C of the housing 10. can do.

また、図１に示すように、このようにハウジング１０とバネ部材３０とを組み合わせたとき、バネ部材３０の第２接触部３３Ｃは貫通穴１３Ｃを介してハウジング１０よりも上方へ突出する。更に、前記のようにハウジング１０とバネ部材３０とを組み合わせたとき、バネ部材３０の第１接触部３１が脚部１１，１２の下面（基板当接部に相当）よりも下方に突出する。   As shown in FIG. 1, when the housing 10 and the spring member 30 are combined in this way, the second contact portion 33C of the spring member 30 protrudes upward from the housing 10 through the through hole 13C. Further, when the housing 10 and the spring member 30 are combined as described above, the first contact portion 31 of the spring member 30 protrudes below the lower surfaces (corresponding to the substrate contact portions) of the leg portions 11 and 12.

このように構成されたコンタクト１は、バネ部材３０が、プリント配線基板の導電パターンとそのプリント配線基板とは別の導電性部材（例えば筐体）との間に弾発状に挟み込まれるようにして使用される。本実施形態では、プリント配線基板側を下方として説明しており、バネ部材３０の第１接触部３１の下面が前記導電パターンにハンダ付けされる。また、バネ部材３０の第２接触部３３Ｃは、バネ部材３０の付勢力によって前記導電性部材に圧接され、前記導電パターンと前記導電性部材とを電気的に接続することができる。よって、例えば前記導電パターンがアースパターンで、前記導電性部材が接地導体である場合は、前記プリント配線基板のグランド対策を容易に施すことができる。   The contact 1 configured as described above is configured such that the spring member 30 is elastically sandwiched between a conductive pattern of the printed wiring board and a conductive member (for example, a casing) different from the printed wiring board. Used. In the present embodiment, the printed wiring board side is described as the lower side, and the lower surface of the first contact portion 31 of the spring member 30 is soldered to the conductive pattern. Further, the second contact portion 33C of the spring member 30 is pressed against the conductive member by the biasing force of the spring member 30, and can electrically connect the conductive pattern and the conductive member. Therefore, for example, when the conductive pattern is a ground pattern and the conductive member is a ground conductor, it is possible to easily take a ground countermeasure for the printed wiring board.

更に、前述のように、バネ部材３０にハウジング１０以外からの負荷が掛かっていない状態では、その第１接触部３１が脚部１１，１２の下面よりも下方に突出する。このため、バネ部材３０とハウジング１０との位置決め精度がそれ程高くなくても、バネ部材３０の第１接触部３１をプリント配線基板の導電パターンに確実に接触させることができる。また、樹脂がプリント配線基板に当接していると、ハンダ付けのときに熱が伝わる邪魔になるが、樹脂製のハウジング１０がプリント配線基板から浮き上がった状態でハンダ付けがなされるので、ハンダ付けする際の効率を向上させることができる。   Further, as described above, the first contact portion 31 protrudes downward from the lower surfaces of the leg portions 11 and 12 when the spring member 30 is not subjected to a load from other than the housing 10. For this reason, even if the positioning accuracy of the spring member 30 and the housing 10 is not so high, the first contact portion 31 of the spring member 30 can be reliably brought into contact with the conductive pattern of the printed wiring board. In addition, if the resin is in contact with the printed circuit board, heat will be transmitted when soldering, but since the resin housing 10 is lifted from the printed circuit board, soldering is performed. The efficiency at the time of doing can be improved.

このように、プリント配線基板の表面（取付対象面）にハンダ付け（実装）されたコンタクト１に外力が加わらないときはハウジング１０はプリント配線基板から浮き上がっており、バネ部材３０またはハウジング１０に外力が加わると、ハウジング１０の脚部１１，１２の下面がプリント配線基板に当接する。このように、ハウジング１０は、脚部１１，１２がプリント配線基板に当接して、バネ部材３０の少なくとも一部（第２接触部３３Ｃの基端部、折り返し部３３Ａの大部分等）を、少なくともバネ部材３０の各部の変形方向を挟む前後両側から包囲して、そのバネ部材３０をプリント配線基板上に支持する。このように、ハウジング１０でバネ部材３０が包囲されるので、そのバネ部材３０の各部の変形方向に交差する前後方向斜め上等から当該バネ部材３０が押圧されても、そのバネ部材３０が潰れるのを抑制することができる。   As described above, when no external force is applied to the contact 1 soldered (mounted) on the surface (surface to be attached) of the printed wiring board, the housing 10 is lifted from the printed wiring board, and the external force is applied to the spring member 30 or the housing 10. Is applied, the lower surfaces of the leg portions 11 and 12 of the housing 10 come into contact with the printed wiring board. As described above, the housing 10 has the leg portions 11 and 12 in contact with the printed circuit board, and at least a part of the spring member 30 (the base end portion of the second contact portion 33C, most of the folded portion 33A, etc.) The spring member 30 is surrounded on at least the front and rear sides sandwiching the deformation direction of each part of the spring member 30, and the spring member 30 is supported on the printed wiring board. As described above, since the spring member 30 is surrounded by the housing 10, even if the spring member 30 is pressed obliquely from above or in the front-rear direction crossing the deformation direction of each part of the spring member 30, the spring member 30 is crushed. Can be suppressed.

なお、このようにバネ部材３０が潰れるのを抑制するためには、脚部１１，１２の下面は外力が加わらない状態におけるプリント配線基板の表面からの浮き上がりがわずかであることが望ましい。その場合、バネ部材３０を変形するような外力が加わったときには脚部１１，１２の下面が４つとも即座にプリント配線基板の表面に当接し、バネ部材３０を良好に支持することができる。   In order to prevent the spring member 30 from being crushed in this way, it is desirable that the lower surfaces of the leg portions 11 and 12 have a slight lift from the surface of the printed wiring board when no external force is applied. In this case, when an external force that deforms the spring member 30 is applied, all four lower surfaces of the leg portions 11 and 12 immediately come into contact with the surface of the printed wiring board, and the spring member 30 can be favorably supported.

また、本実施形態のコンタクト１は、前述のようにハウジング１０をバネ部材３０の上方から押し込んで装着するだけで容易に製造することができる。したがって、本実施形態のコンタクト１は、高価な装置を必要とすることなく容易に製造することができる。すなわち、ハウジング１０，バネ部材３０が係合部を有さず、バネ部材３０の一部をハウジング１０の外周からかしめ付ける場合、バネ部材３０とハウジング１０との位置関係を正確に保持した状態でバネ部材３０をプレス変形させる必要があり、製造には高価な装置が必要となる。これに対して、本実施形態では、ハウジング１０にバネ部材３０を嵌め込むだけでよく、手作業でも容易にコンタクト１を製造することができる。更に、前述のようにかしめ付ける場合、ハウジング１０にも応力が加わって悪影響を及ぼす可能性があるが、本実施形態ではそのような事態の発生も抑制することができる。   Moreover, the contact 1 of this embodiment can be easily manufactured only by pushing the housing 10 from the upper side of the spring member 30 and mounting it as described above. Therefore, the contact 1 of this embodiment can be easily manufactured without requiring an expensive device. That is, when the housing 10 and the spring member 30 do not have an engaging portion and a part of the spring member 30 is caulked from the outer periphery of the housing 10, the positional relationship between the spring member 30 and the housing 10 is accurately maintained. The spring member 30 needs to be press-deformed, and an expensive device is required for manufacturing. On the other hand, in this embodiment, it is only necessary to fit the spring member 30 into the housing 10, and the contact 1 can be easily manufactured by manual work. Furthermore, when caulking as described above, stress may be applied to the housing 10 to adversely affect the housing 10, but the occurrence of such a situation can also be suppressed in the present embodiment.

また、第２接触部３３Ｃは、バネ部材３０が二股に分かれることによって構成され、ハウジング１０は、貫通穴１３Ｃの間の天板１３がその二股に分かれた部分に係合している。このため、第２接触部３３Ｃにプリント配線基板から引き剥がすような力が加わったとしても、ハウジング１０がバネ部材３０の二股に分かれた部分に係合しているので、バネ部材３０が捲れ上がらない。更に、第２接触部３３Ｃが二股に分かれているため、バネ部材３０と前記導電性部材との接触が多点接点による接触となり、前記導電パターンと前記導電性部材とを一層確実に電気的に接続することができる。   Further, the second contact portion 33C is configured by the spring member 30 being divided into two branches, and the housing 10 is engaged with a portion where the top plate 13 between the through holes 13C is divided into the two branches. For this reason, even if a force that peels off the printed wiring board is applied to the second contact portion 33C, the housing 10 is engaged with the bifurcated portion of the spring member 30, so that the spring member 30 is rolled up. Absent. Further, since the second contact portion 33C is divided into two portions, the contact between the spring member 30 and the conductive member becomes a contact by a multipoint contact, and the conductive pattern and the conductive member are more reliably electrically connected. Can be connected.

［本発明の他の実施形態］
なお、本発明は前記実施形態に何ら限定されるものではなく、本発明の要旨を逸脱しない範囲で種々の形態で実施することができる。例えば、第１接触部３１をより大きくして、脚部１１，１２の下面が第１接触部３１の上面に当接するように構成してもよい。すなわち、前記基板当接部は前記バネ部材の一部を介してプリント配線基板に当接してもよい。また、先端部３３Ｄは、第２接触部３３Ｃの延長面上に配設されてもよく、第２接触部３３Ｃの右端から平面部３３Ｂとは逆方向に延びていてもよい。但し、後者または本実施形態のように先端部３３Ｄが平面部３３Ｂと同一平面上に配設される場合、第２接触部３３Ｃの可動範囲が多くなる点で望ましい。更に、本発明は、単一のバネ部材３０を備えたものに限定されず、前述の特許文献１のような複数のバネ部材３０を有するコンタクトにも同様に適用することができる。 [Other Embodiments of the Present Invention]
In addition, this invention is not limited to the said embodiment at all, It can implement with a various form in the range which does not deviate from the summary of this invention. For example, the first contact portion 31 may be made larger and the lower surfaces of the leg portions 11 and 12 may be in contact with the upper surface of the first contact portion 31. That is, the substrate contact portion may contact the printed wiring board through a part of the spring member. Further, the distal end portion 33D may be disposed on the extended surface of the second contact portion 33C, and may extend from the right end of the second contact portion 33C in the direction opposite to the plane portion 33B. However, when the distal end portion 33D is disposed on the same plane as the planar portion 33B as in the latter or this embodiment, it is desirable in that the movable range of the second contact portion 33C is increased. Furthermore, the present invention is not limited to the one provided with the single spring member 30, and can be similarly applied to a contact having a plurality of spring members 30 as described in Patent Document 1 described above.

１…コンタクト １０…ハウジング １１，１２…脚部 １３…天板
１３Ｃ…貫通穴 １５Ａ，１５Ｂ，１５Ｃ，３５Ａ，３５Ｂ，３５Ｃ…係合部
３０…バネ部材 ３１…第１接触部 ３３…弾性接触部 ３３Ａ…折り返し部
３３Ｂ…平面部 ３３Ｃ…第２接触部 ３３Ｄ…先端部 DESCRIPTION OF SYMBOLS 1 ... Contact 10 ... Housing 11, 12 ... Leg part 13 ... Top plate 13C ... Through-hole 15A, 15B, 15C, 35A, 35B, 35C ... Engagement part 30 ... Spring member 31 ... 1st contact part 33 ... Elastic contact part 33A ... turn-up portion 33B ... plane portion 33C ... second contact portion 33D ... tip portion

Claims (4)

導電性及び弾性を有する薄板から構成され、プリント配線基板の導電パターンと前記プリント配線基板とは別の導電性部材との間に弾発状に挟み込まれるバネ部材と、
前記バネ部材の前記導電パターンと接触する部分を第１接触部とし、前記バネ部材の前記導電性部材と接触する部分を第２接触部として、前記第１接触部と前記第２接触部とを連結する部分の少なくとも一部を、当該一部を構成する各部それぞれの変形方向を挟む両側から包囲して、前記バネ部材を前記プリント配線基板上に支持する樹脂製のハウジングと、
前記バネ部材と前記ハウジングとにそれぞれ形成され、前記ハウジングが前記バネ部材を包囲する位置に配設されたときに互いに係合して、前記バネ部材の少なくとも一部を前記ハウジングの少なくとも一部に固定する係合部と、
を備え、
前記ハウジングの前記プリント配線基板と当接する部分を基板当接部として、
前記各係合部が互いに係合して、かつ、前記第１接触部が前記導電パターンと接触し、かつ、前記バネ部材に前記ハウジング以外からの負荷が掛かっていない状態では、前記第１接触部は前記基板当接部よりも前記プリント配線基板側に突出して、前記ハウジングを前記プリント配線基板から浮き上がらせるように構成されていることを特徴とするコンタクト。 A spring member composed of a thin plate having electrical conductivity and elasticity, and elastically sandwiched between a conductive pattern of the printed wiring board and another conductive member different from the printed wiring board;
A portion of the spring member that contacts the conductive pattern is used as a first contact portion, and a portion of the spring member that contacts the conductive member is used as a second contact portion, and the first contact portion and the second contact portion are used. at least part of the portion linking the surrounding from both sides sandwiching the deformation direction of the respective components constituting a part such, made of resin for supporting the spring member to the printed circuit board housing,
The spring member and the housing are respectively formed and engaged with each other when the housing is disposed at a position surrounding the spring member, so that at least a part of the spring member becomes at least a part of the housing. An engaging portion to be fixed;
Equipped with a,
A portion of the housing that comes into contact with the printed circuit board is a board contact portion
In a state where the engaging portions are engaged with each other, the first contact portion is in contact with the conductive pattern, and no load is applied to the spring member from other than the housing, the first contact is performed. The contact protrudes toward the printed wiring board from the board contact part, and is configured to float the housing from the printed wiring board . 前記バネ部材は、弾性変形されて前記ハウジングに挿入されることにより、前記各係合部に係合方向の付勢力を付与することを特徴とする請求項１に記載のコンタクト。   The contact according to claim 1, wherein the spring member is elastically deformed and inserted into the housing, thereby applying an urging force in an engagement direction to each engagement portion. 前記基板当接部は、前記バネ部材の前記各部それぞれの変形方向を挟んだ両側に、それぞれ２箇所以上配設されたことを特徴とする請求項２に記載のコンタクト。 The substrate contact portion, the contact of claim 2, wherein on both sides of the deformation direction of the respective parts each spring member, characterized in that disposed above each two locations. 前記第２接触部は、前記バネ部材が二股に分かれることによって構成され、
前記ハウジングは、前記係合部とは別に前記バネ部材の前記二股に分かれた部分にも係合することを特徴とする請求項１〜３のいずれか１項に記載のコンタクト。 The second contact portion before SL, the spring member is formed by bifurcated,
The housing contact according to any one of claims 1 to 3, characterized in that said even engage a portion bifurcated in the engaging portion and is separately said spring member.
JP2012248606A 2012-11-12 2012-11-12 contact Active JP6025194B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012248606A JP6025194B2 (en) 2012-11-12 2012-11-12 contact
PCT/JP2013/079756 WO2014073495A1 (en) 2012-11-12 2013-11-01 Contact
US14/442,125 US9735483B2 (en) 2012-11-12 2013-11-01 Contact
EP13852428.5A EP2919327B1 (en) 2012-11-12 2013-11-01 Contact and method for mounting such contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012248606A JP6025194B2 (en) 2012-11-12 2012-11-12 contact

Publications (2)

Publication Number Publication Date
JP2014096324A JP2014096324A (en) 2014-05-22
JP6025194B2 true JP6025194B2 (en) 2016-11-16

Family

ID=50684601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012248606A Active JP6025194B2 (en) 2012-11-12 2012-11-12 contact

Country Status (4)

Country Link
US (1) US9735483B2 (en)
EP (1) EP2919327B1 (en)
JP (1) JP6025194B2 (en)
WO (1) WO2014073495A1 (en)

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5113550B1 (en) 1970-12-29 1976-04-30
JPS5522700Y2 (en) * 1974-07-19 1980-05-29
JPS6058155B2 (en) 1980-12-26 1985-12-18 住友重機械工業株式会社 Slab gripping device
JPS6244385Y2 (en) * 1980-12-27 1987-11-21
JPH0312677A (en) 1989-06-12 1991-01-21 Ricoh Co Ltd One-pack developing device
FR2714539B1 (en) * 1993-12-24 1996-01-26 Itt Composants Instr Electrical connector for the connection of an electronic memory card.
JPH08222335A (en) * 1994-12-15 1996-08-30 Amp Japan Ltd Electric contact and ic socket using the contact
JP3012677U (en) 1994-12-20 1995-06-20 トーマス アンド ベッツ コーポレーション Terminal board
FR2737352B1 (en) * 1995-07-28 1997-08-29 Itt Composants Instr ELECTRICAL CONNECTOR FOR CONNECTION OF A CARD WITH AN INTEGRATED CIRCUIT (S) WITH CONTACT
US5746626A (en) * 1996-10-11 1998-05-05 Bourns, Inc. Electrical connector assembly
TW385071U (en) 1998-11-24 2000-03-11 Hon Hai Prec Ind Co Ltd Structure of electrical connector terminals
FR2809871B1 (en) * 2000-06-05 2002-07-19 Itt Mfg Entpr S Inc ELECTRICAL CONNECTOR WITH IMPROVED CONTACT BLADES FOR CONNECTION OF AN INTEGRATED CIRCUIT (S) CARD
JP3477640B2 (en) * 2000-08-10 2003-12-10 日本航空電子工業株式会社 connector
DE10238661B3 (en) 2002-08-23 2004-02-26 Lumberg Connect Gmbh & Co. Kg Electrical contacting device, in particular for connecting a voltage source to an electronic circuit
JP2004127611A (en) * 2002-09-30 2004-04-22 Jst Mfg Co Ltd Electrical connector
JP3682655B2 (en) * 2002-10-28 2005-08-10 日本航空電子工業株式会社 connector
JP4037259B2 (en) * 2002-12-26 2008-01-23 タイコエレクトロニクスアンプ株式会社 Electrical connector
JP4263046B2 (en) 2003-07-09 2009-05-13 京セラ株式会社 Connection parts to be mounted on the board of electronic equipment
JP4551227B2 (en) * 2005-01-18 2010-09-22 タイコエレクトロニクスジャパン合同会社 Surface mount type electrical connector
TWM335050U (en) * 2007-10-08 2008-06-21 Hon Hai Prec Ind Co Ltd Electrical connector
TWM334477U (en) * 2007-12-28 2008-06-11 Advanced Connectek Inc Battery connector
JP2009206068A (en) * 2008-02-27 2009-09-10 Ace Five:Kk Connector
JP2011014271A (en) * 2009-06-30 2011-01-20 Japan Aviation Electronics Industry Ltd Connector
CN101944192B (en) * 2009-07-03 2013-04-03 富士康(昆山)电脑接插件有限公司 Electronic card
JP5589409B2 (en) * 2010-01-29 2014-09-17 オムロン株式会社 Mounting component, electronic device and mounting method
KR101756476B1 (en) * 2010-12-16 2017-07-11 삼성전자주식회사 Contact terminal for portable terminal
JP5809509B2 (en) * 2011-09-29 2015-11-11 新光電気工業株式会社 Wiring board with spring terminal and its mounting structure and socket
US8690585B2 (en) * 2011-10-07 2014-04-08 Hon Hai Precision Industry Co., Ltd. Electrical connector for low profile application

Also Published As

Publication number Publication date
JP2014096324A (en) 2014-05-22
US20160294078A1 (en) 2016-10-06
US9735483B2 (en) 2017-08-15
WO2014073495A1 (en) 2014-05-15
EP2919327A1 (en) 2015-09-16
EP2919327B1 (en) 2020-07-08
EP2919327A4 (en) 2017-02-22

Similar Documents

Publication Publication Date Title
JP4951306B2 (en) Contacts and electrical connectors
WO2014038427A1 (en) Connector
JP5016692B2 (en) Socket connector
US8840408B2 (en) Crank-shaped board terminal with a protruding support portion
JP5912632B2 (en) connector
JP2014165066A (en) Connector
JP4591855B2 (en) Socket for mounting electronic components
JP7175632B2 (en) Shunt Resistor and Shunt Resistor Mounting Structure
JP2006179362A (en) Connector terminal and connector equipped with it
JP2015046479A (en) Circuit configuration
JP2007048684A (en) Connector
JP6162441B2 (en) Substrate reinforcement structure
JP6025194B2 (en) contact
JP5927391B2 (en) Contact member
JP2014165065A (en) Connector
JP4020149B1 (en) Electronic component module
JP2018041533A (en) Substrate connector
JP5445470B2 (en) Board to board connection structure
JP7058089B2 (en) Board mounting structure
JP5381663B2 (en) Connector member and electronic device using the same
US9065220B2 (en) Electrical connector
JP6385878B2 (en) connector
JP2014222677A (en) Connector
CN116981163A (en) Component for surface-mount on a circuit board, related use and assembly
JP2016076462A (en) Push switch

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20151030

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160531

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160728

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160913

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20161006

R150 Certificate of patent or registration of utility model

Ref document number: 6025194

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250