JP5940342B2 - Substrate transport apparatus, substrate processing system, substrate transport method, and storage medium - Google Patents

Substrate transport apparatus, substrate processing system, substrate transport method, and storage medium Download PDF

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JP5940342B2
JP5940342B2 JP2012077694A JP2012077694A JP5940342B2 JP 5940342 B2 JP5940342 B2 JP 5940342B2 JP 2012077694 A JP2012077694 A JP 2012077694A JP 2012077694 A JP2012077694 A JP 2012077694A JP 5940342 B2 JP5940342 B2 JP 5940342B2
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substrate
pick
vacuum processing
processing unit
wafer
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JP2013042112A (en
Inventor
博充 阪上
博充 阪上
雅仁 小沢
雅仁 小沢
雄一 古屋
雄一 古屋
菜奈子 信田
菜奈子 信田
勝人 廣瀬
勝人 廣瀬
稲垣 守人
守人 稲垣
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東京エレクトロン株式会社
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Priority claimed from KR1020120076764A external-priority patent/KR20130009700A/en
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Description

  The present invention relates to a substrate transport apparatus used in a substrate processing apparatus that performs vacuum processing with heat on a substrate such as a semiconductor wafer, a substrate processing system and a substrate transport method using the same, and a storage medium.

  In the manufacturing process of a semiconductor device, a vacuum process such as a film forming process is frequently used for a semiconductor wafer (hereinafter simply referred to as a wafer) that is a substrate to be processed. Recently, from the viewpoint of improving the efficiency of such vacuum processing and suppressing contamination such as oxidation and contamination, a plurality of vacuum processing units are connected to a transfer chamber held in a vacuum and provided in this transfer chamber. A cluster tool type multi-chamber type vacuum processing system is used in which a wafer can be transferred to each vacuum processing unit by the substrate transfer apparatus (for example, Patent Document 1).

  In such a multi-chamber processing system, a wafer is transferred from a wafer cassette placed in the atmosphere to a transfer chamber held in a vacuum, in addition to the above-described vacuum processing unit, in a transfer chamber held in a vacuum. A load lock chamber is connected to each other, and a wafer is transferred between the vacuum processing unit and the load lock chamber or between the vacuum processing units by a substrate transfer device provided in the transfer chamber.

  In the substrate transfer apparatus used at this time, a pick that holds only the back surface of the wafer or only the lower surface side bevel is used as a pick for holding the wafer.

JP 2000-208589 A

  Recently, it is required to carry wafers at high speed and perform processing at high throughput. However, as described above, when using a pick that holds only the back surface of the wafer or only the lower surface bevel, the speed is high. When the wafer is transferred, the wafer slips and the wafer position accuracy becomes low. In addition, when a process with heat such as a film forming process is performed, errors due to thermal expansion are also superimposed and the position accuracy is further decreased.

  The present invention has been made in view of such circumstances, and in a substrate processing apparatus that performs processing with heat in a vacuum, a substrate transport apparatus capable of increasing the positional accuracy of a substrate even when the substrate is transported at a high speed, It is an object to provide a substrate processing system and a substrate transfer method using the same. It is another object of the present invention to provide a storage medium storing a program for executing such a transport method.

In order to solve the above problems, according to a first aspect of the present invention, there is provided a substrate having a vacuum processing unit for performing vacuum processing with heat, and a transfer chamber to which the vacuum processing unit is connected and whose interior is held in vacuum. In the processing system, the substrate transfer apparatus is provided in the transfer chamber and carries the substrate into and out of the vacuum processing unit, and has a positioning pin for positioning the substrate, and holds the substrate in a positioned state. A pick unit; a drive unit that drives the pick so that the substrate is carried into and out of the vacuum processing unit by the pick; and a conveyance control unit that controls a substrate conveyance operation by the pick. control unit, at the time of carrying a substrate into the vacuum processing unit, advance the reference position location of the substrate at room temperature by previously grasped on X-Y coordinate, actual In sense, when loading the substrate into the vacuum processing unit, the positional deviation due to heat from the pre-Symbol reference position determined on said X-Y coordinates, from said position of said X-Y coordinate after the positional deviation There is provided a substrate transport apparatus that calculates a displacement amount of a substrate, controls the drive unit to correct the displacement amount and carry the substrate into the vacuum processing unit.

In a second aspect of the present invention, a vacuum processing unit for performing vacuum processing with heat, a transfer chamber to which the vacuum processing unit is connected and maintained in a vacuum, and provided in the transfer chamber, the vacuum A substrate processing system comprising a substrate transfer device that carries a substrate into and out of a processing unit, the substrate transfer device having a positioning pin for positioning the substrate and holding the substrate in a positioned state A pick unit; a drive unit that drives the pick so that the substrate is carried into and out of the vacuum processing unit by the pick; and a conveyance control unit that controls a substrate conveyance operation by the pick. control unit, at the time of carrying a substrate into the vacuum processing unit, advance the reference position location of the substrate at room temperature by previously grasped on X-Y coordinates, you the actual processing Te, the time of loading the substrate into the vacuum processing unit, the positional deviation due to heat from the pre-Symbol reference position determined on said X-Y coordinates, from said position of said X-Y coordinate after the positional deviation substrate The substrate processing system is characterized in that the amount of deviation is calculated, the amount of deviation is corrected, and the drive unit is controlled to carry the substrate into the vacuum processing unit.

  In the first and second aspects, the positioning pins are arranged so as to sandwich the substrate on the pick, and the substrate is positioned by pressing the substrate against the positioning pins by inertia when the pick is moved. It can be constituted as follows.

  The pick may include a plurality of positioning pins, and may further include a clamp mechanism that clamps the substrate on the pick by moving any of the plurality of positioning pins.

  In this case, an articulated arm mechanism including the pick and another arm is provided, the pick is provided so as to be rotatable with respect to an adjacent arm, and the clamp mechanism includes a cam that is displaced as the pick rotates. A moving member that moves the positioning pin forward and backward by the displacement of the cam to clamp or release the substrate, and an intermediate mechanism that transmits the displacement of the cam to the moving member. The position of the positioning pin can be adjusted so as to be determined in synchronization with the rotational position.

  The positioning pin includes a distal end side positioning pin provided on the distal end side of the pick, and a proximal end positioning pin provided on the proximal end side of the pick, and the clamp mechanism includes the proximal end positioning pin. Is configured to clamp or release the substrate by advancing and retreating, and when the articulated arm mechanism is extended to release the substrate on the pick to deliver the substrate, the acceleration of the pick is When the substrate is released in the negative range, the articulated arm is retracted, and the substrate is clamped after receiving the substrate on the pick, the substrate is clamped in the range where the acceleration of the pick is positive. It can be configured.

In the above first and second aspects, the reference position location is at room temperature, detecting the substrate by the position detection sensor unit provided at a position where the substrate to be transferred into and out relative to the vacuum processing unit passes And can be obtained based on the detection information. At this time, the position information of the substrate when the substrate is carried into the vacuum processing unit is obtained based on the detection information detected by the position detection sensor unit, and the position information of the substrate thus obtained is obtained. it is possible to calculate the positional deviation from the reference position location and. The detection of the displacement is performed when the substrate is carried out of the vacuum processing unit or when the substrate is carried into the vacuum processing unit, and the correction of the displacement amount is performed when the substrate is carried into the vacuum processing unit. Can be.

The substrate processing system further includes a load lock chamber that is connected to the transfer chamber, is variable in pressure between an air atmosphere and a vacuum, and transfers a substrate from the air atmosphere to the transfer chamber, conveyance control unit, at the time of transferring the substrate to the load lock chamber, the reference position location of the substrate at normal temperature is previously grasped on X-Y coordinates, in the actual processing, the substrate to the load lock chamber when loading, the positional deviation due to heat from the pre-Symbol reference position determined on said X-Y coordinate, and calculates a shift amount of the substrate from the position of the X-Y coordinate after the positional deviation, the deviation amount The drive unit can be controlled so that the substrate is carried into the load lock chamber by correcting the above.

  Furthermore, it is preferable that the positioning pin of the pick has a ring member that is rotatable with respect to a vertical axis. Moreover, it is preferable that the said pick has a back surface support pad provided with the roller which supports the back surface of a board | substrate and can be rotated in the moving direction at the time of positioning a board | substrate.

In a third aspect of the present invention, a substrate is positioned in a substrate processing system having a vacuum processing unit for performing vacuum processing with heat, and a transfer chamber to which the vacuum processing unit is connected and whose interior is held in vacuum. A pick having a positioning pin for holding the substrate in a positioned state, and a drive unit for driving the pick to carry the substrate into and out of the vacuum processing unit by the pick. A substrate transfer method for carrying a substrate in and out of the vacuum processing unit using a substrate transfer device provided in a chamber, wherein the substrate at room temperature when the substrate is transferred into the vacuum processing unit. the reference position location is previously grasped on X-Y coordinates, in the actual processing, when loading the substrate into the vacuum processing unit, before Symbol reference position Obtain the position displacement due to heat on the X-Y coordinate, and calculates a shift amount of the substrate from the position of the X-Y coordinate after the positional deviation, the said substrate by correcting the amount of deviation vacuum processing unit A substrate carrying method is provided.

  According to a fourth aspect of the present invention, there is provided a storage medium that operates on a computer and stores a program for controlling a substrate transport apparatus, and the program is executed when the substrate transport method according to the third aspect. The storage medium is characterized by causing a computer to control the substrate transfer device.

According to the present invention, when the substrate is carried into the vacuum processing unit, the reference position of the substrate at normal temperature is previously grasped on X-Y coordinates, in the actual processing, when the substrate is carried into the vacuum processing unit the displacement caused by the heat from the group reference position determined on the X-Y coordinate, and calculates a shift amount of the substrate from the position of the X-Y coordinate after the positional deviation, the vacuum processing a substrate by correcting the amount of deviation Since the drive unit is controlled so that it is transported to the unit, in substrate processing equipment that performs processing with heat in a vacuum , even if the substrate is transported at high speed, the displacement of the substrate is suppressed, and thermal expansion is also corrected. And the positional accuracy of the substrate can be increased.

1 is a horizontal sectional view showing a schematic structure of a multi-chamber type substrate processing system according to an embodiment of the present invention. It is a top view which shows the 1st example of a board | substrate conveyance apparatus. It is a front view which shows the 1st example of a board | substrate conveyance apparatus. It is a figure for demonstrating the drive state of the 1st example of a board | substrate conveyance apparatus. It is a perspective view for demonstrating the pick of the 1st example of a board | substrate conveyance apparatus. It is a figure for demonstrating the preferable example of the back surface support pad of the pick of the 1st example of a board | substrate conveyance apparatus. It is a disassembled perspective view which shows the structure of the back surface support pad of FIG. It is the perspective view and sectional drawing for demonstrating the preferable example of the stopper pin of the pick of the 1st example of a board | substrate conveyance apparatus. It is sectional drawing for demonstrating the other preferable example of the stopper pin of the pick in the 1st example of a board | substrate conveyance apparatus. It is a top view which shows the principal part of the 2nd example of a board | substrate conveyance apparatus. It is a figure which shows the clamp mechanism of the 2nd example of a board | substrate conveyance apparatus. It is a figure for demonstrating the state of the articulated arm mechanism and the state of a clamp mechanism in the 2nd example of a board | substrate conveyance apparatus at the time of the clamp start by a clamp mechanism, and completion. It is a figure which shows the relationship between the stroke of an articulated arm mechanism, and the capture range in a pick in the 2nd example of a board | substrate conveyance apparatus. In the 2nd example of a board | substrate conveyance apparatus, it is a figure which shows the speed-acceleration curve and release timing at the time of expansion | extension of an articulated arm mechanism, and the speed-acceleration curve and clamp timing at the time of degeneracy. It is a figure for demonstrating the mode of the displacement by thermal expansion at the time of hold | maintaining a wafer with the pick of a board | substrate conveyance apparatus. It is a flowchart which shows the procedure of the correction | amendment of the position shift by the thermal expansion in a board | substrate conveyance apparatus. It is a figure for demonstrating the measurement aspect of the position of the wafer by the sensor in the case of correction | amendment of the position shift by thermal expansion. It is a figure for demonstrating the aspect which correct | amends deviation | shift amount actually in the case of the correction | amendment of the position shift by thermal expansion. It is a figure for demonstrating the measurement of the reference | standard position of a wafer, and calculation of the deviation | shift amount of a wafer. Speed / acceleration curve at the time of extension of the articulated arm mechanism and the optical sensor installable area in the first and second examples of the substrate transfer device, and a speed / acceleration curve at the time of degeneration and the first example of the substrate transfer device It is a figure which shows the optical sensor installation possible area | region in a 2nd example. It is a figure which shows the correlation of the elongation measured with the laser displacement meter used for the elongation correction of an arm mechanism, and the measurement result in a position detection sensor unit. It is a figure which shows the relationship between the temperature of an arm mechanism, and the elongation of the arm mechanism measured with the laser displacement meter. It is a figure which shows the relationship between the idling time and the elongation of the arm mechanism measured with the laser displacement meter.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the accompanying drawings.

<Substrate Processing System According to One Embodiment of the Present Invention>
FIG. 1 is a horizontal sectional view showing a schematic structure of a multi-chamber type substrate processing system according to an embodiment of the present invention.

  The substrate processing system 100 includes four vacuum processing units 1, 2, 3, and 4 that perform high-temperature processing with heat such as film formation processing, and each of these vacuum processing units 1 to 4 has a hexagonal shape. It is provided corresponding to each of the four sides of the transfer chamber 5 formed. In addition, load lock chambers 6 and 7 according to the present embodiment are provided on the other two sides of the transfer chamber 5, respectively. A load / unload chamber 8 is provided on the opposite side of the load lock chambers 6 and 7 from the transfer chamber 5, and a wafer W as a substrate to be processed is placed on the opposite side of the load lock chambers 6 and 7 of the load / unload chamber 8. Three ports 9, 10, and 11 for attaching a hoop F that is a container to be accommodated are provided. The vacuum processing units 1, 2, 3, and 4 are configured to perform predetermined vacuum processing, for example, etching or film formation processing, with the object to be processed placed on the processing plate.

  The vacuum processing units 1 to 4 are connected to the sides of the transfer chamber 5 via gate valves G as shown in the figure, and these are communicated with the transfer chamber 5 by opening the corresponding gate valves G. By closing the corresponding gate valve G, the transfer chamber 5 is shut off. The load lock chambers 6 and 7 are connected to the remaining sides of the transfer chamber 5 via the first gate valve G1 and connected to the loading / unloading chamber 8 via the second gate valve G2. Has been. The load lock chambers 6 and 7 have a stage on which the wafer W is placed, can be changed between atmospheric pressure and a vacuum state at a high speed, and are opened in a vacuum state by opening the first gate valve G1. It communicates with the transfer chamber 5 and is shut off from the transfer chamber 5 by closing the first gate valve G1. The second gate valve G2 is opened to communicate with the loading / unloading chamber 8, and the second gate valve G2 is closed to shut off the loading / unloading chamber 8.

  In the transfer chamber 5, there is provided a substrate transfer apparatus 12 according to this embodiment that carries in and out the wafer W with respect to the vacuum processing units 1 to 4 and the load lock chambers 6 and 7. The substrate transfer device 12 is disposed substantially at the center of the transfer chamber 5 and has two articulated arm mechanisms 41 and 42. The detailed structure of the substrate transfer device 12 will be described later.

  The ports 9, 10, 11 of the loading / unloading chamber 8 are each provided with a shutter (not shown), and the ports 9, 10 are accommodated in a state where the wafer W is accommodated or an empty hoop F is placed on the stage S. , 11, and when attached, the shutter comes off and communicates with the loading / unloading chamber 8 while preventing intrusion of outside air. An alignment chamber 15 is provided on the side surface of the loading / unloading chamber 8, and the wafer W is aligned there.

  In the vicinity of the loading / unloading ports of the vacuum processing units 1 to 4 and the load lock chambers 6 and 7 in the transfer chamber 5, position detection sensor units 22 are respectively provided at positions where wafers W loaded / unloaded pass through. ing. The position detection sensor unit is for detecting the position of the wafer W placed on the multi-joint arm mechanisms 41 and 42 of the substrate transfer apparatus 12. Each position detection sensor unit 22 includes two optical sensors 23a, 23b. As the optical sensors 23a and 23b, for example, transmission type sensors are used.

  In the loading / unloading chamber 8, a substrate transfer device 16 for loading / unloading the wafer W into / from the FOUP F and loading / unloading the wafer W into / from the load lock chambers 6, 7 is provided. The substrate transfer device 16 has an articulated arm structure, and can run on the rail 18 along the direction in which the hoops F are arranged, and the wafer W is placed on the support arm 17 at the tip thereof. Transport. A downflow of clean air is formed in the carry-in / out chamber 8.

  Each component in this substrate processing system 100, for example, the vacuum processing units 1 to 4, the transfer chamber 5, and the gas supply system and exhaust system in the load lock chambers 6 and 7, the substrate transfer devices 12, 16 and the gate valve, It is controlled by an overall control unit 30 having a controller equipped with a microprocessor (computer). In addition to the controller that actually controls, the overall control unit 30 includes a storage unit that stores a process sequence of the substrate processing system 100 and a process recipe that is a control parameter, an input unit, a display, and the like. Accordingly, the substrate processing system 100 is controlled.

<First Example of Substrate Transfer Device>
Next, a first example of the substrate transfer apparatus mounted on the processing system will be described.
FIG. 2 is a plan view showing a first example of the substrate transfer apparatus, and FIG. 3 is a front view thereof. The substrate transfer device 12 includes a rotary base 40 that is rotatably supported by the bottom plate 5a of the transfer chamber 5 serving as a base, and a pick 41c that holds the wafer W and is supported by the rotary base 40 so as to be capable of turning and bending. A first multi-joint arm mechanism 41 and a second multi-joint arm mechanism 42 having 42c, and a drive link mechanism 43 for selectively bending and extending one of the first multi-joint arm mechanism 41 and the second multi-joint arm mechanism 42; It has a drive unit 44 having a drive mechanism for rotating the rotation base 40 and a drive mechanism for swinging the drive link mechanism 43, and a transport control unit 45 for controlling the transport operation. The transport control unit 45 is controlled by the overall control unit 30. Each drive mechanism of the drive unit 44 has a stepping motor that is controlled by the number of pulses at a constant angle.

  The rotation base 40 is rotated via a hollow shaft 50 by a drive mechanism built in the drive unit 44. By rotating the rotation base 40, the first multi-joint arm mechanism 41 and the second multi-joint arm mechanism 42 can access a desired unit.

  The first articulated arm mechanism 41 includes a first arm 41a having a base end connected to the rotary base 40 so as to be turnable by a shaft 51, and a base end capable of turning by a shaft 52 to the tip of the first arm 41a. And a pick 41c for holding the wafer W, the base end of which is pivotally connected to the distal end of the second arm 41b by a shaft 53. A pulley having a predetermined diameter is fixed to each shaft, and a belt is stretched around the pulley. The first arm 41a, the second arm 41b, and the pick 41c are swung at a predetermined rotation angle ratio. 41c is linearly movable with respect to the vacuum processing units 1 to 4 and the load lock chambers 6 and 7, and the wafer W is loaded into the vacuum processing units 1 to 4 and the load lock chambers 6 and 7. Unloading is possible.

  The second multi-joint arm mechanism 42 has a structure similar to that of the first multi-joint arm mechanism 41 and is provided symmetrically, and a first arm 42 a whose base end is pivotally connected to the rotary base 40 by a shaft 54. A second arm 42b whose base end is pivotally connected to the distal end of the first arm 42a by a shaft 55, and a base end is pivotally connected to the distal end of the second arm 42b by a shaft 56. It has a pick 42c for holding the wafer W, and can operate in the same manner as the first articulated arm mechanism 41.

  In other words, the substrate transfer device 12 is driven by the drive unit 44 via the mechanical units of the multi-joint arm mechanisms 41 and 42 and the drive link mechanism 43, whereby the picks 41c and 42c are moved to the vacuum processing units 1 to 4 and the load lock. The chambers 6 and 7 can be accessed, and the wafers W are carried into and out of the vacuum processing units 1 to 4 and the load lock chambers 6 and 7 using the picks 41c and 42c. .

  The drive link mechanism 43 includes a drive arm 61 provided so as to be swingable via a shaft 60 provided coaxially inside the hollow shaft 50 by a drive mechanism built in the drive unit 44, and the drive arm 61. One end of the first articulated arm mechanism 41 is rotatably connected to the lower part of the first arm 41a and the second articulated arm mechanism 42 is rotatably connected to the lower part of the first arm 42a. It has two driven arms 62 and 63 connected. Then, by rotating the shaft 60 and swinging the drive arm 61 forward and backward via a pulley and a belt (not shown), one of the first multi-joint arm mechanism 41 and the second multi-joint arm mechanism 42 is extended, The other can be bent. That is, one articulated arm mechanism is extended by swinging the drive arm 61 to one side, and the other articulated arm mechanism is extended by swinging the drive arm 61 to the other side.

  Specifically, as shown in FIG. 4, by swinging the drive arm 61 in the direction of arrow A, the first arm 41a of the first multi-joint arm mechanism 41 rotates in the direction of arrow B, so that the first multi-joint The arm mechanism 41 extends, and the pick 41c moves linearly in the arrow C direction.

  As shown in FIG. 5, each of the picks 41c and 42c includes four back surface support pads 71 that support the back surface of the wafer W, two front end side stopper pins 72 that support the end portion of the wafer W on the front end side, The base end side has two base end side stopper pins 73 that support the end portion of the wafer W, and the front end side stopper pins 72 and the base end side are supported while the back surface of the wafer W is supported by the back surface support pad 71. The wafer W is positioned on the picks 41c and 42c by pressing the wafer W against the distal end side stopper pin 72 by the inertia when the wafer W is sandwiched between the stopper pins 73 and the articulated arm mechanism is extended. That is, the two distal end side stopper pins function as positioning pins. Thereby, the positional accuracy of the wafer W on the picks 41c and 42c can be kept high even if it is transported at a high speed.

  In this way, on the picks 41c and 42c, the wafer W is pressed against the front end side stopper pin 72 and positioned by the inertia when the multi-joint arm mechanism is extended, so that the position accuracy (position reproducibility) is improved. The back surface support pad 71 preferably has a structure in which the wafer W on the back support pad 71 can easily move. For this reason, it is possible to use a carbon sphere having a good sliding property, for example, a carbon sphere composed only of carbon having self-lubricating properties. However, since the friction coefficient increases in vacuum and the position reproducibility decreases, a roller having a roller (pulley) 75 that rolls in a direction in which the wafer W moves with inertia as shown in FIG. 6 instead of a fixed pad. It is preferable to use a pad. In this case, for example, as shown in FIG. 7, the back surface support pad 71 is in a state in which a roller 75 is attached to the rotating shaft 76, and is inserted into the recess 77 a of the receiving member 77 to hold the rotating shaft 76. Therefore, the recess 77 a is closed with the lid 78, and the roller 75 is protruded from the lid 78 so as to be rotatable. The material of the roller 75, the receiving member 77 that receives the roller, and the lid 78 is preferably a hard resin (for example, polybenzimitazole (PBI) resin).

  The distal end side stopper pin 72 and the proximal end side stopper pin 73 are preferably made of a material that is low in friction and hardly generates dust, such as PBI resin. However, even when such a material that hardly generates dust is used, the friction between the stopper pins 72 and 73 and the wafer W increases as the wafer temperature rises. There is a risk of generating particles due to dust. For this reason, as shown in FIG. 8, the structure of the distal end side stopper pin 72 and the proximal end side stopper pin 73 is configured to be freely fitted on the outside of the columnar core 81 fixed perpendicular to the pick and to be rotatable. The ring member 82 is preferably provided. As a result, the ring member 82 rotates when the wafer W comes into contact with the stopper pins 72 and 73, so that a tangential force can be released and dust generation due to friction can be reduced. In the example of FIG. 8, a groove 82a is formed in the upper inner periphery of the ring member 82, a flange 81a is provided at the upper end of the core portion 81, and the flange 81a is engaged with the groove 82a. Further, as shown in FIG. 9, a groove 82b at the inner peripheral upper portion of the ring member 82 and a flange 81b at the upper end of the core portion 81 are formed so that the engaging portion between the ring member 82 and the core portion 81 has a labyrinth structure. May be. By adopting the labyrinth structure in this way, there is an advantage that particles generated due to wear of the ring member 82 and the core portion 81 are hardly scattered.

  The transfer control unit 45 controls the drive mechanism of the drive unit 44 to control the transfer operation of the wafer W in the substrate transfer apparatus 12 and corrects the position shift of the wafer W due to thermal expansion. In the present embodiment, since the wafer W is positioned in the picks 41c and 42c, when the heat treatment is performed in the vacuum processing units 1, 2, 3, and 4, the arms and picks of the articulated arm mechanisms 41 and 42 are used. However, when the unit W expands due to heat from the chamber or the wafer W, the center position of the wafer W is shifted. For this reason, the reference position of the wafer W is measured and transferred using the optical sensors 23a and 23b of the position detection sensor unit 22 provided in the vicinity of the loading / unloading ports of the vacuum processing units 1 to 4 and the load lock chambers 6 and 7. When the wafer W is actually loaded into one of the vacuum processing units 1 to 4 and the load lock chambers 6 and 7, the optical sensors 23a and 23b of the position detection sensor unit 22 are used. The position of the wafer W is measured, and the transfer control unit 45 compares this measurement result with the stored reference position information to grasp the amount of deviation of the wafer W, and corrects the amount of deviation and carries it in. To control.

<Second Example of Substrate Transfer Device>
Next, a second example of the substrate transfer apparatus mounted on the processing system will be described.
In the first example of the substrate transfer apparatus, the wafer W is sandwiched between the distal end side stopper pins 72 and the proximal end side stopper pins 73 on the picks 41c and 42c, and the articulated arm mechanism is extended. The wafer W is positioned by pressing the wafer W against the front end side stopper pins 72 due to inertia, but when the transfer speed is further increased, generation of particles when the wafer W hits the front end side stopper pins 72 and There is a concern that the wafer W may be displaced when the articulated arm mechanisms 41 and 42 are rotated, or the wafer W may be displaced during measurement by the position detection sensor unit 22.

  Therefore, in this example, as shown in FIG. 10 and FIG. 11 which is an enlarged view thereof, the tips of the picks 41c and 42c of the first articulated arm mechanism 41 and the second articulated arm mechanism 42 of the first example. A clamp mechanism 90 for clamping the wafer W after the wafer W is placed between the side stopper pins 72 and the base end side stopper pins 73 is added. Other configurations are the same as those of the substrate transfer apparatus of the first example. In the following description, only the pick 41c of the first multi-joint arm mechanism 41 will be described for convenience, but the same applies to the second multi-joint arm mechanism 42.

  The clamp mechanism 90 uses the rotation mechanism of the pick 41c to clamp the wafer W by the displacement of the cam accompanying the rotation of the pick 41c. The clamp mechanism 90 includes a cam 91 attached to the rotation shaft 46 of the pick 41c, and the cam 91. The wafer W is clamped or released by moving the base end side stopper pin 73 forward / backward by the expansion / contraction of the expansion / contraction member 93, the link mechanism 92 transmitting the displacement of the cam 91 to the expansion / contraction member 93. And a linear guide 94 for guiding the moving member 95. A capture range adjustment member 96 for adjusting the capture range is provided between the link mechanism 92 and the expansion / contraction member 93.

  The telescopic member 93 has a coil spring 93a, a spring fixing block 93b, a moving block 93c, and a position adjusting portion 93d for adjusting the spring force by adjusting the position of the spring fixing block 93b. The moving member 95 is pressed by the urging force via the moving block 93c and the capture range adjusting member 96, and the moving member 95 presses the base end side stopper pin 73 to clamp the end portion of the wafer W.

  The cam 91 rotates relative to the pick 41c when the pick 41c rotates relative to the second arm 41b by the rotation mechanism during the operation of the first articulated arm mechanism 41. A large-diameter portion 91a that presses the mechanism 92, a small-diameter portion 91b that does not press the link mechanism 92, and an inclined portion 91c between them.

  When the large-diameter portion 91 a of the cam 91 is at a position corresponding to the link mechanism 92, the cam 91 presses the link mechanism 92, whereby the moving block 93 c of the telescopic member 93 is moved via the capture range adjustment member 96. The base end side stopper pin 73 is retracted together with the moving member 95 so that the wafer W can be received and delivered. When the small-diameter portion 91b of the cam 91 is at a position corresponding to the link mechanism 92, the link mechanism 92 is not pressed, and the moving member 95 presses the base end side stopper pin 73 as described above, and the wafer W Clamp the end of the. Further, when the inclined portion 91 c corresponds to the link mechanism 92, the proximal end side stopper pin 73 moves in the clamping direction or the retracting direction.

  The position of the cam 91 is adjusted so that the position of the base end side stopper pin 73 is determined in synchronization with the position of the pick 41 c of the first articulated arm mechanism 41. Taking the case of clamping after receiving the wafer W as an example, in the state where the first articulated arm 41 receiving the wafer W is extended, the cam 91 is in a position to press the link mechanism 92 by the large diameter portion 91a. The telescopic member 93 is pressed via the mechanism 92, and the proximal end stopper pin 73 is retracted by the moving member 95. In the process of retracting the first articulated arm mechanism 41 after receiving the wafer W, the position of the cam 91 corresponding to the link mechanism 92 reaches the end of the large-diameter portion 91a as shown in FIG. At that time, clamping of the wafer W is started. When the first articulated arm mechanism 41 is further retracted and the position of the cam 91 corresponding to the link mechanism 92 reaches the small diameter portion 91b as shown in FIG. 12B through the inclined portion 91c, the clamp of the wafer W is performed. Is completed. When removing the clamp of the wafer W and enabling the delivery of the wafer W, the movement is completely reversed.

  FIG. 13 shows the relationship between the stroke of the first articulated arm 41 and the capture range by the clamp mechanism 90 at this time. Here, the capture range refers to the length from the pressing portion of the base end side stopper pin 73 to the opposite end portion of the wafer W. In this example, the diameter of the wafer W is 300 mm and the wafer W is clamped. The capture range is 300 mm, and the capture range when the wafer W is released is 306 mm. The stroke of the first articulated arm 41 is the distance between the center of the rotation base 40 (center of the shaft 60) and the center of the wafer W on the pick 41c, and the first articulated arm 41 is most degenerated. The stroke at the time is 308 mm, and the stroke when it is most extended is 980 mm.

  At the time of clamping the wafer W, a in FIG. 13 is a range where the wafer W is received, the cam 91 is in a position where the large diameter portion 91a presses the link mechanism 92, and the capture range is 306 mm at the maximum. b is a position where the position of the cam 91 corresponding to the link mechanism 92 shifts from the large diameter portion 91a to the inclined portion 91c, which is a clamp start position. The position c corresponding to the link mechanism 92 of the cam 91 is an inclined portion 91c, which is a range in which the wafer W is clamped, and the capture range decreases. d is a position where the position of the cam 91 corresponding to the link mechanism 92 shifts from the inclined portion 91c to the small diameter portion 91b, which is a clamp end position, and the capture range is 300 mm. e is a range in which the stroke is further reduced. The position of the cam 91 corresponding to the link mechanism 92 corresponds to the small diameter portion 91b, and the wafer W remains clamped.

  At the time of release, the situation is completely reversed, and when reaching e to d in the clamped state, the position of the cam 91 corresponding to the link mechanism 92 shifts from the small diameter portion 91b to the inclined portion 91c and becomes the release start position. In c, the capture range is expanded and the wafer W is released, and b is the release end position. Then, the wafer W is transferred within the range a.

  FIG. 14 shows a speed / acceleration curve when the first multi-joint arm mechanism 41 is extended (released) and a speed / acceleration curve when it is retracted (clamped). As shown in FIG. 14a, when the first articulated arm mechanism 41 is extended and the wafer W is released, the acceleration is negative in the longer range of the first articulated arm mechanism 41, that is, the deceleration. It becomes an area. At the time of extension, the wafer W is pressed against the front end side stopper pin 72 in a region where the acceleration is negative. Therefore, it is sufficient to release the clamp of the wafer W (release the wafer W) within this range. Further, as shown in FIG. 14b, when the first articulated arm mechanism 41 is retracted to clamp the wafer W, the acceleration is positive in the longer range of the first articulated arm mechanism 41, that is, acceleration. It becomes an area. At the time of degeneration, the wafer W is pressed against the front end side stopper pin 72 in a region where the acceleration is positive. Therefore, the wafer W may be clamped within this range. As described above, when the wafer W is pressed against the front end side stopper pin 72, the clamping operation and the clamping release operation are performed, so that the wafer W does not move at that time, and the positional accuracy is not lowered.

  In the second example, similarly to the first example, the transfer control unit 45 controls the driving mechanism of the drive unit 44 to control the transfer operation of the wafer W in the substrate transfer device 12, and also the wafer caused by thermal expansion. The position shift of W is corrected.

<Operation of substrate processing system>
Next, the operation of the substrate processing system 100 will be described.
First, the wafer W is taken out from the FOUP F connected to the loading / unloading chamber 8 by the substrate transfer device 16 and loaded into the load lock chamber 6 (or 7). At this time, the inside of the load lock chamber 6 (or 7) is set to an air atmosphere, and then the wafer W is loaded with the second gate valve G2 opened.

  Then, the load lock chamber 6 (or 7) is evacuated to a pressure corresponding to the transfer chamber 5, the first gate valve G1 is opened, and the first articulated arm 41 or the second of the substrate transfer device 12 is opened. The wafer W in the load lock chamber 6 (or 7) is received by the articulated arm 42, the gate valve G of any vacuum processing unit is opened, the wafer W is loaded therein, and film formation is performed on the wafer W. Vacuum treatment with heat such as is performed.

  When the vacuum processing is completed, the gate valve G is opened, the substrate transfer apparatus 12 carries out the wafer W from the corresponding vacuum processing unit, the first gate valve G1 is opened, and the wafer W is loaded into the load lock chamber 6 and Then, the wafer W is returned to atmospheric pressure while cooling the wafer W. Thereafter, the second gate valve G2 is opened, and the processed wafer W is stored in the FOUP F by the substrate transfer device 16. Such an operation is repeated by the number of wafers W in the FOUP F.

  At this time, when the substrate transfer apparatus of the first example is used as the substrate transfer apparatus 12, the wafer W of the first multi-joint arm mechanism 41 and the second multi-joint arm mechanism 42 is held when the wafer W is transferred. The picks 41c and 42c have a distal end side stopper pin 72 and a proximal end side stopper pin 73, and the wafer W is sandwiched therebetween. Then, the wafer W is positioned on the picks 41c and 42c by pressing the wafer W against the distal end side stopper pin 72 by inertia when the multi-joint arm mechanism is extended. For this reason, even if the wafer W is conveyed at high speed, the wafer W on the picks 41c and 42c is prevented from slipping, and the wafer positional accuracy can be kept high. Further, even if the stopper pins 72 and 73 (the core portion 81 or the ring member 82) are worn, the wafer W is positioned on the picks 41c and 42c by pressing the wafer W against the distal end side stopper pins 72.

  Thus, when the wafer W is pressed against the front end side stopper pin 72 and positioned by inertia when the multi-joint arm mechanism is extended, the wafer W is required to be easily moved on the back surface support pad 71. By configuring the back support pad 71 with a material having good lubricity such as a carbon sphere, a certain degree of positional accuracy can be obtained. However, when the wafer W is transported in a vacuum as in this embodiment, normal pressure is used. Even with a material with good lubricity, friction increases. On the other hand, by using a roller pad having a roller (pulley) 75 that rolls in a direction in which the wafer W moves with inertia as shown in FIG. 6, the wafer W can easily move even in a vacuum, and the wafer W is positioned with high accuracy. can do.

  Further, when the picks 41c and 42c are configured to hold the wafer W by the distal end side stopper pins 72 and the proximal end side stopper pins 73, when the wafer W becomes high temperature as in this embodiment, the stopper pins 72, Even if a material that does not easily generate dust is used as 73, the friction between the stopper pins 72 and 73 and the wafer W increases as the wafer temperature rises. May occur. However, as shown in FIG. 8 and FIG. 9 described above, by providing the rotatable ring member 82 on the outer peripheral side, the tangential force can be released and dust generation due to friction can be reduced.

  By the way, in the first example of the substrate transfer device, the wafer W is sandwiched between the distal end side stopper pin 72 and the proximal end side stopper pin 73 on the picks 41c and 42c, and the articulated arm mechanism is extended. The wafer W is positioned by pressing the wafer W against the front end side stopper pins 72 with inertia, but the wafer W is movable between the front end side stopper pins 72 and the base end side stopper pins 73, so that the wafer W is transferred. When the speed is further increased, there is a concern about generation of particles when the wafer W hits the front end side stopper pin 72 and displacement of the wafer W when the multi-joint arm mechanisms 41 and 42 are swung.

  Therefore, in the second example of the substrate transfer apparatus, the wafer W is placed between the distal end side stopper pin 72 and the proximal end side stopper pin 73 on the picks 41c and 42c, and then the proximal end side stopper is clamped by the clamp mechanism 90. The pins 73 are pressed against the wafer W to clamp the wafer W.

  In this way, by clamping the wafer W, even if the transfer speed is further increased, the wafer W is prevented from hitting the front end side stopper pins 72, and the generation of particles can be effectively prevented. Further, it is possible to prevent the wafer W from being displaced when the articulated arm mechanisms 41 and 42 are turned.

  As described above, when the first multi-joint arm mechanism 41 is taken as an example of the clamp mechanism 90, the wafer W is clamped by the displacement of the cam 91 accompanying the rotation of the pick 41c using the rotation mechanism of the pick 41c. Is used. The position of the cam 91 is adjusted so that the advance / retreat of the proximal end stopper pin 73 is determined in synchronization with the rotational position of the pick 41 c of the first articulated arm mechanism 41. More specifically, when clamping when receiving and retracting the wafer W, the cam 91 presses the link mechanism 92 by the large-diameter portion 91a when the first articulated arm mechanism 41 receiving the wafer W is extended. In the process where the first articulated arm mechanism 41 is retracted after the base end side stopper pin 73 is retracted and the wafer W is received after the telescopic member 93 is pressed via the link mechanism 92. The position corresponding to the link mechanism 92 reaches the end of the large-diameter portion 91a. At that time, the clamping of the wafer W is started, and the first multi-joint arm mechanism 41 is further retracted, and corresponds to the link mechanism 92 of the cam 91. When the position reaches the small diameter portion 91b through the inclined portion 91c, the clamping of the wafer W is completed (see FIG. 12). When removing the clamp of the wafer W and enabling the delivery of the wafer W, the movement is completely reversed.

  In this way, the clamp mechanism 90 using the cam 91 is used, the rotation mechanism of the pick 41c is used, the wafer W is clamped by the operation of the cam 91 accompanying the rotation of the pick 41c, and the clamp is released. No special power or control mechanism is required, and the equipment does not become large. Further, since the wafer W is clamped by the clamp mechanism 90 after the wafer W is placed between the distal end side stopper pin 72 and the proximal end side stopper pin 73 in this way, the capture range before clamping is set to the substrate of the first example. The wafer W can be made larger and easier to receive and deliver than the transfer mechanism.

  When the first multi-joint arm mechanism 41 is extended to release the wafer W, the acceleration of the range where the stroke of the first multi-joint arm mechanism 41 is longer is negative, that is, in the deceleration region, the wafer W When clamping is performed (release of the wafer W) and the first multi-joint arm mechanism 41 is retracted to clamp the wafer W, the first multi-joint arm mechanism 41 has a positive acceleration in the longer range. That is, by clamping the wafer W in the acceleration region, the wafer W can be clamped and released in a state where the wafer W is pressed against the front end side stopper pin 72. For this reason, when the wafer W is clamped and when the clamp is released, the wafer W does not move, and the positional accuracy is not lowered.

  By the way, in any of the substrate transport mechanisms of the first example and the second example, the picks 41c and 42c are configured to hold the wafer W by the front end side stopper pins 72 and the base end side stopper pins 73. As schematically shown in FIG. 15, since the wafer W is positioned by the pick 41c (42c), the arms and picks of the articulated arm mechanisms 41 and 42 are thermally expanded by the heat of the vacuum processing units 1 to 4. Then, the position of the wafer W is displaced by the thermal expansion. When the wafer W is transferred to the vacuum processing units 1 to 4 or the load lock chambers 6 and 7 in a state where the position of the wafer W is shifted as described above, the wafer W is placed at a position shifted from a predetermined position on the stage. Will be placed.

  Therefore, in the present embodiment, such a positional deviation correction due to thermal expansion is performed by the procedure described below so that the wafer W is transferred to the correct position.

<Correction of wafer misalignment due to thermal expansion>
The correction of the wafer position shift due to such thermal expansion can be performed according to the procedure shown in the flowchart of FIG.

  First, for each module of the vacuum processing units 1 to 4 and the load lock chambers 6 and 7, the wafer reference position is obtained based on the detection values of the optical sensors 23a and 23b of the corresponding position detection sensor unit 22, and the transfer control unit 45 (step 1).

  When the wafer W is actually transferred, it is determined which module of the optical sensor 23a, 23b is used when the first and second multi-joint arm mechanisms 41, 42 of the substrate transfer apparatus 12 are turned (step 2).

  As shown in FIG. 17, when the wafer W is loaded into the module (one of the vacuum processing units 1 to 4 and the load lock chambers 6 and 7) or when the wafer W is returned from the module to the transfer chamber 5, Based on the detection signals of the optical sensors 23a and 23b, the position of the wafer W is measured by the transfer control unit 45 (step 3).

  The transfer control unit 45 calculates a deviation amount of the wafer W from the reference position based on the measurement result, and corrects the deviation amount when the wafer W is loaded into the module as shown in FIG. Next, the drive unit 44 of the substrate transfer device 12 is controlled (step 4).

  Next, a specific method for measuring the reference position of the wafer W and calculating the shift amount will be described. Since each drive mechanism of the drive unit 44 uses a stepping motor, position information can be grasped from a pulse value.

[Measurement of wafer reference position]
The measurement of the reference position of the wafer W is performed when the wafer W in the corresponding module is placed on the pick and returned to the transfer chamber 5 at room temperature. At this time, the pick on which the wafer W is placed is moved linearly. As shown in FIG. 19A, the points where the wafer W shields the light irradiated by the optical sensors S1 and S2 are A and C, and the wafer W is further moved to transmit the light irradiated by the optical sensors S1 and S2. The points that have come to light are designated as B and D. As a known value, the reference wafer radius is 150 mm.

(A) Calculation procedure of inter-sensor distance HH 'First, under this condition, the inter-sensor distance HH' is calculated by the following procedures 1 to 5.
1. The AD pulse value is converted into an actual arm position.
2. The lengths of AB and CD are calculated.
3. Since OH 2 = AO 2 − (AB ÷ 2) 2 holds according to the three-square theorem, the length of OH is calculated from this equation.
4). The length of OH ′ is calculated in the same manner as 1 to 3 above.
5). From the above 3 and 4, HH ′ is calculated as HH ′ = OH + OH ′.

(B) Calculation procedure of coordinates of reference wafer position O Next, the coordinates (x1, y1) of the reference wafer position O are calculated by the following procedures 6 to 8.
6). Let S1 be the X coordinate reference (X = 0).
7). Since the length of OH has already been calculated according to 3 above, the X coordinate (x1) of the reference wafer position O is x1 = OH.
8). The Y coordinate (y1) of the reference wafer position O can be obtained by B arm position + (AB ÷ 2).

[Calculation of wafer displacement]
The amount of deviation of the wafer W is calculated when the wafer W in the corresponding module is placed on the pick and returned to the transfer chamber 5 during actual processing. At this time, as in the measurement of the reference position, the pick on which the wafer W is placed is moved linearly. As the known values, the inter-sensor distance HH ′ and the coordinates of the reference wafer position O are used. As shown in FIG. 19B, as in the measurement of the reference position, the points where the wafer W shields the light irradiated by the optical sensors S1 and S2 are A and C, and the wafer W is further moved to move the optical sensor. B and D are points where the light irradiated by S1 and S2 is transmitted.

(A) Calculation Procedure of Wafer Radius r and X Position of Wafer Position O ′: x2 The X radius: x2 of the wafer radius r and wafer position O ′ is calculated by the following procedures 9 to 11.
9. The AD pulse value is converted into an actual arm position.
10. The lengths of AB and CD are calculated.
11. Since the following two equations hold according to the three-square theorem, r and x2 are calculated by simultaneous equations.
r 2 = (x2) 2 + (AB ÷ 2) 2
r 2 = (HH′−x2) 2 + (CD ÷ 2) 2

(B) Calculation procedure of Y coordinate: y2 of wafer position O 'Y coordinate: y2 of wafer position O' is calculated according to the following 12.
12 y2 = B arm position + (AB ÷ 2)

(C) Calculation procedure of wafer displacement amount The wafer displacement amount is calculated according to the following 13:
13. The shift amount is calculated from the coordinates (x2, y2) of O ′ and the coordinates (x1, y1) of the reference position O by the following formula.
Deviation amount 2 = (x2-x1) 2 + (y2-y1) 2

  As described above, the wafer W is positioned in the picks 41c and 42c, and the position correction is performed by using the sensors provided for the respective modules. Even if the position of the wafer W is shifted due to thermal expansion, the wafer W can be transferred with high positional accuracy. Further, not only the thermal expansion but also the position of the wafer W can be corrected when the position of the wafer W is shifted due to other factors. For example, even if the stopper pins 72 and 73 (the core portion 81 or the ring member 82) are worn, the wafer W can be positioned on the picks 41c and 42c by pressing the wafer W against the distal end side stopper pins 72. The position correction of the wafer W can be performed by the above method. In addition, since the amount of deviation increases, it is possible to grasp the pick and arm replacement timing.

  However, in the case of the substrate transfer apparatus of the first example, there is a possibility that the wafer W may move on the picks 41c and 42c at the time of deceleration, so there is a concern about the positional deviation of the wafer W during measurement by the position detection sensor unit 22. Is done. That is, in the case of the first example, since the wafer W is pressed against one of the stopper pins in the positive acceleration region, that is, in the acceleration region, the optical sensor 23a of the position detection unit 22 is in that region. , 23b, the wafer W is not substantially displaced. However, if the optical sensors 23a and 23b of the position detection unit 22 are installed in a region where the acceleration is negative, that is, a deceleration region, the measurement is performed while the wafer W is moving, and thus the error becomes large. Specifically, when the multi-joint arm mechanism is extended, that is, when the wafer W is loaded into the module, as shown in FIG. 20A, the multi-joint arm mechanism has a short stroke range A. When the articulated arm mechanism is retracted, that is, when the wafer W is returned from the module, as shown in FIG. 20B, the articulated arm mechanism has a long stroke range B as shown in FIG. However, it can only be measured accurately. Therefore, it is difficult to accurately measure the optical sensors 23a and 23b at a predetermined position without causing a positional shift of the wafer W both when the optical sensors 23a and 23b are transferred to the module and returned from the module. In addition, when the installation positions of the optical sensors 23a and 23b are limited, there are cases where measurement cannot be performed with high accuracy.

  On the other hand, in the case of the second example in which the wafer W is clamped, the range C in FIG. 20A, the range D in FIG. 20B, and when the wafer W is loaded into the module and from the module In any case of returning, the position of the wafer W can be measured with accuracy over almost the entire area.

<Extension correction of arm mechanism>
The positional deviation due to the thermal expansion of the wafer can be corrected by the above procedure. However, when processing is performed again after a long period of idling, the first articulated arm mechanism 41 and the second articulated arm mechanism 41 of the substrate transfer apparatus 12 If the actual extension amount of the arm or pick of the articulated arm mechanism 42 is unknown and the carrying operation is performed as it is based on the data immediately before idling, the wafer W is placed on the front end side stopper pin 72 when the wafer W is placed on the pick. Or, there is a risk of riding on the base end side stopper pin 73. For this reason, it is preferable to perform extension correction of the first multi-joint arm mechanism 41 and the second multi-joint arm mechanism 42 (hereinafter simply referred to as an arm mechanism).

  When correcting the extension of the arm mechanism, the amount of extension of the arm mechanism is measured in advance by a displacement meter such as a laser displacement meter, and the elongation measured by the laser displacement meter and the position detection sensor unit 22 are shown in FIG. The correlation with the measurement result is obtained in advance. Then, as shown in FIG. 22, the relationship between the temperature of the arm mechanism and the extension of the arm mechanism is obtained with a laser displacement meter. From the relationship between the idling time and the temperature of the arm mechanism, as shown in FIG. Find the relationship of mechanism elongation. After completion of idling, when the transport operation is started, the extension amount of the arm mechanism is calculated based on the idling time based on FIG. 23, and the arm mechanism is operated using the extension amount as a correction value. Specifically, the wafer is placed on the pick immediately after the idling state is reached, and the extension amount (correction value) of the arm mechanism at the time of resuming the processing is determined based on the data of the thermal expansion change at the time of idling. Based on the position correction.

  As a result, the extension amount of the arm mechanism can be grasped even after idling for a long time, and when the wafer W is placed on the pick, the wafer W rides on the distal end side stopper pin 72 or the proximal end side stopper pin 73. This can be prevented.

  As described above, instead of taking the correlation between the measured value of the laser displacement meter and the idling time in advance, the displacement of the laser displacement meter or the like is introduced into the substrate processing system 100, for example, at the entrance of the load lock chamber 6 or 7. A meter may be provided to measure the displacement of the arm mechanism directly.

<Other applications>
The present invention can be variously modified without being limited to the above embodiment. For example, in the above-described embodiment, the articulated arm mechanism is used as the substrate transport mechanism, but the present invention is not limited to this, and other mechanisms such as a linear motion mechanism may be used. Further, the optical sensor is used as the sensor of the position detection sensor unit. However, the present invention is not limited to this as long as the position is detected, and two sensors are used for one position detection sensor unit. But you can. In addition, the position detection sensor unit is provided in the vicinity of the loading / unloading port of the wafer loading / unloading target module (either the vacuum processing unit or the load lock chamber), but the pick holding the wafer is used for loading and unloading the wafer. It may be in a range that moves linearly. Furthermore, in the above-described embodiment, the substrate processing system provided with four vacuum processing units and two load lock chambers has been described as an example, but the number is not limited thereto. Furthermore, the present invention is not limited to a multi-chamber type vacuum processing apparatus provided with a plurality of vacuum processing units, and can be applied to a system having one vacuum processing unit. Furthermore, it goes without saying that the substrate to be processed is not limited to a semiconductor wafer but can be another substrate such as a glass substrate for FPD.

1-4; Vacuum processing unit 5; Transfer chamber 6, 7; Load lock chamber 8; Loading / unloading chamber 12, 16; Substrate transfer device 22; Position detection sensor unit 23a, 23b; Optical sensor 30; Base 41; first articulated arm mechanism 41a, 42a; first arm 41b, 42b; second arm 41c, 42c; pick 43; drive link mechanism 44; drive unit 45; transport control unit 50; , 53, 54, 55, 56, 60; shaft 61; drive arm 62, 63; driven arm 71; back support pad 72; distal end side stopper pin 73; proximal end side stopper pin 75; roller (pulley)
76; Rotating shaft 81; Core portion 82; Ring member 90; Clamp mechanism 91; Cam 92; Link mechanism 93; Telescopic member 94; Linear guide 95; Moving member 100; Substrate processing system W;

Claims (28)

  1. In a substrate processing system having a vacuum processing unit for performing vacuum processing with heat and a transfer chamber to which the vacuum processing unit is connected and whose interior is kept in vacuum, the substrate processing system is provided in the transfer chamber, A substrate transfer device that carries in and out substrates.
    A pick having positioning pins for positioning the substrate and holding the substrate in a positioned state;
    A drive unit for driving the pick so as to carry the substrate in and out of the vacuum processing unit by the pick;
    A transfer control unit for controlling the transfer operation of the substrate by the pick,
    The conveyance control unit
    When loading the substrate into the vacuum processing unit, advance the reference position location of the substrate at room temperature by previously grasped on X-Y coordinates,
    In actual processing, when loading the substrate into the vacuum processing unit, the positional deviation due to heat from the pre-Symbol reference position determined on said X-Y coordinate from the position of the X-Y coordinate after the positional deviation Calculating the amount of deviation of the substrate ;
    The substrate transfer apparatus, wherein the drive unit is controlled so as to correct the shift amount and carry the substrate into the vacuum processing unit.
  2.   The positioning pin is disposed so as to sandwich the substrate on the pick, and the substrate is positioned by pressing the substrate against the positioning pin with inertia when the pick is moved. Substrate transfer device.
  3.   The substrate transport apparatus according to claim 1, wherein the pick has a plurality of positioning pins, and further includes a clamp mechanism that moves any of the plurality of positioning pins to clamp the substrate on the pick. .
  4.   An articulated arm mechanism including the pick and another arm, wherein the pick is rotatably provided to an adjacent arm, and the clamp mechanism includes a cam that is displaced as the pick rotates, A displacement member that moves the positioning pin forward and backward by displacement to clamp or release the substrate; and an intermediate mechanism that transmits the displacement of the cam to the displacement member. The cam is synchronized with the rotational position of the pick. 4. The substrate transfer apparatus according to claim 3, wherein the position of the positioning pin is adjusted so that the advancement / retraction of the positioning pin is determined.
  5.   The positioning pin includes a distal end side positioning pin provided on the distal end side of the pick and a proximal end positioning pin provided on the proximal end side of the pick, and the clamp mechanism advances and retracts the proximal end positioning pin. The pick is configured to clamp or release the substrate, and when the articulated arm mechanism is extended to release the substrate on the pick for delivery, the pick acceleration is negative. When clamping the substrate after releasing the substrate in a certain range, retracting the articulated arm and receiving the substrate on the pick, clamping the substrate in a range where the acceleration of the pick is positive The board | substrate conveyance apparatus of Claim 4 characterized by the above-mentioned.
  6. The reference position location has a feature in that at room temperature, to detect the substrate by the position detection sensor unit provided at a position where the substrate to be transferred into and out relative to the vacuum processing unit to pass, is determined based on the detected information The board | substrate conveyance apparatus of any one of Claim 1 to 5.
  7. The position information of the substrate when the substrate is carried into the vacuum processing unit is obtained based on the detection information detected by the position detection sensor unit, and the position information of the substrate thus obtained and the reference substrate transfer device according to the position to claim 6, characterized in that to calculate the positional deviation.
  8. The detection of the displacement is performed when the substrate is unloaded from the vacuum processing unit or when the substrate is loaded into the vacuum processing unit, and the correction of the displacement is performed when the substrate is loaded into the vacuum processing unit. The substrate transfer apparatus according to claim 7.
  9. The substrate processing system further includes a load lock chamber connected to the transfer chamber, variable in pressure between an atmospheric atmosphere and vacuum, and transferring a substrate from the atmospheric atmosphere to the transfer chamber,
    The conveyance control unit
    When the substrate is carried into the said load lock chamber, it leaves the reference position location of the substrate at room temperature by previously grasped on X-Y coordinates,
    In actual processing, when loading the substrate into the load lock chamber, the displacement caused by the heat from the pre-Symbol reference position determined on said X-Y coordinate from the position of the X-Y coordinate after the positional deviation Calculating the amount of deviation of the substrate ;
    9. The substrate transfer apparatus according to claim 1, wherein the driving unit is controlled so as to correct the shift amount and carry the substrate into the load lock chamber. 10.
  10.   The substrate transfer apparatus according to claim 1, wherein the positioning pin of the pick includes a ring member that is rotatable with respect to a vertical axis.
  11.   11. The pick according to claim 1, wherein the pick has a back support pad provided with a roller that supports a back surface of the substrate and is rotatable in a moving direction when the substrate is positioned. The board | substrate conveyance apparatus of description.
  12. A vacuum processing unit for performing vacuum processing with heat;
    A transfer chamber to which the vacuum processing unit is connected and the inside is kept in vacuum; and
    A substrate processing system provided in the transfer chamber and including a substrate transfer device that carries the substrate in and out of the vacuum processing unit;
    The substrate transfer device includes:
    A pick having positioning pins for positioning the substrate and holding the substrate in a positioned state;
    A drive unit for driving the pick so as to carry the substrate in and out of the vacuum processing unit by the pick;
    A transfer control unit for controlling the transfer operation of the substrate by the pick,
    The conveyance control unit
    When loading the substrate into the vacuum processing unit, advance the reference position location of the substrate at room temperature by previously grasped on X-Y coordinates,
    In actual processing, when loading the substrate into the vacuum processing unit, the positional deviation due to heat from the pre-Symbol reference position determined on said X-Y coordinate from the position of the X-Y coordinate after the positional deviation Calculating the amount of deviation of the substrate ;
    The substrate processing system, wherein the drive unit is controlled so as to correct the shift amount and to carry the substrate into the vacuum processing unit.
  13.   The positioning pin is disposed so as to sandwich the substrate on the pick, and the substrate is positioned by pressing the substrate against the positioning pin with inertia when the pick is moved. Substrate processing system.
  14.   The substrate processing system according to claim 12, wherein the pick includes a plurality of positioning pins, and further includes a clamp mechanism that moves any of the plurality of positioning pins to clamp the substrate on the pick. .
  15.   The substrate transfer apparatus has an articulated arm mechanism including the pick and another arm, the pick is provided to be rotatable with respect to an adjacent arm, and the clamp mechanism is displaced with the rotation of the pick. A cam, a moving member that moves the positioning pin forward and backward by displacement of the cam, and clamps or releases the substrate, and an intermediate mechanism that transmits the displacement of the cam to the moving member. The substrate processing system according to claim 14, wherein the position of the positioning pin is adjusted so as to be determined in synchronization with a rotational position of the pick.
  16.   The positioning pin includes a distal end side positioning pin provided on the distal end side of the pick and a proximal end positioning pin provided on the proximal end side of the pick, and the clamp mechanism advances and retracts the proximal end positioning pin. The pick is configured to clamp or release the substrate, and when the articulated arm mechanism is extended to release the substrate on the pick for delivery, the pick acceleration is negative. When clamping the substrate after releasing the substrate in a certain range, retracting the articulated arm and receiving the substrate on the pick, clamping the substrate in a range where the acceleration of the pick is positive The substrate processing system according to claim 15, characterized in that:
  17. The reference position location has a feature in that at room temperature, to detect the substrate by the position detection sensor unit provided at a position where the substrate to be transferred into and out relative to the vacuum processing unit to pass, is determined based on the detected information The substrate processing system according to any one of claims 12 to 16.
  18. The position information of the substrate when the substrate is carried into the vacuum processing unit is obtained based on the detection information detected by the position detection sensor unit, and the position information of the substrate thus obtained and the reference the substrate processing system of claim 17, wherein the calculating the positional deviation from the position.
  19. The detection of the displacement is performed when the substrate is unloaded from the vacuum processing unit or when the substrate is loaded into the vacuum processing unit, and the correction of the displacement is performed when the substrate is loaded into the vacuum processing unit. The substrate processing system according to claim 18.
  20. Connected to the transfer chamber, variable in pressure between an atmospheric atmosphere and vacuum, further comprising a load lock chamber for transferring a substrate from the atmospheric atmosphere to the transfer chamber;
    The conveyance control unit
    When the substrate is carried into the said load lock chamber, it leaves the reference position location of the substrate at room temperature by previously grasped on X-Y coordinates,
    In actual processing, when loading the substrate into the load lock chamber, the displacement caused by the heat from the pre-Symbol reference position determined on said X-Y coordinate from the position of the X-Y coordinate after the positional deviation Calculating the amount of deviation of the substrate ;
    20. The substrate processing system according to claim 12, wherein the driving unit is controlled so as to correct the shift amount and carry the substrate into the load lock chamber.
  21.   21. The substrate processing system according to claim 12, wherein the positioning pin of the pick includes a ring member that is rotatable with respect to a vertical axis.
  22.   The pick according to any one of claims 12 to 21, wherein the pick has a back surface support pad provided with a roller that supports the back surface of the substrate and is rotatable in a moving direction when positioning the substrate. The substrate processing system as described.
  23. In a substrate processing system having a vacuum processing unit for performing vacuum processing with heat, and a transfer chamber to which the vacuum processing unit is connected and whose interior is held in vacuum, the substrate processing system has positioning pins for positioning the substrate, A pick that is held in a positioned state; and a drive unit that drives the pick so that the pick is carried into and out of the vacuum processing unit by the pick, and a substrate transfer device provided in the transfer chamber is provided A substrate carrying method for carrying in and carrying out the substrate to and from the vacuum processing unit,
    When loading the substrate into the vacuum processing unit, advance the reference position location of the substrate at room temperature by previously grasped on X-Y coordinates,
    In actual processing, when loading the substrate into the vacuum processing unit, the positional deviation due to heat from the pre-Symbol reference position determined on said X-Y coordinate from the position of the X-Y coordinate after the positional deviation Calculating the amount of deviation of the substrate ;
    A substrate transfer method comprising correcting the shift amount and carrying the substrate into the vacuum processing unit.
  24. The reference position location has a feature in that at room temperature, to detect the substrate by the position detection sensor unit provided at a position where the substrate to be transferred into and out relative to the vacuum processing unit to pass, is determined based on the detected information The substrate carrying method according to claim 23.
  25. The position information of the substrate when the substrate is carried into the vacuum processing unit is obtained based on the detection information detected by the position detection sensor unit, and the position information of the substrate thus obtained and the reference substrate transfer method according to claim 24, characterized in that for calculating the positional deviation from the position.
  26. The detection of the displacement is performed when the substrate is unloaded from the vacuum processing unit or when the substrate is loaded into the vacuum processing unit, and the correction of the displacement is performed when the substrate is loaded into the vacuum processing unit. 26. The substrate carrying method according to claim 25.
  27. The substrate processing system further includes a load lock chamber connected to the transfer chamber, variable in pressure between an atmospheric atmosphere and vacuum, and transferring a substrate from the atmospheric atmosphere to the transfer chamber,
    When the substrate is carried into the said load lock chamber, it leaves the reference position location of the substrate at room temperature by previously grasped on X-Y coordinates,
    In actual processing, when loading the substrate into the load lock chamber, the displacement caused by the heat from the pre-Symbol reference position determined on said X-Y coordinate from the position of the X-Y coordinate after the positional deviation Calculating the amount of deviation of the substrate ;
    27. The substrate transfer method according to claim 23, wherein the substrate is carried into the load lock chamber after correcting the shift amount .
  28.   A storage medium that operates on a computer and stores a program for controlling the substrate transfer apparatus, wherein the program is executed by the substrate transfer method according to any one of claims 23 to 27. And a computer for controlling the substrate transfer apparatus.
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US13/549,046 US20130180448A1 (en) 2011-07-15 2012-07-13 Substrate transfer device and substrate processing system
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