JP5914243B2 - Circuit module manufacturing method - Google Patents

Description

The present invention relates to a circuit module of the electronic components, more particularly to a method of manufacturing a circuit module which shielding layer is formed on the surface of the insulating layer covering the electronic components.

  2. Description of the Related Art Conventionally, as a circuit module, one that blocks external noise by a shield layer is known (see, for example, Patent Documents 1 and 2). In the circuit module manufacturing process described in Patent Documents 1 and 2, an insulating layer is stacked on a collective substrate composed of a plurality of circuit substrates, and half-cut from the insulating layer side along the dividing line of the collective substrate. Subsequently, a conductive material is applied from the insulating layer side of the collective substrate, and a shield layer is formed on the surface of the insulating layer and in the half-cut groove. And the circuit module by which the upper surface and side surface of the insulating layer were coat | covered with the shield layer is formed by the intermediate position in the width direction of the half cut groove | channel in which the shield layer was formed being fully cut with a thin blade.

JP 2004-172176 A JP 2008-042152 A

  However, in the circuit module formed by the manufacturing method described above, the shield layer is exposed from the circuit module, so that the metal component in the shield layer moves to the mounting substrate side on the side surface of the shield layer (hereinafter referred to as migration). Therefore, there is a possibility that a problem such as a short circuit occurs between the shield layer of the circuit module and the conductor pattern of the mounting board (motherboard). Although it is conceivable to eliminate the shield layer as a countermeasure against the migration, there is a problem that the shield layer is easily affected by external noise as much as the shield layer is not formed.

The present invention has been made in view of such circumstances, while reducing the influence of external noise, and an object thereof is to provide a method of manufacturing a circuit module capable of suppressing migration.

  The method for manufacturing a circuit module of the present invention includes a step of laminating an insulating layer on one surface of a collective substrate on which components are arranged, and a step of forming a pair of parallel grooves in the insulating layer along each division line of the collective substrate A step of applying a conductive material to the insulating layer so as to fill the pair of parallel grooves to form a shield layer, and between the pair of parallel grooves along each dividing line of the collective substrate And a step of dividing. According to this configuration, the side surface of the shield layer surrounding the part is formed by filling the pair of parallel grooves with the conductive material. Moreover, the circuit module by which the side surface of the shield layer was coat | covered with the insulating layer by dividing | segmenting between a pair of parallel grooves is formed. Therefore, external noise can be blocked by the shield layer, and migration on the side surface of the shield layer can be suppressed. Therefore, even when the circuit module is mounted on the mounting board, it is possible to prevent problems such as a short circuit on the mounting board.

  In the circuit module manufacturing method of the present invention, in the step of forming the shield layer, the conductive material is applied while masking between the pair of parallel grooves. According to this configuration, the shield layer is not formed between the pair of parallel grooves. Therefore, when it divides | segments between a pair of parallel grooves, a shield layer is not exposed from the division surface used as the side surface of a circuit module.

  In the circuit module manufacturing method of the present invention, in the step of forming the pair of parallel grooves, a pair of parallel grooves reaching the collective substrate is formed, and the conductor pattern formed on the collective substrate and the shield layer are electrically connected. Thus, a conductive material is applied to the pair of parallel grooves. According to this configuration, the conductive pattern can be connected to the ground of the mounting substrate via the shield layer by the conductive material filled in the pair of parallel grooves.

  In the circuit module manufacturing method of the present invention, in the step of forming the pair of parallel grooves, a chamfered portion is formed at the upper ends of the pair of parallel grooves. According to this configuration, it is possible to prevent the corners of the insulating layer formed by the pair of parallel grooves from being lost during the manufacturing of the circuit module.

  In the circuit module manufacturing method of the present invention, in the step of dividing between the pair of parallel grooves, the gap between the pair of parallel grooves is divided by using a cutting blade that is thinner than between the pair of parallel grooves. . According to this configuration, the outer surface of the circuit module is divided so as to be an insulating layer, and the insulating layer can be left outside the side surface of the shield layer.

  According to the present invention, by covering the side surface of the shield layer surrounding the periphery with the insulating layer, the influence of external noise can be reduced and migration can be suppressed.

1 is an overall view of a circuit module according to the present embodiment. It is a figure which shows an example of the manufacturing method of the circuit module which concerns on a comparative example. It is a figure which shows an example of the manufacturing method of the circuit module which concerns on this Embodiment. It is a figure which shows an example of the manufacturing method of the circuit module which concerns on a modification.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The circuit module will be described with reference to FIG. FIG. 1 is an overall view of a circuit module according to the present embodiment. 1A is a perspective view of the circuit module, and FIG. 1B is a cross-sectional view of the circuit module.

  As shown in FIGS. 1A and 1B, in the circuit module 1, an insulating layer 3 is laminated on a circuit board 2, and the shield layer 4 is exposed from the upper surface of the insulating layer 3. The circuit board 2 is formed in a thin plate shape with an insulating resin such as glass epoxy resin. A component 5 such as an IC is mounted on one surface 11 of the circuit board 2 and is connected to an electrode 6 formed on the one surface 11 by wire bonding or the like. A conductor pattern 7 connected to the electrode 6 is provided inside the circuit board 2. The conductor pattern 7 is embedded in the circuit board 2 so as not to be exposed from the side surface 12 of the circuit board 2.

  The insulating layer 3 is laminated on the one surface 11 of the circuit board 2 so as to harden the gap between the components 5 mounted on the circuit board 2 with an insulating resin. The side surface 13 of the insulating layer 3 is formed flush with the side surface 12 of the circuit board 2. Thus, the side surface of the circuit module 1 is formed by the insulating resin of the circuit board 2 and the insulating layer 3. The shield layer 4 is provided on the insulating layer 3 so as to cover the component 5 in the insulating layer 3 with a conductive material such as silver paste. The shield layer 4 is formed in a box shape with the lower surface opened by a surface 14 covering the upper surface of the insulating layer 3 and a side surface 15 surrounding the periphery of the component 5.

  One surface 14 of the shield layer 4 is formed by laminating a conductive material on the upper surface of the insulating layer 3, and the side surface 15 of the shield layer 4 is filled with a conductive material in a groove formed in the insulating layer 3. (See FIG. 3D). For this reason, external noise from above is blocked by the one surface 14 of the shield layer 4, and external noise from the side is blocked by the side surface 15 of the shield layer 4. Further, one surface 14 of the shield layer 4 is exposed from the insulating layer 3, and the side surface 15 of the shield layer 4 is covered with the insulating layer 3. In this case, the side surface 15 of the shield layer 4 reaches the circuit board 2, and the shield layer 4 and the conductor pattern 7 are connected.

  The circuit module 1 configured as described above is installed on a mounting board 27 such as a mother board. At this time, the shield layer 4 of the circuit module 1 is connected to the ground pattern of the mounting substrate 27. Therefore, the conductor pattern 7 in the circuit board 2 is also conducted to the ground pattern of the mounting board 27 through the shield layer 4, and the conductor pattern 7 in the circuit board 2 is set to the ground potential. In the circuit module 1, the side surface 15 of the shield layer 4 is covered with the insulating layer 3, and the conductor pattern 7 is embedded in the circuit board 2, so that the exposure of the metal portion from the side surface of the circuit module 1 is suppressed. .

  In the circuit module 1 according to the present embodiment, the side surface 15 of the shield layer 4 is covered with an insulating resin, and the conductor pattern 7 is embedded in the circuit board 2 so as not to be exposed, thereby preventing migration. The migration is suppressed by the shield layer 4 and the conductor pattern 7 that are close to the mounting surface of the mounting substrate 27, thereby preventing problems such as a short circuit in the mounting substrate 27. The one surface 14 of the shield layer 4 is exposed from the upper surface of the insulating layer 3, but is sufficiently separated from the installation surface of the mounting substrate 27. Therefore, it is difficult for problems to occur in the mounting board 27 caused by migration.

  With reference to FIG.2 and FIG.3, the manufacturing method of a circuit module is demonstrated, comparing with the circuit module which concerns on a comparative example. FIG. 2 is a diagram illustrating an example of a circuit module manufacturing method according to a comparative example. FIG. 3 is a diagram illustrating an example of a circuit module manufacturing method according to the present embodiment. The circuit module according to the comparative example is different from the circuit module according to the present embodiment in that the side surface of the shield layer is not covered with the insulating resin and is exposed to the outside.

  First, a method for manufacturing a circuit module according to a comparative example will be described. As shown in FIG. 2A, first, a component installation process is performed. In the component installation step, a collective board 69 composed of a plurality of circuit boards 62 is prepared, and a component 65 is installed on one surface 71 of the collective board 69 for each circuit board 62. Each component 65 is connected to an electrode 66 exposed from one surface 71 of the collective substrate 69 by wire bonding or the like. Next, as shown in FIG. 2B, an insulating layer forming step is performed. In the insulating layer forming step, the insulating layer 63 is laminated on the one surface 71 of the collective substrate 69. Thereby, the component 65, the wire, and the like on the collective substrate 69 are sealed with the insulating resin, and the component 65 is protected from impact, moisture, and the like.

  Next, as shown to FIG. 2C, a 1st half cut process is implemented. In the first half-cut process, the collective substrate 69 is half-cut from the insulating layer 63 side by the cutting blade 81 along the dividing line L set on the collective substrate 69. The dividing lines L indicate the boundaries of the individual circuit boards 62 set in a grid pattern on the collective board 69. As the cutting blade 81, a blade of a thick cutting wheel is used. The cutting blade 81 is cut from the insulating layer 63 side toward the collective substrate 69, thereby forming a wide groove 77 reaching the collective substrate 69 from the insulating layer 63. In the thick groove 77, the conductor pattern 67 provided inside the collective substrate 69 is exposed.

  Next, as shown in FIG. 2D, a shield layer forming step is performed. In the shield layer forming step, a conductive material such as silver paste is applied from the insulating layer 63 side. As a result, the upper surface of the insulating layer 63 is covered with the conductive material, and the conductive material is filled in the wide groove 77, so that the shield is provided so as to cover the upper side and the side of the component 65 in the insulating layer 63. Layer 64 is formed. At this time, since the conductor pattern 67 is exposed in the thick groove 77, the conductor pattern 67 and the shield layer 64 are connected by the conductive material filled in the thick groove 77.

  Next, as shown in FIG. 2E, a second half-cut process is performed. In the second half-cut process, half-cut is performed from above by the cutting blade 82 along the dividing line L with the aggregate substrate 69 side facing upward. In this case, as the cutting blade 82, a blade of a medium-width cutting wheel that is thinner than the cutting blade 81 is used. By cutting from the back side of the collective substrate 69 with the medium-width cutting blade 82, a medium-width groove 78 is formed in the collective substrate 69.

  Next, as shown in FIG. 2F, a dividing step is performed. In the dividing step, the insulating layer 63 side is faced upward, and the cutting blade 83 is used to cut the full line from above along the dividing line L. In this case, as the cutting blade 83, the blade of the thinnest cutting grindstone is used. With this thin cutting blade 83, the side wall portion of the shield layer 64 that covers the side of the component 65 is cut from above toward the middle width groove 78, whereby the collective substrate 69 is divided into individual circuit modules 61. Is done.

  In each circuit module 61 according to the comparative example, since the upper surface and the side surface of the insulating layer 63 are covered with the shield layer 64, it is possible to effectively block external noise with respect to the component 65 in the insulating layer 63. However, since the side surface 75 of the shield layer 64 is exposed to the outside, there is a possibility that a problem such as a short circuit may occur in the mounting substrate due to the migration of the side surface 75 of the shield layer 64. As described above, in the circuit module 61 according to the comparative example, although the shielding property can be improved, the migration cannot be suppressed.

  Then, the manufacturing method of the circuit module which concerns on this Embodiment is demonstrated. As shown in FIG. 3A, first, a component installation process is performed. In the component installation step, a collective substrate 9 composed of a plurality of circuit boards 2 is prepared, and the component 5 is installed on one surface 11 of the collective substrate 9 for each circuit board 2. Each component 5 is connected to the electrode 6 exposed from the one surface 11 of the collective substrate 9 by wire bonding or the like. A conductor pattern 7 is partially provided in the collective substrate 9 corresponding to the circuit board 2. Next, as shown in FIG. 3B, an insulating layer forming step is performed. In the insulating layer forming step, the insulating layer 3 is laminated on the one surface 11 of the collective substrate 9. As a result, the component 5, the wire, and the like on the collective substrate 9 are sealed with the insulating resin, and the component 5 is protected from impact, moisture, and the like.

  Next, as shown in FIG. 3C, a half-cut process is performed. In the half-cut process, the collective substrate 9 is half-cut from the insulating layer 3 side by the cutting blade 21 along the dividing line L set on the collective substrate 9. The dividing lines L indicate the boundaries of the individual circuit boards 2 set in a lattice pattern on the collective substrate 9. As the cutting blade 21, a blade having a pair of cutting grindstones 22 attached in parallel is used. A pair of parallel grooves 17 reaching from the insulating layer 3 to the collective substrate 9 is formed by cutting with the cutting blade 21 from the insulating layer 3 side toward the collective substrate 9. In the pair of parallel grooves 17, a part of the conductor pattern 7 is exposed from the side surface of the parallel grooves 17.

  Next, as shown in FIG. 3D, a shield layer forming step is performed. In the shield layer forming step, a conductive material such as silver paste is applied from the insulating layer 3 side. At this time, the conductive material is applied to the insulating layer 3 in a state where the space between the pair of parallel grooves 17 is masked by the metal mask 26. Therefore, the upper surface of the insulating layer 3 is covered with the conductive material except between the pair of parallel grooves 17. The upper surface of the insulating layer 3 is covered with a conductive material, and the pair of parallel grooves 17 are filled with the conductive material, so that the shield layer 4 covers the upper side and the side of the component 5 in the insulating layer 3. It is formed. At this time, since part of the conductor pattern 7 is exposed in the pair of parallel grooves 17, the conductor pattern 7 and the shield layer 4 are connected by the conductive material filled in the pair of parallel grooves 17.

  Next, as shown in FIG. 3E, a dividing step is performed. In the dividing step, the cutting blade 23 is fully cut along the dividing line L from above. As the cutting blade 23, unlike the cutting blade 21, a blade of a cutting grindstone 24 that is thinner than between the pair of parallel grooves 17 is used. With this cutting blade 23, the space between the pair of parallel grooves 17 is cut from the insulating layer 3 side, whereby the aggregate substrate 9 is divided into individual circuit modules 1. In this case, the circuit module 1 is divided by leaving the insulating resin outside the side surface 15 of the shield layer 4 so that the outer surface of the circuit module 1 is formed by the insulating layer 3 and the circuit board 2. Further, since the shield layer 4 is not formed between the pair of parallel grooves 17, a cutting blade 21 suitable for resin cutting may be used.

  The individual circuit modules 1 formed in this way are installed on the mounting board 27 (see FIG. 1B). In the circuit module 1, the shield layer 4 is connected to the ground pattern of the mounting substrate 27 in the mounting substrate 27. With this configuration, the conductor pattern 7 and the ground pattern are electrically connected via the shield layer 4, and the conductor pattern 7 is set to the ground potential. In the circuit module 1 according to the present embodiment, similarly to the circuit module 61 according to the comparative example, since the upper surface and the side surface of the insulating layer 3 are covered with the shield layer 4, it is possible to effectively block external noise with respect to the component 5. .

  Also, in the circuit module 1 according to the present embodiment, unlike the circuit module 61 according to the comparative example, the side surface 15 of the shield layer 4 and the periphery of the conductor pattern 7 are shielded from the outside by the insulating resin. The migration of the side surface 15 can be effectively suppressed. Therefore, even if the circuit module 1 is installed on the mounting board 27 (see FIG. 1B), problems such as a short circuit on the mounting board 27 can be prevented. Although one surface 14 of the shield layer 4 is exposed to the outside, since the distance from the one surface 14 of the shield layer 4 to the installation surface of the mounting substrate 27 is long, the mounting substrate 27 caused by migration Defects can be suppressed. Furthermore, in this embodiment, since the side surface 12 of the circuit board 2 and the side surface 13 of the insulating layer 3 are divided by a single process so as to be flush with each other, the number of manufacturing steps can be reduced as compared with the comparative example. (See FIG. 1).

  As described above, according to the circuit module 1 according to the present embodiment, the side surface 15 of the shield layer 4 surrounding the part 5 is formed by filling the pair of parallel grooves 17 with the conductive material. . Moreover, by dividing | segmenting between a pair of parallel grooves 17, the circuit module 1 by which the side surface 15 of the shield layer 4 was coat | covered with insulating resin is formed. For this reason, migration on the side surface 15 of the shield layer 4 close to the mounting substrate 27 can be suppressed. Therefore, the migration can be effectively suppressed while improving the shielding property, and problems such as a short circuit on the mounting substrate 27 can be prevented.

  The present invention is not limited to the above-described embodiment, and can be implemented with various modifications. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effects of the present invention are exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  For example, the upper ends of the pair of parallel grooves may be chamfered. Hereinafter, with reference to FIG. 4, the manufacturing method of the circuit module which concerns on a modification is demonstrated. Note that the circuit module manufacturing method according to the modification is different from the circuit module manufacturing method according to the present embodiment in that a chamfered portion is formed at the upper ends of the pair of parallel grooves in the half-cut process. Therefore, detailed explanations other than the differences will be omitted. FIG. 4 is a diagram illustrating an example of a circuit module manufacturing method according to a modification.

  As shown to FIG. 4A, a component installation process is first implemented. In the component installation process, components 35 are installed on the collective substrate 39, and each component 35 is connected to the electrode 36 exposed from the one surface 41 of the circuit substrate 32 by wire bonding or the like. In the collective substrate 39 according to the modification, the conductor pattern 37 is partially provided. Next, as shown in FIG. 4B, an insulating layer forming step is performed. In the insulating layer forming step, the insulating layer 33 is laminated on the one surface 41 of the collective substrate 39, and the components 35, wires, and the like on the collective substrate 39 are sealed with an insulating resin.

  Next, as shown in FIG. 4C, a half-cut process is performed. In the half-cut process, a pair of parallel grooves 47 reaching the collective substrate 39 from the insulating layer 33 is formed by cutting with the cutting blade 51 from the insulating layer 33 side toward the collective substrate 39. In the pair of parallel grooves 47, a part of the conductor pattern 37 provided inside the collective substrate 39 is exposed. As the cutting blade 51, a blade in which a pair of large-diameter grindstones 52 are attached in parallel and a pair of small-diameter grindstones 53 are provided outside the pair of large-diameter grindstones 52 is used. By using this cutting blade 51, a pair of parallel grooves 47 is formed by the pair of large-diameter grindstones 52, and at the same time, a stepped chamfer 48 is formed at the upper end outside the pair of parallel grooves 47 by the pair of small-diameter grindstones 53. Is formed. In this way, the corners of the insulating layer 33 formed by the pair of parallel grooves 47 are chamfered, so that the corners are prevented from being chipped during the manufacture of the circuit module 31. Note that the chamfered portion 48 may be formed in a step shape as in the present embodiment, or may be formed in a tapered shape.

  Next, as shown in FIG. 4D, a shield layer forming step is performed. In the shield layer forming step, the conductive material is applied to the insulating layer 33 in a state where the space between the pair of parallel grooves 47 is masked by the metal mask 59. The upper surface of the insulating layer 33 is covered with a conductive material, and the pair of parallel grooves 47 are filled with the conductive material, so that the shield layer 34 covers the upper side and the side of the component 35 in the insulating layer 33. It is formed. Next, as shown in FIG. 4E, a dividing step is performed. In the dividing step, the aggregate substrate 39 is divided into the individual circuit modules 31 by cutting between the pair of parallel grooves 47 from the insulating layer 33 side with the blade 55 of the thin cutting grindstone 56. In this case, the circuit module 31 is divided by leaving the insulating resin outside the side surface 45 of the shield layer 34 so that the outer surface of the circuit module 31 is formed by the insulating layer 33 and the circuit board 32.

  In the half-cut process of the present embodiment and the modification described above, the pair of parallel grooves are formed simultaneously with a cutting blade having a pair of grinding wheels attached in parallel. However, the present invention is not limited to this structure. In the half-cut process, a pair of parallel grooves may be individually formed with a cutting blade having a single grinding wheel.

  Further, in the above-described half-cut process of the present embodiment and the modification, the pair of parallel grooves is formed by mechanical dicing using a cutting blade, but the present invention is not limited to this configuration. In the half-cut process, it is only necessary to be able to form a pair of parallel grooves. For example, the pair of parallel grooves is formed by laser dicing (ablation processing) using a laser beam having a wavelength that is absorptive with respect to the insulating layer or the aggregate substrate. It may be formed.

  Further, in the shield layer forming process of the present embodiment and the modification described above, the shield layer is formed by applying silver paste as the conductive material, but the present invention is not limited to this configuration. In the shield layer forming step, the conductive material is not limited to the metal paste, and a conductive resin may be used.

  In the shield layer forming process of the present embodiment and the modification described above, the conductive material is applied in a state where the space between the pair of parallel grooves is masked. However, the present invention is not limited to this configuration. In the shield layer forming step, the conductive material may be applied in a state where the space between the pair of parallel grooves is not masked. In this case, the shield layer is exposed over the entire upper surface of the circuit module obtained by dividing the aggregate substrate. However, since the shield layer exposed on the upper surface of the circuit module is sufficiently separated from the mounting substrate, problems due to migration hardly occur.

  In the shield layer forming process of the present embodiment and the modification described above, the method for applying the conductive material is not particularly limited. In the shield layer forming step, the conductive material may be applied to the insulating layer by printing, or may be applied to the insulating layer by a spray method or a spin coat method.

  Further, in the dividing process of the present embodiment and the modification described above, the collective substrate is divided by one full cut. However, the present invention is not limited to this structure. In the dividing step, the aggregate substrate may be divided by dividing it into two times.

  Further, in the dividing process of the present embodiment and the modification described above, the structure is divided by mechanical dicing using a cutting blade, but is not limited to this structure. In the dividing step, it is only necessary to be able to divide, and for example, the dividing may be performed by laser dicing (ablation processing) using a laser beam having a wavelength that is absorptive with respect to the insulating layer or the collective substrate.

  Moreover, in the above-described embodiment and modification, the component and the electrode are connected by wire bonding, but the present invention is not limited to this configuration. The component may be mounted on the circuit board in any manner with respect to the circuit board. For example, the component is a BGA (Ball Grid Array) or LGA (Land Grid Array) package and is surface-mounted on the circuit board. Also good.

  As described above, the present invention has the effect of reducing the influence of external noise and suppressing migration, and is particularly useful for electronic component circuit modules and circuit module manufacturing methods.

1, 31 Circuit module 2, 32 Circuit board 3, 33 Insulating layer 4, 34 Shield layer 5, 35 Component 7, 37 Conductor pattern 9, 39 Aggregate substrate 15, 45 Side surface of shield layer 17, 47 Parallel groove 26, 59 Metal Mask 27 Mounting board 48 Chamfer

Claims (5)

Laminating an insulating layer on one surface of a collective substrate on which components are arranged;
Forming a pair of parallel grooves in the insulating layer along each dividing line of the aggregate substrate;
Applying a conductive material to the insulating layer to fill the pair of parallel grooves to form a shield layer;
And a step of dividing the pair of parallel grooves along each dividing line of the collective substrate. Wherein in the step of forming the shielding layer, method of manufacturing a circuit module according to claim 1, characterized in that mask the between the pair of parallel grooves coating the conductive material. In the step of forming the pair of parallel grooves, a pair of parallel grooves reaching the collective substrate is formed,
As the conductor pattern formed on the assembly substrate and the shield layer are conductive, the circuit module according to claim 1 or claim 2, characterized in that filling the conductive material into the pair of parallel grooves Production method. Wherein in the pair of forming a parallel groove, a manufacturing method of a circuit module according to any of claims 1 to 3, characterized by forming a chamfered portion at an upper end of said pair of parallel grooves. In the step of dividing between the pair of parallel grooves, wherein claim 1, wherein the dividing between said pair of parallel grooves with a cutting blade of the thin width than between the pair of parallel grooves Item 5. A method for manufacturing a circuit module according to Item 4 .

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