JP6013475B2 - キャリア付金属箔 - Google Patents

キャリア付金属箔 Download PDF

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Publication number
JP6013475B2
JP6013475B2 JP2014519990A JP2014519990A JP6013475B2 JP 6013475 B2 JP6013475 B2 JP 6013475B2 JP 2014519990 A JP2014519990 A JP 2014519990A JP 2014519990 A JP2014519990 A JP 2014519990A JP 6013475 B2 JP6013475 B2 JP 6013475B2
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JP
Japan
Prior art keywords
metal foil
carrier
resin
manufacturing
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014519990A
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English (en)
Japanese (ja)
Other versions
JPWO2013183607A1 (ja
Inventor
倫也 古曳
倫也 古曳
晃正 森山
晃正 森山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2014519990A priority Critical patent/JP6013475B2/ja
Publication of JPWO2013183607A1 publication Critical patent/JPWO2013183607A1/ja
Application granted granted Critical
Publication of JP6013475B2 publication Critical patent/JP6013475B2/ja
Active legal-status Critical Current
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/582Tearability
    • B32B2307/5825Tear resistant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0156Temporary polymeric carrier or foil, e.g. for processing or transferring
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264Peeling insulating layer, e.g. foil, or separating mask
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1536Temporarily stacked PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2014519990A 2012-06-04 2013-06-03 キャリア付金属箔 Active JP6013475B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014519990A JP6013475B2 (ja) 2012-06-04 2013-06-03 キャリア付金属箔

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012127566 2012-06-04
JP2012127566 2012-06-04
JP2014519990A JP6013475B2 (ja) 2012-06-04 2013-06-03 キャリア付金属箔
PCT/JP2013/065408 WO2013183607A1 (ja) 2012-06-04 2013-06-03 キャリア付金属箔

Publications (2)

Publication Number Publication Date
JPWO2013183607A1 JPWO2013183607A1 (ja) 2016-02-01
JP6013475B2 true JP6013475B2 (ja) 2016-10-25

Family

ID=49711999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014519990A Active JP6013475B2 (ja) 2012-06-04 2013-06-03 キャリア付金属箔

Country Status (4)

Country Link
JP (1) JP6013475B2 (ko)
KR (3) KR20190099096A (ko)
TW (1) TWI565371B (ko)
WO (1) WO2013183607A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013183606A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔
JPWO2013183605A1 (ja) * 2012-06-04 2016-02-01 Jx日鉱日石金属株式会社 キャリア付金属箔
WO2013183604A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 多層プリント配線板の製造方法
JP5826322B2 (ja) * 2014-03-25 2015-12-02 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ用回路形成基板、半導体パッケージ及びプリント配線板の製造方法
JP6438370B2 (ja) * 2015-08-03 2018-12-12 Jx金属株式会社 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器
WO2017022807A1 (ja) * 2015-08-03 2017-02-09 Jx金属株式会社 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器
JP5897755B2 (ja) * 2015-08-11 2016-03-30 Jx金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器、半導体パッケージ、プリント配線板の製造方法、電子機器の製造方法、半導体パッケージの製造方法、樹脂基材の製造方法、銅箔の表面プロファイルを樹脂基材に転写する方法
JPWO2017051897A1 (ja) * 2015-09-24 2018-08-30 Jx金属株式会社 金属箔、離型層付き金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP6031624B2 (ja) * 2016-02-29 2016-11-24 Jx金属株式会社 表面処理銅箔、銅張積層板、プリント配線板の製造方法、半導体パッケージの製造方法及び電子機器の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4582436B2 (ja) * 2001-08-27 2010-11-17 Jx日鉱日石金属株式会社 水溶性樹脂キャリア付銅箔及び該銅箔を使用したプリント基板
JP2007055165A (ja) * 2005-08-26 2007-03-08 Shin Etsu Chem Co Ltd フレキシブル銅張積層板及びその製造方法
JP4334005B2 (ja) * 2005-12-07 2009-09-16 新光電気工業株式会社 配線基板の製造方法及び電子部品実装構造体の製造方法
JP4754402B2 (ja) * 2006-05-17 2011-08-24 三井金属鉱業株式会社 キャリア箔付銅箔、キャリア箔付銅箔の製造方法、キャリア箔付表面処理銅箔及びそのキャリア箔付表面処理銅箔を用いた銅張積層板
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
JPWO2008004615A1 (ja) * 2006-07-07 2009-12-03 三菱瓦斯化学株式会社 ポリイミド樹脂
WO2008146448A1 (ja) * 2007-05-23 2008-12-04 Unitika Ltd. ピーラブル性を有する積層体およびその製造方法
WO2009035014A1 (ja) * 2007-09-11 2009-03-19 Ajinomoto Co., Inc. 多層プリント配線板の製造方法
JP4973519B2 (ja) * 2008-01-18 2012-07-11 住友ベークライト株式会社 積層板、積層板の製造方法、多層プリント配線板および半導体装置
US8318292B2 (en) * 2008-03-26 2012-11-27 Sumitomo Bakelite Co., Ltd. Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device
JP4805304B2 (ja) 2008-05-12 2011-11-02 Jx日鉱日石金属株式会社 キャリヤー付き金属箔及び多層コアレス回路基板の製造方法
JP4927963B2 (ja) * 2010-01-22 2012-05-09 古河電気工業株式会社 表面処理銅箔、その製造方法及び銅張積層基板
JP2013140856A (ja) * 2011-12-28 2013-07-18 Jx Nippon Mining & Metals Corp キャリア付金属箔
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板
JPWO2013183605A1 (ja) * 2012-06-04 2016-02-01 Jx日鉱日石金属株式会社 キャリア付金属箔
WO2013183604A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 多層プリント配線板の製造方法
WO2013183606A1 (ja) * 2012-06-04 2013-12-12 Jx日鉱日石金属株式会社 キャリア付金属箔

Also Published As

Publication number Publication date
CN104334345A (zh) 2015-02-04
JPWO2013183607A1 (ja) 2016-02-01
KR20150024359A (ko) 2015-03-06
KR20190099096A (ko) 2019-08-23
TWI565371B (zh) 2017-01-01
KR20170034947A (ko) 2017-03-29
TW201414365A (zh) 2014-04-01
WO2013183607A1 (ja) 2013-12-12

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