JP5919753B2 - 発光装置および発光装置の製造方法 - Google Patents

発光装置および発光装置の製造方法 Download PDF

Info

Publication number
JP5919753B2
JP5919753B2 JP2011253219A JP2011253219A JP5919753B2 JP 5919753 B2 JP5919753 B2 JP 5919753B2 JP 2011253219 A JP2011253219 A JP 2011253219A JP 2011253219 A JP2011253219 A JP 2011253219A JP 5919753 B2 JP5919753 B2 JP 5919753B2
Authority
JP
Japan
Prior art keywords
light emitting
emitting element
light
transparent member
sealing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011253219A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013110227A5 (enExample
JP2013110227A (ja
Inventor
楠瀬　健
健 楠瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2011253219A priority Critical patent/JP5919753B2/ja
Publication of JP2013110227A publication Critical patent/JP2013110227A/ja
Publication of JP2013110227A5 publication Critical patent/JP2013110227A5/ja
Application granted granted Critical
Publication of JP5919753B2 publication Critical patent/JP5919753B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball

Landscapes

  • Led Device Packages (AREA)
JP2011253219A 2011-11-18 2011-11-18 発光装置および発光装置の製造方法 Active JP5919753B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011253219A JP5919753B2 (ja) 2011-11-18 2011-11-18 発光装置および発光装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011253219A JP5919753B2 (ja) 2011-11-18 2011-11-18 発光装置および発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2013110227A JP2013110227A (ja) 2013-06-06
JP2013110227A5 JP2013110227A5 (enExample) 2014-12-04
JP5919753B2 true JP5919753B2 (ja) 2016-05-18

Family

ID=48706715

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011253219A Active JP5919753B2 (ja) 2011-11-18 2011-11-18 発光装置および発光装置の製造方法

Country Status (1)

Country Link
JP (1) JP5919753B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013201192A (ja) * 2012-03-23 2013-10-03 Toshiba Corp 半導体発光装置及びその製造方法
CN105874618A (zh) * 2014-01-08 2016-08-17 皇家飞利浦有限公司 经波长转换的半导体发光器件
JP2016062899A (ja) * 2014-09-12 2016-04-25 株式会社東芝 半導体発光装置
WO2017134994A1 (ja) * 2016-02-02 2017-08-10 シチズン電子株式会社 発光装置およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005167079A (ja) * 2003-12-04 2005-06-23 Toyoda Gosei Co Ltd 発光装置
JP4923408B2 (ja) * 2005-01-26 2012-04-25 パナソニック株式会社 発光装置の製造方法
JP5200471B2 (ja) * 2006-12-26 2013-06-05 日亜化学工業株式会社 発光装置およびその製造方法
CN101569024B (zh) * 2007-02-21 2011-01-12 松下电器产业株式会社 半导体发光器件及半导体发光装置的制造方法
US20090039375A1 (en) * 2007-08-07 2009-02-12 Cree, Inc. Semiconductor light emitting devices with separated wavelength conversion materials and methods of forming the same
JP2010080553A (ja) * 2008-09-24 2010-04-08 Panasonic Corp 発光体および照明用光源

Also Published As

Publication number Publication date
JP2013110227A (ja) 2013-06-06

Similar Documents

Publication Publication Date Title
US10230034B2 (en) Light emitting device and method for manufacturing light emitting device
US8377726B2 (en) Method for manufacturing light emitting device and light emitting device
US9478722B2 (en) Light emitting device and method for manufacturing same
CN105098029B (zh) 发光装置
JP6555247B2 (ja) 発光装置及びその製造方法
JP6237181B2 (ja) 発光装置の製造方法
US8759855B2 (en) Light emitting device including support member and bonding member
JP2011233650A (ja) 半導体発光装置
JP2016072304A (ja) 発光装置及び発光装置の製造方法
JP6458793B2 (ja) 発光装置の製造方法
JP6519177B2 (ja) 発光装置及び発光装置の製造方法
JP2015220392A (ja) 発光装置の製造方法
JP5919753B2 (ja) 発光装置および発光装置の製造方法
US20160053968A1 (en) Light emitting device and method of manufacturing the same
JP2019134187A (ja) 発光装置の製造方法
JP2018011088A (ja) 発光装置
JP6597135B2 (ja) 発光装置
CN102403432B (zh) 发光结构及其制造方法
HK1162083A (en) Method for manufacturing light emitting device and light emitting device
CN105762251A (zh) 发光结构及其制造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20141016

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20141016

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20150819

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150825

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151021

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160315

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160328

R150 Certificate of patent or registration of utility model

Ref document number: 5919753

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250