JP5956113B2 - 球状シリカ粉体の製造方法及び半導体封止材の製造方法 - Google Patents
球状シリカ粉体の製造方法及び半導体封止材の製造方法 Download PDFInfo
- Publication number
- JP5956113B2 JP5956113B2 JP2011071800A JP2011071800A JP5956113B2 JP 5956113 B2 JP5956113 B2 JP 5956113B2 JP 2011071800 A JP2011071800 A JP 2011071800A JP 2011071800 A JP2011071800 A JP 2011071800A JP 5956113 B2 JP5956113 B2 JP 5956113B2
- Authority
- JP
- Japan
- Prior art keywords
- silica powder
- spherical silica
- pulverization
- melt
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims description 131
- 239000000377 silicon dioxide Substances 0.000 title claims description 63
- 239000000843 powder Substances 0.000 title claims description 49
- 238000004519 manufacturing process Methods 0.000 title claims description 29
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 239000008393 encapsulating agent Substances 0.000 title description 3
- 229910052770 Uranium Inorganic materials 0.000 claims description 32
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 claims description 32
- 238000010298 pulverizing process Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 238000005563 spheronization Methods 0.000 claims description 11
- 239000003566 sealing material Substances 0.000 claims description 10
- 239000000155 melt Substances 0.000 claims description 7
- 244000043261 Hevea brasiliensis Species 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- 229920003052 natural elastomer Polymers 0.000 claims description 6
- 229920001194 natural rubber Polymers 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 6
- 239000004575 stone Substances 0.000 claims description 5
- 239000006185 dispersion Substances 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 3
- -1 polyethylene Polymers 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 239000002245 particle Substances 0.000 description 12
- 239000011044 quartzite Substances 0.000 description 10
- 239000012535 impurity Substances 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 7
- 239000002861 polymer material Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 6
- 238000011109 contamination Methods 0.000 description 6
- 239000000806 elastomer Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000006004 Quartz sand Substances 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000011449 brick Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 150000004294 cyclic thioethers Chemical class 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000002921 oxetanes Chemical class 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 150000004873 thianes Chemical class 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- ZXHDVRATSGZISC-UHFFFAOYSA-N 1,2-bis(ethenoxy)ethane Chemical compound C=COCCOC=C ZXHDVRATSGZISC-UHFFFAOYSA-N 0.000 description 1
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- AUAGGMPIKOZAJZ-UHFFFAOYSA-N 1,3,6-trioxocane Chemical compound C1COCOCCO1 AUAGGMPIKOZAJZ-UHFFFAOYSA-N 0.000 description 1
- SDRZFSPCVYEJTP-UHFFFAOYSA-N 1-ethenylcyclohexene Chemical compound C=CC1=CCCCC1 SDRZFSPCVYEJTP-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- CXURGFRDGROIKG-UHFFFAOYSA-N 3,3-bis(chloromethyl)oxetane Chemical compound ClCC1(CCl)COC1 CXURGFRDGROIKG-UHFFFAOYSA-N 0.000 description 1
- RVGLUKRYMXEQAH-UHFFFAOYSA-N 3,3-dimethyloxetane Chemical compound CC1(C)COC1 RVGLUKRYMXEQAH-UHFFFAOYSA-N 0.000 description 1
- RPRIYERFOHERFT-UHFFFAOYSA-N 3,3-dimethylthietane Chemical class CC1(C)CSC1 RPRIYERFOHERFT-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical class [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- VEZXCJBBBCKRPI-UHFFFAOYSA-N beta-propiolactone Chemical compound O=C1CCO1 VEZXCJBBBCKRPI-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- 239000006072 paste Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 229960000380 propiolactone Drugs 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- VOVUARRWDCVURC-UHFFFAOYSA-N thiirane Chemical compound C1CS1 VOVUARRWDCVURC-UHFFFAOYSA-N 0.000 description 1
- 150000003553 thiiranes Chemical class 0.000 description 1
- 150000003572 thiolanes Chemical class 0.000 description 1
- 229960000834 vinyl ether Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Processes Of Treating Macromolecular Substances (AREA)
- Silicon Compounds (AREA)
Description
・比較例:実施例と同じ石英砂100kgを300Lボールミル(中央化工機製、型番:MB−300)にて20kg/時間の処理速度で粉砕した。粉砕終了後、体積平均粒径5μmのシリカ粉体が得られた。得られたシリカ粉体中のウラン濃度は100ppbであった。
・以上の結果から明らかなように、本実施例の製造方法にて調製された球状シリカ粉体は比較例の製造方法にて調製した球状シリカ粉体と比べてウラン濃度を低く保つことができた。これは、粉砕装置からの摩耗物由来の夾雑物の混入を効果的に防ぐことができたことが要因であると考えられる。
Claims (4)
- ウラン含有量が所定値以下のケイ石破砕物を高速流体中にて互いに衝突させて粉砕し粉砕物にする粉砕工程と、
該粉砕物を火炎中に投入して溶融球状化する溶融球状化工程と、
を有し、
前記粉砕工程は天然ゴムにてライニングされた粉砕容器中にて行われ、
前記粉砕工程にて混入した前記天然ゴムは前記溶融球状化工程で酸化・飛散させる球状シリカ粉体の製造方法。 - 前記溶融球状化工程に供するために、0.1μm〜50μmから選択される所定粒径になった粉砕物を分離する分級操作も行う請求項1に記載の球状シリカ粉体の製造方法。
- 前記所定値は1ppbである請求項1又は2に記載の球状シリカ粉体の製造方法。
- 請求項1〜3の何れかに記載の前記粉砕工程と前記溶融球状化工程に続いて、球状シリカ粉体を分散用樹脂組成物中に分散する工程を有する半導体封止材の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011071800A JP5956113B2 (ja) | 2011-03-29 | 2011-03-29 | 球状シリカ粉体の製造方法及び半導体封止材の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011071800A JP5956113B2 (ja) | 2011-03-29 | 2011-03-29 | 球状シリカ粉体の製造方法及び半導体封止材の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012206870A JP2012206870A (ja) | 2012-10-25 |
JP5956113B2 true JP5956113B2 (ja) | 2016-07-20 |
Family
ID=47186959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011071800A Active JP5956113B2 (ja) | 2011-03-29 | 2011-03-29 | 球状シリカ粉体の製造方法及び半導体封止材の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5956113B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102653644B1 (ko) * | 2019-03-12 | 2024-04-01 | 제지앙 써드 에이지 매터리얼 테크놀로지 컴퍼니., 리미티드 | 구형 실리카 파우더 필러의 제조 방법, 이로부터 획득된 구형 실리카 파우더 필러 및 그 응용 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5030433A (en) * | 1988-07-18 | 1991-07-09 | International Minerals & Chemical Corp. | Process for producing pure and dense amorphous synthetic silica particles |
US5028407A (en) * | 1990-01-25 | 1991-07-02 | International Minerals & Chemical Corp. | Method of production of high purity fusible silica |
JPH1121432A (ja) * | 1997-06-30 | 1999-01-26 | Nippon Shiyaauin Uiriamuzu Kk | 半導体封止材 |
JP2007176738A (ja) * | 2005-12-28 | 2007-07-12 | Asahi Glass Si-Tech Co Ltd | 安定化された表面処理葉状シリカ2次粒子粉末及びその製造方法 |
JP5094184B2 (ja) * | 2007-03-30 | 2012-12-12 | 株式会社アドマテックス | 金属ケイ素粉末及びその製造方法、球状シリカ粉末並びに樹脂組成物 |
US20110300384A1 (en) * | 2008-12-22 | 2011-12-08 | Denki Kagaku Kogyo Kabushiki Kaisha | Powder, method for producing same, and resin composition containing same |
-
2011
- 2011-03-29 JP JP2011071800A patent/JP5956113B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2012206870A (ja) | 2012-10-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI639556B (zh) | 粉碎二氧化矽粒子之製造方法及含有該粒子之樹脂組成物 | |
CN104221140B (zh) | 树脂组合物和半导体装置 | |
CN1827689A (zh) | 聚亚芳基醚酮粉末、含有它们的模塑品以及其制备方法 | |
KR101256299B1 (ko) | 비정질 실리카질 분말, 그의 제조 방법 및 용도 | |
CN103937294B (zh) | 一种高密度集成电路封装用硅微粉的制备方法 | |
US10364152B2 (en) | Particle production apparatus, particle production method and method for producing semiconductor encapsulating resin composition | |
JP5956113B2 (ja) | 球状シリカ粉体の製造方法及び半導体封止材の製造方法 | |
JP5090404B2 (ja) | 光半導体封止用樹脂タブレットの製法およびそれによって得られる光半導体封止用樹脂タブレット、並びにそれを用いた光半導体装置 | |
TWI457282B (zh) | 非晶質矽石質粉末、其製造方法、樹脂組成物、及半導體封止材 | |
CN108296490A (zh) | 一种球形钨钽合金粉的制造方法 | |
TWI551352B (zh) | 半導體密封用樹脂組成物之製造方法及粉碎裝置 | |
CN103374241A (zh) | 粉体改性一体化生产工艺 | |
JP2019112283A (ja) | ガラスフィラーの製造方法 | |
JP5580513B2 (ja) | 球状無機物粉体の製造方法及び球状無機物粉体製造装置並びに樹脂組成物の製造方法 | |
JPWO2017014067A1 (ja) | ガラス充填材及びそれを用いた立体造形用樹脂組成物 | |
JP5094184B2 (ja) | 金属ケイ素粉末及びその製造方法、球状シリカ粉末並びに樹脂組成物 | |
JP4569296B2 (ja) | 半導体封止用樹脂タブレットの製造方法および樹脂成形体の製造方法 | |
JP5108607B2 (ja) | 球状シリカの製造方法及び樹脂組成物の製造方法 | |
JP5725667B2 (ja) | 球状無機物粉体の製造方法及び球状無機物粉体製造装置並びに樹脂組成物の製造方法 | |
JP5544205B2 (ja) | 球状シリカ粒子の製造方法 | |
JPS6243452B2 (ja) | ||
KR20170003379A (ko) | 과립상 반도체 소자 봉지용 에폭시 수지 조성물 및 이를 사용하여 봉지된 반도체 소자 | |
KR20230150345A (ko) | 이산화규소 분말 | |
JP2000271929A (ja) | 粒状封止材料の製造方法 | |
JPH03257009A (ja) | シリカ系フィラー |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140114 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140421 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140513 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140711 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140911 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141105 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20150217 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150515 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20150520 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20150626 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160414 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160616 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5956113 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |