JP5982889B2 - 物理量センサーモジュール及び電子機器 - Google Patents
物理量センサーモジュール及び電子機器 Download PDFInfo
- Publication number
- JP5982889B2 JP5982889B2 JP2012054188A JP2012054188A JP5982889B2 JP 5982889 B2 JP5982889 B2 JP 5982889B2 JP 2012054188 A JP2012054188 A JP 2012054188A JP 2012054188 A JP2012054188 A JP 2012054188A JP 5982889 B2 JP5982889 B2 JP 5982889B2
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- JP
- Japan
- Prior art keywords
- physical quantity
- quantity sensor
- substrate
- sensor module
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
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- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
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- 229910000833 kovar Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012054188A JP5982889B2 (ja) | 2012-03-12 | 2012-03-12 | 物理量センサーモジュール及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012054188A JP5982889B2 (ja) | 2012-03-12 | 2012-03-12 | 物理量センサーモジュール及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013186108A JP2013186108A (ja) | 2013-09-19 |
| JP2013186108A5 JP2013186108A5 (enrdf_load_stackoverflow) | 2015-04-23 |
| JP5982889B2 true JP5982889B2 (ja) | 2016-08-31 |
Family
ID=49387632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012054188A Expired - Fee Related JP5982889B2 (ja) | 2012-03-12 | 2012-03-12 | 物理量センサーモジュール及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5982889B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6378269B2 (ja) * | 2016-05-17 | 2018-08-22 | エーエーシー テクノロジーズ ピーティーイー リミテッドＡａｃ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｐｔｅ．Ｌｔｄ． | 加速度センサー |
| JP6373318B2 (ja) * | 2016-05-17 | 2018-08-15 | エーエーシー テクノロジーズ ピーティーイー リミテッドＡａｃ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｐｔｅ．Ｌｔｄ． | 圧力センサー |
| CN110243343B (zh) | 2018-03-09 | 2022-07-29 | 精工爱普生株式会社 | 传感器模块、倾斜仪以及结构物监视装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0639335Y2 (ja) * | 1988-03-14 | 1994-10-12 | 三菱油化株式会社 | 加速度センサ |
| JPH0943270A (ja) * | 1995-07-26 | 1997-02-14 | Ngk Spark Plug Co Ltd | 圧電型力学量センサ |
| JP2003028892A (ja) * | 2001-07-16 | 2003-01-29 | Matsushita Electric Works Ltd | 加速度センサ |
| JP2007040766A (ja) * | 2005-08-01 | 2007-02-15 | Toyota Motor Corp | センサユニット |
| JP2007127607A (ja) * | 2005-11-07 | 2007-05-24 | Mitsutoyo Corp | センサブロック |
-
2012
- 2012-03-12 JP JP2012054188A patent/JP5982889B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013186108A (ja) | 2013-09-19 |
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