JP2014139027A5 - - Google Patents

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Publication number
JP2014139027A5
JP2014139027A5 JP2014086922A JP2014086922A JP2014139027A5 JP 2014139027 A5 JP2014139027 A5 JP 2014139027A5 JP 2014086922 A JP2014086922 A JP 2014086922A JP 2014086922 A JP2014086922 A JP 2014086922A JP 2014139027 A5 JP2014139027 A5 JP 2014139027A5
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JP
Japan
Prior art keywords
silicon carbide
carbide plate
cutter wheel
scribing
scribe
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JP2014086922A
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Japanese (ja)
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JP2014139027A (en
JP5884852B2 (en
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Priority to JP2014086922A priority Critical patent/JP5884852B2/en
Priority claimed from JP2014086922A external-priority patent/JP5884852B2/en
Publication of JP2014139027A publication Critical patent/JP2014139027A/en
Publication of JP2014139027A5 publication Critical patent/JP2014139027A5/ja
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Publication of JP5884852B2 publication Critical patent/JP5884852B2/en
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Claims (3)

スクライブ開始にあたって、先ず炭化珪素板の一方の面のスクライブ開始点に水平軸の周りで回転自在であると共に刃先角度が９０°から１４０°であるカッターホイールを炭化珪素板の一方の面に刃先荷重０．１ｋｇ／ｃｍ ２ から２ｋｇ／ｃｍ ２ で圧接させた状態で、当該カッターホイールを炭化珪素板の一方の面に対して直交する垂直軸の周りで回動又は揺動させて、上記開始点にクボミを刻み形成し、クボミを形成した後、このクボミにおいて炭化珪素板の一方の面にカッターホイールを圧接させた状態で、カッターホイールによる炭化珪素板の一方の面に対するスクライブをスタートさせる炭化珪素板のスクライブ方法。 At the start of scribing , a cutter wheel that is rotatable around a horizontal axis at the scribe start point on one surface of the silicon carbide plate and that has a blade edge angle of 90 ° to 140 ° is applied to one surface of the silicon carbide plate. In the state where the pressure is 0.1 kg / cm 2 to 2 kg / cm 2 , the cutter wheel is rotated or swung around a vertical axis orthogonal to one surface of the silicon carbide plate to to form minced dimples, after forming the dimples, while being pressed against the cutter wheel on one surface of the silicon carbide plate in the recess, silicon carbide make start scribing against one surface of the silicon carbide plate by the cutter wheel Board scribing method. スクライブ開始にあたって、水平軸の周りで回転自在であると共に刃先角度が９０°から１４０°であるカッターホイールとは別に設けたダイヤモンドスクライブスタイラスを先ず、炭化珪素板の一方の面のスクライブ開始点に圧接させた状態で 炭化珪素板の一方の面に直交する垂直軸の周りで回動又は揺動させて、上記開始点にクボミを刻み形成し、クボミを形成した後、このクボミにおいて炭化珪素板の一方の面にカッターホイールを刃先荷重０．１ｋｇ／ｃｍ  At the start of scribing, a diamond scribe stylus that is rotatable around a horizontal axis and is provided separately from a cutter wheel having a blade edge angle of 90 ° to 140 ° is first pressed against the scribe start point on one surface of the silicon carbide plate. In such a state, the silicon carbide plate is rotated or swung around a vertical axis orthogonal to one surface of the silicon carbide plate, and a dent is formed at the start point. Cutter wheel on one side, cutting edge load 0.1 kg / cm ２2 から２ｋｇ／ｃｍTo 2kg / cm ２2 で圧接し、この圧接後、カッターホイールによる炭化珪素板の一方の面に対するスクライブをスタートさせる炭化珪素板のスクライブ方法。A silicon carbide plate scribing method in which, after this pressure welding, scribing to one surface of the silicon carbide plate by a cutter wheel is started. 炭化珪素板の一方の面に対して直交する垂直軸の周りで回動又は揺動自在なダイヤモンドスクライブスタイラスを備え、このダイヤモンドスクライブスタイラスを炭化珪素板の一方の面に圧接して垂直軸の周りで回動又は揺動させて当該炭化珪素板の一方の面にクボミを刻み形成するダイヤモンドスタイラス装置と、水平軸の周りで回転自在であると共に刃先角度が９０°から１４０°であるカッターホイールを備え、このカッターホイールをクボミにおいて炭化珪素板の一方の面に刃先荷重０．１ｋｇ／ｃｍA diamond scribe stylus that is rotatable or swingable about a vertical axis orthogonal to one surface of the silicon carbide plate is provided, and the diamond scribe stylus is pressed against one surface of the silicon carbide plate and is rotated around the vertical axis. And a diamond stylus device that forms a dent on one surface of the silicon carbide plate by rotating or swinging with a cutter wheel that is rotatable around a horizontal axis and has a blade edge angle of 90 ° to 140 °. Equipped with this cutter wheel with a cutting edge load of 0.1 kg / cm on one side of the silicon carbide plate at Kubo ２2 から２ｋｇ／ｃｍTo 2kg / cm ２2 で圧接した状態で水平軸の周りで転動させて炭化珪素板の一方の面にスクライブラインを刻み形成するようにしたスクライブヘッドとを備えたスクライブ装置。A scribing device comprising a scribing head that is rolled around a horizontal axis in a state where it is pressed in contact with each other to form a scribe line on one surface of the silicon carbide plate.
JP2014086922A 2014-04-18 2014-04-18 Silicon carbide plate scribing method and scribing apparatus Expired - Fee Related JP5884852B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014086922A JP5884852B2 (en) 2014-04-18 2014-04-18 Silicon carbide plate scribing method and scribing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014086922A JP5884852B2 (en) 2014-04-18 2014-04-18 Silicon carbide plate scribing method and scribing apparatus

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2012551742A Division JPWO2012093422A1 (en) 2011-01-07 2011-01-07 Silicon carbide plate scribing method and scribing apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2016009319A Division JP2016104571A (en) 2016-01-20 2016-01-20 Method and device for scribing silicon carbide board

Publications (3)

Publication Number Publication Date
JP2014139027A JP2014139027A (en) 2014-07-31
JP2014139027A5 true JP2014139027A5 (en) 2015-03-19
JP5884852B2 JP5884852B2 (en) 2016-03-15

Family

ID=51416049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014086922A Expired - Fee Related JP5884852B2 (en) 2014-04-18 2014-04-18 Silicon carbide plate scribing method and scribing apparatus

Country Status (1)

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JP (1) JP5884852B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7137242B2 (en) 2018-09-28 2022-09-14 三星ダイヤモンド工業株式会社 GaN substrate cutting method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4710148B2 (en) * 2001-02-23 2011-06-29 パナソニック株式会社 Manufacturing method of nitride semiconductor chip
TWI286232B (en) * 2002-10-29 2007-09-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate
JP5022602B2 (en) * 2004-02-02 2012-09-12 三星ダイヤモンド工業株式会社 Cutter wheel and method for scribing and dividing brittle material substrate using the same
US7392732B2 (en) * 2005-01-24 2008-07-01 Micro Processing Technology, Inc. Scribing tool and method
KR101574616B1 (en) * 2009-04-10 2015-12-04 반도키코 가부시키가이샤 Glass plate scribing method and scribing apparatus

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