JP5958688B2 - Gyro sensor and electronics - Google Patents

Description

  The present invention relates to a gyro sensor and an electronic device.

  In recent years, an angular velocity sensor (gyro sensor) that detects an angular velocity using, for example, silicon MEMS (Micro Electro Mechanical System) technology has been developed.

  For example, Patent Literature 1 discloses a gyro sensor including a vibrating body, a drive electrode that vibrates the vibrating body, and a detection electrode that detects a signal that changes in accordance with the vibration of the vibrating body. The drive electrode and the detection electrode are connected to the drive wiring and the detection wiring, respectively.

JP 7-218268 A

  However, in the gyro sensor as described above, an AC voltage is applied to the drive electrode via the drive wiring, and therefore, via a parasitic capacitance generated between the drive wiring and another wiring adjacent to the drive wiring. In some cases, current flowed through other wirings. As a result, desired characteristics may not be obtained.

  One of the objects according to some aspects of the present invention is to provide a gyro sensor capable of suppressing a current from flowing to another wiring through a parasitic capacitance generated between the drive wiring and the other wiring. It is in. Another object of some aspects of the present invention is to provide an electronic apparatus having the above gyro sensor.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
The gyro sensor according to this application example is
A substrate,
A vibrating body,
A fixed drive electrode fixed on the substrate and vibrating the vibrating body;
A fixed vibration detection electrode that is fixed on the substrate and detects a signal that changes according to the vibration of the vibrating body;
A drive wiring provided on the substrate and connected to the fixed drive electrode;
Vibration detection wiring provided on the substrate and connected to the fixed vibration detection electrode;
A fixed potential wiring provided on the substrate and having a predetermined potential;
Including
The fixed potential wiring is provided between the drive wiring and the vibration detection wiring in a plan view.

  According to such a gyro sensor, it is possible to suppress the generation of parasitic capacitance between the drive wiring and the vibration detection wiring. Thereby, it is possible to suppress a current from flowing through the vibration detection wiring via the parasitic capacitance generated between the drive wiring and the vibration detection wiring.

[Application Example 2]
In the gyro sensor according to this application example,
The vibration detection electrode is
It may be an electrode that detects a vibration state of the vibrating body.

  According to such a gyro sensor, it is possible to suppress a current from flowing through the vibration detection wiring via the parasitic capacitance generated between the drive wiring and the vibration detection wiring.

[Application Example 3]
In the gyro sensor according to this application example,
The thickness of the fixed potential wiring may be equal to or greater than the thickness of the drive wiring and may be equal to or greater than the thickness of the vibration detection wiring.

  According to such a gyro sensor, it is possible to more reliably suppress the generation of parasitic capacitance between the drive wiring and the vibration detection wiring.

[Application Example 4]
In the gyro sensor according to this application example,
The fixed potential wiring may be electrically connected to the vibrating body.

  According to such a gyro sensor, it is possible to suppress the generation of parasitic capacitance between the drive wiring and the vibration detection wiring while applying a potential to the vibrating body by the fixed potential wiring.

  In the description according to the present invention, the term “electrically connected” is used, for example, as another specific member (hereinafter “electrically connected” to “specific member (hereinafter referred to as“ A member ”)”. B member "))" and the like. In the description according to the present invention, in the case of this example, the case where the A member and the B member are in direct contact and electrically connected, and the A member and the B member are the other members. The term “electrically connected” is used as a case where the case where the terminals are electrically connected to each other is included.

[Application Example 5]
In the gyro sensor according to this application example,
The fixed potential wiring may be provided so as to surround the vibrating body in a plan view.

  According to such a gyro sensor, for example, when the vibrating body is adjacent to another functional element, it is possible to suppress the generation of parasitic capacitance between the vibrating body and the other functional element.

[Application Example 6]
In the gyro sensor according to this application example,
A movable drive electrode extending from the vibrating body and vibrating the vibrating body;
A movable monitor electrode extending from the vibrating body and detecting a vibration state of the vibrating body;
Further including
The fixed drive electrode is provided to face the movable drive electrode,
The fixed vibration detection electrode may be provided to face the movable monitor electrode.

  According to such a gyro sensor, it is possible to suppress a current from flowing through the vibration detection wiring via the parasitic capacitance generated between the drive wiring and the vibration detection wiring.

[Application Example 7]
In the gyro sensor according to this application example,
The fixed drive electrode is
Provided on one side of the movable drive electrode and on the other side of the movable drive electrode;
The fixed vibration detection electrode is
Provided on one side of the movable monitor electrode and on the other side of the movable monitor electrode;
The drive wiring is connected to the fixed drive electrode provided on one side of the movable drive electrode,
The other drive wiring is connected to the fixed drive electrode provided on the other side of the movable drive electrode,
The vibration detection wiring is connected to the fixed vibration detection electrode provided on one side of the movable monitor electrode,
The other vibration detection wiring is connected to the fixed vibration detection electrode provided on the other side of the movable monitor electrode,
The crossing area of the drive wiring and the vibration detection wiring and the crossing area of the drive wiring and the other vibration detection wiring are the same,
The area where the other driving wiring and the vibration detection wiring intersect with each other and the area where the other driving wiring and the other vibration detection wiring intersect may be the same.

  According to such a gyro sensor, it is possible to cancel the influence of the current flowing through the vibration detection wiring via the parasitic capacitance.

[Application Example 8]
The electronic device according to this application example is
The gyro sensor according to this application example is included.

  According to such an electronic apparatus, it is possible to have a gyro sensor that can suppress a current from flowing through the vibration detection wiring via a parasitic capacitance generated between the drive wiring and the vibration detection wiring.

The top view which shows typically the gyro sensor which concerns on this embodiment. FIG. 3 is a cross-sectional view schematically showing the gyro sensor according to the embodiment. FIG. 3 is a cross-sectional view schematically showing the gyro sensor according to the embodiment. FIG. 3 is a cross-sectional view schematically showing the gyro sensor according to the embodiment. The top view which shows typically the functional element of the gyro sensor which concerns on this embodiment. The figure for demonstrating operation | movement of the gyro sensor which concerns on this embodiment. The figure for demonstrating operation | movement of the gyro sensor which concerns on this embodiment. The figure for demonstrating operation | movement of the gyro sensor which concerns on this embodiment. The figure for demonstrating operation | movement of the gyro sensor which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the gyro sensor which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the gyro sensor which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the gyro sensor which concerns on this embodiment. Sectional drawing which shows typically the gyro sensor which concerns on the modification of this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment. The perspective view which shows typically the electronic device which concerns on this embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are essential constituent requirements of the present invention.

1. First, a gyro sensor according to this embodiment will be described with reference to the drawings. FIG. 1 is a plan view schematically showing a gyro sensor 100 according to the present embodiment. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1 schematically showing the gyro sensor 100 according to the present embodiment. 3 is a cross-sectional view taken along the line III-III in FIG. 1 schematically showing the gyro sensor 100 according to the present embodiment. 4 is a cross-sectional view taken along line IV-IV in FIG. 1 schematically showing the gyro sensor 100 according to the present embodiment. 1 to 4 show the X axis, the Y axis, and the Z axis as three axes orthogonal to each other.

  1-4, the gyro sensor 100 includes a substrate 10, a functional element 102, drive wirings 20, 21, vibration detection wirings 30, 31, 50, 51, a fixed potential wiring 40, a lid, And body 60. The vibration detection wirings 30, 31, 50 and 51 are classified into detection wirings 30 and 31 and monitor wirings 50 and 51. For convenience, the lid 60 is omitted in FIGS. 1, 3, and 4.

  The material of the substrate 10 is, for example, glass or silicon. As shown in FIG. 2, the substrate 10 has a first surface 11 and a second surface 12 opposite to the first surface 11. In the illustrated example, the first surface 11 and the second surface 12 are surfaces parallel to the XY plane.

  A recess 14 is provided in the first surface 11 of the substrate 10. A vibrating body 112 of the functional element 102 is provided above the concave portion 14 via a gap. By the recess 14, the vibrating body 112 can be moved in a desired direction without being obstructed by the substrate 10. Although the planar shape of the recessed part 14 is not specifically limited, For example, it is a rectangle. As shown in FIGS. 2 to 4, grooves 16, 17, 18, and 19 may be further provided on the first surface 11 of the substrate 10. For the sake of convenience, in FIG. 1, illustration of the concave portion 14 and the groove portions 16, 17, 18, and 19 is omitted.

  The functional element 102 is provided on the substrate 10 (on the first surface 11 of the substrate 10). Hereinafter, an example in which the functional element 102 is a gyro sensor element (capacitive MEMS gyro sensor element) that detects an angular velocity around the Z axis will be described. FIG. 5 is a plan view schematically showing the functional element 102. In FIG. 5, an X axis, a Y axis, and a Z axis are illustrated as three axes orthogonal to each other.

  As shown in FIGS. 2 and 5, the functional element 102 includes a first structure body 106 and a second structure body 108. The first structure 106 and the second structure 108 are connected to each other along the X axis. The first structure 106 is located on the −X direction side of the second structure 108. As illustrated in FIG. 5, the structures 106 and 108 have, for example, a shape that is symmetric with respect to a boundary line B (a straight line along the Y axis) between the structures 106 and 108. Although not illustrated, the functional element 102 may not include the second structure 108 but may be configured by the first structure 106.

  As shown in FIG. 5, the structures 106 and 108 include the vibrating body 112, the first spring portion 114, the movable drive electrode 116, the displacement portion 122, the second spring portion 124, and the fixed drive electrodes 130 and 132. The movable vibration detection electrodes 118 and 126, the fixed vibration detection electrodes 140, 142, 160 and 162, and the fixed portion 150 can be provided. The movable vibration detection electrodes 118 and 126 are classified into a movable monitor electrode 118 and a movable detection electrode 126. The fixed vibration detection electrodes 140, 142, 160, 162 are classified into fixed detection electrodes 140, 142 and fixed monitor electrodes 160, 162.

  The vibrating body 112, the spring portions 114 and 124, the movable drive electrode 116, the movable monitor electrode 118, the displacement portion 122, the movable detection electrode 126, and the fixed portion 150 are, for example, a silicon substrate (not shown) bonded to the substrate 10. Are formed integrally. As a result, it is possible to apply a fine processing technique used for manufacturing a silicon semiconductor device, and the functional element 102 can be downsized. The material of the functional element 102 is, for example, silicon imparted with conductivity by doping impurities such as phosphorus and boron.

  The vibrating body 112 has, for example, a frame shape (frame shape). Inside the vibrating body 112, a displacement portion 122, a movable detection electrode 126, and fixed detection electrodes 140 and 142 are provided.

  The first spring portion 114 has one end connected to the vibrating body 112 and the other end connected to the fixed portion 150. The fixing unit 150 is fixed on the substrate 10 (on the first surface 11 of the substrate 10). That is, the concave portion 14 is not provided below the fixed portion 150. The vibrating body 112 is supported by the fixed portion 150 via the first spring portion 114. In the illustrated example, four first spring portions 114 are provided in each of the first structure body 106 and the second structure body 108. Note that the fixing part 150 on the boundary line B between the first structure 106 and the second structure 108 may not be provided.

  The first spring portion 114 is configured to be able to displace the vibrating body 112 in the X-axis direction. More specifically, the first spring portion 114 has a shape extending in the X axis direction (along the X axis) while reciprocating in the Y axis direction (along the Y axis). Note that the number of the first spring portions 114 is not particularly limited as long as the vibrating body 112 can vibrate along the X axis.

  The movable drive electrode 116 is connected to the vibrating body 112. The movable drive electrode 116 extends from the vibrating body 112 in the + Y direction and the −Y direction. In the example shown in FIG. 5, a plurality of movable drive electrodes 116 are provided, and the plurality of movable drive electrodes 116 are arranged in the X-axis direction. The movable drive electrode 116 can vibrate along the X axis with the vibration of the vibrating body 112.

  The movable monitor electrode 118 is connected to the vibrating body 112. The movable monitor electrode 118 extends from the vibrating body 112 in the + Y direction and the −Y direction. In the example shown in FIG. 5, one movable monitor electrode 118 is provided on the + Y direction side of the vibrating body 112 of the first structure 106 and one on the + Y direction side of the vibrating body 112 of the second structure 108. A plurality of movable drive electrodes 116 are arranged between the monitor electrodes 118. Further, one movable monitor electrode 118 is provided on the −Y direction side of the vibrating body 112 of the first structure 106 and on the −Y direction side of the vibrating body 112 of the second structure 108, and the movable monitor electrode 118 is provided. A plurality of movable drive electrodes 116 are arranged in between. The planar shape of the movable monitor electrode 118 is the same as the planar shape of the movable drive electrode 116, for example. The movable monitor electrode 118 can vibrate along the X axis with the vibration of the vibrating body 112.

  The fixed drive electrodes 130 and 132 are fixed on the substrate 10 (on the first surface 11 of the substrate 10), and are provided on the + Y direction side of the vibrating body 112 and the −Y direction side of the vibrating body 112.

  The fixed drive electrodes 130 and 132 face the movable drive electrode 116 and are provided with the movable drive electrode 116 interposed therebetween. More specifically, in the fixed drive electrodes 130 and 132 sandwiching the movable drive electrode 116, the first structure 106 is provided with the fixed drive electrode 130 on the −X direction side of the movable drive electrode 116. A fixed drive electrode 132 is provided on the + X direction side. In the second structure 108, the fixed drive electrode 130 is provided on the + X direction side of the movable drive electrode 116, and the fixed drive electrode 132 is provided on the −X direction side of the movable drive electrode 116. As shown in FIG. 1, the fixed drive electrode 130 is connected to the drive wiring 20, and the fixed drive electrode 132 is connected to the drive wiring 21.

  A plurality of fixed drive electrodes 130 and 132 are provided according to the number of movable drive electrodes 116, and are arranged in the X-axis direction. In the example shown in FIG. 5, the fixed drive electrodes 130 and 132 have a comb-like shape, and the movable drive electrode 116 has a shape that can be inserted between the comb teeth of the fixed drive electrodes 130 and 132. doing. The fixed drive electrodes 130 and 132 and the movable drive electrode 116 are electrodes for vibrating the vibrating body 112.

  The fixed monitor electrodes 160 and 162 are fixed on the substrate 10 (on the first surface 11 of the substrate 10), and are provided on the + Y direction side of the vibrating body 112 and the −Y direction side of the vibrating body 112.

  The fixed monitor electrodes 160 and 162 face the movable monitor electrode 118 and are provided with the movable monitor electrode 118 interposed therebetween. More specifically, in the fixed monitor electrodes 160 and 162 sandwiching the movable monitor electrode 118, the first structure 106 is provided with a fixed drive electrode 160 on the −X direction side of the movable monitor electrode 118. A fixed monitor electrode 162 is provided on the + X direction side. In the second structure 108, the fixed monitor electrode 160 is provided on the + X direction side of the movable monitor electrode 118, and the fixed monitor electrode 162 is provided on the −X direction side of the movable monitor electrode 118. As shown in FIG. 1, the fixed monitor electrode 160 is connected to the monitor wiring 50, and the fixed monitor electrode 162 is connected to the monitor wiring 51. The planar shape of the fixed monitor electrodes 160 and 162 is the same as the planar shape of the fixed drive electrodes 130 and 132, for example.

  The fixed monitor electrodes 160 and 162 and the movable monitor electrode 118 are electrodes for detecting a signal that changes in accordance with the vibration of the vibrating body 112, and are electrodes for detecting the vibration state of the vibrating body 112. More specifically, the displacement of the movable monitor electrode 118 along the X-axis causes the capacitance between the movable monitor electrode 118 and the fixed monitor electrode 160 and the relationship between the movable monitor electrode 118 and the fixed monitor electrode 162. The capacitance between them changes. As a result, the currents of the fixed monitor electrodes 160 and 162 change. By detecting this change in current, the vibration state of the vibrating body 112 can be detected.

  The displacement part 122 is connected to the vibrating body 112 via the second spring part 124. In the illustrated example, the planar shape of the displacement portion 122 is a rectangle having a long side along the Y axis. Although not shown, the displacement part 122 may be provided outside the vibrating body 112.

  The second spring portion 124 is configured to be able to displace the displacement portion 122 in the Y-axis direction. More specifically, the second spring portion 124 has a shape that extends in the Y-axis direction while reciprocating in the X-axis direction. The number of the second spring portions 124 is not particularly limited as long as the displacement portions 122 can be displaced along the Y axis.

  The movable detection electrode 126 is connected to the displacement part 122. For example, a plurality of movable detection electrodes 126 are provided. The movable detection electrode 126 extends from the displacement portion 122 in the + X direction and the −X direction.

  The fixed detection electrodes 140 and 142 are fixed on the substrate 10 (on the first surface 11 of the substrate 10). More specifically, the fixed detection electrodes 140 and 142 have one end fixed on the substrate 10 and the other end extending to the displacement part 122 side as a free end.

  The fixed detection electrodes 140 and 142 face the movable detection electrode 126 and are provided with the movable detection electrode 126 interposed therebetween. More specifically, in the fixed detection electrodes 140 and 142 sandwiching the movable detection electrode 126, in the first structure 106, the fixed detection electrode 140 is provided on the −Y direction side of the movable detection electrode 126. A fixed detection electrode 142 is provided on the + Y direction side. In the second structure 108, the fixed detection electrode 140 is provided on the + Y direction side of the movable detection electrode 126, and the fixed detection electrode 142 is provided on the −Y direction side of the movable detection electrode 126. As shown in FIG. 1, the fixed detection electrode 140 is connected to the detection wiring 30, and the fixed detection electrode 142 is connected to the detection wiring 31.

  In the example shown in FIG. 5, a plurality of fixed detection electrodes 140 and 142 are provided and are alternately arranged along the Y axis. The fixed detection electrodes 140 and 142 and the movable detection electrode 126 are electrodes for detecting a signal (capacitance) that changes according to the vibration of the vibrating body 112.

  The drive wirings 20 and 21 are provided on the substrate 10 as shown in FIGS. As shown in FIG. 1, the drive wiring 20 includes a fixed drive electrode 130 provided on the + Y direction side of the vibrating body 112 and a fixed drive electrode 130 provided on the −Y direction side of the vibrating body 112 in a plan view. And connected. The drive wiring 21 connects the fixed drive electrode 132 provided on the + Y direction side of the vibrating body 112 and the fixed drive electrode 132 provided on the −Y direction side of the vibrating body 112 in plan view. Yes.

  The drive wirings 20 and 21 are provided so as to surround the −X direction side of the vibrating body 112 in a plan view. That is, the drive wirings 20 and 21 are provided on the + Y direction side of the vibrating body 112 and extend in the X axis direction, on the −X direction side of the vibrating body 112 and extend in the Y axis direction, And a portion provided on the −Y direction side of the vibrating body 112 and extending in the X-axis direction. In the illustrated example, the drive wirings 20 and 21 are not provided on the + X direction side of the vibrating body 112.

  As shown in FIG. 3, the drive wiring 20 can have a first portion 20 a provided in the groove 16 and a second portion 20 b provided in the first surface 11. The second portion 20b straddles the groove portion 17 in which the drive wiring 21 is provided. The material of the first portion 20a is, for example, metal, and the material of the second portion 20b is, for example, silicon to which conductivity is imparted. The first portion 20a and the second portion 20b are connected to each other. With such a configuration, it is possible to prevent the drive wiring 20 and the drive wiring 21 from contacting each other at a portion where the drive wirings 20 and 21 intersect in plan view. Further, since the drive wiring 20 includes the first portion 20a, it is possible to prevent the drive wiring 20, the monitor wirings 50 and 51, and the fixed potential wiring 40 from contacting each other.

  Similarly, the drive wiring 21 may have a first portion 21 a provided in the groove portion 17 and a second portion (not shown) provided on the first surface 11. Thereby, it is possible to prevent the drive wiring 21 from contacting the monitor wirings 50 and 51 and the fixed potential wiring 40.

  Each of the drive wirings 20 and 21 may be connected to a pad (not shown) provided on the substrate 10. The drive wirings 20 and 21 are wirings for applying an AC voltage to the fixed drive electrodes 130 and 132.

  The detection wiring 30 is provided on the substrate 10. The detection wiring 30 is connected to the fixed detection electrode 140 and extends from the fixed detection electrode 140 to the + X direction side of the vibrating body 112. More specifically, the detection wiring 30 extends from the fixed detection electrode 140 of the first structure 106 to the + X direction side of the vibrating body 112 of the first structure 106, and further the fixed detection of the second structure 108. It is connected to the electrode 140 and extends to the + X direction side of the vibrating body 112 of the second structure 108. Thereby, the detection wiring 30 and the drive wirings 20 and 21 can be provided so as not to cross each other in plan view.

  The detection wiring 31 is provided on the substrate 10. The detection wiring 31 is connected to the fixed detection electrode 142 and extends from the fixed detection electrode 142 to the + X direction side of the vibrating body 112. More specifically, the detection wiring 31 extends from the fixed detection electrode 142 of the first structure 106 to the + X direction side of the vibrating body 112 of the first structure 106, and further the fixed detection of the second structure 108. It is connected to the electrode 142 and extends to the + X direction side of the vibrating body 112 of the second structure 108. Thus, the detection wiring 31 and the drive wirings 20 and 21 can be provided so as not to cross each other in plan view.

  As shown in FIG. 2, the detection wirings 30 and 31 may have a portion provided in the recess 14. Thereby, it can prevent that the detection wiring 30 and 31 and the vibrating body 112 contact. Further, the detection wirings 30 and 31 may have a portion provided in a groove portion (not shown) formed in the first surface 11 of the substrate 10 like the first portion 20 a of the driving wiring 20. Good. Further, the detection wirings 30 and 31 may have a portion (not shown) provided on the first surface 11 of the substrate 10 like the second portion 20 b of the drive wiring 20. Thereby, it is possible to prevent the detection wirings 30 and 31 from contacting the monitor wirings 50 and 51 and the fixed potential wiring 40.

  Each of the detection wirings 30 and 31 may be connected to a pad (not shown) provided on the substrate 10. The detection wirings 30 and 31 are wirings for detecting a change in electrostatic capacitance between the movable detection electrode 126 and the fixed detection electrodes 140 and 142.

  The monitor wirings 50 and 51 are provided on the substrate 10. As shown in FIG. 1, the monitor wiring 50 includes a fixed monitor electrode 160 provided on the + Y direction side of the vibrating body 112 and a fixed monitor electrode 160 provided on the −Y direction side of the vibrating body 112 in a plan view. And connected. The monitor wiring 51 connects the fixed monitor electrode 162 provided on the + Y direction side of the vibrating body 112 and the fixed monitor electrode 162 provided on the −Y direction side of the vibrating body 112 in plan view. Yes.

  The monitor wires 50 and 51 are provided so as to surround the + X direction side of the vibrating body 112 in a plan view. That is, the monitor wirings 50 and 51 are provided on the + Y direction side of the vibrating body 112 and extend in the X axis direction, on the + X direction side of the vibrating body 112 and extend in the Y axis direction, A portion provided on the −Y direction side of the body 112 and extending in the X-axis direction. In the illustrated example, the monitor wires 50 and 51 are not provided on the −X direction side of the vibrating body 112.

  As shown in FIG. 1, in plan view, for example, an area (total area) S1 where the drive lines 20 and the monitor lines 50 intersect and an area (total area) S2 where the drive lines 20 and the monitor lines 51 intersect The same. Similarly, the area (total area) S3 where the drive wiring 21 and the monitor wiring 50 intersect is the same as the area (total area) S4 where the drive wiring 21 and the monitor wiring 51 intersect. For example, the sizes of the areas S1, S2, S3, and S4 may be the same.

  As shown in FIGS. 2 and 3, the monitor wires 50 and 51 may have first portions 50 a and 50 b provided in the groove portions 18 and 19 formed in the first surface 11 of the substrate 10. Good. Further, the detection wirings 50 and 51 may have a second part (not shown) provided on the first surface 11 of the substrate 10 like the second part 20 b of the drive wiring 20. Thereby, it is possible to prevent the monitor wirings 50 and 51 from being in contact with the drive wirings 20 and 21, the detection wirings 30 and 31, and the fixed potential wiring 40.

  The monitor wires 50 and 51 may be connected to pads (not shown) provided on the substrate 10. The monitor wirings 50 and 51 are wirings for detecting changes in the current of the fixed monitor electrodes 160 and 162.

  The material of the wiring 20, 21, 30, 31, 50, 51 is, for example, ITO (Indium Tin Oxide), aluminum, gold, platinum, titanium, tungsten, chromium, or silicon provided with conductivity. The material of the wiring 20, 21, 30, 31, 50, 51 may include, for example, a portion made of the metal described above and a portion made of silicon to which conductivity is imparted.

  The fixed potential wiring 40 is provided on the substrate 10. The fixed potential wiring 40 has a predetermined potential such as a reference potential, for example. In the example shown in FIG. 1, the fixed potential wiring 40 is electrically connected to the vibrating body 112, the movable drive electrode 116, the movable monitor electrode 118, the displacement unit 122, and the movable detection electrode 126 via the fixed unit 150. Yes. The fixed potential wiring 40 may have the same potential as that of the vibrating body 112 or the like.

  The fixed potential wiring 40 is provided so as to surround the vibrating body 112 (the functional element 102) in a plan view. The fixed potential wiring 40 is provided between the drive wirings 20 and 21 and the detection wirings 30 and 31 on the + Y direction side (one side) of the vibrating body 112 in a plan view. Similarly, the fixed potential wiring 40 is provided between the drive wirings 20 and 21 and the detection wirings 30 and 31 on the −Y direction side (the other side) of the vibrating body 112. More specifically, the drive wirings 20 and 21 and the detection wirings 30 and 31 extend in the X axis direction on the + Y direction side and the −Y direction side of the vibrating body 112, and the fixed potential wiring 40 is connected to the drive wirings 20 and 20. 21 and the detection wirings 30 and 31 extend in the X-axis direction.

  The material of the fixed potential wiring 40 is, for example, silicon provided with conductivity. In the example illustrated in FIG. 2, the fixed potential wiring 40 is formed integrally with the fixed portion 150. The material of the fixed potential wiring 40 is not limited to silicon provided with conductivity, and may be, for example, ITO, aluminum, gold, platinum, titanium, tungsten, or chromium.

  The thickness of the fixed potential wiring 40 (size in the Z-axis direction) is equal to or greater than the thickness of the drive wirings 20 and 21 and equal to or greater than the thickness of the monitor wirings 50 and 51. Furthermore, the thickness of the fixed potential wiring 40 is equal to or greater than the thickness of the detection wirings 30 and 31. In the example shown in FIG. 4, the fixed potential wiring 40 is thicker than the drive wirings 20 and 21 and larger than the monitor wirings 50 and 51. The fixed potential wiring 40 may be connected to a pad (not shown) provided on the substrate 10.

  As shown in FIG. 2, the lid 60 is provided on the substrate 10. The board | substrate 10 and the cover body 60 can comprise a package. The substrate 10 and the lid body 60 can form a cavity 62, and the functional element 102 can be accommodated in the cavity 62. The cavity 62 is sealed with a vacuum, for example. The material of the lid 60 is, for example, silicon or glass.

  Next, the operation of the gyro sensor 100 will be described. 6 to 9 are diagrams for explaining the operation of the gyro sensor 100. 6 to 9, the X axis, the Y axis, and the Z axis are illustrated as three axes orthogonal to each other. For convenience, in FIG. 6 to FIG. 9, members other than the functional element 102 are not shown, and further, the movable drive electrode 116, the movable monitor electrode 118, the movable detection electrode 126, the fixed drive electrodes 130 and 132, and the fixed detection electrode. 140 and 142 and the fixed monitor electrodes 160 and 162 are omitted, and the functional element 102 is simplified.

  When a voltage is applied between the movable drive electrode 116 and the fixed drive electrodes 130 and 132 by a power source (not shown), an electrostatic force can be generated between the movable drive electrode 116 and the fixed drive electrodes 130 and 132. (See FIGS. 1 and 5). Accordingly, as shown in FIGS. 6 and 7, the first spring portion 114 can be expanded and contracted along the X axis, and the vibrating body 112 can be vibrated along the X axis.

  More specifically, a constant potential Vr is applied to the movable drive electrode 116 via the fixed potential wiring 40. Further, the first AC voltage is applied to the fixed drive electrode 130 via the drive wiring 20 with reference to Vr. Further, a second AC voltage whose phase is shifted by 180 degrees from the first AC voltage is applied to the fixed drive electrode 132 via the drive wiring 21 as a reference.

  Here, in the fixed drive electrodes 130 and 132 sandwiching the movable drive electrode 116, the first structure 106 includes the fixed drive electrode 130 on the −X direction side of the movable drive electrode 116, and the + X direction side of the movable drive electrode 116. Is provided with a fixed drive electrode 132 (see FIGS. 1 and 5). In the second structure 108, the fixed drive electrode 130 is provided on the + X direction side of the movable drive electrode 116, and the fixed drive electrode 132 is provided on the −X direction side of the movable drive electrode 116 (see FIGS. 1 and 5). ). Therefore, the first AC voltage and the second AC voltage cause the vibrating body 112a of the first structure body 106 and the vibrating body 112b of the second structure body 108 to have opposite phases and a predetermined frequency along the X axis. Can be vibrated. In the example shown in FIG. 6, the vibrating body 112a is displaced in the α1 direction, and the vibrating body 112b is displaced in the α2 direction opposite to the α1 direction. In the example shown in FIG. 7, the vibrating body 112a is displaced in the α2 direction, and the vibrating body 112b is displaced in the α1 direction.

  The displacement part 122 is displaced along the X axis with the vibration of the vibrating body 112. Similarly, the movable detection electrode 126 (see FIGS. 1 and 5) is displaced along the X axis with the vibration of the vibrating body 112.

  As shown in FIGS. 8 and 9, when an angular velocity ω around the Z-axis is applied to the functional element 102 in a state where the vibrating bodies 112a and 112b vibrate along the X-axis, Coriolis force acts and the displacement The part 122 is displaced along the Y axis. In other words, the displacement portion 122a connected to the vibrating body 112a and the displacement portion 122b connected to the vibrating body 112b are displaced in opposite directions along the Y axis. In the example shown in FIG. 8, the displacement part 122a is displaced in the β1 direction, and the displacement part 122b is displaced in the β2 direction opposite to the β1 direction. In the example shown in FIG. 9, the displacement part 122a is displaced in the β2 direction, and the second displacement part 122b is displaced in the β1 direction.

  As the displacement parts 122a and 122b are displaced along the Y axis, the distance between the movable detection electrode 126 and the fixed drive electrode 140 changes (see FIGS. 1 and 5). Similarly, the distance between the movable detection electrode 126 and the fixed drive electrode 142 changes (see FIGS. 1 and 5). Therefore, the electrostatic capacitance between the movable detection electrode 126 and the fixed drive electrode 140 changes. Similarly, the capacitance between the movable detection electrode 126 and the fixed drive electrode 142 changes.

  In the gyro sensor 100, by applying a voltage between the movable detection electrode 126 and the fixed detection electrode 140 via the detection wiring 30 and the fixed potential wiring 40, the gap between the movable detection electrode 126 and the fixed detection electrode 140 is applied. The amount of change in capacitance can be detected (see FIG. 1). Further, by applying a voltage between the movable detection electrode 126 and the fixed detection electrode 142 via the detection wiring 31 and the fixed potential wiring 40, the electrostatic capacitance between the movable detection electrode 126 and the fixed detection electrode 142. Can be detected (see FIG. 1). In this way, the gyro sensor 100 can obtain the angular velocity ω around the Z axis based on the amount of change in capacitance between the movable detection electrode 126 and the fixed detection electrodes 140 and 142.

  Further, in the gyro sensor 100, the vibration bodies 112a and 112b vibrate along the X axis, whereby the distance between the movable monitor electrode 118 and the fixed monitor electrode 160 changes (see FIGS. 1 and 5). Similarly, the distance between the movable monitor electrode 118 and the fixed monitor electrode 162 varies (see FIGS. 1 and 5). Therefore, the electrostatic capacitance between the movable monitor electrode 118 and the fixed monitor electrode 160 changes. Similarly, the capacitance between the movable monitor electrode 118 and the fixed monitor electrode 162 changes. Along with this, the current flowing through the fixed monitor electrodes 160 and 162 (to the monitor wires 50 and 51) changes. The vibration state of the vibrating bodies 112a and 112b can be detected (monitored) by this change in current. Note that feedback control can be applied to the drive signal based on changes in the current of the monitor wirings 50 and 51.

  The gyro sensor 100 according to the present embodiment has, for example, the following characteristics.

  According to the gyro sensor 100, the fixed potential wiring 40 is provided between the drive wirings 20 and 21 and the monitor wirings 50 and 51 on one side (for example, + Y direction side) of the vibrating body 112 in a plan view. The fixed potential wiring 40 has a predetermined potential such as a reference potential, for example. Therefore, it is possible to suppress the generation of parasitic capacitance between the drive wiring 20 and the monitor wirings 50 and 51. Similarly, generation of parasitic capacitance between the drive wiring 21 and the monitor wirings 50 and 51 can be suppressed. Thereby, it is possible to suppress the current from flowing through the monitor wirings 50 and 51 via the parasitic capacitance generated between the drive wiring 20 and the monitor wirings 50 and 51. Similarly, it is possible to suppress the current from flowing through the monitor wirings 50 and 51 through the parasitic capacitance generated between the drive wiring 21 and the monitor wirings 50 and 51. For example, if a current flows through the monitor wiring via the parasitic capacitance, a problem may occur in the drive circuit for driving the gyro sensor. Therefore, it is necessary to increase the number of movable drive electrodes and fixed drive electrodes, movable monitor electrodes and fixed monitor electrodes, and the areas of the movable detection electrodes and movable fixed electrodes may be reduced accordingly. Thereby, the detection accuracy of angular velocity may fall. According to the gyro sensor 100, current can be suppressed from flowing through the monitor wirings 50 and 51 through the parasitic capacitance, so that the above-described problems can be avoided and desired characteristics can be obtained.

  According to the gyro sensor 100, the thickness of the fixed potential wiring 40 is equal to or greater than the thickness of the drive wirings 20 and 21 and equal to or greater than the thickness of the monitor wirings 50 and 51. Therefore, generation of parasitic capacitance between the drive wirings 20 and 21 and the monitor wirings 50 and 51 can be suppressed more reliably.

  According to the gyro sensor 100, the fixed potential wiring 40 is electrically connected to the vibrating body 112. Accordingly, it is possible to suppress the generation of parasitic capacitance between the drive wirings 20 and 21 and the monitor wirings 50 and 51 while applying a potential to the vibrating body 112.

  According to the gyro sensor 100, the fixed potential wiring 40 is provided so as to surround the vibrating body 112 in a plan view. Therefore, for example, when another functional element (a functional element adjacent to the functional element 102) is accommodated in the cavity 62, the generation of parasitic capacitance between the functional element 102 and the other functional element is suppressed. it can.

  According to the gyro sensor 100, the crossing area (total area) S1 of the drive wiring 20 and the monitor wiring 50 and the crossing area (total area) S2 of the driving wiring 20 and the monitor wiring 51 are the same. Similarly, the area (total area) S3 where the drive wiring 21 and the monitor wiring 50 intersect is the same as the area (total area) S4 where the drive wiring 21 and the monitor wiring 51 intersect. Therefore, the magnitude of the current flowing through the monitor wiring 50 via the parasitic capacitance between the drive wiring 20 and the monitor wiring 50 and the monitor wiring 51 via the parasitic capacitance between the drive wiring 20 and the monitor wiring 51 are connected. The magnitude of the flowing current can be made closer (or the same). Similarly, the monitor wiring 51 via the parasitic capacitance between the drive wiring 21 and the monitor wiring 50 and the magnitude of the current flowing through the monitor wiring 50 and the parasitic capacitance between the driving wiring 21 and the monitor wiring 51. Can be made close to (or the same as) the magnitude of the current flowing through the. Thereby, the influence of the current flowing through the monitor wirings 50 and 51 via the parasitic capacitance can be canceled.

  In the above description, an example in which the fixed potential wiring 40 is provided between the drive wirings 20 and 21 and the monitor wirings 50 and 51 on one side of the vibrating body 112 has been described. On the one side of the body 112, the fixed potential wiring 40 may be provided between the drive wirings 20 and 21 and the detection wirings 30 and 31. According to such a form, it can suppress that an electric current flows into detection wiring 30 and 31 via the parasitic capacitance which generate | occur | produces between drive wiring 20 and 21 and detection wiring 30 and 31. FIG.

2. Next, a method for manufacturing a gyro sensor according to this embodiment will be described with reference to the drawings. 10 to 12 are sectional views schematically showing the manufacturing process of the gyro sensor 100 according to this embodiment, and correspond to FIG.

  As shown in FIG. 10, the recess 14 and the grooves 16, 17, 18, 19 are formed on the first surface 11 of the substrate 10. The concave portion 14 and the groove portions 16, 17, 18, 19 are formed by, for example, a photolithography technique and an etching technique. Thereby, the board | substrate 10 with which the recessed part 14 and the groove parts 16, 17, 18, and 19 are provided in the 1st surface 11 can be prepared.

  As shown in FIG. 11, the detection wirings 30 and 31 are formed on the substrate 10 including the inside of the recess 14, and the first portions 20 a of the wirings 20, 21, 50 and 51 are respectively formed in the groove parts 16, 17, 18 and 19. , 21a, 50a, 51a. The first portions 20a, 21a, 50a, 51a and the detection wirings 30, 31 are formed, for example, by sputtering or CVD (Chemical Vapor Deposition), and then patterned by a photolithography technique and an etching technique. It is formed.

  As shown in FIG. 12, the functional element 102 is formed on the substrate 10. More specifically, the functional element 102 is formed by placing (bonding) a silicon substrate (not shown) on the first surface 11 of the substrate 10, reducing the thickness of the silicon substrate, and then patterning. . The patterning is performed by a photolithography technique and an etching technique. The bonding between the silicon substrate and the substrate 10 is performed by, for example, anodic bonding.

  In the step of forming the functional element 102, a portion (second portion) provided on the first surface 11 of the wirings 20, 21, 50, 51 is formed to form the wirings 20, 21, 50, 51, and further fixed. The potential wiring 40 can be formed.

  As illustrated in FIG. 2, the substrate 10 and the lid body 60 are joined, and the functional element 102 is accommodated in the cavity 62 surrounded by the substrate 10 and the lid body 60. The bonding between the substrate 10 and the lid 60 is performed by, for example, anodic bonding.

  Through the above steps, the gyro sensor 100 can be manufactured.

  According to the manufacturing method of the gyro sensor 100, as described above, it is possible to suppress the current from flowing through the monitor wirings 50 and 51 through the parasitic capacitance generated between the drive wirings 20 and 21 and the monitor wirings 50 and 51. The gyro sensor 100 can be formed.

3. Next, a gyro sensor according to a modification of the present embodiment will be described with reference to the drawings. FIG. 13 is a cross-sectional view schematically showing a gyro sensor 200 according to a modification of the present embodiment, and corresponds to FIG. For convenience, the lid 60 is not shown in FIG. Hereinafter, the gyro sensor 200 will be described with respect to differences from the above-described example of the gyro sensor 100, and description of similar points will be omitted.

  In the gyro sensor 100, the thickness of the fixed potential wiring 40 in the wiring 20, 21, 40, 50, 51 is provided on the + Y direction side of the vibrating body 112 and extends in the X axis direction (see FIG. 1). As shown in FIG. 4, it was larger than the thickness of the drive wirings 20 and 21 and larger than the thickness of the monitor wirings 50 and 51. The drive wirings 20 and 21 and the monitor wirings 50 and 51 shown in FIG. 4 are the first portions 20a, 21a, 50a, and 51a provided in the groove portions 16, 17, 18, and 19, respectively.

  On the other hand, in the gyro sensor 200, the fixed potential wiring 40 in the portions (see FIG. 1) of the wirings 20, 21, 40, 50, 51 provided on the + Y direction side of the vibrating body 112 and extending in the X-axis direction. 13 is the same as the thickness of the drive wirings 20 and 21 and the thickness of the monitor wirings 50 and 51, as shown in FIG. Drive wirings 20 and 21 and monitor wirings 50 and 51 shown in FIG. 13 are second portions 20b, 21b, 50b and 51b provided on the first surface 11 of the substrate 10, respectively. The second portions 20b, 21b, 50b, 51b are made of, for example, the same material (silicon having conductivity) as the fixed potential wiring 40.

  According to the gyro sensor 200, it is possible to suppress the current from flowing through the monitor wirings 50 and 51 through the parasitic capacitance generated between the drive wirings 20 and 21 and the monitor wirings 50 and 51.

4). Next, an electronic device according to the present embodiment will be described with reference to the drawings. The electronic device according to the present embodiment includes the gyro sensor according to the present invention. Hereinafter, an electronic device including the gyro sensor 100 will be described as the gyro sensor according to the present invention.

  FIG. 14 is a perspective view schematically showing a mobile (or notebook) personal computer 1100 as the electronic apparatus according to the present embodiment.

  As shown in FIG. 14, a personal computer 1100 includes a main body portion 1104 having a keyboard 1102 and a display unit 1106 having a display portion 1108. The display unit 1106 has a hinge structure portion with respect to the main body portion 1104. It is supported so that rotation is possible.

  Such a personal computer 1100 has a built-in gyro sensor 100.

  FIG. 15 is a perspective view schematically showing a mobile phone (including PHS) 1200 as the electronic apparatus according to the present embodiment.

  As shown in FIG. 15, the cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. .

  Such a cellular phone 1200 incorporates the gyro sensor 100.

  FIG. 16 is a perspective view schematically showing a digital still camera 1300 as an electronic apparatus according to the present embodiment. In addition, in FIG. 16, the connection with an external apparatus is also shown simply.

  Here, an ordinary camera sensitizes a silver halide photographic film with a light image of a subject, whereas a digital still camera 1300 photoelectrically converts a light image of a subject with an image sensor such as a CCD (Charge Coupled Device). An imaging signal (image signal) is generated.

  A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to display based on an imaging signal from the CCD. The display unit 1310 displays an object as an electronic image. Functions as a viewfinder.

  A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.

  In the digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. A television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication, if necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

  Such a digital still camera 1300 incorporates the gyro sensor 100.

  The electronic devices 1100, 1200, and 1300 as described above can include the gyro sensor 100 that can suppress a current from flowing through the detection wiring via a parasitic capacitance generated between the drive wiring and the monitor wiring.

  Note that the electronic device provided with the gyro sensor 100 includes, for example, an ink jet discharge in addition to the personal computer (mobile personal computer) shown in FIG. 14, the mobile phone shown in FIG. 15, and the digital still camera shown in FIG. Devices (for example, inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, head mounted displays, various navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices , Word processor, workstation, video phone, security TV monitor, electronic binoculars, POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish school Knowledge, various measuring instruments, gages (e.g., vehicles, aircraft, rockets, instruments and a ship), attitude control such as a robot or a human body, can be applied to a flight simulator.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to appropriately combine each embodiment and each modification.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the invention includes a configuration that achieves the same effect as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 10 ... Base | substrate, 11 ... 1st surface, 12 ... 2nd surface, 14 ... Recessed part, 16, 17, 18, 19 ... Groove part, 20 ... Drive wiring, 20a ... 1st part, 20b ... 2nd part, 21 ... Drive Wiring, 21a ... first part, 21b ... second part, 30, 31 ... detection wiring, 40 ... fixed potential wiring, 50 ... monitor wiring, 50a ... first part, 50b ... second part, 51 ... monitor wiring, 51a ... 1st part, 51b ... 2nd part, 60 ... Lid, 62 ... Cavity, 100 ... Gyro sensor, 102 ... Functional element, 106 ... 1st structure, 108 ... 2nd structure, 112 ... Vibrating body, DESCRIPTION OF SYMBOLS 112a ... Vibration body, 112b ... Vibration body, 114 ... 1st spring part, 116 ... Movable drive electrode, 118 ... Movable monitor electrode, 122 ... Displacement part, 122a ... Displacement part, 122b ... Displacement part, 124 ... 2nd spring part 126. Movable detection power , 130, 132 ... fixed drive electrodes, 140, 142 ... fixed detection electrodes, 150 ... fixed parts, 160, 162 ... fixed monitor electrodes, 200 ... gyro sensor, 1100 ... personal computer, 1102 ... keyboard, 1104 ... main body part, 1106 Display unit 1108 Display unit 1200 Mobile phone 1202 Operation button 1204 Earpiece 1206 Speaker 1208 Display unit 1300 Digital still camera 1302 Case 1304 Unit 1306 ... Shutter button, 1308 ... Memory, 1310 ... Display section, 1312 ... Video signal output terminal, 1314 ... Input / output terminal, 1430 ... TV monitor, 1440 ... Personal computer

Claims (8)

A substrate,
A vibrating body,
A fixed drive electrode fixed on the substrate and vibrating the vibrating body;
A fixed vibration detection electrode that is fixed on the substrate and detects a signal that changes according to the vibration of the vibrating body;
A drive wiring provided on the substrate and connected to the fixed drive electrode;
Vibration detection wiring provided on the substrate and connected to the fixed vibration detection electrode;
A fixed potential wiring provided on the substrate and having a predetermined potential;
Including
The fixed potential wiring is provided between the drive wiring and the vibration detection wiring in a plan view ,
The fixed potential wiring is a gyro sensor provided so as to surround the vibrating body in a plan view . Oite to claim 1,
A movable drive electrode extending from the vibrating body and vibrating the vibrating body;
A movable monitor electrode extending from the vibrating body and detecting a vibration state of the vibrating body;
Further including
The fixed drive electrode is provided to face the movable drive electrode,
The gyro sensor, wherein the fixed vibration detection electrode is provided to face the movable monitor electrode. In claim 2 ,
The fixed drive electrode is
Provided on one side of the movable drive electrode and on the other side of the movable drive electrode;
The fixed vibration detection electrode is
Provided on one side of the movable monitor electrode and on the other side of the movable monitor electrode;
The drive wiring is connected to the fixed drive electrode provided on one side of the movable drive electrode,
The other drive wiring is connected to the fixed drive electrode provided on the other side of the movable drive electrode,
The vibration detection wiring is connected to the fixed vibration detection electrode provided on one side of the movable monitor electrode,
The other vibration detection wiring is connected to the fixed vibration detection electrode provided on the other side of the movable monitor electrode,
The crossing area of the drive wiring and the vibration detection wiring and the crossing area of the drive wiring and the other vibration detection wiring are the same,
The area where the other drive wiring and the vibration detection wiring intersect with the area where the other drive wiring and the other vibration detection wiring intersect is the same. A substrate,
A vibrating body,
A fixed drive electrode fixed on the substrate and vibrating the vibrating body;
A fixed vibration detection electrode that is fixed on the substrate and detects a signal that changes according to the vibration of the vibrating body;
A drive wiring provided on the substrate and connected to the fixed drive electrode;
Vibration detection wiring provided on the substrate and connected to the fixed vibration detection electrode;
A fixed potential wiring provided on the substrate and having a predetermined potential;
A movable drive electrode extending from the vibrating body and vibrating the vibrating body;
A movable monitor electrode extending from the vibrating body and detecting a vibration state of the vibrating body;
Including
The fixed potential wiring is provided between the drive wiring and the vibration detection wiring in a plan view ,
The fixed drive electrode is provided to face the movable drive electrode,
The fixed vibration detection electrode is provided to face the movable monitor electrode,
The fixed drive electrode is
Provided on one side of the movable drive electrode and on the other side of the movable drive electrode;
The fixed vibration detection electrode is
Provided on one side of the movable monitor electrode and on the other side of the movable monitor electrode;
The drive wiring is connected to the fixed drive electrode provided on one side of the movable drive electrode,
The other drive wiring is connected to the fixed drive electrode provided on the other side of the movable drive electrode,
The vibration detection wiring is connected to the fixed vibration detection electrode provided on one side of the movable monitor electrode,
The other vibration detection wiring is connected to the fixed vibration detection electrode provided on the other side of the movable monitor electrode,
The crossing area of the drive wiring and the vibration detection wiring and the crossing area of the drive wiring and the other vibration detection wiring are the same,
The area where the other drive wiring and the vibration detection wiring intersect with the area where the other drive wiring and the other vibration detection wiring intersect is the same . In any one of Claims 1 thru | or 4 ,
The fixed vibration detection electrode is
A gyro sensor which is an electrode for detecting a vibration state of the vibrating body. In any one of Claims 1 thru | or 5 ,
The gyro sensor having a thickness of the fixed potential wiring that is equal to or greater than a thickness of the drive wiring and equal to or greater than a thickness of the vibration detection wiring. In any one of Claims 1 thru | or 6 ,
The gyro sensor, wherein the fixed potential wiring is electrically connected to the vibrating body.   An electronic device comprising the gyro sensor according to claim 1.