JP2014139027A5 - - Google Patents
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- Publication number
- JP2014139027A5 JP2014139027A5 JP2014086922A JP2014086922A JP2014139027A5 JP 2014139027 A5 JP2014139027 A5 JP 2014139027A5 JP 2014086922 A JP2014086922 A JP 2014086922A JP 2014086922 A JP2014086922 A JP 2014086922A JP 2014139027 A5 JP2014139027 A5 JP 2014139027A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- carbide plate
- cutter wheel
- scribing
- scribe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 16
- 229910010271 silicon carbide Inorganic materials 0.000 claims 16
- 229910003460 diamond Inorganic materials 0.000 claims 4
- 239000010432 diamond Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 2
- 238000003466 welding Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014086922A JP5884852B2 (ja) | 2014-04-18 | 2014-04-18 | 炭化珪素板のスクライブ方法及びスクライブ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014086922A JP5884852B2 (ja) | 2014-04-18 | 2014-04-18 | 炭化珪素板のスクライブ方法及びスクライブ装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012551742A Division JPWO2012093422A1 (ja) | 2011-01-07 | 2011-01-07 | 炭化珪素板のスクライブ方法及びスクライブ装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016009319A Division JP2016104571A (ja) | 2016-01-20 | 2016-01-20 | 炭化珪素板のスクライブ方法及びスクライブ装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014139027A JP2014139027A (ja) | 2014-07-31 |
| JP2014139027A5 true JP2014139027A5 (enExample) | 2015-03-19 |
| JP5884852B2 JP5884852B2 (ja) | 2016-03-15 |
Family
ID=51416049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014086922A Expired - Fee Related JP5884852B2 (ja) | 2014-04-18 | 2014-04-18 | 炭化珪素板のスクライブ方法及びスクライブ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5884852B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI837150B (zh) | 2018-09-28 | 2024-04-01 | 日商三星鑽石工業股份有限公司 | GaN基板之分斷方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4710148B2 (ja) * | 2001-02-23 | 2011-06-29 | パナソニック株式会社 | 窒化物半導体チップの製造方法 |
| TWI286232B (en) * | 2002-10-29 | 2007-09-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
| JP5022602B2 (ja) * | 2004-02-02 | 2012-09-12 | 三星ダイヤモンド工業株式会社 | カッターホイールおよびこれを用いた脆性材料基板のスクライブ方法および分断方法 |
| US7392732B2 (en) * | 2005-01-24 | 2008-07-01 | Micro Processing Technology, Inc. | Scribing tool and method |
| KR101651557B1 (ko) * | 2009-04-10 | 2016-08-26 | 반도키코 가부시키가이샤 | 유리판 선긋기 장치 |
-
2014
- 2014-04-18 JP JP2014086922A patent/JP5884852B2/ja not_active Expired - Fee Related
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