WO2018221571A1 - Adhesive sheet, and sealed body - Google Patents
Adhesive sheet, and sealed body Download PDFInfo
- Publication number
- WO2018221571A1 WO2018221571A1 PCT/JP2018/020731 JP2018020731W WO2018221571A1 WO 2018221571 A1 WO2018221571 A1 WO 2018221571A1 JP 2018020731 W JP2018020731 W JP 2018020731W WO 2018221571 A1 WO2018221571 A1 WO 2018221571A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive layer
- adhesive sheet
- shear
- adhesive
- sheet according
- Prior art date
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 120
- 239000000853 adhesive Substances 0.000 title claims abstract description 119
- 239000012790 adhesive layer Substances 0.000 claims abstract description 110
- 239000004593 Epoxy Substances 0.000 claims abstract description 43
- 150000001875 compounds Chemical class 0.000 claims abstract description 39
- 238000007789 sealing Methods 0.000 claims abstract description 25
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- 229920005672 polyolefin resin Polymers 0.000 claims description 44
- 238000012360 testing method Methods 0.000 claims description 34
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 33
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 20
- 238000005259 measurement Methods 0.000 claims description 20
- 239000003054 catalyst Substances 0.000 claims description 12
- 239000003513 alkali Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 6
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- -1 Allyl diglycidyl ether Chemical compound 0.000 description 23
- 238000000034 method Methods 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 15
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000000178 monomer Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 150000001336 alkenes Chemical class 0.000 description 9
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 150000001244 carboxylic acid anhydrides Chemical group 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 6
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000123 paper Substances 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229920001684 low density polyethylene Polymers 0.000 description 4
- 239000004702 low-density polyethylene Substances 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 229920000058 polyacrylate Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 150000003377 silicon compounds Chemical class 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 3
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N hexane Substances CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920000092 linear low density polyethylene Polymers 0.000 description 3
- 239000004707 linear low-density polyethylene Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 229920013716 polyethylene resin Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 description 2
- 239000001124 (E)-prop-1-ene-1,2,3-tricarboxylic acid Substances 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229940091181 aconitic acid Drugs 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000005370 alkoxysilyl group Chemical group 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 2
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- GTZCVFVGUGFEME-IWQZZHSRSA-N cis-aconitic acid Chemical compound OC(=O)C\C(C(O)=O)=C\C(O)=O GTZCVFVGUGFEME-IWQZZHSRSA-N 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 229920001903 high density polyethylene Polymers 0.000 description 2
- 239000004700 high-density polyethylene Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 125000005462 imide group Chemical group 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 229920001179 medium density polyethylene Polymers 0.000 description 2
- 239000004701 medium-density polyethylene Substances 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011112 polyethylene naphthalate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 229920001862 ultra low molecular weight polyethylene Polymers 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- KMOUUZVZFBCRAM-UHFFFAOYSA-N 1,2,3,6-tetrahydrophthalic anhydride Chemical compound C1C=CCC2C(=O)OC(=O)C21 KMOUUZVZFBCRAM-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- AJHINEHNXSBERZ-UHFFFAOYSA-N 2-[[2-(oxiran-2-ylmethoxy)-5-[2-[4-(oxiran-2-ylmethoxy)-3-(oxiran-2-ylmethyl)phenyl]propan-2-yl]phenyl]methyl]oxirane Chemical compound CC(C)(C1=CC=C(OCC2CO2)C(CC2CO2)=C1)C1=CC=C(OCC2CO2)C(CC2CO2)=C1 AJHINEHNXSBERZ-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- WHKZBVQIMVUGIH-UHFFFAOYSA-N 3-hydroxyquinoline-2-carboxylic acid Chemical compound C1=CC=C2C=C(O)C(C(=O)O)=NC2=C1 WHKZBVQIMVUGIH-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920003354 Modic® Polymers 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920010346 Very Low Density Polyethylene (VLDPE) Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- GBTKXRHCGMUSDA-UHFFFAOYSA-N [SiH3]OC(=O)CCC=C Chemical compound [SiH3]OC(=O)CCC=C GBTKXRHCGMUSDA-UHFFFAOYSA-N 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- AYIGWTYMCHDVTN-UHFFFAOYSA-N [dicarboxy(ethenyl)silyl]formic acid Chemical compound OC(=O)[Si](C=C)(C(O)=O)C(O)=O AYIGWTYMCHDVTN-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 229940081735 acetylcellulose Drugs 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- IHWUGQBRUYYZNM-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-3,4-dicarboxylic acid Chemical compound C1CC2(C(O)=O)C(C(=O)O)=CC1C2 IHWUGQBRUYYZNM-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000003759 ester based solvent Substances 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- PWOZXQOZUNMWKG-UHFFFAOYSA-N ethenyl(tripentoxy)silane Chemical compound CCCCCO[Si](OCCCCC)(OCCCCC)C=C PWOZXQOZUNMWKG-UHFFFAOYSA-N 0.000 description 1
- FEHYCIQPPPQNMI-UHFFFAOYSA-N ethenyl(triphenoxy)silane Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(C=C)OC1=CC=CC=C1 FEHYCIQPPPQNMI-UHFFFAOYSA-N 0.000 description 1
- NNBRCHPBPDRPIT-UHFFFAOYSA-N ethenyl(tripropoxy)silane Chemical compound CCCO[Si](OCCC)(OCCC)C=C NNBRCHPBPDRPIT-UHFFFAOYSA-N 0.000 description 1
- MABAWBWRUSBLKQ-UHFFFAOYSA-N ethenyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](OC(C)C)(OC(C)C)C=C MABAWBWRUSBLKQ-UHFFFAOYSA-N 0.000 description 1
- VYJZXBZFLIBVQA-UHFFFAOYSA-N ethenyl-tris(phenylmethoxy)silane Chemical compound C=1C=CC=CC=1CO[Si](OCC=1C=CC=CC=1)(C=C)OCC1=CC=CC=C1 VYJZXBZFLIBVQA-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 238000010559 graft polymerization reaction Methods 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 1
- 125000002560 nitrile group Chemical group 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- SGCFZHOZKKQIBU-UHFFFAOYSA-N tributoxy(ethenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C=C SGCFZHOZKKQIBU-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- QYJYJTDXBIYRHH-UHFFFAOYSA-N trimethoxy-[8-(oxiran-2-ylmethoxy)octyl]silane Chemical compound C(C1CO1)OCCCCCCCC[Si](OC)(OC)OC QYJYJTDXBIYRHH-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- 229940124543 ultraviolet light absorber Drugs 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N urethane group Chemical group NC(=O)OCC JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
Definitions
- the present invention relates to an adhesive sheet having an adhesive layer excellent in sealability, and a sealed body obtained by sealing a seal with the adhesive sheet.
- organic EL elements have attracted attention as light emitting elements capable of high luminance light emission by low voltage direct current driving.
- the organic EL element has a problem that light emission characteristics such as light emission luminance, light emission efficiency, light emission uniformity and the like are easily deteriorated with the passage of time.
- As a cause of the problem of the deterioration of the light emission characteristic it has been considered that oxygen, moisture and the like infiltrate into the inside of the organic EL element to deteriorate the electrode and the organic layer. For this reason, in order to solve this problem, using the adhesive sheet which is excellent in water blocking property as a sealing material has been proposed.
- Patent Document 1 proposes a pressure-sensitive adhesive sheet having a specific adhesive property and the like and containing a rubber-based resin as a main component.
- the pressure-sensitive adhesive sheet is a pressure-sensitive adhesive sheet having a low water vapor permeability, which has sufficient adhesive strength even after wet heat, and suppresses yellowing when wet heat is passed, It is described that the pressure-sensitive adhesive sheet preferably contains a silane coupling agent in addition to the rubber-based resin because it is easy to express these characteristics.
- Patent Document 1 As described in Patent Document 1, by using a pressure-sensitive adhesive composition containing a rubber-based resin as a main component, a pressure-sensitive adhesive sheet having excellent moisture blocking properties tends to be obtained.
- a pressure-sensitive adhesive composition containing a rubber-based resin as a main component
- the adhesion may be reduced after being placed under high humidity conditions, and it is used as a forming material of a sealing material. It turned out that there are things that can not be done. Therefore, there has been a demand for a sealing material-forming material which has excellent sealing properties and maintains its performance even after being placed under high humidity conditions.
- This invention is made in view of the said situation, provides the adhesive sheet which has an adhesive bond layer which is excellent in sealing property, and the sealing body formed by sealing a sealing thing by the said adhesive sheet. With the goal.
- thermosetting adhesive layer containing a specific proportion of a multifunctional epoxy compound which has specific shear properties, is excellent in sealability and after being placed under high humidity conditions. Even then, they found that their performance was maintained, and came to complete the present invention.
- the following adhesive sheets (1) to (10), and (11) and (12) sealing bodies are provided.
- Lamination is performed under a pressure of 0.2 MPa and a lamination speed of 0.2 m / min to obtain a laminate.
- the laminate is then heated at 100 ° C. for 2 hours to cure the adhesive layer. Thereafter, the laminate is allowed to stand at 23 ° C. under a relative humidity of 50% for 24 hours to obtain a measurement sample.
- the shear load is measured at a shear rate of 0.1 mm / min using the obtained measurement sample.
- the value of the maximum shear load (P 2 max ) in the shear test (B) is 70% or more of the value of the maximum shear load (P 1 max ) in the shear test (1).
- the adhesive sheet which has an adhesive layer which is excellent in sealing property, and the sealing body formed by sealing a to-be-sealed thing with the said adhesive sheet are provided.
- Adhesive sheet The adhesive sheet of the present invention is an adhesive sheet having a thermosetting adhesive layer containing a polyfunctional epoxy compound, and the content of the polyfunctional epoxy compound is 5 to 50 in the entire adhesive layer. It is a mass%, and when the above shear test (A) is performed, the above requirements [1] to [3] are satisfied.
- the adhesive layer constituting the adhesive sheet of the present invention contains a polyfunctional epoxy compound.
- the polyfunctional epoxy compound refers to a compound having two or more epoxy groups in the molecule.
- the epoxy equivalent of the polyfunctional epoxy compound is preferably 100 g / eq or more and 500 g / eq or less, more preferably 150 g / eq or more and 300 g / eq or less.
- the content of the polyfunctional epoxy compound is 5 to 50% by mass, preferably 10 to 40% by mass in the entire adhesive layer.
- An adhesive layer containing too little content of a polyfunctional epoxy compound becomes difficult to satisfy above-mentioned requirements [1] and [2], and is inferior to adhesiveness.
- the adhesive layer having too much content of the polyfunctional epoxy compound is less likely to satisfy the above requirement [3], and is inferior in flexibility after curing.
- the adhesive layer may contain a modified polyolefin resin as a component other than the polyfunctional epoxy compound.
- the modified polyolefin resin is a polyolefin resin having a functional group introduced, which is obtained by subjecting a polyolefin resin as a precursor to a modification treatment using a modifier.
- the polyolefin resin refers to a polymer containing a repeating unit derived from an olefin monomer.
- the polyolefin resin may be a polymer consisting only of repeating units derived from an olefin monomer, or a monomer derived from an olefin monomer and a monomer copolymerizable with the olefin monomer. It may be a polymer composed of the repeating units of
- the olefin-based monomer is preferably an ⁇ -olefin having 2 to 8 carbon atoms, more preferably ethylene, propylene, 1-butene, isobutylene or 1-hexene, and still more preferably ethylene or propylene.
- These olefin monomers can be used alone or in combination of two or more.
- a monomer copolymerizable with an olefin type monomer vinyl acetate, (meth) acrylic acid ester, styrene etc. are mentioned.
- (meth) acrylic acid means acrylic acid or methacrylic acid (the same applies below).
- the monomer copolymerizable with these olefin type monomers can be used individually by 1 type or in combination of 2 or more types.
- VLDPE very low density polyethylene
- LDPE low density polyethylene
- MDPE medium density polyethylene
- HDPE high density polyethylene
- PP polypropylene
- ethylene-propylene co Examples thereof include a polymer, an olefin elastomer (TPO), an ethylene-vinyl acetate copolymer (EVA), an ethylene- (meth) acrylic acid copolymer, and an ethylene- (meth) acrylic acid ester copolymer.
- the modifier used to modify the polyolefin resin is a compound having a functional group in the molecule.
- a functional group a carboxyl group, a carboxylic acid anhydride group, a carboxylic acid ester group, a hydroxyl group, an epoxy group, an amide group, an ammonium group, a nitrile group, an amino group, an imide group, an isocyanate group, an acetyl group, a thiol group, an ether group , Thioether group, sulfone group, phosphonic group, nitro group, urethane group, halogen atom and the like.
- a carboxyl group, a carboxylic acid anhydride group, a carboxylic acid ester group, a hydroxyl group, an ammonium group, an amino group, an imide group and an isocyanate group are preferable, a carboxylic acid anhydride group and an alkoxysilyl group are more preferable, and a carboxylic acid anhydride
- the compound having a functional group may have two or more types of functional groups in the molecule.
- modified polyolefin resin examples include an acid-modified polyolefin resin and a silane-modified polyolefin resin. From the viewpoint that the more excellent effect of the present invention can be obtained, the acid-modified polyolefin resin is preferable.
- the acid-modified polyolefin resin refers to a resin obtained by graft-modifying a polyolefin resin with an acid.
- a polyolefin resin is reacted with an unsaturated carboxylic acid or unsaturated carboxylic acid anhydride (hereinafter, these may be collectively referred to as "unsaturated carboxylic acid etc.") to give a carboxyl group or a carboxylic acid anhydride group.
- unsaturated carboxylic acid etc. unsaturated carboxylic acid or unsaturated carboxylic acid anhydride
- unsaturated carboxylic acids to be reacted with a polyolefin resin examples include unsaturated carboxylic acids such as maleic acid, fumaric acid, itaconic acid, citraconic acid, glutaconic acid, glutaronic acid, tetrahydrophthalic acid, aconitic acid, etc .; maleic anhydride, itaconic anhydride, anhydride And unsaturated carboxylic acid anhydrides such as glutaconic acid, citraconic acid anhydride, aconitic acid anhydride, norbornene dicarboxylic acid anhydride, and tetrahydrophthalic acid anhydride. These can be used singly or in combination of two or more. Among these, maleic anhydride is preferable because an adhesive that is more excellent in adhesive strength can be easily obtained.
- the amount of unsaturated carboxylic acid or the like to be reacted with the polyolefin resin is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 3 parts by mass, still more preferably 0.2 based on 100 parts by mass of the polyolefin resin. It is up to 1.0 parts by mass.
- the adhesive containing the acid-modified polyolefin resin thus obtained is more excellent in adhesive strength.
- a commercial item can also be used as acid-modified polyolefin resin.
- Examples of commercially available products include Admar (registered trademark) (Mitsui Chemical Co., Ltd.), Unistoll (registered trademark) (Mitsui Chemical Co., Ltd.), BondyRam (Polyram), orevac (registered trademark) (ARKEMA), Modic (registered trademark) (manufactured by Mitsubishi Chemical Corporation) and the like.
- the silane-modified polyolefin resin refers to a resin obtained by graft-modifying a polyolefin resin with an unsaturated silane compound.
- the silane modified polyolefin resin has a structure in which an unsaturated silane compound which is a side chain is graft copolymerized to a polyolefin resin which is a main chain.
- silane modified polyethylene resin and silane modified ethylene-vinyl acetate copolymer can be mentioned.
- silane-modified polyethylene resins such as silane-modified low density polyethylene, silane-modified ultra-low density polyethylene, and silane-modified linear low density polyethylene are preferable.
- a vinylsilane compound is preferable.
- the conditions in the case of graft-polymerizing an unsaturated silane compound to the polyolefin resin which is a principal chain may adopt a well-known graft polymerization method.
- the amount of the unsaturated silane compound to be reacted with the polyolefin resin is preferably 0.1 to 10 parts by mass, preferably 0.3 to 7 parts by mass, with respect to 100 parts by mass of the polyolefin resin. More preferably, it is 5 to 5 parts by mass.
- the adhesive containing the silane-modified polyolefin-based resin to be obtained is more excellent in adhesive strength.
- a commercial item can also be used as silane modification polyolefin resin.
- LINCTRON registered trademark
- the low density polyethylene-based linkleon, the linear low density polyethylene-based lindleon, the ultra low density polyethylene-based lincolon, and the ethylene-vinyl acetate copolymer-based lincolone can be preferably used.
- the modified polyolefin resin can be used singly or in combination of two or more.
- the number average molecular weight (Mn) of the modified polyolefin resin is preferably 10,000 to 2,000,000, and more preferably 20,000 to 1,500,000.
- the number average molecular weight (Mn) of the modified polyolefin resin can be determined as a standard polystyrene conversion value by gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent.
- the content of the modified polyolefin resin is preferably 40 to 90% by mass, more preferably 50 to 80% by mass, based on the entire adhesive layer.
- the adhesive layer can more easily satisfy the requirements [1] to [3].
- the adhesive layer may contain an imidazole-based curing catalyst as a component other than the polyfunctional epoxy compound.
- imidazole series curing catalyst 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl -4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and the like.
- 2-ethyl-4-methylimidazole is preferable.
- These imidazole curing catalysts can be used alone or in combination of two or more.
- the content of the imidazole-based curing catalyst is preferably 0.1 to 10 parts by mass, more preferably 0.2 based on 100 parts by mass of the polyfunctional epoxy compound. 5 parts by mass.
- the adhesive layer can more easily satisfy the requirements [1] to [3].
- the adhesive layer may contain a silane coupling agent as a component other than the polyfunctional epoxy compound.
- a silane coupling agent as a component other than the polyfunctional epoxy compound.
- a well-known silane coupling agent can be used as a silane coupling agent.
- organic silicon compounds having at least one alkoxysilyl group in the molecule are preferable.
- silane coupling agent polymerizable unsaturated group-containing silicon compounds such as vinyltrimethoxysilane, vinyltriethoxysilane, methacryloxypropyltrimethoxysilane and the like; 3-glycidoxypropyltrimethoxysilane, 2- (3,4 Silicon compounds having an epoxy structure such as -epoxycyclohexyl) ethyltrimethoxysilane; 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) Amino group-containing silicon compounds such as -3-aminopropylmethyldimethoxysilane; 3-chloropropyltrimethoxys
- the content of the silane coupling agent is preferably 0.01 to 2% by mass, more preferably 0.05 to 1% by mass, based on the entire adhesive layer. .
- the adhesive layer can more easily satisfy the requirements [1] to [3].
- the adhesive layer may contain other components as long as the effects of the present invention are not impaired.
- Other components include additives such as ultraviolet light absorbers, antistatic agents, light stabilizers, antioxidants, resin stabilizers, fillers, pigments, extenders, and softeners. These can be used singly or in combination of two or more. When the adhesive layer contains these additives, the content can be appropriately determined according to the purpose.
- the thickness of the adhesive layer is preferably 1 to 25 ⁇ m, more preferably 3 to 20 ⁇ m.
- the adhesive layer has a thermosetting property. That is, by heating the adhesive layer, at least the epoxy group of the polyfunctional epoxy compound is reacted to cure the adhesive layer.
- the conditions at which the adhesive layer is thermally cured are not particularly limited.
- the heating temperature is usually 80 to 200 ° C., preferably 90 to 150 ° C.
- the heating time is usually 30 minutes to 12 hours, preferably 1 to 6 hours.
- the water vapor transmission rate of the adhesive layer after curing is usually 0.1 to 200 g ⁇ m ⁇ 2 ⁇ day ⁇ 1 , preferably 1 to 150 g ⁇ m ⁇ 2 ⁇ day ⁇ 1 .
- the water vapor permeability can be measured using known gas permeability measuring devices.
- the adhesive layer satisfies the following requirements [1] to [3] when the shear test (A) is performed under the following conditions.
- Shear test (A) Prepare two rectangular alkali-free glasses with a short side of 10 mm, and on one of these sheets of alkali-free glass, a square adhesive layer with a side of 10 mm and a bonding area of 100 mm 2 (10 mm ⁇ 10 mm) Then, they are laminated at a temperature of 60 ° C., a pressure of 0.2 MPa, and a laminating speed of 0.2 m / min.
- Another non-alkali glass is stacked on the side of the adhesive layer not in contact with the non-alkali glass so that the adhesion area is 100 mm 2 (10 mm ⁇ 10 mm), and these are heated to 60 ° C.
- Lamination is performed under a pressure of 0.2 MPa and a lamination speed of 0.2 m / min to obtain a laminate.
- the laminate is then heated at 100 ° C. for 2 hours to cure the adhesive layer. Thereafter, the laminate is allowed to stand at 23 ° C. under a relative humidity of 50% for 24 hours to obtain a measurement sample.
- the shear load is measured under the conditions of a shear rate of 0.1 mm / min and an atmosphere at a room temperature of 23 ° C. and a relative humidity of 50% using the obtained measurement sample.
- Requirement [1] The maximum shear load (P 1 max ) is measured when the shear strain is less than 10,000%.
- Requirement [2] The value of the maximum shear load (P 1 max ) is 100 N or more.
- the shear strain means the amount of displacement in the horizontal direction with respect to the thickness of the adhesive layer, and is calculated by the following equation.
- the shear strain of 10,000% means that the upper surface of the adhesive layer is horizontally offset by 1000 ⁇ m with respect to the lower surface.
- Shear test (A) is a test to evaluate the shear properties of the adhesive under normal conditions.
- the adhesive layer of the adhesive sheet of the present invention satisfies the requirement [1] when the shear test (A) is performed. That is, the adhesive layer of the adhesive sheet of the present invention is one that is measured when the maximum shear load (P 1 max ) is less than 10,000% shear strain.
- the adhesive layer satisfying the requirement [1] is preferable from the viewpoint of sealability. By including 5 to 50% by mass of the polyfunctional epoxy resin in the adhesive layer, an adhesive layer satisfying the requirement [1] can be easily obtained.
- the adhesive layer of the adhesive sheet of the present invention satisfies the requirement [2] when the shear test (A) is performed. That is, the adhesive layer of the adhesive sheet of the present invention has a maximum shear load (P 1 max ) value of 100 N or more.
- the adhesive layer satisfying the requirement [2] is preferable from the viewpoint of sealability. By including 5 to 50% by mass of the polyfunctional epoxy resin in the adhesive layer, an adhesive layer satisfying the requirement [2] can be easily obtained.
- the adhesive layer of the adhesive sheet of the present invention satisfies the requirement [3] when the shear test (A) is performed. That is, in the adhesive layer of the adhesive sheet of the present invention, the shear load (P 1 10000% ) at a shear strain of 10,000% is 50% or more of the value of the maximum shear load (P 1 max ) It is.
- the adhesive layer satisfying the requirement [3] is preferable from the viewpoint of flexibility when sealing the object to be sealed. By including 5 to 50% by mass of the multifunctional epoxy resin in the adhesive layer, an adhesive layer satisfying the requirement [3] can be easily obtained. Furthermore, by containing the modified polyolefin resin in the adhesive layer, an adhesive layer satisfying the requirement [3] can be more easily obtained.
- the adhesive layer of the adhesive sheet of the present invention preferably satisfies the following requirement [4] when the shear test (B) is performed under the following conditions.
- [Shear test (B)] A measurement sample is produced in the same manner as the production method of the measurement sample in the shear test (A). The measurement sample obtained is allowed to stand for 24 hours under conditions of a temperature of 60 ° C. and a relative humidity of 90% for 100 hours, and then under a condition of a temperature of 23 ° C. and a relative humidity of 50%. The shear load is measured under conditions of a shear rate of 0.1 mm / min and an atmosphere at a room temperature of 23 ° C. and a relative humidity of 50%.
- the shear test (B) is a test to evaluate the shear properties of the adhesive layer after being placed under high humidity conditions.
- the adhesive layer satisfying the requirement [4] is preferable in that it has excellent durability after sealing the object to be sealed. By including a silane coupling agent in the adhesive layer, an adhesive layer satisfying the requirement [4] can be easily obtained.
- the adhesive sheet of the present invention may have a release film.
- the release film functions as a support in the manufacturing process of the adhesive sheet, and also functions as a protective sheet of the adhesive layer until the adhesive sheet is used.
- the release film is usually peeled off.
- peeling film As a peeling film, a conventionally well-known thing can be utilized. For example, what has a peeling layer in which the peeling process was carried out by the peeling agent on the base material for peeling films is mentioned.
- substrates for release films paper substrates such as glassine paper, coated paper, high-quality paper, etc .; laminated paper obtained by laminating a thermoplastic resin such as polyethylene on these paper substrates; polyethylene terephthalate resin, polybutylene terephthalate resin, Plastic films, such as polyethylene naphthalate resin, a polypropylene resin, polyethylene resin ;; etc. are mentioned.
- release agent examples include silicone resins, olefin resins, isoprene resins, rubber elastomers such as butadiene resins, long chain alkyl resins, alkyd resins, fluorine resins and the like.
- the number of peelable films may be one or two, but generally, two on each side of the adhesive layer.
- the release film of At this time, the two peelable films may be identical or different, but the two peelable films preferably have different peel strengths.
- the peeling force of the two peeling films is different, a problem is less likely to occur when using the adhesive sheet. That is, the process of peeling a peeling film initially can be performed more efficiently by making the peeling force of two peeling films different.
- the method for producing the adhesive sheet is not particularly limited.
- an adhesive sheet can be manufactured using a cast method.
- a coating liquid containing the components of the adhesive layer and a solvent is prepared, and the obtained coating liquid is applied to the release treated surface of the release film, and thus obtained.
- By drying the coated film an adhesive layer with a release film can be produced, and then, another release film can be laminated on the adhesive layer to obtain an adhesive sheet.
- solvents used for preparation of the coating liquid include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; n-pentane And aliphatic hydrocarbon solvents such as n-hexane and n-heptane; alicyclic hydrocarbon solvents such as cyclopentane, cyclohexane and methylcyclohexane; and the like. These solvents can be used alone or in combination of two or more. The content of the solvent can be appropriately determined in consideration of coating properties and the like.
- Drying conditions for drying the coating include, for example, a drying temperature of 80 to 150 ° C., and a drying time of 30 seconds to 5 minutes.
- the adhesive layer of the adhesive sheet of the present invention has the above-mentioned shear properties and is excellent in sealability. Therefore, by forming the sealing material using the adhesive sheet of the present invention, it is possible to achieve long life of the organic EL element and the like.
- the sealed body of the present invention is obtained by sealing an object to be sealed using the adhesive sheet of the present invention.
- the sealing body of the present invention includes, for example, a substrate, an element (object to be sealed) formed on the substrate, and a sealing material for sealing the element. What is a thing derived from the adhesive bond layer of the adhesive sheet of this invention (hardened material of an adhesive bond layer) is mentioned for a sealing material.
- the substrate is not particularly limited, and various substrate materials can be used. In particular, it is preferable to use a substrate material having a high visible light transmittance. In addition, a material having a high blocking performance to block moisture and gas from the outside of the element and having excellent solvent resistance and weather resistance is preferable.
- transparent inorganic materials such as quartz and glass; polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polystyrene, polyethylene, polypropylene, polyphenylene sulfide, polyvinylidene fluoride, acetyl cellulose, brominated phenoxy, aramids, polyimides, Transparent plastics, such as polystyrenes, polyarylates, polysulfones, polyolefins, and the gas barrier film mentioned above;
- the thickness of the substrate is not particularly limited, and can be appropriately selected in consideration of the light transmittance and the performance of blocking the inside and outside of the device.
- an organic EL element As an object to be sealed, an organic EL element, an organic EL display element, a liquid crystal display element, a solar cell element and the like can be mentioned.
- the manufacturing method of the sealing body of this invention is not specifically limited. For example, after the adhesive layer of the adhesive sheet of the present invention is stacked on an object to be sealed, the adhesive layer of the adhesive sheet is adhered to the object by heating. Then, the adhesive layer is cured to produce the sealed body of the present invention.
- the bonding conditions for bonding the adhesive layer of the adhesive sheet and the object to be sealed are not particularly limited.
- the adhesion temperature is, for example, 23 to 100 ° C., preferably 40 to 80 ° C. This adhesion process may be performed while applying pressure.
- the curing conditions for curing the adhesive layer the conditions described above can be used.
- the sealed body of the present invention is obtained by sealing an object to be sealed with the adhesive sheet of the present invention. Therefore, in the sealed body of the present invention, the performance of the sealed object is maintained for a long time.
- Example 1 Acid-modified polyolefin resin (acid-modified ⁇ -olefin polymer, manufactured by Mitsui Chemicals, trade name: Unistol H-200, number average molecular weight: 47,000) 76.6 parts, multifunctional epoxy compound (1) (water Added bisphenol A type epoxy resin, manufactured by Mitsubishi Chemical Co., Ltd., trade name: YX8034, 23.0 parts of epoxy equivalent weight, imidazole-based curing catalyst (manufactured by Shikoku Kasei Co., Ltd., trade name: Cuazole 2E4MZ, 2-ethyl-4-) 0.3 part of methylimidazole and 0.1 part of silane coupling agent (1) (8-glycidoxyoctyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM4803) are dissolved in methyl ethyl ketone and solid Adhesive composition 1 having a concentration of 18% was prepared.
- This adhesive composition 1 is coated on the release-treated surface of a release film (Lintech Co., Ltd., trade name: SP-PET 382150), and the obtained coating film is dried at 100 ° C. for 2 minutes, and has a thickness of 10 ⁇ m An agent layer was formed, and the release-treated surface of another release film (Lintech Co., Ltd., trade name: SP-PET 381031) was bonded thereon to obtain an adhesive sheet 1.
- Example 2 In Example 1, in place of the polyfunctional epoxy compound (1), a polyfunctional epoxy compound (2) (hydrogenated bisphenol A type epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name: YX 8000, epoxy equivalent 205 g / eq) is used. An adhesive composition 2 was prepared in the same manner as in Example 1 except for the above, and an adhesive sheet 2 was obtained using this.
- a polyfunctional epoxy compound (2) hydrogenated bisphenol A type epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name: YX 8000, epoxy equivalent 205 g / eq
- Example 3 In Example 1, in place of the polyfunctional epoxy compound (1), a polyfunctional epoxy compound (3) (hydrogenated bisphenol A epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name: YX8040, epoxy equivalent: 1100 g / eq) is used. An adhesive composition 3 was prepared in the same manner as in Example 1 except for the above, and an adhesive sheet 3 was obtained using this.
- a polyfunctional epoxy compound (3) hydrogenated bisphenol A epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name: YX8040, epoxy equivalent: 1100 g / eq
- Example 4 In Example 1, in place of the silane coupling agent (1), a silane coupling agent (2) (3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM 403) is used. An adhesive composition 4 was prepared in the same manner as in Example 1 except for the above, and an adhesive sheet 4 was obtained using this.
- a silane coupling agent (2) (3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM 403
- Example 5 In Example 1, in place of the polyfunctional epoxy compound (1), polyfunctional epoxy compound (4) (hydrogenated bisphenol A diglycidyl ether, manufactured by Kyoeisha Chemical Co., Ltd., trade name: Epolite 4000, epoxy equivalent weight 215 to 245 g / eq
- the adhesive composition 5 was prepared in the same manner as in Example 1 except that the above was used, to obtain an adhesive sheet 5.
- Example 6 In Example 5, in place of the silane coupling agent (1), a silane coupling agent (2) (3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM 403) was used. An adhesive composition 6 was prepared in the same manner as in Example 5 except for the above, and an adhesive sheet 6 was obtained using this.
- a silane coupling agent (2) (3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM 403
- Comparative Example 1 An adhesive composition 7 was prepared in the same manner as in Example 1 except that the multifunctional epoxy compound (1) was not used in Example 1, and an adhesive sheet 7 was obtained using this.
- Comparative Example 2 77 parts of n-butyl acrylate, 20 parts of methyl acrylate, 3 parts of acrylic acid, 200 parts of ethyl acetate, 2,2'-azo, in a reaction vessel equipped with a stirrer, thermometer, reflux condenser, dropping device and nitrogen introducing pipe 0.16 parts of bisisobutyronitrile was charged, and the copolymerization was carried out at 70 ° C. in a nitrogen gas atmosphere to obtain an acrylic polymer (1) having a weight average molecular weight (Mw) of 800,000.
- Shear test (B) A measurement sample was produced in the same manner as the production method of the measurement sample in the shear test (A). The measurement sample obtained is allowed to stand for 24 hours under conditions of a temperature of 60 ° C. and a relative humidity of 90% for 100 hours, and then under a condition of a temperature of 23 ° C. and a relative humidity of 50%. The shear load was measured at a shear rate of 0.1 mm / min.
- An organic EL element having a glass substrate on which an indium tin oxide (ITO) film (thickness: 100 nm, sheet resistance: 50 ⁇ / ⁇ (ohm / square)) was formed as an anode was manufactured by the following method.
- ITO indium tin oxide
- Tris (8-) A light emitting layer was formed by sequentially depositing hydroxy-quinolinate) aluminum (manufactured by Luminescence Technology) at a rate of 50 nm, 0.1 to 0.2 nm / min.
- Lithium fluoride (LiF) (manufactured by High Purity Chemical Laboratory Co., Ltd.) 4 nm at a rate of 0.1 nm / min as an electron injecting material on the obtained light emitting layer, then aluminum (Al) (high purity chemical research laboratory ) was deposited at a rate of 0.1 nm / min to form a cathode, whereby an organic EL device was obtained.
- the degree of vacuum at the time of deposition was all 1 ⁇ 10 ⁇ 4 Pa or less.
- Example or Comparative Example One release film of the adhesive sheet obtained in Example or Comparative Example was peeled off, the exposed adhesive layer was stacked on a metal foil film, and these were adhered at 60 ° C. using a heat laminator. Next, another release film was peeled off, and the exposed adhesive layer was overlapped so as to cover the organic EL element formed on the glass substrate, and these were adhered at 60 ° C. using a heat laminator. Then, the adhesive layer was cured by heating at 100 ° C. for 2 hours to obtain a bottom emission type electronic device in which the organic EL element was sealed. This electronic device is allowed to stand for 250 hours in an environment of a temperature of 60 ° C.
- Table 1 shows the following.
- the adhesive layer of the adhesive sheet obtained in Examples 1 to 6 is excellent in sealability, and the occurrence of dark spots can be suppressed by sealing the organic EL element using these.
- the adhesive layer of the adhesive sheet obtained in Comparative Examples 1 to 4 does not have predetermined shear characteristics, and these are inferior in sealability.
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Abstract
Description
しかし、有機EL素子には、時間の経過とともに、発光輝度、発光効率、発光均一性等の発光特性が低下し易いという問題があった。
この発光特性の低下の問題の原因として、酸素や水分等が有機EL素子の内部に浸入し、電極や有機層を劣化させることが考えられてきた。このため、この問題を解決するために、水分遮断性に優れる粘着シートを封止材として用いることが提案されてきた。 In recent years, organic EL elements have attracted attention as light emitting elements capable of high luminance light emission by low voltage direct current driving.
However, the organic EL element has a problem that light emission characteristics such as light emission luminance, light emission efficiency, light emission uniformity and the like are easily deteriorated with the passage of time.
As a cause of the problem of the deterioration of the light emission characteristic, it has been considered that oxygen, moisture and the like infiltrate into the inside of the organic EL element to deteriorate the electrode and the organic layer. For this reason, in order to solve this problem, using the adhesive sheet which is excellent in water blocking property as a sealing material has been proposed.
この文献には、その粘着シートが水蒸気透過度の低い粘着シートであって、湿熱経過時においても十分な粘着力を有し、かつ湿熱経過時の黄変が抑制されたものであることや、これらの特性を発現し易いことから、粘着シートは、ゴム系樹脂に加えてシランカップリング剤を含有するものが好ましいこと等が記載されている。 As a pressure-sensitive adhesive sheet having such characteristics, Patent Document 1 proposes a pressure-sensitive adhesive sheet having a specific adhesive property and the like and containing a rubber-based resin as a main component.
In this document, the pressure-sensitive adhesive sheet is a pressure-sensitive adhesive sheet having a low water vapor permeability, which has sufficient adhesive strength even after wet heat, and suppresses yellowing when wet heat is passed, It is described that the pressure-sensitive adhesive sheet preferably contains a silane coupling agent in addition to the rubber-based resin because it is easy to express these characteristics.
しかしながら、本発明者らの検討によれば、このような粘着剤組成物であっても、高湿条件下に置かれた後に粘着力が低下することがあり、封止材の形成材料として使用できないものもあることが分かった。
したがって、封止性に優れ、かつ、高湿条件下に置かれた後であっても、その性能が維持される封止材形成材料が求められていた。 As described in Patent Document 1, by using a pressure-sensitive adhesive composition containing a rubber-based resin as a main component, a pressure-sensitive adhesive sheet having excellent moisture blocking properties tends to be obtained.
However, according to the study of the present inventors, even with such a pressure-sensitive adhesive composition, the adhesion may be reduced after being placed under high humidity conditions, and it is used as a forming material of a sealing material. It turned out that there are things that can not be done.
Therefore, there has been a demand for a sealing material-forming material which has excellent sealing properties and maintains its performance even after being placed under high humidity conditions.
その結果、多官能エポキシ化合物を特定割合で含有する熱硬化性の接着剤層であって、特定のせん断特性を有するものは、封止性に優れ、かつ、高湿条件下に置かれた後であっても、その性能が維持されることを見出し、本発明を完成するに至った。 The present inventors diligently studied the adhesive layer in order to solve the above problems.
As a result, a thermosetting adhesive layer containing a specific proportion of a multifunctional epoxy compound, which has specific shear properties, is excellent in sealability and after being placed under high humidity conditions. Even then, they found that their performance was maintained, and came to complete the present invention.
(1)多官能エポキシ化合物を含有する熱硬化性の接着剤層を有する接着シートであって、多官能エポキシ化合物の含有量が、接着剤層全体中5~50質量%であり、下記の条件でせん断試験(A)を行ったときに、下記の要件〔1〕~〔3〕を満たすことを特徴とする接着シート。
〔せん断試験(A)〕
短辺が10mmの長方形の無アルカリガラスを2枚用意し、これらの中の1枚の無アルカリガラス上に、1辺が10mmの正方形の接着剤層を接着面積が100mm2(10mm×10mm)になるように配置し、これらを温度60℃、圧力0.2MPa、ラミネート速度0.2m/分の条件でラミネートする。次いで、前記接着剤層の、無アルカリガラスと接していない側の面に、もう1枚の無アルカリガラスを接着面積が100mm2(10mm×10mm)になるように重ね、これらを温度60℃、圧力0.2MPa、ラミネート速度0.2m/分の条件でラミネートし積層体を得る。次いで、この積層体を100℃で2時間加熱してその接着剤層を硬化させる。その後、積層体を23℃、相対湿度50%の条件下で24時間静置し、測定試料を得る。得られた測定試料を用いて、せん断速度0.1mm/分の条件でせん断荷重を測定する。
〔要件〕
要件〔1〕:最大せん断荷重(P1 max)がせん断歪み10,000%未満のときに測定される。
要件〔2〕:最大せん断荷重(P1 max)の値が100N以上である。
要件〔3〕:せん断歪み10,000%のときのせん断荷重(P1 10000%)の値が、最大せん断荷重(P1 max)の値の50%以上である。
(2)下記の条件でせん断試験(B)を行ったときに、下記の要件〔4〕を満たすことを特徴とする、(1)に記載の接着シート。
〔せん断試験(B)〕
せん断試験(A)における測定試料の作製方法と同様にして測定試料を作製する。
得られた測定試料を、温度60℃、相対湿度90%の条件下に100時間、次いで、温度23℃、相対湿度50%の条件下に24時間静置させた後に、この測定試料を用いて、せん断速度0.1mm/分の条件でせん断荷重を測定する。
〔要件〕
要件〔4〕:せん断試験(B)における最大せん断荷重(P2 max)の値が、せん断試験(1)における最大せん断荷重(P1 max)の値の70%以上である。
(3)前記接着剤層が、さらに変性ポリオレフィン系樹脂を含有するものである、(1)又は(2)に記載の接着シート。
(4)変性ポリオレフィン系樹脂の含有量が、接着剤層全体中40~90質量%である、(3)に記載の接着シート。
(5)前記接着剤層が、さらにイミダゾール系硬化触媒を含有するものである、(1)~(4)のいずれかに記載の接着シート。
(6)イミダゾール系硬化触媒の含有量が、前記接着剤層中に含まれる前記多官能エポキシ化合物100質量部に対し、0.1~10質量部である、(5)に記載の接着シート。
(7)前記接着剤層が、さらにシランカップリング剤を含有するものである、(1)~(6)のいずれかに記載の接着シート。
(8)シランカップリング剤の含有量が、接着剤層全体中0.01~2質量%である、(7)に記載の接着シート。
(9)接着剤層の厚みが1~25μmである、(1)~(8)のいずれかに記載の接着シート。
(10)さらに剥離フィルムを有する、(1)~(9)のいずれかに記載の接着シート。
(11)被封止物が、(1)~(10)のいずれかに記載の接着シートを用いて封止されてなる封止体。
(12)前記被封止物が、有機EL素子、有機ELディスプレイ素子、液晶ディスプレイ素子、又は太陽電池素子である、(11)に記載の封止体。 Thus, according to the present invention, the following adhesive sheets (1) to (10), and (11) and (12) sealing bodies are provided.
(1) An adhesive sheet having a thermosetting adhesive layer containing a polyfunctional epoxy compound, wherein the content of the polyfunctional epoxy compound is 5 to 50% by mass in the entire adhesive layer, and the following conditions are satisfied: An adhesive sheet characterized by satisfying the following requirements [1] to [3] when the shear test (A) is carried out.
[Shear test (A)]
Prepare two rectangular alkali-free glasses with a short side of 10 mm, and on one of these sheets of alkali-free glass, a square adhesive layer with a side of 10 mm and a bonding area of 100 mm 2 (10 mm × 10 mm) Then, they are laminated at a temperature of 60 ° C., a pressure of 0.2 MPa, and a laminating speed of 0.2 m / min. Next, another non-alkali glass is stacked on the side of the adhesive layer not in contact with the non-alkali glass so that the adhesion area is 100 mm 2 (10 mm × 10 mm), and these are heated to 60 ° C. Lamination is performed under a pressure of 0.2 MPa and a lamination speed of 0.2 m / min to obtain a laminate. The laminate is then heated at 100 ° C. for 2 hours to cure the adhesive layer. Thereafter, the laminate is allowed to stand at 23 ° C. under a relative humidity of 50% for 24 hours to obtain a measurement sample. The shear load is measured at a shear rate of 0.1 mm / min using the obtained measurement sample.
[Requirements]
Requirement [1]: The maximum shear load (P 1 max ) is measured when the shear strain is less than 10,000%.
Requirement [2]: The value of the maximum shear load (P 1 max ) is 100 N or more.
Requirement [3]: The value of the shear load (P 1 10000% ) at a shear strain of 10,000% is 50% or more of the value of the maximum shear load (P 1 max ).
(2) The adhesive sheet according to (1), which satisfies the following requirement (4) when a shear test (B) is performed under the following conditions.
[Shear test (B)]
A measurement sample is produced in the same manner as the production method of the measurement sample in the shear test (A).
The measurement sample obtained is allowed to stand for 24 hours under conditions of a temperature of 60 ° C. and a relative humidity of 90% for 100 hours, and then under a condition of a temperature of 23 ° C. and a relative humidity of 50%. Measure the shear load at a shear rate of 0.1 mm / min.
[Requirements]
Requirement [4]: The value of the maximum shear load (P 2 max ) in the shear test (B) is 70% or more of the value of the maximum shear load (P 1 max ) in the shear test (1).
(3) The adhesive sheet according to (1) or (2), wherein the adhesive layer further contains a modified polyolefin resin.
(4) The adhesive sheet according to (3), wherein the content of the modified polyolefin resin is 40 to 90% by mass in the entire adhesive layer.
(5) The adhesive sheet according to any one of (1) to (4), wherein the adhesive layer further contains an imidazole-based curing catalyst.
(6) The adhesive sheet according to (5), wherein the content of the imidazole-based curing catalyst is 0.1 to 10 parts by mass with respect to 100 parts by mass of the polyfunctional epoxy compound contained in the adhesive layer.
(7) The adhesive sheet according to any one of (1) to (6), wherein the adhesive layer further contains a silane coupling agent.
(8) The adhesive sheet according to (7), wherein the content of the silane coupling agent is 0.01 to 2% by mass in the entire adhesive layer.
(9) The adhesive sheet according to any one of (1) to (8), wherein the thickness of the adhesive layer is 1 to 25 μm.
(10) The adhesive sheet according to any one of (1) to (9), further having a release film.
(11) A sealed body obtained by sealing an object to be sealed using the adhesive sheet according to any one of (1) to (10).
(12) The sealed body according to (11), wherein the object to be sealed is an organic EL element, an organic EL display element, a liquid crystal display element, or a solar cell element.
本発明の接着シートは、多官能エポキシ化合物を含有する熱硬化性の接着剤層を有する接着シートであって、多官能エポキシ化合物の含有量が、接着剤層全体中5~50質量%であり、上記のせん断試験(A)を行ったときに、上記の要件〔1〕~〔3〕を満たすことを特徴とするものである。 1) Adhesive sheet The adhesive sheet of the present invention is an adhesive sheet having a thermosetting adhesive layer containing a polyfunctional epoxy compound, and the content of the polyfunctional epoxy compound is 5 to 50 in the entire adhesive layer. It is a mass%, and when the above shear test (A) is performed, the above requirements [1] to [3] are satisfied.
本発明の接着シートを構成する接着剤層は、多官能エポキシ化合物を含有する。
多官能エポキシ化合物とは、分子内にエポキシ基を2つ以上有する化合物のことをいう。
多官能エポキシ化合物を含有する接着剤を用いることで、上記の要件〔1〕~〔3〕を満たす接着剤層を効率よく形成することができる。 [Adhesive layer]
The adhesive layer constituting the adhesive sheet of the present invention contains a polyfunctional epoxy compound.
The polyfunctional epoxy compound refers to a compound having two or more epoxy groups in the molecule.
By using an adhesive containing a polyfunctional epoxy compound, an adhesive layer satisfying the above requirements [1] to [3] can be efficiently formed.
多官能エポキシ化合物は、1種を単独で、あるいは2種以上を組み合わせて用いることができる。
多官能エポキシ化合物の分子量は、好ましくは50~10,000、より好ましくは100~5,000である。 As a polyfunctional epoxy compound, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, hydrogenated bisphenol A epoxy resin, hydrogenated bisphenol F epoxy resin, hydrogenated bisphenol S epoxy resin, bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, brominated bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether, brominated bisphenol S diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, water Added bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether, pentaerythritol polyglycidyl ether, 1,6-hexane Allyl diglycidyl ether, hexahydrophthalic acid diglycidyl ester, neopentyl glycol diglycidyl ether, trimethylolpropane polyglycidyl ether, 2,2-bis (3-glycidyl-4-glycidyloxyphenyl) propane, dimethylol tricyclode Candiglycidyl ether etc. are mentioned.
A polyfunctional epoxy compound can be used individually by 1 type or in combination of 2 or more types.
The molecular weight of the polyfunctional epoxy compound is preferably 50 to 10,000, more preferably 100 to 5,000.
多官能エポキシ化合物の含有量が少な過ぎる接着剤層は、上記の要件〔1〕、〔2〕を満たしにくくなり、接着性に劣る。一方、多官能エポキシ化合物の含有量が多過ぎる接着剤層は、上記の要件〔3〕を満たしにくくなり、硬化後の柔軟性に劣る。 The content of the polyfunctional epoxy compound is 5 to 50% by mass, preferably 10 to 40% by mass in the entire adhesive layer.
An adhesive layer containing too little content of a polyfunctional epoxy compound becomes difficult to satisfy above-mentioned requirements [1] and [2], and is inferior to adhesiveness. On the other hand, the adhesive layer having too much content of the polyfunctional epoxy compound is less likely to satisfy the above requirement [3], and is inferior in flexibility after curing.
変性ポリオレフィン系樹脂を含有する接着剤を用いることで、上記の要件〔1〕~〔3〕を満たす接着剤層を有する接着シートがより得られ易くなる。 The adhesive layer may contain a modified polyolefin resin as a component other than the polyfunctional epoxy compound.
By using an adhesive containing a modified polyolefin resin, an adhesive sheet having an adhesive layer satisfying the above requirements [1] to [3] can be more easily obtained.
オレフィン系単量体と共重合可能な単量体としては、酢酸ビニル、(メタ)アクリル酸エステル、スチレン等が挙げられる。ここで、「(メタ)アクリル酸」は、アクリル酸又はメタクリル酸の意味である(以下にて同じ。)。
これらのオレフィン系単量体と共重合可能な単量体は、1種を単独で、あるいは2種以上を組み合わせて用いることができる。 The olefin-based monomer is preferably an α-olefin having 2 to 8 carbon atoms, more preferably ethylene, propylene, 1-butene, isobutylene or 1-hexene, and still more preferably ethylene or propylene. These olefin monomers can be used alone or in combination of two or more.
As a monomer copolymerizable with an olefin type monomer, vinyl acetate, (meth) acrylic acid ester, styrene etc. are mentioned. Here, "(meth) acrylic acid" means acrylic acid or methacrylic acid (the same applies below).
The monomer copolymerizable with these olefin type monomers can be used individually by 1 type or in combination of 2 or more types.
官能基としては、カルボキシル基、カルボン酸無水物基、カルボン酸エステル基、水酸基、エポキシ基、アミド基、アンモニウム基、ニトリル基、アミノ基、イミド基、イソシアネート基、アセチル基、チオール基、エーテル基、チオエーテル基、スルホン基、ホスホン基、ニトロ基、ウレタン基、ハロゲン原子等が挙げられる。これらの中でも、カルボキシル基、カルボン酸無水物基、カルボン酸エステル基、水酸基、アンモニウム基、アミノ基、イミド基、イソシアネート基が好ましく、カルボン酸無水物基、アルコキシシリル基がより好ましく、カルボン酸無水物基が特に好ましい。
官能基を有する化合物は、分子内に2種以上の官能基を有していてもよい。 The modifier used to modify the polyolefin resin is a compound having a functional group in the molecule.
As a functional group, a carboxyl group, a carboxylic acid anhydride group, a carboxylic acid ester group, a hydroxyl group, an epoxy group, an amide group, an ammonium group, a nitrile group, an amino group, an imide group, an isocyanate group, an acetyl group, a thiol group, an ether group , Thioether group, sulfone group, phosphonic group, nitro group, urethane group, halogen atom and the like. Among these, a carboxyl group, a carboxylic acid anhydride group, a carboxylic acid ester group, a hydroxyl group, an ammonium group, an amino group, an imide group and an isocyanate group are preferable, a carboxylic acid anhydride group and an alkoxysilyl group are more preferable, and a carboxylic acid anhydride Particular preference is given to
The compound having a functional group may have two or more types of functional groups in the molecule.
これらは、1種を単独で、あるいは2種以上を組み合わせて用いることができる。これらの中でも、接着強度により優れる接着剤が得られ易いことから、無水マレイン酸が好ましい。 Examples of unsaturated carboxylic acids to be reacted with a polyolefin resin include unsaturated carboxylic acids such as maleic acid, fumaric acid, itaconic acid, citraconic acid, glutaconic acid, glutaronic acid, tetrahydrophthalic acid, aconitic acid, etc .; maleic anhydride, itaconic anhydride, anhydride And unsaturated carboxylic acid anhydrides such as glutaconic acid, citraconic acid anhydride, aconitic acid anhydride, norbornene dicarboxylic acid anhydride, and tetrahydrophthalic acid anhydride.
These can be used singly or in combination of two or more. Among these, maleic anhydride is preferable because an adhesive that is more excellent in adhesive strength can be easily obtained.
不飽和シラン化合物を主鎖であるポリオレフィン樹脂にグラフト重合させる場合の条件は、公知のグラフト重合法を採用すればよい。 As the unsaturated silane compound to be reacted with the above-mentioned polyolefin resin, a vinylsilane compound is preferable. For example, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltripropoxysilane, vinyltriisopropoxysilane, vinyltributoxysilane, vinyltripentyloxy Silane, vinyltriphenoxysilane, vinyltribenzyloxysilane, vinyltrimethylenedioxysilane, vinyltriethylenedioxysilane, vinylpropionyloxysilane, vinyltriacetoxysilane, vinyltricarboxysilane and the like can be mentioned. These can be used alone or in combination of two or more.
The conditions in the case of graft-polymerizing an unsaturated silane compound to the polyolefin resin which is a principal chain may adopt a well-known graft polymerization method.
変性ポリオレフィン系樹脂の数平均分子量(Mn)は、テトラヒドロフラン(THF)を溶媒として用いてゲルパーミエーションクロマトグラフィー(GPC)を行い、標準ポリスチレン換算値として求めることができる。 The number average molecular weight (Mn) of the modified polyolefin resin is preferably 10,000 to 2,000,000, and more preferably 20,000 to 1,500,000.
The number average molecular weight (Mn) of the modified polyolefin resin can be determined as a standard polystyrene conversion value by gel permeation chromatography (GPC) using tetrahydrofuran (THF) as a solvent.
変性ポリオレフィン系樹脂の含有量が上記範囲内であることで、その接着剤層は上記の要件〔1〕~〔3〕をより満たし易くなる。 When the adhesive layer contains a modified polyolefin resin, the content of the modified polyolefin resin is preferably 40 to 90% by mass, more preferably 50 to 80% by mass, based on the entire adhesive layer.
When the content of the modified polyolefin resin is in the above range, the adhesive layer can more easily satisfy the requirements [1] to [3].
イミダゾール系硬化触媒を含有する接着剤を用いることで、上記の要件〔1〕~〔3〕を満たす接着剤層を有する接着シートがより得られ易くなる。 The adhesive layer may contain an imidazole-based curing catalyst as a component other than the polyfunctional epoxy compound.
By using an adhesive containing an imidazole curing catalyst, an adhesive sheet having an adhesive layer satisfying the above requirements [1] to [3] can be more easily obtained.
これらのイミダゾール系硬化触媒は、1種を単独で、あるいは2種以上を組み合わせて用いることができる。 As an imidazole series curing catalyst, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl -4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and the like. Among these, 2-ethyl-4-methylimidazole is preferable.
These imidazole curing catalysts can be used alone or in combination of two or more.
シランカップリング剤を含有する接着剤を用いることで、上記の要件〔1〕~〔3〕を満たす接着剤層を有する接着シートがより得られ易くなる。 The adhesive layer may contain a silane coupling agent as a component other than the polyfunctional epoxy compound.
By using an adhesive containing a silane coupling agent, an adhesive sheet having an adhesive layer satisfying the above requirements [1] to [3] can be more easily obtained.
シランカップリング剤としては、ビニルトリメトキシシラン、ビニルトリエトキシシラン、メタクリロキシプロピルトリメトキシシラン等の重合性不飽和基含有ケイ素化合物;3-グリシドキシプロピルトリメトキシシラン、2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン等のエポキシ構造を有するケイ素化合物;3-アミノプロピルトリメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルトリメトキシシラン、N-(2-アミノエチル)-3-アミノプロピルメチルジメトキシシラン等のアミノ基含有ケイ素化合物;3-クロロプロピルトリメトキシシラン;3-イソシアネートプロピルトリエトキシシラン;等が挙げられる。
これらのシランカップリング剤は、1種単独で、あるいは2種以上を組み合わせて用いることができる。 A well-known silane coupling agent can be used as a silane coupling agent. Among them, organic silicon compounds having at least one alkoxysilyl group in the molecule are preferable.
As a silane coupling agent, polymerizable unsaturated group-containing silicon compounds such as vinyltrimethoxysilane, vinyltriethoxysilane, methacryloxypropyltrimethoxysilane and the like; 3-glycidoxypropyltrimethoxysilane, 2- (3,4 Silicon compounds having an epoxy structure such as -epoxycyclohexyl) ethyltrimethoxysilane; 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) Amino group-containing silicon compounds such as -3-aminopropylmethyldimethoxysilane; 3-chloropropyltrimethoxysilane; 3-isocyanatopropyltriethoxysilane; and the like.
These silane coupling agents can be used singly or in combination of two or more.
シランカップリング剤の含有量が上記範囲内であることで、その接着剤層は上記の要件〔1〕~〔3〕をより満たし易くなる。 When the adhesive layer contains a silane coupling agent, the content of the silane coupling agent is preferably 0.01 to 2% by mass, more preferably 0.05 to 1% by mass, based on the entire adhesive layer. .
When the content of the silane coupling agent is in the above range, the adhesive layer can more easily satisfy the requirements [1] to [3].
その他の成分としては、紫外線吸収剤、帯電防止剤、光安定剤、酸化防止剤、樹脂安定剤、充填剤、顔料、増量剤、軟化剤等の添加剤が挙げられる。
これらは1種単独で、あるいは2種以上を組み合わせて用いることができる。
接着剤層がこれらの添加剤を含有する場合、その含有量は、目的に合わせて適宜決定することができる。 The adhesive layer may contain other components as long as the effects of the present invention are not impaired.
Other components include additives such as ultraviolet light absorbers, antistatic agents, light stabilizers, antioxidants, resin stabilizers, fillers, pigments, extenders, and softeners.
These can be used singly or in combination of two or more.
When the adhesive layer contains these additives, the content can be appropriately determined according to the purpose.
接着剤層は熱硬化性を有するものである。すなわち、接着剤層を加熱することにより、少なくとも多官能エポキシ化合物のエポキシ基が反応し、接着剤層が硬化する。
接着剤層を熱硬化させる際の条件は特に限定されない。
加熱温度は、通常、80~200℃、好ましくは90~150℃である。
加熱時間は、通常、30分から12時間、好ましくは1~6時間である。
硬化後の接着剤層の水蒸気透過率は、通常、0.1~200g・m-2・day-1、好ましくは1~150g・m-2・day-1である。
水蒸気透過率は、公知のガス透過率測定装置を使用して測定することができる。 The thickness of the adhesive layer is preferably 1 to 25 μm, more preferably 3 to 20 μm.
The adhesive layer has a thermosetting property. That is, by heating the adhesive layer, at least the epoxy group of the polyfunctional epoxy compound is reacted to cure the adhesive layer.
The conditions at which the adhesive layer is thermally cured are not particularly limited.
The heating temperature is usually 80 to 200 ° C., preferably 90 to 150 ° C.
The heating time is usually 30 minutes to 12 hours, preferably 1 to 6 hours.
The water vapor transmission rate of the adhesive layer after curing is usually 0.1 to 200 g · m −2 · day −1 , preferably 1 to 150 g · m −2 · day −1 .
The water vapor permeability can be measured using known gas permeability measuring devices.
〔せん断試験(A)〕
短辺が10mmの長方形の無アルカリガラスを2枚用意し、これらの中の1枚の無アルカリガラス上に、1辺が10mmの正方形の接着剤層を接着面積が100mm2(10mm×10mm)になるように配置し、これらを温度60℃、圧力0.2MPa、ラミネート速度0.2m/分の条件でラミネートする。次いで、前記接着剤層の、無アルカリガラスと接していない側の面に、もう1枚の無アルカリガラスを接着面積が100mm2(10mm×10mm)になるように重ね、これらを温度60℃、圧力0.2MPa、ラミネート速度0.2m/分の条件でラミネートし積層体を得る。次いで、この積層体を100℃で2時間加熱してその接着剤層を硬化させる。その後、積層体を23℃、相対湿度50%の条件下で24時間静置し、測定試料を得る。得られた測定試料を用いて、せん断速度0.1mm/分の条件、および室温23℃、相対湿度50%の雰囲気下でせん断荷重を測定する。 The adhesive layer satisfies the following requirements [1] to [3] when the shear test (A) is performed under the following conditions.
[Shear test (A)]
Prepare two rectangular alkali-free glasses with a short side of 10 mm, and on one of these sheets of alkali-free glass, a square adhesive layer with a side of 10 mm and a bonding area of 100 mm 2 (10 mm × 10 mm) Then, they are laminated at a temperature of 60 ° C., a pressure of 0.2 MPa, and a laminating speed of 0.2 m / min. Next, another non-alkali glass is stacked on the side of the adhesive layer not in contact with the non-alkali glass so that the adhesion area is 100 mm 2 (10 mm × 10 mm), and these are heated to 60 ° C. Lamination is performed under a pressure of 0.2 MPa and a lamination speed of 0.2 m / min to obtain a laminate. The laminate is then heated at 100 ° C. for 2 hours to cure the adhesive layer. Thereafter, the laminate is allowed to stand at 23 ° C. under a relative humidity of 50% for 24 hours to obtain a measurement sample. The shear load is measured under the conditions of a shear rate of 0.1 mm / min and an atmosphere at a room temperature of 23 ° C. and a relative humidity of 50% using the obtained measurement sample.
要件〔2〕:最大せん断荷重(P1 max)の値が100N以上である。
要件〔3〕:せん断歪み10,000%のときのせん断荷重(P1 10000%)の値が、最大せん断荷重(P1 max)の値の50%以上である。 Requirement [1]: The maximum shear load (P 1 max ) is measured when the shear strain is less than 10,000%.
Requirement [2]: The value of the maximum shear load (P 1 max ) is 100 N or more.
Requirement [3]: The value of the shear load (P 1 10000% ) at a shear strain of 10,000% is 50% or more of the value of the maximum shear load (P 1 max ).
本発明の接着シートの接着剤層は、せん断試験(A)を行ったときに上記要件〔1〕を満たすものである。すなわち、本発明の接着シートの接着剤層は、最大せん断荷重(P1 max)がせん断歪み10,000%未満のときに測定されるものである。
要件〔1〕を満たす接着剤層は、封止性の観点で好ましい。
接着剤層中に多官能エポキシ樹脂を5~50質量%含有させることで、要件〔1〕を満たす接着剤層が得られ易くなる。 Shear test (A) is a test to evaluate the shear properties of the adhesive under normal conditions.
The adhesive layer of the adhesive sheet of the present invention satisfies the requirement [1] when the shear test (A) is performed. That is, the adhesive layer of the adhesive sheet of the present invention is one that is measured when the maximum shear load (P 1 max ) is less than 10,000% shear strain.
The adhesive layer satisfying the requirement [1] is preferable from the viewpoint of sealability.
By including 5 to 50% by mass of the polyfunctional epoxy resin in the adhesive layer, an adhesive layer satisfying the requirement [1] can be easily obtained.
要件〔2〕を満たす接着剤層は、封止性の観点で好ましい。
接着剤層中に多官能エポキシ樹脂を5~50質量%含有させることで、要件〔2〕を満たす接着剤層が得られ易くなる。 The adhesive layer of the adhesive sheet of the present invention satisfies the requirement [2] when the shear test (A) is performed. That is, the adhesive layer of the adhesive sheet of the present invention has a maximum shear load (P 1 max ) value of 100 N or more.
The adhesive layer satisfying the requirement [2] is preferable from the viewpoint of sealability.
By including 5 to 50% by mass of the polyfunctional epoxy resin in the adhesive layer, an adhesive layer satisfying the requirement [2] can be easily obtained.
要件〔3〕を満たす接着剤層は、被封止物を封止した際の柔軟性の観点で好ましい。
接着剤層中に多官能エポキシ樹脂を5~50質量%含有させることで、要件〔3〕を満たす接着剤層が得られ易くなる。
さらに、接着剤層に変性ポリオレフィン系樹脂を含有させることで、要件〔3〕を満たす接着剤層がより得られ易くなる。 The adhesive layer of the adhesive sheet of the present invention satisfies the requirement [3] when the shear test (A) is performed. That is, in the adhesive layer of the adhesive sheet of the present invention, the shear load (P 1 10000% ) at a shear strain of 10,000% is 50% or more of the value of the maximum shear load (P 1 max ) It is.
The adhesive layer satisfying the requirement [3] is preferable from the viewpoint of flexibility when sealing the object to be sealed.
By including 5 to 50% by mass of the multifunctional epoxy resin in the adhesive layer, an adhesive layer satisfying the requirement [3] can be easily obtained.
Furthermore, by containing the modified polyolefin resin in the adhesive layer, an adhesive layer satisfying the requirement [3] can be more easily obtained.
〔せん断試験(B)〕
せん断試験(A)における測定試料の作製方法と同様にして測定試料を作製する。
得られた測定試料を、温度60℃、相対湿度90%の条件下に100時間、次いで、温度23℃、相対湿度50%の条件下に24時間静置させた後に、この測定試料を用いて、せん断速度0.1mm/分の条件、および室温23℃、相対湿度50%の雰囲気下でせん断荷重を測定する。
要件〔4〕:せん断試験(B)における最大せん断荷重(P2 max)の値が、せん断試験(A)における最大せん断荷重(P1 max)の値の70%以上である。 The adhesive layer of the adhesive sheet of the present invention preferably satisfies the following requirement [4] when the shear test (B) is performed under the following conditions.
[Shear test (B)]
A measurement sample is produced in the same manner as the production method of the measurement sample in the shear test (A).
The measurement sample obtained is allowed to stand for 24 hours under conditions of a temperature of 60 ° C. and a relative humidity of 90% for 100 hours, and then under a condition of a temperature of 23 ° C. and a relative humidity of 50%. The shear load is measured under conditions of a shear rate of 0.1 mm / min and an atmosphere at a room temperature of 23 ° C. and a relative humidity of 50%.
Requirement [4]: The value of the maximum shear load (P 2 max ) in the shear test (B) is 70% or more of the value of the maximum shear load (P 1 max ) in the shear test (A).
要件〔4〕を満たす接着剤層は、被封止物を封止した後の耐久性に優れる点で好ましい。
接着剤層にシランカップリング剤を含有させることで、要件〔4〕を満たす接着剤層が得られ易くなる。 The shear test (B) is a test to evaluate the shear properties of the adhesive layer after being placed under high humidity conditions.
The adhesive layer satisfying the requirement [4] is preferable in that it has excellent durability after sealing the object to be sealed.
By including a silane coupling agent in the adhesive layer, an adhesive layer satisfying the requirement [4] can be easily obtained.
本発明の接着シートは、剥離フィルムを有していてもよい。
剥離フィルムは、接着シートの製造工程においては支持体として機能するとともに、接着シートを使用するまでの間は、接着剤層の保護シートとして機能するものである。
本発明の接着シートを使用する際は、通常、剥離フィルムは剥離除去される。 [Peeling film]
The adhesive sheet of the present invention may have a release film.
The release film functions as a support in the manufacturing process of the adhesive sheet, and also functions as a protective sheet of the adhesive layer until the adhesive sheet is used.
When using the adhesive sheet of the present invention, the release film is usually peeled off.
剥離フィルム用の基材としては、グラシン紙、コート紙、上質紙等の紙基材;これらの紙基材にポリエチレン等の熱可塑性樹脂をラミネートしたラミネート紙;ポリエチレンテレフタレート樹脂、ポリブチレンテレフタレート樹脂、ポリエチレンナフタレート樹脂、ポリプロピレン樹脂、ポリエチレン樹脂等のプラスチックフィルム;等が挙げられる。
剥離剤としては、シリコーン系樹脂、オレフィン系樹脂、イソプレン系樹脂、ブタジエン系樹脂等のゴム系エラストマー、長鎖アルキル系樹脂、アルキド系樹脂、フッ素系樹脂等が挙げられる。 As a peeling film, a conventionally well-known thing can be utilized. For example, what has a peeling layer in which the peeling process was carried out by the peeling agent on the base material for peeling films is mentioned.
As substrates for release films, paper substrates such as glassine paper, coated paper, high-quality paper, etc .; laminated paper obtained by laminating a thermoplastic resin such as polyethylene on these paper substrates; polyethylene terephthalate resin, polybutylene terephthalate resin, Plastic films, such as polyethylene naphthalate resin, a polypropylene resin, polyethylene resin ;; etc. are mentioned.
Examples of the release agent include silicone resins, olefin resins, isoprene resins, rubber elastomers such as butadiene resins, long chain alkyl resins, alkyd resins, fluorine resins and the like.
接着シートの製造方法は特に限定されない。例えば、キャスト法を用いて、接着シートを製造することができる。
接着シートをキャスト法により製造する場合、例えば、接着剤層の成分と溶媒を含有する塗工液を調製し、得られた塗工液を剥離フィルムの剥離処理面に塗工し、得られた塗膜を乾燥することで、剥離フィルム付接着剤層を製造し、次いで、もう1枚の剥離フィルムを接着剤層上に重ねることで、接着シートを得ることができる。 [Adhesive sheet]
The method for producing the adhesive sheet is not particularly limited. For example, an adhesive sheet can be manufactured using a cast method.
When the adhesive sheet is produced by a casting method, for example, a coating liquid containing the components of the adhesive layer and a solvent is prepared, and the obtained coating liquid is applied to the release treated surface of the release film, and thus obtained. By drying the coated film, an adhesive layer with a release film can be produced, and then, another release film can be laminated on the adhesive layer to obtain an adhesive sheet.
これらの溶媒は、1種単独で、あるいは2種以上を組み合わせて用いることができる。
溶媒の含有量は、塗工性等を考慮して適宜決定することができる。 Examples of solvents used for preparation of the coating liquid include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; n-pentane And aliphatic hydrocarbon solvents such as n-hexane and n-heptane; alicyclic hydrocarbon solvents such as cyclopentane, cyclohexane and methylcyclohexane; and the like.
These solvents can be used alone or in combination of two or more.
The content of the solvent can be appropriately determined in consideration of coating properties and the like.
塗膜を乾燥するときの乾燥条件としては、例えば、乾燥温度80~150℃、乾燥時間30秒から5分間が挙げられる。 As a method of applying a coating liquid, a spin coat method, a spray coat method, a bar coat method, a knife coat method, a roll coat method, a blade coat method, a die coat method, a gravure coat method etc. are mentioned, for example.
Drying conditions for drying the coating include, for example, a drying temperature of 80 to 150 ° C., and a drying time of 30 seconds to 5 minutes.
本発明の封止体は、被封止物が、本発明の接着シートを用いて封止されてなるものである。
本発明の封止体としては、例えば、基板と、該基板上に形成された素子(被封止物)と、該素子を封止するための封止材とを備えるものであって、前記封止材が本発明の接着シートの接着剤層由来のもの(接着剤層の硬化物)であるものが挙げられる。 3) Sealed body The sealed body of the present invention is obtained by sealing an object to be sealed using the adhesive sheet of the present invention.
The sealing body of the present invention includes, for example, a substrate, an element (object to be sealed) formed on the substrate, and a sealing material for sealing the element. What is a thing derived from the adhesive bond layer of the adhesive sheet of this invention (hardened material of an adhesive bond layer) is mentioned for a sealing material.
基板の厚さは特に制限されず、光の透過率や、素子内外を遮断する性能を勘案して、適宜選択することができる。 The substrate is not particularly limited, and various substrate materials can be used. In particular, it is preferable to use a substrate material having a high visible light transmittance. In addition, a material having a high blocking performance to block moisture and gas from the outside of the element and having excellent solvent resistance and weather resistance is preferable. Specifically, transparent inorganic materials such as quartz and glass; polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polystyrene, polyethylene, polypropylene, polyphenylene sulfide, polyvinylidene fluoride, acetyl cellulose, brominated phenoxy, aramids, polyimides, Transparent plastics, such as polystyrenes, polyarylates, polysulfones, polyolefins, and the gas barrier film mentioned above;
The thickness of the substrate is not particularly limited, and can be appropriately selected in consideration of the light transmittance and the performance of blocking the inside and outside of the device.
次いで、この接着剤層を硬化させることにより、本発明の封止体を製造することができる。 The manufacturing method of the sealing body of this invention is not specifically limited. For example, after the adhesive layer of the adhesive sheet of the present invention is stacked on an object to be sealed, the adhesive layer of the adhesive sheet is adhered to the object by heating.
Then, the adhesive layer is cured to produce the sealed body of the present invention.
接着剤層を硬化させる際の硬化条件としては、先に説明した条件を利用することができる。 The bonding conditions for bonding the adhesive layer of the adhesive sheet and the object to be sealed are not particularly limited. The adhesion temperature is, for example, 23 to 100 ° C., preferably 40 to 80 ° C. This adhesion process may be performed while applying pressure.
As the curing conditions for curing the adhesive layer, the conditions described above can be used.
したがって、本発明の封止体においては、長期にわたって被封止物の性能が維持される。 The sealed body of the present invention is obtained by sealing an object to be sealed with the adhesive sheet of the present invention.
Therefore, in the sealed body of the present invention, the performance of the sealed object is maintained for a long time.
各例中の部及び%は、特に断りのない限り、質量基準である。 Hereinafter, the present invention will be described in more detail by way of examples. However, the present invention is not limited to the following examples.
Parts and% in each example are based on mass unless otherwise noted.
酸変性ポリオレフィン系樹脂(酸変性α-オレフィン重合体、三井化学社製、商品名:ユニストールH-200、数平均分子量:47,000)76.6部、多官能エポキシ化合物(1)(水添ビスフェノールA型エポキシ樹脂、三菱化学社製、商品名:YX8034、エポキシ当量270g/eq)23.0部、イミダゾール系硬化触媒(四国化成社製、商品名:キュアゾール2E4MZ、2-エチル-4-メチルイミダゾール)0.3部、及び、シランカップリング剤(1)(8-グリシドキシオクチルトリメトキシシラン、信越化学工業社製、商品名:KBM4803)0.1部をメチルエチルケトンに溶解し、固形分濃度18%の接着剤組成物1を調製した。
この接着剤組成物1を剥離フィルム(リンテック社製、商品名:SP-PET382150)の剥離処理面上に塗工し、得られた塗膜を100℃で2分間乾燥し、厚みが10μmの接着剤層を形成し、その上に、もう1枚の剥離フィルム(リンテック社製、商品名:SP-PET381031)の剥離処理面を貼り合わせて接着シート1を得た。 Example 1
Acid-modified polyolefin resin (acid-modified α-olefin polymer, manufactured by Mitsui Chemicals, trade name: Unistol H-200, number average molecular weight: 47,000) 76.6 parts, multifunctional epoxy compound (1) (water Added bisphenol A type epoxy resin, manufactured by Mitsubishi Chemical Co., Ltd., trade name: YX8034, 23.0 parts of epoxy equivalent weight, imidazole-based curing catalyst (manufactured by Shikoku Kasei Co., Ltd., trade name: Cuazole 2E4MZ, 2-ethyl-4-) 0.3 part of methylimidazole and 0.1 part of silane coupling agent (1) (8-glycidoxyoctyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM4803) are dissolved in methyl ethyl ketone and solid Adhesive composition 1 having a concentration of 18% was prepared.
This adhesive composition 1 is coated on the release-treated surface of a release film (Lintech Co., Ltd., trade name: SP-PET 382150), and the obtained coating film is dried at 100 ° C. for 2 minutes, and has a thickness of 10 μm An agent layer was formed, and the release-treated surface of another release film (Lintech Co., Ltd., trade name: SP-PET 381031) was bonded thereon to obtain an adhesive sheet 1.
実施例1において、多官能エポキシ化合物(1)に代えて、多官能エポキシ化合物(2)(水添ビスフェノールA型エポキシ樹脂、三菱化学社製、商品名:YX8000、エポキシ当量205g/eq)を使用したことを除き、実施例1と同様にして、接着剤組成物2を調製し、これを用いて接着シート2を得た。 Example 2
In Example 1, in place of the polyfunctional epoxy compound (1), a polyfunctional epoxy compound (2) (hydrogenated bisphenol A type epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name: YX 8000, epoxy equivalent 205 g / eq) is used An adhesive composition 2 was prepared in the same manner as in Example 1 except for the above, and an adhesive sheet 2 was obtained using this.
実施例1において、多官能エポキシ化合物(1)に代えて、多官能エポキシ化合物(3)(水添ビスフェノールA型エポキシ樹脂、三菱化学社製、商品名:YX8040、エポキシ当量1100g/eq)を使用したことを除き、実施例1と同様にして、接着剤組成物3を調製し、これを用いて接着シート3を得た。 [Example 3]
In Example 1, in place of the polyfunctional epoxy compound (1), a polyfunctional epoxy compound (3) (hydrogenated bisphenol A epoxy resin, manufactured by Mitsubishi Chemical Corporation, trade name: YX8040, epoxy equivalent: 1100 g / eq) is used An adhesive composition 3 was prepared in the same manner as in Example 1 except for the above, and an adhesive sheet 3 was obtained using this.
実施例1において、シランカップリング剤(1)に代えて、シランカップリング剤(2)(3-グリシドキシプロピルトリメトキシシラン、信越化学工業社製、商品名:KBM403)を使用したことを除き、実施例1と同様にして、接着剤組成物4を調製し、これを用いて接着シート4を得た。 Example 4
In Example 1, in place of the silane coupling agent (1), a silane coupling agent (2) (3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM 403) is used. An adhesive composition 4 was prepared in the same manner as in Example 1 except for the above, and an adhesive sheet 4 was obtained using this.
実施例1において、多官能エポキシ化合物(1)に代えて、多官能エポキシ化合物(4)(水添ビスフェノールAジグリシジルエーテル、共栄社化学社製、商品名:エポライト4000、エポキシ当量215~245g/eq)を使用したことを除き、実施例1と同様にして、接着剤組成物5を調製し、これを用いて接着シート5を得た。 [Example 5]
In Example 1, in place of the polyfunctional epoxy compound (1), polyfunctional epoxy compound (4) (hydrogenated bisphenol A diglycidyl ether, manufactured by Kyoeisha Chemical Co., Ltd., trade name: Epolite 4000, epoxy equivalent weight 215 to 245 g / eq The adhesive composition 5 was prepared in the same manner as in Example 1 except that the above was used, to obtain an adhesive sheet 5.
実施例5において、シランカップリング剤(1)に代えて、シランカップリング剤(2)(3-グリシドキシプロピルトリメトキシシラン、信越化学工業社製、商品名:KBM403)を使用したことを除き、実施例5と同様にして、接着剤組成物6を調製し、これを用いて接着シート6を得た。 [Example 6]
In Example 5, in place of the silane coupling agent (1), a silane coupling agent (2) (3-glycidoxypropyltrimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KBM 403) was used. An adhesive composition 6 was prepared in the same manner as in Example 5 except for the above, and an adhesive sheet 6 was obtained using this.
実施例1において、多官能エポキシ化合物(1)を使用しなかったことを除き、実施例1と同様にして、接着剤組成物7を調製し、これを用いて接着シート7を得た。 Comparative Example 1
An adhesive composition 7 was prepared in the same manner as in Example 1 except that the multifunctional epoxy compound (1) was not used in Example 1, and an adhesive sheet 7 was obtained using this.
攪拌機、温度計、還流冷却器、滴下装置及び窒素導入管を備えた反応容器に、n-ブチルアクリレート77部、メチルアクリレート20部、アクリル酸3部、酢酸エチル200部、2,2'-アゾビスイソブチロニトリル0.16部を仕込み、窒素ガス雰囲気下、70℃で共重合反応を行い、重量平均分子量(Mw)800,000のアクリル系重合体(1)を得た。
アクリル系重合体(1)97.4部、トリレンジイソシアネートのトリメチロールプロパンアダクト体2.3部、アルミニウムトリスアセチルアセトナート0.3部を、トルエン/酢酸エチルの混合溶媒〔混合割合(体積比):3/2〕に溶解させ、固形分濃度21%の接着剤組成物8を調製した。接着剤組成物8を使用したことを除き、実施例1と同様にして接着シート8を得た。 Comparative Example 2
77 parts of n-butyl acrylate, 20 parts of methyl acrylate, 3 parts of acrylic acid, 200 parts of ethyl acetate, 2,2'-azo, in a reaction vessel equipped with a stirrer, thermometer, reflux condenser, dropping device and nitrogen introducing pipe 0.16 parts of bisisobutyronitrile was charged, and the copolymerization was carried out at 70 ° C. in a nitrogen gas atmosphere to obtain an acrylic polymer (1) having a weight average molecular weight (Mw) of 800,000.
97.4 parts of acrylic polymer (1), 2.3 parts of trimethylolpropane adduct of tolylene diisocyanate, 0.3 parts of aluminum trisacetylacetonate, mixed solvent of toluene / ethyl acetate [mixing ratio (volume ratio) ): 3/2] to prepare an adhesive composition 8 having a solid concentration of 21%. An adhesive sheet 8 was obtained in the same manner as in Example 1, except that the adhesive composition 8 was used.
攪拌機、温度計、還流冷却器、滴下装置及び窒素導入管を備えた反応容器に、2-エチルヘキシルアクリレート60部、メチルメタクリレート20部、ヒドロキシエチルアクリレート20部、酢酸エチル200部、2,2’-アゾビスイソブチロニトリル0.16部を仕込み、窒素ガス雰囲気下、70℃で共重合反応を行い、重量平均分子量(Mw)700,000のアクリル系重合体(2)を得た。
アクリル系重合体(2)99.5部、トリレンジイソシアネートのトリメチロールプロパンアダクト体0.2部、3-グリシドキシプロピルトリメトキシシラン0.3部を酢酸エチル/メチルエチルケトンの混合溶媒〔混合割合(体積比):4/1〕に溶解させ、固形分濃度35%の接着剤組成物9を調製した。接着剤組成物9を使用したことを除き、実施例1と同様にして接着シート9を得た。 Comparative Example 3
60 parts of 2-ethylhexyl acrylate, 20 parts of methyl methacrylate, 20 parts of hydroxyethyl acrylate, 200 parts of ethyl acetate, 2,2'-, in a reaction vessel equipped with a stirrer, thermometer, reflux condenser, dropping device and nitrogen introduction pipe 0.16 parts of azobisisobutyronitrile was charged, and a copolymerization reaction was carried out at 70 ° C. in a nitrogen gas atmosphere to obtain an acrylic polymer (2) having a weight average molecular weight (Mw) of 700,000.
99.5 parts of acrylic polymer (2), 0.2 part of trimethylolpropane adduct of tolylene diisocyanate, 0.3 part of 3-glycidoxypropyltrimethoxysilane in mixed solvent of ethyl acetate / methyl ethyl ketone [mixing ratio (Volume ratio): 4/1] was dissolved to prepare an adhesive composition 9 having a solid content concentration of 35%. An adhesive sheet 9 was obtained in the same manner as in Example 1, except that the adhesive composition 9 was used.
イソブチレンとイソプレンの共重合体(日本ブチル社製、Exxon Butyl 268、数平均分子量260,000、イソプレンの含有率1.7モル%)100部に対し、カルボン酸系官能基を有するポリイソプレンゴム(クラレ社製、LIR410、数平均分子量30,000、1分子あたりの平均カルボキシル基数:10)5部、脂肪族系石油樹脂(日本ゼオン社製、クイントンA100、軟化点100℃)20部、架橋剤(エポキシ化合物、三菱化学社製、TC-5)1部をトルエンに溶解し、固形分濃度25%の接着剤組成物10を得た。接着剤組成物10を使用したことを除き、実施例1と同様にして接着シート10を得た。 Comparative Example 4
Polyisoprene rubber (having a carboxylic acid functional group) per 100 parts of a copolymer of isobutylene and isoprene (manufactured by Nippon Butyl Co., Exxon Butyl 268, number average molecular weight 260,000, content of isoprene 1.7 mol%) ( Kuraray LIR 410, number average molecular weight 30,000, average number of carboxyl groups per molecule: 10, 5 parts, aliphatic petroleum resin (Nippon Zeon Co., Quinton A100, softening point 100 ° C.) 20 parts, crosslinking agent One part of an epoxy compound (TC-5, manufactured by Mitsubishi Chemical Corporation) was dissolved in toluene to obtain an adhesive composition 10 having a solid content concentration of 25%. An adhesive sheet 10 was obtained in the same manner as Example 1, except that the adhesive composition 10 was used.
〔せん断試験(A)〕
実施例又は比較例で得た接着シートを、1辺が10mmの正方形に加工した。
短辺が10mmの長方形の無アルカリガラスを2枚用意した。上記の正方形の接着シートの剥離フィルムを1枚剥がし、残った接着シートを、露出した接着剤層が無アルカリガラスに対向し、かつ、接着面積が100mm2(10mm×10mm)になるように無アルカリガラス上に配置し、加圧ローラーを用いて、これらを温度60℃、圧力0.2MPa、ラミネート速度0.2m/分の条件でラミネートした。次いで、もう1枚の剥離フィルムを剥がし、露出した接着剤層上にもう1枚の無アルカリガラスを接着面積が100mm2(10mm×10mm)になるように重ね、加圧ローラーを用いて、これらを温度60℃、圧力0.2MPa、ラミネート速度0.2m/分の条件でラミネートし積層体を得た。
次いで、この積層体を100℃で2時間加熱してその接着剤層を硬化させた。その後、積層体を23℃、相対湿度50%の条件下で24時間静置し、測定試料を得た。
得られた測定試料を用いて、せん断速度0.1mm/分の条件でせん断荷重を測定した。 The following tests were conducted on the adhesive sheets 1 to 10 obtained in Examples 1 to 6 and Comparative Examples 1 to 4.
[Shear test (A)]
The adhesive sheet obtained in the example or the comparative example was processed into a square having a side of 10 mm.
Two pieces of rectangular alkali-free glass having a short side of 10 mm were prepared. The peeling film of the above-mentioned square adhesive sheet is peeled off, and the remaining adhesive sheet is not present so that the exposed adhesive layer faces the non-alkali glass and the adhesion area is 100 mm 2 (10 mm × 10 mm). They were placed on alkali glass and laminated using a pressure roller at a temperature of 60 ° C., a pressure of 0.2 MPa, and a laminating speed of 0.2 m / min. Then, another release film is peeled off, another alkali-free glass is overlaid on the exposed adhesive layer so that the adhesion area is 100 mm 2 (10 mm × 10 mm), and these are applied using a pressure roller. Were laminated under conditions of a temperature of 60 ° C., a pressure of 0.2 MPa and a laminating speed of 0.2 m / min to obtain a laminate.
The laminate was then heated at 100 ° C. for 2 hours to cure the adhesive layer. Thereafter, the laminate was allowed to stand at 23 ° C. under a relative humidity of 50% for 24 hours to obtain a measurement sample.
The shear load was measured at a shear rate of 0.1 mm / min using the obtained measurement sample.
せん断試験(A)における測定試料の作製方法と同様にして測定試料を作製した。
得られた測定試料を、温度60℃、相対湿度90%の条件下に100時間、次いで、温度23℃、相対湿度50%の条件下に24時間静置させた後に、この測定試料を用いて、せん断速度0.1mm/分の条件でせん断荷重を測定した。 [Shear test (B)]
A measurement sample was produced in the same manner as the production method of the measurement sample in the shear test (A).
The measurement sample obtained is allowed to stand for 24 hours under conditions of a temperature of 60 ° C. and a relative humidity of 90% for 100 hours, and then under a condition of a temperature of 23 ° C. and a relative humidity of 50%. The shear load was measured at a shear rate of 0.1 mm / min.
酸化インジウムスズ(ITO)膜(厚み:100nm、シート抵抗:50Ω/□(オーム・パー・スクウェア)が成膜されたガラス基板を陽極として有する有機EL素子を、以下の方法により作製した。
まず、前記ガラス基板のITO膜上に、N,N’-ビス(ナフタレン-1-イル)-N,N’-ビス(フェニル)-ベンジジン)(Luminescence Technology社製)を50nm、トリス(8-ヒドロキシ-キノリネート)アルミニウム(Luminescence Technology社製)を50nm、0.1~0.2nm/分の速度で順次蒸着させ、発光層を形成した。
得られた発光層上に、電子注入材料として、フッ化リチウム(LiF)(高純度化学研究所社製)を0.1nm/分の速度で4nm、次いでアルミニウム(Al)(高純度化学研究所社製)を0.1nm/分の速度で100nm蒸着させて陰極を形成し、有機EL素子を得た。
なお、蒸着時の真空度は、全て1×10-4Pa以下であった。 [Evaluation test of organic EL element]
An organic EL element having a glass substrate on which an indium tin oxide (ITO) film (thickness: 100 nm, sheet resistance: 50 Ω / □ (ohm / square)) was formed as an anode was manufactured by the following method.
First, 50 nm of N, N'-bis (naphthalen-1-yl) -N, N'-bis (phenyl) -benzidine) (manufactured by Luminescence Technology) on the ITO film of the glass substrate, Tris (8-) A light emitting layer was formed by sequentially depositing hydroxy-quinolinate) aluminum (manufactured by Luminescence Technology) at a rate of 50 nm, 0.1 to 0.2 nm / min.
Lithium fluoride (LiF) (manufactured by High Purity Chemical Laboratory Co., Ltd.) 4 nm at a rate of 0.1 nm / min as an electron injecting material on the obtained light emitting layer, then aluminum (Al) (high purity chemical research laboratory ) Was deposited at a rate of 0.1 nm / min to form a cathode, whereby an organic EL device was obtained.
The degree of vacuum at the time of deposition was all 1 × 10 −4 Pa or less.
この電子デバイスを、温度60℃、相対湿度90%の環境下に250時間静置させた後、有機EL素子を起動させ、ダークスポット(非発光箇所)の有無を観察し、以下の基準で評価した。
◎:ダークスポットが発光面積の40%未満
△:ダークスポットが発光面積の40%以上50%未満
×:ダークスポットが発光面積の50%以上
評価結果を第1表に示す。 One release film of the adhesive sheet obtained in Example or Comparative Example was peeled off, the exposed adhesive layer was stacked on a metal foil film, and these were adhered at 60 ° C. using a heat laminator. Next, another release film was peeled off, and the exposed adhesive layer was overlapped so as to cover the organic EL element formed on the glass substrate, and these were adhered at 60 ° C. using a heat laminator. Then, the adhesive layer was cured by heating at 100 ° C. for 2 hours to obtain a bottom emission type electronic device in which the organic EL element was sealed.
This electronic device is allowed to stand for 250 hours in an environment of a temperature of 60 ° C. and a relative humidity of 90%, and then the organic EL element is activated to observe the presence or absence of dark spots (non-light emitting places). did.
◎: dark spot is less than 40% of light emitting area Δ: dark spot is 40% to less than 50% of light emitting area x: dark spot is 50% or more of light emitting area The evaluation results are shown in Table 1.
実施例1~6で得られた接着シートの接着剤層は封止性に優れるものであり、これらを用いて有機EL素子を封止することで、ダークスポットの発生を抑制することができる。
一方、比較例1~4で得られた接着シートの接着剤層は、所定のせん断特性を有しないものであり、これらは封止性に劣っている。 Table 1 shows the following.
The adhesive layer of the adhesive sheet obtained in Examples 1 to 6 is excellent in sealability, and the occurrence of dark spots can be suppressed by sealing the organic EL element using these.
On the other hand, the adhesive layer of the adhesive sheet obtained in Comparative Examples 1 to 4 does not have predetermined shear characteristics, and these are inferior in sealability.
Claims (12)
- 多官能エポキシ化合物を含有する熱硬化性の接着剤層を有する接着シートであって、
多官能エポキシ化合物の含有量が、接着剤層全体中5~50質量%であり、
下記の条件でせん断試験(A)を行ったときに、下記の要件(1)~(3)を満たすことを特徴とする接着シート。
〔せん断試験(A)〕
短辺が10mmの長方形の無アルカリガラスを2枚用意し、これらの中の1枚の無アルカリガラス上に、1辺が10mmの正方形の接着剤層を接着面積が100mm2(10mm×10mm)になるように配置し、これらを温度60℃、圧力0.2MPa、ラミネート速度0.2m/分の条件でラミネートする。次いで、前記接着剤層の、無アルカリガラスと接していない側の面に、もう1枚の無アルカリガラスを接着面積が100mm2(10mm×10mm)になるように重ね、これらを温度60℃、圧力0.2MPa、ラミネート速度0.2m/分の条件でラミネートし積層体を得る。次いで、この積層体を100℃で2時間加熱してその接着剤層を硬化させる。その後、積層体を23℃、相対湿度50%の条件下で24時間静置し、測定試料を得る。得られた測定試料を用いて、せん断速度0.1mm/分の条件でせん断荷重を測定する。
〔要件〕
要件〔1〕:最大せん断荷重(P1 max)がせん断歪み10,000%未満のときに測定される。
要件〔2〕:最大せん断荷重(P1 max)の値が100N以上である。
要件〔3〕:せん断歪み10,000%のときのせん断荷重(P1 10000%)の値が、最大せん断荷重(P1 max)の値の50%以上である。 An adhesive sheet having a thermosetting adhesive layer containing a polyfunctional epoxy compound,
The content of the polyfunctional epoxy compound is 5 to 50% by mass in the entire adhesive layer,
An adhesive sheet characterized by satisfying the following requirements (1) to (3) when performing a shear test (A) under the following conditions.
[Shear test (A)]
Prepare two rectangular alkali-free glasses with a short side of 10 mm, and on one of these sheets of alkali-free glass, a square adhesive layer with a side of 10 mm and a bonding area of 100 mm 2 (10 mm × 10 mm) Then, they are laminated at a temperature of 60 ° C., a pressure of 0.2 MPa, and a laminating speed of 0.2 m / min. Next, another non-alkali glass is stacked on the side of the adhesive layer not in contact with the non-alkali glass so that the adhesion area is 100 mm 2 (10 mm × 10 mm), and these are heated to 60 ° C. Lamination is performed under a pressure of 0.2 MPa and a lamination speed of 0.2 m / min to obtain a laminate. The laminate is then heated at 100 ° C. for 2 hours to cure the adhesive layer. Thereafter, the laminate is allowed to stand at 23 ° C. under a relative humidity of 50% for 24 hours to obtain a measurement sample. The shear load is measured at a shear rate of 0.1 mm / min using the obtained measurement sample.
[Requirements]
Requirement [1]: The maximum shear load (P 1 max ) is measured when the shear strain is less than 10,000%.
Requirement [2]: The value of the maximum shear load (P 1 max ) is 100 N or more.
Requirement [3]: The value of the shear load (P 1 10000% ) at a shear strain of 10,000% is 50% or more of the value of the maximum shear load (P 1 max ). - 下記の条件でせん断試験(B)を行ったときに、下記の要件〔4〕を満たすことを特徴とする請求項1に記載の接着シート。
〔せん断試験(B)〕
せん断試験(A)における測定試料の作製方法と同様にして測定試料を作製する。
得られた測定試料を、温度60℃、相対湿度90%の条件下に100時間、次いで、温度23℃、相対湿度50%の条件下に24時間静置させた後に、この測定試料を用いて、せん断速度0.1mm/分の条件でせん断荷重を測定する。
〔要件〕
要件〔4〕:せん断試験(2)における最大せん断荷重(P2 max)の値が、せん断試験(A)における最大せん断荷重(P1 max)の値の70%以上である。 The adhesive sheet according to claim 1, wherein when the shear test (B) is performed under the following conditions, the following requirement (4) is satisfied.
[Shear test (B)]
A measurement sample is produced in the same manner as the production method of the measurement sample in the shear test (A).
The measurement sample obtained is allowed to stand for 24 hours under conditions of a temperature of 60 ° C. and a relative humidity of 90% for 100 hours, and then under a condition of a temperature of 23 ° C. and a relative humidity of 50%. Measure the shear load at a shear rate of 0.1 mm / min.
[Requirements]
Requirement [4]: The value of the maximum shear load (P 2 max ) in the shear test (2) is 70% or more of the value of the maximum shear load (P 1 max ) in the shear test (A). - 前記接着剤層が、さらに変性ポリオレフィン系樹脂を含有するものである、請求項1又は2に記載の接着シート。 The adhesive sheet according to claim 1, wherein the adhesive layer further contains a modified polyolefin resin.
- 変性ポリオレフィン系樹脂の含有量が、接着剤層全体中40~90質量%である、請求項3に記載の接着シート。 The adhesive sheet according to claim 3, wherein the content of the modified polyolefin resin is 40 to 90% by mass in the entire adhesive layer.
- 前記接着剤層が、さらにイミダゾール系硬化触媒を含有するものである、請求項1~4のいずれかに記載の接着シート。 The adhesive sheet according to any one of claims 1 to 4, wherein the adhesive layer further contains an imidazole-based curing catalyst.
- イミダゾール系硬化触媒の含有量が、前記接着剤層中に含まれる前記多官能エポキシ化合物100質量部に対し、0.1~10質量部である、請求項5に記載の接着シート。 The adhesive sheet according to claim 5, wherein the content of the imidazole-based curing catalyst is 0.1 to 10 parts by mass with respect to 100 parts by mass of the polyfunctional epoxy compound contained in the adhesive layer.
- 前記接着剤層が、さらにシランカップリング剤を含有するものである、請求項1~6のいずれかに記載の接着シート。 The adhesive sheet according to any one of claims 1 to 6, wherein the adhesive layer further contains a silane coupling agent.
- シランカップリング剤の含有量が、接着剤層全体中0.01~2質量%である、請求項7に記載の接着シート。 The adhesive sheet according to claim 7, wherein the content of the silane coupling agent is 0.01 to 2% by mass in the entire adhesive layer.
- 接着剤層の厚みが1~25μmである、請求項1~8のいずれかに記載の接着シート。 The adhesive sheet according to any one of claims 1 to 8, wherein the thickness of the adhesive layer is 1 to 25 μm.
- さらに剥離フィルムを有する、請求項1~9のいずれかに記載の接着シート。 The adhesive sheet according to any one of claims 1 to 9, further comprising a release film.
- 被封止物が、請求項1~10のいずれかに記載の接着シートを用いて封止されてなる封止体。 A sealed body obtained by sealing an object to be sealed with the adhesive sheet according to any one of claims 1 to 10.
- 前記被封止物が、有機EL素子、有機ELディスプレイ素子、液晶ディスプレイ素子、又は太陽電池素子である、請求項11に記載の封止体。 The sealed body according to claim 11, wherein the object to be sealed is an organic EL element, an organic EL display element, a liquid crystal display element, or a solar cell element.
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008163344A (en) * | 2008-01-22 | 2008-07-17 | Nitto Denko Corp | Reactive adhesive composition for fixing electronic component and its adhesive sheet |
WO2014084350A1 (en) * | 2012-11-30 | 2014-06-05 | リンテック株式会社 | Adhesive agent composition, adhesive sheet, and electronic device |
WO2016158770A1 (en) * | 2015-03-27 | 2016-10-06 | 味の素株式会社 | Resin composition for sealing |
WO2017094591A1 (en) * | 2015-12-01 | 2017-06-08 | リンテック株式会社 | Adhesive composition, sealing sheet, and sealed body |
WO2017094590A1 (en) * | 2015-12-01 | 2017-06-08 | リンテック株式会社 | Adhesive composition, sealing sheet, and sealed body |
WO2018047920A1 (en) * | 2016-09-07 | 2018-03-15 | リンテック株式会社 | Adhesive composition, sealing sheet, and sealed body |
WO2018047868A1 (en) * | 2016-09-07 | 2018-03-15 | リンテック株式会社 | Adhesive composition, sealing sheet, and sealed body |
WO2018092800A1 (en) * | 2016-11-18 | 2018-05-24 | リンテック株式会社 | Adhesive composition, sealing sheet and sealed body |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101218539B (en) * | 2005-07-05 | 2011-07-13 | 日立化成工业株式会社 | Photosensitive adhesive composition, and obtained adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part using the same |
KR102103169B1 (en) * | 2012-10-05 | 2020-04-22 | 린텍 가부시키가이샤 | Dicing sheet with protective film forming layer and chip fabrication method |
JP2016040369A (en) * | 2014-08-12 | 2016-03-24 | ユニチカ株式会社 | Polyolefin resin aqueous dispersion, adhesive using the same, solar cell back sheet and solar cell module |
JP2016053157A (en) | 2014-09-03 | 2016-04-14 | 王子ホールディングス株式会社 | Pressure sensitive adhesive sheet |
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-
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008163344A (en) * | 2008-01-22 | 2008-07-17 | Nitto Denko Corp | Reactive adhesive composition for fixing electronic component and its adhesive sheet |
WO2014084350A1 (en) * | 2012-11-30 | 2014-06-05 | リンテック株式会社 | Adhesive agent composition, adhesive sheet, and electronic device |
WO2016158770A1 (en) * | 2015-03-27 | 2016-10-06 | 味の素株式会社 | Resin composition for sealing |
WO2017094591A1 (en) * | 2015-12-01 | 2017-06-08 | リンテック株式会社 | Adhesive composition, sealing sheet, and sealed body |
WO2017094590A1 (en) * | 2015-12-01 | 2017-06-08 | リンテック株式会社 | Adhesive composition, sealing sheet, and sealed body |
WO2018047920A1 (en) * | 2016-09-07 | 2018-03-15 | リンテック株式会社 | Adhesive composition, sealing sheet, and sealed body |
WO2018047868A1 (en) * | 2016-09-07 | 2018-03-15 | リンテック株式会社 | Adhesive composition, sealing sheet, and sealed body |
WO2018092800A1 (en) * | 2016-11-18 | 2018-05-24 | リンテック株式会社 | Adhesive composition, sealing sheet and sealed body |
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