JP5973867B2 - Method for manufacturing multiple chip resistors - Google Patents

Description

  The present invention relates to a method for manufacturing a multiple chip resistor in which a plurality of resistive elements are integrally provided on an insulating base.

  Multiple chip resistors consist of a rectangular parallelepiped-shaped insulating base, a plurality of pairs of electrode portions provided at predetermined intervals along the longitudinal direction of the insulating base, and electrode portions forming each pair. It is mainly composed of a plurality of resistors that bridge and an insulating protective layer that covers each resistor. The insulating base is made of ceramic or the like, and the electrode part is formed by plating the base electrode layer. The base electrode layer includes a front electrode, a back electrode, and an end electrode that bridges both electrodes, and a plurality of pairs of surface electrodes are bridged by resistors on the surface side of the insulating base.

  When manufacturing such a multiple chip resistor, after preparing a large-sized collective substrate made of ceramics and the like, and forming a plurality of pairs of electrodes along the grid-like division lines on the collective substrate, A plurality of resistors over the electrodes paired with the collective substrate, a protective layer covering the plurality of resistors, and the like are collectively formed. Next, the collective substrate is divided into a plurality of strip-shaped substrates along one of the vertical and horizontal dividing lines, and end electrodes connected to a plurality of pairs of electrodes are formed on both end surfaces of each strip-shaped substrate, and then the strips are formed. A plurality of multiple chip resistors are obtained by dividing the substrate along the other dividing line. Since the multiple chip resistor thus obtained is an aggregate of separated resistance elements, the end face electrodes must also be formed in a separated state corresponding to the individual resistance elements. As a method, techniques described in Patent Document 1 and Patent Document 2 are conventionally known.

  In the method of manufacturing a multiple chip resistor described in Patent Document 1, a plurality of strip-shaped substrates are overlapped in the vertical direction, and in this state, the two resistors are formed on both end surfaces of each strip-shaped substrate so that the individual resistors do not conduct with each other. After a plurality of masking tapes are applied, end electrodes are formed on the entire end faces of each strip substrate by roller transfer or sputtering, and then each masking tape is peeled off to form separated end electrodes. I have to. Moreover, in the manufacturing method of the multiple chip resistor described in Patent Document 2, a plurality of strip-shaped substrates are stacked in the vertical direction, and in this state, the entire end faces of each strip-shaped substrate are applied by a roller transfer method or a sputtering method. After the end face electrodes are formed, the end face electrodes positioned between the individual resistors are removed in a strip shape with a laser to form a separated end face electrode.

JP 2003-209007 A JP 2003-209008 A

  By the way, as the miniaturization of the multiple chip resistors is promoted, the arrangement pitch of the resistors on the strip-shaped substrate is narrowed. Therefore, as described in Patent Document 1, the width of the separated end face electrodes and In the method in which the pitch is determined by the masking tape, it is extremely difficult to accurately apply a narrow masking tape to a predetermined position of the strip-shaped substrate. On the other hand, as described in Patent Document 2, the method of removing the end face electrode formed on the entire end face of the strip-like substrate in a strip shape with a laser can cope with the downsizing of the multiple chip resistor. However, there is concern about damage to the strip-shaped substrate due to laser irradiation. In the techniques described in Patent Document 1 and Patent Document 2, when a plurality of strip-shaped substrates are stacked in the vertical direction, the individual resistors formed on the respective strip-shaped substrates are accurately aligned in the vertical direction. Since it has to be aligned, the troublesome work of aligning and aligning the electrode formation positions of the strip-shaped substrates stacked vertically is necessary.

  The present invention has been made in view of the actual situation of the prior art, and an object of the present invention is to provide a method for manufacturing a multiple chip resistor that is suitable for downsizing and can simplify the manufacturing process.

  In order to achieve the above object, in the method of manufacturing a multiple chip resistor according to the present invention, a plurality of rectangular through holes are provided at predetermined intervals along the first and second directions orthogonal to each other. A plurality of electrodes connected to the plurality of pairs of electrodes, and a step of forming a plurality of electrodes between the through holes adjacent to each other along the first direction on one side of the assembly substrate A step of forming a resistor, a step of forming a protective layer so as to cover at least the plurality of resistors, and dividing the collective substrate so as to cross the through holes arranged along the second direction. A step of forming a plurality of strip-shaped substrates whose both ends are uneven, a step of forming an end surface electrode by sputtering over the entire end surface where the concave and convex portions of the strip-shaped substrate are continuous, and After forming, from the strip-shaped substrate Removing the protrusions, it was decided to include a.

  In this way, a large number of through holes are provided in advance in the collective substrate, and after forming a plurality of pairs of electrodes, a plurality of resistors, and a protective layer on the collective substrate, the collective substrate is divided so as to cross the through holes. When these strip-shaped substrates are obtained, both end portions of these strip-shaped substrates are uneven. And after forming the end face electrode by sputtering on the entire end face where the concave and convex portions of the strip-shaped substrate are continuous, when the convex portion is removed from the strip-shaped substrate, only the end face electrodes formed in the concave portion are separated. Remain in. Here, the uneven shape of the strip-shaped substrate is determined by each through hole provided in the collective substrate, and these through holes can be provided with high precision to the collective substrate. Accordingly, even if the arrangement pitch between the individual resistors is narrowed, the end face electrodes connected to each resistor can be accurately formed in a separated state. In addition, since the position accuracy of the separated end face electrodes depends on the concavo-convex shape of each strip-shaped substrate, when the end face electrodes are sputtered by stacking a plurality of strip-shaped substrates in the vertical direction, each strip-shaped substrate is strictly This eliminates the need for alignment, and eliminates the need for troublesome alignment work, thereby simplifying the manufacturing process.

  In such a method for manufacturing a multiple chip resistor, the protective layer only needs to be formed at a position covering at least the plurality of resistors, but the protective layer extends between adjacent through holes along the second direction. When formed so as to be exposed, when the end face electrode is formed by sputtering on the entire concave and convex end face of the strip-shaped substrate, the extended portion of the protective layer prevents spattering, so it is connected to the resistor. This is preferable because it is possible to surely prevent a short circuit between the pair of electrodes.

  In this method of manufacturing a multiple chip resistor, the strip substrate dividing step and the convex removing step may be performed using a dicing method or a laser scribing method. A first dividing groove and a second dividing groove extending in parallel along the direction are provided, and the first dividing groove and the second dividing groove are opposite to each other on the front and back of the collective substrate. If the strip-shaped substrate is divided from the collective substrate along the first division groove and the convex portion is removed from the strip-shaped substrate along the second division groove, the strip substrate is stripped from the collective substrate. When the substrate is divided, it is preferable that the convex portions can be prevented from being broken together.

  In this case, if a minute interval is secured between the straight line along the extending direction of the second divided groove and the end surface along the first direction of the through hole, the strip is broken along the second divided groove. When the convex portion is removed from the substrate, the breaking force does not reach the concave portion, so that it is possible to reliably prevent a defect that the end face electrode is lost due to a crack generated in the concave portion.

  In the method of manufacturing a multiple chip resistor according to the present invention, a plurality of pairs of electrodes, a plurality of resistors, a protective layer, and the like are formed on an aggregate substrate having a large number of through holes, and then divided so as to cross the through holes. Thus, when a plurality of strip-shaped substrates are obtained, both end portions of these strip-shaped substrates have a concavo-convex shape in which a concave portion and a convex portion are continuous. Then, after forming the end face electrode on the entire end face of such a strip-shaped substrate by sputtering, if the convex portion is removed from the strip-shaped substrate, only the end face electrode formed in the concave portion remains in a separated state. Even if the arrangement pitch between the individual resistors is reduced as the series chip resistors are reduced in size, the end face electrodes connected to the resistors can be formed with high accuracy in a separated state. In addition, since the position accuracy of the separated end face electrodes depends on the concavo-convex shape of each strip-shaped substrate, when the end face electrodes are sputtered by stacking a plurality of strip-shaped substrates in the vertical direction, each strip-shaped substrate is strictly This eliminates the need for alignment, and eliminates the need for troublesome alignment work, thereby simplifying the manufacturing process.

It is a top view of the multiple chip resistor concerning the example of an embodiment of the present invention. It is sectional drawing which follows the II line | wire of FIG. It is sectional drawing which follows the II-II line of FIG. It is sectional drawing which follows the III-III line of FIG. FIG. 2 is a plan view of a collective substrate used in the manufacturing process of the multiple chip resistor shown in FIG. 1. It is sectional drawing which follows the IV-IV line of FIG. It is process drawing of planar view which shows the state in which the surface electrode was formed in the aggregate substrate. It is process drawing of planar view which shows the state which formed the resistor in the aggregate substrate. It is process drawing of planar view which shows the state which formed the undercoat in the aggregate substrate. It is process drawing of planar view which shows the state which formed the trimming groove | channel in the resistor. It is process drawing of planar view which shows the state which formed the overcoat in the aggregate substrate. It is process drawing of planar view which shows the state which divided | segmented the assembly board | substrate into the strip-shaped board | substrate primarily. It is process drawing of planar view which shows the state which formed the end surface electrode in the strip-shaped board | substrate. It is process drawing of planar view which shows the state which removed the dummy part from the strip-shaped board | substrate. It is process drawing of planar view which shows the state which carried out the secondary division | segmentation of the strip-shaped board | substrate into each multiple chip resistor. It is process drawing of planar view which shows the modification of the overcoat formed in the aggregate substrate. It is process drawing of planar view which shows the modification of the overcoat formed in the aggregate substrate.

  Embodiments of the present invention will be described below with reference to the drawings. First, the configuration of the multiple chip resistor 1 according to the embodiment of the present invention will be described based on FIGS. 1 to 4. The multiple chip resistor 1 includes a rectangular parallelepiped insulating base 2 and an insulating base 2. A plurality of pairs of surface electrodes 3 provided at both ends in the short direction (left and right direction in FIG. 1) on the upper surface of the insulating base 2, and provided at both ends in the short direction on the lower surface of the insulating base 2. A plurality of pairs of back electrodes 4, a plurality of pairs of end surface electrodes 5 provided on the side surface of the insulating base 2 to bridge the electrodes 3, 4, and a pair of electrodes provided on the upper surface of the insulating base 2 A plurality of resistors 6 bridging the surface electrodes 3, an undercoat 7 that individually covers each resistor 6, an overcoat 8 that covers each undercoat 7, and each surface electrode 3 It is mainly comprised by the plating layer 9 which coat | covers the back surface electrode 4 and the end surface electrode 5. FIG. FIG. 1 shows a quadruple-type multiple chip resistor 1, in which four resistive elements including four resistors 6 are integrally provided on an insulating base 2 in a separated state.

  The insulating base 2 is made of ceramic or the like. The insulating base 2 is divided into pieces by dividing the collective substrate 10 shown in FIGS. 5 to 11 along the first to third dividing grooves 11, 12, and 13. It has been

  A plurality of pairs of the surface electrode 3, the end surface electrode 5, and the back surface electrode 4 are formed at predetermined intervals at both ends of the insulating base 2 as a base electrode layer continuous in a U-shape. A plating layer 9 is deposited on the electrode layer to form an electrode portion of the multiple chip resistor 1. The plating layer 9 has a laminated structure of two or more layers including an innermost nickel (Ni) plating layer in close contact with the base electrode layer and an outermost tin (Sn) plating layer exposed on the outer surface. Yes.

  The resistor 6 is made of ruthenium oxide or the like, and a trimming groove 15 (see FIG. 10) is formed in the resistor 6 in order to adjust the resistance value. The undercoat 7 is an insulating layer made of glass or the like, and the overcoat 8 is an insulating layer made of epoxy resin or the like. The undercoat 7 and the overcoat 8 constitute a protective layer having a two-layer structure, and the lower undercoat 7 is formed so as to cover the resistor 6 before the trimming groove 15 is formed. On the other hand, the upper overcoat 8 is formed after the trimming groove 15 is formed in the resistor 6, and the overcoat 8 covers the undercoat 7, the resistor 6, the trimming groove 15, and the like. .

  Next, a manufacturing method of the multiple chip resistor 1 configured as described above will be described with reference to FIGS.

  First, as shown in FIG. 5, a collective substrate 10 provided with a large number of rectangular through holes 14 is prepared. Here, XY coordinates orthogonal to FIG. 5 are set, and when the X direction (left-right direction) is referred to as a first direction and the Y direction (up-down direction) is referred to as a second direction, each through hole 14 is They are arranged in a lattice pattern along the first direction and the second direction. Specifically, the through holes 14 are continuously arranged in the first direction with a predetermined interval P1, and continuously arranged in the second direction with an interval P2 smaller than the interval P1. Yes. In FIG. 5, eight through holes 14 are provided along the second direction, and this is regarded as one row, three rows along the first direction, and a total of 24 (8 × 3 = 24 pieces). ) Is drawn, but in reality, more through holes 14 are provided in the collective substrate 10.

  The collective substrate 10 is formed with first to third divided grooves 11, 12, 13 having a V-shaped cross section, of which the first divided groove 11 and the second divided groove 12 extend in the second direction, The third dividing groove 13 extends in the first direction. The first divided grooves 11 extend so as to cross the middle of the through holes 14 arranged along the second direction, and the first divided grooves 11 face the both surfaces of the collective substrate 10 with the groove bottoms facing each other. It is formed to do. The second divided groove 12 extends slightly across the short side end face (5 μm to 50 μm) of each through hole 14 arranged along the second direction, and the second divided groove 12 and the through hole A very small interval is secured between the 14 short sides (end face along the first direction). The second divided grooves 12 are also formed on the front and back surfaces of the collective substrate 10 so that the groove bottoms face each other. Is set to have the opposite relationship. In the case of this embodiment, since the aggregate substrate 10 having a thickness of 200 μm is used, the first dividing groove 11 has a front side depth of 50 μm and a back side depth of 30 μm, as shown in FIG. The two-divided groove 12 has a front side depth of 30 μm and a back side depth of 50 μm.

  The third divided grooves 13 extend in the first direction in the middle of the through holes 14 arranged along the second direction, and the third divided grooves 13 are also formed on the front and back surfaces of the collective substrate 10 with the groove bottoms of each other. Are formed to face each other. The first dividing groove 11 and the second dividing groove 12 described above are formed with respect to the through holes 14 of all the rows adjacent along the first direction, but the third dividing groove 13 is formed in the second direction. A plurality of continuous through-holes 14 are formed as one unit, and in the case of the quadruple-type multiple chip resistor 1 according to this embodiment, between the pair of third divided grooves 13 Four through holes 14 are provided in the sandwiched region. The through hole 14 and the first to third divided grooves 11, 12, 13 are all processed in the state of a ceramic green sheet before firing, and the ceramic green sheet has a large number of through holes and V-shapes. After forming the shape-divided grooves using a mold, the aggregate substrate 10 as shown in FIG. 5 is obtained by firing the divided grooves.

  Next, a silver paste is screen-printed between the adjacent through holes 14 along the first direction on the upper surface of the collective substrate 10 and baked, as shown in FIG. 7, along the first direction. A plurality of pairs of surface electrodes 3 are formed between adjacent through holes 14. Although not shown, a plurality of pairs of back surface electrodes 4 are formed between the through holes 14 adjacent in the first direction by performing the same process on the back surface of the collective substrate 10. At that time, it is preferable to print the silver paste slightly apart from the corresponding through-holes 14 because it is possible to prevent the silver paste from flowing into the through-holes 14 even if some printing deviation occurs. Note that the first to third dividing grooves 11, 12, and 13 are not shown in FIGS. 7 to 10 in order to simplify the drawings for easy understanding.

  Next, the ruthenium oxide resistor paste is screen-printed and baked so as to straddle the paired surface electrodes 3 so that both ends in the longitudinal direction are overlapped with the surface electrodes 3 as shown in FIG. A plurality of combined resistors 6 are formed at once.

  Next, an undercoat 7 is formed on each resistor 6 as shown in FIG. 9 by screen-printing and baking a glass paste in a region covering each resistor 6 individually. This undercoat 7 is for preventing the vicinity of the trimming groove 15 of the resistor 6 from being damaged by the heat of the laser beam irradiated in the next step.

  That is, in the next step, in order to adjust the resistance value of each resistor 6, as shown in FIG. 10, a number of resistors 6 covered with the undercoat 7 are sequentially irradiated with a laser beam. A trimming groove 15 is formed. At that time, probes not shown are brought into contact with the surface electrodes 3 existing on both sides in the longitudinal direction of the resistor 6 to be trimmed, and laser trimming is performed while measuring the resistance value through these probes. When the laser beam irradiation is started and the trimming groove 15 becomes longer, the resistance value increases accordingly. Therefore, the laser beam irradiation is performed when the resistance value of the resistor 6 to be trimmed reaches a desired value. Turn off.

  Next, an epoxy resin paste is screen-printed on the regions covering the respective undercoats 7, the resistors 6, and the trimming grooves 15, and cured by heating, as shown in FIG. 11, along the second direction. An overcoat 8 is formed extending in the direction. The overcoat 8 is for protecting the resistor 6 from the external environment.

  The process so far is a batch process for the collective substrate 10. In the next process, the collective substrate 10 is primarily divided into strips along the first division grooves 11 (primary breaking process), so that FIG. As shown, a plurality of strip-shaped substrates 16 are obtained from the collective substrate 10. Here, since the 1st division groove 11 is extended so that the middle of each through-hole 14 arranged along the 2nd direction, it is a strip-like board obtained by breaking along the 1st division groove 11 Both end portions along the longitudinal direction of 16 are not flat and have a concave-convex shape in which concave portions 16a and convex portions 16b are alternately continued. The primary breaking process is performed by extending the front side of the collective substrate 10 and applying a bending stress in the direction. The bending stress causes the first divided groove 11 to have a groove opening on the surface side having a large groove depth. Break to be opened. At that time, the same bending stress acts on the second divided groove 12 provided in parallel in the vicinity of the first divided groove 11, but as shown in FIG. 6, the first divided groove 11 and the second divided groove 12. Are set so that the groove depths are opposite to each other on the front and back of the collective substrate 10, and the second divided grooves 12 have a groove depth on the front surface side smaller than that of the back surface. It is possible to prevent the second divided grooves 12 from being accidentally broken together during the break.

  Next, after stacking a plurality of strip-shaped substrates 16 in the vertical direction, Ni / Cr is sputtered over the entire end surface of each strip-shaped substrate 16 in this state, thereby forming the strip-shaped substrates 16 as shown in FIG. The end face electrode 17 is formed on the entire end face of the concavo-convex shape.

  Next, by breaking the strip-shaped substrate 16 along the second dividing grooves 12, as shown in FIG. 14, the convex portions 16b that are dummy portions are removed from the strip-shaped substrate 16, and then the convex portions 16b are removed. The strip-shaped substrate 16 thus formed is secondarily divided (secondary break processing) along the third dividing groove 13. As a result, as shown in FIG. 15, a piece 18 (chip alone) having the same size as the multiple chip resistor 1 is obtained. The single chip 18 thus separated has a plurality of pairs of end surface electrodes 5 separated for each recess 16a on both end surfaces in the short direction of the insulating base 2, and each end surface electrode 5 and the surface electrode 3 are separated from each other. Since the back electrode 4 is bridged, a plurality of pairs of base electrode layers continuous in a U-shape are obtained.

  Finally, by applying Ni plating and Sn plating to the base electrode layer (front electrode 3, back electrode 4 and end electrode 5) of each chip 18 to form a plurality of two-layered plating layers 7, A multiple chip resistor 1 as shown in FIGS. 1 to 4 is completed.

  As described above, in the method for manufacturing the multiple chip resistor 1 according to this embodiment, the collective substrate 10 provided with a large number of rectangular through holes 14 is prepared, and a plurality of pairs are provided on the collective substrate 10. After forming electrodes (front surface electrode 3 and back surface electrode 4), a plurality of resistors 6, protective layers (undercoat 7 and overcoat 8), etc., both ends are formed by primary division across the through hole 14 A plurality of strip-shaped substrates 16 having a concavo-convex shape can be obtained. And after forming the end surface electrode 17 by sputtering method in the whole end surface where the recessed part 16a and the convex part 16b of such a strip-shaped board | substrate 16 continue, when the convex part 16b which is a dummy part is removed from the strip-shaped board | substrate 16, Since only the end face electrode 17 formed in the recess 16a remains in a separated state, even if the arrangement pitch between the individual resistors 6 is reduced as the multiple chip resistor 1 is reduced in size, each resistor 6 The end face electrode 5 connected to the can be formed with high accuracy in a separated state. Further, the positional accuracy of the end face electrode 5 depends on the uneven shape (concave portion 16a and convex portion 16b) of the strip-shaped substrate 16 subjected to the primary break, and the uneven shape of each through-hole 14 formed in the aggregate substrate 10 in advance. Since it depends on the size and the formation position, when the end face electrodes are sputtered by stacking a plurality of strip-shaped substrates 16 in the vertical direction, it is not necessary to strictly align the respective strip-shaped substrates 16, and troublesome alignment work is performed. It becomes unnecessary and can simplify a manufacturing process.

  In the present embodiment, first to third dividing grooves 11, 12, and 13 having a V-shaped cross section are formed in the collective substrate 10 in advance, and primary division (primary division) is performed along the first dividing groove 11. (Break process), the dummy portion is removed along the second divided groove 12 and the secondary division (primary break process) is performed along the third divided groove 13. Of the first divided grooves 11 and the second divided grooves 12 that extend in the second direction in the proximity state, the first divided grooves 11 cross the middle of the through holes 14 arranged along the second direction. However, since the first divided grooves 11 and the second divided grooves 12 are set so that the groove depths are opposite to each other on the front and back of the collective substrate 10, the first divided grooves 11 and the second divided grooves 12 extend along the first divided grooves 11. Thus, when the strip-shaped substrate 16 is subjected to the primary break, the second divided grooves 12 can be prevented from being accidentally broken together.

  In addition, since a minute interval is secured between the straight line along the extending direction of the second divided groove 12 and the short side (end surface along the first direction) of the through hole 14, the second divided groove 12 extends along the second divided groove 12. When the protrusion 16b (dummy part) is removed from the strip-shaped substrate 16 by breaking, the breaking force does not reach the recess 16a on the short side of the through hole 14, but is caused by a crack generated in the recess 16a. Thus, it is possible to prevent a defect that the end face electrode 5 is lost.

  However, the primary division, the secondary division, and the removal process of the dummy portion can be performed using a dicing method or a laser scribing method. In this case, the first to third division grooves 11, 12, and 13 are formed. Prepare an unassembled aggregate substrate, form multiple pairs of electrodes, resistors, protective layers, etc. on the aggregate substrate, then rotate the blade and cut it, or irradiate a laser to scribe lines. The primary division, the removal of the dummy portion, and the secondary division may be performed by a laser scribing method of forming. Alternatively, the breaking process using the dividing grooves, the dicing method, and the laser scribing method, such that the primary dividing process and the dummy portion removing process are performed by the breaking process using the dividing grooves, and the secondary dividing process is performed using the dicing method or the laser scribing method. Can be combined as appropriate.

  In this embodiment, the overcoat 8 extending in a strip shape after the trimming adjustment of the resistor 6 is formed so as to cover the undercoat 7, the resistor 6, and the trimming groove 15. As shown in FIG. 5, the overcoat 8 is integrally protruded between the adjacent through holes 14 along the second direction so as to form the overcoat 8 having comb-shaped sides. Anyway. Alternatively, as shown in FIG. 17, after forming an overcoat 8 extending in a strip shape after trimming adjustment of the resistor 6, a paste made of a water-soluble epoxy resin is screen-printed (masking printing) and dried (of the end face electrode 17. A plurality of extending portions 8b extending in the first direction may be formed in the overcoat 8 by washing with water after the formation). When the overcoat 8 has the extended portions 8a and 8b protruding between the through holes 14 as described above, the end surface electrode 17 is formed on the entire concave and convex end surface of the strip-shaped substrate 16 by a sputtering method in a subsequent process. Since the sputter wraparound is prevented by the extending portions 8a and 8b of the overcoat 8, a short circuit between the surface electrodes 3 connected to the resistor 6 can be reliably prevented.

DESCRIPTION OF SYMBOLS 1 Multiple chip resistor 2 Insulation base 3 Front surface electrode 4 Back surface electrode 5 End surface electrode 6 Resistor 7 Undercoat (protective layer)
8 Overcoat (protective layer)
8a, 8b Extension part 9 Plating layer 10 Collective substrate 11 1st division groove 12 2nd division groove 13 3rd division groove 14 Through hole 15 Trimming groove 16 Strip-like substrate 16a Concave part 16b Protrusion part 17 End face electrode 18 Single chip

Claims (4)

A collective substrate is prepared in which a plurality of rectangular through holes are provided at predetermined intervals along first and second directions orthogonal to each other, and one side of the collective substrate is provided along the first direction. Forming a plurality of pairs of electrodes between the adjacent through holes;
Forming a plurality of resistors connected to the plurality of pairs of electrodes;
Forming a protective layer so as to cover at least the plurality of resistors;
Dividing the collective substrate so as to cross the through-holes arranged along the second direction to form a plurality of strip-shaped substrates having irregularities at both ends;
Forming an end face electrode by sputtering over the entire end face where the concave and convex portions of the strip substrate are continuous;
Removing the protrusions from the strip substrate after forming the end face electrodes;
The manufacturing method of the multiple chip resistor characterized by including this.   2. The method of manufacturing a multiple chip resistor according to claim 1, wherein the protective layer extends between the adjacent through holes along the second direction.   The first divided groove and the second divided groove extending in parallel along the second direction are provided on the collective substrate according to claim 1 or 2, and the first divided groove and the second divided groove are provided. The grooves are set so that the groove depths are opposite to each other on the front and back of the collective substrate, the strip substrate is divided from the collective substrate along the first divided grooves, and the convex portions are A method of manufacturing a multiple chip resistor, wherein the chip resistor is removed from the strip substrate along the second dividing groove.   4. The multiple space according to claim 3, wherein a minute interval is secured between a straight line along the extending direction of the second dividing groove and an end surface of the through hole along the first direction. Manufacturing method of chip resistor.