JP5884852B2 - 炭化珪素板のスクライブ方法及びスクライブ装置 - Google Patents

炭化珪素板のスクライブ方法及びスクライブ装置 Download PDF

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Publication number
JP5884852B2
JP5884852B2 JP2014086922A JP2014086922A JP5884852B2 JP 5884852 B2 JP5884852 B2 JP 5884852B2 JP 2014086922 A JP2014086922 A JP 2014086922A JP 2014086922 A JP2014086922 A JP 2014086922A JP 5884852 B2 JP5884852 B2 JP 5884852B2
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silicon carbide
scribing
carbide plate
scribe
wheel
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JP2014139027A (ja
JP2014139027A5 (enExample
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坂東　和明
和明 坂東
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Bando Kiko Co Ltd
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Bando Kiko Co Ltd
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JP2014086922A 2014-04-18 2014-04-18 炭化珪素板のスクライブ方法及びスクライブ装置 Expired - Fee Related JP5884852B2 (ja)

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JP2014086922A JP5884852B2 (ja) 2014-04-18 2014-04-18 炭化珪素板のスクライブ方法及びスクライブ装置

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JP2012551742A Division JPWO2012093422A1 (ja) 2011-01-07 2011-01-07 炭化珪素板のスクライブ方法及びスクライブ装置

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JP2016009319A Division JP2016104571A (ja) 2016-01-20 2016-01-20 炭化珪素板のスクライブ方法及びスクライブ装置

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JP2014139027A JP2014139027A (ja) 2014-07-31
JP2014139027A5 JP2014139027A5 (enExample) 2015-03-19
JP5884852B2 true JP5884852B2 (ja) 2016-03-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210049875A (ko) 2018-09-28 2021-05-06 미쓰보시 다이야몬도 고교 가부시키가이샤 GaN 기판의 분단 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4710148B2 (ja) * 2001-02-23 2011-06-29 パナソニック株式会社 窒化物半導体チップの製造方法
TWI286232B (en) * 2002-10-29 2007-09-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate
CN102161219A (zh) * 2004-02-02 2011-08-24 三星钻石工业股份有限公司 刀轮、使用其的脆性材料基板的划线方法及分割方法、刀轮的制造方法
US7392732B2 (en) * 2005-01-24 2008-07-01 Micro Processing Technology, Inc. Scribing tool and method
KR101651557B1 (ko) * 2009-04-10 2016-08-26 반도키코 가부시키가이샤 유리판 선긋기 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210049875A (ko) 2018-09-28 2021-05-06 미쓰보시 다이야몬도 고교 가부시키가이샤 GaN 기판의 분단 방법

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