JP5971902B2 - Work holding device and three-dimensional shape measuring device provided with the work holding device - Google Patents

Description

  The present invention relates to a work holding device capable of holding a high-precision optical element such as a projection lens of a semiconductor exposure apparatus, and a three-dimensional shape measuring apparatus including the work holding device.

  A semiconductor exposure apparatus (stepper) reduces a circuit pattern by a projection lens, and performs projection exposure while moving on a wafer. It is known that this projection lens is composed of, for example, a large lens made of an aspheric surface, and the shape accuracy is required to be about 1 nm to 0.1 nm.

  High-precision optical elements represented by projection lenses and mirrors used in the above stepper have a very high required shape accuracy, so when processed by a smooth polishing device or the like, a three-dimensional shape measuring device Is processed while measuring the shape.

  In general, as such a three-dimensional shape measuring apparatus for measuring the shape of an optical element with high accuracy, the shape is measured by scanning the surface of a workpiece with a probe (spindle 16) as described in Patent Document 1. Things are widely known.

  In the case of a large lens such as the projection lens described above, the size may exceed the measurement range of the probe. For this reason, in the three-dimensional shape measuring apparatus described in Patent Document 1, the table 103 on which the workpiece is placed is configured to be rotatable by the rotation mechanism 165, and the workpiece can be scanned for each predetermined range.

  By the way, it is necessary to measure the shape of a high-precision optical element such as a projection lens in units of nanometers as described above, and accurate measurement cannot be performed even if there is a minute shift at the time of measurement.

Here, the three-dimensional shape measuring apparatus described in Patent Document 1 is configured such that the table 103 is always supported by the support base 154 in a rotatable state. Therefore, there is a problem that the table 103 is easy to move during measurement.

  On the other hand, as described in Patent Document 2, as the table (rotating table 101) on which the work is placed, the table 101 is lifted by air from the air pressure source 113, and after the table 101 is lifted, the rotation index is calculated. What to do is devised.

JP 59-65702 A Japanese Patent Laid-Open No. 11-304460

  When rotating the table 101 as in the apparatus described in Patent Document 2, if the table is lifted by air, the load generated on the rotating mechanism can be reduced. Further, during the measurement, the supply of air is stopped and the table 101 is seated on the base 103, so that the table 101 is less likely to move.

  However, the apparatus of Patent Document 2 floats or sits on the table 101 by turning air on and off. Therefore, it is difficult to stably seat the table 101, and an impact occurs when seated. If the table 101 cannot be seated stably and slowly, the optical element that requires nano-order shape accuracy may be deformed by an impact during seating. Further, there is a possibility that the rotating mechanism that rotates the table during the sitting is deformed.

  Therefore, an object of the present invention is to provide a workpiece holding device that can hold a precise workpiece and a three-dimensional shape measuring device using the workpiece holding device.

The present invention relates to a rotary yatoe having a holding surface for holding a workpiece, a back surface opposite to the holding surface, and a plurality of rotary yatoy receiving portions that protrude toward the back surface of the rotating yatoy and point-support the back surface of the rotating yatoy It includes a base member as a fixed member having a rear and detachably supporting portion of the front Symbol rotating lens holder unit, lifting unit for raising and lowering the support portion, and a rotary elevating mechanism having a rotating unit for rotating the support part The base member is formed with a hole through which the support portion of the rotary lifting mechanism passes from the lower side to the upper side of the base member in order to support the back surface of the rotary yatoi. The rotating portion that is raised by the elevating portion and supported by the support portion that is in contact with the back surface while being floated from the base member, and that can be rotated by the rotating portion. If, apart from the back is not the support portion is lowered by the elevating unit, and a seating position for seating the rotating lens holder unit to the base member, the lift is driven, in the work holding device, characterized in that.

  According to this invention, it has a support part which can be contacted / separated with the back surface of the rotation yatoy holding a workpiece | work, and a raising / lowering part which raises / lowers this support part. When rotating the rotary yatoe, the support portion is raised and brought into contact with the back surface of the rotary yatoi so that the rotary yatoi is floated from the base member. Further, when measuring the shape of the workpiece, the support portion is lowered and separated from the back surface of the rotating yatoy, and the rotating yatoe is seated on the base member. As described above, since the rotary yato is raised and lowered by the support member that directly contacts the back surface, the rotary yato can be raised and lowered stably, and even a work such as a high-precision optical element is held without being deformed. be able to. In addition, since the rotating yatoy is rotated while floating from the base member, it is possible to reduce the load on the rotating portion.

The schematic diagram which shows the three-dimensional shape measuring apparatus which concerns on the 1st Embodiment of this invention. The side view which shows the three-dimensional shape measuring apparatus which concerns on the 1st Embodiment of this invention. It is a schematic diagram which shows the workpiece holding apparatus which concerns on the 1st Embodiment of this invention, Comprising: (a) is a figure which shows a seating position, (b) is a figure which shows a rotation position. (A) The workpiece holding device of the state which removed the rotation yatoe, (b) The schematic diagram which shows the back surface of a rotation yatoi. The schematic diagram which shows the relationship between the workpiece | work and the scanning range of a probe. Process drawing which shows the procedure at the time of measuring a large sized workpiece | work. It is a schematic diagram which shows the workpiece holding apparatus which concerns on the 2nd Embodiment of this invention, Comprising: (a) is a figure which shows a seating position, (b) is a figure which shows a rotation position.

[First Embodiment]
[Schematic configuration of measuring device]
Hereinafter, based on the drawings, a three-dimensional shape measuring apparatus 1 and a work holding apparatus 3 according to an embodiment of the present invention will be described. In the following description, “Yato” is used to mean a holding tool (for example, a table) that holds a holding target.

  First, the configuration of the three-dimensional shape measuring apparatus 1 will be described based on FIG. 1 and FIG. As shown in FIGS. 1 and 2, the three-dimensional shape measuring apparatus 1 is a three-dimensional shape measuring apparatus that scans the surface of a workpiece W with a probe P and measures the shape thereof. The workpiece holding device 3 and the control unit 4 are provided.

  The measuring unit 2 includes a surface plate 21 in which the work holding device 3 is incorporated at the center thereof, and a stage base 22 connected to the surface plate 21. A probe P holds a workpiece on the stage base 22 via a Y-axis stage 23Y movable in the Y-axis direction, an X-axis stage 23X movable in the X-axis direction, and a Z-axis stage 23Z movable in the Z-axis direction. It is supported so as to face the device 3.

  The probe P is composed of a contact-type probe, and can contact the surface of the workpiece W with a constant pressure. Specifically, the probe shaft is held by a leaf spring, the amount of deflection of the leaf spring is measured with a displacement meter or the like, and the amount of deflection is controlled to be constant.

  In addition, a gate-shaped mirror frame 24 is provided on the surface plate 21 so as to straddle the probe P and the work holding device 3. A Z reference mirror 25Z and a Y reference mirror 25Y are attached to the mirror frame 24 at positions orthogonal to each other. An X reference mirror 25X is attached at a position orthogonal to each of the Z reference mirror 25Z and the Y reference mirror 25Y.

  Further, as shown in FIG. 2, the probe P is attached with a laser measuring Z-axis interferometer 26Z, a laser measuring X-axis interferometer 26X, and a laser measuring Y-axis interferometer (not shown). Yes. The laser measuring Z-axis interferometer 26Z is an interferometer that measures the distance from the Z reference mirror 25Z. The laser measuring X-axis interferometer 26X is an interferometer that measures the distance from the X reference mirror 25X. The laser measuring Y-axis interferometer is a laser measuring Y-axis interferometer that measures the distance from the Y reference mirror 25Y.

  Further, another interferometer for laser length measurement (not shown) is attached to the probe P in the height direction, and the stage in the Y-axis direction and the X-axis direction is measured by measuring the difference between the upper and lower two interferometers. The pitching amount is measured.

  As described above, the measurement unit 2 detects the position of the probe P using the laser measurement interferometers 26X and 26Z for the X, Y, and Z axes. Then, based on a command from the control unit 4, the stages 23 X, 23 Y, and 23 Z of the X, Y, and Z axes are moved, and the surface of the workpiece W is scanned by the probe P.

  The control unit 4 includes an electrical unit 41, a control computer 42, and a data processing computer 43. The electrical unit 41 is loaded with various drivers, for example, a drive motor driver for the moving stages 23X, 23Y, and 23Z, and a driver for the rotation motor 35b of the work holding device 3 described later in detail.

  In addition, the electrical unit 41 is equipped with a pressure control unit that controls the Z-axis stage 23Z so as to keep the contact pressure between the contact probe P and the workpiece W constant. While the probe P and the workpiece W are in contact, the Z-axis stage 23Z is driven by this pressure control unit instead of the Z-axis stage driver.

  Furthermore, the electrical unit 41 is equipped with a length measurement board for taking in a length measurement signal from the laser length measurement light source and the laser length measurement interferometers 26X and 26Z.

  On the other hand, the control computer 42 is a computer that outputs various signals to the electrical unit 41 and receives signals from the electrical unit 41. The control computer 42 is loaded (stored) with a program for controlling various drivers mounted on the electrical unit 41.

  Further, the control computer 42 is equipped with a length measurement data capturing program that samples a length measurement signal from each laser length measurement interferometer via the electrical unit 41 and converts it into length measurement data.

  The data processing computer 43 is a computer that manages measurement condition parameters, and the measurement conditions to be managed include a measurement range, the number of measurements, a measurement speed, a measurement type, a design value shape of the object to be measured, and the like. . Specifically, the data processing computer 43 includes a measurement program, a data capture program, a shape data calculation program, an error calculation program, a shape position calculation program, and a stitching program.

  The measurement program is a measurement program that processes measurement condition parameters to obtain measurement procedure data and sends the measurement procedure parameters to the control computer 42 together with the measurement condition parameters. The data acquisition program is a program for acquiring measurement data from each laser measurement interferometer via the control computer 42. The shape data calculation program is a program for calculating the surface shape of the workpiece W from the acquired laser measurement data. The error calculation program is a program for calculating an error from the measured design value of the workpiece W from the calculated shape data of the workpiece W and the design value shape of the workpiece W. The shape position calculation program is a program for calculating, from the shape data of the workpiece W, a three-dimensional position where the workpiece W is placed with respect to the origin and coordinates of the apparatus or an arbitrary origin and coordinates. The splicing program is a program for calculating the entire shape of the workpiece W from the calculated shape data of a plurality of portions of the workpiece W.

[Detailed configuration of work holding device]
Next, the configuration of the workpiece holding device 3 described above will be described in detail based on FIGS. 3 and 4 with reference to FIGS. 1 and 2. As shown in FIG. 3, the work holding device 3 includes a base member 32 supported by the surface plate 21, a rotary yatoe 31 that is seated on the base member 32 and on which the work W is placed, and the base member 32. And a rotary elevating mechanism 33 disposed below.

  The rotary yatoe 31 is a work-only yatoy on which the work W is placed, and is composed of a circular plate-like member having a holding surface 31F that holds the work W and a back surface 31R opposite to the holding surface. Yes.

  The base member 32 is a general-purpose yatoi made of a plate-like member supported by the surface plate 21, and has a rotary gotoy receiving portion 32 a for seating the back surface 31 </ b> R of the rotary yatoe 31. The rotary yatoe 31 is positioned on the surface plate 21 by being seated on the seating member of the base member 32, and the workpiece W can be measured.

  Further, a hole 32 h is formed in the center of the base member 32 for connecting a support portion 34 of a rotary lifting mechanism 33 (described later) to the back surface 31 </ b> R of the rotary Yato 31.

  The rotation elevating mechanism 33 is a device that rotates the rotary Yatoi 31 in a state of floating from the base member 32, and includes a support portion 34 that can be brought into contact with and separated from the back surface 31R of the rotary Yatoi 31, an elevating portion 36 that raises and lowers the support portion 34, A rotating part 35 that rotates the support part 34 is provided.

  The elevating part 36 has four leg parts 36b, an elevating stage 36a that elevates while being supported between the plurality of leg parts 36b, and a linear actuator 36c that elevates and lowers the elevating stage 36a. Yes. The linear actuator 36c is incorporated in the elevating stage 36a and includes an air cylinder, a linear motor, and the like.

  The rotating portion 35 includes a rotating motor 35b attached on the lifting stage 36a and a rotating member 35a attached to the upper portion of the rotating motor 35b and rotating.

  The support portion 34 is a protruding member that protrudes from the upper surface of the rotating member 35 a toward the rotating Yatoi 31, and has a protruding shape in which a tip portion that contacts the rear surface 31 </ b> R of the rotating Yatoi 31 has a predetermined curvature. That is, the support portion 34 has a shape that makes point contact with the back surface 31 </ b> R of the rotary yato 31.

The rotary yatoe 31, the base member 32, and the rotary member 35a described above are arranged so that the centers C thereof coincide with each other, and the rotary member 35a is formed so that its diameter is smaller than the hole 32h of the base member 32. Yes. Therefore, the rotation raising / lowering mechanism 33 is driven _up and down to the rotation position P _up (position of FIG. 3B) and the seating position P _S (position of FIG. 3A). The rotation position P _up is supported by the support unit 34 that is raised by the elevating unit 35 and is in contact with the back surface 31 </ b> R of the rotary unit 31 while the rotary unit 31 is floated from the base member 32. It is a position that can be rotated. Sitting position P _s is, the support portion 34 is lowered by the elevating unit 35 away from the rear 31R of the rotary lens holder unit 31 is a position for seating the rotating lens holder unit 31 to the base member 32.

  Next, the contact relationship between the base member 32 and the rotary elevating mechanism 33 and the rotary yatoe 31 will be described in detail with reference to FIG. 4A is a plan view showing a state in which the rotary Yato 31 has been removed from the work holding device 3, and FIG. 4B is a schematic view showing the back surface of the rotary Yato 31.

As shown in FIG. 4 (a), the supporting portion 34 in contact with the rear surface 31R of the rotary lens holder unit 31, the rotation member 35a from the center _{C 1} of the (first) predetermined distance _{r 1,} 3 one on is released circles The rotary yatoe 31 is supported at three points by these three support portions 34.

Also, it is rotated lens holder unit receiving portion 32a from the center C ₁ of the support member 35a (second) predetermined distance r _2, three on is released circles disposed to the rear 31R of the rotary lens holder unit 31 is seated in the same manner (R ₂ > r ₁ ). The rotary yatoe 31 is supported at three points by these three rotary yatoee receiving portions 32a. Further, the rotary Yatoi receiving portion 32 a has a protruding shape having a predetermined curvature at the tip portion, and supports the rotary Yatoi 31 in the same manner as the support portion 34.

That is, the support portion 34 and the rotary yatoy receiving portion 32a are positioned so as to have the center of gravity at the approximate center of three points with respect to the workpiece W and the rotary yatoe 31 (in this embodiment, the centers C ₁ , C ₂ , C ₃ Are arranged to match). In other words, if the workpiece W and the rotary Yato 31 have a substantially rotationally symmetric shape, the support portion 34 and the rotary Yatoi receiving portion 32a are arranged at a substantially equilateral triangular position.

  On the other hand, as shown in FIG. 4B, the back surface 31 </ b> R of the rotary yato 31 that comes into contact with the support portion 34 and the rotary goat receiving portion 32 a has a support region 31 a that can receive an instruction from the support portion 34. Moreover, it has the seating area | region 31b in which the rotation yatoy receiving part 32a can be seated, and the back surface 31c other than these support area | regions and seating area | regions.

The support area 31a, the rotation of the rotary member 35a center _{C 1} (center _{C 2} of the present embodiment mainly _{C 1} is rotating lens holder unit 31 matches) centered at (first) ring-shaped having a predetermined width _{W 1} The center C ₃₄ of the support portion ₃₄ is positioned at the center of the width W ₁ .

Further, the seating region 31b is the rotational center _{C 1} of the rotary member 35a as a center (second) has a ring shape having a predetermined width _{W 2,} rotating lens holder unit receiving portion 32a in the middle of the width _{W 2} The center _C32 is located.

  Further, the support region 31a and the seating region 31b are arranged concentrically with the seating region 31b positioned on the outer diameter side, and are cut out one step higher than the other back surface 31c. Further, the support region 31a and the seating region 31b have higher surface accuracy than the other back surface 31c.

Thus, the rotation lens holder unit 31 is higher support region 31a of the surface-precision, seating region 31b is, the support portion 34 is supported at three points on the rotating lens holder unit receiving portion 32a, even the rotational position _{P Stay up-,} accurately even sitting position _{P s} It has come to be supported.

[Action]
Next, the operation of the three-dimensional shape measuring apparatus 1 according to this embodiment will be described. In measuring the surface shape of a projection lens (hereinafter simply referred to as a workpiece) W for a semiconductor exposure apparatus, the measurer takes the workpiece W held on the rotating Yatoi 31 from the transport system (not shown) at the measurement position. The base member 32 on which the rotating Yatoi 31 is mounted is carried in.

  When the workpiece W is conveyed to the measurement position, that is, above the workpiece holding device 3, the base member 32 is mounted on the surface plate 21. At this time, the size of the workpiece W may exceed the measurable range of any of the reference mirrors 25X, 25Y, and 25Z, that is, the scanning range of the probe P. In this case, the measurer divides the scanning range of the probe P on the workpiece by the control unit (control device) 4 that controls the probe P and the rotary lifting mechanism 33. Then, the rotary Yatoi 31 is rotated, the surface of the workpiece W is scanned by the probe P for each divided region, and the three-dimensional shape is measured for the entire range of the workpiece W.

  Hereinafter, as shown in FIG. 5, a method for measuring the three-dimensional shape of the workpiece W when the size (diameter Dw) of the workpiece W exceeds the measurable range Rx in the X direction of the Z reference mirror 25Z. Explain in detail. In the present embodiment, since the range covered by the Z reference mirror 25Z with respect to the size of the workpiece W is approximately half, the shape of the entire surface of the workpiece is calculated by measuring three times in consideration of overlapping of connections. .

First, when measuring the workpiece W, the measurer sets parameters, a measurement range, and a measurement trace method for the data processing computer 43. As the parameter work of the design data, reference mirror and the overlapped part of the workpiece W as a measurement range (e.g., R ₁ portion of FIG. 6), the rotational angle of 120 ° as the trace method, measurement number 3 times and as trace speed input.

  Next, a command is sent from the data processing computer 43 to the electrical unit 41 via the control computer 42 to move all the moving stages 23X, 23Y, 23Z to the origin or a position where they do not hinder the loading or unloading of the workpiece W. .

  And the workpiece | work hold | maintained at the rotation Yatoi 31 is conveyed and positioned to the measurement position of the surface plate 21 with the base member 32 with the conveying apparatus as mentioned above. When the positioning to the measurement position is completed, the data processing computer 43 sends a measurement start command to the control computer 42. At the same time, the set various parameters are sent to the control computer 42 at the same time.

  Then, the control computer 42 positions the probe P at the origin position of the Z axis, and then moves the XY axis position of the probe P to the measurement start point according to various parameters sent from the data processing computer 43.

  When the probe P moves to the measurement start point, the probe P is lowered and brought into contact with the workpiece surface. Then, in a state where the contact pressure between the probe P and the workpiece W is constant, the workpiece surface in the designated range is scanned according to the parameters set by the data processing computer 43.

  When the scanning of the designated range is completed by the probe P, the probe P is moved away from the workpiece W and moved to the origin position. Thereby, the first measurement is completed.

When the first measurement is completed, the control computer 42 gives an ascending command to the rotary elevating mechanism 33 through the electrical unit 41. When receiving the ascent command, the linear actuator 36 c of the rotary elevating mechanism 33 raises the elevating stage 36 a and brings the support portion 34 into contact with the support area 31 a of the back surface 31 </ b> R of the rotary Yatoi 31. Then, in a state in which the rotary yatoe 31 is supported at three points by the three support portions 34, the elevating stage 36a is further raised, and the rotary yatoe 31 is floated from the base member 32 (rotation position P _{up in} FIG. 3B).

When the rotary elevating mechanism 33 rises to the rotational position P _up , the control computer 42 drives the rotation motor 35b to rotate the rotary yatoe 31 supported by the support portion 34 at a preset angle (120 in this embodiment). Rotate only °).

When the rotation is completed, the control computer 42 gives a descent command to the linear actuator 36c of the rotating lift mechanism 33 lowers the lift stage 36a to the seating position P _s. When the elevating stage 36a is lowered, the seating area 31b on the back surface 31R of the rotary Yato 31 and the rotary Yato receiving part 32a come into contact with each other, and the rotary Yato 31 is seated on the three rotary Yato receiving parts 32a. Then, in a state in which the rotary yatoe 31 is supported at three points by the rotary yatoi receiving portion 32a, only the support portion 34 is lowered, and the support portion 34 is separated from the support region 31a.

  When the rotation operation (rotation indexing) of the rotary yato 31 is completed, the second surface shape measurement is performed in the same manner as the first time (state shown in FIG. 5B). When the second surface shape measurement is completed, the rotation operation is performed again, and the third shape measurement is performed (state shown in FIG. 5C).

  When the third shape measurement is completed, the shape measurement of the entire range of the workpiece W is completed, and the workpiece W is lowered together with the base member 32 from the three-dimensional shape measuring device by the conveying device, and the measured data are joined together to obtain the entire workpiece. Calculate the shape.

Note that, as in the present embodiment, the measurement ranges R ₁ , R ₂ , and R ₃ of the workpiece W may be set so as not to cover a part of each region for each measurement. In addition, an arbitrary number of measurements such as six times may be set.

  In this way, by rotating the support portion 34 that directly contacts the rotary Yato 31 to the back surface 31R, the rotary Yato 31 can be seated on the base member 32 stably and slowly. Therefore, even when the workpiece holding device 3 lifts and lowers the rotary yatoe 31 with little impact, the optical element can be held with high accuracy without any deformation. Further, there is no possibility of damaging the rotating part 35.

  Furthermore, since the rotating Yato 31 is seated on the base member 32 during measurement, it is possible to prevent the rotating Yato 31 from rotating during measurement without increasing the rigidity of the rotating portion 35. Further, at the time of the rotation indexing, the support portion 34 is in direct contact with the back surface 31R of the rotary goat 31 and supports the rotary goat 31 in a state of being floated from the base member 32, so the load generated on the rotary portion 35 is reduced. be able to.

  Further, the surface accuracy of the support region 31a with which the support portion 34 of the back surface 31R of the rotary yato 31 can come into contact and the seating region 31b with which the rotary goat receiving portion 32a can come into contact with each other is formed with high precision, so Can be supported. In addition, the support unit 34 and the rotary goat receiving portion 32a support the rotary goat 31 at a plurality of points, whereby the rotary goat 31 can be supported in a more parallel state.

  Further, since the support region 31a and the seating region 31b are ring-shaped, it is not necessary to surface the entire surface of the rotary Yatoi receiving portion 32a with high accuracy and can be easily processed using a lathe or the like. it can. Moreover, the support part 34 and the support area 31a, and the rotation goat receiving part 32a and the seating area 31b can be brought into contact with each other regardless of the position where the support part 34 and the rotation yato 31 are rotated.

The support region 31a and the seating region 31b are concentrically arranged so that the seating region 31b is positioned on the outer diameter side, and when the support of the rotary yatoe 31 is switched from the rotary lift mechanism 33 to the apparatus main body side. Furthermore, since the center of gravity is the same, the position of the workpiece does not become unstable. Furthermore, since the centers of rotation C ₁ and the workpiece W of the rotary elevating mechanism 33 are matched, there is no center of gravity of the device is broken during rotation. Moreover, since the seating area | region 31b is located in the outer diameter side of the support area | region 31a, the workpiece | work W can be hold | maintained more stably at the time of a measurement.

[Second Embodiment]
Next, a work holding device 3 according to a second embodiment of the present invention will be described with reference to FIG. This work holding device 3 is different from the first embodiment in that the support region 31a and the seating region 31b of the rotary yatoe 31 are formed in a groove shape. Therefore, the description of the parts different from the first embodiment will be omitted below, and the same reference numerals as those of the first embodiment are used for the corresponding constituent elements.

  As shown in FIG. 7, the support region 31a and the seating region 31b are formed by processing the back surface 31R of the rotary yatoe 31 into a groove shape, and this groove portion has higher surface accuracy than the other back surface portion 31c. Has been.

The support portion 34 abutting on the said support area 31a, the diameter of the tip portion is narrower than the width W ₁ of the support region 31a, it is made possible contact support region 31a and the point. Further, as the rotation lens holder unit receiving portion 32a for contact with the seating region 31b, the diameter of the tip portion is narrower than the width W ₂ of the seating region 31b, have become accessible seating region 31b and the point.

  As described above, the support region 31a and the seating region 31b are formed in a groove shape, and the support portion 34 and the rotary yatoy receiving portion 32a are in contact with each other in the groove, so that the rotary yatoe 31 is parallel in the back surface 31R. It can prevent moving.

  In addition, you may comprise the support area | region 31a and the seating area | region 31b by attaching another member which consists of metals, such as duralumin and stainless steel with high hardness, to the back surface 31R of the rotation Yatoi 31. Further, the support region 31a may be located on the outer diameter side of the seating region 31b. Furthermore, the support region 31a and the seating region 31b are not limited to a ring shape, and may be, for example, circular. When both the support region 31a and the seating region 31b are circular, the support region 31a and the seating region 31b are one circular region. Formed by.

  Further, the number of the support portions 34 and the rotary yatoy receiving portions 32a is not limited to three, and may be set to an arbitrary number even if there is one or more than one. Furthermore, a high-precision optical element such as a large lens or mirror such as an aspherical surface, a spherical surface, or a free-form surface is most suitable for the workpiece W, but the three-dimensional measuring apparatus 1 measures the surface shape of various workpieces W. can do.

  Needless to say, the inventions described in the above-described embodiments may be combined in any way.

31 rotating lens holder unit 31F holding surface 31R rear 32 base member 32a rotating lens holder unit receiving portion 33 rotates the lift mechanism 34 supporting portion 35 rotating portion 36 supporting portion _{P Stay up-rotation} position _{P S} sitting position W workpiece

Claims (10)

A rotary yatoe having a holding surface for holding a workpiece, and a back surface opposite to the holding surface;
A base member as a fixing member that protrudes toward the back surface of the rotating yatoy and has a plurality of rotating yatoy receiving portions that support the back surface of the rotating yatoe;
Includes rear and detachably supporting portion of the front Symbol rotating lens holder unit, lifting unit for raising and lowering the support portion, and a rotary elevating mechanism having a rotating unit for rotating the support part,
The base member is formed with a hole that passes from the lower side to the upper side of the base member in order for the support portion of the rotary lifting mechanism to support the back surface of the rotary yatoi,
The rotation elevating mechanism supports the rotating yatoy in a state of being floated from the base member by the support unit raised by the elevating unit and contacting the back surface, and a rotation position capable of rotating by the rotating unit; The support part is lowered by the elevating part and separated from the back surface, and is driven to elevate to and from a seating position where the rotary yatoe is seated on the base member.
A workpiece holding device characterized by that. The back surface has a support region that can receive the support of the support portion, and a seating region that can be seated on the rotary yatoy receiving portion,
Before Symbol the sitting area is different from the rear outside these support areas and seating area, surface accuracy is formed high,
The work holding device according to claim 1. A plurality of the support portions are provided to support the back surface of the rotary yatoe, and a plurality of the support portions are provided.
The support region is formed with higher surface accuracy than the back surface other than the support region and the seating region.
  The work holding device according to claim 2. The seating area is formed in a groove shape,
  The work holding device according to claim 2 or 3. The support region and the seating region are circular or ring-shaped,
The work holding device according to any one of claims 2 to 4 . The support region and the seating region are formed concentrically.
The work holding device according to claim 5 . The support portion has a protruding shape having a predetermined curvature at the tip portion,
The rotary lens holder unit receiving portion, Ru protrusion-shaped der the tip portion having a predetermined curvature,
The work holding device according to any one of claims 1 to 6 . The rotating yatoi is disposed so that the center of rotation of the support portion coincides with the center thereof.
The workpiece holding device of any one of claims 1 to 7. The work holding device according to any one of claims 1 to 8 ,
A stage that can move in three dimensions,
A probe that is held through the stage and scans the workpiece surface;
A surface plate incorporating the work holding device and connected to the stage;
A control device for controlling the probe and the rotary lifting mechanism,
The base member is supported by the surface plate,
When the size of the workpiece exceeds the scanning range of the probe, the control device divides the scanning range of the probe on the workpiece, rotates the rotary yato and moves the workpiece by the probe for each divided region. The surface of the workpiece is scanned and the 3D shape is measured for the entire range of the workpiece.
A three-dimensional shape measuring apparatus. The workpiece is a projection lens for a semiconductor exposure apparatus,
The three-dimensional shape measuring apparatus according to claim 9 .

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