JP5955410B2 - Wafer handling tray - Google Patents

Description

  The present invention relates to a wafer handling tray, and more particularly to an extremely thin wafer handling tray for transporting a semiconductor wafer in a state where the extremely thin semiconductor wafer is not in contact with outside air.

  In order to cope with the higher density of semiconductor elements, product development for substantially realizing three-dimensional wiring by stacking semiconductor wafers is being carried out in parallel with thinning of wiring patterns in semiconductor wafers. As a specific method of three-dimensional wiring, after grinding the back surface of the wafer on which the elements are formed to make the semiconductor wafer ultra-thin, the wafers are stacked and wire bonding is performed between the stacked wafers or via holes are formed. A so-called TSV (Through Silicon Via) technique for connecting these via holes after laminating the elements having formed thereon is used.

  As a method of handling such an ultra-thin semiconductor wafer, the semiconductor wafer is attached to a film (dicing film, etc.) attached to a so-called film frame (dicing frame, etc.), and the entire film frame is handled, or an expansion ring is used. A method is generally used in which a semiconductor wafer is mounted on an expansion ring film and handled (see Patent Document 2 and Patent Document 3). In addition, a handling tray that is conscious of handling and transporting an extremely thin wafer has been proposed (see Patent Document 1).

JP 2007-103454 A JP 2012-119437 A JP 2012-114265 A

  However, the film frame itself does not have a mechanical interface. For this reason, it was difficult to handle the film frame and the semiconductor wafer in a clean state by a mechanical device.

  In the conventional method of handling an extremely thin semiconductor wafer using a film frame, the semiconductor wafer is held together with the dicing frame so as to be sandwiched between one handling tray and another handling tray. For this reason, it is necessary to make the handling tray larger than the dicing frame.

  And since the coupling member for fixing one handling tray to another handling tray must be provided in a handling tray, it is necessary to ensure further the space which provides a coupling member in a handling tray. For this reason, it has been difficult to reduce the size of the handling tray.

  An object of the present invention is to provide a wafer handling tray that can be handled by a mechanical device, can keep the size of the handling tray small, and can hold a semiconductor wafer in a sealed state.

  The present invention is a wafer handling tray having a flat plate-like main body portion having a front surface and a back surface, and a thin film frame on which a thin film to which a semiconductor wafer is attached is fixed on the front surface of the main body portion. A wafer handling tray for holding the thin film frame between one wafer handling tray and another wafer handling tray, the wafer handling tray being disposed at a peripheral portion of the main body portion, and the main body portion of the other wafer handling tray A coupling portion coupled to the main body portion, disposed on a surface of the main body portion, a position direction determining portion for positioning and directional determination of the thin film frame on the surface, and disposed on a back surface of the main body portion, A seal having an annular seal member capable of contacting the thin film frame placed on another wafer handling tray And at least one end portion and the other end portion of the main body portion in a direction parallel to the surface of the main body portion, and a pair of first portions provided on the processing arm of the external machine device can be respectively engaged. An engagement portion, and the seal member abuts on the thin film frame so as to surround the periphery of the semiconductor wafer attached to the thin film frame placed on another wafer handling tray. A sealed space for accommodating the semiconductor wafer is formed by the tray, the other wafer handling tray, the seal portion, and the thin film, and the engaging portions engage with the pair of first portions of the processing arm, respectively. The wafer handling handle having a first position restricting engagement portion that restricts the position of the main body portion in the direction connecting the front surface and the back surface of the main body portion. Lee about.

  Further, the first position restriction engaging portion is a pair of opposed surfaces with which the first portion of the processing arm can come into contact, and is a direction away from the main body portion in a direction parallel to the surface of the main body portion. It is preferable to have a pair of first opposing surfaces that approach each other in the direction connecting the front surface and the back surface of the main body portion.

  Further, the engaging portion engages with a pair of second portions of the processing arm, so that the engaging portion is in a direction parallel to the surface of the main body and in a direction intersecting with a direction away from the main body. It is preferable to have the 2nd position control engagement part in which the position of a main-body part is controlled.

  Further, the second position restriction engaging portion is a pair of opposed surfaces with which the second portion of the processing arm can come into contact, and is directed away from the main body portion in a direction parallel to the surface of the main body portion. Accordingly, it is preferable to have a pair of second opposing surfaces that are separated from each other in a direction parallel to the surface of the main body.

  In addition, the coupling portion has a hook disposed on the front surface of the main body portion and a hook locking portion disposed on the back surface of the main body portion and engaged with the hook, or on the back surface of the main body portion. A hook engaging portion that is disposed on the surface of the main body portion and is engaged with the hook, the hook engaging portion is elastically deformable, and the hook engaging portion includes: The third portion of the processing arm can be contacted, and the hook locking portion can be elastically deformed, whereby the hook can be locked to the hook locking portion, and the hook locking portion can be the processing arm. It is preferable that the hook locking portion is elastically deformed by being pushed by the third portion, and the locking of the hook to the hook locking portion is released.

  Moreover, it is preferable that the said main-body part and the said sealing member are comprised by the conductive resin containing a conductive particle or a conductive resin component.

  ADVANTAGE OF THE INVENTION According to this invention, the wafer handling tray which can be handled with a mechanical apparatus, can suppress the dimension of a handling tray small, and can hold | maintain a semiconductor wafer in a sealing state can be provided.

It is sectional drawing which shows a mode that the semiconductor wafer W is hold | maintained so that it may be pinched | interposed by the wafer handling tray 1 which concerns on 1st Embodiment. It is sectional drawing which shows a mode that the wafer handling trays 1 which concern on 1st Embodiment are spaced apart. It is an expanded sectional view showing signs that semiconductor wafer W is held so that it may be pinched by wafer handling tray 1 concerning a 1st embodiment. It is an expanded sectional view showing signs that wafer handling trays 1 concerning a 1st embodiment are separated. It is an expanded sectional view showing signs that hooks 26 of wafer handling tray 1 concerning a 1st embodiment are locked to hook locking part 45. It is an expanded sectional view showing signs that hook 26 of wafer handling tray 1 concerning a 1st embodiment has stopped latching from hook latching part 45. It is an expanded sectional view which shows a mode that the dicing frame 2 is mounted in the wafer handling tray 1 which concerns on 1st Embodiment. It is a top view which shows the surface 20 of the wafer handling tray 1 which concerns on 1st Embodiment. It is a bottom view which shows the back surface 40 of the wafer handling tray 1 which concerns on 1st Embodiment. It is a top view which shows the dicing frame 2 mounted in the wafer handling tray 1 which concerns on 1st Embodiment. It is a top view which shows a mode that the dicing frame 2 is mounted in the wafer handling tray 1 which concerns on 1st Embodiment. It is an expanded sectional view showing a pair of 1st countering faces 111 of wafer handling tray 1 concerning a 1st embodiment. It is a top view showing surface 20A of wafer handling tray 1A concerning a 2nd embodiment. It is a top view which shows a mode that the dicing frame 2 is mounted in the wafer handling tray 1A which concerns on 2nd Embodiment. It is a bottom view showing back 40A of wafer handling tray 1A concerning a 2nd embodiment.

Hereinafter, a wafer handling tray according to a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1A is a cross-sectional view illustrating a state in which a semiconductor wafer W is held by a wafer handling tray 1 according to the first embodiment. FIG. 1B is a cross-sectional view illustrating a state in which the wafer handling trays 1 according to the first embodiment are separated from each other. FIG. 2A is an enlarged cross-sectional view showing a state in which the semiconductor wafer W is held by the wafer handling tray 1 according to the first embodiment.

  FIG. 2B is an enlarged cross-sectional view illustrating a state where the wafer handling trays 1 according to the first embodiment are separated from each other. FIG. 3A is an enlarged cross-sectional view showing a state where the hook 26 of the wafer handling tray 1 according to the first embodiment is locked to the hook locking portion 45. FIG. 3B is an enlarged cross-sectional view showing a state where the hook 26 of the wafer handling tray 1 according to the first embodiment is unlocked from the hook locking portion 45. FIG. 4 is an enlarged cross-sectional view showing a state where the dicing frame 2 is placed on the wafer handling tray 1 according to the first embodiment. FIG. 5 is a plan view showing the surface 20 of the wafer handling tray 1 according to the first embodiment.

  FIG. 6 is a bottom view showing the back surface 40 of the wafer handling tray 1 according to the first embodiment. FIG. 7 is a plan view showing the dicing frame 2 placed on the wafer handling tray 1 according to the first embodiment. FIG. 8 is a plan view showing a state in which the dicing frame 2 is placed on the wafer handling tray 1 according to the first embodiment.

  Here, for convenience of explanation, a direction from the rear end portion 12 of the main body 10 described later toward the front end portion 11 (direction from the top to the bottom in FIG. 5) is defined as the front direction D11, and the opposite direction is the rear direction. These are defined as D12, and these are defined as the front-rear direction D1. Further, a direction (upward direction in FIG. 1A) from the back surface 40 to the front surface 20 of the main body 10 described later is defined as an upward direction D21, the opposite direction is defined as a downward direction D22, and these are defined as a vertical direction D2. To do. Further, a direction from the right end portion 14 to the left end portion 13 of the main body 10 described later (direction from right to left in FIG. 5) is defined as a left direction D31, and the opposite direction is defined as a right direction D32. Is defined as the left-right direction D3. 1A, FIG. 1B, FIG. 2A, FIG. 2B, and FIG. 4 are sectional views viewed from the direction of the arrow A in FIG. 5, and FIG. 3A and FIG. 3B are the directions of the arrow A in FIG. Therefore, the arrows indicating the left-right direction D3 and the front-rear direction D1 are omitted.

  Moreover, the semiconductor wafer W (refer FIG. 4 etc.) hold | maintained at the wafer handling tray 1 is a disk-shaped silicon wafer, a glass wafer, a sapphire wafer etc., and is an extremely thin thing used for industry. The thickness of the semiconductor wafer W is about 0.02 mm to 0.3 mm, typically about 0.05 mm to 0.15 mm, if it is a silicon wafer alone. In the case of a glass wafer or a sapphire wafer, the thickness of the semiconductor wafer W is about 0.3 mm to 0.9 mm, and typically about 0.4 mm to 0.7 mm.

  As shown in FIG. 7, the dicing frame 2 as a thin film frame placed on the wafer handling tray 1 has a flat plate-like ring made of SUS steel. The front end 2A and the rear end 2B of the dicing frame 2 have parallel straight lines extending in the left-right direction D3. Further, the left end portion 2C and the right end portion 2D of the dicing frame 2 have parallel straight lines extending in the front-rear direction D1. A first notch portion 2E that is notched in a substantially V shape is formed at a position near the right end in the linear portion of the rear end portion 2B of the dicing frame 2.

  At a position near the left end in the linear portion of the rear end portion 2B of the dicing frame 2, a second cutout portion 2F cut out in a substantially V shape is formed. As shown in FIG. 2A and the like, the upper surface of the dicing frame 2 has a frame inclined surface 2G in which the thickness in the vertical direction D2 of the dicing frame 2 decreases toward the center of the dicing frame 2.

The wafer handling tray 1 is handled by a processing arm (not shown) of an external machine device (not shown). The processing arm has a first part (not shown), a second part (not shown), and a third part (not shown), and the first to third parts are separately independent. It may be configured to operate as a single unit, or may be configured integrally.
Specifically, the processing arm of the external mechanical device (not shown) includes two pairs of first parts (not shown) in which a groove having a V-shaped cross section is formed at the tip. Further, the processing arm of the external mechanical device (not shown) includes a pair of second parts (not shown) having a tip portion protruding in a V-shaped cross section. Further, the processing arm of the external mechanical device (not shown) has an elongated third portion.

  As shown in FIGS. 5 and 6, the wafer handling tray 1 includes a flat plate-like and annular main body 10 having a front surface 20 and a back surface 40. The main body 10 is made of a conductive resin containing conductive particles and is extremely thin. The thickness of the main body 10 is typically about 1 mm to 4 mm, but is about 0.5 mm to 5 mm when a molding material, a rib structure, a shrinkage structure, or the like is devised. On the surface 20 of the main body 10, the dicing frame 2 to which the film F to which the semiconductor wafer W is attached is fixed can be placed.

  The front end portion 11 and the rear end portion 12 of the main body portion 10 as the engaging portion have parallel straight lines extending in the left-right direction D3, and at least the main body portion 10 in a direction parallel to the surface 20 of the main body portion 10. It is located at one end and the other end, respectively. The left end portion 13 and the right end portion 14 of the main body portion 10 as the engaging portion have parallel straight lines extending in the front-rear direction D1. As shown in FIG. 9, the linear portion of the front end portion 11 of the main body portion 10 has a pair of first opposing surfaces 111 as engaging portions each having a flat surface. The rear end portion 12, the left end portion 13, and the right end portion 14 of the main body 10 also have a pair of first opposing surfaces similar to the front end portion 11, but have the same shape as the pair of first opposing surfaces 111. Therefore, only the pair of first opposing surfaces 111 will be described.

  The pair of first opposing surfaces 111 are in a direction parallel to the front surface 20 of the main body 10 and in a direction away from the main body 10 (the left direction in FIG. 9). Are configured so as to approach each other in a direction (vertical direction in FIG. 9). Accordingly, the pair of first opposing surfaces 111 form a convex portion having a V-shaped cross section. A first part (not shown) of the processing arm of the external machine device can come into contact with the pair of first opposing surfaces 111, and the first part (not shown) of the processing arm comes into contact with the pair of first opposing surfaces 111 in this way. Thus, the first portion (not shown) of the processing arm can be engaged with the V-shaped convex portion as the engaging portion. By this engagement, the main body 10 is positioned in the vertical direction D2.

  As shown in FIG. 5 etc., the center part of the left-right direction D3 in the front-end part 11 of the main-body part 10 has a pair of 2nd opposing surface 112 as a 2nd position regulation engaging part which consists of a plane, respectively. Similarly, the central portion in the left-right direction D3 at the rear end portion 12 of the main body portion 10 has a pair of second opposing surfaces 122 as second position restriction engaging portions each formed of a flat surface. The pair of second opposing surfaces 112 and 122 are configured to be separated from each other as they go in a direction parallel to the surface 20 of the main body 10 and away from the main body 10. Accordingly, a V-shaped groove is formed by the pair of second opposing surfaces 112 and 122.

  A second part (not shown) of the processing arm of the external machine device can come into contact with the pair of second opposing surfaces 112 and 122, and the processing arm comes into contact with the position restricting engagement part. A second portion (not shown) of the processing arm can be engaged with the V-shaped groove. By this engagement, the position of the main body portion 10 is regulated in a direction parallel to the surface 20 of the main body portion 10 and intersecting with a direction away from the main body portion 10, specifically, in the left-right direction D3.

  As shown in FIG. 2A and the like, the surface 20 of the main body 10 and the periphery of the surface inner periphery forming portion 21 that forms the inner periphery has a surface upper step portion 22 that is one step higher. The periphery of the upper surface step portion 22 has a lower surface outer peripheral portion 23 that is one step lower than the upper surface step portion 22.

  As shown in FIG. 5, a protrusion 24 as a position direction determining portion that protrudes upward is located at a position near the right end of the linear portion of the rear end portion 12 of the main body portion 10 in the lower surface outer peripheral portion 23. Is provided. Similarly, on the surface 20 of the main body 10, a protrusion as a position direction determining portion protruding upward at a position near the left end and a position near the right end of the linear portion of the front end 11 of the main body 10. 25 are provided.

  Moreover, it is the surface outer periphery low part 23, Comprising: The front part of the main-body part 10, the left front part, the right rear part, and the left rear part comprise a coupling part, and a pair of hook 26 which mutually opposes is provided. As shown in FIG. 5, the pair of hooks 26 are arranged so that the tip portions of the hooks 26 face each other in a direction orthogonal to the radial direction of the main body 10 (see FIGS. 3A, 5, etc.). Moreover, as shown to FIG. 3B etc., the front-end | tip of a pair of hook 26 is mutually spaced apart.

  As shown in FIG. 2A and the like, the back surface 40 of the main body 10 and the periphery of the back surface inner periphery forming portion 41 that forms the inner periphery have a back surface upper step portion 42 that is one step higher. The periphery of the back upper step 42 has a back outer periphery lower portion 43 that is one step lower than the back upper step 42.

  A seal portion 44 is provided at the radially inner end of the main body portion 10 in the upper back surface portion 42. As shown in FIG. 6, the seal portion 44 has a seal annular portion 441 (see FIG. 2A and the like) having an annular shape arranged in a coaxial positional relationship with the main body portion 10. The seal annular portion 441 extends downward from the back upper step portion 42. The seal annular portion 441 is made of a conductive resin containing conductive particles. A seal member 442 is fixed to the extended end portion of the seal annular portion 441.

  The seal member 442 is made of a material such as rubber that has a large elastic deformation and is in close contact with the upper surface of the dicing frame 2 serving as an abutment surface, or is one when a predetermined force is applied. It is configured by a lip shape that can be deformed so as to be in close contact with and in contact with the upper surface of the dicing frame 2 serving as a contact surface. In the present embodiment, the seal member 442 is constituted by those having both functions. That is, any structure may be used as long as the distance between the upper surface of the dicing frame 2 serving as the opposing surface and the lower end of the seal annular portion 441 is not more than a predetermined dimension and is in close contact with each other.

  The cross section of the seal member 442 has an inverted Ω shape, and a round portion of the inverted Ω shape is shown in FIG. 2A and the like. The seal member 442 has an annular shape as a whole, and is fixed over the entire circumference of the extended end portion of the seal annular portion 441. The seal portion 44 can abut on the dicing frame 2 placed on another wafer handling tray 1.

  As shown in FIG. 6, a hook locking portion 45 that constitutes a coupling portion is provided in a part of the back surface outer peripheral low portion 43 and on the right front portion, left front portion, right rear portion, and left rear portion of the main body portion 10. It has been. As shown in FIG. 2A, the hook locking portion 45 extends downward from the upper back surface step portion 42. The hook locking portion 45 has a hook contact portion 452 extending outward in the radial direction of the main body portion 10. Furthermore, the hook locking portion 45 has an extending portion 453 that extends outward from the hook contact portion 452 in the radial direction of the main body portion 10 and has a narrow width in a direction orthogonal to the radial direction of the main body portion 10. A protruding semicircular portion 454 that protrudes downward in a substantially semicircular shape is provided at the lower end of the extending end portion of the extending portion 453.

  As shown in FIG. 2A, the end portion of the hook contact portion 452 in the extending direction of the extension portion 453, that is, the left end portion of the hook contact portion 452 in FIG. It has an inclined surface (an inclined surface inclined from upper left to lower right in FIG. 2A) that is inclined so as to approach the axis.

Next, an operation for holding the semiconductor wafer W by bonding the wafer handling trays 1 to each other will be described.
First, as shown in FIGS. 1A, 1B, and 4, a film F as a thin film composed of a UV cured film is attached to the lower surface of the dicing frame 2 shown in FIG. Specifically, the film F is attached to one surface on the lower surface of the dicing frame 2 and forming the inner peripheral edge, and the film F is fixed to the dicing frame 2. Therefore, the central opening of the annular dicing frame 2 is closed by the film F.

  Next, a circular semiconductor wafer W smaller than the central opening of the dicing frame 2 is attached to the upper surface of the film F. At this time, the positional relationship is such that the center of the dicing frame 2 and the center of the semiconductor wafer W coincide.

  Next, the dicing frame 2 to which the semiconductor wafer W is bonded in this way is placed on the surface 20 of the wafer handling tray 1 as shown in FIG. At this time, the positional relationship is such that the center of the dicing frame 2 and the center of the wafer handling tray 1 coincide. Further, the protrusion 24 is engaged with the first notch 2E of the dicing frame 2, and the protrusion 25, 25 has a right front edge of the dicing frame 2, a left front edge of the dicing frame 2, and Are in contact with each other. Thereby, not only the positioning of the dicing frame 2 on the surface 20 of the main body 10, but also the orientation of the dicing frame 2 on the surface 20 of the main body 10 is determined.

  Next, the wafer handling tray 1 is sandwiched by the two pairs of first parts (not shown) of the processing arms (not shown) of the external machine device, and positioning is performed in the vertical direction D2. The first part of the processing arm approaches the pair of first opposing surfaces 111 (see FIG. 9) of the front end portion 11 of the main body portion 10 from the front, and contacts the pair of first opposing surfaces 111 of the front end portion 11. .

  The first portion (not shown) engages with a V-shaped convex portion formed by the pair of first opposing surfaces 111 of the front end portion 11. Similarly, the first part approaches the rear end 12, the left end 13, and the right end 14 of the main body 10 from the rear, left, and right, respectively. Engage with the end 12, the left end 13, and the right end 14. Finally, the tips of the V-shaped projections formed by the pair of first opposing surfaces 111 are engaged with the center of the V-shaped groove of the first part in the up-down direction D2, so that the wafer handling tray 1 is positioned in the vertical direction D2.

  Simultaneously with the positioning in the vertical direction D2 of the wafer handling tray 1, the positioning in the vertical direction D2 of the wafer handling tray 1 in the horizontal direction D3 is performed. A second portion (not shown) of the processing arm approaches the pair of second opposing surfaces 112 of the front end portion 11 from the front and contacts the pair of second opposing surfaces 112 of the front end portion 11. Further, the second portion approaches the pair of second opposing surfaces 122 of the rear end portion 12 from behind, and comes into contact with the pair of second opposing surfaces 122 of the rear end portion 12. Finally, the second portion of the processing arm of the external machine (not shown) is engaged with the center of the V-shaped groove in the left-right direction D3, thereby positioning the wafer handling tray 1 in the left-right direction D3. The

  Next, the other wafer handling tray 1 is brought close to the wafer handling tray 1 on which the dicing frame 2 is placed in a positional relationship that coincides in plan view by another external mechanical device. Then, another wafer handling tray 1 is pressed in the direction of the wafer handling tray 1 on which the dicing frame 2 is placed.

  As a result, the hook latching portion 45 of the upper wafer handling tray 1 is elastically deformed, and the hook contact portion 452 of the hook latching portion 45 enters between the pair of hooks 26 of the lower wafer handling tray 1. The hook 26 of the upper wafer handling tray 1 is locked to the hook locking portion 45 of the upper wafer handling tray 1. That is, the main body portion 10 of the upper wafer handling tray 1 is connected to the main body portion 10 of the lower wafer handling tray 1 by the hook 26 and the hook engaging portion 45 as the connecting portion.

  At this time, as shown in FIG. 3A, the lower end of the protruding semicircular portion 454 of the upper wafer handling tray 1 abuts on the upper surface of the lower wafer handling tray 1 and presses the extending portion 453 upward. As a result, the hook contact portion 452 is pushed upward and comes into strong contact with the hook 26. Thereby, the latching of the hook 26 to the hook latching portion 45 is further strengthened.

  Further, when another wafer handling tray 1 is pressed in the direction of the wafer handling tray 1 on which the dicing frame 2 is placed, the seal of the seal portion 44 of the upper wafer handling tray 1 as shown in FIG. 2A and the like. The member 442 contacts the upper surface of the dicing frame 2. At this time, the seal member 442 of the seal portion 44 contacts the dicing frame 2 so as to surround the periphery of the semiconductor wafer W attached to the dicing frame 2 placed on the lower wafer handling tray 1 in plan view. It will be in contact.

  Thereby, the upper wafer handling tray 1, the lower wafer handling tray 1, the seal portion 44, and the film F form a sealed space in which the semiconductor wafer W is accommodated. That is, one wafer handling tray 1 and another wafer handling tray 1 hold the dicing frame 2 as a thin film frame so as to hold the semiconductor wafer W in the sealed space.

  In this manner, the wafer handling tray 1 is accommodated in a bag or the like and transported in a state where the semiconductor wafer W is accommodated in the sealed space.

  When taking out the semiconductor wafer W accommodated in the sealed space, a processing arm of an external mechanical device (not shown) is used. With the tip of the third part (not shown) of the processing arm, the extension part 453 of the hook locking part 45 is opposite to the direction in which the extension part 453 of the hook locking part 45 extends (FIG. 2A). To the right). Then, the hook locking part 45 is elastically deformed, and the locking of the hook 26 to the hook contact part 452 is released. Thereby, as shown in FIG. 2B and the like, the coupling between the upper wafer handling tray 1 and the lower wafer handling tray 1 is released.

  Next, the film F is irradiated with ultraviolet rays. Thereby, the adhesive force of the film F falls and the semiconductor wafer W adhering to the film F is peeled from the film F.

According to the wafer handling tray 1 according to the first embodiment having the above configuration, the following effects can be obtained.
The wafer handling tray 1 is disposed on the back surface 40 of the main body 10 and includes a seal portion 44 having an annular seal member 442 that can come into contact with a dicing frame 2 as a thin film frame placed on another wafer handling tray 1. Have. The seal member 442 abuts the dicing frame 2 so as to surround the periphery of the semiconductor wafer W attached to the dicing frame 2 placed on the other wafer handling tray 1, so that one wafer handling tray 1 and the other The wafer handling tray 1, the seal portion 44, and the film F as a thin film form a sealed space that accommodates the semiconductor wafer W.

  For this reason, since the semiconductor wafer W can be transported in a state accommodated in the sealed space, the semiconductor wafer W can be prevented from being contaminated by particles, contaminants, or the like contained in the outside air. As a result, a higher quality product can be manufactured from the semiconductor wafer W, the yield can be improved, and the manufacturing cost can be reduced.

  Moreover, since the conventionally used dicing frame 2 can be used, new investment can be minimized.

  Further, since the seal member 442 contacts the dicing frame 2, it is not necessary to dispose the seal member 442 outside the peripheral edge of the dicing frame 2, the size of the main body portion 10 can be suppressed, and the size can be reduced. Can do.

  Further, the front end portion 11, the rear end portion 12, the left end portion 13, and the right end portion 14 as the engagement portions have a first position restriction engagement portion, and the first position restriction engagement portion is a processing arm. The first portion of the body portion 10 is a pair of opposed surfaces that can contact the front surface 20 and the back surface 40 of the main body portion 10 in a direction parallel to the front surface 20 of the main body portion 10 and away from the main body portion 10. It has a pair of 1st opposing surface 111 which mutually approaches in the direction to tie.

  For this reason, the front-end part 11, the rear-end part 12, the left-end part 13, and the right-end part 14 as an engaging part can be made into a mechanical interface. That is, by engaging the pair of first portions of the processing arm with the front end portion 11, the rear end portion 12, the left end portion 13, and the right end portion 14 as the engaging portions, The wafer handling tray 1 can be mechanically handled by restricting the position of the main body 10 in the direction connecting the back surface 40. As a result, the wafer handling tray 1 can be handled safely and at high speed by an external machine device, and contamination or failure of the semiconductor wafer W due to human intervention can be minimized.

  Further, the front end portion 11, the rear end portion 12, the left end portion 13, and the right end portion 14 as the engagement portions have second position restriction engagement portions, and the second position restriction engagement portion is a processing arm. In the direction parallel to the surface 20 of the main body 10 as it goes away from the main body 10 in the direction parallel to the surface 20 of the main body 10. It has a pair of 2nd opposing surfaces 112 and 122 which mutually space apart. For this reason, it is possible to regulate the position of the main body 10 in a direction parallel to the surface 20 of the main body 10 and intersecting the direction away from the main body 10. Thereby, the wafer handling tray 1 can be mechanically handled more smoothly.

  The coupling portion includes a hook 26 and a hook locking portion 45. The hook locking portion 45 can be elastically deformed, and the third portion of the processing arm can contact the hook locking portion 45. It is. For this reason, the hook 26 can be locked to the hook locking portion 45 by elastically deforming the hook locking portion 45. Further, when the hook locking portion 45 is pushed by the third portion of the processing arm, the hook locking portion 45 is elastically deformed, and the hook 26 can be released from the hook locking portion 45. Accordingly, since one wafer handling tray 1 and another wafer handling tray 1 can be coupled or released by a simple operation, mechanical handling can be facilitated.

  In addition, since the main body 10 and the seal member 442 are made of a conductive resin containing conductive particles, static charge on the semiconductor wafer W can be suppressed. As a result, contamination by particles in the semiconductor wafer W can be reduced.

  Further, since the pair of hooks 26 are disposed so that the tip ends of the hooks 26 face each other in the direction orthogonal to the radial direction of the main body 10, the hook locking portion 45 extends at the third portion of the processing arm. It is possible to prevent the main body 10 from rotating about the axis of the main body 10 when the exit portion 453 is pressed.

  Further, since the wafer handling tray 1 includes the annular main body 10 having the front surface 20 and the back surface 40, the wafer handling tray 1 can be configured with a minimum necessary material.

  Next, a wafer handling tray according to a second embodiment of the present invention will be described with reference to FIGS. The wafer handling tray 1A according to the second embodiment includes a point that the main body 10A has a substantially square shape, a point in which the front ends of the pair of hooks 26A face in the left-right direction D3, and a hook. It differs from the wafer handling tray 1 according to the first embodiment in that the extending portion 453 of the locking portion 45A extends forward or backward. Since the configuration other than these is the same as that of the first embodiment, the same members are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 10 is a plan view showing the surface 20A of the wafer handling tray 1A according to the second embodiment. FIG. 11 is a plan view showing a state in which the dicing frame 2 is placed on the wafer handling tray 1A according to the second embodiment. FIG. 12 is a bottom view showing the back surface 40A of the wafer handling tray 1A according to the second embodiment.

  As shown in FIG. 10 and the like, the main body 10A of the wafer handling tray 1A has a substantially square flat plate shape. A pair of hooks 26 </ b> A are provided on the surface 20 </ b> A of the main body 10 </ b> A in the vicinity of the four corners of a substantially square shape. The pair of hooks 26A are arranged so that the tip portions of the hooks 26A face each other in the left-right direction D3.

  Further, as shown in FIG. 11, hook engaging portions 45A are provided on the back surface 40A of the main body portion 10A and in the vicinity of four corners of a substantially square shape. Of the total four hook locking portions 45A, two of the front sides (two on the lower side in FIG. 10) have the extending portions 453A of the hook locking portions 45A extending forward. Of the four hook locking portions 45A in total, the rear two (two on the upper side in FIG. 10) have rearward extending portions 453 of the hook locking portions 45A.

The present invention is not limited to the above-described embodiments, and can be modified within the technical scope described in the claims.
For example, in the above-described embodiment, the hook 26 is provided on the front surface 20 of the main body portion 10 of the wafer handling tray 1, and the hook locking portion 45 is provided on the back surface 40 of the main body portion 10 of the wafer handling tray 1. However, it is not limited to this. The hook may be provided on the back surface of the main body portion of the wafer handling tray, and the hook locking portion may be provided on the surface of the main body portion of the wafer handling tray.

Moreover, the shape of each part of a wafer handling tray and the number of each part are not limited to the shape of the above-mentioned embodiment. For example, the configuration of the coupling portion, the position direction determining portion, the engaging portion, the first position restriction engaging portion, and the second position restriction engaging portion is not limited to the configuration of the above-described embodiment.
Moreover, although the main-body part 10 and the sealing member 442 were comprised with the electrically conductive resin containing an electrically-conductive particle, it is not limited to this. For example, you may be comprised with the conductive resin containing a conductive resin component. Furthermore, the main body 10 is not limited to resin, but may be metal, ceramic, or the like. In the case of such a material, when the elastic deformation is insufficient as the hook 26 and the hook locking portion 45, only these portions are separately provided. It can also be made of an elastic material.
Moreover, although the film F was comprised with the UV cured film, it is not limited to this. Any thin film to which the semiconductor wafer W can be attached may be used.

DESCRIPTION OF SYMBOLS 1 Wafer handling tray 10 Main-body part 20 Front surface 40 Back surface 2 Dicing frame (thin film frame)
26 Hook (joint)
45 Hook locking part (joint part)
24, 25 Protrusion (Position / direction determining part)
44 Seal portion 442 Seal member 111 A pair of first opposing surfaces (engagement portion, first position restriction engagement portion)
112, 122 A pair of second opposing surfaces (engagement portion, second position restriction engagement portion)
F film (thin film)
W Semiconductor wafer

Claims (6)

It has a flat plate-shaped main body having a front surface and a back surface,
A wafer handling tray capable of mounting a thin film frame on which a thin film on which a semiconductor wafer is bonded is fixed on the surface of the main body, wherein the thin film frame is formed by one wafer handling tray and another wafer handling tray. A wafer handling tray that holds the wafer in a sandwiched manner,
A coupling portion disposed at a peripheral portion of the main body portion and coupling the main body portion to the main body portion of another wafer handling tray;
A position and orientation determining portion that is disposed on the surface of the main body and that positions and orients the thin film frame on the surface;
A seal portion disposed on the back surface of the main body portion and having an annular seal member capable of contacting the thin film frame placed on another wafer handling tray;
Engaging portions that are disposed at least at one end and the other end of the main body in a direction parallel to the surface of the main body, and can be engaged with a pair of first portions provided on a processing arm of an external machine device. And
The seal member is in contact with the thin film frame so as to surround the periphery of the semiconductor wafer attached to the thin film frame mounted on another wafer handling tray, so that one wafer handling tray and the other wafer handling tray And the sealed portion and the thin film form a sealed space for accommodating the semiconductor wafer,
The engaging portion is engaged with a pair of first portions of the processing arm, whereby the position of the main body portion in the direction connecting the front surface and the back surface of the main body portion is restricted. Wafer handling tray having a portion.   The first position restriction engaging portion is a pair of opposed surfaces with which the first portion of the processing arm can come into contact, and is directed in a direction away from the main body portion in a direction parallel to the surface of the main body portion. The wafer handling tray according to claim 1, further comprising a pair of first opposing surfaces that approach each other in a direction connecting the front surface and the back surface of the main body.   The main body portion in a direction that is parallel to the surface of the main body portion and intersects with a direction away from the main body portion by engaging with the pair of second portions of the processing arm, respectively. The wafer handling tray according to claim 1, further comprising a second position restriction engaging portion for restricting a position of the wafer handling tray.   The second position restriction engagement portion is a pair of opposed surfaces with which the second portion of the processing arm can come into contact, and in a direction parallel to the surface of the main body portion, the second position restriction engagement portion is moved away from the main body portion. The wafer handling tray according to claim 3, further comprising a pair of second opposing surfaces that are separated from each other in a direction parallel to the surface of the main body. The coupling portion has a hook disposed on the front surface of the main body portion and a hook engaging portion disposed on the back surface of the main body portion and engaged with the hook, or disposed on the back surface of the main body portion. A hook engaging portion that is disposed on the surface of the main body portion and is engaged with the hook.
The hook locking portion is elastically deformable, and the hook locking portion can contact the third portion of the processing arm,
When the hook locking part is elastically deformed, the hook can be locked to the hook locking part, and when the hook locking part is pushed by the third part of the processing arm, the hook locking part The wafer handling tray according to any one of claims 1 to 4, wherein the portion is elastically deformed and the locking of the hook to the hook locking portion is released.   The wafer handling tray according to claim 1, wherein the main body portion and the sealing member are made of conductive resin containing conductive particles or a conductive resin component.

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