CN105122438A - Substrate detection system and substrate detection method - Google Patents
Substrate detection system and substrate detection method Download PDFInfo
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- CN105122438A CN105122438A CN201380075577.2A CN201380075577A CN105122438A CN 105122438 A CN105122438 A CN 105122438A CN 201380075577 A CN201380075577 A CN 201380075577A CN 105122438 A CN105122438 A CN 105122438A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
The invention provides a substrate detection system and a substrate detection method. The system is equipped with: a substrate carrier which is provided with a substrate loading surface defining a substrate loading region upon which a substrate is loaded, and in which a detection mark is disposed in an inspection region that includes at least a portion of the substrate loading region on the substrate loading surface; imaging devices which acquire assessment images by photographing the substrate loading surface upon which the substrate is loaded such that the inspection region is included; and an assessment device which assesses that the substrate is properly loaded upon the substrate loading surface in cases in which the assessment images do not include an image of the portion of the detection mark disposed in the substrate loading region, and which assesses that the substrate is not properly loaded upon the substrate loading surface in cases in which the assessment images include an image of the portion of the detection mark disposed in the substrate loading region.
Description
Technical field
The present invention relates to and a kind of detect the substrate whether substrate detection system of normal mounting on substrate carrier (carrier) and method of testing substrate.
Background technology
In the treatment process such as the film forming in the manufacture of the semiconductor device of solar battery cell etc. or etching, have and substrate is arranged on substrate carrier and moves into the mode to processing unit.At this moment, need to detect whether on substrate carrier normal mounting have substrate.Therefore, following method has been proposed: by utilizing the substrate of the filming apparatus such as camera to the state be arranged on substrate carrier to take, and substrate is correctly arranged on (for example, referring to patent documentation 1) on substrate carrier.Further, also propose there is the detection method etc. utilizing reflection-type laser displacement determination method.
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open 2003-332388 publication
Summary of the invention
Invent problem to be solved
When taking the substrate be arranged on substrate carrier, such as, interarea projection illumination light from the side identical with shooting direction to substrate from.Therefore, by film-forming process (process) etc. the interarea of substrate and the surface of substrate carrier both on be formed with film, so when the interarea of substrate and the surface of substrate carrier are close state, exist and be difficult to obtain optical contrast (opticalcontrast), the Boundary Recognition of substrate and substrate carrier becomes the problem of difficulty.Further, the method for reflection-type laser displacement determination method is utilized at substrate carrier and light projector-use in irrelevant configuration of disturbing by light path, in addition, to need to carry out motion scan to any one in substrate or transducer.Therefore, substrate limits many in detecting.
In view of described problem, the object of the present invention is to provide a kind of can high accuracy and detection is limited detect less the substrate whether substrate detection system of normal mounting on substrate carrier and method of testing substrate.
The technological means of dealing with problems
According to a form of the present invention, a kind of substrate detection system is provided, comprise: (1) substrate carrier, comprise the substrate mounting surface faces defining the substrate installation region being installed with substrate, be configured with in the inspection area at least comprising a part for substrate installation region of substrate mounting surface faces and detect mark; (2) filming apparatus, takes the substrate mounting surface faces being provided with substrate in the mode comprising inspection area and obtains judgement image; And (3) judgment means, be judged as that substrate normal mounting is on substrate mounting surface faces when the image being configured in the part in substrate installation region detecting mark is not contained in judgement image, be judged as that substrate does not have normal mounting on substrate mounting surface faces when the image of the part be configured in substrate installation region detecting mark is contained in judgement image.
According to another form of the present invention, a kind of method of testing substrate is provided, comprise the steps: (1) prepared substrate carrier, described substrate carrier comprises the substrate mounting surface faces defining the substrate installation region being installed with substrate, is configured with and detects mark in the inspection area at least comprising a part for substrate installation region of substrate mounting surface faces; (2) take with the substrate mounting surface faces being provided with substrate of mode to substrate carrier comprising inspection area and obtain judgement image; (3) check whether the image being configured in the part in substrate installation region detecting mark is contained in judgement image; And when the image being configured in the part in substrate installation region detecting mark is not contained in judgement image, (4) are judged as that substrate normal mounting is on substrate mounting surface faces, be judged as that substrate does not have normal mounting on substrate mounting surface faces when the image of the part be configured in substrate installation region detecting mark is contained in judgement image.
The effect of invention
According to the present invention, can provide a kind of can high accuracy and make detection limit detect the substrate whether substrate detection system of normal mounting on substrate carrier and method of testing substrate less.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the formation of the substrate detection system representing embodiments of the present invention.
Fig. 2 is the schematic diagram of the configuration example of the substrate mounting surface faces of the substrate carrier of the substrate detection system representing embodiments of the present invention.
Fig. 3 is the schematic diagram representing the example detecting mark.
Fig. 4 is the schematic diagram representing another example detecting mark.
Fig. 5 is the schematic diagram representing another example again detecting mark.
Fig. 6 is the schematic diagram of the example representing substrate carrier.
Fig. 7 is the front schematic view of the example of the means of illumination represented in the substrate detection system of embodiments of the present invention.
Fig. 8 is the schematic plan view of the example of the means of illumination represented in the substrate detection system of embodiments of the present invention.
Fig. 9 is the schematic diagram of the example of the judgement image represented when not having normal mounting substrate.
Figure 10 is the schematic diagram of the example of judgement image when representing that normal mounting has a substrate.
Figure 11 is the flow chart of the method for testing substrate for illustration of embodiments of the present invention.
Figure 12 is the schematic diagram of the example of judgement image before representing trapezoidal correction.
Figure 13 is the schematic diagram of the example representing trapezoidal revised judgement image.
Figure 14 is the schematic diagram of the example of the inspection area represented in judgement image.
Figure 15 is the schematic diagram of the example of the inspection area represented from judgement image contract.
Figure 16 is the example of the reference pattern for pattern match.
Figure 17 is the schematic diagram representing the example being provided with substrate on substrate mounting surface faces.
Figure 18 is the schematic diagram of the example representing the substrate carrier that can be applicable in the method for testing substrate of another embodiment of the present invention.
Embodiment
Secondly, with reference to accompanying drawing, embodiments of the present invention are described.In the record of the following drawings, same or analogous symbol is marked to same or analogous part.But, should notice that accompanying drawing is schematic diagram.Further, execution mode shown below be illustrate for make technological thought of the present invention specialize device or method, the structure of constituent part, configuration etc. do not specify as following structure, configuration etc. by embodiments of the present invention.Embodiments of the present invention can add various change in claims.
The substrate detection system 1 of the embodiments of the present invention shown in Fig. 1 detect whether on the substrate carrier 10 comprising the substrate sheet material 11 with substrate mounting surface faces 110 normal mounting have substrate 100.
First, the substrate mounting surface faces 110 of substrate carrier 10 is described.As shown in Figure 2, on substrate mounting surface faces 110, define the non-installation region 112 being installed with the substrate installation region 111 of substrate 100 and the surrounding of substrate installation region 111.Non-installation region 112 is remaining areas being defined as the region of substrate installation region 111 of substrate mounting surface faces 110.Further, in the region of a part at least comprising substrate installation region 111, be configured with detection mark 200.Moreover, the region detecting mark 200 that is configured with of substrate mounting surface faces 110 is called " inspection area D ".In Fig. 2, represent the example being provided with four pieces of substrates 100 on the substrate mounting surface faces 110 of substrate sheet material 11.But certainly, the block number being arranged on the substrate 100 on a substrate mounting surface faces 110 is not limited to four pieces.Such as, also on a substrate mounting surface faces 110, one piece of substrate 100 can be installed.
Detecting mark 200 is such as grooving and being formed on the surface of substrate mounting surface faces 110.In the illustrated example shown in fig. 2, the groove that mark 200 is the linearities crossed over substrate installation region 111 and non-installation region and formed continuously is detected.That is, cross over substrate installation region 111 and the border of non-installation region 112 and be configured with and detect mark 200.
Moreover, except forming groove, coating can also be applied on substrate mounting surface faces 110 or tape (tape), and detection mark 200 is formed at the surface of substrate mounting surface faces 110.But, when in film formation device substrate carrier 10, need to make high temperature when coating or adhesive tape tolerance film forming.And, when using substrate carrier 10 in the manufacturing installation carrying out plasma treatment, on substrate mounting surface faces 110, form protuberance because of coating or adhesive tape, make substrate 100 become insufficient with the contact of substrate mounting surface faces 110, thus can think that substrate potential is in an unsure state.Therefore, in plasma deposition, the problem that the uniformity likely producing film is deteriorated.Further, be carry out film forming process in chamber in many film formation devices, but sometimes can produce gas from coating or adhesive tape when making to become in chamber vacuum to carry out film forming process.Thus, produce following problem sometimes: increased the time till the pressure being decompressed to regulation in chamber, or the quality of film because residuing in gas in chamber variation etc.Therefore, need to inquire into using the manufacturing process of substrate carrier 10 to take into account the formation method detecting mark 200.
In Fig. 2, be represent to detect the example that mark 200 is the rectilinear form pattern vertically extended, but in addition, various shape can also be adopted in detection mark 200.Such as, as shown in Figure 3, detecting mark 200 also can be the rectilinear form pattern extended in the horizontal direction.Or as shown in Figure 4, detecting mark 200 also can be parallel multiple rectilinear form patterns.
Further, such as, as shown in Figure 5, also can only configuration detection mark 200 in substrate installation region 111.Being not particularly limited detecting the shape of mark 200, cross shape as illustrated in Figure 5, round-shaped, quadrangle form etc. can be adopted.
Substrate carrier 10 is that substrate mounting surface faces 110 vertically extends and the vertically erect type of installation base plate 100 board-like (boardtype).Moreover, in FIG, only indicate one block of substrate sheet material 11, but board-like substrate carrier 10 as shown in Figure 6, normally multiple substrate sheet material 11 is along the structure of the face normal direction arrangement of substrate mounting surface faces 110, and each bottom of described multiple substrate sheet material 11 is fixed on a base plate 12.
Substrate 100 is such as silicon substrate or glass substrate etc. for the substrate of semiconductor device or solar battery cell.
As shown in Figure 1, substrate detection system 1 comprises: the 1st filming apparatus 31 and the 2nd filming apparatus 32, takes and obtain judgement image to substrate mounting surface faces 110; And judgment means 40, utilize judgement image, whether normal mounting is on substrate mounting surface faces 110 to judge substrate 100.
In toward each other two substrate mounting surface faces 110 of substrate sheet material 11 at least on any one, substrate 100 is installed.In Fig. 1, represent two substrate mounting surface faces 110 of substrate sheet material 11 both on the example of substrate 100 is installed.Therefore, the 1st filming apparatus 31 that the substrate mounting surface faces 110 being provided with substrate 100 is taken and the 2nd filming apparatus 32 that another substrate mounting surface faces 110 being provided with substrate 100 is taken is prepared.The filming apparatus be used in substrate detection system 1 is generically and collectively referred to as " filming apparatus 30 ".
Moreover, also only on a substrate mounting surface faces 110 of substrate sheet material 11, substrate 100 can be installed.At this moment, the filming apparatus 30 to not having the substrate mounting surface faces 110 of installation base plate 100 to take is not needed.
Filming apparatus 30 is taken the substrate mounting surface faces 110 being provided with substrate 100 in the mode comprising inspection area D.Such as, when substrate carrier 10 is as shown in Figure 6 board-like, with the inspection area D of reference object not by the mode that the substrate sheet material 11 adjoined blocks, near upper end inspection area D being configured in substrate installation region 111.Further, filming apparatus 30 is taken from the oblique upper of substrate sheet material 11 inspection area D.Be configured near the upper end of substrate mounting surface faces 110, so the upper area of filming apparatus 30 pairs of substrate installation regions 111 is taken and obtains judgement image owing to detecting mark 200.
The data of judgement image are sent to judgment means 40 by signal ld from filming apparatus 30.
When substrate 100 is arranged on substrate mounting surface faces 110 with normal posture, owing to being hidden by substrate 100, so part (hereinafter referred to as " installation region the part ") device 30 that cannot be taken being configured in substrate installation region 111 detecting mark 200 is taken.Therefore, the image detecting the installation region part of mark 200 is not contained in judgement image.On the other hand, when substrate 100 is not arranged on substrate mounting surface faces 110 with normal posture, the entirety or the part that detect the image of the installation region part of mark 200 are present in judgement image.
Therefore, judgment means 40 is by the presence or absence of the image of the installation region part of the detection mark 200 in judgement image, and whether normal mounting is on substrate mounting surface faces 110 to judge substrate 100.That is, judgment means 40 checks judgement image, when the image of the installation region part detecting mark 200 is not contained in judgement image, is judged as that substrate 100 normal mounting is on substrate mounting surface faces 110.On the other hand, when the image of the installation region part detecting mark 200 is contained in judgement image, be judged as that substrate 100 does not have normal mounting on substrate mounting surface faces 110.That is, detect mark 200 to play a role as optical signatures.
Substrate detection system 1 detects substrate 100 and is arranged on substrate carrier 10 with normal posture or substrate 100 is arranged on the normal position of substrate carrier 10.Or, detect in all substrate installation regions 111 of defining on substrate carrier 10 and substrate 100 be installed.
Moreover substrate detection system 1 as shown in Figure 7, also comprises the lighting device 20 illumination light L being projected to the substrate mounting surface faces 110 being provided with substrate 100.So that the mode detecting mark 200 can be manifested in judgement image brightly, select the position of lighting device 20 or the kind etc. of illumination light L.Such as when detecting mark 200 for being formed at the groove on substrate mounting surface faces 110, from the direction vertical with the direction that groove extends along substrate mounting surface faces 110 couples of substrate mounting surface faces 110 projection illumination light L.Thus, the contrast produced by being formed with detection mark 200 is more distinct.
Specifically, when detection mark 200 is the groove vertically extended as shown in figures 2 or 4, as shown in Figure 7, Figure 8, illumination light L is irradiated along substrate mounting surface faces 110 from horizontal direction.Moreover Fig. 7 represents the example being provided with four pieces of substrates 100 on substrate mounting surface faces 110, Fig. 8 represents the example being provided with one piece of substrate 100 on substrate mounting surface faces 110.
On the other hand, when detecting mark 200 as shown in Figure 3 and being the groove extended in the horizontal direction, preferably illumination light L is irradiated along substrate mounting surface faces 110 from vertical direction.
Judgement image graph picture when Fig. 9 represents that substrate 100 is not arranged on substrate mounting surface faces 110.Detection mark 200 shown in Fig. 9 is the examples being vertically formed with two grooves by substantial middle part in substrate installation region 111 of the slot machining of width 1mm, degree of depth 0.5mm with the interval of 20mm.
The width being formed as the groove detecting mark 200 needs for may correspond to the resolution in filming apparatus 30, more than the width detecting mark 200 detected in judgement image graph picture.That is, width and the degree of depth of setting slot is come with the part of groove and the mode of the contrast distinctness of other parts.On the other hand, with regard to make contrast distinct with regard to, groove is more dark better, but forms groove in the mode of not through substrate sheet material 11.If this is because form through hole on substrate sheet material 11, will the problems such as membrance casting condition changes be produced.
Even if vainly increase the width of groove, due to the restriction of the thickness of substrate sheet material 11, so the low jump of aspect ratio also can only be formed.Therefore, in current embodiment, the depth-set of groove is 0.5mm, and 1mm is set as the width of groove, to make contrast become clear and definite under the described degree of depth.That is, when the degree of depth is the groove of 0.5mm, it is 1mm that the hacures width imagined according to groove depth and groove width reaches maximum width.Described width is the value close with the resolution limit of used filming apparatus 30.
In the judgement image shown in Fig. 9, comprise the image of the installation region part detecting mark 200.On the other hand, in the judgement image shown in Figure 10, due to hide by substrate 100, so not containing detecting the installation region part of mark 200, and only containing the part be configured in non-installation region 112 detecting mark 200.At this moment, substrate 100 normal mounting is on substrate mounting surface faces 110.
Moreover, with regard to make by be formed detect mark 200 and the contrast that produces distinct for, and utilize coating or adhesive tape to be formed to detect compared with mark 200, preferably grooving and form detection mark 200 on substrate mounting surface faces 110.
Judgment means 40 such as, as described belowly utilizes pattern match method, judges whether substrate 100 is arranged on substrate mounting surface faces 110 with normal posture.Below, with reference to Figure 11, while be described the example of the method for testing substrate of embodiments of the present invention.Below, be board-like with regard to substrate carrier 10, filming apparatus 30 carries out illustrative from oblique upper to the situation that substrate mounting surface faces 110 is taken.Moreover, be set on substrate mounting surface faces 110, be configured with the detection mark 200 shown in Fig. 9.
First, in the step S11 of Figure 11, filming apparatus 30 is taken the substrate carrier 10 being provided with substrate 100 on substrate mounting surface faces 110.Thus, such as, as shown in figure 12, the judgement image of the substrate mounting surface faces 110 from oblique upper shooting is obtained.
Secondly, in step s 12, the image processing part 41 of judgment means 40 carries out trapezoidal correction to judgement image.That is, in order to implement following pattern match, by because the image correction of substrate mounting surface faces 110 from oblique upper shooting in trapezoidal shape be observe from face normal direction time rectangular shaped image.Thus, obtaining substrate mounting surface faces 110 is as shown in fig. 13 that the judgement image of rectangular shape.By carrying out trapezoidal correction to carry out the pattern match of rectangle, thus alleviate the time required for calculating, and can matching precision be improved.
Then, the inspection portion 42 of judgment means 40 checks whether in trapezoidal revised judgement image containing the installation region part detecting mark 200.Specifically, in step s 13, the region of inspection area D is comprised from judgement image contract.The extraction region A represented with quadrangle in Figure 14 is extracted region, and Figure 15 represents the figure amplified by extraction region A.Then, in step S14, utilize and extract the image of region A and the reference pattern 210 shown in pre-prepd Figure 16, carry out in order to judge whether the detection mark 200 consistent with reference pattern 210 is contained in the pattern match in judgement image.Reference pattern 210 is the patterns being equivalent to detect mark 200, therefore checks whether in judgement image containing the installation region part detecting mark 200 by pattern match.If there is the pattern identical with reference pattern 210 in extracted image, so ought to the detection mark 200 that hides by substrate 100 just expose.
Secondly, in step S15, the judging part 43 of judgment means 40 utilizes the result of pattern match, and whether normal mounting is on substrate mounting surface faces 110 to judge substrate 100.That is, when the image of the installation region part detecting mark 200 is not contained in judgement image, be judged as that substrate 100 normal mounting is on substrate mounting surface faces 110.On the other hand, when detect mark 200 installation region part a part or or the image of entirety is contained in judgement image time, be judged as that substrate 100 does not have normal mounting on substrate mounting surface faces 110.
By the above, the substrate of completing substrate detection system 1 detects.
When not being arranged on normal position at substrate carrier 10 upper substrate 100, or when substrate 100 is not installed with normal posture, likely produce substrate 100 in the treatment process of substrate 100 to fall from substrate carrier 10, or the undesirable conditions such as normal process cannot be carried out to substrate 100.Figure 17 indicates that substrate 100a is arranged on substrate mounting surface faces 110 with normal posture, and substrate 100b is not arranged on the example on substrate mounting surface faces 110 with normal posture.And, indicate that substrate 100c is not arranged on normal position, and from the example that substrate mounting surface faces 110 comes off.
According to substrate detection system 1, by checking the installation region part detecting mark 200, can detect that the substrate 100b shown in Figure 17 and substrate 100c does not have normal mounting on substrate carrier 10.Therefore, the undesirable condition because substrate 100 does not have normal mounting caused on substrate carrier 10 can be prevented.
In addition, because the area of substrate mounting surface faces 110 is large, so about the width detecting mark 200, the degree of freedom is higher.Due to can the width of enlarged slot, the size of detection mark 200 therefore can be made to be formed as the size matched with low resolution picture.Therefore, on judgement image, high shape S/N ratio is easily maintained.Therefore, do not use the filming apparatus of high-resolution costliness as filming apparatus 30, just can detect substrate 100 accurately.Thus, according to substrate detection system 1, detection perform and economy can be taken into account.
Such as, be the region of about 660mm ~ 680mm to width, take the image of horizontal 640 points × vertical 480.At this moment, each pixel of image and the width 1mm of pod roughly the same.But in order to obtain the image of the groove of contrast distinctness, not only the width of groove is important, and the degree of depth is also important.Therefore, can use can expand the shooting visual field until " the hacures width imagined according to groove depth and groove width " and the pixel analytic ability of resolution " economical " be the filming apparatus 30 of the degree till same degree.Further, about used mark extraction program (algorithm), the performance of described degree is also effective.
As previously discussed, in the substrate detection system 1 of embodiments of the present invention, by checking with or without the image of installation region part detecting mark 200 in judgement image, can high accuracy and detection is limited detect substrate 100 less whether to be arranged on substrate mounting surface faces 110 with normal posture.
Moreover as previously discussed, the resolution of judgement image is low also harmless, so the wide shooting visual field can be set to configure filming apparatus 30.That is, also substrate mounting surface faces 110 can be taken from substrate carrier 10 position relatively far apart.Therefore, at vertically installation base plate 100, and when multiple substrate 100 being configured in side by side board-like substrate carrier 10 on same substrate mounting surface faces 110, substrate detection system 1 is effective especially.
In addition, when be difficult to the position or direction of substrate 100 right opposite on configure lighting device or substrate detecting sensor etc., substrate detection system 1 is also effective.
Moreover when detecting installment state to the multiple substrates 100 be arranged on a substrate mounting surface faces 110 simultaneously, filming apparatus 30 is configured in the position all can taken the inspection area D be configured in each substrate installation region 111.
Substrate detection system 1 shown in Fig. 1 such as can be used for utilizing plasma activated chemical vapour deposition (CVD) method to be formed on solar cell substrate in the operation of anti-reflective film or passivation (passivation) film.That is, the solar cell substrate comprising silicon substrate etc. is arranged on substrate carrier 10 as substrate 100.Further, the substrate carrier 10 being provided with solar cell substrate being moved into before plasma CVD equipment, detecting solar cell substrate by substrate detection system 1 and whether being correctly arranged on substrate carrier 10.When confirming solar cell substrate and being correctly arranged on substrate carrier 10, substrate carrier 10 is moved into plasma CVD equipment.At this moment, substrate sheet material 11 is used as the anode electrode of plasma CVD equipment.
In above-mentioned, describe substrate 100 for solar cell substrate, substrate sheet material 11 is the example of the anode electrode of plasma CVD equipment.But such as substrate carrier 10 also can be the substrate carrier in order to be moved into by substrate 100 to Etaching device or heater.That is, the substrate detection system 1 shown in Fig. 1 can be applicable to installation base plate 100 and is accommodated in the substrate carrier 10 in various manufacturing installation.
Moreover the region of the illumination light L required for illuminated detection substrate 100 is just configured with the inspection area D detecting mark 200.Therefore, the reflection of illumination light L is not vulnerable to the impact of the surface state of substrate carrier 10 or substrate 100, thus easily obtains optical contrast.Therefore, easily the detection mark 200 be configured on substrate mounting surface faces 110 is detected.Further, only shooting inspection area D, therefore can suppress the increase of the number of units of lighting device 20 or filming apparatus 30.In addition, different from reflection-type laser displacement determination method etc., do not need to carry out motion scan to substrate 100 etc., and can Static Detection be carried out.
In the method for testing substrate of substrate detection system 1, as long as can only detection mark 200 be extracted from judgement image.Therefore, the analytic ability of filming apparatus 30 also can lower than the thickness of substrate 100.Such as, when the surface area of such as substrate 100 as semiconductor wafer is large and thickness is thin, also can take extracting the judgement image detecting mark 200.Therefore, when substrate thickness thin substrate 100, also can detect whether substrate 100 is be arranged on substrate mounting surface faces 110 with normal posture.
In above-mentioned, as shown in Fig. 2 and Fig. 9, illustrate and crossed over substrate installation region 111 and non-installation region 112 and the example that configures continuously by detecting mark 200.But, if be only configured in substrate installation region 111 by detection mark 200, then easily judge the presence or absence detecting mark 200.Therefore, if just judge whether substrate 100 is arranged on substrate mounting surface faces 110 with normal posture, then be preferably only configured in substrate installation region 111 by detection mark 200.On the other hand, in order to other purposes, also the groove etc. be formed on substrate mounting surface faces 110 can be used for detecting mark 200.
(other execution mode)
As mentioned above, the present invention is recorded by execution mode, but forms the discussion of a part for described announcement and accompanying drawing should not be construed as limiting the present invention.According to described announcement, those skilled in the art are when knowing various alternate embodiments, embodiment and application technology.
In above-mentioned, disclose the board-like example that substrate carrier 10 is vertically installation base plate 100, but also can apply the present invention to the substrate carrier 10 of other type.Such as, as shown in figure 18, on the substrate mounting surface faces 110 extended in the horizontal direction flatly installation base plate 100 cart type (carttype) substrate carrier 10, also can by checking the presence or absence detecting mark 200 in judgement image, whether normal mounting is on substrate mounting surface faces 110 to detect substrate 100.
Further, grooving on the surface being disclosed in substrate mounting surface faces 110 and form the example detecting mark 200, but also can apply coating on substrate mounting surface faces 110 or tape and formed on the surface of substrate mounting surface faces 110 and detect mark 200.
As mentioned above, the present invention comprises the various execution modes etc. do not recorded certainly here.Therefore, technical scope of the present invention is only determined by the specific item of the invention of appropriate claims according to described explanation.
Industrial utilizability
The present invention may be used for the base plate processing system using substrate carrier.
Claims (14)
1. a substrate detection system, is characterized in that comprising:
Substrate carrier, comprises the substrate mounting surface faces defining the substrate installation region being installed with substrate, is configured with and detects mark in the inspection area at least comprising a part for described substrate installation region of described substrate mounting surface faces;
Filming apparatus, takes the described substrate mounting surface faces being provided with described substrate in the mode comprising described inspection area and obtains judgement image; And
Judgment means, be judged as that described substrate normal mounting is on described substrate mounting surface faces when the described image detecting the part be configured in described substrate installation region of mark is not contained in described judgement image, be judged as that when the image of described part is contained in described judgement image described substrate does not have normal mounting on described substrate mounting surface faces.
2. substrate detection system according to claim 1, is characterized in that: described detection is masked as the groove being formed at described substrate mounting surface faces.
3. substrate detection system according to claim 2, characterized by further comprising: lighting device, from the direction vertical with the direction that described groove extends, illumination light is projected to the described substrate mounting surface faces being provided with described substrate along described substrate mounting surface faces.
4. substrate detection system according to claim 1, is characterized in that: described detection mark is only configured in described substrate installation region.
5. substrate detection system according to claim 1, is characterized in that: configured continuously in the described detection mark described substrate installation region of leap and described non-installation region.
6. substrate detection system according to claim 1, is characterized in that:
Described judgment means comprises:
Image processing part, the image of rectangular shaped when the image correction of the described substrate mounting surface faces of the trapezoidal shape taken from oblique upper is become to observe from face normal direction;
Inspection portion, checks whether in the image of the described substrate installation region of rectangular shape containing described detection mark; And
Judging part, utilizes the check result of described inspection portion, and whether normal mounting is on described substrate mounting surface faces to judge described substrate.
7. substrate detection system according to claim 1, is characterized in that: the upper area of described filming apparatus to described substrate installation region is taken and obtain described judgement image.
8. a method of testing substrate, is characterized in that comprising the steps:
Prepared substrate carrier, described substrate carrier comprises the substrate mounting surface faces defining the substrate installation region being installed with substrate, is configured with and detects mark in the inspection area at least comprising a part for described substrate installation region of described substrate mounting surface faces;
Take with the described substrate mounting surface faces being provided with described substrate of mode to described carrier comprising described inspection area and obtain judgement image;
Check whether the described image detecting the part be configured in described substrate installation region of mark is contained in described judgement image; And
Be judged as that when the image of described part is not contained in described judgement image described substrate normal mounting is on described substrate mounting surface faces, is judged as that when the image of described part is contained in described judgement image described substrate does not have normal mounting on described substrate mounting surface faces.
9. method of testing substrate according to claim 8, is characterized in that: described detection is masked as the groove being formed at described substrate mounting surface faces.
10. method of testing substrate according to claim 9, it is characterized in that: when taking described substrate mounting surface faces, from the direction vertical with the direction that described groove extends along described substrate mounting surface faces, illumination light is projected to the described substrate mounting surface faces being provided with described substrate.
11. method of testing substrate according to claim 8, is characterized in that: described detection mark is only configured in described substrate installation region.
12. method of testing substrate according to claim 8, is characterized in that: configured continuously in the described detection mark described substrate installation region of leap and described non-installation region.
13. method of testing substrate according to claim 8, is characterized in that:
The step of carrying out described inspection comprises as the next stage:
The image of rectangular shaped when the image correction of the described substrate mounting surface faces of the trapezoidal shape taken from oblique upper is become to observe from face normal direction; And
Check whether in the image of the described substrate installation region of rectangular shape containing described detection mark.
14. method of testing substrate according to claim 8, is characterized in that: take the upper area of described substrate installation region and obtain described judgement image.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2013/061489 WO2014170986A1 (en) | 2013-04-18 | 2013-04-18 | Substrate detection system and substrate detection method |
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| CN105122438A true CN105122438A (en) | 2015-12-02 |
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| WO (1) | WO2014170986A1 (en) |
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| KR101836136B1 (en) * | 2016-09-01 | 2018-04-19 | (주)시그마에프에이 | Center of hole position finder unit and inspector with thereof |
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| JP2011061023A (en) * | 2009-09-10 | 2011-03-24 | Kaneka Corp | Substrate holding member and method for manufacturing thin film |
| CN102131351A (en) * | 2010-01-20 | 2011-07-20 | 株式会社日立高新技术 | Processing device or acf adhibition state checking method or substrate module assembly line |
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| JPH0438405A (en) * | 1990-06-04 | 1992-02-07 | Fujitsu Ltd | Method for recognizing transparent member on tray |
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| JP5538291B2 (en) * | 2011-04-13 | 2014-07-02 | パナソニック株式会社 | Plasma processing apparatus and plasma processing method |
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- 2013-04-18 JP JP2015512247A patent/JP5987976B2/en not_active Expired - Fee Related
- 2013-04-18 CN CN201380075577.2A patent/CN105122438A/en active Pending
- 2013-04-18 WO PCT/JP2013/061489 patent/WO2014170986A1/en active Application Filing
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| JP2003332388A (en) * | 2002-05-16 | 2003-11-21 | Matsushita Electric Ind Co Ltd | Positioning device of work and under receiving method of work |
| CN1759478A (en) * | 2003-03-11 | 2006-04-12 | 应用材料有限公司 | Vision system and method for calibrating a wafer carrying robot |
| US20050115830A1 (en) * | 2003-10-15 | 2005-06-02 | Anelva Corporation | Film forming apparatus |
| CN101312137A (en) * | 2007-05-22 | 2008-11-26 | 松下电器产业株式会社 | Electronic component mounting system and electronic component mounting method |
| CN103000553A (en) * | 2007-08-15 | 2013-03-27 | 株式会社尼康 | Alignment apparatus, substrates stacking apparatus, stacked substrates manufacturing apparatus, exposure apparatus and alignment method |
| JP2009054823A (en) * | 2007-08-28 | 2009-03-12 | Panasonic Corp | Component mounting apparatus and component recovering method of component mounting apparatus |
| CN101579967A (en) * | 2008-05-16 | 2009-11-18 | 精工爱普生株式会社 | Printing medium detection system, printing medium detection method, and printing apparatus |
| JP2011061023A (en) * | 2009-09-10 | 2011-03-24 | Kaneka Corp | Substrate holding member and method for manufacturing thin film |
| CN102131351A (en) * | 2010-01-20 | 2011-07-20 | 株式会社日立高新技术 | Processing device or acf adhibition state checking method or substrate module assembly line |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5987976B2 (en) | 2016-09-07 |
| WO2014170986A1 (en) | 2014-10-23 |
| JPWO2014170986A1 (en) | 2017-02-16 |
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