JP6014513B2 - プラズマエッチング装置及び制御方法 - Google Patents

プラズマエッチング装置及び制御方法 Download PDF

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JP6014513B2
JP6014513B2 JP2013031212A JP2013031212A JP6014513B2 JP 6014513 B2 JP6014513 B2 JP 6014513B2 JP 2013031212 A JP2013031212 A JP 2013031212A JP 2013031212 A JP2013031212 A JP 2013031212A JP 6014513 B2 JP6014513 B2 JP 6014513B2
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temperature
base
cooling medium
flow path
electrostatic chuck
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JP2014063972A (ja
JP2014063972A5 (enExample
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敦彦 田淵
敦彦 田淵
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to US14/013,128 priority patent/US8809197B2/en
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JP2013031212A 2012-08-29 2013-02-20 プラズマエッチング装置及び制御方法 Active JP6014513B2 (ja)

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JP2013031212A JP6014513B2 (ja) 2012-08-29 2013-02-20 プラズマエッチング装置及び制御方法
US14/013,128 US8809197B2 (en) 2012-08-29 2013-08-29 Plasma etching apparatus and control method

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JP2012188913 2012-08-29
JP2012188913 2012-08-29
JP2013031212A JP6014513B2 (ja) 2012-08-29 2013-02-20 プラズマエッチング装置及び制御方法

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JP2014063972A JP2014063972A (ja) 2014-04-10
JP2014063972A5 JP2014063972A5 (enExample) 2016-01-28
JP6014513B2 true JP6014513B2 (ja) 2016-10-25

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101575505B1 (ko) * 2014-07-21 2015-12-07 주식회사 스피드터치 공정온도 조절 장치
WO2016080502A1 (ja) * 2014-11-20 2016-05-26 住友大阪セメント株式会社 静電チャック装置
JP5841281B1 (ja) 2015-06-15 2016-01-13 伸和コントロールズ株式会社 プラズマ処理装置用チラー装置
KR102395029B1 (ko) * 2015-08-07 2022-05-09 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6570390B2 (ja) * 2015-09-24 2019-09-04 東京エレクトロン株式会社 温度調整装置及び基板処理装置
JP2017199851A (ja) * 2016-04-28 2017-11-02 株式会社ディスコ 減圧処理装置
JP6823494B2 (ja) * 2017-02-24 2021-02-03 伸和コントロールズ株式会社 温度制御装置
JP6990058B2 (ja) * 2017-07-24 2022-01-12 伸和コントロールズ株式会社 温度制御装置
JP2020120081A (ja) * 2019-01-28 2020-08-06 東京エレクトロン株式会社 基板処理装置
WO2020217800A1 (ja) * 2019-04-23 2020-10-29 Ckd株式会社 熱交換システム
JP7668682B2 (ja) * 2021-06-02 2025-04-25 東京エレクトロン株式会社 温度制御装置および基板処理装置
CN118077038A (zh) * 2021-10-15 2024-05-24 东京毅力科创株式会社 温度控制装置、基片处理装置和液量控制方法
JP7587548B2 (ja) * 2022-04-26 2024-11-20 Ckd株式会社 温度調整用流量制御ユニットおよび半導体製造装置
JP2025139506A (ja) * 2024-03-12 2025-09-26 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04275420A (ja) * 1991-03-04 1992-10-01 Matsushita Electric Ind Co Ltd ドライエッチング装置の冷却装置
JPH06283594A (ja) * 1993-03-24 1994-10-07 Tokyo Electron Ltd 静電チャック
JPH0982788A (ja) * 1995-07-10 1997-03-28 Anelva Corp 静電チャックおよびその製造方法
JP4256031B2 (ja) * 1999-07-27 2009-04-22 東京エレクトロン株式会社 処理装置およびその温度制御方法
JP5434636B2 (ja) * 2010-01-29 2014-03-05 住友電気工業株式会社 静電チャックを備えた基板保持体
JP5423632B2 (ja) * 2010-01-29 2014-02-19 住友大阪セメント株式会社 静電チャック装置
JP2011187758A (ja) * 2010-03-10 2011-09-22 Tokyo Electron Ltd 温度制御システム、温度制御方法、プラズマ処理装置及びコンピュータ記憶媒体

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