JP2011138963A - Circuit module and method of manufacturing the circuit module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress the durability of a shielding member from deteriorating. <P>SOLUTION: A circuit module 1 includes: a substrate 10 having an electronic component mounting surface 10a; an electronic component group 11 mounted on the electronic component mounting surface 10a; a first mold resin 12 as a first sealing member for covering the electronic component group 11; a plated layer 13 as a shield member covering the first mold resin 12, and at the same time, brought into contact with the substrate 10; and a second mold resin 14 as a second sealing member sandwiching a substrate contact part 13a of the portion of the plated layer 13 which is brought into contact with the substrate 10 with the substrate 10 and covering at least a part of the plated layer 13. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a circuit module and a circuit module manufacturing method.

  There is a circuit module including a sealing member that covers an electronic component mounted on a substrate and a shield material that covers the sealing member that covers the electronic component. For example, Patent Literature 1 includes a sealing body made of an epoxy resin containing an inorganic filler that seals a mounted component (electronic component), a plurality of plating layers formed on the surface of the sealing body, and a shield layer. A circuit module is disclosed.

JP 2005-109306 A

  In the technique disclosed in Patent Document 1, as shown in FIG. 2 of Patent Document 1, when the side on which the electronic component is provided is the inside, a shield layer (corresponding to the shield member of the present invention) is arranged on the outermost side. The Specifically, the shield layer is a metal plating layer. In the technique disclosed in Patent Document 1, since oxygen comes into contact with this plating layer, the plating layer functioning as a shield layer may be oxidized. Moreover, the technique currently disclosed by patent document 1 can also consider that the force from the outside acts on a shield layer. As a result, the technique disclosed in Patent Document 1 may cause oxidation and peeling of the shield layer, resulting in a decrease in durability.

  This invention is made | formed in view of the above, Comprising: It aims at suppressing the fall of durability of a shield member.

  In order to solve the above-described problems and achieve the object, a circuit module according to the present invention includes a substrate having an electronic component mounting surface, an electronic component mounted on the electronic component mounting surface, and a first covering the electronic component. 1 sealing member, a shield member that covers the first sealing member and partially contacts the substrate, and a portion of the shield member that contacts the substrate is sandwiched between the substrate, and And a second sealing member that covers at least a part of the shield member.

  With the above configuration, in the circuit module according to the present invention, the shield member is covered with the second sealing member. Thereby, the circuit module which concerns on this invention can reduce the area of the part which contacts oxygen among the total areas of a shield member. As a result, the circuit module according to the present invention can suppress oxidation of the shield member. In addition, the circuit module according to the present invention can reduce the possibility of force acting from the outside of the shield member. As described above, the circuit module according to the present invention can suppress oxidation and peeling of the shield member. As a result, the circuit module according to the present invention can suppress a decrease in the durability of the shield member.

  As a preferred aspect of the present invention, the substrate includes a terminal forming surface opposite to the electronic component mounting surface, and a stepped portion having a portion recessed from the electronic component mounting surface toward the terminal forming surface. Preferably, a portion of the shield member that contacts the substrate is sandwiched between the stepped portion and the second sealing member.

  The shield member is a thin metal film. For this reason, when the end of the stepped portion is deformed or rubbed due to some contact, or the circuit module itself is warped, the shield member is easily peeled off. However, in the circuit module according to the present invention, the shield member is sandwiched between the second sealing member and the stepped portion. Thereby, a shield member becomes difficult to peel from a board | substrate. With the configuration described above, the circuit module according to the present invention makes it difficult for the shield member to peel from the substrate, and thus can more suitably reduce the durability of the shield member.

  As a preferable aspect of the present invention, the second sealing member preferably covers the entire shield member.

  With the above configuration, the circuit module according to the present invention can reduce the area of the portion of the shield member that contacts oxygen. In addition, the circuit module according to the present invention can reduce a gap in which a liquid such as water tries to enter the inside. Thereby, the circuit module according to the present invention can more suitably suppress the oxidation of the shield member. Moreover, the circuit module which concerns on this invention can reduce a possibility that force may act on the edge part of a shield member from the outside. As described above, the circuit module according to the present invention can more suitably suppress oxidation and peeling of the shield member. As a result, the circuit module according to the present invention can more suitably suppress a decrease in the durability of the shield member.

  As a preferred aspect of the present invention, the substrate includes a terminal forming surface opposite to the electronic component mounting surface, and a first step portion having a portion that is recessed from the electronic component mounting surface toward the terminal forming surface. A portion adjacent to the first step portion and provided on a portion opposite to the electronic component with the first step portion as a boundary, from the electronic component mounting surface toward the terminal forming surface. A second step portion having a portion recessed further toward the terminal forming surface than the one step portion, and an end portion of the shield member is in contact with the first step portion and the first step portion. It is preferable that the second sealing member is provided between the second sealing member and the second sealing member is in contact with the second step portion.

  With the above configuration, in the circuit module according to the present invention, the second sealing member covers all of the shield member. Thereby, the circuit module which concerns on this invention can make the area of the part which contacts oxygen out of the total area of a shield member theoretically zero. In addition, the circuit module according to the present invention can reduce a gap in which a liquid such as water tries to enter the inside. Thereby, the circuit module according to the present invention can more suitably suppress the oxidation of the shield member. In addition, the circuit module according to the present invention can theoretically reduce the area of the portion of the total area of the shield member where a force may be applied from the outside to zero. As described above, the circuit module according to the present invention can more suitably suppress oxidation and peeling of the shield member. As a result, the circuit module according to the present invention can more suitably suppress a decrease in the durability of the shield member.

  As a preferred aspect of the present invention, it is preferable that a side surface of the circuit module which forms an outer shape of the entire circuit module and has an angle with respect to the electronic component mounting surface is a flat surface.

  With the above configuration, the side surface of the circuit module according to the present invention is flat. When the side surfaces are flat, the circuit module according to the present invention can integrate the appearance of the circuit module. Furthermore, since the step portion is not formed in the circuit module according to the present invention, when the circuit module is handled, the portion where stress tends to concentrate on the side surface can be reduced. Thereby, the circuit module according to the present invention can suppress a decrease in durability.

  As a preferable aspect of the present invention, it is preferable that the linear expansion coefficient of the second sealing member is smaller than the linear expansion coefficient of the first sealing member.

  Generally, the linear expansion coefficient of the first sealing member is different from the linear expansion coefficient of the substrate. For this reason, in a circuit module in which the second sealing member is not provided, the circuit module may be bent due to the difference in the linear expansion coefficient. However, in the circuit module according to the present invention, the second sealing member, which is a material whose linear expansion coefficient is smaller than that of the first sealing member, is outside of the shield member (what is an electronic component? Provided on the opposite side). And a 2nd sealing member suppresses the curve of the circuit module concerning this invention resulting from the difference of the linear expansion coefficient of a board | substrate and a 1st sealing member. As a result, the circuit module according to the present invention can reduce the risk of bending itself.

  As a preferable aspect of the present invention, it is preferable that a linear expansion coefficient of the second sealing member is not more than a linear expansion coefficient of the substrate.

  Generally, among the members included in the circuit module, the substrate is a member having the smallest linear expansion coefficient. Therefore, with the above configuration, the second sealing member included in the circuit module according to the present invention is the member having the smallest linear expansion coefficient among the plurality of members configuring the circuit module according to the present invention. By providing such a second sealing member, the circuit module according to the present invention has a linear expansion coefficient of the substrate and the entire mold resin (first sealing member and second sealing member) provided on the substrate. The difference from the linear expansion coefficient can be further reduced. As a result, the circuit module according to the present invention can more suitably reduce the risk of bending itself.

  In order to solve the above-described problems and achieve the object, a circuit module manufacturing method according to the present invention has two surfaces: an electronic component mounting surface and a terminal formation surface opposite to the electronic component mounting surface. A first step of covering an electronic component formed on the electronic component mounting surface of the substrate with a first sealing member; and at least the first sealing member from the electronic component mounting surface side toward the terminal forming surface side A second step of cutting, a third step of covering the first sealing member with a shield member and contacting a part of the shield member with the substrate, and at least a part of the shield member with the second sealing member A fourth step of sandwiching a portion of the shield member that contacts the substrate with the substrate, and at least the second sealing from the electronic component mounting surface side to the terminal forming surface side Member and substrate Characterized in that it comprises a fifth step of cutting, the.

  In the circuit module manufactured by using the circuit module manufacturing method according to the present invention, the shield member is covered with the second sealing member. Thereby, the circuit module which concerns on this invention can reduce the area of the part which contacts the oxygen of a shield member. As a result, the circuit module according to the present invention can suppress oxidation of the shield member. In addition, the circuit module according to the present invention can reduce a portion where a force may be applied from the outside of the shield member. As described above, the circuit module according to the present invention can suppress oxidation and peeling of the shield member. As a result, by using the circuit module manufacturing method according to the present invention, it is possible to suppress a decrease in durability of the shield member included in the circuit module according to the present invention.

  As a preferred aspect of the present invention, in the second step, the first sealing member is cut from the electronic component mounting surface side toward the terminal forming surface side, and from the electronic component mounting surface to the terminal forming surface. In the fifth step, the second sealing member, the substrate, and the shield member are cut from the electronic component mounting surface side to the terminal forming surface side in the fifth step. It is preferable to cut.

  As a preferred aspect of the present invention, between the third step and the fourth step, a portion of the shield member that contacts the substrate is moved from the electronic component mounting surface side to the terminal forming surface side. It is preferable to provide the 6th process cut | disconnected toward.

  In the circuit module according to the present invention manufactured by using the circuit module manufacturing method according to the present invention, the second sealing member covers all of the shield member. Therefore, the circuit module according to the present invention can eliminate the portion of the shield member that comes into contact with oxygen. Moreover, the circuit module manufactured by the circuit module manufacturing method according to the present invention can reduce a gap in which a liquid such as water tries to enter the inside. Thereby, the circuit module according to the present invention can more suitably suppress the oxidation of the shield member. Moreover, the circuit module manufactured by the circuit module manufacturing method according to the present invention can eliminate a portion where a force may be applied from the outside of the shield member. As described above, the circuit module manufactured by the circuit module manufacturing method according to the present invention can more suitably suppress oxidation and peeling of the shield member. As a result, by using the circuit module manufacturing method according to the present invention, it is possible to manufacture a circuit module that can more suitably suppress a decrease in durability of the shield member included in the circuit module.

  As a preferred aspect of the present invention, in the second step, the first sealing member is cut from the electronic component mounting surface side toward the terminal forming surface side, and from the electronic component mounting surface to the terminal forming surface. In the sixth step, the portion of the shield member that contacts the substrate is cut from the electronic component mounting surface side to the terminal forming surface side. In addition, a part of the substrate is also cut away from the electronic component mounting surface toward the terminal forming surface, and in the fifth step, the second sealing is performed from the electronic component mounting surface side toward the terminal forming surface side. It is preferable to cut the stop member and the substrate.

  The present invention can suppress a decrease in durability of the shield member.

FIG. 1 is a cross-sectional view of the circuit module of Embodiment 1 cut along a plane orthogonal to the substrate. FIG. 2 is a flowchart illustrating steps of the circuit module manufacturing method according to the first embodiment. FIG. 3 is a block diagram illustrating functions of the circuit module manufacturing system. FIG. 4 is a cross-sectional view showing a pre-division circuit module assembly in the middle of manufacture in which electronic components are formed on a substrate. FIG. 5 is a cross-sectional view showing the pre-division circuit module assembly in the middle of manufacture provided with the first mold resin. FIG. 6 is a cross-sectional view showing the pre-division circuit module assembly in the middle of manufacture that has been subjected to the first cutting. FIG. 7 is a cross-sectional view showing a pre-division circuit module assembly in the middle of manufacture that has been plated. FIG. 8 is a cross-sectional view showing the pre-division circuit module assembly provided with the second mold resin. FIG. 9 is a cross-sectional view showing the pre-division circuit module assembly that has been subjected to the second cutting. FIG. 10 is a cross-sectional view of the circuit module according to the second embodiment cut along a plane orthogonal to the substrate. FIG. 11 is a flowchart illustrating the steps of the circuit module manufacturing method according to the second embodiment. FIG. 12 is a cross-sectional view showing the pre-division circuit module assembly in the middle of manufacture that has been subjected to the second cutting. FIG. 13 is a cross-sectional view showing the pre-division circuit module assembly provided with the second mold resin. FIG. 14 is a cross-sectional view showing the pre-division circuit module assembly that has been subjected to the third cutting.

  DESCRIPTION OF EMBODIMENTS Hereinafter, modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The following embodiments do not limit the present invention. In addition, constituent elements disclosed in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in the range of so-called averages. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

(Embodiment 1)
FIG. 1 is a cross-sectional view of the circuit module of Embodiment 1 cut along a plane orthogonal to the substrate. Next, the material and shape of each member included in the circuit module 1, the manufacturing method of the circuit module 1, and the structure of the circuit module 1 will be described in this order. As shown in FIG. 1, the circuit module 1 includes a substrate 10, an electronic component group 11, a first mold resin 12 that is a first sealing member, a plating layer 13 that is a shield member, and a second sealing member. And a second mold resin 14. In the following, an example of the material and shape of each member will be described, but each member is not limited to the described material and shape.

  The substrate 10 is a resin plate member. In the present embodiment, the thickness of the substrate 10 is 0.3 mm. Moreover, the linear expansion coefficient of the board | substrate 10 is 17-18 ppm / degrees C. The substrate 10 has an electronic component mounting surface 10a and a terminal forming surface 10b. The electronic component mounting surface 10a and the terminal forming surface 10b are surfaces that form the front surface and the back surface of the substrate 10, and are parallel and opposed to each other. The distance between the electronic component mounting surface 10 a and the terminal forming surface 10 b is the thickness of the substrate 10. Hereinafter, the direction orthogonal to the electronic component mounting surface 10a and the terminal forming surface 10b, that is, the thickness direction of the substrate 10 is referred to as a first direction. Of the directions orthogonal to the first direction, the direction orthogonal to the two side surfaces 1s facing each other of the circuit module 1 is referred to as a second direction. Since there are two sets of two side surfaces 1 s facing each other of the circuit module 1, there are actually two second directions. However, in the following description, the configuration of the circuit module 1 will be described on a two-dimensional plane. Therefore, in the following description, one of the two directions will be described as the second direction.

  In the electronic component group 11, a plurality of electronic components are electrically connected. In the following description, the circuit module 1 will be described as having a plurality of electronic components. However, the circuit module 1 may have a single electronic component. The electronic component group 11 is formed on the electronic component mounting surface 10 a of the substrate 10. The first mold resin 12 is an epoxy resin containing a filler (silica). The content rate of the filler which the 1st mold resin 12 contains is 60 wt%. The thickness of the first mold resin 12 is a dimension in the first direction of the first mold resin 12, and is 0.8 mm to 1.0 mm in the present embodiment. Further, the linear expansion coefficient of the first mold resin 12 is 29 ppm / ° C. The plating layer 13 is composed of a copper plating layer and a nickel plating layer. The thickness of the plating layer 13 is the dimension in the first direction of the plating layer 13 in a plane parallel to the electronic component mounting surface 10a, and the second direction of the plating layer 13 in a plane having an angle with respect to the electronic component mounting surface 10a. It is the dimension. In addition, the surface which has an angle with respect to the electronic component mounting surface 10a and the terminal formation surface 10b is a surface orthogonal to the electronic component mounting surface 10a and the terminal formation surface 10b in this embodiment. That is, the angle here is 90 °. However. The angle is not limited to 90 °, and includes tolerances such as manufacturing errors. In this embodiment, the plating layer 13 has a total thickness of 13 μm, with the copper plating layer having a thickness of 10 μm and the nickel plating layer having a thickness of 3 μm. The linear expansion coefficient of the plating layer 13 is 16.8 ppm / ° C. for the copper plating layer and 12.8 ppm / ° C. for the nickel plating layer.

  The second mold resin 14 is an epoxy resin containing a filler (silica). The second mold resin 14 has a higher elastic modulus than the first mold resin 12. Specifically, the elastic modulus of the second mold resin 14 is 500 Mpa or more. The content rate of the filler which the 2nd mold resin 14 contains is 80 wt% or more. The thickness of the second mold resin 14 is 0.05 mm to 0.1 mm. The thickness of the second mold resin 14 is a dimension in the first direction of the second mold resin 14 in a plane parallel to the electronic component mounting surface 10a, and the second mold resin in a surface having an angle with respect to the electronic component mounting surface 10a. It is the dimension of the resin 14 in the second direction. The linear expansion coefficient of the second mold resin 14 is preferably at least smaller than the linear expansion coefficient of the first mold resin 12 and less than or equal to the linear expansion coefficient of the substrate 10. In the present embodiment, the linear expansion coefficient of the second mold resin 14 is 5 to 15 ppm / ° C. Next, a method for manufacturing the circuit module 1 will be described.

  FIG. 2 is a flowchart illustrating steps of the circuit module manufacturing method according to the first embodiment. FIG. 3 is a block diagram illustrating functions of the circuit module manufacturing system. FIG. 4 is a cross-sectional view showing a pre-division circuit module assembly in the middle of manufacture in which an electronic circuit is formed on a substrate. FIG. 5 is a cross-sectional view showing the pre-division circuit module assembly in the middle of manufacture provided with the first mold resin. Each step shown in FIG. 2 is executed by the circuit module manufacturing system 20 shown in FIG.

  The circuit module manufacturing system 20 has functions of a circuit forming part 21, a sealing part 22, a cutting part 23, and a plating layer forming part 24. The circuit forming unit 21 mounts the electronic component group 11 on the substrate 10 shown in FIG. The sealing part 22 seals a target portion with the first mold resin 12 and the second mold resin 14. The cutting part 23 cuts out a part of the target portion or cuts the target member. The plating layer forming unit 24 forms the plating layer 13 on the target portion. The circuit module manufacturing system 20 includes a plurality of devices that realize different functions, thereby realizing the functions of the circuit forming unit 21, the sealing unit 22, the cutting unit 23, and the plating layer forming unit 24. May be. Further, the circuit module manufacturing system 20 may realize all the functions.

  The circuit module manufacturing system 20 shown in FIG. 3 first manufactures a pre-division circuit module assembly 1A including a plurality of circuit modules 1 shown in FIG. 1, and cuts the pre-division circuit module assembly 1A to obtain each circuit module. 1 is produced. 2, the circuit forming unit 21 shown in FIG. 3 mounts one or more electronic components on the electronic component mounting surface 10a of the substrate 10 as shown in FIG. In the present embodiment, an example in which the circuit forming unit 21 mounts a plurality of electronic component groups 11 on the electronic component mounting surface 10a will be described. Next, it progresses to step ST102 (1st process), and the sealing part 22 shown in FIG. 3 is electronic component group by 1st mold resin 12 so that the one or more electronic component group 11 may be covered, as shown in FIG. 11 is sealed.

  FIG. 6 is a cross-sectional view showing the pre-division circuit module assembly in the middle of manufacture that has been subjected to the first cutting. In step ST103 (second step) shown in FIG. 2, the cutting unit 23 shown in FIG. 3 performs the first cutting on the circuit module assembly 1A before division as shown in FIG. Specifically, the cutting unit 23 cuts the first mold resin 12 with a dicing blade from the electronic component mounting surface 10a side toward the terminal forming surface 10b side, and mounts the electronic component partway along the thickness direction of the substrate 10. A part of the substrate 10 is cut away by a dicing blade from the surface 10a toward the terminal forming surface 10b. This time, the thickness of the dicing blade used in the first cutting is, for example, 0.4 mm. Note that the cutting unit 23 only needs to cut at least the first mold resin 12, and it is not always necessary to cut out a part of the substrate 10. However, when only the first mold resin 12 is cut, the cutting portion 23 is required to have higher processing accuracy. Therefore, in this embodiment, the cutting part 23 shall cut both the 1st mold resin 12 and the board | substrate 10 by step ST103 so that the processing precision requested | required of the cutting part 23 can be reduced.

  In the first cutting process, the cutting unit 23 cuts a part of the substrate 10 to the depth D1 of the substrate 10. The part to which the cutting part 23 performs the cutting is a part 15a between two electronic component groups 11 adjacent in the second direction, and both sides of the two electronic component groups 11a arranged at both ends in the second direction. This is a portion 15b on the side where the adjacent electronic component group 11 is not present. As a result, the cutting unit 23 performs cutting on both sides of each electronic component group 11 in the second direction. In addition, 11a is a code | symbol for distinguishing the electronic component group of the both sides in a 2nd direction from another electronic component group. The electronic component group 11 a is substantially the same as the other electronic component group 11.

  FIG. 7 is a cross-sectional view showing the pre-division circuit module assembly that has been plated during the manufacturing process. When step ST103 described above is completed, the process proceeds to step ST104 (third step), and the plating layer forming unit 24 shown in FIG. 3 forms the plating layer 13 on the circuit module assembly 1A before division as shown in FIG. To do. The plating layer 13 covers the first mold resin 12. Further, the plating layer 13 is partially in contact with the substrate 10. Specifically, the plating layer 13 is formed on the upper surface 12a of the first mold resin 12, the side surface 12b of the first mold resin 12, the first-cut bottom surface 10c and the first-cut side surface 10d of the substrate 10. The upper surface 12a of the first mold resin 12 is a surface parallel to the electronic component mounting surface 10a among a plurality of surfaces of the first mold resin 12. The side surface 12b of the first mold resin 12 is a surface having an angle with respect to the electronic component mounting surface 10a among a plurality of surfaces of the first mold resin 12. The first-cut bottom surface 10c and the first-cut side surface 10d of the substrate 10 are newly exposed surfaces in the first cutting process in step ST103 among a plurality of surfaces of the substrate 10. The first-cut bottom surface 10c is a surface parallel to the electronic component mounting surface 10a. The first cut side surface 10d is a surface having an angle with respect to the electronic component mounting surface 10a. A portion of the plating layer 13 that is in contact with the first cut bottom surface 10c and the first cut side surface 10d is referred to as a substrate contact portion 13a.

  FIG. 8 is a cross-sectional view showing the pre-division circuit module assembly covered with the second mold resin. FIG. 9 is a cross-sectional view showing the pre-division circuit module assembly that has been subjected to the second cutting. When step ST104 described above is completed, the process proceeds to step ST105 (fourth process), and the sealing portion 22 shown in FIG. 3 is provided with the second mold resin 14 so as to cover the plated layer 13 as shown in FIG. Thereby, the pre-division circuit module assembly 1A is completed. Next, it progresses to step ST106 (5th process), and the cutting part 23 shown in FIG. 3 performs the 2nd time cutting process to the circuit module assembly 1A before division, as shown in FIG.

  In the second cutting process, the cutting portion 23 extends from the electronic component mounting surface 10a side to the terminal forming surface 10b side to the terminal forming surface 10b with respect to the terminal forming surface 10b until reaching the terminal forming surface 10b. Disconnect. In this embodiment, the cutting part 23 also cuts the plating layer 13 from the electronic component mounting surface 10a side toward the terminal forming surface 10b side. Of the surfaces of the second mold resin 14, the surface exposed by the second cutting process is defined as a mold resin cutting side surface 14 a. Moreover, let the surface exposed by the 2nd cutting process among the surfaces of the board | substrate 10 be the 2nd cutting side surface 10e.

  The part which the cutting part 23 performs the second cutting process is the part 16a and the part 16b shown in FIG. The part 16a is a part where the plating layer 13 has a valley shape. More specifically, the portion 16a is between the electronic component groups 11 adjacent in the second direction, and is between the two surfaces of the plating layer 13 that have an angle with respect to the electronic component mounting surface 10a. The part 16b is a part on both end sides in the second direction of the circuit module assembly 1A before division. More specifically, the portion 16b is adjacent to the surface of the plated layer 13 formed in this portion having an angle with respect to the electronic component mounting surface 10a in the direction away from the electronic component group 11 in the second direction. It is a part to do. In the present embodiment, the cutting unit 23 performs a cutting process on the center of the first cutting bottom surface 10c of the substrate 10 in the second direction. The thickness of the dicing blade, which is a cutting tool used in the second cutting process, is smaller than the thickness of the dicing blade used in the first cutting process in step ST103. Thereby, the range in the 2nd direction which the cutting part 23 performs the 2nd cutting process becomes narrower than the range in the 2nd direction which performed the 1st cutting process in step ST103. Therefore, the first-cutting side surface 10d and the second-cutting side surface 10e are formed at positions separated in the second direction.

  Through the steps described above, the circuit module manufacturing system 20 manufactures the circuit module 1 shown in FIG. As shown in FIG. 1, the circuit module 1 manufactured by the manufacturing method of the present embodiment has the plating layer 13 covered with the second mold resin 14. For this reason, since the exposed area of the circuit module 1 in the total area of the plating layer 13 is reduced, the area of the total area of the plating layer 13 that comes into contact with oxygen is reduced. As a result, the circuit module 1 can suppress oxidation of the plating layer 13. In addition, the circuit module 1 can reduce the area of the total area of the plating layer 13 where a force may be applied from the outside. Thereby, the circuit module 1 can suppress the oxidation and peeling of the plating layer 13, and as a result, decrease in durability of the plating layer 13 can be reduced.

  In particular, in the plated layer 13 of the present embodiment, the substrate contact portion 13a is sandwiched in the first direction between the step portion recessed from the electronic component mounting surface 10a toward the terminal forming surface 10b and the second mold resin 14. ing. The step portion is a portion formed by the first cut side face 10d and the first cut bottom face 10c. Thus, in the circuit module 1, the plating layer 13 is more easily removed from the substrate 10 when the plating layer 13 is sandwiched between the second mold resin 14 and the first cut bottom surface 10c than when the plating layer 13 is exposed. It becomes difficult to peel. As a result, the circuit module 1 can more suitably reduce the durability of the plated layer 13.

  Further, as shown in FIG. 8, in the circuit module 1, the second mold resin 14 is provided in a portion 16a and a portion 16b that are portions to be subjected to the second cutting. Then, as shown in FIG. 9, in the circuit module 1, the second mold resin 14 provided in the part 16 a and the part 16 b together with the substrate 10 is also cut by a dicing blade. As a result, in the circuit module 1, as shown in FIG. 1, the position of the second cutting side surface 10e in the second direction is the same as the position of the mold resin cutting side surface 14a in the second direction. As a result, in the circuit module 1, since the mold resin cutting side surface 14a and the second cutting side surface 10e are the same surface, the circuit module 1 has a step portion at the boundary between the mold resin cutting side surface 14a and the second cutting side surface 10e. Not formed.

  On the other hand, for example, when a step portion is formed on the side surface of the circuit module, the appearance of the circuit module deteriorates due to the step. When handling a circuit module, it is also conceivable that external force concentrates on the inside of the electronic component module at the step formed in the circuit module. Thereby, the durability of such a circuit module may be reduced.

  However, the circuit module 1 has a flat side surface 1s. The side surface 1 s is a surface having an angle with respect to the electronic component mounting surface 10 a among the surfaces forming the outer shape of the entire circuit module 1. The circuit module 1 has four side surfaces 1s. FIG. 1 shows two of the four side surfaces 1s. By making the side surface 1s flat, the circuit module 1 does not lose the aesthetic appearance of the circuit module 1. Further, since the step portion is not formed on the side surface 1s, the circuit module 1 tends to concentrate stress on the side surface 1s. There are few parts. Thereby, when the circuit module 1 is handled, since the possibility that the force from the outside will concentrate inside the electronic component module is reduced, the deterioration of durability is suppressed.

  Further, the circuit module 1 can reduce the bending of the circuit module 1. Next, the reason will be described. As described above, the linear expansion coefficient of the first mold resin 12 and the linear expansion coefficient of the substrate 10 are different. Therefore, in a circuit module in which the second mold resin 14 is not provided, the circuit module may be bent due to the difference in the linear expansion coefficient. However, in the circuit module 1, the second mold resin 14, which is a material having a linear expansion coefficient smaller than that of the first mold resin 12, is located outside the plating layer 13 (on the side opposite to the electronic component group 11). Provided. Since the second mold resin 14 is less likely to bend than the first mold resin 12, the circuit module 1 is prevented from being bent due to a difference in linear expansion coefficient between the substrate 10 and the first mold resin 12. As a result, the circuit module 1 can reduce the possibility that the circuit module 1 itself (the circuit module 1) is bent.

  Further, the value of the linear expansion coefficient of the second mold resin 14 is not more than the linear expansion coefficient of the substrate 10. That is, the second mold resin 14 is a member having the smallest linear expansion coefficient among a plurality of members included in the circuit module 1. By providing the second mold resin 14 as described above, the circuit module 1 allows the linear expansion coefficient of the substrate 10 and the lines of the entire mold resin (the first mold resin 12 and the second mold resin 14) provided on the substrate 10. The difference from the expansion coefficient can be reduced more suitably. Thereby, the circuit module 1 can reduce the possibility that the circuit module 1 will bend more appropriately.

  In addition, as a method for reducing the curvature of the circuit module or a method for not forming the stepped portion on the side surface of the circuit module, a method of making the plating layer thicker than before without providing the second mold resin 14. Is also possible. However, while recent circuit modules are required to be lighter, the circuit modules in this case cannot be reduced in weight because the amount of metal increases. On the other hand, since the circuit module 1 includes the second mold resin 14 having a mass smaller than that of the metal, the circuit module 1 can reduce its weight.

  Furthermore, in the circuit module 1 of the present embodiment, the nickel layer constituting the plating layer 13 can be reduced or omitted because the oxidation of the plating layer 13 is suppressed by the second mold resin 14. As a result, the circuit module 1 can be lighter. The second mold resin 14 is a material that is easier to cut than the plated layer 13 that is a metal. For this reason, if the circuit module 1 is manufactured using the circuit module manufacturing method according to the present embodiment, it becomes easier to cut. The second mold resin 14 has a higher filler (silica) content than the first mold resin 12. Here, the epoxy resin having a filler content of 80 wt% or more is a flame-retardant material. Therefore, the flame resistance of the circuit module 1 is further improved by arranging the second mold resin 14 on the outermost side.

  The circuit module manufacturing method according to this embodiment is also characterized in that the second mold resin 14 is provided before the pre-division circuit module assembly 1A is cut. For example, when the circuit module assembly 1A before the division is cut and each circuit module being manufactured is covered with the second mold resin 14, the circuit module 1 also has the terminal molding surface 10b shown in FIG. It may be covered with. However, if the circuit module manufacturing method according to the present embodiment is used, the second mold resin 14 is provided when the second mold resin 14 is provided, rather than when each circuit module being manufactured is covered with the second mold resin 14. There is little risk of wrapping around the terminal forming surface 10b. Thereby, the circuit module manufacturing method according to the present embodiment can reduce the possibility that the terminal forming surface 10b is covered with the second mold resin 14.

(Embodiment 2)
FIG. 10 is a cross-sectional view of the circuit module according to the second embodiment cut along a plane orthogonal to the substrate. FIG. 11 is a flowchart illustrating the steps of the circuit module manufacturing method according to the second embodiment. FIG. 12 is a cross-sectional view showing the pre-division circuit module assembly in the middle of manufacture that has been subjected to the second cutting. The circuit module 2 shown in FIG. 10 is manufactured by the circuit module manufacturing system 20 shown in FIG. 3 executing a series of steps shown in FIG. The material of each member provided in the circuit module 2 shown in FIG. 10 is the same as the material of each member provided in the circuit module 1 shown in FIG.

  Steps ST201 to ST204 of the circuit module manufacturing method according to the present embodiment are the same as the steps ST101 to ST104 of the circuit module manufacturing method according to Embodiment 1, and a description thereof will be omitted. When manufacturing of a circuit module is started by the circuit module manufacturing method according to the present embodiment and the process ends up to step ST204, the process proceeds to step ST205 (sixth step).

  In step ST205, the cutting unit 23 shown in FIG. 3 performs the second cutting on the circuit module assembly 2A before division as shown in FIG. In the second cutting process, the cutting part 23 cuts the plating layer 13 from the electronic component mounting surface 10a side to the terminal forming surface 10b side and cuts a part of the substrate 10 to the depth D2 of the substrate 10. To do. The depth D2 is larger than the depth D1 shown in FIG. Note that the cutting portion 23 only needs to cut at least the plating layer 13, and it is not always necessary to cut off a part of the substrate 10. However, when only the plating layer 13 is cut, the machining accuracy required for the cutting portion 23 is improved. Therefore, in this embodiment, the cutting part 23 shall cut both the plating layer 13 and the board | substrate 10 by step ST205.

  The site | part which the cutting part 23 performs the 2nd cutting process is the site | part 16a and the site | part 16b. Next, let the surface exposed by the 2nd cutting process be the 2nd cutting bottom face 10f and the 2nd cutting side face 10g among the surfaces of the board | substrate 10. FIG. In the present embodiment, the cutting unit 23 performs a cutting process on the center of the first cutting bottom surface 10c of the substrate 10 in the second direction. The thickness of the dicing blade that is a cutting tool used in the second cutting is smaller than the thickness of the dicing blade used in the first cutting in step ST203. Thereby, the range in the 2nd direction which the cutting part 23 performs the 2nd cutting process becomes narrower than the range in the 2nd direction which performed the 1st cutting process in step ST203. Therefore, the first-cutting side surface 10d and the second-cutting side surface 10g are formed at positions separated in the second direction.

  FIG. 13 is a cross-sectional view showing the pre-division circuit module assembly provided with the second mold resin. FIG. 14 is a cross-sectional view showing the pre-division circuit module assembly that has been subjected to the third cutting. When step ST206 ends, the process proceeds to step ST206 (fourth step) shown in FIG. In step ST206, the sealing part 22 shown in FIG. 3 is provided with the second mold resin 14 so as to cover the entire plating layer 13 divided in step ST205 as shown in FIG. Thereby, the pre-division circuit module assembly 2A is completed. Next, it progresses to step ST207 (5th process) shown in FIG. 2, and the cutting part 23 shown in FIG. 3 performs the cutting process of the circuit module assembly 2A before a division | segmentation 3rd time as shown in FIG.

  In the third cutting process, the cutting part 23 cuts the second mold resin 14 and the substrate 10 from the electronic component mounting surface 10a side to the terminal forming surface 10b side until reaching the terminal forming surface 10b. In the present embodiment, the cutting unit 23 does not cut the plated layer 13. The parts to which the cutting part 23 performs the cutting process in the third cutting process are a part 17a and a part 17b shown in FIG. As shown in FIG. 13, the part 17a is between two second-cutting side faces 10g formed between the electronic component groups 11 adjacent in the second direction. The site | part 17b is between the two 2nd cutting side surfaces 10g formed in the side which does not have the adjacent electronic component group 11 among the both sides of the electronic component group 11a.

  Of the surface of the second mold resin 14, the surface exposed by the third cutting process is defined as a mold resin cutting side surface 14b. Further, among the surfaces of the substrate 10, a surface exposed by the third cutting process is defined as a third cutting side surface 10 h. In the present embodiment, the cutting unit 23 performs a cutting process on the center of the second cutting bottom surface 10f of the substrate 10 in the second direction. The thickness of the dicing blade as a cutting tool used in the third cutting process is smaller than the thickness of the dicing blade used in the second cutting process in step ST205. Thereby, the range in the 2nd direction which the cutting part 23 performs the 3rd cutting process becomes narrower than the range in the 2nd direction which performed the 2nd cutting process in step ST205. Therefore, the second cutting side surface 10g and the third cutting side surface 10h are formed at positions separated in the second direction.

  Through the process described above, the circuit module manufacturing system 20 manufactures the circuit module 2 shown in FIG. As shown in FIG. 13, the circuit module 2 manufactured by the manufacturing method of the present embodiment is filled with the second mold resin 14 between the plating layers 13 facing each other in the second direction, and the circuit module 2 in the second direction The second mold resin 14 is provided on both sides of the electronic component group 11a arranged at both ends. Then, in the circuit module 2, as shown in FIG. 14, the second mold resin 14 together with the substrate 10 is simultaneously cut with a dicing blade. Thereby, as shown in FIG. 10, in the circuit module 2, the position of the third cutting side surface 10h in the second direction is the same as the position of the mold resin cutting side surface 14b in the second direction. As a result, in the circuit module 2, since the mold resin cutting side surface 14b and the third cutting side surface 10h exist on the same plane, there is a step portion at the boundary between the mold resin cutting side surface 14b and the third cutting side surface 10h. Not formed.

  Thereby, the circuit module 2 can suppress a decrease in aesthetic appearance of the circuit module 2. Moreover, since the step part is not formed in the side surface 1s, the circuit module 2 has few portions where stress tends to concentrate on the side surface 1s. Thereby, when the circuit module 2 is handled, since the possibility that the external force will be concentrated inside the electronic component module is reduced, a decrease in durability is suppressed.

  Further, the circuit module 2 manufactured by the circuit module manufacturing method according to the present embodiment has the same effects as the circuit module 1 described above. In addition, the circuit module manufacturing method according to the present embodiment has the same effects as the circuit module manufacturing method according to the first embodiment. Further, the reason why these effects are achieved is the same as the reason described in the first embodiment. Hereinafter, of the effects produced by the circuit module 2, effects different from the effects produced by the circuit module 1 will be described.

  The circuit module 2 can suppress the deterioration of the durability of the plating layer 13 more suitably than the circuit module 1 of Embodiment 1 shown in FIG. The reason will be described below. In the circuit module 1 shown in FIG. 1, a part of the end portion 13 b of the plating layer 13 is exposed on the side surface 1 s of the circuit module 1. The end 13b of the plating layer 13 is in the same position in the second direction as the mold resin cutting side surface 14a of the second mold resin 14 and the second cutting side surface 10e of the substrate 10. That is, the end 13 b of the plating layer 13 does not protrude from the mold resin cutting side surface 14 a of the second mold resin 14 and the second cutting side surface 10 e of the substrate 10. Therefore, the durability of the plating layer 13 can be sufficiently secured even in the circuit module 1.

  On the other hand, in the circuit module 2 shown in FIG. 10, the plating layer 13 is completely covered with the second mold resin 14. Specifically, the substrate 10 of the present embodiment has a first step portion and a second step portion. The first stepped portion is a stepped portion that is recessed from the electronic component mounting surface 10a toward the terminal forming surface 10b, and is a portion formed by the first-cutting bottom surface 10c and the first-cutting side surface 10d. The second stepped portion is provided adjacent to the first stepped portion in the second direction away from the electronic component group 11, and is further recessed from the electronic component mounting surface 10a toward the terminal forming surface 10b than the first stepped portion. It is a level | step-difference part which has. The 2nd level | step-difference part is formed by 10g of 2nd cutting side surfaces, and 10f of 2nd cutting side surfaces. The substrate contact portion 13 a of the plating layer 13 and the end portion 13 b of the plating layer 13 are sandwiched between the first step portion and the second mold resin 14. The second mold resin 14 is provided at the second step portion.

  As a result, in the circuit module 2, the end portion 13 b of the plating layer 13 is covered with the second mold resin 14 provided in the second step portion. That is, in the circuit module 2, the end portion 13 b of the plating layer 13 is not exposed. Thereby, the circuit module 2 can theoretically reduce the area of the portion in contact with oxygen out of the total area of the plating layer 13 to zero. Further, the circuit module 2 can reduce a gap where a liquid such as water tries to enter the inside. Further, the circuit module 2 can theoretically reduce the external force acting directly on the plating layer 13 to zero. Therefore, the circuit module 2 can more suitably suppress peeling and oxidation of the plating layer 13 than when the end portion 13b of the plating layer 13 is exposed. As a result, the circuit module 2 can more suitably reduce the durability of the plated layer 13.

  As described above, the circuit module and the circuit module manufacturing method according to the present invention are useful for a technique for sealing electronic components, and are particularly suitable for suppressing a decrease in durability of a shield member.

1, 2 Circuit module 1A, 2A Pre-division circuit module assembly 1s Side surface 10 Substrate 10a Electronic component mounting surface 10b Terminal forming surface 10c First cut bottom surface 10d First cut side surface 10e Second cut side surface 10f Second cut bottom surface 10g Second time Cutting side surface 10h Third cutting side surface 11, 11a Electronic component group 12 First mold resin 12a Upper surface 12b Side surface 13 Plating layer 13a Substrate contact portion 13b End portion 14 Second mold resin 14a Mold resin cutting side surface 14b Mold resin cutting side surfaces 15a-17b Part 20 Circuit module manufacturing system 21 Circuit forming part 22 Sealing part 23 Cutting part 24 Plating layer forming part D1, D2 Depth

Claims (11)

A substrate having an electronic component mounting surface;
An electronic component mounted on the electronic component mounting surface;
A first sealing member covering the electronic component;
A shield member that covers the first sealing member and partially contacts the substrate;
A second sealing member that sandwiches a portion of the shield member that contacts the substrate with the substrate and covers at least a portion of the shield member;
A circuit module comprising: The substrate is
A terminal forming surface opposite to the electronic component mounting surface;
A step portion having a portion recessed from the electronic component mounting surface toward the terminal forming surface, and
The circuit module according to claim 1, wherein a portion of the shield member that contacts the substrate is sandwiched between the stepped portion and the second sealing member.   The circuit module according to claim 1, wherein the second sealing member covers the entire shield member. The substrate is
A terminal forming surface opposite to the electronic component mounting surface;
A first step portion having a portion recessed from the electronic component mounting surface toward the terminal forming surface;
A portion adjacent to the first step portion, provided at a portion opposite to the electronic component with the first step portion as a boundary, and from the electronic component mounting surface toward the terminal formation surface. A second step portion having a portion recessed further toward the terminal forming surface than the step portion,
An end portion of the shield member is provided to be in contact with the first step portion and sandwiched between the first step portion and the second sealing member,
The circuit module according to claim 1, wherein the second sealing member is in contact with the second stepped portion.   The circuit module according to any one of claims 1 to 4, wherein a side surface of the circuit module that forms an outer shape of the entire circuit module and has an angle with respect to the electronic component mounting surface is a flat surface. .   The circuit module according to claim 1, wherein a linear expansion coefficient of the second sealing member is smaller than a linear expansion coefficient of the first sealing member.   The circuit module according to claim 1, wherein a linear expansion coefficient of the second sealing member is equal to or less than a linear expansion coefficient of the substrate. A first step of covering the electronic component formed on the electronic component mounting surface of the substrate having two surfaces of the electronic component mounting surface and the terminal forming surface opposite to the electronic component mounting surface with a first sealing member When,
A second step of cutting at least the first sealing member from the electronic component mounting surface side toward the terminal forming surface side;
A third step of covering the first sealing member with a shield member and bringing a part of the shield member into contact with the substrate;
A fourth step of covering at least a part of the shield member with a second sealing member and sandwiching a portion of the shield member that contacts the substrate with the substrate;
A fifth step of cutting at least the second sealing member and the substrate from the electronic component mounting surface side toward the terminal forming surface side;
A circuit module manufacturing method comprising: In the second step, the first sealing member is cut from the electronic component mounting surface side toward the terminal forming surface side, and a part of the substrate is directed from the electronic component mounting surface toward the terminal forming surface. Excise the
The circuit module manufacturing method according to claim 8, wherein in the fifth step, the second sealing member, the substrate, and the shield member are cut from the electronic component mounting surface side toward the terminal forming surface side. .   Between the third step and the fourth step, a sixth step of cutting a portion of the shield member that contacts the substrate from the electronic component mounting surface side toward the terminal forming surface side The circuit module manufacturing method of Claim 8 provided. In the second step, the first sealing member is cut from the electronic component mounting surface side toward the terminal forming surface side, and a part of the substrate is directed from the electronic component mounting surface toward the terminal forming surface. Excise the
In the sixth step, the portion of the shield member that contacts the substrate is cut from the electronic component mounting surface side toward the terminal forming surface side, and from the electronic component mounting surface to the terminal forming surface. Also cut away part of the substrate towards
The circuit module manufacturing method according to claim 10, wherein in the fifth step, the second sealing member and the substrate are cut from the electronic component mounting surface side toward the terminal forming surface side.

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