JP7058089B2 - Board mounting structure - Google Patents

Description

The present invention relates to a board mounting structure for mounting a circuit element on a circuit board.

In recent years, there has been a demand for compact electronic devices. Therefore, the mounting space of the circuit board on the electronic device may be limited to a narrow space. In that case, it is often required to keep the thickness dimension of the circuit board including the circuit components mounted on the circuit board small.

In order to mount a circuit element on a circuit board, the circuit element is usually soldered onto the circuit board so as to protrude from the surface of the circuit board. In this case, the thickness dimension of the circuit board including the circuit element becomes large, and a large mounting space of the circuit board on the electronic device is required. Further, it may be required to mount the circuit element on the circuit board in a replaceable manner. In that case, a socket is soldered onto the circuit board, and a circuit element is mounted on the socket. If the configuration is provided with such a socket, the thickness dimension may be further increased.

Here, Patent Document 1 discloses a structure in which a circuit board is arranged within a range of the thickness of the electric connector in an electric connector into which an end portion of the circuit board is inserted. However, in the case of this structure, the upper and lower surfaces of the connector protrude from the surface of the circuit board, and the overall thickness dimension becomes large.

Further, Patent Document 2 discloses a partition wall mounting structure in which a substrate-like connector is arranged at an opening of the partition wall. However, in the case of this structure, since the partition wall and the connector are soldered to each other, it is difficult to attach / detach the connector from the partition wall.

Japanese Unexamined Patent Publication No. 2016-126874 Japanese Unexamined Patent Publication No. 2014-207145

In view of the above circumstances, it is an object of the present invention to provide a substrate mounting structure in which a circuit element is interchangeably mounted on a circuit board while suppressing the thickness dimension of the circuit board including the circuit element.

The board mounting structure of the present invention that achieves the above object is
A circuit board with a wiring pattern formed on the surface and an element placement hole in which circuit elements are placed, and a circuit board.
It is provided with a pair of spring terminals that are solder-connected to the wiring pattern on the surface of the circuit board, enter the element placement hole, elastically sandwich the circuit element placed in the element placement hole from both sides, and conduct with the circuit element. ,
Each of the above pair of spring terminals
A soldered portion of the circuit board that is soldered to the surface of the circuit board placed in the element placement hole facing the same direction as the rear surface in the direction of insertion into the element placement hole.
Following the soldered portion, it extends to a position overlapping the edge of the rear surface of the circuit element arranged in the element arrangement hole, and extends toward the back of the element arrangement hole and away from the circuit element to escape to the rear surface side of the circuit element. Suppressing part that suppresses
Following the suppression portion, a pressing portion that elastically presses the circuit element and conducts with the circuit element by extending toward the side surface of the circuit element, contacting the side surface, and then extending toward a direction away from the side surface.
Following the pressing portion, it is characterized by having a support portion extending to a position overlapping the front surface of the circuit element in the direction of insertion into the element placement hole to prevent the circuit element from coming off to the front surface side .

In the substrate mounting structure of the present invention, the circuit board is provided with an element arrangement hole, and the circuit element is arranged in the element arrangement hole, so that the thickness dimension of the circuit board including the circuit element can be suppressed. Further, in the substrate mounting structure of the present invention, since the circuit element arranged in the element arrangement hole is elastically sandwiched from both sides by a pair of spring terminals, the circuit element can be easily replaced.

Here, in the board mounting structure of the present invention,
The circuit board has a groove for positioning the spring terminal provided at a position corresponding to the edge of each soldered portion of the pair of spring terminals on the side away from the element placement hole.
It is preferable that each of the pair of spring terminals has a positioning portion that bends from the end edge of the soldered portion toward the circuit board side and enters the groove .

Further, in the board mounting structure of the present invention,
The circuit element has a rectangular shape when projected in the direction of insertion into the substrate placement hole.
The circuit board has a pair of protrusions that project from the inner wall surface of the board placement hole toward each of the remaining two sides of the circuit element except the two sides in contact with the spring terminal to support the circuit element from both sides. Is preferable.

According to the above invention, a board mounting structure is realized in which circuit elements are interchangeably mounted on a circuit board while suppressing the thickness dimension of the circuit board including the circuit elements.

It is a perspective view of the circuit board which has the substrate mounting structure as the 1st Embodiment of this invention. It is sectional drawing which follows the arrow XX shown in FIG. , A sectional view (B) along the plan view (A), the cross-sectional view (B) along the arrow YY of FIG. 3 (A), and the arrow ZZ of FIG. 3 (A) of the circuit board whose perspective view is shown in FIG. It is a cross-sectional view (C). It is sectional drawing of the circuit board which has the substrate mounting structure as the 2nd Embodiment of this invention. It is sectional drawing of the circuit board which has the substrate mounting structure as the 3rd Embodiment of this invention. It is sectional drawing of the circuit board which has the substrate mounting structure as the 4th Embodiment of this invention. It is sectional drawing of the circuit board which has the substrate mounting structure as the 5th Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described.

FIG. 1 is a perspective view of a circuit board having a board mounting structure as the first embodiment of the present invention.

Further, FIG. 2 is a cross-sectional perspective view taken along the arrows XX shown in FIG.

Further, FIG. 3 shows a plan view (A), a cross-sectional view (B) along the arrows YY of FIG. 3 (A), and an arrow of FIG. 3 (A) of the circuit board whose perspective view is shown in FIG. It is sectional drawing (C) along ZZ.

The circuit board 10 is provided with an element arrangement hole 11. Further, a wiring pattern (not shown) is formed on the surface of the circuit board 10. The wiring pattern extends to the edge of the element placement hole 11.

Further, the circuit board 10 is provided with a pair of spring terminals 20. These spring terminals 20 enter into the element arrangement hole 11 leaving the soldered portion 21 on the surface of the circuit board 10. The soldered portions 21 of these spring terminals 20 are solder-connected to a wiring pattern (not shown) on the surface of the circuit board 10.

A circuit element 30 is inserted in the element arrangement hole 11. The circuit element 30 is elastically sandwiched from both sides by a pair of spring terminals 20 in the element arrangement hole 11. Electrical terminals (not shown) of the circuit element 30 are provided at both ends of the circuit element 30 in contact with the spring terminal 20. Therefore, the circuit element 30 is electrically connected to the wiring pattern on the surface of the circuit board 10 via the pair of spring terminals 20 in a state of being inserted into the element arrangement hole 11.

Further, the circuit board 10 has a pair of protrusions 12 protruding into the element arrangement hole 11 and supporting both sides of the circuit element 20. The pair of protrusions 12 together with the pair of spring terminals 20 are responsible for stabilizing the posture and placement position of the circuit element 30 inserted in the element placement hole 11.

Further, the spring terminal 20 in the first embodiment has a support portion 22. The support portion 22 supports the front surface of the circuit element 30 inserted into the element arrangement hole 11 in the direction of insertion into the element arrangement hole 11, and is the front surface side of the circuit element 30, that is, FIG. 3 (B). It plays a role in preventing the product from falling off to the lower surface side.

In the case of this first embodiment, the pair of spring terminals is used to prevent the circuit element 30 from falling off to the rear surface side (upper surface side), that is, to prevent the circuit element 30 from falling off to the inlet side of insertion into the element arrangement hole 11. It relies on the elastic holding force of the circuit element 30 by 20.

According to this first embodiment, the thickness of the spring terminal 20 is only slightly increased by the thickness of the soldered portion 21 protruding from the element arrangement hole 11, so that the overall thickness of the circuit board 10 is almost increased. Instead, the circuit element 30 is arranged.

Further, since the circuit element 30 is elastically sandwiched by the pair of spring terminals 20, the circuit element can be easily removed from the element arrangement hole 11 and replaced if necessary.

FIG. 4 is a cross-sectional view of a circuit board having a board mounting structure as a second embodiment of the present invention. Each figure after FIG. 4 is a cross-sectional view corresponding to FIG. 3 (B) in the above-mentioned first embodiment.

In the explanation of each of the second and subsequent embodiments shown in FIG. 4, the same points as those of the first embodiment described above will be omitted, and the differences will be described.

In the case of the second embodiment shown in FIG. 4, the cross-sectional shape of the pair of spring terminals 20 is different from that of the first embodiment in the following two points.

The circuit board 10 is provided with a groove 13 for positioning the spring terminal 20. The spring terminal 20 shown in FIG. 4 is provided with a positioning portion 23 that enters the groove 13 of the circuit board adjacent to the soldering portion 21. The spring terminal 20 is arranged so that the positioning portion 23 enters the groove 13 when soldering to the circuit board 10. As a result, the spring terminal 20 is temporarily fixed to the circuit board 10 and soldered to the correct position and in the correct posture.

Further, the spring terminal 20 shown in FIG. 4 has a shape that slightly narrows the opening on the insertion side of the circuit element 30 into the element arrangement hole 11 of the circuit board 10. That is, the spring terminal 20 shown in FIG. 4 is provided with a tapered portion 24 in which the insertion port of the circuit element 30 into the element arrangement hole 11 is narrowed and the distance between the spring terminals 20 is widened toward the back side of the element arrangement hole 11. Has been done. The tapered portion 24 has a function of preventing the circuit element 30 inserted in the element arrangement hole 11 from being inadvertently pulled out from the opening on the insertion side of the element arrangement hole 11.

FIG. 5 is a cross-sectional view of a circuit board having a board mounting structure as a third embodiment of the present invention.

In the case of the fifth embodiment shown in FIG. 5, a resin support member 40 is provided. The support member 40 is provided with a pair or a plurality of pairs of columns 41 and protrusions 42 for holding the circuit element 30. On the other hand, the circuit board 10 is formed with a hole 14 into which the support column 41 of the support member 40 is inserted. The support column 41 is lightly press-fitted into the hole 14. The support member 40 is attached to the circuit board 10 as shown in the figure after the circuit element 30 is inserted into the element arrangement hole 11. Then, the upper surface of the circuit element 30 in FIG. 5 is pushed by the protrusion 42, whereby the circuit element 30 is prevented from falling off from the upper surface side of the element arrangement hole 11.

When the circuit element 30 is replaced, the support member 40 is removed from the circuit board 10, the circuit element 30 is replaced, and the support member 40 is reattached. As a result, the new circuit element 30 inserted in the element arrangement hole 11 is prevented from coming off by the support member 40.

FIG. 6 is a cross-sectional view of a circuit board having a board mounting structure as a fourth embodiment of the present invention.

The spring terminal 20 shown in FIG. 6 has a function of elastically sandwiching the circuit element 30 inserted in the element arrangement hole 11 from both sides thereof. However, this spring terminal 20 is not sufficient because the function of preventing the circuit element 30 from coming off from the element arrangement hole 11 is only the point of elastic pinching.

Therefore, in the case of the fourth embodiment shown in FIG. 6, a pair of resin support members 51 and 52 for pressing the circuit element 30 inserted in the element arrangement hole 11 from both the upper and lower surfaces thereof is provided. One of the support members 51 and 52 of the pair of support members 51 and 52 has two or four columns 511. On the other hand, the circuit board 10 is provided with two holes 15 into which those columns 511 are inserted. Further, the other support member 52 is provided with two coupling holes 521 communicating with the two holes 15 of the circuit board 10. A strut 511 is also press-fitted into these coupling holes 521.

Further, each of the pair of support members 51 and 52 is provided with protrusions 512 and 522 that press the lower surface and the upper surface of the circuit element 30 inserted in the element arrangement hole 11, respectively.

One support member 51 is attached to the circuit board 10 before the circuit element 30 is inserted into the element arrangement hole 11. Then, the circuit element 30 is inserted into the element arrangement hole 11, and then the other support member 52 is attached to the support member 51 previously attached. As a result, the circuit element 30 in the element arrangement hole 11 is sandwiched between the protrusions 512 and 522 of the pair of support members 51 and 52 and is prevented from coming off in either the upper or lower direction.

When replacing the circuit element 30, one support member 51 (52) or both support members 51 and 52 are removed. Then, the circuit element 30 is replaced, and the new circuit element 30 is prevented from coming off by the support members 51 and 52.

FIG. 7 is a cross-sectional view of a circuit board having a board mounting structure as a fifth embodiment of the present invention.

Here, the differences from the above-mentioned fourth embodiment will be described.

The fifth embodiment shown in FIG. 7 also includes a pair of resin-made support members 51 and 52, as in the fourth embodiment described above. The mounting structure of one support member 51 to the circuit board 10 and the mounting structure of the support members 51 and 52 are the same as in the case of the fourth embodiment described above.

In the case of the fifth embodiment shown in FIG. 7, the pair of spring terminals 20 are integrally molded with one of the support members 52. The soldered portions 21 of the pair of spring terminals 20 are exposed from the opening 523 of the support member.

Further, the spring terminal 20 in the fifth embodiment extends only from the upper surface of the circuit board to an intermediate position in the element arrangement hole 11. The spring terminal 20 has a role of elastically sandwiching the circuit element 30 inserted in the element arrangement hole 11 from both sides thereof and electrically connecting the circuit element 20 to the wiring pattern on the surface of the circuit board 10. I am in charge.

Here, one support member 52 is arranged with respect to the circuit board 10 as shown in the drawing, and the soldering portion 21 exposed from the opening 523 of the support member 52 is soldered to the wiring pattern of the circuit board 10. Then, the circuit board 10 is turned upside down and the circuit element 30 is inserted into the element arrangement hole 11. After that, the other support member 51 is attached.

When replacing the circuit element 30, one of the support members 52 cannot be removed because the integrally molded spring terminal 20 is soldered to the support member 52. In the case of this fifth embodiment, only the other support member 51 is removed. Then, the circuit element 30 is taken out from the element arrangement hole 11 using tweezers or the like, a new circuit element 30 is inserted, and the support member 51 is reattached.

According to each of the above embodiments, the circuit element 30 is inserted into the element arrangement hole 11 and elastically sandwiched between the pair of spring terminals 20 so that the circuit element 30 can be exchanged while suppressing the thickness dimension. It is mounted on the circuit board 10.

10 Circuit board 11 Element placement hole 12 Protrusion part 13 Groove 14, 15 Hole 20 Spring terminal 21 Soldering part 22 Support part 23 Positioning part 24 Tapered part 30 Circuit element 40, 51, 52 Support member 41,511 Support column 512,522 Protrusion 523 opening

Claims (3)

A circuit board with a wiring pattern formed on the surface and an element placement hole in which circuit elements are placed,
It is provided with a pair of spring terminals that are solder-connected to the wiring pattern on the surface of the circuit board, enter the element placement hole, elastically sandwich the circuit element placed in the element placement hole from both sides, and conduct with the circuit element. ,
Each of the pair of spring terminals
A soldered portion of the circuit board to be soldered to a surface of the circuit board arranged in the element arrangement hole facing the same direction as the rear surface of the insertion direction into the element arrangement hole.
Following the soldered portion, the circuit element extends to a position overlapping the edge of the rear surface of the circuit element arranged in the element arrangement hole, and then extends inward in the element arrangement hole and in a direction away from the circuit element. Suppressing part that suppresses the pulling out to the rear surface side,
Following the suppression portion, the circuit element is elastically pressed and conductive with the circuit element by extending toward the side surface of the circuit element, contacting the side surface, and then extending toward a direction away from the side surface. Pressing part and
Following the pressing portion, the circuit element has a support portion extending to a position overlapping the front surface in the direction of insertion into the element placement hole to prevent the circuit element from coming off to the front surface side. Board mounting structure. The circuit board has a groove for positioning the spring terminal provided at a position corresponding to an end edge of the soldered portion of each of the pair of spring terminals on the side away from the element placement hole. ,
The substrate mounting structure according to claim 1 , wherein each of the pair of spring terminals has a positioning portion that bends from the end edge of the soldered portion toward the circuit board side and enters the groove . The circuit element has a rectangular shape when projected in the direction of insertion into the substrate placement hole.
A pair of protrusions from both sides of the circuit board projecting from the inner wall surface of the board placement hole toward each of the remaining two sides of the circuit element except the two sides in contact with the spring terminal. The board mounting structure according to claim 1 or 2, wherein the board has a portion .

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