JP5900680B1 - Adhesive composition, laminate, storage device packaging, storage device container, and storage device - Google Patents

Adhesive composition, laminate, storage device packaging, storage device container, and storage device Download PDF

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JP5900680B1
JP5900680B1 JP2015063150A JP2015063150A JP5900680B1 JP 5900680 B1 JP5900680 B1 JP 5900680B1 JP 2015063150 A JP2015063150 A JP 2015063150A JP 2015063150 A JP2015063150 A JP 2015063150A JP 5900680 B1 JP5900680 B1 JP 5900680B1
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adhesive composition
acid
layer
storage device
epoxy
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JP2016183223A (en
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睦 中里
睦 中里
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Toyo Ink SC Holdings Co Ltd
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Toyo Ink SC Holdings Co Ltd
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Priority to JP2015063150A priority Critical patent/JP5900680B1/en
Priority to PCT/JP2016/001692 priority patent/WO2016152161A1/en
Priority to CN201680017172.7A priority patent/CN107429133B/en
Priority to KR1020177029945A priority patent/KR102005491B1/en
Priority to TW105109185A priority patent/TWI695870B/en
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Publication of JP2016183223A publication Critical patent/JP2016183223A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/09Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38Packaging materials of special type or form
    • B65D65/40Applications of laminates for particular packaging purposes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/16Copolymers of ethene with alpha-alkenes, e.g. EP rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C08F255/02Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having two or three carbon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C08F255/08Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms
    • C08F255/10Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms on to butene polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00Polymerisation catalysts
    • C08F4/42Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors
    • C08F4/44Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides
    • C08F4/60Metals; Metal hydrides; Metallo-organic compounds; Use thereof as catalyst precursors selected from light metals, zinc, cadmium, mercury, copper, silver, gold, boron, gallium, indium, thallium, rare earths or actinides together with refractory metals, iron group metals, platinum group metals, manganese, rhenium technetium or compounds thereof
    • C08F4/62Refractory metals or compounds thereof
    • C08F4/64Titanium, zirconium, hafnium or compounds thereof
    • C08F4/659Component covered by group C08F4/64 containing a transition metal-carbon bond
    • C08F4/65912Component covered by group C08F4/64 containing a transition metal-carbon bond in combination with an organoaluminium compound
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • C08F8/12Hydrolysis
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14Polycondensates modified by chemical after-treatment
    • C08G59/1433Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461Unsaturated monoacids
    • C08G59/1472Fatty acids
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/06Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/052Li-accumulators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/116Primary casings; Jackets or wrappings characterised by the material
    • H01M50/121Organic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10Primary casings; Jackets or wrappings
    • H01M50/116Primary casings; Jackets or wrappings characterised by the material
    • H01M50/124Primary casings; Jackets or wrappings characterised by the material having a layered structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/033 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/40Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/31Heat sealable
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/514Oriented
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/732Dimensional properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/70Other properties
    • B32B2307/748Releasability
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2439/00Containers; Receptacles
    • B32B2439/40Closed containers
    • B32B2439/46Bags
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2800/00Copolymer characterised by the proportions of the comonomers expressed
    • C08F2800/20Copolymer characterised by the proportions of the comonomers expressed as weight or mass percentages
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Organic Chemistry (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
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  • Emergency Medicine (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
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Abstract

【課題】 40℃、3日間程度のエージングの場合に、85℃の電解質溶液に2週間以上浸漬されても接着強度を高レベルで維持できる積層体を形成できる接着剤組成物の提供。従来よりも電解質耐性に優れる蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイスの提供。【解決手段】 本発明は、カルボキシル基もしくは酸無水物基を有するポリオレフィン樹脂(A)と、不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応により得られるエポキシ化合物(B)とを含有することを特徴とする接着剤組成物。【選択図】 なしPROBLEM TO BE SOLVED: To provide an adhesive composition capable of forming a laminate capable of maintaining a high adhesive strength even when immersed in an electrolyte solution at 85 ° C. for 2 weeks or more in the case of aging at 40 ° C. for about 3 days. The provision of a packaging material for an electricity storage device, a container for an electricity storage device, and an electricity storage device that have better electrolyte resistance than before. The present invention relates to a reaction between a polyolefin resin (A) having a carboxyl group or an acid anhydride group, a polymer (B1) of an unsaturated fatty acid, and a compound (B2) having two or more epoxy groups. An adhesive composition comprising the resulting epoxy compound (B). [Selection figure] None

Description

本発明は接着剤組成物に関する。また、本発明は金属箔層とヒートシール層とを前記接着剤組成物を用いて積層した積層体および蓄電デバイス用包装材に関する。さらに本発明は、前記ヒートシール層が内面となるように前記蓄電デバイス用包装材を加工してなる蓄電デバイス用容器、および前記蓄電デバイス用容器を用いてなる蓄電デバイスに関する。   The present invention relates to an adhesive composition. Moreover, this invention relates to the laminated body which laminated | stacked the metal foil layer and the heat seal layer using the said adhesive composition, and the packaging material for electrical storage devices. Furthermore, the present invention relates to a power storage device container obtained by processing the power storage device packaging material so that the heat seal layer is an inner surface, and a power storage device using the power storage device container.

二次電池は代表的な蓄電デバイスである。携帯電話、携帯型パソコン等の電子機器の急速な成長により、軽量かつ小型のリチウムイオン電池などの二次電池の需要が増大してきた。二次電池の外装体としては、従来、金属製缶が用いられてきたが、軽量化や生産性の観点よりプラスチックフィルムや金属箔などを積層した包装材が主流となりつつある。
最もシンプルな包装材としては、図1のような外層側から順に樹脂フィルム層(11)、金属箔層(12)、接着剤層(13)およびヒートシール層(14)からなる積層体が挙げられる。蓄電デバイス用容器は、図2に示すように、樹脂フィルム層(11)が凸面を構成し、ヒートシール層(14)が凹面を構成するように前記包装材を成型(深絞り成型加工、張出し成型加工等)したものである。そして、蓄電デバイス用容器の凹面側に、電極や電解液等を封入してシールすることにより電池を製造している。
また、キャパシタも逐電デバイスの1つであり、中でもリチウムイオンキャパシタは今後市場の成長が見込まれる分野である。
A secondary battery is a typical power storage device. Due to the rapid growth of electronic devices such as mobile phones and portable personal computers, the demand for secondary batteries such as lightweight and small lithium-ion batteries has increased. Conventionally, metal cans have been used as outer bodies of secondary batteries, but packaging materials in which plastic films, metal foils, and the like are laminated are becoming mainstream from the viewpoints of weight reduction and productivity.
As the simplest packaging material, a laminate composed of a resin film layer (11), a metal foil layer (12), an adhesive layer (13) and a heat seal layer (14) in order from the outer layer side as shown in FIG. It is done. As shown in FIG. 2, the container for an electricity storage device is formed by molding the packaging material so that the resin film layer (11) forms a convex surface and the heat seal layer (14) forms a concave surface (deep drawing molding process, overhanging). Molding process, etc.). And the battery is manufactured by enclosing and sealing an electrode, electrolyte solution, etc. in the concave surface side of the container for electrical storage devices.
Capacitors are also one type of power-discharging devices. Among them, lithium ion capacitors are an area in which market growth is expected in the future.

特許文献1(特許3184725号)には、(A)酸無水物基、カルボキシル基およびカルボン酸金属塩からなる群から選ばれた少なくとも1種の官能基を有するポリオレフィン系樹脂および(B)エポキシ基を2個以上有し、かつ分子量が3000以下であるエポキシ化植物油を、特定割合で含有する接着性樹脂組成物が開示されている。   Patent Document 1 (Patent 3184725) includes (A) a polyolefin-based resin having at least one functional group selected from the group consisting of an acid anhydride group, a carboxyl group, and a carboxylic acid metal salt, and (B) an epoxy group. An adhesive resin composition containing two or more epoxidized vegetable oils having a molecular weight of 3000 or less in a specific ratio is disclosed.

特許文献2(特開2012−216364号公報)には、プロピレン成分を70質量%以上含有すると共に酸成分を0.1〜10質量%含有する酸変性ポリプロピレン樹脂と、オキサゾリン化合物及びエポキシ化合物の少なくとも一方を含む架橋剤とを特定の割合で含有する接着層を有する電池用外装体が開示されている。   Patent Document 2 (Japanese Patent Application Laid-Open No. 2012-216364) discloses an acid-modified polypropylene resin containing 70% by mass or more of a propylene component and 0.1 to 10% by mass of an acid component, and at least of an oxazoline compound and an epoxy compound. A battery exterior body having an adhesive layer containing a cross-linking agent containing one at a specific ratio is disclosed.

特許文献3(特開2013−91702号公報)には、酸変性ポリオレフィン樹脂(A)と、エポキシ基を1分子中に2つ以上有し、且つ、水酸基を1分子中に10以上有するエポキシ樹脂系化合物(B)とを含有する接着性樹脂組成物が開示されている。   Patent Document 3 (Japanese Patent Laid-Open No. 2013-91702) discloses an acid-modified polyolefin resin (A) and an epoxy resin having two or more epoxy groups in one molecule and ten or more hydroxyl groups in one molecule. An adhesive resin composition containing a compound (B) is disclosed.

特許文献4(WO2014/050686)には、水酸基及び/又は酸基を有するポリオレフィン樹脂(A)、リン酸変性化合物(B)、およびエポキシ当量が160〜1000であるエポキシ樹脂(C)を含有するラミネート用接着剤組成物が開示されている(請求項4)。そして、二次電池用の積層体への適用が開示されている(請求項9)。   Patent Document 4 (WO2014 / 050686) contains a polyolefin resin (A) having a hydroxyl group and / or an acid group, a phosphoric acid-modified compound (B), and an epoxy resin (C) having an epoxy equivalent of 160 to 1000. An adhesive composition for laminating is disclosed (claim 4). And the application to the laminated body for secondary batteries is disclosed (Claim 9).

特許3184725号Japanese Patent No. 3184725 特開2012−216364号公報JP 2012-216364 A 特開2013−91702号公報JP2013-91702A WO2014/050686のパンフレットWO2014 / 050686 brochure

蓄電デバイス用包装材のうち、金属箔層とヒートシール層とを貼り合わせるための接着剤層には、主に以下の性能が要求される。
(1) 金属箔層とヒートシール層との接着強度が大きいこと。
(2) 上記の接着剤層が電解質耐性を有していること。即ち、電解質を電池容器内に密封しても、金属箔とヒートシール層との接着強度が維持できること。
例えば、リチウム電池の電解質溶液は、六フッ化リン酸リチウムのようなリチウム塩(電解質)と、プロピレンカーボネート、エチレンカーボネート、ジエチルカーボネート、ジメチルカーボネート等の溶剤とを含む。
蓄電デバイス用容器に電解質溶液を入れると、電解質溶液がヒートシール層を通り抜け、接着剤層に達し、ヒートシール層と金属箔との接着強度低下を引き起こす。また、電池容器外部から電解質溶液に水分が浸入すると、六フッ化リン酸リチウムのようなリチウム塩と水とが反応し、フッ酸が発生する。発生したフッ酸はヒートシール層及び接着剤層を通り抜け、金属箔にまで到達し、金属箔を腐食させ、この腐食がヒートシール層と金属箔との接着強度を著しく低下させる。
そこで、ヒートシール層と金属箔層とを貼りあわせる接着剤層には、電解質そのものに対する耐性の他、蓄電デバイス外部からの進入物が電解質に作用し生じる物質に対する耐性も求められる。
ところで、近年、車載や家庭蓄電など用途が拡大するに伴い、蓄電デバイスには大容量化、長期の耐久性が求められるようになった。そのため特に車載用途においてはより優れた電解質耐性が求められる。
The following performance is mainly required for the adhesive layer for bonding the metal foil layer and the heat seal layer among the packaging materials for the electricity storage device.
(1) The adhesive strength between the metal foil layer and the heat seal layer is large.
(2) The adhesive layer has electrolyte resistance. That is, the adhesive strength between the metal foil and the heat seal layer can be maintained even if the electrolyte is sealed in the battery container.
For example, the electrolyte solution of a lithium battery includes a lithium salt (electrolyte) such as lithium hexafluorophosphate and a solvent such as propylene carbonate, ethylene carbonate, diethyl carbonate, and dimethyl carbonate.
When the electrolyte solution is put into the container for the electricity storage device, the electrolyte solution passes through the heat seal layer, reaches the adhesive layer, and causes a decrease in the adhesive strength between the heat seal layer and the metal foil. Further, when moisture enters the electrolyte solution from the outside of the battery container, a lithium salt such as lithium hexafluorophosphate reacts with water to generate hydrofluoric acid. The generated hydrofluoric acid passes through the heat seal layer and the adhesive layer, reaches the metal foil, and corrodes the metal foil. This corrosion significantly reduces the adhesive strength between the heat seal layer and the metal foil.
Therefore, the adhesive layer that bonds the heat seal layer and the metal foil layer is required to have resistance to a substance that is generated when an intruder from the outside of the electricity storage device acts on the electrolyte in addition to resistance to the electrolyte itself.
Incidentally, in recent years, with the expansion of applications such as in-vehicle and household power storage, power storage devices have been required to have a large capacity and long-term durability. Therefore, more excellent electrolyte resistance is required particularly for in-vehicle applications.

特許文献1は、接着性樹脂組成物をポリエステルフィルム上もしくはポリアミドフィルム上に溶融押し出し、各フィルムと前記接着性樹脂組成物層との間の接着強度が、温度60℃、相対湿度90%の恒温槽に48時間放置後も、ある程度維持できる旨、記載する。しかし、特許文献1は電池用包装材を開示しないし、示唆もしない。上記のような接着強度の耐湿性と電解質耐性とは全く異なる。
特許文献2は、前述の通り電池外装材を開示する。しかし、その電解質耐性は、85℃または100℃で24時間程度のレベルに過ぎない。
特許文献3は電池用包装材を開示しないし、示唆もしない。そして、初期の接着強度は記載されているが、接着強度の耐久性への言及は一切ない。当然、電解質耐性は一言も示唆されていない。
特許文献4は、前述の通り二次電池用の積層体への適用を開示し、「耐電解質性」に言及する。しかし、その「耐電解質性」は、リチウム塩のような電解質を含まない単なる溶剤(エチレンカーボネート、プロピルカーボネート)に40℃で30日間浸漬するレベルに過ぎない。すなわち、引用文献4における「耐電解質性」は単なる耐溶剤性である。電解質を含む電解質溶液に対する耐性と、単なる耐溶剤性とは全く異なる。
In Patent Document 1, the adhesive resin composition is melt-extruded on a polyester film or a polyamide film, and the adhesive strength between each film and the adhesive resin composition layer is a constant temperature at a temperature of 60 ° C. and a relative humidity of 90%. It is stated that it can be maintained to some extent even after being left in the tank for 48 hours. However, Patent Document 1 does not disclose or suggest a battery packaging material. The moisture resistance and electrolyte resistance of the adhesive strength as described above are completely different.
Patent Document 2 discloses a battery exterior material as described above. However, its electrolyte resistance is only about 24 hours at 85 ° C. or 100 ° C.
Patent Document 3 does not disclose or suggest a battery packaging material. And although the initial adhesive strength is described, there is no mention of the durability of the adhesive strength. Of course, no word for electrolyte resistance has been suggested.
Patent Document 4 discloses application to a laminate for a secondary battery as described above, and refers to “electrolytic resistance”. However, the “electrolyte resistance” is merely a level of immersion in a solvent (ethylene carbonate, propyl carbonate) not containing an electrolyte such as a lithium salt at 40 ° C. for 30 days. That is, “electrolyte resistance” in the cited document 4 is merely solvent resistance. Resistance to an electrolyte solution containing an electrolyte is completely different from mere solvent resistance.

本発明は、上記背景を鑑みてなされたものであり、より短いエージング時間の場合により高温の電解質溶液に長期間浸漬されても接着強度を高レベルで維持できる積層体を形成できる接着剤組成物を提供することを課題とする。また、本発明は、従来よりも電解質耐性に優れる蓄電デバイス用包装材、蓄電デバイス用容器および蓄電デバイスを提供することを課題とする。
具体的には40℃、3日間程度のエージングでも85℃、2週間以上の電解質耐性の確保を課題とする。
The present invention has been made in view of the above background, and in the case of a shorter aging time, an adhesive composition capable of forming a laminate capable of maintaining a high level of adhesive strength even when immersed in a high-temperature electrolyte solution for a long period of time. It is an issue to provide. Moreover, this invention makes it a subject to provide the packaging material for electrical storage devices, the container for electrical storage devices, and an electrical storage device which are more excellent in electrolyte tolerance than before.
Specifically, it is an object to ensure an electrolyte resistance of 85 ° C. for 2 weeks or more even after aging at 40 ° C. for about 3 days.

本発明者は、不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応により得られるエポキシ化合物(B)が、ポリオレフィンとの相溶性に優れ、硬化反応を早くすることを見出し、本発明を完成した。
即ち、本発明は、カルボキシル基もしくは酸無水物基を有するポリオレフィン樹脂(A)と、不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応により得られるエポキシ化合物(B)とを含有することを特徴とする接着剤組成物に関する。
The present inventor found that the epoxy compound (B) obtained by the reaction of the unsaturated fatty acid polymer (B1) and the compound (B2) having two or more epoxy groups is excellent in compatibility with the polyolefin and has a curing reaction. The present invention has been completed.
That is, the present invention is obtained by a reaction between a polyolefin resin (A) having a carboxyl group or an acid anhydride group, a polymer (B1) of an unsaturated fatty acid, and a compound (B2) having two or more epoxy groups. The present invention relates to an adhesive composition comprising an epoxy compound (B).

前記エポキシ化合物(B)は、不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応生成物を、さらに水添することにより得られるエポキシ化合物であることが好ましい。
前記不飽和脂肪酸の重合体(B1)は、炭素数が12〜24個の不飽和脂肪酸を2量化させた化合物(ダイマー酸)ないし3量化させた化合物(トリマー酸)であることが好ましい。
2つ以上のエポキシ基を有する前記の化合物(B2)は、ビスフェノールA型エポキシ化合物またはビスフェノールF型エポキシ化合物から選ばれることが好ましい。
前記エポキシ化合物(B)のエポキシ当量は、200〜7000であることが好ましい。
The epoxy compound (B) is an epoxy compound obtained by further hydrogenating a reaction product of a polymer (B1) of an unsaturated fatty acid and a compound (B2) having two or more epoxy groups. Is preferred.
The polymer (B1) of the unsaturated fatty acid is preferably a compound (dimer acid) or a compound (trimer acid) obtained by dimerizing an unsaturated fatty acid having 12 to 24 carbon atoms.
The compound (B2) having two or more epoxy groups is preferably selected from a bisphenol A type epoxy compound or a bisphenol F type epoxy compound.
It is preferable that the epoxy equivalent of the said epoxy compound (B) is 200-7000.

前記ポリオレフィン樹脂(A)の質量平均分子量は5万〜50万であることが好ましい。
前記ポリオレフィン樹脂(A)は、1−ブテンと他のオレフィンとから得られる共重合体を、さらに酸変性することにより得たものであることが好ましい。
The polyolefin resin (A) preferably has a mass average molecular weight of 50,000 to 500,000.
The polyolefin resin (A) is preferably obtained by further acid-modifying a copolymer obtained from 1-butene and another olefin.

本発明の接着剤組成物は、前記ポリオレフィン樹脂(A)1(g)当たりのカルボキシル基の含有量をX(mmol)、酸無水物基の含有量をY(mmol)とした場合に、X+2Yが0.05〜0.6であることが好ましい。
本発明の接着剤組成物は、前記ポリオレフィン樹脂(A)の含有量をP(g)、前記エポキシ樹脂(B)中のエポキシ基をZ(mmol)とした場合に、Z/[(X+2Y)P]が0.3〜10であることが好ましい。
In the adhesive composition of the present invention, when the content of carboxyl groups per 1 g of the polyolefin resin (A) is X (mmol) and the content of acid anhydride groups is Y (mmol), X + 2Y Is preferably 0.05 to 0.6.
When the content of the polyolefin resin (A) is P (g) and the epoxy group in the epoxy resin (B) is Z (mmol), the adhesive composition of the present invention is Z / [(X + 2Y). P] is preferably 0.3 to 10.

また、本発明は、前記の接着剤組成物から形成される接着剤層を介して、金属箔層とヒートシール層とが積層されてなる積層体に関する。   Moreover, this invention relates to the laminated body by which a metal foil layer and a heat seal layer are laminated | stacked through the adhesive bond layer formed from the said adhesive composition.

さらに、本発明は、外層から順に、樹脂フィルム層、金属箔層、接着剤層、ヒートシール層を必須とする蓄電デバイス用包装材において、前記接着剤層が前記の接着剤組成物から形成されることを特徴とする蓄電デバイス用包装材に関する。   Furthermore, the present invention is an electricity storage device packaging material in which a resin film layer, a metal foil layer, an adhesive layer, and a heat seal layer are essential from the outer layer, and the adhesive layer is formed from the adhesive composition. The present invention relates to a packaging material for an electricity storage device.

また、本発明は、前記の蓄電デバイス用包装材から形成されてなる蓄電デバイス用容器であって、ヒートシール層が内面を構成している、蓄電デバイス用容器に関する。
さらに、本発明は、前記の蓄電デバイス用容器を使用してなる蓄電デバイスに関する。
The present invention also relates to a container for an electricity storage device formed from the packaging material for an electricity storage device, wherein a heat seal layer constitutes the inner surface.
Furthermore, this invention relates to the electrical storage device formed using the said container for electrical storage devices.

本発明の接着剤組成物により、40℃、3日間程度のエージングの場合に、85℃の電解質溶液に2週間以上浸漬されても接着強度を高レベルで維持できる積層体を形成できる。   With the adhesive composition of the present invention, in the case of aging at 40 ° C. for about 3 days, it is possible to form a laminate capable of maintaining the adhesive strength at a high level even when immersed in an electrolyte solution at 85 ° C. for 2 weeks or more.

本発明の蓄電デバイス用包装材の一態様の模式的断面図である。It is typical sectional drawing of the one aspect | mode of the packaging material for electrical storage devices of this invention. 本発明の蓄電デバイス用容器の一態様(トレイ状)の模式的斜視図である。It is a typical perspective view of one mode (tray form) of the container for electrical storage devices of the present invention.

以下、本発明の実施の形態を、詳細に説明する。なお、本明細書において「任意の数A〜任意の数B」なる記載は、数Aおよび数Aより大きい範囲であって、数Bおよび数Bより小さい範囲を意味する。
本発明の蓄電デバイス用包装材は、図1に示すように、樹脂フィルム層(11)、金属箔層(12)、接着剤層(13)およびヒートシール層(14)が順次積層されてなるものである。接着剤層(13)は、金属箔層(12)とヒートシール層(14)とを積層(貼りあわせ)する役割を担う。
Hereinafter, embodiments of the present invention will be described in detail. In the present specification, the description “arbitrary number A to arbitrary number B” means a range larger than the number A and the number A and smaller than the number B and the number B.
As shown in FIG. 1, the packaging material for an electricity storage device of the present invention is formed by laminating a resin film layer (11), a metal foil layer (12), an adhesive layer (13), and a heat seal layer (14) in this order. Is. The adhesive layer (13) plays a role of laminating (bonding) the metal foil layer (12) and the heat seal layer (14).

本発明の蓄電デバイス用容器は、本発明の蓄電デバイス用包装材を用いて形成されたものであり、その形態は特に制限されない。好適な例として、図2に示すようなトレイ状のものが挙げられる。この例において、トレイの内部、即ち、電極や電解質等を収容するための空間を形成する凹面側にヒートシール層(14)が配置され、トレイの外側、即ち、凸面側に外層側樹脂フィルム層(11)が配置される。トレイ状の他、筒状(円筒、四角筒、楕円筒等)のものが例示できる。これらの蓄電デバイス用容器は、通常、平たい状態の蓄電デバイス用包装材を成型加工して得られる。蓄電デバイス用容器の内側、即ち電解液等と接する面は、ヒートシール層(14)である。フランジ部のヒートシール層(14)と、別の蓄電デバイス用包装材を構成するヒートシール層(14)や別の蓄電デバイス用容器のフランジ部のヒートシール層(14)とを対向・接触させ、加熱することにより、ヒートシール層(14)同士を融着させ、電解液や電極等の蓄電デバイス部材を封入する。
本発明の蓄電デバイス用の容器には、トレイ状の他、袋状用の容器(パウチタイプ)もある。
The container for an electricity storage device of the present invention is formed using the packaging material for an electricity storage device of the present invention, and the form thereof is not particularly limited. A preferred example is a tray-like one as shown in FIG. In this example, the heat seal layer (14) is disposed inside the tray, that is, on the concave side forming a space for accommodating an electrode, an electrolyte, and the like, and the outer layer side resin film layer on the outside of the tray, that is, on the convex side. (11) is arranged. In addition to the tray shape, a cylindrical shape (cylinder, square tube, elliptical tube, etc.) can be exemplified. These electric storage device containers are usually obtained by molding a flat storage device for an electric storage device. The inside of the electricity storage device container, that is, the surface in contact with the electrolytic solution or the like is a heat seal layer (14). The heat seal layer (14) of the flange portion and the heat seal layer (14) constituting another energy storage device packaging material or the heat seal layer (14) of the flange portion of another energy storage device container are opposed to and in contact with each other. By heating, the heat seal layers (14) are fused together, and an electricity storage device member such as an electrolytic solution or an electrode is enclosed.
The container for an electricity storage device of the present invention includes a bag-like container (pouch type) in addition to a tray shape.

本発明の接着剤組成物は、接着剤層(13)の形成に好適に用いられる。
本発明の接着剤組成物は、カルボキシル基もしくは酸無水物基を有するポリオレフィン樹脂(A)と、不飽和脂肪酸の重合体により変性されたエポキシ化合物(B)とを含有する。カルボキシル基もしくは酸無水物基を有するポリオレフィン樹脂(A)を単にポリオレフィン樹脂(A)と略し、不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応により得られるエポキシ化合物(B)を単にエポキシ化合物(B)と略すこともある。
本発明の接着剤組成物を、金属箔層(12)とヒートシール層(14)との間に挟んだ状態で、ポリオレフィン樹脂(A)中のカルボキシル基もしくは酸無水物基と、エポキシ化合物(B)中のエポキシ基とを反応させることにより、強固な架橋構造を形成し、十分な接着強度を発現でき、より高温の電解質溶液に長期間浸漬されてもその接着強度を高レベルで維持できる。
The adhesive composition of this invention is used suitably for formation of an adhesive bond layer (13).
The adhesive composition of the present invention contains a polyolefin resin (A) having a carboxyl group or an acid anhydride group and an epoxy compound (B) modified with a polymer of an unsaturated fatty acid. A polyolefin resin (A) having a carboxyl group or an acid anhydride group is simply abbreviated as a polyolefin resin (A), and is reacted with a polymer (B1) of an unsaturated fatty acid and a compound (B2) having two or more epoxy groups. The resulting epoxy compound (B) may simply be abbreviated as epoxy compound (B).
In a state where the adhesive composition of the present invention is sandwiched between the metal foil layer (12) and the heat seal layer (14), a carboxyl group or an acid anhydride group in the polyolefin resin (A) and an epoxy compound ( By reacting with the epoxy group in B), a strong cross-linked structure can be formed, sufficient adhesive strength can be expressed, and the adhesive strength can be maintained at a high level even when immersed in a higher temperature electrolyte solution for a long period of time. .

<カルボキシル基もしくは酸無水物基を有するポリオレフィン樹脂(A)>
ポリオレフィン樹脂(A)は、接着剤組成物に使用する溶剤への溶解性や、その溶解した溶液が沈殿せず安定に保管できる(保存安定性を有する)ために、非結晶性を有することが好ましい。一方、積層体における接着剤層としての電解質耐性を向上するためには、結晶性部位も有すことが好ましく、そのバランスが重要となる。本発明で使用する前記ポリオレフィン樹脂(A)は、質量平均分子量が5万〜50万、融点が60〜110℃であり、融解エネルギー(ΔE)が15〜50(mJ/mg
)であることが好ましい。
<Polyolefin resin (A) having carboxyl group or acid anhydride group>
The polyolefin resin (A) has non-crystallinity because it is soluble in the solvent used in the adhesive composition and can be stably stored without precipitation of the dissolved solution (having storage stability). preferable. On the other hand, in order to improve the electrolyte resistance as an adhesive layer in the laminate, it is preferable to have a crystalline part, and the balance is important. The polyolefin resin (A) used in the present invention has a mass average molecular weight of 50,000 to 500,000, a melting point of 60 to 110 ° C., and a melting energy (ΔE) of 15 to 50 (mJ / mg).
) Is preferable.

ポリオレフィン樹脂(A)は、質量平均分子量(Mw)が5万〜50万であることによって、接着剤組成物を構成するポリオレフィン樹脂(A)の溶液としての保存安定性と、蓄電デバイス用包装材としての電解質耐性、ヒートシール性、塗工性を両立しやすくなる。より好ましくは、ポリオレフィン樹脂(A)のMwは10万〜40万である。
言い換えると、ポリオレフィン樹脂(A)のMwが5万未満であると、ポリオレフィン樹脂(A)のポリマー鎖の絡み合いが不足するため接着剤層の膜強度が低くなり電解質耐性が不足する恐れがある。また、Mwが50万より大きいとポリオレフィン樹脂(A)溶液としての25℃での保存安定性が低下したり、接着剤溶液の粘度が高すぎて塗工性が悪化したりする恐れがある。
Since the polyolefin resin (A) has a mass average molecular weight (Mw) of 50,000 to 500,000, the storage stability as a solution of the polyolefin resin (A) constituting the adhesive composition, and a packaging material for an electricity storage device As a result, it is easy to achieve both electrolyte resistance, heat sealability, and coatability. More preferably, Mw of polyolefin resin (A) is 100,000-400,000.
In other words, if the Mw of the polyolefin resin (A) is less than 50,000, the polymer chain of the polyolefin resin (A) is insufficiently entangled, so that the film strength of the adhesive layer is lowered and the electrolyte resistance may be insufficient. On the other hand, if Mw is larger than 500,000, the storage stability at 25 ° C. as the polyolefin resin (A) solution may be lowered, or the viscosity of the adhesive solution may be too high to deteriorate the coatability.

ポリオレフィン樹脂(A)は、融点が60〜110℃、融解エネルギー(ΔE)が15〜50(m
J/mg)であることによって、蓄電デバイス用包装材としての接着強度(初期、電解液浸漬後)やヒートシール性をバランスよく満足することができる。
言い換えると、ポリオレフィン樹脂(A)の融点が60℃未満であると、電解液浸漬後の接着強度やヒートシール性が低下する恐れがある。融点が110℃より大きくなると接着強度(初期、電解液浸漬後)が低下する恐れがある。より好ましくはポリオレフィン樹脂(A)の融点は60〜90℃である。
また、ポリオレフィン樹脂(A)の融解エネルギー(ΔE)が15(mJ/mg)未満であると電
解液浸漬後の接着強度やヒートシール性が低下し、50(mJ/mg)より大きくなると結晶性が高く、ポリオレフィン樹脂(A)溶液としての保存安定性が低下する場合がある。より好ましくは、ポリオレフィン樹脂(A)の融解エネルギー(ΔE)は、20〜50(mJ/mg)であり、さらに好
ましくは20〜40(mJ/mg)である。
The polyolefin resin (A) has a melting point of 60 to 110 ° C. and a melting energy (ΔE) of 15 to 50 (m).
J / mg), the adhesive strength (initial, after immersion in the electrolyte solution) and heat sealability as a packaging material for an electricity storage device can be satisfied in a well-balanced manner.
In other words, when the melting point of the polyolefin resin (A) is less than 60 ° C., the adhesive strength and the heat sealability after immersion in the electrolyte may be lowered. If the melting point is higher than 110 ° C., the adhesive strength (initially, after immersion in the electrolytic solution) may be reduced. More preferably, the melting point of the polyolefin resin (A) is 60 to 90 ° C.
Further, when the melting energy (ΔE) of the polyolefin resin (A) is less than 15 (mJ / mg), the adhesive strength and heat sealability after immersion in the electrolyte are lowered, and when it is higher than 50 (mJ / mg), the crystallinity. The storage stability as a polyolefin resin (A) solution may decrease. More preferably, the melting energy (ΔE) of the polyolefin resin (A) is 20 to 50 (mJ / mg), and more preferably 20 to 40 (mJ / mg).

ここで、ヒートシール性について説明する。
蓄電デバイス用包装材には、[解決しようとする課題]の項の冒頭で述べた2つの性能(接着強度が大きいこと、電解質耐性に優れること)の他に、さらにヒートシール性に優れることも求められる。
蓄電デバイス用包装材を構成するヒートシール層(14)は、前述の通り、熱により、ヒートシール層(14)同士を融着させ、蓄電デバイス用容器内に電解液や電極等の蓄電デバイス部材を封入する機能を担う。大きなヒートシール強度(ヒートシール層(14)同士の剥離強度)を確保するという観点からは、高温・高圧でのヒートシールが好ましいと考えられる。
しかし、ヒートシール時の熱と圧力により、ヒートシール層(14)と金属箔層(12)とを貼り合わせていた接着剤層(13)が溶融したり変形したりすると、電極端子と金属箔層(12)とが導通してしまうおそれがある。導通してしまうと、蓄電デバイスとして機能しない。そこで、電極端子と金属箔層(13)との絶縁性がヒートシールによって損なわれないよう、ヒートシール時の熱と圧力により、接着剤層(13)が溶融したり変形したりしないことが求められる。
融点や融解エネルギー(ΔE)を上記範囲内のポリオレフィン樹脂(A)のものを用いることによ
り、ヒートシール時の接着剤層(13)の溶融や変形を効果的に抑制・防止できる。
Here, the heat sealability will be described.
In addition to the two performances (high adhesion strength and excellent electrolyte resistance) described at the beginning of the section [Problems to be Solved], the power storage device packaging material also has excellent heat sealability. Desired.
As described above, the heat seal layer (14) constituting the packaging material for the electricity storage device is fused with the heat seal layer (14) by heat, and an electricity storage device member such as an electrolyte solution or an electrode in the electricity storage device container. Responsible for the function of sealing. From the viewpoint of securing a large heat seal strength (peel strength between heat seal layers (14)), it is considered that heat seal at high temperature and high pressure is preferable.
However, when the adhesive layer (13) that has bonded the heat seal layer (14) and the metal foil layer (12) melts or deforms due to heat and pressure during heat sealing, the electrode terminal and the metal foil There is a possibility that the layer (12) is electrically connected. When conducting, it does not function as an electricity storage device. Therefore, it is required that the adhesive layer (13) is not melted or deformed by heat and pressure during heat sealing so that the insulation between the electrode terminal and the metal foil layer (13) is not impaired by heat sealing. It is done.
By using the polyolefin resin (A) having a melting point and melting energy (ΔE) within the above ranges, melting and deformation of the adhesive layer (13) during heat sealing can be effectively suppressed / prevented.

なお、本発明において「保存安定性がある」とは、トルエン:90gに樹脂:10gを加え、樹脂を加熱溶解し、透明な溶液を得た後、25℃に冷却し、同温で一週間静置して沈殿を生じないものを言う。   In the present invention, “storage stability” means that 10 g of resin is added to 90 g of toluene, the resin is heated and dissolved to obtain a transparent solution, and then cooled to 25 ° C. for one week at the same temperature. A thing that does not cause precipitation upon standing.

本発明におけるポリオレフィン樹脂(A)は、カルボキシル基または酸無水物基を有していればよく、例えば、カルボキシル基または酸無水物基を有していないポリオレフィン樹脂(A1)にエチレン性不飽和カルボキシル基またはその酸無水物をグラフト重合させた変性ポリオレフィン樹脂や、オレフィンモノマーとエチレン性不飽和カルボン酸またはその酸無水物との共重合体等が挙げられる。また、酸無水物基を有するポリオレフィンの酸無水物基と、水やアルコールと反応させることによりカルボキシル基を有するポリオレフィンを得ることもできる。カルボキシル基または酸無水物基を有していないポリオレフィン(A1)にエチレン性不飽和カルボキシル基またはその酸無水物をグラフト重合させた変性ポリオレフィン樹脂が好ましい。ポリオレフィン樹脂(A)は単独で使用しても良いし、2種以上を任意に組み合わせて使用しても良い。
ポリオレフィン樹脂(A)中のカルボキシル基または酸無水物基の量については、後述する。
The polyolefin resin (A) in the present invention only needs to have a carboxyl group or an acid anhydride group. For example, the polyolefin resin (A1) not having a carboxyl group or an acid anhydride group may have an ethylenically unsaturated carboxyl group. Examples thereof include a modified polyolefin resin obtained by graft polymerization of a group or its acid anhydride, and a copolymer of an olefin monomer and an ethylenically unsaturated carboxylic acid or its acid anhydride. Moreover, the polyolefin which has a carboxyl group can also be obtained by making it react with the acid anhydride group of polyolefin which has an acid anhydride group, and water or alcohol. A modified polyolefin resin obtained by graft-polymerizing an ethylenically unsaturated carboxyl group or an acid anhydride thereof to a polyolefin (A1) having no carboxyl group or acid anhydride group is preferred. The polyolefin resin (A) may be used alone or in combination of two or more.
The amount of the carboxyl group or acid anhydride group in the polyolefin resin (A) will be described later.

ポリオレフィンのグラフト重合方法は、特に限定されないが、例えば特開平11−293216に開示されている方法を用いることができる。
前記ポリオレフィン樹脂(A1)としては、特に限定されるものではないが、例えば、エチレン、プロピレン、1−ブテン、ブタジエン、イソプレン、1−ヘキセン、1−オクテン等のオレフィンモノマーの単独重合体、オレフィンモノマー同士の共重合体、もしくはその他のモノマーとの共重合体、および得られた重合体の水素化物やハロゲン化物など、炭化水素骨格を主体とする重合体を指す。オレフィンモノマー同士の共重合体が好ましい。
The method for graft polymerization of polyolefin is not particularly limited. For example, the method disclosed in JP-A-11-293216 can be used.
Although it does not specifically limit as said polyolefin resin (A1), For example, the homopolymer of olefin monomers, such as ethylene, propylene, 1-butene, butadiene, isoprene, 1-hexene, 1-octene, olefin monomer It refers to a polymer mainly composed of a hydrocarbon skeleton, such as a copolymer of each other, a copolymer with other monomers, and a hydride or halide of the obtained polymer. A copolymer of olefin monomers is preferred.

オレフィンモノマー同士の共重合体としては、1−ブテンと他のオレフィンモノマーとの共重合体が好ましい。他のオレフィンとしては、エチレン、プロピレンが好ましく、1−ブテンと他のオレフィンモノマーとの共重合体としては、エチレンと1−ブテンとの二元共重合体、プロピレンと1−ブテンとの二元共重合体、エチレンとプロピレンと1−ブテンとの三元共重合体が挙げられ、プロピレンと1−ブテンとの二元共重合体がより好ましい。共重合比は、プロピレン:1−ブテン=10:90〜80:20(モル比)であることが好ましく、40:60〜80:20(モル比)であることがより好ましい。プロピレンと1−ブテンの共重合体において、プロピレンが10モル%未満の場合は融点が60℃より低い場合があり、80モル%より多い場合は融点が110℃より高くなる場合がある。   As a copolymer of olefin monomers, a copolymer of 1-butene and another olefin monomer is preferable. Other olefins are preferably ethylene and propylene, and copolymers of 1-butene and other olefin monomers are binary copolymers of ethylene and 1-butene, binary of propylene and 1-butene. Examples of the copolymer include a terpolymer of ethylene, propylene and 1-butene, and a binary copolymer of propylene and 1-butene is more preferable. The copolymerization ratio is preferably propylene: 1-butene = 10: 90 to 80:20 (molar ratio), and more preferably 40:60 to 80:20 (molar ratio). In the copolymer of propylene and 1-butene, the melting point may be lower than 60 ° C. when propylene is less than 10 mol%, and the melting point may be higher than 110 ° C. when more than 80 mol%.

オレフィンモノマーに共重合してもよいその他のモノマーとしては、特に限定されず、例えば、
スチレン、α−メチルスチレン、インデン等の芳香族ビニル化合物;
メチル(メタ)アクリレート、エチル(メタ)アクリレート、ブチル(メタ)アクリレート、ヘキシル(メタ)アクリレート、オクチル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、ドデシル(メタ)アクリレート、ステアリル(メタ)アクリレート、ベヘニル(メタ)アクリレート等のアルキル(メタ)アクリレート化合物;
シクロヘキシル(メタ)アクリレート、イソボルニル(メタ)アクリレート等の脂環構造を有する(メタ)アクリレート化合物;
ベンジル(メタ)アクリレート等の芳香環を有する(メタ)アクリレート化合物;
2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、4−ヒドロキシブチル(メタ)アクリレート等の水酸基含有(メタ)アクリレート化合物;
ジメチルアミノエチル(メタ)アクリレート、ジエチルアミノエチル(メタ)アクリレート、t−ブチルアミノエチル(メタ)アクリレート等のアミノ基を有する(メタ)アクリレート化合物;
(メタ)アクリルアミド、ジメチル(メタ)アクリルアミド、ジメチルアミノプロピル(メタ)アクリルアミド、イソプロピル(メタ)アクリルアミド、ジエチル(メタ)アクリルアミド、ヒドロキシエチル(メタ)アクリルアミド等のアクリルアミド類;
(メタ)アクリロニトリル、アクリロイルモルホリン等が挙げられる。
グラフト重合性の点およびポリオレフィンとの相溶性の点から、スチレン、ドデシル(メタ)アクリレート、ステアリル(メタ)アクリレートが好ましい。
前記エチレン性不飽和カルボン酸としては、特に限定されるものではないが、例えば、アクリル酸、メタクリル酸、マレイン酸、フマル酸、クロトン酸、イタコン酸等が挙げられる。これらエチレン性不飽和カルボン酸またはその酸無水物は、1種のみを用いても良いし、2種以上を併用しても良い。
Other monomers that may be copolymerized with the olefin monomer are not particularly limited, for example,
Aromatic vinyl compounds such as styrene, α-methylstyrene, and indene;
Methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, dodecyl (meth) acrylate, stearyl (meth) acrylate, Alkyl (meth) acrylate compounds such as behenyl (meth) acrylate;
(Meth) acrylate compounds having an alicyclic structure such as cyclohexyl (meth) acrylate and isobornyl (meth) acrylate;
(Meth) acrylate compounds having an aromatic ring such as benzyl (meth) acrylate;
Hydroxyl group-containing (meth) acrylate compounds such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate;
(Meth) acrylate compounds having an amino group such as dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, t-butylaminoethyl (meth) acrylate;
Acrylamides such as (meth) acrylamide, dimethyl (meth) acrylamide, dimethylaminopropyl (meth) acrylamide, isopropyl (meth) acrylamide, diethyl (meth) acrylamide, hydroxyethyl (meth) acrylamide;
(Meth) acrylonitrile, acryloylmorpholine, etc. are mentioned.
Styrene, dodecyl (meth) acrylate, and stearyl (meth) acrylate are preferable from the viewpoint of graft polymerization and compatibility with polyolefin.
The ethylenically unsaturated carboxylic acid is not particularly limited, and examples thereof include acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, and itaconic acid. These ethylenically unsaturated carboxylic acids or acid anhydrides thereof may be used alone or in combination of two or more.

オレフィンモノマーの重合方法は、特に限定されないが、例えば、特公平07−080948号に開示されている方法などチーグラー・ナッタ触媒やメタロセン触媒などの金属触媒や、必要に応じて(メチル)アルミノキサン等の助触媒を添加して、重合することができる。   The polymerization method of the olefin monomer is not particularly limited. For example, a metal catalyst such as a Ziegler-Natta catalyst or a metallocene catalyst such as the method disclosed in Japanese Patent Publication No. 07-080948, or (methyl) aluminoxane as necessary. A cocatalyst can be added to polymerize.

なお、ポリオレフィン樹脂(A)のMwは、以下のようにして求める。
TSKgel superHZM−Nのカラムを2本接続した東ソー株式会社製HLC−8220GPCシステムにより、カラム温度40℃、溶離液にテトラヒドロフラン、流量毎分0.35mlの条件にて測定した。サンプルは、2mgのポリオレフィン樹脂(A)を、5mlのテトラヒドロフランに溶解して調整した。また、Mwは標準ポリスチレン換算で算出した。
ポリオレフィン樹脂(A)を2種以上併用した場合は、その混合物全体の質量平均分子量を意味する。
In addition, Mw of polyolefin resin (A) is calculated | required as follows.
The measurement was carried out with a column temperature of 40 ° C., tetrahydrofuran as an eluent, and a flow rate of 0.35 ml per minute, using an HLC-8220GPC system manufactured by Tosoh Corporation, in which two TSKgel superHZM-N columns were connected. A sample was prepared by dissolving 2 mg of polyolefin resin (A) in 5 ml of tetrahydrofuran. Mw was calculated in terms of standard polystyrene.
When two or more types of polyolefin resins (A) are used in combination, it means the mass average molecular weight of the entire mixture.

また融点、融解エネルギー(ΔE)は、JIS K7121に準じてDSC測定により求めること
ができる。具体的には以下のようにして求める。
約10mgのポリオレフィン樹脂(A)の直径または各辺が0.5mm以下の場合はそのまま使用し、0.5mmを超えるものは0.5mm以下に切断して容器に入れる。
毎分10℃で融点より約30℃高い温度まで加熱し、その後毎分10℃でTgより約50℃低い温度まで冷却する。明確なTgが観測されない場合は、融点より約50℃低い温度まで冷却する。その後、毎分10℃で融点より約30℃高い温度まで加熱した際に表れる融解に対応するピークのピークトップより求めた。また、ΔEは、融解に対応するピークが、ベースラインから離れてから再度ベー
スラインに戻るまでの部分の面積より求める。
ポリオレフィン樹脂(A)を2種以上併用する場合は、融点は高温側のピークのピークトップより求め、ΔEは融解により得られる全てのピーク面積の合計から算出する。
The melting point and melting energy (ΔE) can be determined by DSC measurement according to JIS K7121. Specifically, it is obtained as follows.
When the diameter or each side of the polyolefin resin (A) of about 10 mg is 0.5 mm or less, it is used as it is, and if it exceeds 0.5 mm, it is cut into 0.5 mm or less and put into a container.
Heat to about 30 ° C above the melting point at 10 ° C per minute and then cool to about 50 ° C below Tg at 10 ° C per minute. If no clear Tg is observed, cool to about 50 ° C. below the melting point. Then, it calculated | required from the peak top of the peak corresponding to the melting which appears when it heated to about 30 degreeC higher than melting | fusing point at 10 degreeC per minute. Further, ΔE is obtained from the area of the portion from when the peak corresponding to melting is separated from the baseline until it returns to the baseline again.
When two or more polyolefin resins (A) are used in combination, the melting point is determined from the peak top of the peak on the high temperature side, and ΔE is calculated from the sum of all peak areas obtained by melting.

ポリオレフィン樹脂(A)としては、市販品を用いることもでき、例えば、スミフィットCK1D(商品名、住友化学株式会社製)、ユニストールP−401、P−802、P−902(商品名)ユーメックス1001、1010、2000(商品名、三洋化成株式会社製)、アウローレン350S、351S、359S、S−5247S、S−5248S、S−5297S、S−5349S、S−5350Sなどが挙げられる。   Commercially available products can also be used as the polyolefin resin (A). For example, Sumifit CK1D (trade name, manufactured by Sumitomo Chemical Co., Ltd.), Unistor P-401, P-802, P-902 (trade name) Umex 1001, 1010, 2000 (trade name, manufactured by Sanyo Chemical Co., Ltd.), Auroren 350S, 351S, 359S, S-5247S, S-5248S, S-5297S, S-5349S, S-5350S, and the like.

本発明では、発明の効果を損なわない範囲で、カルボキシル基または酸無水物基を有するポリオレフィン樹脂(A)の他に、カルボキシル基または酸無水物基を有さないポリオレフィン樹脂を併用しても良い。   In the present invention, in addition to the polyolefin resin (A) having a carboxyl group or an acid anhydride group, a polyolefin resin not having a carboxyl group or an acid anhydride group may be used in combination as long as the effects of the invention are not impaired. .

本発明で使用されるカルボキシル基または酸無水物基を有さないポリオレフィン樹脂としては、例えば、住友化学株式会社製のタフセレンT3712、T3722、T3522(プロピレン系エラストマー)、住友ノーブレン(ポリプロピレン)、三井化学社製タフマーDF&A、タフマーH、タフマーXM、タフマーBL、タフマーM(α−オレフィン共重合体)、株式会社クラレ製のクラプレンLIR−30(イソプレン重合体)、LIR−200(水素化イソプレン重合体)、LBR−300(ブタジエン重合体)、株式会社クラレ製のセプトン2002、2004(以上、水素化スチレン−イソプレン−スチレン共重合体)、2104、4033、HG252(以上、水素化スチレン−イソプレン/ブタジエン−スチレン共重合体)、旭化成ケミカルズ株式会社製のアサプレンT−432、T−437、クレイトンポリマージャパン株式会社製のクレイトンD1155(以上、スチレン−ブタジエン−スチレン共重合体)、旭化成ケミカルズ株式会社製のタフテックP1500、P2000、MP10(部分水素化スチレン−ブタジエン−スチレン共重合体)、H1052、H1043(以上、水素化スチレン−ブタジエン−スチレン共重合体)、日本製紙ケミカル株式会社製のスーパークロンC(プロピレン重合体の塩素化物)、日本ポリエチレン株式会社製のレクスパールEMA(エチレン−アクリル酸メチル共重合体)、レクスパールEEA(エチレン−アクリル酸エチル共重合体)、三井・デュポンポリケミカル株式会社製エバフレックス(エチレン−酢酸ビニル共重合体)、住友化学株式会社製ボンドファースト(エチレン−グリシジルメタクリレート共重合体)等が挙げられる。これらは単独で使用しても良いし、2種以上を任意に組み合わせて使用しても良い。   Examples of the polyolefin resin having no carboxyl group or acid anhydride group used in the present invention include Tough selenium T3712, T3722, T3522 (propylene elastomer), Sumitomo Noblen (polypropylene), Mitsui Chemicals, manufactured by Sumitomo Chemical Co., Ltd. Tuffmer DF & A, Tuffmer H, Tuffmer XM, Tuffmer BL, Tuffmer M (α-olefin copolymer), Kuraray LIR-30 (isoprene polymer), LIR-200 (hydrogenated isoprene polymer) manufactured by Kuraray Co., Ltd. LBR-300 (butadiene polymer), Kuraray Co., Ltd. Septon 2002, 2004 (above, hydrogenated styrene-isoprene-styrene copolymer), 2104, 4033, HG252 (above, hydrogenated styrene-isoprene / butadiene- Styrene copolymer) Asaprene T-432 and T-437 manufactured by Asahi Kasei Chemicals Co., Ltd., Clayton D1155 manufactured by Kraton Polymer Japan Co., Ltd. (Partially hydrogenated styrene-butadiene-styrene copolymer), H1052, H1043 (above, hydrogenated styrene-butadiene-styrene copolymer), Nippon Paper Chemicals Co., Ltd. Supercron C (chlorinated product of propylene polymer), Lexpearl EMA (ethylene-methyl acrylate copolymer) manufactured by Nippon Polyethylene Co., Ltd., Lexpearl EEA (ethylene-ethyl acrylate copolymer), Everflex (ethylene-vinyl acetate copolymer) manufactured by Mitsui DuPont Polychemical Co., Ltd. Polymer), Sumitomo Chemical Co., Ltd. bond first (ethylene-glycidyl methacrylate copolymer), and the like. These may be used alone or in any combination of two or more.

次に本発明で使用される不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応により得られるエポキシ化合物(B)について説明する。
前記エポキシ化合物(B)中のエポキシ基と、前記ポリオレフィン樹脂(A)中のカルボキシル基または酸無水物基とを反応させた強固な架橋構造により、十分な接着強度を発現でき、より高温の電解質溶液に長期間浸漬されてもその接着強度を高レベルで維持できる。
Next, the epoxy compound (B) obtained by the reaction of the unsaturated fatty acid polymer (B1) used in the present invention with the compound (B2) having two or more epoxy groups will be described.
Due to the strong cross-linked structure obtained by reacting the epoxy group in the epoxy compound (B) with the carboxyl group or acid anhydride group in the polyolefin resin (A), sufficient adhesive strength can be expressed, and the electrolyte has a higher temperature. Even if it is immersed in the solution for a long time, its adhesive strength can be maintained at a high level.

本発明で使用される前記エポキシ化合物(B)としては、以下に限定されるものではないが、不飽和脂肪酸の重合体(B1)中のカルボキシル基と、2つ以上のエポキシ基を有する化合物(B2)中のエポキシ基とのエステル化反応により得られる樹脂またはその水添化合物が挙げられる。
不飽和脂肪酸の重合体(B1)で変性したエポキシ化合物(B)を用いることにより、前記ポリオレフィン樹脂(A)との相溶性を著しく改善し、ポリオレフィン樹脂(A)中のカルボキシル基または酸無水物基との反応が促進され、生産性を向上させることができる。
The epoxy compound (B) used in the present invention is not limited to the following, but is a compound having a carboxyl group in an unsaturated fatty acid polymer (B1) and two or more epoxy groups ( Examples thereof include a resin obtained by an esterification reaction with an epoxy group in B2) or a hydrogenated compound thereof.
By using the epoxy compound (B) modified with the unsaturated fatty acid polymer (B1), the compatibility with the polyolefin resin (A) is remarkably improved, and the carboxyl group or acid anhydride in the polyolefin resin (A) The reaction with the group is promoted, and the productivity can be improved.

前記不飽和脂肪酸の重合体(B1)としては、例えば、不飽和脂肪酸の2量体、3量体や4量体以上のオリゴマーが挙げられ、2量体(ダイマー酸)、3量体(トリマー酸)が好ましく、両者の混合物であってもよい。
不飽和脂肪酸としては、例えばオレイン酸、エライジン酸、バクセン酸、リシノレン酸、ガドレイン酸、エイコセン酸、エルカ酸、ネルボン酸などの1つの不飽和基を有する脂肪酸;
リノール酸、イコサジエン酸、ドコサジエン酸などの2つの不飽和基を有する脂肪酸;
イコサトリエン酸、エレオステアリン酸、ジホモ−γ−リノレン酸、ピノレン酸、ミード酸、リノレン酸などの3つの不飽和基を有する脂肪酸;
ステアリドン酸、アダキドン酸、エイコサテトラエン酸、アドレン酸などの4つの不飽和基を有する脂肪酸が挙げられる。
これら重合脂肪酸の市販品としては、例えば、クローダジャパン社製の「プリポール1004」、「プリポール1006」、「プリポール1009」、「プリポール1013」、「プリポール1015」、「プリポール1017」、「プリポール1022」、「プリポール1025」、「プリポール1040」や、BASFジャパン社製の「エンポール1008」、「エンポール1012」、「エンポール1016」、「エンポール1026」、「エンポール1028」、「エンポール1043」、「エンポール1061」、「エンポール1062」等が挙げられる。
中でも、前記ポリオレフィン樹脂(A)との相溶性がよく、工業的に得られやすい炭素数が12〜24個の不飽和脂肪酸が好ましい。
Examples of the unsaturated fatty acid polymer (B1) include dimers, trimers and oligomers of tetramers or more of unsaturated fatty acids, dimers (dimer acids), trimers (trimers). Acid) is preferred, and a mixture of both may be used.
Examples of unsaturated fatty acids include fatty acids having one unsaturated group such as oleic acid, elaidic acid, vaccenic acid, ricinolenic acid, gadoleic acid, eicosenoic acid, erucic acid, nervonic acid;
Fatty acids having two unsaturated groups such as linoleic acid, icosadienoic acid, docosadienoic acid;
Fatty acids having three unsaturated groups such as icosatrienoic acid, eleostearic acid, dihomo-γ-linolenic acid, pinolenic acid, mead acid, linolenic acid;
Examples include fatty acids having four unsaturated groups such as stearidonic acid, adachidonic acid, eicosatetraenoic acid, and adrenic acid.
Examples of commercially available products of these polymerized fatty acids include “Pripol 1004”, “Plipol 1006”, “Plipol 1009”, “Plipol 1013”, “Plipol 1015”, “Plipol 1017”, and “Plipol 1022” manufactured by Croda Japan. , “Prepole 1025”, “Prepole 1040”, “Empole 1008”, “Empole 1012”, “Empole 1016”, “Empole 1026”, “Empole 1028”, “Empole 1043”, “Empole 1061” manufactured by BASF Japan And “Empole 1062”.
Among these, unsaturated fatty acids having 12 to 24 carbon atoms, which have good compatibility with the polyolefin resin (A) and are easily obtained industrially, are preferable.

2つ以上のエポキシ基を有する化合物(B2)は、1分子中に2つ以上のエポキシ基を有する化合物であればよく、例えば、市販品としては、例えば、三菱化学社製の商品名「エピコート828」、「エピコート834」、「エピコート1001」、「エピコート1004」、大日本インキ化学工業社製の商品名「エピクロン840」、「エピクロン850」、「エピクロン1050」、「エピクロン2055」、新日鉄住金化学社製の商品名「エポトート128」等のビスフェノールA型エポキシ化合物;
大日本インキ化学工業社製の商品名「エピクロン830S」、三菱化学社製の商品名「エピコート807」、新日鉄住金化学社製の商品名エポトートYDF−170」、「エポトートYDF−175」、「エポトートYDF−2004」等のビスフェノールF型エポキシ化合物;
日本化薬製の商品名「EBPS−200」、旭電化工業社製の商品名「EPX−30」、大日本インキ化学工業社製の商品名「エピクロンEXA1514」等のビスフェノールS型エポキシ化合物;
大阪ガス社製の商品名「BPFG」等のビスフェノールフルオレン型エポキシ化合物、三菱化学社製の商品名「YL−6056」、「YL−6021」、「YX−4000」、「YX−4000H」等のビキシレノール型、或いはビフェニル型エポキシ化合物、又はそれらの混合物;
新日鉄住金化学社製の商品名「エポトートST−2004」、「ST−2007」、「ST−3000」等の水添ビスフェノールA型エポキシ化合物;
三菱化学社製の商品名「エピコート152」、「エピコート154」、ダウケミカル社製の商品名「D.E.N.431」、「D.E.N.438」、大日本インキ化学工業社製の商品名「エピクロンN−690」、「エピクロンN−695」、「エピクロンN−730」、「エピクロンN−770」、「エピクロンN−865」、新日鉄住金化学社製の商品名「エポトートYDCN−701」、「エポトートYDCN−704」、日本化薬社製の商品名「EPPN−201」、「EOCN−1025」、「EOCN−1020」、「EOCN−104S」、「RE−306」等のノボラック型エポキシ化合物;
三菱化学社製の商品名「エピコートYL−903」、大日本インキ化学工業社製の商品名「エピクロン152」、「エピクロン165」、新日鉄住金化学社製の商品名「エポトートYDB−400」、「エポトートYDB−500」等の臭素化ビスフェノールA型エポキシ化合物;
新日鉄化学社製の商品名「ESN−190」、「ESN−360」、大日本インキ化学工業社製の商品名「HP−4032」、「EXA−4700」、「EXA−4750」等のナフタレン骨格を有するエポキシ化合物;
大日本インキ化学工業社製の商品名「HP−7200」、「HP−7200H」等のジシクロペンタジエン骨格を有するエポキシ化合物;
三菱化学社製の商品名「YL−933」、日本化薬社製の商品名「EPPN−501」「EPPN−502」等のトリスヒドロキシフェニルメタン型エポキシ化合物;
日産化学社製の商品名「TEPIC」、三菱ガス化学社製の商品名「TGI」等の複素環式エポキシ化合物;
三菱化学社製の商品名「jER604」、「jER630」、新日鉄住金化学社製の商品名「エポトートYH−434」、旭化成工業社製の商品名「アラルダイトMY720」、等のグリシジルアミン型エポキシ化合物;
ダイセル化学工業社製の商品名「セロキサイド2011」、旭化成工業社製の商品名「アラルダイトCY175」、「アラルダイトCY179」、新日本理化社製の商品名「HBE−100」等の脂環式エポキシ化合物等が挙げられるが、これらに限定されるものではない。これらエポキシ化合物は単独又は2種以上を組み合わせて使用することができる。
中でも接着力の点から、ビスフェノールA型エポキシ化合物またはビスフェノールF型エポキシ化合物であることが好ましい。
The compound (B2) having two or more epoxy groups may be a compound having two or more epoxy groups in one molecule. For example, as a commercial product, for example, trade name “Epicoat” manufactured by Mitsubishi Chemical Corporation 828 ”,“ Epicoat 834 ”,“ Epicoat 1001 ”,“ Epicoat 1004 ”, trade names“ Epicron 840 ”,“ Epicron 850 ”,“ Epicron 1050 ”,“ Epicron 2055 ”manufactured by Dainippon Ink and Chemicals, NS Bisphenol A type epoxy compounds such as “Epototo 128” manufactured by Kagaku Co .;
Product name “Epicron 830S” manufactured by Dainippon Ink & Chemicals, Inc. Product name “Epicoat 807” manufactured by Mitsubishi Chemical Co., Ltd. Product names “Epototo YDF-170”, “Epototo YDF-175”, “Epototo” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. Bisphenol F type epoxy compounds such as “YDF-2004”;
Bisphenol S type epoxy compounds such as Nippon Kayaku's trade name "EBPS-200", Asahi Denka Kogyo's trade name "EPX-30", Dainippon Ink and Chemicals' trade name "Epicron EXA1514";
Bisphenol fluorene type epoxy compounds such as “BPFG” manufactured by Osaka Gas Co., Ltd., “YL-6056”, “YL-6021”, “YX-4000”, “YX-4000H” manufactured by Mitsubishi Chemical Corporation, etc. Bixylenol type or biphenyl type epoxy compounds, or mixtures thereof;
Hydrogenated bisphenol A type epoxy compounds such as “Epototo ST-2004”, “ST-2007”, “ST-3000” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd .;
Product names “Epicoat 152” and “Epicoat 154” manufactured by Mitsubishi Chemical Corporation, product names “DEN 431” and “DEN 438” manufactured by Dow Chemical Company, Dainippon Ink and Chemicals, Inc. “Epicron N-690”, “Epicron N-695”, “Epicron N-730”, “Epicron N-770”, “Epicron N-865”, trade names “Epototo YDCN” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. -701 "," Epototo YDCN-704 ", trade names" EPPN-201 "," EOCN-1025 "," EOCN-1020 "," EOCN-104S "," RE-306 "manufactured by Nippon Kayaku Co., Ltd. Novolac epoxy compounds;
Trade names “Epicoat YL-903” manufactured by Mitsubishi Chemical Corporation, “Epicron 152” and “Epicron 165” manufactured by Dainippon Ink and Chemicals, Inc. “Epototo YDB-400” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. Brominated bisphenol A type epoxy compounds such as “Epototo YDB-500”;
Naphthalene skeletons such as trade names “ESN-190” and “ESN-360” manufactured by Nippon Steel Chemical Co., Ltd., trade names “HP-4032”, “EXA-4700” and “EXA-4750” manufactured by Dainippon Ink & Chemicals, Inc. An epoxy compound having:
Epoxy compounds having a dicyclopentadiene skeleton such as trade names “HP-7200” and “HP-7200H” manufactured by Dainippon Ink & Chemicals, Inc .;
Trishydroxyphenylmethane type epoxy compounds such as Mitsubishi Chemical's trade name “YL-933” and Nippon Kayaku's trade names “EPPN-501” and “EPPN-502”;
Heterocyclic epoxy compounds such as Nissan Chemical's trade name “TEPIC” and Mitsubishi Gas Chemical's trade name “TGI”;
Glycidylamine type epoxy compounds such as trade names “jER604” and “jER630” manufactured by Mitsubishi Chemical Corporation, “Epototo YH-434” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., and “Araldite MY720” manufactured by Asahi Kasei Corporation;
Alicyclic epoxy compounds such as “Celoxide 2011” manufactured by Daicel Chemical Industries, “Araldite CY175”, “Araldite CY179” manufactured by Asahi Kasei Kogyo, and “HBE-100” manufactured by Shin Nippon Chemical Co., Ltd. However, it is not limited to these. These epoxy compounds can be used alone or in combination of two or more.
Among these, bisphenol A type epoxy compounds or bisphenol F type epoxy compounds are preferable from the viewpoint of adhesive strength.

本発明で使用される不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応により得られるエポキシ化合物(B)のエポキシ当量は、ポットライフや接着強度、薬品耐性に優れるという理由から、200〜7000であることが好ましい。接着剤組成物のポットライフの長さと、接着剤層の適度な架橋密度による初期接着力の向上の点から、エポキシ当量は200以上であることが好ましい。またエポキシ当量が7000以下であることにより、接着剤層の架橋密度が大きくでき初期接着力を向上でき、薬品耐性も向上できる。   The epoxy equivalent of the epoxy compound (B) obtained by the reaction of the unsaturated fatty acid polymer (B1) and the compound (B2) having two or more epoxy groups used in the present invention is pot life, adhesive strength, It is preferably 200 to 7000 because it is excellent in chemical resistance. It is preferable that the epoxy equivalent is 200 or more from the viewpoint of improving the initial adhesive force due to the length of the pot life of the adhesive composition and the appropriate crosslinking density of the adhesive layer. Moreover, when the epoxy equivalent is 7000 or less, the crosslinking density of the adhesive layer can be increased, the initial adhesive force can be improved, and the chemical resistance can be improved.

本発明で使用される不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応により得られるエポキシ化合物(B)を製造するためのエステル化反応は、公知の反応で行うことができる。即ち、製造法には特に制限が無く、例えば、触媒を用いたカルボキシル基とエポキシ基の反応により合成される。触媒の存在下、50乃至200℃、好ましくは120乃至180℃の温度で30分乃至20時間両者を接触させることにより容易に行うことができるが、通常、反応生成物の酸価が5mgKOH/g、好ましくは1mgKOH/g以下になった時点を反応の終点とする。
触媒としては塩化亜鉛、塩化リチウムなどのハロゲン化物;
N,N−ジメチルアニリン、ピリジン、トリエチルアミン、ヘキサメチレンジアミン、ジアザビシクロウンデセンなどの3級アミン及びその塩基酸または臭酸塩;
テトラメチルアンモニウムクロライド、トリメチルドデシルベンジルアンモニウムクロライドなどの4級アンモニウム塩;
パラトルエンスルホン酸などのスルホン酸類などが用いられる。
The esterification reaction for producing the epoxy compound (B) obtained by the reaction of the unsaturated fatty acid polymer (B1) used in the present invention with the compound (B2) having two or more epoxy groups is known. The reaction can be performed. That is, the production method is not particularly limited, and for example, it is synthesized by a reaction between a carboxyl group and an epoxy group using a catalyst. In the presence of a catalyst, it can be easily carried out by contacting both at a temperature of 50 to 200 ° C., preferably 120 to 180 ° C. for 30 minutes to 20 hours, but usually the acid value of the reaction product is 5 mg KOH / g. The end point of the reaction is preferably the time when 1 mgKOH / g or less is reached.
Catalysts such as halides such as zinc chloride and lithium chloride;
Tertiary amines such as N, N-dimethylaniline, pyridine, triethylamine, hexamethylenediamine, diazabicycloundecene and their basic acids or odorates;
Quaternary ammonium salts such as tetramethylammonium chloride and trimethyldodecylbenzylammonium chloride;
Sulfonic acids such as paratoluenesulfonic acid are used.

不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応により得られるエポキシ化合物(B)は、市販品としても入手できる。例えば、三菱化学社製「エピコート871」、「エピコート872」、「エピコート872−X−75」、新日鉄住金化学社製「YD−172」、「YD−172X75」などが挙げられる。   The epoxy compound (B) obtained by the reaction of the unsaturated fatty acid polymer (B1) and the compound (B2) having two or more epoxy groups can also be obtained as a commercial product. Examples include “Epicoat 871”, “Epicoat 872”, “Epicoat 872-X-75” manufactured by Mitsubishi Chemical Corporation, “YD-172”, “YD-172X75” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.

本発明で使用されるポリオレフィン樹脂(A)は、接着性および溶解性に優れるという観点から、前記ポリオレフィン樹脂(A)1gあたりのカルボキシル基の含有量がX(mmol)、酸無水物基の含有量がY(mmol)とした場合に、X+2Yが0.05〜0.6であることが好ましい。
X+2Yが0.05未満であると、架橋点となる酸性基が少なく、架橋が十分でなく、十分な接着強度や電解質耐性が得られない場合がある。0.6より大きいと、塗膜の架橋収縮が大きいために接着強度が不十分であったり、溶剤への溶解性が低下したりする場合がある。
From the viewpoint that the polyolefin resin (A) used in the present invention is excellent in adhesiveness and solubility, the content of carboxyl groups per 1 g of the polyolefin resin (A) is X (mmol), the content of acid anhydride groups When the amount is Y (mmol), X + 2Y is preferably 0.05 to 0.6.
When X + 2Y is less than 0.05, there are few acidic groups that serve as crosslinking points, crosslinking is not sufficient, and sufficient adhesive strength and electrolyte resistance may not be obtained. If it is larger than 0.6, the crosslinking strength of the coating film is large, so that the adhesive strength may be insufficient, or the solubility in a solvent may be reduced.

接着剤組成物中に含まれるポリオレフィン樹脂(A)をP(g)、エポキシ化合物(B)由来のエポキシ基をZ(mmol)とした場合に、Z/(X+2Y)Pが0.3〜10となる範囲でエポキシ化合物(B)を含み、0.5〜7の範囲で含むことがより好ましい。
接着強度、電解質耐性の向上のために、十分な架橋構造が形成により凝集力を向上できるよう、Z/(X+2Y)Pが0.3以上であることが好ましい。電解質耐性の点から未反応のエポキシ化合物(B)が残らないよう、Z/(X+2Y)Pが10以下であることが好まししい。
When the polyolefin resin (A) contained in the adhesive composition is P (g) and the epoxy group derived from the epoxy compound (B) is Z (mmol), Z / (X + 2Y) P is 0.3 to 10 It is more preferable that the epoxy compound (B) is included within the range of 0.5 to 7 inclusive.
In order to improve adhesive strength and electrolyte resistance, it is preferable that Z / (X + 2Y) P is 0.3 or more so that cohesion can be improved by forming a sufficient cross-linked structure. From the viewpoint of electrolyte resistance, it is preferable that Z / (X + 2Y) P is 10 or less so that an unreacted epoxy compound (B) does not remain.

本発明の接着剤には、金属箔との接着強度を高めるために、さらに、シランカップリング剤を含有させることができる。シランカップリング剤としては、例えばビニルトリメトキシシラン、ビニルトリエトキシシラン等のビニル基を有するトリアルコキシシラン、3−アミノプロピルトリエトキシシラン、N−(2−アミノエチル)3−アミノプロピルトリメトキシシラン等のアミノ基を有するトリアルコキシシラン、3−グリシドキシプロピルトリメトキシシラン、2−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、3−グリシドキシプロピルトリエトキシシラン等のグリシジル基を有するトリアルコキシシラン等が挙げられる。シランカップリング剤の添加量は、接着剤の固形分を基準として0.1〜5質量%であることが好ましく、0.5〜3質量%であることがより好ましい。   In order to increase the adhesive strength with the metal foil, the adhesive of the present invention can further contain a silane coupling agent. Examples of silane coupling agents include trialkoxysilanes having a vinyl group such as vinyltrimethoxysilane and vinyltriethoxysilane, 3-aminopropyltriethoxysilane, and N- (2-aminoethyl) 3-aminopropyltrimethoxysilane. Having a glycidyl group such as trialkoxysilane having an amino group such as 3-glycidoxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane Examples include trialkoxysilane. The addition amount of the silane coupling agent is preferably 0.1 to 5% by mass, and more preferably 0.5 to 3% by mass based on the solid content of the adhesive.

本発明の接着剤は、金属箔との接着強度を高めるため、カテコールまたはその誘導体を含有することができる。具体的には、カテコール、t−ブチルカテコール、アドレナリン、ノルアドレナリン、ドーパミン、ノルジヒドログアヤレチック酸などが挙げられる。   The adhesive of the present invention can contain catechol or a derivative thereof in order to increase the adhesive strength with the metal foil. Specifically, catechol, t-butylcatechol, adrenaline, noradrenaline, dopamine, nordihydroguaiaretic acid and the like can be mentioned.

本発明の接着剤組成物は有機溶剤を含むことができる。単独もしくは混合溶剤として本接着剤組成物で使用する材料を溶解でき、不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応により得られるエポキシ化合物(B)との反応性が不活性であり、接着剤塗工時の乾燥工程における過熱により揮発させて除去できるものであれば特に限定されない。これらの溶剤の具体例としては、例えば、トルエン、キシレン等の芳香族系有機溶剤;
n−ヘキサン、n−ヘプタン等の脂肪族系有機溶剤;
シクロヘキサン、メチルシクロヘキサン等の脂環族系有機溶剤;
メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノンなどのケトン系溶剤;
酢酸エチル、酢酸ブチル等のエステル系溶剤;
エタノール、メタノール、n−プロパノール、2−プロパノール、ブタノール、ヘキサノール等のアルコール系溶剤;
ジイソプロピルエーテル、ブチルセロソルブ、テトラヒドロフラン、ジオキサン、ブチルカルビトール等のエーテル系溶剤;
ジエチレングリコールモノメチルエーテル、トリエチレングルコールモノメチルエーテル、プロピレングリコールモノメチルエーテル等のグリコールエーテル系溶剤;
エチレングリコールモノメチルエーテルアセテート、プロプレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノエチルエーテルアセテート等のグリコールエステル系溶剤等が挙げられ、これらは単独で使用しても良いし、2種以上を併用しても良い。
これらの中でも、ポリオレフィン樹脂(A)の溶液の保存安定性の点から、芳香族系有機溶剤とケトン系溶剤の併用、芳香族系有機溶剤とアルコール系溶剤の併用、脂環族系有機溶剤とケトン系溶剤の併用、脂環俗系有機溶剤とアルコール系溶剤の併用が好ましい。
The adhesive composition of the present invention can contain an organic solvent. An epoxy compound (B) which can dissolve a material used in the present adhesive composition alone or as a mixed solvent, and which is obtained by reacting an unsaturated fatty acid polymer (B1) with a compound (B2) having two or more epoxy groups. ) Is inactive, and is not particularly limited as long as it can be volatilized and removed by overheating in the drying step during adhesive coating. Specific examples of these solvents include aromatic organic solvents such as toluene and xylene;
aliphatic organic solvents such as n-hexane and n-heptane;
Cycloaliphatic organic solvents such as cyclohexane and methylcyclohexane;
Ketone solvents such as methyl ethyl ketone, methyl isobutyl ketone and cyclohexanone;
Ester solvents such as ethyl acetate and butyl acetate;
Alcohol solvents such as ethanol, methanol, n-propanol, 2-propanol, butanol, hexanol;
Ether solvents such as diisopropyl ether, butyl cellosolve, tetrahydrofuran, dioxane, butyl carbitol;
Glycol ether solvents such as diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether;
Examples include glycol ester solvents such as ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, and diethylene glycol monoethyl ether acetate. These may be used alone or in combination of two or more.
Among these, from the viewpoint of the storage stability of the solution of the polyolefin resin (A), a combination of an aromatic organic solvent and a ketone solvent, a combination of an aromatic organic solvent and an alcohol solvent, an alicyclic organic solvent, The combined use of ketone solvents and the combined use of alicyclic organic solvents and alcohol solvents are preferred.

本発明の接着剤組成物において、発明の効果を損なわない範囲で、必要に応じて、粘着付与剤、可塑剤等の公知の添加剤を配合しても良い。
本発明で使用できる粘着付与剤としては、ポリテルペン樹脂、ロジン系樹脂、脂肪族系石油樹脂、脂環族系石油樹脂、共重合系石油樹脂、スチレン樹脂および水添石油樹脂等が挙げられ、接着強度を向上させる目的で用いられる。これらは単独で用いても良いし、2種以上を任意に組み合わせて使用しても良い。
また、本発明で使用される可塑剤としては、ポリイソプレン、ポリブテン等の液状ゴムやプロセルオイル等が挙げられる。
In the adhesive composition of the present invention, known additives such as a tackifier and a plasticizer may be blended as necessary within a range not impairing the effects of the invention.
Examples of tackifiers that can be used in the present invention include polyterpene resins, rosin resins, aliphatic petroleum resins, alicyclic petroleum resins, copolymer petroleum resins, styrene resins, and hydrogenated petroleum resins. Used for the purpose of improving strength. These may be used alone or in any combination of two or more.
Examples of the plasticizer used in the present invention include liquid rubbers such as polyisoprene and polybutene, and process oil.

本発明の接着剤組成物は、金属箔層(12)とヒートシール層(14)との積層に好適に使用される。
金属箔層(12)の金属としては、アルミニウム、銅、ニッケル等が挙げられる。これらの金属箔は、各種表面処理を施したものであっても良い。表面処理の例としては、例えば、サンドブラスト処理、研磨処理などの物理的処理や蒸着による脱脂処理、エッチング処理、カップリング剤やコーティング剤を塗布するプライマー処理などの表面処理がある。
表面処理層を形成するための処理剤は、エポキシ基と反応する官能基を含むことが好ましく、より好ましくはカルボン酸、水酸基およびアミノ基からなる群より選ばれる少なくとも1種の官能基の含むことが好ましい。ここでいうアミノ基とは1級アミンと2級アミン、およびイミノ基のことである。このような官能基を含む表面処理層を金属箔層(12)表面に設けることにより、接着剤組成物を熱硬化する際、接着剤層中のエポキシ基と、表面処理層中の前記官能基とが反応することにより、初期接着強度が大きく、電解質耐性に優れた積層体を得ることができる。
The adhesive composition of the present invention is suitably used for laminating the metal foil layer (12) and the heat seal layer (14).
Examples of the metal of the metal foil layer (12) include aluminum, copper, and nickel. These metal foils may be subjected to various surface treatments. Examples of the surface treatment include physical treatment such as sand blast treatment and polishing treatment, degreasing treatment by vapor deposition, etching treatment, and surface treatment such as primer treatment for applying a coupling agent or a coating agent.
The treatment agent for forming the surface treatment layer preferably contains a functional group that reacts with an epoxy group, and more preferably contains at least one functional group selected from the group consisting of carboxylic acid, hydroxyl group and amino group. Is preferred. The amino group here means a primary amine, a secondary amine, and an imino group. By providing a surface treatment layer containing such a functional group on the surface of the metal foil layer (12), the epoxy group in the adhesive layer and the functional group in the surface treatment layer when the adhesive composition is thermally cured. , A laminate having high initial adhesive strength and excellent electrolyte resistance can be obtained.

ヒートシール層(14)は特に限定されるものではないが、ポリオレフィン系フィルムであることが好ましく、ポリエチレン、ポリプロピレン、オレフィン系共重合体、これらの酸変成物およびアイオノマーからなる群より選ばれた少なくとも1種類の熱可塑性樹脂からなる未延伸フィルムであることが好ましい。ヒートシール層の厚さは特に限定されるものではないが、20〜150μmであることが好ましい。   The heat seal layer (14) is not particularly limited, but is preferably a polyolefin film, and at least selected from the group consisting of polyethylene, polypropylene, olefin copolymers, acid modified products thereof, and ionomers. An unstretched film made of one kind of thermoplastic resin is preferable. Although the thickness of a heat seal layer is not specifically limited, It is preferable that it is 20-150 micrometers.

本発明の接着剤組成物を用いてなる積層体は、例えば、以下のようにして得ることができる。
金属箔層(12)(又はヒートシール層(14))の一方の面に、本発明の接着剤組成物を塗工し、溶剤を揮散させ(乾燥させ)、未硬化の接着剤層を形成し、60〜150℃、加圧下に前記未硬化の接着剤層の表面に、ヒートシール層(又は金属箔)を重ねた後、40〜80℃で3〜10日程度静置し、接着剤層を十分硬化させ(エージングとも称する)、金属箔とヒートシール層とを貼り合わせることで、積層体を得ることができる。
接着剤組成物の塗工には、コンマコーター等の一般的な塗工機を用いることができる。また、乾燥硬化時の硬化接着剤層の厚み(量)は、0.5〜10g/m2程度であることが好ましい。
A laminate using the adhesive composition of the present invention can be obtained, for example, as follows.
On one side of the metal foil layer (12) (or heat seal layer (14)), the adhesive composition of the present invention is applied, and the solvent is stripped (dried) to form an uncured adhesive layer. Then, after the heat seal layer (or metal foil) is stacked on the surface of the uncured adhesive layer under pressure at 60 to 150 ° C., it is allowed to stand at 40 to 80 ° C. for about 3 to 10 days. A layered product can be obtained by sufficiently curing the layer (also referred to as aging) and bonding the metal foil and the heat seal layer together.
For coating of the adhesive composition, a general coating machine such as a comma coater can be used. The thickness (amount) of the cured adhesive layer at the time of dry curing is preferably about 0.5 to 10 g / m 2 .

本発明の蓄電デバイス用包装材は、金属箔層(12)の他方の面(本発明の接着剤組成物から形成される接着剤層(13)が接していない面)に、外層側接着剤層を介して樹脂フィルム層(11)を具備することができる。
樹脂フィルム層(11)は、予め接着剤組成物(本発明の接着剤組成物と同じであってもよいし、異なっていてもよい)を用いて、金属箔層(12)に積層されていてもよいし、本発明の接着剤組成物を用いて金属箔層(12)とヒートシール層(14)との積層体を得た後、金属箔層(12)に外層側接着剤層を介して樹脂フィルム層(11)を積層することもできる。
用いられる樹脂フィルム層(11)としては、ポリエステル樹脂やポリアミド樹脂(ナイロン)等の延伸フィルム等が挙げられ、樹脂フィルム層(11)は、積層体を蓄電デバイス用包装材として用い、蓄電デバイス用容器を形成する際、電解質液とは接触しない外側に位置するとなる。
The packaging material for an electricity storage device of the present invention is the outer layer side adhesive on the other surface of the metal foil layer (12) (the surface where the adhesive layer (13) formed from the adhesive composition of the present invention is not in contact). A resin film layer (11) can be provided through the layer.
The resin film layer (11) is previously laminated on the metal foil layer (12) using an adhesive composition (which may be the same as or different from the adhesive composition of the present invention). Or after obtaining the laminated body of a metal foil layer (12) and a heat seal layer (14) using the adhesive composition of this invention, an outer layer side adhesive bond layer is attached to a metal foil layer (12). The resin film layer (11) can also be laminated.
Examples of the resin film layer (11) used include stretched films such as a polyester resin and a polyamide resin (nylon), and the resin film layer (11) uses a laminate as a packaging material for an electricity storage device and is used for an electricity storage device. When forming the container, the container is located outside the electrolyte solution.

本発明の蓄電デバイス用容器は、前述の蓄電デバイス用包装材を用い、外層側樹脂フィルム層(11)が凸面を構成し、ヒートシール層(14)が凹面を構成するように成型して得ることができる。
なお、本発明でいう「凹面」とは、平たい状態の蓄電デバイス用包装材を成型加工して図2に示すようなトレイ状とした場合に、電解質液を内部に収容し得る窪みを有する面という意であり、本発明でいう「凸面」とは、前記窪みを有する面の自背面(反対側の面、裏側の面)の意である。
The container for an electricity storage device of the present invention is obtained by using the above-described packaging material for an electricity storage device and molding the outer layer side resin film layer (11) to form a convex surface and the heat seal layer (14) to form a concave surface. be able to.
The “concave surface” as used in the present invention is a surface having a dent that can accommodate an electrolyte solution when the flat packaging material for an electricity storage device is molded into a tray shape as shown in FIG. The term “convex surface” as used in the present invention refers to the self-back surface (opposite surface, back surface) of the surface having the depression.

二次電池等の蓄電デバイスは、電池本体と、前記電池本体の正極と負極にそれぞれ接合されてなる複数の端子と、電池容器と、電解質液とを具備する。前記電池容器は、本発明の接着剤組成物から形成される接着剤層(13)を介して、金属箔層(12)とヒートシール層(14)とが積層されてなる積層体から得られるものであり、前記ヒートシール層が前記電解質液に接する。   An electricity storage device such as a secondary battery includes a battery body, a plurality of terminals respectively joined to a positive electrode and a negative electrode of the battery body, a battery container, and an electrolyte solution. The battery container is obtained from a laminate in which a metal foil layer (12) and a heat seal layer (14) are laminated via an adhesive layer (13) formed from the adhesive composition of the present invention. The heat seal layer is in contact with the electrolyte solution.

電解質溶液は、ヒートシール層(14)から金属箔層(12)に向かって浸透し始めるが、本発明の接着剤組成物から形成された接着剤層(13)は、電解質溶液に対する耐性に優れているので、ヒートシール層と金属箔との間の接着強度は低下せず、液漏れ等の問題が発生しない。   The electrolyte solution starts to penetrate from the heat seal layer (14) toward the metal foil layer (12), but the adhesive layer (13) formed from the adhesive composition of the present invention has excellent resistance to the electrolyte solution. Therefore, the adhesive strength between the heat seal layer and the metal foil does not decrease, and problems such as liquid leakage do not occur.

以下、実施例により、本発明をさらに詳細に説明するが、以下の実施例は本発明の権利範囲を何ら制限するものではない。なお、実施例中における各評価は下記の方法に従った。なお、実施例中、%は質量%を、部は質量部を示す。
<カルボキシル基の定量>
秤量した試料a(g)を還流させたキシレン中に溶解させ、室温まで冷却後、フェノールフタレインを指示薬とし、0.1Mのエタノール性水酸化カリウムを用いて滴定することにより定量を行った。指示薬の呈色が10秒間残留した時を滴定の終点とした。滴定量をb(ml)とすると、以下の式からXを求めることができる。
X=0.1*b/a
<酸無水物基の定量>
秤量した試料c(g)を還流させたキシレン中に溶解させ、室温まで冷却後、試料の酸無水物基の当量以上のオクチルアミンd(mmol)を添加した。残存するオクチルアミンを、0.1Mエタノール性過塩素酸を用いて滴定することにより定量を行った。滴定量をe(ml)とすると、以下の式からYを求めることができる。
Y=(0.1*e−d)/c
EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, a following example does not restrict | limit the right range of this invention at all. In addition, each evaluation in an Example followed the following method. In the examples,% represents mass%, and part represents mass part.
<Quantification of carboxyl group>
The weighed sample a (g) was dissolved in refluxed xylene, cooled to room temperature, and then titrated with 0.1M ethanolic potassium hydroxide using phenolphthalein as an indicator. The end point of the titration was when the color of the indicator remained for 10 seconds. If the titer is b (ml), X can be obtained from the following equation.
X = 0.1 * b / a
<Quantification of acid anhydride group>
The weighed sample c (g) was dissolved in refluxed xylene, cooled to room temperature, and then octylamine d (mmol) equal to or greater than the acid anhydride group of the sample was added. The remaining octylamine was quantified by titrating with 0.1M ethanolic perchloric acid. If the titration amount is e (ml), Y can be obtained from the following equation.
Y = (0.1 * ed) / c

<質量平均分子量>
TSKgel superHZM−Nのカラムを2本接続した東ソー株式会社製HLC−8220GPCシステムにより、溶離液にテトラヒドロフラン、カラム温度を40℃とし、流量毎分0.35mlの条件にて測定した。サンプルは、2mgのポリオレフィン樹脂(A)を、5mlのテトラヒドロフランに溶解して調整した。また、質量平均分子量は標準ポリスチレン換算で算出した。
<Mass average molecular weight>
Using an HLC-8220GPC system manufactured by Tosoh Corporation with two TSKgel superHZM-N columns connected, the eluent was tetrahydrofuran, the column temperature was 40 ° C., and the flow rate was 0.35 ml per minute. A sample was prepared by dissolving 2 mg of polyolefin resin (A) in 5 ml of tetrahydrofuran. The mass average molecular weight was calculated in terms of standard polystyrene.

<融点、融解温度エネルギー(ΔE)>
融点、ΔEは、JIS K7121に準じてDSC測定により求めることができる。具体的には以
下のようにして求める。
約10mgのポリオレフィン樹脂(A)の直径または各辺が0.5mm以下の場合はそのまま使用し、0.5mmを超えるものは0.5mm以下に切断して容器に入れる。
毎分10℃で融点より約30℃高い温度まで加熱し、その後毎分10℃でTgより約50℃低い温度まで冷却する。明確なTgが観測されない場合は、融点より約50℃低い温度まで冷却する。その後、毎分10℃で融点より約30℃高い温度まで加熱した際に表れる融解に対応するピークのピークトップより求めた。また、ΔEは、融解に対応するピークが、ベースラインから離れてから再度ベー
スラインに戻るまでの部分の面積より求めた。
ポリオレフィン樹脂(A)を2種以上併用した場合は、融点は高温側のピークのピークトップより求め、ΔEは融解により得られる全てのピーク面積の合計から算出した。
<Melting point, melting temperature energy (ΔE)>
The melting point and ΔE can be determined by DSC measurement according to JIS K7121. Specifically, it is obtained as follows.
When the diameter or each side of the polyolefin resin (A) of about 10 mg is 0.5 mm or less, it is used as it is, and if it exceeds 0.5 mm, it is cut into 0.5 mm or less and put into a container.
Heat to about 30 ° C above the melting point at 10 ° C per minute and then cool to about 50 ° C below Tg at 10 ° C per minute. If no clear Tg is observed, cool to about 50 ° C. below the melting point. Then, it calculated | required from the peak top of the peak corresponding to the melting which appears when it heated to about 30 degreeC higher than melting | fusing point at 10 degreeC per minute. Further, ΔE was obtained from the area of the part from the time when the peak corresponding to melting was separated from the baseline until it returned to the baseline again.
When two or more polyolefin resins (A) were used in combination, the melting point was determined from the peak top of the peak on the high temperature side, and ΔE was calculated from the sum of all peak areas obtained by melting.

<共重合組成比>
ポリオレフィンの共重合組成比は、日本電子株式会社製NMR(JNM−LA400)を用いて、13Cの測定により求めた。
サンプル20mgを1mlの重クロロホルムに溶解して測定した。エチレン由来のメチレン基は40−50ppmに、プロピレン由来のメチン基は25−30ppmに、1−ブテン由来のメチン基は30−35ppmに含まれる。各ピークの積分比から共重合組成比を求めた。
<Copolymerization composition ratio>
The copolymer composition ratio of polyolefin was determined by 13 C measurement using NMR (JNM-LA400) manufactured by JEOL Ltd.
A 20 mg sample was dissolved in 1 ml deuterated chloroform and measured. The methylene group derived from ethylene is contained in 40-50 ppm, the methine group derived from propylene is contained in 25-30 ppm, and the methine group derived from 1-butene is contained in 30-35 ppm. The copolymer composition ratio was determined from the integration ratio of each peak.

<合成例1>
窒素置換した内容積500mLのガラス製オートクレーブに精製トルエン250mL、メチルアルミノキサンをAl原子換算で0.5mg、ジメチルシリル−ビス−(4,5,6,7,8−ペンタヒドロアズレン−2−イル)ジルコニウムジクロライドをZr原子換算で1.25μg原子を投入し、40℃に昇温した。続いてエチレンとプロピレンを、それぞれ50L/hr、40L/hrの一定速度で供給しながら、40℃で1.32MPaの一定圧力を維持するように1−ブテンモノマーを連続供給し、重合を開始した。40℃、8時間、重合を行った後、イソプロパノールを添加して重合を停止した。得られたポリマー溶液を、多量のメタノールに添加し、ポリマーを析出させた。析出したポリマーをろ過、乾燥することにより、エチレン/プロピレン/1−ブテン=46/33/15(モル比)で共重合されたポリオレフィンを得た。
得られたポリオレフィン20gと、セロソルブアセテート20gとを仕込み、窒素気流下、加熱溶解させ、溶液温度の110℃にした。無水マレイン酸4g、ラウリルメタクリレート2gおよび過酸化ベンゾイル0.6gをセロソルブアセテート239.4gに溶解したものを2時間かけて滴下した。滴下終了後さらに1時間その温度で反応を続けた。得られたポリマー溶液を、多量のメタノールに添加し、ポリマーを析出させた。析出したポリマーをろ過、乾燥することにより、酸無水物基を有するポリオレフィン樹脂(A1)を得た。
ポリオレフィン樹脂(A−1)のMw、融点、ΔEは、それぞれ4700、103℃、45mJ/
mgであった。
<Synthesis Example 1>
Purified toluene 250mL, methylaluminoxane 0.5mg in terms of Al atom, dimethylsilyl-bis- (4,5,6,7,8-pentahydroazulen-2-yl) in a 500mL glass autoclave purged with nitrogen Zirconium dichloride was charged with 1.25 μg atoms in terms of Zr atoms and heated to 40 ° C. Subsequently, while supplying ethylene and propylene at a constant rate of 50 L / hr and 40 L / hr, respectively, 1-butene monomer was continuously supplied to maintain a constant pressure of 1.32 MPa at 40 ° C., and polymerization was started. . After polymerization at 40 ° C. for 8 hours, isopropanol was added to terminate the polymerization. The obtained polymer solution was added to a large amount of methanol to precipitate a polymer. The precipitated polymer was filtered and dried to obtain a polyolefin copolymerized with ethylene / propylene / 1-butene = 46/33/15 (molar ratio).
20 g of the obtained polyolefin and 20 g of cellosolve acetate were charged and dissolved by heating in a nitrogen stream to a solution temperature of 110 ° C. A solution prepared by dissolving 4 g of maleic anhydride, 2 g of lauryl methacrylate and 0.6 g of benzoyl peroxide in 239.4 g of cellosolve acetate was added dropwise over 2 hours. The reaction was continued at that temperature for an additional hour after the addition. The obtained polymer solution was added to a large amount of methanol to precipitate a polymer. The precipitated polymer was filtered and dried to obtain a polyolefin resin (A1) having an acid anhydride group.
The Mw, melting point, and ΔE of the polyolefin resin (A-1) are 4700, 103 ° C., 45 mJ /
mg.

<合成例2〜4、6〜12>
表1に示すオレフィン重合時の混合ガスの流量比と重合温度、グラフト重合時のモノマー添加量以外は、合成例1と同様にして酸無水物基を有するポリオレフィン樹脂(A−2)〜(A−4)、(A−6)〜(A−8)を得た。
<Synthesis Examples 2-4, 6-12>
Polyolefin resins having acid anhydride groups (A-2) to (A) in the same manner as in Synthesis Example 1, except for the flow rate ratio and the polymerization temperature of the mixed gas at the time of olefin polymerization shown in Table 1, and the monomer addition amount at the time of graft polymerization -4) and (A-6) to (A-8) were obtained.

<合成例5>
表1に示す混合ガスの流量比、グラフト重合時のモノマー添加量以外は、合成例1と同様にして酸無水物基を有するポリオレフィン樹脂を得た。得られたポリオレフィン樹脂を、85℃、85%RHの環境下に3日間保存することにより、カルボキシル基を有するポリオレフィン樹脂(A−5)を得た。
<Synthesis Example 5>
A polyolefin resin having an acid anhydride group was obtained in the same manner as in Synthesis Example 1 except for the flow rate ratio of the mixed gas shown in Table 1 and the monomer addition amount during graft polymerization. The polyolefin resin obtained was stored in an environment of 85 ° C. and 85% RH for 3 days to obtain a polyolefin resin (A-5) having a carboxyl group.

<合成例9>
プロピレン−エチレン共重合体(プロピレン/エチレン=82/18質量%、質量平均分子量85000)280gを4つ口フラスコ中、窒素雰囲気下で加熱溶融させた後、系内温度を180℃に保って攪拌下、酸成分として無水マレイン酸35.0g、ラジカル発生剤としてジ−t−ブチルパーオキサイド6.0gをそれぞれ2時間かけて加え、その後1時間反応させた。反応終了後、得られた反応物を多量のアセトン中に投入し、樹脂を析出させた。この樹脂をさらにアセトンで数回洗浄し、未反応の無水マレイン酸を除去した後、減圧乾燥機中で減圧乾燥して酸変性ポリプロピレン樹脂(質量平均分子量40000)を得た。
ヒーター付きの密閉できる耐圧1リットル容ガラス容器を備えた撹拌機を用いて、60.0gの前記酸変性ポリプロピレン系樹脂、60.0gのテトラヒドロフラン、6.9gのN,N−ジメチルエタノールアミン(酸変性ポリプロピレン樹脂中の酸成分のカルボキシル基に対して1.0倍当量)及び173.1gの蒸留水をガラス容器内に仕込み、撹拌翼の回転速度を300rpmとして撹拌したところ、容器底部には樹脂粒状物の沈澱は認められず、浮遊状態となっていることが確認された。そこでこの状態を保ちつつ、10分後にヒーターの電源を入れ加熱した。そして系内温度を140℃に保ってさらに60分間撹拌した後、ヒーターの電源を切り60℃まで自然冷却した。冷却後60℃に保持し、撹拌及び減圧下で脱溶剤を行い、必要に応じて水を添加し、媒体を水に置換することによりポリオレフィン樹脂(A−9)の水分散体を得た。
<Synthesis Example 9>
280 g of propylene-ethylene copolymer (propylene / ethylene = 82/18% by mass, mass average molecular weight 85000) was heated and melted in a four-necked flask in a nitrogen atmosphere, and then the system temperature was maintained at 180 ° C. and stirred. Then, 35.0 g of maleic anhydride as an acid component and 6.0 g of di-t-butyl peroxide as a radical generator were added over 2 hours, respectively, and then reacted for 1 hour. After completion of the reaction, the obtained reaction product was put into a large amount of acetone to precipitate a resin. This resin was further washed several times with acetone to remove unreacted maleic anhydride, and then dried under reduced pressure in a vacuum dryer to obtain an acid-modified polypropylene resin (mass average molecular weight 40000).
Using a stirrer equipped with a heat-resistant 1 liter glass container with a heater, 60.0 g of the acid-modified polypropylene resin, 60.0 g of tetrahydrofuran, 6.9 g of N, N-dimethylethanolamine (acid When 1.03.1 equivalent to the carboxyl group of the acid component in the modified polypropylene resin) and 173.1 g of distilled water were charged into a glass container and stirred at a rotation speed of 300 rpm, the resin was placed at the bottom of the container. Precipitation of particulate matter was not recognized, and it was confirmed that it was in a floating state. Therefore, while maintaining this state, the heater was turned on and heated after 10 minutes. The system temperature was maintained at 140 ° C. and stirring was continued for 60 minutes, and then the heater was turned off and naturally cooled to 60 ° C. After cooling, the temperature was maintained at 60 ° C., the solvent was removed under stirring and reduced pressure, water was added as necessary, and the medium was replaced with water to obtain an aqueous dispersion of polyolefin resin (A-9).

表1中、記号は以下の通り。
LMA:ラウリルメタクリレート
St:スチレン
In Table 1, the symbols are as follows.
LMA: Lauryl methacrylate St: Styrene

<合成例10>
クローダジャパン社製プリポール1013(C18不飽和脂肪酸のダイマー酸、酸価196mgKOH/g)46g、jER1001(三菱化学株式会社製、ビスフェノールA型エポキシ化合物、エポキシ当量:475)154部、トリフェニルホスフィン4部、トルエン160部およびイソプロピルアルコール40部を4つ口フラスコ中、窒素雰囲気下で加熱溶解させた後、攪拌しながら系内温度を100℃に保った。酸価が1.0mgKOH/g以下となるまで反応させ、冷却させることにより固形分50%、エポキシ当量1236のエポキシ化合物(B−1)を得た。
<Synthesis Example 10>
46 g of POLPOL 1013 (C18 unsaturated fatty acid dimer acid, acid value 196 mg KOH / g), jER1001 (Mitsubishi Chemical Corporation, bisphenol A type epoxy compound, epoxy equivalent: 475), 154 parts, triphenylphosphine 4 parts Then, 160 parts of toluene and 40 parts of isopropyl alcohol were heated and dissolved in a four-necked flask under a nitrogen atmosphere, and the system temperature was kept at 100 ° C. with stirring. It was made to react until an acid value became 1.0 mgKOH / g or less, and the epoxy compound (B-1) of solid content 50% and epoxy equivalent 1236 was obtained by making it cool.

<合成例11>
クローダジャパン社製プリポール1010(C18不飽和脂肪酸のダイマー酸の水添物、酸価195mgKOH/g)14g、jER1007(三菱化学社製、ビスフェノールA型エポキシ化合物、エポキシ当量1975g/eq)186部、トリフェニルホスフィン4部、トルエン160部およびイソプロピルアルコール40部を4つ口フラスコ中、窒素雰囲気下で加熱溶解させた後、攪拌しながら系内温度を100℃に保った。酸価が1.0mgKOH/g以下となるまで反応させ、冷却させることにより固形分50%、エポキシ当量4238のエポキシ化合物(B−2)を得た。
<Synthesis Example 11>
14 g of Pripol 1010 manufactured by Croda Japan (hydrogenated product of dimer acid of C18 unsaturated fatty acid, acid value 195 mgKOH / g), jER1007 (Mitsubishi Chemical Corporation, bisphenol A type epoxy compound, epoxy equivalent 1975 g / eq) 186 parts, tri After 4 parts of phenylphosphine, 160 parts of toluene and 40 parts of isopropyl alcohol were dissolved in a four-necked flask under heating in a nitrogen atmosphere, the system temperature was maintained at 100 ° C. with stirring. It was made to react until an acid value became 1.0 mgKOH / g or less, and it was made to cool, and the epoxy compound (B-2) of 50% of solid content and the epoxy equivalent 4238 was obtained.

<合成例12>
クローダジャパン社製プリポール1010(C18不飽和脂肪酸のダイマー酸の水添物、酸価195mgKOH/g)7g、jER1010(三菱化学社製、ビスフェノールA型エポキシ化合物、エポキシ当量4000g/eq)193部、トリフェニルホスフィン4部、トルエン160部およびイソプロピルアルコール40部を4つ口フラスコ中、窒素雰囲気下で加熱溶解させた後、攪拌しながら系内温度を100℃に保った。酸価が1.0mgKOH/g以下となるまで反応させ、冷却させることにより固形分50%、エポキシ当量8288のエポキシ化合物(B−3)を得た。
<Synthesis Example 12>
7 g of Pripol 1010 manufactured by Croda Japan (hydrogenated product of dimer acid of C18 unsaturated fatty acid, acid value 195 mgKOH / g), 193 parts of jER1010 (Mitsubishi Chemical Corporation, bisphenol A type epoxy compound, epoxy equivalent 4000 g / eq), tri After 4 parts of phenylphosphine, 160 parts of toluene and 40 parts of isopropyl alcohol were dissolved in a four-necked flask under heating in a nitrogen atmosphere, the system temperature was maintained at 100 ° C. with stirring. It was made to react until an acid value became 1.0 mgKOH / g or less, and it was made to cool, and the epoxy compound (B-3) of 50% of solid content and the epoxy equivalent of 8288 was obtained.

<合成例13>
クローダジャパン社製プリポール1004(C22不飽和脂肪酸のダイマー酸の水添物、酸価162mgKOH/g)109g、jER630(三菱化学社製、グリシジルアミン型エポキシ化合物、エポキシ当量96g/eq)91部、トリフェニルホスフィン4部、トルエン160部およびイソプロピルアルコール40部を4つ口フラスコ中、窒素雰囲気下で加熱溶解させた後、攪拌しながら系内温度を100℃に保った。酸価が1.0mgKOH/g以下となるまで反応させ、冷却させることにより固形分50%、エポキシ当量317のエポキシ化合物(B−4)を得た。
<Synthesis Example 13>
109 parts of Tripol 1004 (dimer acid hydrogenated C22 unsaturated fatty acid, acid value 162 mgKOH / g), jER630 (Mitsubishi Chemical Co., Ltd., glycidylamine type epoxy compound, epoxy equivalent 96 g / eq) 91 parts, Trida After 4 parts of phenylphosphine, 160 parts of toluene and 40 parts of isopropyl alcohol were dissolved in a four-necked flask under heating in a nitrogen atmosphere, the system temperature was maintained at 100 ° C. with stirring. It was made to react until an acid value became 1.0 mgKOH / g or less, and it was made to cool, and the epoxy compound (B-4) of 50% of solid content and the epoxy equivalent 317 was obtained.

<合成例14>
クローダジャパン社製プリポール1040(C18不飽和脂肪酸のトリマー酸、酸価189mgKOH/g)22g、jER4005P(三菱化学社製、ビスフェノールF型エポキシ化合物、エポキシ当量1175g/eq)178部、トリフェニルホスフィン4部、トルエン160部およびイソプロピルアルコール40部を4つ口フラスコ中、窒素雰囲気下で加熱溶解させた後、攪拌しながら系内温度を100℃に保った。酸価が1.0mgKOH/g以下となるまで反応させ、冷却させることにより固形分50%、エポキシ当量3822のエポキシ化合物(B−5)を得た。
<Synthesis Example 14>
Cropol Japan Co., Ltd. Pripol 1040 (C18 unsaturated fatty acid trimer acid, acid value 189 mg KOH / g) 22 g, jER4005P (Mitsubishi Chemical Corporation, bisphenol F type epoxy compound, epoxy equivalent 1175 g / eq) 178 parts, triphenylphosphine 4 parts Then, 160 parts of toluene and 40 parts of isopropyl alcohol were heated and dissolved in a four-necked flask under a nitrogen atmosphere, and the system temperature was kept at 100 ° C. with stirring. It was made to react until an acid value became 1.0 mgKOH / g or less, and it was made to cool, and the epoxy compound (B-5) of 50% of solid content and the epoxy equivalent 3822 was obtained.

<合成例15>
ラウリン酸(酸価200mgKOH/g)87g、三菱ガス化学社製TETRAD−C(エポキシ当量91g/eq)113部、トリフェニルホスフィン4部、トルエン160部およびイソプロピルアルコール40部を4つ口フラスコ中、窒素雰囲気下で加熱溶解させた後、攪拌しながら系内温度を100℃に保った。酸価が1.0mgKOH/g以下となるまで反応させ、冷却させることにより固形分50%、エポキシ当量645のエポキシ化合物(B−5)を得た。
<Synthesis Example 15>
In a four-necked flask, 87 g of lauric acid (acid value 200 mg KOH / g), 113 parts of Mitsubishi Gas Chemical Co., Ltd. TETRAD-C (epoxy equivalent 91 g / eq), 4 parts of triphenylphosphine, 160 parts of toluene and 40 parts of isopropyl alcohol After heating and dissolving in a nitrogen atmosphere, the system temperature was kept at 100 ° C. with stirring. It was made to react until an acid value became 1.0 mgKOH / g or less, and it was made to cool, and the epoxy compound (B-5) of 50% of solid content and the epoxy equivalent 645 was obtained.

<添加剤の合成例>
攪拌機、温度計、還流冷却器および窒素ガス導入管を備えた反応容器にjER1001(三菱化学株式会社製、ビスフェノールA型エポキシ化合物、エポキシ当量:475)545.5部と、ジエチレングリコールジメチルエーテル259.0部とを仕込んで、加熱溶解させながら、80℃まで昇温した。溶解後、80℃にてアクリル酸59.7部を仕込み、続いてジブチルヒドロキシトルエン0.6部、トリフェニルホスフィン2.4部を仕込み、110℃まで1時間かけて昇温しながら撹拝した。110℃で3時間保持して反応を続行せしめて、酸価が1.0mgKOH/g以下となった所で、80℃にまで下げて、85%リン酸12.1部およびジエチレングリコールジメチルエーテル70.2部からなる混合物を、1時間かけて連続滴下した。滴下終了後も引き続いて、80℃で4時間反応させ、次いで、ジエチレングリコールジメチルエーテル50.5部仕込むことにより、不揮発分が64.0%で、かつ、酸価が9.0なる、リン酸変性エポキシ化合物(C−1)の溶液を得た。
<Synthesis example of additive>
In a reaction vessel equipped with a stirrer, a thermometer, a reflux condenser and a nitrogen gas introduction tube, 545.5 parts of jER1001 (Mitsubishi Chemical Corporation, bisphenol A type epoxy compound, epoxy equivalent: 475) and 259.0 parts of diethylene glycol dimethyl ether Was heated up to 80 ° C. while being heated and dissolved. After dissolution, 59.7 parts of acrylic acid was charged at 80 ° C., followed by 0.6 parts of dibutylhydroxytoluene and 2.4 parts of triphenylphosphine, and stirred while raising the temperature to 110 ° C. over 1 hour. . The reaction was continued by maintaining at 110 ° C. for 3 hours. When the acid value became 1.0 mgKOH / g or less, the temperature was lowered to 80 ° C., and 12.1 parts of 85% phosphoric acid and 70.2% diethylene glycol dimethyl ether were used. The mixture consisting of parts was continuously added dropwise over 1 hour. The phosphoric acid-modified epoxy having a non-volatile content of 64.0% and an acid value of 9.0 by continuously reacting at 80 ° C. for 4 hours after completion of the dropping and then charging 50.5 parts of diethylene glycol dimethyl ether. A solution of compound (C-1) was obtained.

<実施例1>
ポリオレフィン樹脂(A1)15部をトルエン/メチルエチルケトン(以下、MEKという)=7/3(重量比)117.9部に加熱溶解した。冷却後、jER871(三菱化学社製、エポキシ当量430のダイマー酸変性エポキシ化合物)を5.8部添加して攪拌することで、固形分15%の接着剤溶液を得た。
40μmのアルミニウム箔に、前記接着剤溶液をバーコーターにて塗布し、100℃、1分間乾燥し、乾燥後の塗布量が約2g/m2の接着剤層を得た。次いで、前記接着剤層に厚み40μmの未延伸ポリプロピレンフィルム(以下CPPと呼ぶ)を重ね合わせ、80℃に設定した2つのロール間を通過させ、積層体を得た。その後、得られた積層体を40℃で3日間または5日間の硬化(エージング)を行った。こうして、得られたアルミニウム箔/CPPラミネートフィルムを、以下「Al/CPP積層フィルム」と呼ぶ。
後述する方法に従って、初期接着強度、耐溶剤性、電解質耐性を評価した。結果を表2に示す。
<Example 1>
15 parts of polyolefin resin (A1) was heated and dissolved in 117.9 parts of toluene / methyl ethyl ketone (hereinafter referred to as MEK) = 7/3 (weight ratio). After cooling, 5.8 parts of jER871 (manufactured by Mitsubishi Chemical Corporation, dimer acid-modified epoxy compound having an epoxy equivalent of 430) was added and stirred to obtain an adhesive solution having a solid content of 15%.
The adhesive solution was applied to a 40 μm aluminum foil with a bar coater and dried at 100 ° C. for 1 minute to obtain an adhesive layer having a coating amount of about 2 g / m 2 after drying. Next, an unstretched polypropylene film (hereinafter referred to as CPP) having a thickness of 40 μm was superposed on the adhesive layer and passed between two rolls set at 80 ° C. to obtain a laminate. Thereafter, the obtained laminate was cured (aging) at 40 ° C. for 3 days or 5 days. The aluminum foil / CPP laminate film thus obtained is hereinafter referred to as “Al / CPP laminate film”.
The initial adhesive strength, solvent resistance, and electrolyte resistance were evaluated according to the methods described below. The results are shown in Table 2.

<実施例2〜22>、<比較例1〜6>
表2、3に示す組成にて、実施例1と同様にして接着剤溶液およびAl/CPP積層フィルムを得、同様に評価した。
<Examples 2 to 22>, <Comparative Examples 1 to 6>
With the compositions shown in Tables 2 and 3, an adhesive solution and an Al / CPP laminated film were obtained in the same manner as in Example 1 and evaluated in the same manner.

表2、3中の記号は以下の通り。
P−401:「ユニストールP−401」、三井化学株式会社製、酸変性ポリオレフィン樹脂、固形分酸価55mgKOH/g、加熱残分8%
P−902:「ユニストールP−902」、三井化学株式会社製、酸変性ポリオレフィン樹脂、固形分酸価55mgKOH/g、加熱残分22%

jER871:三菱化学社製ダイマー酸変性エポキシ化合物(エポキシ当量430g/eq)
YD172:新日鉄住金化学社製ダイマー酸変性エポキシ化合物(エポキシ当量650g/eq)

jER630:三菱化学株式会社製、N,N−ビス(2,3−エポキシプロピル)−4−(2,3−エポキシプロポキシ)アニリン(エポキシ当量96g/eq)
TETRAD−C:三菱ガス化学社製、1,3−ビス(N,N−ジグリシジルアミノメチル)シクロヘキサン(エポキシ当量91g/eq)

B−7:アデカレジンEM−0517(アデカ株式会社製、ビスフェノールA時グリシジルエーテル型エポキシ樹脂)を水で固形分濃度10%に希釈したもの
B−8:バソナートHW−100(BASF社製非ブロック型の多官能イソシアネート化合物、イソシアネート含有率約17%)を水で固形分濃度10%に希釈したもの

860:「EPICLON860」、DIC株式会社製、エポキシ当量245g/eqのビスフェノールA型エポキシ樹脂
TPP:トリフェニルホスフィン

混合溶剤1:トルエン/メチルエチルケトン=7/3(質量比)
混合溶剤2:トルエン/イソプロピルアルコール=8/2(質量比)
混合溶剤3:メチルシクロヘキサン/イソプロピルアルコール=8/2(質量比)
The symbols in Tables 2 and 3 are as follows.
P-401: “Unistor P-401”, manufactured by Mitsui Chemicals, acid-modified polyolefin resin, solid content acid value 55 mg KOH / g, heating residue 8%
P-902: “Unistor P-902”, manufactured by Mitsui Chemicals, acid-modified polyolefin resin, solid content acid value 55 mgKOH / g, heating residue 22%

jER871: Dimer acid-modified epoxy compound manufactured by Mitsubishi Chemical Corporation (epoxy equivalent 430 g / eq)
YD172: Nippon Steel & Sumikin Chemical Co., Ltd. dimer acid-modified epoxy compound (epoxy equivalent 650 g / eq)

jER630: manufactured by Mitsubishi Chemical Corporation, N, N-bis (2,3-epoxypropyl) -4- (2,3-epoxypropoxy) aniline (epoxy equivalent 96 g / eq)
TETRAD-C: manufactured by Mitsubishi Gas Chemical Company, 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane (epoxy equivalent 91 g / eq)

B-7: Adeka Resin EM-0517 (manufactured by Adeka Co., Ltd., glycidyl ether type epoxy resin at the time of bisphenol A) diluted with water to a solid content concentration of 10% B-8: Vasonate HW-100 (BASF non-block type) Diluted with water to a solid content concentration of 10%.

860: “EPICLON 860”, manufactured by DIC Corporation, bisphenol A type epoxy resin having an epoxy equivalent of 245 g / eq, TPP: triphenylphosphine

Mixed solvent 1: toluene / methyl ethyl ketone = 7/3 (mass ratio)
Mixed solvent 2: toluene / isopropyl alcohol = 8/2 (mass ratio)
Mixed solvent 3: methylcyclohexane / isopropyl alcohol = 8/2 (mass ratio)

[相溶性]
100μmのPETフィルムに、接着剤溶液をバーコーターにて塗布し、100℃、1分間乾燥し、乾燥後の塗布量が約2g/m2の接着剤層を得た。この積層フィルムを、JIS K7136に準じ、ヘイズを測定することにより相溶性を、以下の基準にて判定した。
A :3未満
B :3以上〜5未満
C :5以上
[Compatibility]
The adhesive solution was applied to a 100 μm PET film with a bar coater and dried at 100 ° C. for 1 minute to obtain an adhesive layer having a coating amount after drying of about 2 g / m 2 . By measuring the haze of this laminated film according to JIS K7136, the compatibility was determined according to the following criteria.
A: Less than 3 B: 3 or more and less than 5 C: 5 or more

[初期接着強度]
Al/CPP積層フィルムを、25℃、湿度65%の環境下で6時間静置後、それぞれ200mm×15mmの大きさに切断し、ASTM−D1876−61の試験法に準じ、引張り試験機を用いて、25℃、湿度65%の環境下で、荷重速度100mm/分でT型剥離試験を行った。アルミニウム箔/CPP間の15mm巾の剥離強度(N)を5個の試験片の平均値で示す。以下の基準にて判定した。
A :10N以上
B :5N以上〜10N未満
C :5N未満
[Initial bond strength]
The Al / CPP laminated film was allowed to stand for 6 hours in an environment of 25 ° C. and a humidity of 65%, then cut to a size of 200 mm × 15 mm, and a tensile tester was used according to the test method of ASTM-D1876-61. Then, a T-type peel test was performed at a load speed of 100 mm / min in an environment of 25 ° C. and a humidity of 65%. The peel strength (N) of 15 mm width between the aluminum foil / CPP is shown as an average value of five test pieces. Judgment was made according to the following criteria.
A: 10N or more B: 5N or more and less than 10N C: less than 5N

[耐溶剤性、電解質耐性(接着強度の変化)]
初期接着強度試験に用いたのと同様の試験片を、下記の有機溶剤、電解質溶液にそれぞれ2週間浸漬した。その後、試験片を取り出し約10分程度流水で洗浄し、ペーパーワイパーで水を十分に拭き取った後に試験片の接着強度を、浸漬試験前の接着強度測定と同様にして測定した。以下の基準にて判定した。
A :初期接着強度に対して、変化率が±10%未満
B :初期接着強度に対して、変化率が±30%未満
C :初期接着強度に対して、変化率が±30%以上
[有機溶剤]:40℃のエチレンカーボネート。
[電解質溶液]:1.5mol/lになるように6フッ化リン酸リチウムをエチレンカーボネート/ジエチルカーボネート/ジメチルカーボネート=1/1/1(容積比)に溶解した溶液としたもの。温度は85℃とした。
[Solvent resistance, electrolyte resistance (change in adhesive strength)]
Test pieces similar to those used in the initial adhesive strength test were immersed in the following organic solvent and electrolyte solution for 2 weeks, respectively. Thereafter, the test piece was taken out and washed with running water for about 10 minutes. After sufficiently wiping off the water with a paper wiper, the adhesive strength of the test piece was measured in the same manner as the adhesive strength measurement before the immersion test. Judgment was made according to the following criteria.
A: Change rate is less than ± 10% with respect to initial bond strength B: Change rate is less than ± 30% with respect to initial bond strength C: Change rate with respect to initial bond strength is ± 30% or more [organic Solvent]: 40 ° C. ethylene carbonate.
[Electrolyte solution]: A solution prepared by dissolving lithium hexafluorophosphate in ethylene carbonate / diethyl carbonate / dimethyl carbonate = 1/1/1 (volume ratio) so as to be 1.5 mol / l. The temperature was 85 ° C.

表2の実施例1〜19に示すように、エージング期間が短くても接着強度(初期、有機溶剤及び電解質溶液浸漬後)が良好な接着剤を提供することができる。
比較例1および5の接着剤は、重合脂肪酸変性部位を含有しないエポキシ化合物であり、本発明のエポキシ樹脂(B)よりポリオレフィンとの相溶性が悪いために短期間でのエージングでは接着強度が発現しにくく、有機溶剤や電解質溶液に浸漬後、接着強度が著しく低下する。
比較例2の接着剤は、ビスフェノールA型のエポキシ樹脂に加え、耐溶剤性の低いイソシアネート化合物を硬化剤に用いるので、比較例1よりさらに耐溶剤性が落ちている。
比較例3および4の接着剤は、リン酸エポキシを用いるので、比較例5に比して耐溶剤性は向上するが、短期間のエージングでは接着強度が十分発現しない。
比較例4および6の接着剤は、酸無水物またはカルボキシル基と、エポキシ基の反応の触媒になるとりフェニルホスフィンやアミノ基を有するエポキシ化合物を用いていても、短期間のエージングでは接着強度が十分発現しない。
As shown in Examples 1 to 19 in Table 2, an adhesive having good adhesive strength (initially, after immersion in an organic solvent and an electrolyte solution) can be provided even if the aging period is short.
The adhesives of Comparative Examples 1 and 5 are epoxy compounds that do not contain a polymerized fatty acid-modified site, and are less compatible with polyolefins than the epoxy resin (B) of the present invention, so that adhesive strength is manifested in aging in a short period of time. The adhesion strength is significantly reduced after immersion in an organic solvent or electrolyte solution.
Since the adhesive of Comparative Example 2 uses an isocyanate compound having low solvent resistance as a curing agent in addition to the bisphenol A type epoxy resin, the solvent resistance is further deteriorated compared to Comparative Example 1.
Since the adhesives of Comparative Examples 3 and 4 use phosphoric acid epoxy, the solvent resistance is improved as compared with Comparative Example 5, but the adhesive strength is not sufficiently exhibited by short-term aging.
Although the adhesives of Comparative Examples 4 and 6 use an epoxy compound having a phenylphosphine or an amino group as a catalyst for the reaction between an acid anhydride or a carboxyl group and an epoxy group, the adhesive strength is low when aging is performed for a short period of time. Not fully expressed.

また、各実施例の積層体(長方形)2枚を用い、CPPが内面となるよう3辺をヒートシールし、パウチ(袋)を作成した。擬似電極端子としての2つアルミニウム片同士は相互には接触させずに、開放端における2枚の積層体で挟みヒートシールした場合、高温(150〜200℃)、高圧(0.5〜3.0kg/cm2)でヒートシールしても、接着剤層が溶融したり著しく変形したりすることはなかった。
しかし、硬化剤にイソシアネート化合物を併用した比較例2では、高温・高圧下でヒートシールした場合に接着剤が溶融して端部からはみ出した結果、擬似電極端子とアルミニウムが接触することにより、絶縁性を確保できない場合があった。
In addition, two laminates (rectangles) of each example were used, and three sides were heat-sealed so that the CPP became the inner surface, and a pouch (bag) was created. When two aluminum pieces as pseudo electrode terminals are not brought into contact with each other and are heat-sealed by sandwiching them between two laminates at the open end, high temperature (150 to 200 ° C.), high pressure (0.5 to 3. Even when heat-sealing at 0 kg / cm 2 ), the adhesive layer did not melt or deform significantly.
However, in Comparative Example 2 in which an isocyanate compound is used in combination with the curing agent, when the heat seal is performed under high temperature and high pressure, the adhesive melts and protrudes from the end portion. In some cases, the sex could not be secured.

本発明に係る接着剤組成物は、リチウムイオン電池や電気二重層キャパシタ、リチウムイオンキャパシタ等の蓄電デバイスの容器を形成するための包材用(積層体)に好適に使用できる。
その他、本発明に係る接着剤組成物は、蓄電デバイスの容器を形成するための包材の他、建築、化学、医療、自動車などのように高接着強度、耐薬品性が求められる各種産業分野における積層体の形成に好適に使用される。
The adhesive composition according to the present invention can be suitably used for a packaging material (laminate) for forming a container for an electricity storage device such as a lithium ion battery, an electric double layer capacitor, or a lithium ion capacitor.
In addition, the adhesive composition according to the present invention is a packaging material for forming a container for an electricity storage device, as well as various industrial fields that require high adhesive strength and chemical resistance, such as architecture, chemistry, medicine, and automobiles. It is used suitably for formation of the laminated body in.

樹脂フィルム層(11)
金属箔層(12)
接着剤層(13)
ヒートシール層(14)
Resin film layer (11)
Metal foil layer (12)
Adhesive layer (13)
Heat seal layer (14)

Claims (13)

金属箔層とヒートシール層とを接着剤層を介して積層するための接着剤組成物であって、
カルボキシル基もしくは酸無水物基を有するポリオレフィン樹脂(A)と、不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応により得られるエポキシ化合物(B)とを含有することを特徴とする接着剤組成物。
An adhesive composition for laminating a metal foil layer and a heat seal layer via an adhesive layer,
An epoxy compound (B) obtained by a reaction between a polyolefin resin (A) having a carboxyl group or an acid anhydride group, a polymer (B1) of an unsaturated fatty acid and a compound (B2) having two or more epoxy groups; An adhesive composition comprising:
前記エポキシ化合物(B)が、不飽和脂肪酸の重合体(B1)と2つ以上のエポキシ基を有する化合物(B2)との反応生成物を、さらに水添することにより得られるエポキシ化合物であることを特徴とする請求項1記載の接着剤組成物。   The epoxy compound (B) is an epoxy compound obtained by further hydrogenating a reaction product of a polymer (B1) of an unsaturated fatty acid and a compound (B2) having two or more epoxy groups. The adhesive composition according to claim 1. 不飽和脂肪酸の重合体(B1)が、炭素数が12〜24個の不飽和脂肪酸を2量化させた化合物(ダイマー酸)ないし3量化させた化合物(トリマー酸)であることを特徴とする請求項1または2記載の接着剤組成物。   The polymer (B1) of unsaturated fatty acid is a compound (dimer acid) or a compound (trimer acid) obtained by dimerizing an unsaturated fatty acid having 12 to 24 carbon atoms. Item 3. The adhesive composition according to item 1 or 2. 2つ以上のエポキシ基を有する化合物(B2)が、ビスフェノールA型エポキシ化合物またはビスフェノールF型エポキシ化合物から選ばれることを特徴とする請求項1〜3いずれか1項に記載の接着剤組成物。   The adhesive composition according to any one of claims 1 to 3, wherein the compound (B2) having two or more epoxy groups is selected from a bisphenol A type epoxy compound or a bisphenol F type epoxy compound. 前記エポキシ化合物(B)のエポキシ当量が200〜7000であることを特徴とする請求項1〜4いずれか1項に記載の接着剤組成物。   The adhesive composition according to any one of claims 1 to 4, wherein an epoxy equivalent of the epoxy compound (B) is 200 to 7000. 前記ポリオレフィン樹脂(A)の質量平均分子量が5万〜50万であることを特徴とする請求項1〜5いずれか1項に記載の接着剤組成物。   The adhesive composition according to claim 1, wherein the polyolefin resin (A) has a mass average molecular weight of 50,000 to 500,000. 前記ポリオレフィン樹脂(A)が、1−ブテンと他のオレフィンとから得られる共重合体を、さらに酸変性することにより得られることを特徴とする請求項1〜6いずれか1項に記載の接着剤組成物。   The adhesion according to any one of claims 1 to 6, wherein the polyolefin resin (A) is obtained by further acid-modifying a copolymer obtained from 1-butene and another olefin. Agent composition. 前記ポリオレフィン樹脂(A)1(g)当たりのカルボキシル基の含有量をX(mmol)、酸無水物基の含有量をY(mmol)とした場合に、X+2Yが0.05〜0.6であることを特徴とする請求項1〜7いずれか1項に記載の接着剤組成物。   When the content of carboxyl groups per 1 g of the polyolefin resin (A) is X (mmol) and the content of acid anhydride groups is Y (mmol), X + 2Y is 0.05 to 0.6. It is, The adhesive composition of any one of Claims 1-7 characterized by the above-mentioned. 前記ポリオレフィン樹脂(A)の含有量をP(g)、前記エポキシ樹脂(B)中のエポキシ基をZ(mmol)とした場合に、Z/[(X+2Y)P]が0.3〜10であることを特徴とする請求項8記載の接着剤組成物。   When the content of the polyolefin resin (A) is P (g) and the epoxy group in the epoxy resin (B) is Z (mmol), Z / [(X + 2Y) P] is 0.3 to 10 The adhesive composition according to claim 8, wherein the adhesive composition is present. 請求項1〜9いずれか1項に記載の接着剤組成物から形成される接着剤層を介して、金属箔層とヒートシール層とが積層されてなる積層体。   The laminated body by which a metal foil layer and a heat seal layer are laminated | stacked through the adhesive bond layer formed from the adhesive composition of any one of Claims 1-9. 外層から順に、樹脂フィルム層、金属箔層、接着剤層、ヒートシール層を必須とする蓄電デバイス用包装材において、
前記接着剤層が請求項1〜9いずれか1項に記載の接着剤組成物から形成されることを特徴とする蓄電デバイス用包装材。
In order from the outer layer, in a packaging material for an electricity storage device that requires a resin film layer, a metal foil layer, an adhesive layer, and a heat seal layer,
The said adhesive bond layer is formed from the adhesive composition of any one of Claims 1-9, The packaging material for electrical storage devices characterized by the above-mentioned.
請求項11記載の蓄電デバイス用包装材から形成されてなる蓄電デバイス用容器であって、ヒートシール層が内面を構成している、蓄電デバイス用容器。   The container for electrical storage devices formed from the packaging material for electrical storage devices of Claim 11, Comprising: The container for electrical storage devices in which the heat seal layer comprises the inner surface. 請求項12記載の蓄電デバイス用容器を使用してなる蓄電デバイス。   An electrical storage device using the electrical storage device container according to claim 12.
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