JP5987976B2 - Substrate detection system and substrate detection method - Google Patents

Description

  The present invention relates to a substrate detection system and a substrate detection method for detecting whether or not a substrate is normally mounted on a substrate carrier.

  In processing steps such as film formation and etching in the manufacture of semiconductor devices such as solar cells, there is a method in which a substrate is mounted on a substrate carrier and carried into a processing device. At this time, it is necessary to detect whether or not the substrate is normally mounted on the substrate carrier. For this reason, there has been proposed a method of correctly mounting a substrate on the substrate carrier by photographing the substrate mounted on the substrate carrier with an imaging device such as a camera (see, for example, Patent Document 1). Also, a detection method using a reflection type laser displacement measurement method has been proposed.

JP 2003-332388 A

  When photographing the substrate mounted on the substrate carrier, for example, illumination light is projected from the same side as the photographing direction toward the main surface of the substrate. For this reason, it is difficult to obtain optical contrast when the main surface of the substrate and the surface of the substrate carrier are similar because the film is formed on both the main surface of the substrate and the surface of the substrate carrier by a film forming process or the like. Thus, there is a problem that it becomes difficult to identify the boundary between the substrate and the substrate carrier. Further, the method using the reflection type laser displacement measurement method can be used only in an arrangement in which the substrate carrier does not interfere with the light projecting / receiving light path, and it is necessary to move and scan either the substrate or the sensor. For this reason, there are many restrictions on substrate detection.

  In view of the above problems, an object of the present invention is to provide a substrate detection system and a substrate detection method that can detect whether or not a substrate is normally mounted on a substrate carrier with high accuracy and less detection limit.

According to one aspect of the present invention, (a) a substrate mounting surface on which a substrate is mounted is defined, and a detection mark is provided in an inspection region including at least a part of the substrate mounting region of the substrate mounting surface. (B) an imaging device that captures a substrate mounting surface on which a substrate is mounted so as to include an inspection region and obtains a determination image; and (c) a substrate mounting region of a detection mark. When the image of the arranged portion is not included in the determination image, it is determined that the substrate is normally mounted on the substrate mounting surface, and the image of the portion arranged in the substrate mounting area of the detection mark is the determination image And a determination apparatus that determines that the substrate is not mounted at a normal position on the substrate mounting surface or is not mounted in a normal posture .

According to another aspect of the present invention, (a) a detection mark is provided in an inspection area having a board mounting surface in which a board mounting area on which a board is mounted is defined and including at least a part of the board mounting area of the board mounting surface (B) obtaining a determination image by photographing the substrate mounting surface on which the substrate of the substrate carrier is mounted so as to include the inspection region; A step of inspecting whether or not an image of a portion arranged in the substrate mounting area of the detection mark is included in the determination image; and (d) an image of the portion arranged in the substrate mounting area of the detection mark. Is not included in the substrate mounting surface, it is determined that the substrate is normally mounted on the substrate mounting surface, and the image of the portion arranged in the substrate mounting area of the detection mark is included in the determination image. instrumentation to a normal position in the mounting surface That it is not or not to be mounted in a normal posture substrate detection method and determining are provided.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate detection system and board | substrate detection method which can detect whether the board | substrate is normally mounted | worn to the board | substrate carrier with high precision and few detection restrictions can be provided.

It is a mimetic diagram showing the composition of the substrate detection system concerning the embodiment of the present invention. It is a schematic diagram which shows the structural example of the board | substrate mounting surface of the board | substrate carrier of the board | substrate detection system which concerns on embodiment of this invention. It is a schematic diagram which shows the example of a detection mark. It is a schematic diagram which shows the other example of a detection mark. It is a schematic diagram which shows another example of a detection mark. It is a schematic diagram which shows the example of a substrate carrier. It is a typical front view which shows the example of the illumination method in the board | substrate detection system which concerns on embodiment of this invention. It is a typical top view which shows the example of the illumination method in the board | substrate detection system which concerns on embodiment of this invention. It is a schematic diagram which shows the example of the image for determination when the board | substrate is not mounted | worn normally. It is a schematic diagram which shows the example of the image for determination when the board | substrate is mounted | worn normally. It is a flowchart for demonstrating the board | substrate detection method which concerns on embodiment of this invention. It is a schematic diagram which shows the example of the image for determination before trapezoid correction | amendment. It is a schematic diagram which shows the example of the image for determination after trapezoid correction | amendment. It is a schematic diagram which shows the example of the test | inspection area | region in the image for determination. It is a schematic diagram which shows the example of the test | inspection area | region extracted from the image for determination. It is an example of the reference pattern used for pattern matching. It is a schematic diagram which shows the example with which the board | substrate was mounted | worn on the board | substrate mounting surface. It is a schematic diagram which shows the example of the board | substrate carrier applicable to the board | substrate detection method which concerns on other embodiment of this invention.

  Next, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic. Further, the embodiment described below exemplifies an apparatus and a method for embodying the technical idea of the present invention, and the embodiment of the present invention has the following structure and arrangement of components. It is not something specific. The embodiment of the present invention can be variously modified within the scope of the claims.

  The substrate detection system 1 according to the embodiment of the present invention shown in FIG. 1 detects whether or not the substrate 100 is normally mounted on the substrate carrier 10 including the substrate plate 11 having the substrate mounting surface 110.

  First, the substrate mounting surface 110 of the substrate carrier 10 will be described. As shown in FIG. 2, a substrate mounting area 111 on which the substrate 100 is mounted and a non-mounting area 112 around the substrate mounting area 111 are defined on the substrate mounting surface 110. The non-mounting area 112 is a remaining area of the area where the board mounting area 111 of the board mounting surface 110 is defined. The detection mark 200 is disposed in an area including at least a part of the substrate mounting area 111. The area where the detection mark 200 on the substrate mounting surface 110 is arranged is referred to as “inspection area D”. FIG. 2 shows an example in which four substrates 100 are mounted on the substrate mounting surface 110 of the substrate plate 11. However, it goes without saying that the number of substrates 100 mounted on one substrate mounting surface 110 is not limited to four. For example, one substrate 100 may be mounted on one substrate mounting surface 110.

  The detection mark 200 is formed by digging a groove in the surface of the substrate mounting surface 110, for example. In the example shown in FIG. 2, the detection mark 200 is a linear groove formed continuously over the substrate mounting area 111 and the non-mounting area. That is, the detection mark 200 is disposed across the boundary between the substrate mounting area 111 and the non-mounting area 112.

  In addition to forming the groove, the detection mark 200 can be formed on the surface of the substrate mounting surface 110 by painting the substrate mounting surface 110 or applying a tape. However, in the case of the substrate carrier 10 used in the film forming apparatus, it is necessary that the coating or tape can withstand the high temperature during film formation. Further, when the substrate carrier 10 is used in a manufacturing apparatus that performs plasma processing, a convex portion is formed on the substrate mounting surface 110 by painting or tape, and the contact between the substrate 100 and the substrate mounting surface 110 becomes insufficient, It is conceivable that the substrate potential is not stable. For this reason, in the plasma film formation, there is a possibility that a problem that the uniformity of the film deteriorates may occur. In many film forming apparatuses, a film forming process is performed in a chamber. When the inside of the chamber is evacuated for the film forming process, gas may be generated from coating or tape. This may cause problems such as an increase in time until the inside of the chamber is depressurized to a predetermined pressure, or deterioration of film quality due to gas remaining in the chamber. Therefore, it is necessary to consider a method for forming the detection mark 200 in consideration of a manufacturing process in which the substrate carrier 10 is used.

  Although FIG. 2 shows an example in which the detection mark 200 is a linear pattern extending in the vertical direction, various shapes can be employed for the detection mark 200 in addition to this. For example, as shown in FIG. 3, the detection mark 200 may be a linear pattern extending in the horizontal direction. Alternatively, as shown in FIG. 4, a plurality of linear patterns in which the detection marks 200 are parallel may be used.

  Further, for example, as shown in FIG. 5, the detection mark 200 may be arranged only in the substrate mounting area 111. The shape of the detection mark 200 is not particularly limited, but a cross shape, a round shape, a square shape, or the like illustrated in FIG. 5 can be employed.

  The substrate carrier 10 is a vertical boat type in which the substrate mounting surface 110 extends in the vertical direction and the substrate 100 is mounted vertically. Although only one substrate plate 11 is shown in FIG. 1, the boat-type substrate carrier 10 has a plurality of substrate plates 11 each having a bottom portion fixed to one bottom plate 12 as shown in FIG. Is generally arranged along the surface normal direction of the substrate mounting surface 110.

  The substrate 100 is a substrate used for a semiconductor device or a solar battery cell such as a silicon substrate or a glass substrate.

  As shown in FIG. 1, the board detection system 1 uses the first imaging device 31 and the second imaging device 32 that capture the board mounting surface 110 to obtain the judgment image, and the judgment image. And a determination device 40 for determining whether or not the substrate 100 is normally mounted on the substrate mounting surface 110.

  The substrate 100 is mounted on at least one of the two substrate mounting surfaces 110 facing each other on the substrate plate 11. FIG. 1 shows an example in which the substrate 100 is mounted on both of the two substrate mounting surfaces 110 of the substrate plate 11. For this reason, a first imaging device 31 that images one substrate mounting surface 110 on which the substrate 100 is mounted and a second imaging device 32 that images the other substrate mounting surface 110 on which the substrate 100 is mounted are prepared. Has been. The imaging devices used in the substrate detection system 1 are collectively referred to as “imaging device 30”.

  The substrate 100 may be mounted only on one substrate mounting surface 110 of the substrate plate 11. In this case, the imaging device 30 that images the board mounting surface 110 on which the board 100 is not mounted is unnecessary.

  The imaging device 30 photographs the substrate mounting surface 110 on which the substrate 100 is mounted so as to include the inspection region D. For example, when the substrate carrier 10 is a boat type as shown in FIG. 6, the inspection region D is located near the upper end of the substrate mounting region 111 so that the inspection region D to be imaged is not a shadow of the adjacent substrate plate 11. Be placed. Then, the imaging device 30 images the inspection region D from obliquely above the substrate plate 11. Since the detection mark 200 is arranged near the upper end of the board mounting surface 110, the imaging device 30 captures the upper end area of the board mounting area 111 and acquires a determination image.

  The image data for determination is transmitted from the imaging device 30 to the determination device 40 as a signal Id.

  When the substrate 100 is mounted on the substrate mounting surface 110 in a normal posture, the portion hidden in the substrate 100 and disposed in the substrate mounting region 111 of the detection mark 200 (hereinafter referred to as “mounting region portion”). ) Cannot be taken by the imaging device 30. Therefore, the image of the mounting area portion of the detection mark 200 is not included in the determination image. On the other hand, when the substrate 100 is not mounted on the substrate mounting surface 110 in a normal posture, the entire or part of the image of the mounting region portion of the detection mark 200 exists in the determination image.

  For this reason, the determination device 40 determines whether or not the substrate 100 is normally mounted on the substrate mounting surface 110 based on the presence or absence of an image of the mounting region portion of the detection mark 200 in the determination image. That is, the determination device 40 inspects the determination image, and when the image of the mounting region portion of the detection mark 200 is not included in the determination image, the substrate 100 is normally mounted on the substrate mounting surface 110. Is determined. On the other hand, when the image for the mounting area of the detection mark 200 is included in the determination image, it is determined that the substrate 100 is not normally mounted on the substrate mounting surface 110. That is, the detection mark 200 functions as an optical identification mark.

  The substrate detection system 1 detects that the substrate 100 is mounted in a normal posture on the substrate carrier 10 and that the substrate 100 is mounted at a normal position on the substrate carrier 10. Alternatively, it is detected that the substrate 100 is mounted on all the substrate mounting regions 111 defined in the substrate carrier 10.

  In addition, the board | substrate detection system 1 is further provided with the illuminating device 20 which projects the illumination light L on the board | substrate mounting surface 110 with which the board | substrate 100 was mounted | worn as shown in FIG. The position of the illumination device 20, the type of the illumination light L, and the like are selected so that the detection mark 200 appears clearly in the determination image. For example, when the detection mark 200 is a groove formed on the substrate mounting surface 110, the illumination light L is projected onto the substrate mounting surface 110 along the substrate mounting surface 110 from a direction perpendicular to the extending direction of the groove. Thereby, the contrast produced by the formation of the detection mark 200 becomes clearer.

  Specifically, when the detection mark 200 is a groove extending in the vertical direction as shown in FIGS. 2 and 4, the horizontal direction along the substrate mounting surface 110 is shown in FIGS. Illumination light L is irradiated from. 7 shows an example in which four substrates 100 are mounted on the substrate mounting surface 110, and FIG. 8 shows an example in which one substrate 100 is mounted on the substrate mounting surface 110.

  On the other hand, when the detection mark 200 is a groove extending in the horizontal direction as shown in FIG. 3, it is preferable to irradiate the illumination light L from the vertical direction along the substrate mounting surface 110.

  FIG. 9 shows an image image for determination when the substrate 100 is not mounted on the substrate mounting surface 110. The detection mark 200 shown in FIG. 9 is an example in which two grooves are formed at a substantially central portion of the substrate mounting area 111 at intervals of 20 mm by groove processing with a width of 1 mm and a depth of 0.5 mm in the vertical direction.

  The width of the groove formed as the detection mark 200 needs to be equal to or larger than the width capable of detecting the detection mark 200 in the image for determination according to the resolution of the imaging device 30. That is, the width and depth of the groove are set so that the contrast between the groove portion and other portions is clear. On the other hand, the deeper the groove, the better the contrast, but the groove is formed so as not to penetrate the substrate plate 11. This is because when the through-hole is formed in the substrate plate 11, problems such as changes in film forming conditions occur.

  Even if the width of the groove is unnecessarily widened, only a step having a low aspect ratio can be formed due to the limitation of the thickness of the substrate plate 11. Therefore, in this example, the groove depth was set to 0.5 mm, and 1 mm was set to the groove width so that the contrast became clear at this depth. That is, in the case of a groove having a depth of 0.5 mm, the width at which the shaded line width assumed from the groove depth and the groove width is maximum is 1 mm. This width is a value close to the resolution limit of the imaging device 30 to be used.

  The determination image shown in FIG. 9 includes an image of the mounting area portion of the detection mark 200. On the other hand, the determination image shown in FIG. 10 does not include the mounting area portion of the detection mark 200 because it is hidden by the substrate 100, and is arranged in the non-mounting area 112 of the detection mark 200. Only part is included. In this case, the substrate 100 is normally mounted on the substrate mounting surface 110.

  In addition, in order to make the contrast generated by forming the detection mark 200 clear, it is possible to form the detection mark 200 by digging a groove in the substrate mounting surface 110 rather than forming the detection mark 200 by painting or tape. preferable.

  The determination device 40 determines whether or not the substrate 100 is mounted on the substrate mounting surface 110 in a normal posture using, for example, a pattern matching method as will be described later. Hereinafter, an example of a substrate detection method according to an embodiment of the present invention will be described with reference to FIG. Below, the case where the board | substrate carrier 10 is a boat type and the imaging device 30 image | photographs the board | substrate mounting surface 110 from diagonally upward is demonstrated exemplarily. Note that the detection mark 200 shown in FIG. 9 is arranged on the board mounting surface 110.

  First, in step S <b> 11 of FIG. 11, the imaging device 30 images the substrate carrier 10 in which the substrate 100 is mounted on the substrate mounting surface 110. Thereby, for example, as shown in FIG. 12, an image for determination of the substrate mounting surface 110 taken from obliquely above is acquired.

  Next, in step S <b> 12, the image processing unit 41 of the determination device 40 performs trapezoid correction on the determination image. That is, in order to perform pattern matching to be described later, the trapezoidal image of the substrate mounting surface 110 is corrected to a rectangular image viewed from the surface normal direction by photographing from obliquely above. As a result, a determination image having a rectangular substrate mounting surface 110 as shown in FIG. 13 is obtained. By performing trapezoidal correction, rectangular pattern matching is possible, time required for calculation is reduced, and matching accuracy can be increased.

  Thereafter, the inspection unit 42 of the determination apparatus 40 inspects whether or not the attachment region portion of the detection mark 200 is included in the determination image after the keystone correction. Specifically, in step S13, an area including the inspection area D is extracted from the determination image. FIG. 15 is an enlarged view of the extraction area A, where the extraction area A indicated by a square in FIG. 14 is an extracted area. Then, in step S14, a pattern for determining whether or not the detection mark 200 matching the reference pattern 210 is included in the determination image using the image of the extraction area A and the reference pattern 210 shown in FIG. 16 prepared in advance. Perform matching. Since the reference pattern 210 is a pattern corresponding to the detection mark 200, it is possible to inspect whether or not the mounting area portion of the detection mark 200 is included in the determination image by pattern matching. If the extracted image has the same pattern as the reference pattern 210, the detection mark 200 that should be hidden by the substrate 100 is exposed.

  Next, in step S <b> 15, the determination unit 43 of the determination apparatus 40 determines whether the substrate 100 is normally mounted on the substrate mounting surface 110 using the pattern matching result. That is, when the image of the mounting area portion of the detection mark 200 is not included in the determination image, it is determined that the substrate 100 is normally mounted on the substrate mounting surface 110. On the other hand, if the image for determination includes a part or the entire image of the mounting area portion of the detection mark 200, it is determined that the substrate 100 is not normally mounted on the substrate mounting surface 110.

  Thus, the substrate detection by the substrate detection system 1 is completed.

  When the substrate 100 is not mounted on the substrate carrier 10 at a normal position or when the substrate 100 is not mounted in a normal posture, the substrate 100 falls from the substrate carrier 10 during the processing step of the substrate 100, There is a possibility that problems such as failure to perform normal processing on the substrate 100 may occur. FIG. 17 shows an example in which the substrate 100a is mounted on the substrate mounting surface 110 in a normal posture and the substrate 100b is not mounted on the substrate mounting surface 110 in a normal posture. Further, an example is shown in which the substrate 100c is not mounted at a normal position and is dropped from the substrate mounting surface 110.

  According to the substrate detection system 1, it is possible to detect that the substrate 100 b and the substrate 100 c illustrated in FIG. 17 are not normally mounted on the substrate carrier 10 by inspecting the mounting region portion of the detection mark 200. For this reason, the malfunction resulting from the board | substrate 100 not being normally mounted | worn to the board | substrate carrier 10 can be prevented.

  By the way, since the area of the substrate mounting surface 110 is large, the width of the detection mark 200 is relatively high. Since the width of the groove can be widened, the size of the detection mark 200 can be made to match the size of the low resolution screen. For this reason, it is easy to keep the shape S / N ratio on the determination image high. Therefore, the substrate 100 can be detected with high accuracy without using an expensive imaging device with a high resolution for the imaging device 30. Thereby, according to the board | substrate detection system 1, both detection performance and economical efficiency are compatible.

  For example, an image of horizontal 640 dots × vertical 480 dots is captured in an area having a horizontal width of about 660 to 680 mm. In this case, one image pixel and the vertical groove width 1 mm are substantially the same. However, in order to obtain an image of a groove having a clear contrast, not only the width of the groove but also the depth is important. Therefore, it is possible to use the imaging device 30 that can widen the imaging field of view up to the same extent as the “shaded line width assumed from the groove depth and groove width” and the “economic resolution pixel resolution”. The above performance is also effective for the mark extraction program (algorithm) used.

  As described above, in the substrate detection system 1 according to the embodiment of the present invention, the substrate 100 is placed on the substrate mounting surface 110 by inspecting the presence or absence of the image of the mounting region portion of the detection mark 200 in the determination image. It is possible to detect with high accuracy and a small detection limit whether or not it is mounted in a normal posture.

  Since the resolution of the determination image may be low as already described, the imaging device 30 can be arranged with a wide imaging field of view set. That is, the substrate mounting surface 110 may be photographed from a position relatively away from the substrate carrier 10. Therefore, the substrate detection system 1 is particularly effective in the case of the boat type substrate carrier 10 in which the substrate 100 is mounted in the vertical direction and a plurality of substrates 100 are arranged side by side on the same substrate mounting surface 110.

  Furthermore, the substrate detection system 1 is also effective when it is difficult to dispose an illumination device, a substrate detection sensor, or the like at a position or direction facing the substrate 100.

  In the case where the mounting state of a plurality of substrates 100 mounted on one substrate mounting surface 110 is detected at the same time, the imaging device 30 can capture all the inspection areas D arranged in the respective substrate mounting areas 111. Placed in.

  The substrate detection system 1 shown in FIG. 1 can be used in a process of forming an antireflection film or a passivation film on a solar cell substrate by, for example, a plasma chemical vapor deposition (CVD) method. That is, a solar cell substrate made of a silicon substrate or the like is mounted on the substrate carrier 10 as the substrate 100. And before carrying in the substrate carrier 10 with which the solar cell substrate was mounted | worn to a plasma CVD apparatus, the substrate detection system 1 detects whether the solar cell substrate is correctly mounted | worn with the substrate carrier 10. FIG. After it is confirmed that the solar cell substrate is correctly mounted on the substrate carrier 10, the substrate carrier 10 is carried into a plasma CVD apparatus. In this case, the substrate plate 11 is used as an anode electrode of a plasma CVD apparatus.

  In the above description, the example in which the substrate 100 is a solar cell substrate and the substrate plate 11 is an anode electrode of a plasma CVD apparatus has been described. However, for example, the substrate carrier 10 may be a substrate carrier for carrying the substrate 100 into an etching apparatus or a heating apparatus. That is, the substrate detection system 1 shown in FIG. 1 is applicable to the substrate carrier 10 that is loaded with the substrate 100 and stored in various manufacturing apparatuses.

  The region irradiated with the illumination light L necessary for detecting the substrate 100 is only the inspection region D where the detection mark 200 is arranged. For this reason, the reflection of the illumination light L is hardly affected by the surface state of the substrate carrier 10 or the substrate 100, and an optical contrast is easily obtained. Therefore, it is easy to detect the detection mark 200 arranged on the substrate mounting surface 110. In addition, since only the inspection area D needs to be imaged, an increase in the number of illumination devices 20 and imaging devices 30 can be suppressed. Further, unlike the reflection type laser displacement measurement method, it is not necessary to move and scan the substrate 100 and the like, and static detection is possible.

  In the substrate detection method by the substrate detection system 1, only the detection mark 200 needs to be extracted from the determination image. For this reason, the resolution of the imaging device 30 may be lower than the thickness of the substrate 100. For example, even when the substrate 100 has a large surface area and a small thickness like a semiconductor wafer, it is possible to capture a determination image from which the detection mark 200 can be extracted. Therefore, even when the substrate 100 is thin, it can be detected whether the substrate 100 is mounted on the substrate mounting surface 110 in a normal posture.

  In the above, as shown in FIG. 2 and FIG. 9, the example in which the detection mark 200 is continuously arranged over the substrate mounting area 111 and the non-mounting area 112 has been shown. However, if the detection mark 200 is arranged only in the substrate mounting area 111, it is easy to determine the presence or absence of the detection mark 200. For this reason, it is preferable that the detection mark 200 is disposed only in the substrate mounting area 111 if it is only determined whether or not the substrate 100 is mounted on the substrate mounting surface 110 in a normal posture. On the other hand, a groove or the like formed on the substrate mounting surface 110 for other purposes can be used for the detection mark 200.

(Other embodiments)
As mentioned above, although this invention was described by embodiment, it should not be understood that the description and drawing which form a part of this indication limit this invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  In the above, an example in which the substrate carrier 10 is a boat type in which the substrate 100 is vertically mounted has been described. However, the present invention can be applied to other types of substrate carriers 10. For example, as shown in FIG. 18, even in the case of a cart-type substrate carrier 10 in which the substrate 100 is horizontally mounted on the substrate mounting surface 110 extending in the horizontal direction, the presence or absence of the detection mark 200 is inspected with the determination image. It can be detected whether or not the substrate 100 is normally mounted on the substrate mounting surface 110.

  Moreover, although the example which forms the groove | channel in the surface of the board | substrate mounting surface 110 and forms the detection mark 200 was shown, the detection mark 200 was applied to the surface of the board | substrate mounting surface 110 by coating the board mounting surface 110 or stretching a tape. 200 may be formed.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

  The present invention is applicable to a substrate processing system using a substrate carrier.

Claims (14)

A substrate carrier having a substrate mounting surface in which a substrate mounting region on which the substrate is mounted is defined, and a detection mark arranged in an inspection region including at least a part of the substrate mounting region of the substrate mounting surface;
An imaging device that captures the substrate mounting surface on which the substrate is mounted so as to include the inspection region and obtains a determination image;
When the image of the portion of the detection mark arranged in the substrate mounting area is not included in the determination image, it is determined that the substrate is normally mounted on the substrate mounting surface, and the image of the portion is A determination device that determines that the substrate is not mounted at a normal position on the substrate mounting surface or is not mounted in a normal posture when included in the determination image. Detection system.   The substrate detection system according to claim 1, wherein the detection mark is a groove formed on the substrate mounting surface. The substrate detection system according to claim 1, wherein the detection mark is a linear pattern extending in a horizontal direction or a vertical direction in the substrate mounting region. The determination device is
An image processing unit that corrects an image of the trapezoidal substrate mounting surface imaged from obliquely above into a rectangular image viewed from the surface normal direction;
An inspection unit for inspecting whether or not the detection mark is included in an image of the rectangular substrate mounting region;
The substrate detection system according to claim 1, further comprising: a determination unit that determines whether or not the substrate is normally mounted on the substrate mounting surface using an inspection result by the inspection unit.   The substrate detection system according to claim 1, wherein the imaging device acquires the determination image by photographing an upper end region of the substrate mounting region. A substrate carrier having a substrate mounting surface in which a substrate mounting region on which the substrate is mounted is defined, and a detection mark arranged in an inspection region including at least a part of the substrate mounting region of the substrate mounting surface;
An imaging device that captures the substrate mounting surface on which the substrate is mounted so as to include the inspection region and obtains a determination image;
When the image of the portion of the detection mark arranged in the substrate mounting area is not included in the determination image, it is determined that the substrate is normally mounted on the substrate mounting surface, and the image of the portion is A determination device that determines that the substrate is not normally mounted on the substrate mounting surface when included in the determination image;
The substrate detection is characterized in that the detection mark is continuously arranged over a non-mounting region of the substrate mounting surface which is a remaining region of the substrate mounting region and a region where the substrate mounting region is defined. system. A substrate carrier having a substrate mounting surface in which a substrate mounting region on which the substrate is mounted is defined, and a detection mark arranged in an inspection region including at least a part of the substrate mounting region of the substrate mounting surface;
An imaging device that captures the substrate mounting surface on which the substrate is mounted so as to include the inspection region and obtains a determination image;
When the image of the portion of the detection mark arranged in the substrate mounting area is not included in the determination image, it is determined that the substrate is normally mounted on the substrate mounting surface, and the image of the portion is A determination device that determines that the substrate is not normally mounted on the substrate mounting surface when included in the determination image;
The detection mark is a groove formed on the substrate mounting surface, and illumination light is directed along the substrate mounting surface from the direction perpendicular to the direction in which the groove extends along the substrate mounting surface on which the substrate is mounted. With lighting equipment to project
A substrate detection system comprising: Providing a substrate carrier having a substrate mounting surface in which a substrate mounting region on which a substrate is mounted is defined and having a detection mark disposed in an inspection region including at least a part of the substrate mounting region of the substrate mounting surface; ,
Photographing the substrate mounting surface on which the substrate of the substrate carrier is mounted so as to include the inspection region, and obtaining a determination image;
Inspecting whether an image of a portion of the detection mark arranged in the substrate mounting region is included in the determination image;
When the image of the portion is not included in the image for determination, it is determined that the substrate is normally mounted on the substrate mounting surface, and the image of the portion is included in the image for determination Determining that the substrate is not mounted at a normal position on the substrate mounting surface or not mounted in a normal posture .   The substrate detection method according to claim 8, wherein the detection mark is a groove formed on the substrate mounting surface. The substrate detection method according to claim 8, wherein the detection mark is a linear pattern extending in a horizontal direction or a vertical direction in the substrate mounting region. Said inspecting step comprises:
Correcting the trapezoidal image of the substrate mounting surface imaged from obliquely above into a rectangular image viewed from the surface normal direction;
The substrate detection method according to claim 8, further comprising: inspecting whether or not the detection mark is included in a rectangular image of the substrate mounting region.   The substrate detection method according to claim 8, wherein the image for determination is acquired by photographing an upper end region of the substrate mounting region. Providing a substrate carrier having a substrate mounting surface in which a substrate mounting region on which a substrate is mounted is defined and having a detection mark disposed in an inspection region including at least a part of the substrate mounting region of the substrate mounting surface; ,
Photographing the substrate mounting surface on which the substrate of the substrate carrier is mounted so as to include the inspection region, and obtaining a determination image;
Inspecting whether an image of a portion of the detection mark arranged in the substrate mounting region is included in the determination image;
When the image of the portion is not included in the image for determination, it is determined that the substrate is normally mounted on the substrate mounting surface, and the image of the portion is included in the image for determination Determining that the substrate is not properly mounted on the substrate mounting surface,
The substrate detection is characterized in that the detection mark is continuously arranged over a non-mounting region of the substrate mounting surface which is a remaining region of the substrate mounting region and a region where the substrate mounting region is defined. Method. Providing a substrate carrier having a substrate mounting surface in which a substrate mounting region on which a substrate is mounted is defined and having a detection mark disposed in an inspection region including at least a part of the substrate mounting region of the substrate mounting surface; ,
Photographing the substrate mounting surface on which the substrate of the substrate carrier is mounted so as to include the inspection region, and obtaining a determination image;
Inspecting whether an image of a portion of the detection mark arranged in the substrate mounting region is included in the determination image;
When the image of the portion is not included in the image for determination, it is determined that the substrate is normally mounted on the substrate mounting surface, and the image of the portion is included in the image for determination Determining that the substrate is not properly mounted on the substrate mounting surface,
The detection mark is a groove formed on the substrate mounting surface;
The substrate is characterized in that illumination light is projected onto the substrate mounting surface on which the substrate is mounted along the substrate mounting surface from a direction perpendicular to a direction in which the groove extends when photographing the substrate mounting surface. Detection method.

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