JP2007314210A - Loading tray and thin plate holding container - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compactly structured thin plate holding container which uses a magnetic force for joining and separating loading trays and suppresses the amount of magnetic flux leaked. <P>SOLUTION: The thin plate holding container includes a laminated assembly of loading trays for holding and storing a thin plate in gaps between them when joined. A joining and separating means 14 for joining and separating first and second loading trays mutually placed on the front and back sides makes a magnetic flux from a magnetic flux generation source provided on the first loading tray flow by the first closed loop from the first to the second loading trays for joining the trays. By changing the first closed loop to an open loop, the joined first and second loading trays are released. At the same time, the flux from the source is made to flow in the second closed loop inherent in the first loading tray. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a loading tray and a thin plate holding container. The present invention, for example, mounting for holding, storing, processing, etc. a thin plate for an electronic device such as a semiconductor wafer, a magnetic recording medium disk, an optical recording medium disk, a glass substrate for liquid crystal, a film substrate for a flexible display device, etc. The present invention can be applied to a tray and a thin plate holding container, and can be applied to a two-object coupling release mechanism in such a loading tray and a thin plate holding container.

  In recent years, further thinning has been demanded for thin plates for electronic devices such as semiconductor wafers. For this reason, regardless of the size, each thin plate becomes extremely thin and easily breaks. Further, even when the plate thickness does not change, the thinning of the plate has progressed relatively from the viewpoint of the aspect of the plate thickness and the outer diameter due to the progress of the increase in size of the outer shape.

  As a container for storing, storing and transporting such an extremely thin thin plate, a multistage storage cassette described in Patent Document 1 is known. This multistage storage cassette is a storage cassette that can be carried out without causing chipping on the outer peripheral surface of an ultra-thin wafer having a thickness of 20 to 100 μm and without causing a mistake in adsorption to a pad. Specifically, as shown in FIG. 9, the multistage storage cassette 6 includes a plurality of storage shelves 2 in which semicircular guides 4 having a diameter slightly larger than the diameter of the ultrathin wafer W are erected from the flat plate 3. Are arranged in parallel up and down at equal intervals via the support column 5. The suction pad of the transfer robot is moved to the upper surface of the wafer W, and then lowered to press the wafer onto the flat plate to eliminate the warp of the wafer, and the wafer is sucked and fixed to the suction pad.

  By the way, the multistage storage cassette 6 as described above is not configured to disassemble and transport each cassette individually. Even if the cassette is gripped and transported, the cassette cannot be accurately positioned and supported. For this reason, there is a problem that the semiconductor wafer inside the cassette cannot be accurately positioned, and it is difficult to smoothly transfer it to an external processing apparatus or the like.

  Therefore, the applicant of the present invention is a thin plate holding container configured by combining a plurality of mounting trays that accommodate thin plates, and the mounting trays can be easily connected to each other and released. Researches and developments have been made to enable conveyance of a single tray (for example, Japanese Patent Application No. 2005-350744).

In general, as a mechanism for releasing the coupling of two objects, there are a mechanism using a locking claw and a fitting hole, a mechanism using a magnet, and the like. Both the former decoupling mechanism and the latter decoupling mechanism have merits, but the latter decoupling mechanism may be used as a decoupling mechanism used in an environment that minimizes the generation of dust and the like. For example, in Patent Document 2, a first magnet is fixedly provided on one object, and a second magnet is provided on the other object so as to be movable in a housing. A mechanism for coupling or releasing by changing the position of the magnet is described.
JP 2004-273867 A International publication number WO 98/56676

  However, in the method of joining and releasing two objects described in Patent Document 2, the magnetic flux of the magnets of each object leaks to the outside even when the two objects are separated (coupled release state). There is a risk that the amount of magnetic flux will adversely affect external devices, devices that employ the coupling and releasing methods, and the like. For example, if there is an object made of a magnetic material in the vicinity of the object, it will have an adverse effect trying to attract it, and if there is an electrical device or magnetic device in the vicinity of the object, the leakage magnetic flux will There is a risk of adversely affecting accuracy.

  In addition, since the method of joining and releasing two objects described in Patent Document 2 is the movement of a magnet (second magnet) itself having N and S poles, it is applied to a mechanism for releasing the connection between the mounting trays. There is a risk of making the loading tray large.

  In Patent Document 2, an electromagnet is applied as the second magnet, and instead of moving the second magnet, a second magnet (electromagnet) is provided with respect to the first magnet by turning on / off the electromagnet. A mechanism for coupling or releasing is described. Even in such a mechanism, an electromagnet and an energization configuration are necessary, and thus it is difficult to apply to a mechanism for releasing the connection between the mounting trays. Further, the object side having the first magnet has a problem of the adverse effect of the leakage magnetic flux described above.

  Therefore, there is a demand for a mounting tray and a thin plate holding container that can reduce the amount of magnetic flux leakage and achieve downsizing of the configuration while using the magnetic force for coupling and release.

  The first aspect of the present invention is a thin plate holding container including a stacked assembly of mounting trays that hold and store a thin plate in the gap when they are coupled to each other. The coupling / releasing means for coupling and releasing the mounting tray causes the magnetic flux from the magnetic flux generation source provided in the first mounting tray to flow in the first closed loop between the first and second mounting trays. The first and second loading trays are coupled, and the first closed loop is changed to an open loop to release the coupling between the first and second loading trays. The magnetic flux is configured to flow in a second closed loop inherent in the first loading tray.

  According to a second aspect of the present invention, there is provided a thin plate holding container including a stacked assembly of mounting trays that hold and store a thin plate in the gap when they are coupled to each other. The coupling / releasing means for coupling and releasing the mounting tray includes (1) a magnetic flux generation source and a magnetic circuit wiring formed of a soft magnetic material that allows the magnetic flux from the magnetic flux generation source to pass therethrough. A magnetic circuit provided on the mounting tray and (2) when the first and second mounting trays are combined, the magnetic circuit is made of a soft magnetic material that forms a part of the magnetic circuit by combining with the magnetic circuit. A magnetic flux receiving portion provided on the second loading tray; and (3) a first magnetic flux inserted between the first and second loading trays, inserted in the middle of the magnetic circuit. It is switched between the closed state, the second closed state inherent in the first loading tray, and the open state. And wherein the obtaining and a magnetic circuit switch provided in said first tray.

  A third aspect of the present invention is a mounting tray for holding and storing a thin plate in the gap when coupled to each other, and (1) a magnetic flux generation source and a soft passage through which the magnetic flux from the magnetic flux generation source passes. A magnetic circuit comprising magnetic circuit wiring formed of a magnetic material; and (2) when the mounting tray is coupled to another mounting tray, the magnetic circuit is coupled to the magnetic circuit in the other mounting tray. A magnetic flux receiving portion made of a soft magnetic material that constitutes a part of the circuit; and (3) a first part that is inserted in the middle of the magnetic circuit and extends between the mounting tray and the other mounting tray. And a magnetic circuit switch for switching between a second closed state inherent in the loading tray and an open state.

  According to the mounting tray and the thin plate holding container of the present invention, it is possible to reduce the amount of magnetic flux leakage and achieve downsizing of the configuration while using magnetic force for coupling and releasing.

(A) 1st Embodiment Hereinafter, 1st Embodiment of the mounting tray and thin plate holding container by this invention is described, referring drawings.

  FIG. 2 is a perspective view showing a schematic configuration of the thin plate holding container according to the first embodiment. FIG. 3 is a schematic perspective view seen from the lower side of the loading tray. Note that the thin plate holding container and the mounting tray have no concept of up, down, left, and right, but in the following description, the top, bottom, left, and right of the state of FIG.

  In FIG. 2, the thin plate holding container 11 mainly includes a pair of base trays 12, one or a plurality of mounting trays 13 inserted between the base trays 12, and between the mounting trays 13 or the base tray. 12 and the mounting tray 13 are coupled to each other and coupled / release means 14 (see FIG. 1) for releasing the coupling.

  The base tray 12 is a tray for protecting the upper end surface and the lower end surface of the stacked stacking trays 13 and engaging with a mechanical device (not shown) that performs processing such as polishing of the semiconductor wafer W. The base tray 12 is formed in a substantially disk shape. On the periphery of the base tray 12, grip portions 21 described later are provided at two positions facing each other. The base tray 12 includes an upper base tray 12A and a lower base tray 12B, and is provided at upper and lower ends of the stacking tray 13 in which one or a plurality of sheets are stacked. Three device pin grooves 16 are formed integrally on the upper side surface of the upper base tray 12A for mechanical connection with the machine device. The three apparatus pin grooves 16 are grooves for positioning the thin plate holding container 11 by fitting with kinematic pins (not shown) on the processing apparatus side. The device pin groove 16 is also integrally provided on the lower surface of the lower base tray 12B.

  The lower side surface of the upper base tray 12A is formed in the same manner as the second mounting portion 19 on the lower side surface of the mounting tray 13 described later. On the upper side surface of the lower base tray 12B, a first placement unit similar to the first placement unit 18 on the upper side surface of the placement tray 13 described later is provided.

  Each mounting tray 13 is a tray that is inserted between the base trays 12 to store and support the semiconductor wafers W. The mounting tray 13 has the same peripheral shape as the base tray 12. The placement tray 13 includes a first placement portion 18, a second placement portion 19, a coupling / release means 14, and a grip portion 21.

  As shown in FIG. 2, the first mounting portion 18 is a portion for mounting the semiconductor wafer W. The first mounting portion 18 is formed on the upper surface of the mounting tray 13 in accordance with the size of the semiconductor wafer W. Since the semiconductor wafer W placed on the first placement unit 18 has a circular shape, the first placement unit 18 is formed in a circle according to the shape. For example, it is set according to the semiconductor wafer W having a diameter of 300 mm and a thickness of about 50 to 750 μm. Note that a protective sheet may be attached to the surface of the semiconductor wafer W. In this case, the thickness is increased by the thickness of the protective sheet. The surface of the first mounting portion 18 is formed into a flat surface, and is in contact with and supported by the entire lower surface of the semiconductor wafer W. Note that at least one of the first mounting portion 18 and the second mounting portion 19 is formed with a removal prevention structure (not shown) for restricting the semiconductor wafer W to a set position within the tray mounting surface. Yes. Specifically, the omission prevention structure has a circular shape or an arc shape along the outer peripheral portion of the semiconductor wafer W, and is formed in a stepped shape or a protruding shape.

  A seal holding groove 23 is provided on the outer peripheral edge of the first placement portion 18. The seal holding groove 23 is a groove for holding the sealing material 24. The seal holding groove 23 is formed in an annular shape on the outer peripheral edge of the first placement portion 18. Thereby, the storage space is constituted by the first mounting portion 18, the second mounting portion 19, and the sealing material 24. The sealing material 24 is provided so as to surround a storage space formed when the two mounting trays 13 are stacked and the mounting trays 13 are coupled to each other in a state of being fitted in the seal holding groove 23. This storage space is isolated from the external environment and kept airtight. The storage space is set to a size that can store at least one semiconductor wafer W. Depending on the application, the storage space may store two or more semiconductor wafers W at the same time. In this case, the storage space is set to a size according to the thickness of the semiconductor wafer W that is stacked two or more.

  As shown in FIG. 3, the second placement portion 19 engages with the first placement portion 18 of another placement tray 13 to form the storage space isolated from the external environment, and in the storage space. This is a portion for mounting and supporting the semiconductor wafer W even when the semiconductor wafer W is sandwiched and turned upside down.

The second mounting unit 19 stores and supports the semiconductor wafer W mounted on the first mounting unit 18 in the storage space that can be covered from above. The second placement unit 19 is formed to have the same dimensions as the first placement unit 18.

  If it sees in detail, the mounting convex part 26 will be provided in the whole surface of the 1st mounting part 18 and the 2nd mounting part 19. FIG. The placement convex portion 26 is a member for pressing and supporting the semiconductor wafer W placed on the first placement portion 18 from both sides. The placement convex portion 26 is formed in a mesh shape. The mounting convex portions 26 are formed in a mesh shape so that the mounting convex portions 26 are in contact with the semiconductor wafer W with a minimum area and the entire surface of the semiconductor wafer W is pressed evenly. As a result, the mesh-like placement convex portion 26 is in contact with the semiconductor wafer W with a minimum area, and presses the entire surface of the semiconductor wafer W evenly, thereby the first placement portion 18 and the second placement portion 19. The ultrathin semiconductor wafer W is sandwiched in the storage space between the two so as to be surely supported. In addition, about the 1st mounting part 18, since there is a thing which does not provide the mounting convex part 26 in some figures, description of the mounting convex part 26 is abbreviate | omitted only for convenience. In addition, as described above, the first mounting portion 18 is also provided with the mounting convex portion 26. The configuration and operation of the mounting convex portion 26 of the second mounting portion 19 are also applied to the mounting convex portion 26 provided in the first mounting portion 18 as it is.

  A seal receiving groove 28 is provided on the outer peripheral edge of the second placement portion 19. The seal receiving groove 28 is a portion for improving the airtightness in the storage space by the sealing material 24 held in the seal holding groove 23 on the first mounting portion 18 side being in close contact.

  FIG. 1 is a schematic cross-sectional view of one loading tray 13 taken along the line II in FIG. 2, and FIG. 4 is an enlarged cross-sectional view of the coupling / releasing means 14. FIG. 4 shows three loading trays 13-1 to 13-3.

  As shown in FIGS. 1 and 4, the coupling / releasing means 14 includes a permanent magnet 30 as a magnetic flux generation source, and magnetic circuit wires provided on the left and right, respectively, that function as a path for magnetic flux from the permanent magnet 30. 31 (31L, 31R), 32 (32L, 32R), magnetic circuit switch 33 that magnetically cuts off and connects the magnetic circuit composed of permanent magnet 30, magnetic circuit wiring 31 and 32, and other loading tray 13 A magnetic flux receiving part 34 for receiving magnetic flux and a switch operation hole 35 are provided.

  The permanent magnet 30, the magnetic circuit wires 31 and 32, and the magnetic circuit switch 33 are provided on the upper half side in the thickness direction of the mounting tray 13, and the magnetic flux receiver 34 is in the lower half of the mounting tray 13 in the thickness direction. On the side.

  In the case of the first embodiment, the magnetic circuit switch 33 is a plate-like or bar-like one that linearly moves in the left-right direction in FIG. 4 by the operation of an operator (not shown) inserted from the switch operation hole 35. The magnetic circuit switch 33 is configured to appropriately connect the first and second magnetic switch-on portions 331 and 332 provided at intervals in the linear motion direction and the left and right magnetic circuit wirings 32 in FIG. A magnetic bridge portion 333 provided between the magnetic switch-on portions 331 and 332 is provided as a magnetic circuit element, and the other portions are made of a nonmagnetic material. The nonmagnetic material in other portions is not limited to a polymer material, and may be a nonmagnetic metal.

  The first and second magnetic switch-on portions 331 and 332, the magnetic bridge portion 333, the magnetic circuit wirings 31 and 32, and the magnetic flux receiving portion 34 are shown in FIG. 4 according to the position of the magnetic circuit switch 33. It is provided at a position where three types of magnetic circuit states can be achieved.

  In FIG. 4, the state of the magnetic circuit (first magnetic circuit state) in the first mounting tray 13-1 is, for example, transported alone after the mounting tray 13-1 is separated from the thin plate holding container 11. Is in a state where is executed. In the first magnetic circuit state, the magnetic flux from the N pole of the permanent magnet 30 is the magnetic circuit wiring 31L in the lower left-first magnetic switch-on portion 331-the magnetic circuit wiring 32L in the upper left-magnetic bridge portion 333-the magnetic in the upper right. The circuit wiring 32R-second magnetic switch-on portion 332-lower right magnetic circuit wiring 31R is routed to the S pole of the permanent magnet 30. A magnetic closed loop is configured only by the components of the mounting tray 13-1 to suppress magnetic leakage and minimize adverse effects to the outside.

  In FIG. 4, the state of the upper magnetic circuit (second magnetic circuit state) in the second loading tray 13-2 is a blocked magnetic circuit. For example, when separating the two loading trays 13-1 and 13-2 in the combined state, the magnetic circuit switch 33 of the lower loading tray 13-2 is set to the second magnetic circuit state. . In the second magnetic circuit state, the lower left magnetic circuit wiring 31L and the upper left magnetic circuit wiring 32L are magnetically blocked by the nonmagnetic material portion of the magnetic circuit switch 33, and the upper left magnetic circuit wiring 32L and the upper right magnetic circuit wiring 32L are magnetically interrupted. The circuit wiring 32R is also magnetically blocked by the nonmagnetic material portion of the magnetic circuit switch 33, and the magnetic circuit wiring 32R on the upper right and the magnetic circuit wiring 31R on the lower right are also magnetically separated by the nonmagnetic material portion of the magnetic circuit switch 33. Is blocked. The second magnetic circuit state is a magnetic open loop, but there is a magnetic flux in the upper left magnetic circuit wiring 32L and the upper right magnetic circuit wiring 32R facing the upper surface of the mounting tray 13-2. Therefore, even if the magnetic flux receiving portions 34 of the other loading trays 13-1 are close to each other, the magnetic flux receiving portions 34 (therefore, the other loading trays 13-1) are not attracted.

  In FIG. 4, the state of the upper magnetic circuit (third magnetic circuit state) in the third loading tray 13-3 is a coupled magnetic circuit that attracts the second loading tray 13-2. . In the third magnetic circuit state, the magnetic flux from the N pole of the permanent magnet 30 is the magnetic circuit wiring 31L in the lower left-first magnetic switch-on unit 331-magnetic circuit wiring 32L in the upper left-magnetic flux receiving unit 34-magnetism in the upper right. The circuit wiring 32R-second magnetic switch-on portion 332-lower right magnetic circuit wiring 31R is routed to the S pole of the permanent magnet 30. In the third magnetic circuit state, instead of the magnetic bridge portion 333 in the first magnetic circuit state, a magnetic closed loop is formed by using the magnetic flux receiving portion 34 that is an element of the other loading tray 13-2. Both loading trays 13-2 and 13-3 are combined. Similarly to the first magnetic circuit state, the third magnetic circuit state also forms a magnetic closed loop, so that magnetic leakage can be suppressed and adverse effects to the outside can be minimized.

  As the permanent magnet 30, for example, a neodymium iron-based permanent magnet, a neodymium iron cobalt-based permanent magnet, or a samarium cobalt-based permanent magnet is applied. These types of permanent magnets have a large product of residual magnetic flux density Br and coercive force Hc in a hysteresis curve as shown in FIG. 5, and can efficiently constitute a magnetic circuit. That is, since the coupling force (attraction force) at the time of coupling can be increased while the size of the coupling / release means 14 is reduced, the above type of permanent magnet is preferable.

  Magnetic circuit elements such as the magnetic circuit wirings 31 and 32, the magnetic flux receiving part 34, the first and second magnetic switch-on parts 331 and 332, and the magnetic bridge part 333 allow the magnetic flux to pass through, but in a state where the magnetic flux is not supplied. It is made of a soft magnetic material that does not generate a magnetic force (holding force). As the soft magnetic material applicable to such a magnetic circuit element, for example, a high magnetic permeability material such as pure iron, silicon steel, ferrite, sendust, permalloy, supermalloy (trade name) and the like, which easily flows magnetic flux, is applied.

  The surface of the magnetic bridge portion 333 that contacts the magnetic circuit is preferably covered with a polymer material having a thickness of about 500 μm or less from the viewpoint of preventing rust and suppressing dust. Here, the thickness is selected so as not to disturb the attractive force between the magnetic circuit wires 32L and 32R and the magnetic bridge portion 333 (at least about 500 μm or less). As the polymer material that covers the surface of the magnetic cross-linking portion 333, fluororesin, polypropylene, and polycarbonate can be applied. If the polymer material that covers the surface of the magnetic cross-linking portion 333 is the same as the polymer material that constitutes the mounting tray 13, the affinity with the contact portion becomes good when contacting the portion that does not constitute the magnetic circuit. It is preferable.

  In addition to the magnetic bridge portion 333, the polymer material may be coated to such an extent that the magnetic attractive force is not hindered.

  As shown in FIG. 6, when the base tray 12 and the mounting tray 13 are stacked, the coupling / releasing means 14 fixes each other between the mounting trays 13 or between the base tray 12 and the mounting tray 13. Thus, the thin plate holding container 11 is configured integrally. In such an integrated state, the coupling / releasing means 14 is in the third magnetic circuit state described above.

  The grip portion 21 is a portion for fitting and gripping a processing arm on the external machine device side. As shown in FIG. 2, the grip portion 21 is provided on each of the opposing side surfaces (left and right side surfaces) of the loading tray 13. The holding part 21 is formed in a wedge shape in its longitudinal cross-sectional shape. That is, the vertical cross-sectional shape of the grip portion 21 is configured to include two inclined surfaces that are inclined with respect to each other and are positioned in the vertical direction. A holding mechanism for a processing arm (not shown) has a V-groove structure. The V-groove portion of the holding mechanism comes into contact with the two inclined surfaces of the grip portion 21 and is fitted to each other, whereby the vertical direction of the loading tray 13 is positioned. Here, the vertical cross-sectional shape of the gripping portion 21 is a wedge shape, but a structure other than a wedge shape may be used as long as the structure includes two inclined surfaces that are inclined in the vertical direction. Positioning of the grip portion 21 in the left-right direction is performed by bringing both end walls of the grip portion 21 into contact with the end walls of the holding mechanism.

  The mounting tray 13 is made of a non-chargeable or conductive polymer material. Further, the first loading portion 18 and the second loading portion 19 of the loading tray 13 are formed of a polymer material that becomes transparent.

  Specific materials for the mounting tray 13 include thermoplastic polymers such as polycarbonate resins, polybutylene terephthalate resins, polymethyl methacrylate resins, cycloolefin resins, polypropylene resins, and fluorine resins. Can be used. Conductivity and non-chargeability can be imparted by mixing these polymers with a conductive material such as carbon fiber or metal powder, or by mixing a surfactant.

  Examples of the elastic material include polybutylene terephthalate resin, polyethylene elastomer, and polybutylene elastomer. Further, since most organic polymer materials are softer than silicon, it is not necessary to be conscious of being softer than the semiconductor wafer W. Although most organic polymer materials can be used as a softer material than the semiconductor wafer W, the organic polymer material has elasticity and is a softer material in a place in direct contact with the semiconductor wafer W. It is desirable to use polybutylene terephthalate resin or the like.

  Examples of the transparent material include polycarbonate resin, polymethyl methacrylate resin, and cycloolefin resin.

  In addition, you may use the polymeric material different from the polymeric material which satisfy | fills the said elastic, non-charging property, or electroconductive function. In this case, only the part of the 1st mounting part 18 and the 2nd mounting part 19 of the mounting tray 13, or the part is formed with a transparent polymer material. Only the mounting tray 13 or a part thereof may be formed of a transparent polymer material.

  The thin plate holding container 11 configured as described above is used as follows. First, a method for configuring the thin plate holding container 11 will be described.

  First, the mounting tray 13 is prepared according to the number of semiconductor wafers W to be held. Then, each semiconductor wafer W is mounted on the first mounting portion 18 of each mounting tray 13. Next, all the loading trays 13 are stacked. Before the stacking, the position of the magnetic circuit switch 33 of each coupling / releasing means 14 is set to the first magnetic circuit state (the state of the mounting tray 13-1 in FIG. 4). After the lamination, a switch operator (not shown) is inserted from the switch operation hole 35, and the position of the magnetic circuit switch 33 is set to the third magnetic circuit state (the state of the mounting tray 13-3 in FIG. 4).

  In such a stacked and coupled state, the semiconductor wafer W placed on the first placement portion 18 of each placement tray 13 is connected to the second placement portion 19 of the upper placement tray 13 and the first placement portion. A storage space is formed by the mounting portion 18 and the sealing material 24, and is blocked from the external environment. Further, the semiconductor wafer W is pressed by the mounting convex portion 26 of the second mounting portion 19 and is securely supported by being sandwiched between the mounting convex portion 26 and the first mounting portion 18.

  Further, the base tray 12 is attached to both upper and lower end portions of each stacking tray 13 stacked in a plurality. That is, the upper base tray 12 </ b> A is attached to the upper side of each loading tray 13, and the lower base tray 12 </ b> B is attached to the lower side by the coupling / releasing means 14. Here, the upper base tray 12 </ b> A and the lower base tray 12 </ b> B are attached after the plurality of mounting trays 13 are stacked, but may be stacked simultaneously with the mounting trays 13.

  When one thin plate holding container 11 is configured, the thin plate holding container 11 is transported. When the number of semiconductor wafers W to be used for the next transfer is smaller or larger than the previous thin plate holding container 11, the number of the mounting trays 13 is adjusted accordingly.

  Next, the thin plate holding container 11 is transported to a place corresponding to the processing content of the internal semiconductor wafer W. After being transported, the thin plate holding container 11 is placed on a mounting table (not shown) of the mechanical device. At this time, the apparatus pin groove 16 of the base tray 12 is fitted to the kinematic pin on the machine apparatus side, and the thin plate holding container 11 is placed at an accurate position.

  Next, as shown in FIGS. 7A and 7B, the two holding mechanisms 42 on the mechanical device side are fitted into the respective gripping portions 21 of the mounting tray 13-m, and the semiconductor wafer to be processed The loading tray 13-m holding W is gripped. Thereby, the vertical direction is positioned by the wedge-shaped gripping portion 21 and the V groove of the holding mechanism 42, and the left-right direction is positioned by the both end walls of the gripping portion 21 and the end wall on the holding mechanism 42 side.

  Next, a switch operator (not shown) moves to the position of the mounting tray 13- (m-1) one stage below the mounting tray 13-m, is inserted into the switch operation hole 35, and is mounted on the mounting tray 13 -The magnetic circuit switch 33 of (m-1) is operated to enter the second magnetic circuit state (the state of the loading tray 13-2 in FIG. 4), and the coupling / releasing means 14 is released, and FIG. C), the mounting tray 13-m gripped by the holding mechanism 42 is lifted, and the thin plate holding container 11 is separated between the mounting trays 13-m and 13- (m−1). When the mounting tray 13-m is lifted, a switch operator (not shown) switches the magnetic circuit switch 33 of the mounting tray 13- (m-1) to the first magnetic circuit state (the mounting tray 13- in FIG. 4). 1).

  Next, a loading / unloading mechanism (not shown) on the machine side supports the semiconductor wafer W, lifts it, and carries it out for processing. After the semiconductor wafer W is unloaded, it waits as it is. Further, if necessary, the raised mounting tray 13-m is returned to the original position, and a switch operator (not shown) switches the magnetic circuit switch 33 of the mounting tray 13- (m-1) to the third magnetic circuit. It operates so that it may be in a state (state of the mounting tray 13-3 of FIG. 4).

  When the semiconductor wafer W after processing is stored in the thin plate holding container 11, the semiconductor wafer W supported by the loading / unloading mechanism is placed on the first placement unit 18. When the mounting trays 13-m and 13- (m-1) are coupled, the mounting tray 13-m above the position to be returned is separated and lifted by the holding mechanism 42 in the same manner as described above. Place on tray 13- (m-1). Thereafter, the mounting tray 13-m lifted by the holding mechanism 42 is lowered, and a switch operator (not shown) switches the magnetic circuit switch 33 of the mounting tray 13- (m-1) to the third magnetic circuit state (FIG. 4) (the state of the loading tray 13-3). Thus, the storage of the semiconductor wafer W is completed.

  When processing the semiconductor wafer W at another position, the mounting tray 13 at that position is cut off in the same manner as described above, and the semiconductor wafer W inside is removed.

  When processing the opposite surface of the semiconductor wafer W, the thin plate holding container 11 is inverted and then placed on the mechanical device, and the above processing is performed.

  By separating the thin plate holding container 11 twice, a part of the one or a plurality of loading trays 13 can be separated from the thin plate holding container 11 and taken out. Also at the time of separation, the magnetic circuit switch 33 is operated with respect to the lower loading tray of the separation position to separate the third magnetic circuit state from the third magnetic circuit state, and then the first magnetic circuit is separated. Set to circuit state.

  According to the first embodiment, one permanent magnet is used, and a magnetic flux receiving portion made of a soft magnetic material of another loading tray is configured as a part of a magnetic circuit of magnetic flux from the permanent magnet. Used to connect and disconnect the mounting trays by connecting and disconnecting the magnetic circuit with the magnetic circuit switch, so that the two mounting trays have magnets that work together for magnetic force coupling. It can be omitted, and the coupling and releasing structure can be made small.

  Further, according to the first embodiment, even in the separated state, a closed loop state of a magnetic circuit composed of only one loading tray is prepared, so that the magnetic flux leaks to the outside in the separated state and has an adverse effect. Can be prevented.

(B) Second Embodiment Next, a second embodiment of the loading tray and the thin plate holding container according to the present invention will be described with reference to the drawings.

  The second embodiment differs from the first embodiment only in the specific configuration of the coupling / release means (the reference numeral 14A is used in the second embodiment). In the first embodiment, the magnetic circuit switch 33 moves linearly, but in the second embodiment, the magnetic circuit switch rotates or swings. Hereinafter, the configuration and operation of the coupling / releasing means 14A in the second embodiment will be described.

  FIG. 8 is a diagram showing a configuration of the coupling / releasing means 14A in the second embodiment. 8 (A1) to (A3) are schematic front views as seen from the axial direction of the rotating shaft, and FIGS. 8 (B1) to (B3) are schematic right side views of FIGS. 8 (A1) to (A3). It is.

  FIGS. 8A1 and 8B1 show a state corresponding to the first magnetic circuit state (the closed loop state at the time of separation) described in the first embodiment. FIGS. 8A2 and 8B2 are shown in FIGS. FIG. 8 shows a state corresponding to the second magnetic circuit state (open loop state at the time of separation) described in the first embodiment, and FIGS. 8A3 and 8B3 are described in the first embodiment. A state corresponding to the third magnetic circuit state (closed loop state when coupled) is shown.

  In FIG. 8, the permanent magnet 100 is connected to magnetic circuit wiring members 101L and 101R. 8 (B1) to (B3), the magnetic circuit wiring members 101L and 101R extend from the permanent magnet 100 to the left and right and then bend to the back side in the normal direction of the paper surface of FIGS. 8 (B1) to (B3). The bent front end side has an arc shape as shown in FIGS. 8 (A1) to (A3).

  As shown in FIGS. 8A1 to 8A3, magnetic circuit wiring members 103L and 103R having arcuate portions 102L and 102R spaced apart from the arcuate tips of the magnetic circuit wiring members 101L and 101R are provided. Yes. As shown in FIGS. 8B1 to 8B3, the magnetic circuit wiring members 103L and 103R are provided with arc-shaped portions 102L and 102R and extending upward, and inwardly from the portions 104L and 104R. It consists of the facing parts 105L and 105R. Magnetic circuit wiring members 106L and 106R extending in an arc shape are provided on the opposing surfaces of the portions 105L and 105R facing inward of both. The magnetic circuit wiring members 106L and 106R are separated from each other.

  Two magnetic circuit on / off members 111 </ b> L and 111 </ b> R and a magnetic bridge member 113 are attached to the rotating shaft 110 so as to rotate with the rotation of the rotating shaft 110.

  The magnetic circuit on / off members 111L and 111R are substantially bent at right angles, and the bent corners are attached to the rotating shaft 110. The two tip portions 112L1, 112L2, and 112R1, of the magnetic circuit on / off members 111L and 111R, 112R2 has an arc shape, and the arc-shaped portions 112L1, 112L2, and 112R1, 112R2 are provided with a soft magnetic material.

  Each of the arc-shaped portions 112L1 and 112L2 of the magnetic circuit on / off member 111L can magnetically connect the arc-shaped tip portion of the magnetic circuit wiring member 101L and the arc-shaped portion 102L of the magnetic circuit wiring member 103L. Similarly, each of the arc-shaped portions 112R1 and 112R2 of the magnetic circuit on / off member 111R can magnetically connect the arc-shaped tip portion of the magnetic circuit wiring member 101R and the arc-shaped portion 102R of the magnetic circuit wiring member 103R. is there.

  The magnetic bridge member 113 extends from the center of rotation and has a circular arc at its tip, and the arc-shaped portion 114 is provided with a soft magnetic material. The arc-shaped portion 114 of the magnetic bridge member 113 can magnetically connect the magnetic circuit wiring members 106L and 106R that are separated from each other.

  In the magnetic bridge member 113, one of the arc-shaped portions 112L1 and 112R1 of the magnetic circuit on / off members 111L and 111R includes the arc-shaped tip portion of the magnetic circuit wiring members 101L and 101R and the arc-shaped portion 102L of the magnetic circuit wiring members 103L and 103R. , 102R are magnetically connected to the rotary shaft 100 so as to magnetically connect the magnetic circuit wiring members 106L and 106R that are separated from each other.

  In the first magnetic circuit state (closed loop state at the time of separation) shown in FIGS. 8A1 and 8B1, the magnetic flux emitted from the N pole of the permanent magnet 100 is a circle of the magnetic circuit wiring member 101L-magnetic circuit on / off member 111L. Arc-shaped portion 112L1-magnetic circuit wiring member 102L-magnetic circuit wiring member 106L-magnetic bridge member 113-magnetic circuit wiring member 106R-magnetic circuit wiring member 102R-arc-shaped portion 112R1-magnetic circuit wiring member 101R of magnetic circuit on / off member 111R It returns to the south pole of the permanent magnet 100 through the path.

  In the second magnetic circuit state (open loop state at the time of separation) shown in FIGS. 8A2 and 8B2, the magnetic circuit on / off members 111L and 111R have their arcuate portions 112L1, 112L2, 112R1, and 112R2, The magnetic circuit is cut by positioning the arcuate tip portions of the magnetic circuit wiring members 101L and 101R and the arc-shaped portions 102L and 102R of the magnetic circuit wiring members 103L and 103R at positions where they are not magnetically connected. .

  In the third magnetic circuit state (closed loop state when coupled) shown in FIGS. 8A3 and 8B3, the magnetic flux emitted from the N pole of the permanent magnet 100 is a circle of the magnetic circuit wiring member 101L-magnetic circuit on / off member 111L. Permanent magnet 100 through the path of arc-shaped portion 112L1-magnetic circuit wiring member 102L-magnetic flux receiving portion 34 of another mounting tray-magnetic circuit wiring member 102R-arc-shaped portion 112R1-magnetic circuit wiring member 101R of magnetic circuit on / off member 111R Return to the S pole.

  Also according to the second embodiment, although the on / off configuration of the magnetic circuit switch is different from that of the first embodiment, the same effects as those of the first embodiment can be obtained.

(C) Other Embodiments The type of thin plate targeted by the thin plate holding container of the present invention is not limited. For example, any of a semiconductor wafer, a magnetic recording medium disk, an optical recording medium disk, a glass substrate for liquid crystal, and a film substrate for flexible display device may be used.

  In each of the above embodiments, the magnetic flux generation source is a permanent magnet, but an electromagnet may be used. In this case, the mounting tray may include an electromagnetic coil, and a current supply source for the electromagnetic coil may be provided outside (for example, common to all mounting trays).

  Further, in each of the above embodiments, a closed loop at the time of separation is formed by using the magnetic bridge portion 333 and the magnetic bridge member 113 whose positions change depending on the state of the magnetic circuit switch so that the magnetic flux flows as far as possible from the surface. However, the closed loop at the time of separation may be formed without using the magnetic cross-linking portion and the magnetic cross-linking member.

It is a schematic sectional drawing of the mounting tray which concerns on 1st Embodiment. It is a perspective view which shows schematic structure of the thin plate holding | maintenance container which concerns on 1st Embodiment. It is the schematic perspective view which looked at the mounting tray of 1st Embodiment from the lower surface side. It is a schematic sectional drawing which shows the detailed structure of the coupling | bonding / release means in 1st Embodiment. It is explanatory drawing of the kind of function applicable as a permanent magnet in 1st Embodiment. It is a schematic sectional drawing of the thin plate holding container which concerns on 1st Embodiment. It is explanatory drawing of the coupling | bonding of the thin plate holding | maintenance container which concerns on 1st Embodiment, and cancellation | release. It is drawing which shows the detailed structure of the coupling | bonding / release means in 2nd Embodiment. It is a front view which shows the conventional thin plate holding container.

Explanation of symbols

11: thin plate holding container, 12: base tray, 13: mounting tray, 14, 14A: coupling / releasing means, 18: first mounting section, 19: second mounting section, 21: gripping section, 23: seal Holding groove, 24: seal material, 26: mounting convex portion, 28: seal receiving groove, 30: permanent magnets 30, 31 (31L, 31R), 32 (32L, 32R): magnetic circuit wiring, 33: magnetic circuit switch 34: Magnetic flux receiving part 35: Switch operation hole 42: Holding mechanism 100: Permanent magnet 101L, 101R, 103L, 103R, 106L, 106R: Magnetic circuit wiring member 110: Rotating shaft 111L, 111R: Magnetic circuit On-off member, 113: magnetic cross-linking member, W: semiconductor wafer.

Claims (8)

When combined with each other, a thin plate holding container including a stacked assembly of mounting trays that holds and stores a thin plate in the gap,
The coupling / releasing means that couples and releases the first and second loading trays that follow each other uses the magnetic flux from the magnetic flux generation source provided in the first loading tray as the first and second loading trays. The first and second loading trays are coupled by flowing in a first closed loop, and the coupling between the first and second loading trays is released by changing the first closed loop to an open loop. And a configuration in which the magnetic flux from the magnetic flux generation source is caused to flow in a second closed loop inherent in the first loading tray. When combined with each other, a thin plate holding container including a stacked assembly of mounting trays that holds and stores a thin plate in the gap,
A coupling / releasing means for coupling and releasing the first and second loading trays that follow each other,
A magnetic circuit provided on the first loading tray, comprising a magnetic flux generation source and a magnetic circuit wiring formed of a soft magnetic material that allows a magnetic flux from the magnetic flux generation source to pass through;
When the first and second mounting trays are combined, the magnetic flux receiver provided on the second mounting tray is made of a soft magnetic material that is combined with the magnetic circuit and forms a part of the magnetic circuit. And
The magnetic circuit is inserted in the middle of the magnetic circuit so that the magnetic circuit is in a first closed state between the first and second mounting trays and in a second closed state inherent in the first mounting tray. And a magnetic circuit switch provided on the first loading tray that switches between an open state and a thin plate holding container.   The magnetic circuit, the magnetic flux receiver, and the magnetic circuit switch form a closed magnetic flux loop when the first and second mounting trays are coupled to each other, and the first and second mounting trays are When separating, a magnetic flux open loop is formed, and after complete separation, the magnetic circuit and the magnetic circuit switch form a magnetic flux closed loop by a magnetic bridge portion operating in conjunction with the magnetic circuit switch. The thin plate holding container according to claim 2.   The thin plate holding container according to claim 3, wherein the surface of the magnetic cross-linking portion is coated with a polymer material having a thickness of at least about 500 µm.   5. The thin plate holding container according to claim 4, wherein the polymer material covering the surface of the magnetic cross-linking portion is a fluororesin, polypropylene or polycarbonate.   The thin plate holding container according to claim 1, wherein the magnetic flux generation source is a permanent magnet.   The thin plate holding container according to claim 6, wherein the permanent magnet is a neodymium iron based permanent magnet, a neodymium iron cobalt based permanent magnet, or a samarium cobalt based permanent magnet. A tray that holds and stores a thin plate in the gap when coupled to each other,
A magnetic circuit comprising a magnetic flux generation source and a magnetic circuit wiring formed of a soft magnetic material that allows a magnetic flux from the magnetic flux generation source to pass through;
When the mounting tray is combined with another mounting tray, a magnetic flux receiving unit made of a soft magnetic material that is combined with the magnetic circuit in the other mounting tray and forms a part of the magnetic circuit;
Inserted in the middle of the magnetic circuit, the magnetic circuit is opened in a first closed state between the mounting tray and the other mounting tray, a second closed state inherent in the mounting tray, and an open state. And a magnetic circuit switch for switching between states.

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