JP5877282B1 - Copper foil and copper-clad laminate for printed wiring boards - Google Patents

Abstract

Provided are a copper foil for a wiring board and a copper clad laminate, which have good visibility after forming a circuit pattern, have a high normal peel strength, and a high level of heat-resistant peel strength. SOLUTION: At least one surface of a copper foil has a roughened particle layer composed of roughened particles having an arithmetic average height of 0.05 to 0.5 μm, and at least nickel is formed on the roughened particle layer. A copper foil containing zinc and having a diffusion prevention coating in which the ratio (mass ratio) of the adhesion amount of nickel to the roughening particle layer to the adhesion amount of zinc to the roughening particle layer is in the range of 0.5 to 20 A copper foil and a copper clad laminate having a diffuse reflectance (Rd) at a wavelength of 600 nm measured from the one surface side in a range of 5 to 50% and a chroma (C *) of 30 or less, and a specific A copper clad laminate having a polyimide resin layer containing a copper damage inhibitor on the one surface side of the copper foil. [Selection figure] None

Description

  The present invention relates to a copper foil for a wiring board and a copper clad laminate, and more particularly to a copper clad laminate for a wiring board excellent in resin adhesion and resin permeation visibility after forming a circuit pattern, and a copper foil used for the same. .

  In various electronic devices, a wiring board is used as a substrate or a connection material, and a copper foil is generally used for a conductive layer of the wiring board.

  The copper foil employed for the wiring board is generally supplied in the form of a rolled copper foil or an electrolytic copper foil.

  In general, a wiring board is formed by bonding a copper foil such as an electrolytic copper foil and a resin film such as polyimide, and forming a circuit pattern by etching. In the subsequent mounting process, the circuit board on which the circuit pattern is formed may be positioned by recognizing the alignment mark or the like with a camera through the resin film removed by etching the copper foil during the circuit pattern formation. . For this reason, it is required that the light transmitted through the resin film does not diffuse and has a resin transmission visibility that can be clearly recognized by a camera. In the present specification, the resin permeation visibility is hereinafter simply referred to as “visibility”.

The visibility of a resin film is generally represented by a haze value (cloudiness value). The haze value with respect to the total light transmittance (T _t ) and diffuse transmittance (T _d ) of the resin film is expressed by the following formula (T _d / T _t ) × 100 (%)
It is represented by The smaller this value, the higher the visibility. In general, a haze value with a wavelength of 600 nm is adopted for evaluation of visibility.

  If the kind of the resin film is the same, the haze value of the resin film depends on the surface shape. If the surface is rough, the diffuse transmission component becomes large and the haze value becomes high. Therefore, in order to increase the visibility, the surface needs to be smooth to some extent.

  Moreover, the surface shape of the resin film transfers the surface shape of the bonded copper foil. Therefore, in order to obtain a smooth resin surface, it is necessary to use a smooth copper foil.

  On the other hand, for use as a wiring board, adhesion between the resin film and the copper foil is required. In order to improve adhesion, the copper foil surface is often roughened to increase the contact surface area and use the anchor effect. Therefore, the improvement of the adhesion leads to the deterioration of the visibility, and it is said that it is difficult to achieve both the resin adhesion and the visibility.

  As a method of roughening the copper foil surface (roughening treatment), it is common to apply granular copper plating (roughening plating) on the copper foil. In addition, a method of roughening the surface by etching or a method of roughening plating by metal or alloy plating other than copper is used.

  Patent Document 1 discloses an electrolytic copper foil that has improved adhesion with a resin by precipitating smaller secondary roughened particles on the primary roughened particles by applying two types of copper roughened plating. Yes. However, since this electrolytic copper foil has an excessively rough surface, the adhesiveness is excellent but the visibility is low, and there is still room for improvement.

  Patent Document 2 discloses a copper clad laminate obtained by thermocompression bonding a multilayer polyimide film obtained by special thermocompression bonding to a smooth copper foil under special conditions. However, this copper-clad laminate has many restrictions on the resin configuration and the method for producing the copper-clad laminate, and can be said to be a content that can be realized only under certain specific conditions.

  In addition, regarding the adhesiveness between the copper foil and the resin film, particularly the adhesiveness with the polyimide resin used as the base material of the flexible printed circuit board (FPC), the adhesive strength immediately after the lamination of the copper foil and the polyimide resin (hereinafter, normal peel) In addition to the term “strength”, the peel strength after applying a long-time heat load (hereinafter referred to as “heat-resistant peel strength”) is also important from the viewpoint of long-term reliability.

  The heat-resistant peel strength of a printed wiring board based on a polyimide resin is generally measured after applying a heat load of 1000 hours in an air atmosphere at 150 ° C.

  While the thermal load under the above conditions is applied to the printed wiring board, a copper atom on the surface of the copper foil becomes a copper ion, which causes a phenomenon (hereinafter referred to as copper damage) that decomposes the polymer resin. To do. For this reason, the heat-resistant peel strength is generally low compared to the normal peel strength.

  In order to improve the heat-resistant peel strength, there is a means for improving the anchor effect by the aforementioned roughening. However, if the coarse particles are made too large, the visibility decreases, and there is a limit to improving the heat-resistant peel strength only by improving the anchor effect.

  In addition to improving the anchor effect by roughening, as in Patent Document 3, different metal atomic layers other than copper consisting of nickel and zinc on a smooth copper foil surface not subjected to roughening treatment (roughening plating) (hereinafter, It is known that an anti-diffusion layer is formed) to prevent deterioration of the resin due to thermal diffusion of copper and improve peel strength. With this method alone, the peel strength is maintained at a certain value or higher with a heat history as low as 50 hours at 150 ° C. However, since the copper foil is smooth, an anchor effect is hardly obtained, so that it is difficult to keep the peel strength at a high level after a high heat load test of 150 hours at 150 ° C. Moreover, in patent document 3, it processes by making many nickel and zinc adhere, and the etching property of copper foil is sacrificed. In addition, the amount of metal components taken out from the plating solution used for the treatment of nickel and zinc increases, which is disadvantageous from the viewpoint of manufacturing cost.

  In order to prevent copper damage to the resin during the heat resistance test, there is a method of adding a copper damage inhibitor to the resin. By chelating the copper ions with the copper damage inhibitor, the copper ions can be inactivated, and the peroxide can be prevented from being catalytically decomposed to generate oxy radicals. That is, the addition of the copper damage inhibitor can suppress the oxidative degradation of the polymer material. Specific examples of the copper damage inhibitor include oxalic acid derivatives, salicylic acid derivatives, hydrazide derivatives, benzotriazole, and the like.

  However, in FPC using copper foil with small surface irregularities and excellent visibility, under severe heat load of 1000 hours at 150 ° C. which is the heat resistance test condition of FPC, deterioration of heat-resistant peel strength is prevented only by adding copper damage prevention agent. It is difficult.

JP 11-340596 A JP 2011-119759 A Japanese Patent No. 4090467

  It is an object of the present invention to provide a copper foil for a wiring board and a copper clad laminate that have good visibility after forming a circuit pattern, have a high normal peel strength, and a high heat-resistant peel strength. .

The present inventors perform a roughening treatment having an uneven height in a range that does not reduce the visibility on one surface of the copper foil to form a roughened particle layer made of pure copper having a specific particle height. And a diffusion reflection on the one surface side of the roughened copper foil having a diffusion prevention coating with a specific nickel / zinc adhesion ratio composed of at least nickel and zinc on the surface. It has been found that by controlling the rate and saturation within a predetermined range, high heat-resistant peel strength and high visibility can be realized. Here, the diffuse reflectance refers to the ratio of the diffusely reflected (irregularly reflected) light beam to the light beam incident on the object surface, and serves as an index for determining the degree of unevenness on the object surface. Saturation is one of the three attributes of color and is a measure of color vividness. In addition, the present inventors include a polyimide resin layer used as an insulating layer containing at least one copper damage inhibitor selected from an oxalic acid derivative, a salicylic acid derivative, a hydrazide derivative, and a triazole, so that heat-resistant peel strength is achieved. It has been found that a completely new copper-clad laminate can be obtained. The present invention has been completed based on these findings.

That is, according to the present invention, the following means are provided.
(1) It has a roughened particle layer made of roughened particles having an arithmetic average height of 0.05 to 0.5 μm on at least one surface of the copper foil, the roughened particles are made of pure copper, and the roughened particles On the layer, at least nickel and zinc are included, and the ratio (mass ratio) of the adhesion amount of nickel to the roughening particle layer to the adhesion amount of zinc to the roughening particle layer (surface) is 0.5 to 20 A copper foil having a diffusion prevention coating within the range of 5%, wherein the diffuse reflectance (R _d ) at a wavelength of 600 nm measured from the one surface side is in the range of 5 to 50% and the saturation (C ^* ) is 30 or less. Copper foil characterized by being.
(2) A copper-clad laminate comprising the copper foil according to item (1).
(3) oxalic acid derivatives, salicylic acid derivatives, hydrazide derivatives, and the polyimide resin layer comprising at least one copper inhibitor is selected from triazoles, having on the one surface side of a copper foil according to (1) claim Copper-clad laminate.

  According to the present invention, it is possible to provide a copper foil for a printed wiring board and a copper clad laminate which are excellent in both visibility and resin adhesion after forming a circuit pattern.

It is a figure explaining the measuring method of the roughening particle height in this invention.

The copper foil of the present invention has a roughened particle layer made of roughened particles having an arithmetic average height of 0.05 to 0.5 μm on at least one surface thereof, and at least nickel on the roughened particle layer. A copper foil having a diffusion-preventing coating in which the ratio (mass ratio) of the amount of adhesion to the surface of nickel with respect to the amount of adhesion to the surface of zinc is 0.5 to 20 The diffuse reflectance (R _d ) at a wavelength of 600 nm measured from the side is in the range of 5 to 50% and the saturation (C ^* ) is 30 or less.
The copper foil of this invention can be used suitably for a printed wiring board.

  The total light transmittance of the resin film is roughly determined by the type and thickness of the resin, and changes slightly depending on the resin surface shape, but the degree of change is small. Therefore, the haze value for evaluating the visibility is greatly influenced by the diffuse transmittance. The diffuse transmittance of the resin is greatly influenced by the surface shape. The surface shape of the resin is a transfer of the surface shape of the copper foil. Therefore, the shape of the copper foil greatly affects the diffuse transmittance of the resin.

  When the diffuse reflectance at a wavelength of 600 nm on the surface of the copper foil is greater than 50%, the resin having the transferred surface shape has an increased diffuse transmittance and excellent adhesion, but the visibility is deteriorated. On the other hand, if the diffuse reflectance is less than 5%, the surface of the copper foil has a very good gloss. However, since the surface is too smooth, the visibility is excellent, but the adhesion with the resin is reduced.

In the CIE L ^* a ^* b ^* color system in which colors are represented by coordinates on a uniform color space consisting of a lightness index L ^* and a chrominance index a ^* , b ^* , the saturation (C ^* ) is expressed by the formula (1 ). The lower the saturation, the grayer the surface. The surface with high saturation varies greatly depending on the wavelength, and the surface with low saturation has a flat spectral reflectance.

Formula (1)

  The hue of the copper foil surface varies greatly depending on the surface treatment. However, the haze value is generally a value having a wavelength of 600 nm for evaluation.

The inventors of the present invention who paid attention to the evaluation of the haze value generally adopting a wavelength of 600 nm have a saturation (C ^* ) of 30 or less, that is, a wavelength of 600 nm on the surface of any hue due to low saturation. The copper foil having such a surface was found to be excellent in the visibility of the resin film to which the surface was transferred.

  Moreover, since visibility was determined from the surface of copper foil, it discovered that it was hard to be influenced by the kind of resin, the manufacturing method of resin, the manufacturing method of a wiring board, etc.

  The copper foil used for the printed wiring board of the present invention has an arithmetic average height of the roughened particles in the roughened layer formed on at least one surface of the copper foil on the side in contact with the insulating layer made of polyimide resin is 0.05 μm. ˜0.5 μm. When it is lower than 0.05 μm, the initial peel strength and the heat-resistant peel strength are lowered. If it is higher than 0.5 μm, the visibility is lowered.

Table 1 summarizes the form of the roughened layer.
The cross-sectional shape of the copper foil defined in the present invention corresponds to the shape 1 in Table 1.

On the other hand, shapes 2 to 5 indicate shapes outside the specified range of the present invention.
Even if the roughened particle height is in the same range as in shape 1 as in shape 2, if the outermost surface becomes gentle, the diffuse reflectance and saturation exceed the provisions of the present invention. In addition, since the anchor effect due to surface irregularities is small, the adhesion is reduced.
If the roughened particles become thin even if the height of the roughened particles is the same as that of the shape 1 as in the shape 3, the diffuse reflectance becomes less than that of the present invention. Although the visibility is good, the roughened particles easily fall off (because the roughened particles are easy to break at the root), and the adhesiveness is lowered.
When the coarse particle height is high as in the shape 4, the diffuse reflectance and saturation exceed the provisions of the present invention. Since the coarse particles are large, the anchor effect is large and the adhesion is satisfactory, but the visibility of the resin after etching the copper foil is deteriorated.
When the rough particle height is small as in the shape 5, the diffuse reflectance is less than that of the present invention. Since the anchor effect is small due to the small unevenness, the adhesion is lowered.

  The copper foil used for the printed wiring board of the present invention comprises at least nickel and zinc on the copper foil surface on the side in contact with the insulating layer made of polyimide resin, and the surface of nickel with respect to the amount of zinc adhered to the surface An anti-diffusion coating having an adhesion ratio (Ni / Zn mass ratio) in the range of 0.5 to 20 is provided. When the adhesion amount ratio is higher than 20, it becomes an obstacle when the copper foil is etched, causing a short circuit of the wiring. When the adhesion amount ratio is lower than 0.5, the effect of preventing the diffusion of copper is lowered, and the heat-resistant peel strength is lowered.

  Here, the diffusion prevention coating may be performed on the entire surface of the copper foil, or may be performed on a part thereof. When a part of the copper foil surface is subjected to diffusion prevention coating, the coverage is preferably 50% or more. Here, the covering rate means the ratio of the covering area when the total area of the surface of the copper foil is 100%.

  As the polyimide resin laminated on the copper foil, a commercially available polyimide film can be used as it is. From the viewpoint of easy control of the thickness and physical properties of the polyimide resin layer as the insulating layer, the polyamic acid solution is directly applied on the copper foil, and then dried and cured by heat treatment, so-called cast (coating) method. Polyimide resin is preferred. The polyimide resin may be formed from a single layer. In consideration of the adhesiveness between the polyimide resin and the copper foil, it is preferable to form a polyimide resin layer composed of a plurality of layers. In the case where a plurality of polyimide resin layers are used, it can be formed by sequentially applying a polyamic acid solution composed of different components on a certain polyamic acid solution.

  The polyamic acid solution that is a precursor of the polyimide resin can be produced by polymerizing an arbitrary diamine and an arbitrary acid dianhydride in the presence of a solvent in accordance with a conventional method. As this solvent, any solvent can be used according to a conventional method.

  Examples of the diamine used as a raw material for the polyimide resin include 4,6-dimethyl-m-phenylenediamine, 2,5-dimethyl-p-phenylenediamine, 2,4-diaminomesitylene, and 4,4′-methylenedi-o. -Toluidine, 4,4'-methylenedi-2,6-xylidine, 4,4'-methylene-2,6-diethylaniline, 2,4-toluenediamine, m-phenylenediamine, p-phenylenediamine, 4,4 '-Diaminodiphenylpropane, 3,3'-diaminodiphenylpropane, 4,4'-diaminodiphenylethane, 3,3'-diaminodiphenylethane, 4,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 2 , 2-bis [4- (4-aminophenoxy) phenyl] propane, 4,4′- Aminodiphenyl sulfide, 3,3′-diaminodiphenyl sulfide, 4,4′-diaminodiphenyl sulfone, 3,3′-diaminodiphenyl sulfone, 4,4′-diaminodiphenyl ether, 3,3-diaminodiphenyl ether, 1,3- Bis (3-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, benzidine, 3,3′-diaminobiphenyl, 3,3′- Dimethyl-4,4′-diaminobiphenyl, 3,3′-dimethoxybenzidine, 4,4′-diamino-p-terphenyl, 3,3′-diamino-p-terphenyl, bis (p-aminocyclohexyl) methane Bis (p-β-amino-t-butylphenyl) ether, bis (p-β-methyl) -Δ-aminopentyl) benzene, p-bis (2-methyl-4-aminopentyl) benzene, p-bis (1,1-dimethyl-5-aminopentyl) benzene, 1,5-diaminonaphthalene, 2,6 -Diaminonaphthalene, 2,4-bis (β-amino-t-butyl) toluene, 2,4-diaminotoluene, m-xylene-2,5-diamine, p-xylene-2,5-diamine, m-xylyl Range amine, p-xylylene diamine, 2,6-diaminopyridine, 2,5-diaminopyridine, 2,5-diamino-1,3,4-oxadiazole, piperazine, 2,2′-dimethyl-4, 4'-diaminobiphenyl, 3,7-diaminodibenzofuran, 1,5-diaminofluorene, dibenzo-p-dioxin-2,7-diamine, 4,4'-diamy Benzyl, and the like.

  Examples of the acid dianhydride used as a raw material for the polyimide resin include pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, 2,2 ′, 3, 3′-benzophenone tetracarboxylic dianhydride, 2,3,3 ′, 4′-benzophenone tetracarboxylic dianhydride, naphthalene-1,2,5,6-tetracarboxylic dianhydride, naphthalene-1, 2,4,5-tetracarboxylic dianhydride, naphthalene-1,4,5,8-tetracarboxylic dianhydride, naphthalene-1,2,6,7-tetracarboxylic dianhydride, 4,8 -Dimethyl-1,2,3,5,6,7-hexahydronaphthalene-1,2,5,6-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,3,5,6, 7-Hexahydronaphthalene-2 3,6,7-tetracarboxylic dianhydride, 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1,4,5,8- Tetracarboxylic dianhydride, 2,3,6,7-tetrachloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 1,4,5,8-tetrachloronaphthalene-2,3 6,7-tetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 2,2 ′, 3,3′-biphenyltetracarboxylic dianhydride, 2,3 , 3 ′, 4′-biphenyltetracarboxylic dianhydride, 3,3 ″, 4,4 ″ -p-terphenyltetracarboxylic dianhydride, 2,2 ″, 3,3 ″- p-terphenyltetracarboxylic dianhydride, 2,3,3 ", 4" p-terphenyltetracarboxylic dianhydride, 2,2-bis (2,3-dicarboxyphenyl) -propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, Bis (2,3-dicarboxyphenyl) ether dianhydride, bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, bis (2,3 -Dicarboxyphenyl) sulfone dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, 1,1-bis ( 3,4-dicarboxyphenyl) ethane dianhydride, perylene-2,3,8,9-tetracarboxylic dianhydride, perylene-3,4,9,10-tetracarboxylic dianhydride, perylene 4,5,10,11-tetracarboxylic dianhydride, perylene-5,6,11,12-tetracarboxylic dianhydride, phenanthrene-1,2,7,8-tetracarboxylic dianhydride Phenanthrene-1,2,6,7-tetracarboxylic dianhydride, phenanthrene-1,2,9,10-tetracarboxylic dianhydride, cyclopentane-1,2,3,4-tetracarboxylic dianhydride Anhydride, pyrazine-2,3,5,6-tetracarboxylic dianhydride, pyrrolidine-2,3,4,5-tetracarboxylic dianhydride, thiophene-2,3,4,5-tetracarboxylic acid And dianhydrides, 4,4′-oxydiphthalic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, and the like.

  The insulating layer made of the polyimide resin used for the printed wiring board of the present invention is composed of a polyimide resin containing at least one or more selected from oxalic acid derivatives, salicylic acid derivatives, hydrazide derivatives, and triazoles as copper damage inhibitors. Is preferred.

  Copper damage inhibitors used in the present invention are oxalic acid derivatives such as 2,2′-oxamido-bis [ethyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], 3 -Salicylic acid derivatives such as (N-salicyloyl) amino-1,2,4-triazole and triazoles, N, N'-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionyl] A hydrazide derivative such as hydrazine can be used. These copper damage inhibitors may be used alone or in combination of two or more. Moreover, Adeka Stub ZS-27 (trade name, manufactured by ADEKA Corporation) can be used as a commercially available copper damage inhibitor in which a plurality of copper damage inhibitors and the like are mixed in advance.

  Among these, the effects of the present invention become more prominent when salicylic acid derivatives such as 3- (N-salicyloyl) amino-1,2,4-triazole and triazoles are used.

  The addition amount of the copper damage inhibitor is preferably 0.05 to 5.0 parts by mass with respect to 100 parts by mass of the polyimide resin as the base resin. This is because if the amount of the copper damage inhibitor added is too small, the desired effect cannot be obtained, and if it is too large, problems such as blooming of the copper damage inhibitor on the resin surface and an increase in cost will occur.

  Moreover, in this invention, the antioxidant used for a commercially available polymeric material other than said copper damage inhibitor can also be used together. Oxidative degradation of the polymer material can be more effectively suppressed by using a copper damage inhibitor and an antioxidant together. The antioxidant used in the present invention has a function of decomposing a peroxide generated during the oxidative degradation of the polymer material and stopping the subsequent auto-oxidation cycle.

  Specifically, the composition comprising the polyimide resin and copper damage inhibitor according to the present invention includes an antioxidant such as a phenol-based antioxidant, a phosphorus-based antioxidant, and a sulfur-based antioxidant as necessary. Can be used in combination.

Examples of the phenolic antioxidant include Irganox 1010 (trade name: Irganox 1010, substance name: pentaerythritol tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], BASF. Manufactured by Japan Co., Ltd.), Irganox 1076 (trade name: Irganox 1076, substance name: octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate, manufactured by BASF Japan Co., Ltd.), Irganox 1330 (trade name: Irganox 1330, substance name: 3,3 ′, 3 ″, 5,5 ′, 5 ″ -hexa-t-butyl-α, α ′, α ″-(mesitylene-2 , 4,6-triyl) tri-p-cresol, manufactured by BASF Japan Ltd., Irganox 3114 (trade name: Irg nox 3114, substance name: 1,3,5-tris (3,5-di-tert-butyl-4-hydroxybenzyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -Trion, manufactured by BASF Japan Ltd., Irganox 3790 (trade name: Irganox 3790, substance name: 1,3,5-tris ((4-t-butyl-3-hydroxy-2,6-xylyl) methyl) ) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, manufactured by BASF Japan Ltd.), Irganox 1035 (trade name: Irganox 1035, substance name: thiodiethylenebis [3 -(3,5-di-tert-butyl-4-hydroxyphenyl) propionate], manufactured by BASF Japan Ltd.), Irganox 1135 (trade name: Irganox) 1135, substance name: benzenepropanoic acid 3,5-bis (1,1-dimethylethyl) -4-hydroxy C7-C9 side chain alkyl ester, manufactured by BASF Japan Ltd., Irganox 1520L (trade name: Irganox 1520L) , Substance name: 4,6-bis (octylthiomethyl) -o-cresol, manufactured by BASF Japan Ltd.), Irganox 3125 (trade name: Irganox 3125, manufactured by BASF Japan Ltd.), Irganox 565 (product) Name: Irganox 565, substance name: 2,4-bis (n-octylthio) -6- (4-hydroxy 3 ′, 5′-di-t-butylanilino) -1,3,5-triazine, BASF Japan Ltd. Adeka Stub AO-80 (trade name: ADK STAB AO-80, substance name: 3,9-bis) 2- (3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy) -1,1-dimethylethyl) -2,4,8,10-tetraoxaspiro (5,5) undecane , Manufactured by ADEKA Co., Ltd.), Sumilizer BHT (trade name: Sumilizer BHT, manufactured by Sumitomo Chemical Co., Ltd.), Sumilizer GA-80 (trade name: Sumilizer GA-80, manufactured by Sumitomo Chemical Co., Ltd.), Sumilizer GS (commercial product) Name: Sumilizer GS, manufactured by Sumitomo Chemical Co., Ltd.), Cyanox 1790 (trade name: Cyanox 1790, manufactured by Cytec Co., Ltd.), vitamin E (for example, manufactured by Eisai Co., Ltd.), and the like.
The content of the phenolic antioxidant is preferably 0.001 to 10 parts by mass, and more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the polyimide resin that is the base resin.

Examples of the phosphorus antioxidant include Irgaphos 168 (trade name: Irgafos 168, substance name: Tris (2,4-di-t-butylphenyl) phosphite, manufactured by BASF Japan Ltd.), Irgaphos 12 ( Product name: Irgafos 12, substance name: Tris [2-[[2,4,8,10-tetra-t-butyldibenzo [d, f] [1,3,2] dioxaphosphin-6-yl] Oxy] ethyl] amine, manufactured by BASF Japan Ltd.), Irgaphos 38 (trade name: Irgafos 38, substance name: bis (2,4-bis (1,1-dimethylethyl) -6-methylphenyl) ethyl ester Phosphoric acid, manufactured by BASF Japan Ltd.), ADK STAB 329K (trade name, manufactured by ADEKA Corp.), ADK STAB PEP36 (trade name, Corp.) DEKA), ADK STAB PEP-8 (trade name, manufactured by ADEKA Corporation), Sandstab P-EPQ (trade name, manufactured by Clariant), Weston 618 (trade name: Weston 618, manufactured by GE), Weston 619G (product) Name: Weston 619G, manufactured by GE), Ultranox 626 (trade name: Ultranox 626, manufactured by GE) and Sumilizer GP (trade name: Sumilizer GP, substance name: 6- [3- (3-t-butyl-4 -Hydroxy-5-methylphenyl) propoxy] -2,4,8,10-tetra-t-butyldibenz [d, f] [1.3.2] dioxaphosphine) (manufactured by Sumitomo Chemical Co., Ltd.) Etc.
The content of the phosphorus antioxidant is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the polyimide resin.

Examples of the sulfur-based antioxidants include 2-mercaptobenzimidazole, dilauryl thiodipropionate, dimyristyl thiodipropionate, distearyl thiodipropionate, and pentaerythritol tetra (β-dodecyl). And β-alkyl mercaptopropionic esters of polyols such as mercaptopropionate).
The content of the sulfur-based antioxidant is preferably 0.01 to 10 parts by mass, more preferably 0.05 to 5 parts by mass with respect to 100 parts by mass of the polyimide resin.

  It is preferable to contain a copper damage inhibitor in the polyimide resin since the heat-resistant peel strength can be further improved.

Hereinafter, one embodiment of the present invention will be described in detail.
The copper foil of the present invention to be used has a surface to be laminated with a polyimide resin (a surface on which various treatments described below including a roughening treatment are performed before the lamination) has a glossiness of 10 or more before the treatment described later. Preferably there is. The gloss of the untreated copper foil before use is about 0 to 30 for the matte foil, about 100 to 500 for the glossy foil, and the surface shape with a gloss of less than 10 has sufficient visibility after the roughening treatment. This is because it becomes difficult to obtain.
A copper foil having a desired surface gloss can be produced under the following conditions. Hereinafter, an electrolytic copper foil will be described as an example .

[Electrolytic copper foil production conditions]
3-Mercapto-1-sodium propanesulfonate: 0.5-3.0 ppm
Hydroxyethyl cellulose: 2-20ppm
Glue (molecular weight = 3000): 1-10ppm
Cu: 40 to 150 g / L
H ₂ SO _4: 60~160g / L
Liquid temperature: 40 ° C to 60 ° C
Current density: 30 to 90 A / dm ²

  At least one surface of the copper foil (in the case of electrolytic copper foil, at least one surface (preferably the M surface) or S surface (Shiny surface) of the M surface (Shiny surface), in the case of rolled copper foil, at least one of the rolled surfaces. Surface). With a copper foil in a non-roughened state, it is difficult to achieve both visibility and resin adhesion. It is important to adjust the foil surface to an appropriate state by post-processing described below.

  One typical example of the roughening treatment is pure copper (Cu) -based roughening plating in which fine granular pure copper is formed on the surface of the copper foil by electroplating. A copper sulfate plating solution is used for pure copper-based rough plating. The sulfuric acid concentration of the roughening plating solution is preferably 50 to 250 g / L, particularly preferably 70 to 200 g / L. If the sulfuric acid concentration is too low, the electrical conductivity is low, and the electrodeposition properties of the roughened particles are deteriorated. If the sulfuric acid concentration is too high, corrosion of the equipment is promoted.

  The copper concentration of the pure copper-based roughening plating solution is preferably 6 to 100 g / L, and particularly preferably 10 to 50 g / L. When the copper concentration is too low, the electrodeposition property of the roughened particles is deteriorated. If the copper concentration is too high, a larger current is required for plating in the form of particles, which is not realistic in terms of equipment.

As a representative example of another roughening treatment, there is alloy-based roughening plating in which a fine granular Cu—Co—Ni alloy is formed on a copper foil surface by electroplating. Cu-Co-Ni alloy plating, by electroplating, coating weight of ternary alloys such that 5 to 15 mg / dm ² of copper -20~90μg / dm ² of cobalt -100~900μg / dm ² of nickel It can be implemented to form a layer. If the amount of Co adhesion is too low, the peel strength after the heat resistance test may be lowered. If the amount of Co adhesion is too high, etching residues are likely to occur, which is not preferable. If the Ni adhesion amount is too low, the peel strength after the heat resistance test may be lowered. On the other hand, if the Ni adhesion amount is too high, an etching residue tends to be generated, which is not preferable. A more preferable amount of Co adhesion is 30 to 80 μg / dm ² , and a more preferable amount of nickel adhesion is 200 to 400 μg / dm ² .

  The copper concentration of the Cu—Co—Ni alloy-based roughening plating solution is 2 to 10 g / L, the cobalt concentration is 20 to 40 g / L, the nickel concentration is 20 to 40 g / L, and the sulfuric acid concentration is 50 to 250 g / L. Is preferred. When the copper, cobalt and nickel concentrations are below the above range, the electrodeposition of the roughened particles becomes poor. When the copper, cobalt and nickel concentrations exceed the above range, a larger current is required for plating in the form of particles, which is also an actual facility. Not right.

Current density pure copper and Cu-Co-Ni alloy-based roughening plating are both preferably 5~120A / dm ^2, in particular 25~100A / dm ² is preferred. If the current density is too low, it takes time for processing, which is not productive. When the current density is too high, the electrodeposition property of the roughened particles is deteriorated.

In order to prevent the roughened particles from falling off after the roughening treatment, thin copper smooth plating (cover plating) may be performed on the surface of the roughened particle layer. The liquid composition at this time is a copper concentration of 40 to 200 g / L, a sulfuric acid concentration of 70 to 200 g / L, a current value of 0.4 to 20 A / dm ² , a liquid temperature of 40 to 60 ° C., and a treatment time of 1 to 1. Preferably it is 10 seconds.

  In the roughening conditions used in the present invention, the height of the formed roughened particles tends to change preferentially in the “roughening plating” part. On the other hand, the width of the roughened particles tends to change preferentially in the “cover plating” portion. Moreover, since covering plating also has a function of filling the valleys between the roughening particles, if the covering plating is applied too much, the height of the roughening particles may be reduced too much. By appropriately controlling these two types of plating, it is possible to control the shape of the roughened particles according to the application. For example, if the amount of electric power for roughing plating is small and the amount of electric power for plating is large, the roughening particles have a gentle shape with a large skirt (for example, shape 2 shown in Table 1 above). On the other hand, if the amount of electric power for rough plating is large and the amount of electric power for plating is small, the rough particles have an elongated shape (for example, shape 3 shown in Table 1 above). Further, regarding the copper concentration of the roughening plating solution, when the concentration is high, the roughened particle shape becomes gentle (for example, the shape 2 shown in Table 1 above), and when it is thin, elongated roughened particles are formed with high density ( For example, the shape shown in Table 1 tends to be 3).

  Moreover, you may perform a roughening process by methods other than roughening plating. Examples include those by etching treatment, those that oxidize and roughen the foil surface by oxidizing agent or atmosphere adjustment, those that roughen the surface by re-reducing the oxidized surface, and those that combine these. Can be mentioned.

  Next, treatment by PR pulse electrolysis is performed on at least one surface of the electrolytic copper foil subjected to the roughening treatment. By applying PR pulse electrolysis, the dissolution and precipitation of the roughened particles are repeated, the roughened particles are reduced in size, the number of roughened particles is increased, and the surface of the roughened particles is smoothed to improve the visibility. It becomes a particle shape.

As the electrolytic solution used for the PR pulse electrolytic treatment, it is preferable to use the above-described pure copper-based roughening plating solution and Cu-Co-Ni alloy-based roughening plating solution. In addition, a pure copper-based roughening treatment was performed using a pure copper-based roughening plating solution for a PR pulse electrolytic treatment, and a PR-pulse electrolytic treatment was also performed using a Cu-Co-Ni for a Cu-Co-Ni alloy roughening treatment. By using the alloy-based rough plating solution, there are advantages that the types of solutions to be used are reduced and the management of the plating solution is facilitated.
The forward electrolysis time and reverse electrolysis time of PR pulse electrolysis are preferably in the range of 50 to 500 milliseconds. If this time is too short, the effect of PR pulse electrolysis is hardly exhibited, and if it is too long, coarse particles may be coarsened.
Forward current density of the PR pulse electrolysis is preferably 0.5~10A / dm ^2. If the forward current density is too small, the amount of precipitation per pulse is small, and it is difficult to obtain an effect on the surface shape. If it is too large, the electrodeposition property becomes worse.
Reverse current density is preferably 1 to 20A / dm ^2. Further, even within this range, conditions that are greatly below or above the forward current density are not preferable. The conditions of the PR pulse electrolysis are determined by comprehensive judgment because each item has a close influence.

  Further, if necessary, an alkali immersion treatment is performed as a post treatment. This treatment is performed for the purpose of removing the residue of surface contaminants such as the additive for foil making and smoothing the surface of the roughened particles. An NaOH aqueous solution is used as the alkaline solution. The NaOH concentration is preferably in the range of 10 to 60 g / L. The solution temperature is preferably 20 to 50 ° C., and the immersion time is preferably 5 to 50 seconds.

After the roughening treatment, a nickel and zinc diffusion-preventing coating covering the roughened particles is performed. In the present invention, it is preferable to use nickel-> zinc continuous electroplating or nickel / zinc alloy electroplating under the following conditions .

[Nickel → zinc continuous electroplating]
Nickel plating bath NiSO ₄ · 6H ₂ O: 45 g / L to 450 g / L
H ₃ BO ₃ : 10 g / L to 50 g / L
pH: 3.0-4.5
Bath temperature: 30 ° C-60 ° C
Current density: 0.1 A / dm ^{2 to} 2.0 A / dm ²
Plating time: 2 seconds to 30 seconds, zinc plating bath ZnSO ₄ .7H ₂ O: 3 g / L to 100 g / L
NaOH: 20 g / L to 80 g / L
Bath temperature: 20-40 ° C
Current density: 0.1 A / dm ^{2 to} 2.0 A / dm ²
Plating time: 2 to 30 seconds

[Nickel / Zinc Alloy Electroplating]
_{NiSO 4 · 6H 2 O: 45g} / L~450g / L
ZnSO ₄ · 7H ₂ O: 3 g / L to 100 g / L
(NH ₄ ) ₂ SO ₄ : 3 g / L to 30 g / L
pH: 4.0-6.0
Bath temperature: 30-50 ° C
Current density: 0.1 A / dm ^{2 to} 2.0 A / dm ²
Plating time 6 to 60 seconds

  At least one surface of the electrolytic copper foil (preferably, the copper foil surface on the side subjected to the roughening treatment and the diffusion prevention coating) may be further subjected to a surface treatment. Specifically, surface treatment for the purpose of adhesion, chemical resistance and rust prevention can be mentioned. Among the surface treatments, examples of the treatment agent used for the metal surface treatment include Cr, Si, Co, and Mo alone or hydrates. As the alloy surface treatment, Cr is deposited after depositing at least one metal of Si, Co, and Mo or an alloy containing one or more metals.

  An example of the plating solution and plating conditions for performing the metal surface treatment or alloy surface treatment (attaching the metal or alloy) are shown below.

[Mo-Co plating]
Na ₂ MoO ₄ · 2H ₂ O 1-30 g / L
CoSO ₄ · 7H ₂ O 1-50 g / L
Trisodium citrate dihydrate 30-200 g / L
Current density 1-50A / dm ²
Bath temperature 10-70 ° C
Treatment time 1 second to 2 minutes pH 1.0 to 4.0

[Cr plating]
CrO ₃ 0.5-40 g / L
Bath temperature 20-70 ° C
Processing time 1 second to 2 minutes Current density 0.1 to 10 A / dm ²
pH 1.0-4.0

Ni, Mo, and the like that are contained in the anti-diffusion coating and adhered to the surface of the copper foil after the roughening treatment by the surface treatment are metals that deteriorate the etching property. Therefore, it is preferable that the adhesion amount to the surface of these metals is 1 mg / dm ² or less. In addition, Zn is preferably 0.2 mg / dm ² or less because Zn may melt at the time of etching and cause deterioration in peel strength if the amount of adhesion to the surface is too large. Moreover, if both are such adhesion amounts, the shape and surface color (appearance) of the roughened surface of the electrolytic copper foil after the surface treatment will not be greatly impaired.

  In order to improve the peel strength, it is preferable to treat the surface subjected to the metal surface treatment with a silane coupling agent (silane coupling treatment). Examples of the silane coupling agent include commonly used amino, vinyl, isocyanate, and epoxy types, but the type is not particularly limited in the present invention.

  In the copper clad laminate of the present invention, the use of an adhesive or thermocompression bonding is not necessary for laminating the copper foil and the polyimide resin layer. A roughened particle layer is provided on one surface of the copper foil, and a diffusion preventing coating having the specific Ni / Zn ratio is further formed thereon, and the surface is further subjected to metal surface treatment or alloy surface treatment, chromate treatment and silane. Adhesion with the polyimide resin layer of the copper foil can be ensured by performing an alkali immersion treatment as a coupling treatment and, if necessary, a post-treatment.

  In the case of a rolled copper foil as the copper foil of the present invention, any one such as a tough pitch copper foil, a copper silver alloy foil (Cu-Ag 0.02-0.03% by mass) can be used. Similarly to the case of the above-described electrolytic copper foil, the rolled copper foil is subjected to various treatments and then laminated with a polyimide resin.

  The present invention will be described below in more detail based on examples, but the present invention is not limited thereto.

Examples 1 to 13 and Comparative Examples 1 to 12
<Preparation of copper foil>
An electrolytic copper foil (thickness 12 μm) manufactured under the following electrolytic copper foil manufacturing conditions in which the glossiness of the M surface (Matté surface) is 230 and the glossiness of the S surface (Shiny surface) is 100 was prepared (hereinafter referred to as this). The type of copper foil is abbreviated as “electrolysis”.) Separately, a rolled copper foil (tough pitch copper, as roll foil) (thickness 12 μm) was also prepared (hereinafter, the type of the copper foil is abbreviated as “rolled”).

[Electrolytic copper foil production conditions]
3-Mercapto-1-sodium propanesulfonate: 0.5-3.0 ppm
Hydroxyethyl cellulose: 2-20ppm
Glue (molecular weight = 3000): 1-10ppm
Cu: 40 to 150 g / L
H ₂ SO _4: 60~160g / L
Bath temperature: 40 ° C-60 ° C
Current density: 30 to 90 A / dm ²

  Each of these copper foils is degreased and pickled according to a conventional method, and then subjected to a pure copper-based or alloy-based roughening treatment on one side of the copper foil (on the matte side in the case of electrolytic copper foil) under the conditions described below, and then covered. Plating treatment was performed. The temperatures of the pure copper-based and alloy-based roughening plating solutions were both 25 ° C.

The copper concentration of the plating solution was 70 g / L, the sulfuric acid concentration was 110 g / L, and the solution temperature was 50 ° C.
Other detailed conditions are shown in Table 2. By appropriately controlling the conditions of “roughening plating process” and “covering plating process” as shown in Table 2, the shape of the roughened particles was controlled.

  PR pulse electrolytic treatment was performed on the roughened surface side of some of the samples after the overplating using a plating solution having the same composition as the roughened plating solution. This treatment was repeated for a predetermined time in the order of pulse forward electrolysis (350 milliseconds), pulse reverse electrolysis (100 milliseconds), and pulse electrolysis stop (200 milliseconds). Other detailed conditions are shown in Table 2.

  Alkaline dipping treatment was performed on each of the copper foils subjected to the roughening plating, covering plating, and PR pulse electrolytic treatment. The treatment liquid was NaOH at 40 g / L, the liquid temperature was 50 ° C., and the treatment time was 32 seconds.

  On the roughened surface of the copper foil after alkali immersion treatment, anti-diffusion coating (the following nickel → zinc continuous electroplating), surface rust prevention treatment (the following Cr plating treatment) and silane coupling treatment are performed in this order. It was. An amino system (trade name: KBM-903, manufactured by Shin-Etsu Chemical Co., Ltd.) is used as a silane coupling agent, and an aqueous solution having a concentration of 0.2% by mass is prepared, and applied to a copper foil and dried (120 ° C.) to obtain a silane cup. Ring treatment was applied.

[Nickel → zinc continuous electroplating]
Nickel plating bath NiSO ₄ · 6H ₂ O: 45 g / L to 450 g / L
H ₃ BO ₃ : 10 g / L to 50 g / L
pH: 3.0-4.5
Bath temperature: 30 ° C-60 ° C
Current density: 0.1 A / dm ^{2 to} 2.0 A / dm ²
Plating time: 2 seconds to 30 seconds, zinc plating bath ZnSO ₄ .7H ₂ O: 3 g / L to 100 g / L
NaOH: 20 g / L to 80 g / L
Bath temperature: 20-40 ° C
Current density: 0.1 A / dm ^{2 to} 2.0 A / dm ²
Plating time: 2 to 30 seconds

[Cr plating] (chromate treatment)
CrO ₃ 0.5-40 g / L
Bath temperature 20-70 ° C
Processing time 1 second to 2 minutes Current density 0.1 to 10 A / dm ²
pH 1.0-4.0

<Preparation of polyimide resin>
(Synthesis of polyamic acid)
A reaction vessel equipped with a thermocouple and a stirrer and capable of introducing nitrogen is charged with N, N-dimethylacetamide, and further, 2,2-bis [4- (4-aminophenoxy) phenyl] propane (BAPP) is added to the reaction vessel. ) And dissolved in the container with stirring. Next, pyromellitic dianhydride (PMDA) is added to a monomer having a molar ratio of about 1: 1 of the diamine (BAPP) and acid dianhydride (PMDA), and the total amount of these monomers. It charged so that it might become 12 mass%.

  A polyamic acid obtained by adding 0.2 parts by mass of one of the following copper damage inhibitors to 100 parts by mass of the prepared polyamic acid was similarly prepared.

Copper damage inhibitor 1: Salicylic acid derivative / triazoles (trade name: ADK STAB CDA-1, manufactured by ADEKA Corporation)
Substance name: 3- (N-salicyloyl) amino-1,2,4-triazole

Copper damage prevention agent 2: Oxalic acid derivative (trade name: Naugard XL-1, manufactured by Advantant)
Substance name: 2,2′-oxamido-bis [ethyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate]

Copper damage inhibitor 3: hydrazide derivative (trade name: Irganox MD1024, manufactured by BASF Japan Ltd.)
Substance name: N, N′-bis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyl] hydrazine

  On the surface of each copper foil that has been subjected to the silane coupling treatment, the thickness of the polyimide resin produced after curing the polyamic acid solution containing the copper damage inhibitor or not containing the copper damage inhibitor is 2.5 μm. After uniform application, the solvent was removed by heating at 130 ° C. Next, a polyamic acid solution containing no copper damage inhibitor is applied uniformly to the coated surface so that the thickness of the polyimide resin produced after curing is 20.0 μm, and the solvent is removed by heating at 120 ° C. did. Furthermore, the thickness of the polyimide resin produced after curing the same polyamic acid solution (containing the copper damage inhibitor or not containing the copper damage inhibitor) as that applied to the first layer on the coated surface side is 2 The film was uniformly applied to a thickness of 5 μm and dried by heating at 130 ° C. to remove the solvent. Each long copper foil was heat-treated in a continuous curing furnace set so that the temperature gradually increased from 300 ° C. to 300 ° C. over a period of about 6 minutes. Imidization was performed to obtain a copper-clad laminate having a total thickness of 25 μm of the formed polyimide resin layer consisting of all three layers.

  Each characteristic is shown in Table 3 about the copper foil of each produced Example and each comparative example.

  In each Example and each Comparative Example, each characteristic was measured by the following method.

(1) Measurement of diffuse reflectance For measurement, UV-visible spectrophotometer V-660 (trade name, integrating sphere unit) manufactured by JASCO Corporation was used. Measuring light was incident perpendicularly to the roughened surface of the copper foil before being bonded to the polyimide resin, and the diffuse reflectance (Rd) was measured. In all cases, the value at a wavelength of 600 nm was used for evaluation.

(2) Measurement of surface color (saturation (C ^* )) An ultraviolet-visible spectrophotometer V-660 (trade name, integrating sphere unit) manufactured by JASCO was used for measurement. The total light spectral reflectance of the roughened surface of the copper foil before being attached to the polyimide resin at a wavelength of 870 to 200 nm was measured. From the spectrum, L ^* , a ^* , and b ^* were calculated by the software attached to the measuring instrument. C ^* was calculated from a ^* and b ^{* according} to Equation 1 above.

(3) Measurement of roughened particle height Each of the produced copper-clad laminates was filled with a resin, and after the cross-section was taken out, FE-SEM (field emission scanning electron microscope) (trade name: SU8020, manufactured by Hitachi High-Technology) was used. Observed at 50000 times. The height of ten coarse particles randomly selected from a 5 μm square field of view was measured, and the arithmetic average value was defined as the coarse particle height. The details of the method for measuring the coarse particle height are shown in FIG. That is,
[1] The two roots of the roughened particles (the roughened particles that are visible on the front side in the SEM photograph shown in the figure) cut at the time of sectioning are connected to the point where the height of the roughened particles is the highest. Draw a triangle. In the observation at 50000 times, a viewing angle of 5 μm cannot be observed, and depending on conditions, 10 roughened particles may not be observed. In this case, two to three cross-sectional SEM images at different photographing locations are obtained. The arithmetic average height is obtained by using a sheet.
[2] For the triangle drawn in [1], measure the height of the triangle when the point where the height of the roughened particle is the highest is the apex and the line connecting the roots of the roughened particle is the base, and this is the rough The height of the particle size. The arithmetic average height is obtained and used as the coarse particle height.

(4) Measurement of element adhesion amount ratio Using an ICP emission analyzer (manufactured by Shimadzu Corporation, trade name: ICPS-7000), the adhesion amount of nickel and zinc on the roughened surface of the copper foil before being attached to the polyimide resin, It measured by the method according to the specification of JISK0553-2002. The Ni adhesion amount of the alloy-based roughened product was determined by measuring the total adhesion amount of Ni constituting the roughened particles and Ni constituting the diffusion preventing layer. From the measured adhesion amount, the Ni / Zn adhesion amount ratio (mass ratio) was calculated.

  Performance evaluation of the copper foil of each Example and each comparative example was performed by the following method.

(5) Film visibility evaluation Polyimide in which the copper foil surface was transferred to one side of the copper clad laminate produced in each of the above Examples and Comparative Examples by dissolving all of the copper foil with a copper chloride etchant. A film was prepared.
For the measurement, an ultraviolet-visible spectrophotometer V-660 (trade name, integrating sphere unit) manufactured by JASCO Corporation was used, a monochromatic light having a wavelength of 600 nm was used as the light source, and other measurement conditions were in accordance with JIS K 7136-2000. . Measuring light was incident perpendicularly to the surface of the polyimide film on which the copper foil surface irregularities were transferred, and the transmitted light entered the integrating sphere. The transmittance when a standard reflector similar to the inner wall of the integrating sphere is installed at the location where the optical axis of the incident light intersects with the inner wall of the integrating sphere is the total light transmittance (T _t ). The transmittance when measured after the light transmitted through is removed from the integrating sphere is excluded is the diffuse transmittance (T _d ). The measurement results are shown in Table 4.
(T _d / T _t ) × 100 (%) was calculated as a haze value.
As the evaluation of visibility, “excellent (A)” when haze value <40 (%), “good (B)” when 40 ≦ haze value <80 (%), and 80 (%) ≦ haze value. Was determined as “poor (E)”. The thing of visibility evaluation E is inferior visibility of the grade which is not suitable for a printed wiring board use, and the thing of visibility evaluation B is the favorable visibility of a grade suitable for a printed wiring board use. The visibility increases in the order of B to A, and a visibility evaluation A is more preferable. The haze values are also shown in Table 4.

(6) Measurement of peel strength between copper foil / resin The normal peel strength and heat-resistant peel strength were measured as follows as a measure of the adhesion between the copper foil and the polyimide resin layer. Using the samples before and after the heat resistance test (heat treatment for 1000 hours in the atmosphere at 150 ° C.) of the copper clad laminate prepared in each of the above Examples and Comparative Examples, the copper foil portion was masked with 10 mm width tape and chlorinated. After performing the copper etching, the tape was removed to prepare a sample having a width of 10 mm, and the normal peel strength and the heat-resistant peel strength were measured in accordance with the standard of JIS C 6481-1996.
When both the normal peel strength and the heat-resistant peel strength are 1.0 kN / m or more, “( A)” is designated, and when either one of the peel strength is less than 1.0 kN / m and 0.8 kN / m or more, “( and B) ", either when one of the peel strength of 0.5 or more kN / m less than 0.8 kN / m with a" (C) ", one of the peel strength 0.5 kN / m less than It was "(D)" the time of. The results were described together in Table 4.

(7) Comprehensive evaluation of visibility and adhesion From the results of (5) and (6) above, comprehensive evaluation was performed based on the following criteria. The results are also shown in Table 4.
Even one of visibility and adhesion has a D rating or E rating : D
The adhesion evaluation has C evaluation and the visibility is not E evaluation: C
Visual認性, at least one of adhesion with B rating, and D evaluation and E evaluation having no: B
Both evaluation items are A evaluation: A

In all of Examples 1 to 13, the overall evaluation is C 1 , B, and A, which can be said to be at a level having no practical problem. As for the roughened shape of the copper foil surface, all of the results of the cross-sectional observation satisfied the definition of the present invention, and the shape indicated by shape 1 in Table 1 was obtained.
In comparison of the actual Example 1 Example 1 2, the heat-resistant peel strength towards those containing copper inhibitor is high, it can be seen more preferable. In comparison of the actual Example 1 and Example 9, Rd is more preferably it can be seen that it is more than 24%. Comparing the actual施例1-6 Example 7-11, among others those using copper deactivator in pure copper roughening treatment, Rd is 24 to 38%, Ni deposition amount ratio is 5.6 to 20% It can be seen that is more preferable. Although Example 1 and Example 13 had the same roughened particle height, Example 13 had a higher haze value and lower visibility, but due to irregularities due to oil pits specific to the rolled copper foil. It can be seen that it is preferable to use electrolytic copper foil.

On the other hand, each comparative example showed inferior properties.
In Comparative Example 1, R _d , C ^*, and the roughened particle height were all higher than those defined in the present invention, and the shape represented by shape 4 in Table 1 was observed when the cross-section was observed. Therefore, the adhesiveness is excellent, but the visibility is low and it is not suitable for practical use.
Comparative Example 2 is opposite to the Comparative Example 1, R _d and roughening particles height is lower than the provisions of this invention, has a shape represented by the shape 5 shown in Table 1 when performing cross-sectional observation. Therefore, both are excellent in visibility but are not suitable for practical use because of low adhesion.
In Comparative Examples 3 and 4, the roughened particle height and the nickel / zinc adhesion ratio are within the specified range of the present invention, and the resin contains a copper damage inhibitor, but at least one of R _d and C ^* is the present invention. When the cross-sectional observation was performed, the shapes represented by the shapes 2 and 3 in Table 1 were obtained. Both have good visibility but are not suitable for practical use because of low adhesion.
In Comparative Examples 5 and 6, the nickel / zinc adhesion ratio was lower than specified in the present invention. All of them have good visibility but are not suitable for practical use because of poor adhesion.
In Comparative Example 7, R _d , C ^*, and the roughened particle height were all higher than those defined in the present invention, and the shape represented by shape 4 in Table 1 was observed by cross-sectional observation. Therefore, the adhesiveness is excellent, but the visibility is low and it is not suitable for practical use.
Comparative Example 8 opposite to the Comparative Example 1, R _d and roughening particles height is lower than the provisions of this invention, has a shape represented by the shape 5 shown in Table 1 when performing cross-sectional observation. Therefore, it is excellent in visibility but is not suitable for practical use because of low adhesion.
Comparative Examples 10 to 12 correspond to those in which PR pulse electrolytic treatment of Examples 1, 8, and 12 was not performed. When the cross sections of Comparative Examples 10 to 12 were observed, the valleys between the roughened particles were very deep. Therefore, the average value of the height of the roughened particles was high, and it was close to the shape represented by shape 4 in Table 1. Therefore, although it is excellent in adhesiveness, since visibility is low, it is not suitable for practical use. The PR pulse electrolytic treatment of the present invention contributes to the improvement of visibility by reducing the height of the roughened particles by filling the valleys between the roughened particles to some extent and bringing them close to the shape 1 in Table 1.

  As mentioned above, there is no practical problem for the first time when the roughened particle height, diffuse reflectance, saturation, and nickel / zinc adhesion ratio of the diffusion prevention coating on the copper foil surface are all in accordance with the provisions of the present invention. It can be seen that the level is reached. Furthermore, it turns out that heat-resistant peel strength is further improved by containing a copper damage inhibitor in a polyimide resin.

  By this invention, it becomes possible to provide the copper clad laminated board for wiring boards excellent in resin adhesiveness and visibility suitable for a printed wiring board use, and the copper foil used for this.

Claims (3)

Having a roughened particle layer made of roughened particles having an arithmetic average height of 0.05 to 0.5 μm on at least one surface of the copper foil, the roughened particles being made of pure copper , In addition, at least nickel and zinc are included, and the ratio (mass ratio) of the adhesion amount of nickel to the roughening particle layer with respect to the adhesion amount of zinc to the roughening particle layer is within the range of 0.5 to 20 A copper foil having a coating, characterized in that a diffuse reflectance (R _d ) at a wavelength of 600 nm measured from the one surface side is within a range of 5 to 50% and a saturation (C ^* ) is 30 or less. Copper foil.   A copper clad laminate comprising the copper foil according to claim 1. The copper clad laminated board which has the polyimide resin layer containing the at least 1 sort (s) of copper damage inhibitor chosen from an oxalic acid derivative, a salicylic acid derivative, a hydrazide derivative, and triazoles in the said one surface side of the copper foil of Claim 1 .