JP5875631B2 - SMDLED heat dissipation structure - Google Patents

Description

The present invention relates to a heat dissipation structure for an LED bulb, and more particularly to a heat dissipation structure for an SMD LED.

Traditionally, most LED vendors use high lumen LED high power LEDs as the light source for illumination of light emitting diodes (LEDs) with high illumination. A K2 LED 10 produced by the Lumileds company is shown in FIG. 1, and a heat conducting copper pillar 14 for mounting the LED chip 15 is provided inside the pedestal 12, and large area heat conduction is performed via the bottom 16 of the heat conducting copper pillar 14. In other words, the K2 LED 10 has two to four terminals 18, and these terminals 18 function as heat conduction and heat dissipation while being used as conduction.

Low power surface-bonded (SMD) LED manufacturing equipment, modules and manufacturing costs are lower and easier to process than K2 LED, so SMD vendors have small dimensions to win the high illumination LED market. Evolving towards high current, high lumen chip SMD LEDs. A conventional SMD LED 20 is shown in FIGS. 2 and 3, a heat insulating fiber insulating layer 24 is provided on the upper end surface of the metal substrate 22, and a plurality of conductive copper foils spaced on the upper end surface of the fiber insulating layer 24. 25 and 25-1 are provided, and two conductive heat conductive electrodes 28 and 28-1 of positive and negative electrodes are provided on the package bottom surface of the LED 26, and the two electrodes 28 and 28-1 are spaced apart from each other. The two copper foils 25 and 25-1 are respectively fixed to be configured as conductive paths. Although the fiber insulating layer 24 can conduct heat, the heat conduction coefficient is very different from the heat conduction coefficient of the metal material, so that the heat conduction transmitted from the copper foil to the substrate 22 is lowered. Furthermore, after the SMD LED 26 is fixed to the substrate 22, conduction and heat conduction can be performed only with the two electrodes 28 and 28-1 (positive and negative metal soldering points). Far lower than LED10. Further, since the upper end surface of the copper foil is generally coated with a coating (for example, white lacquer) to prevent oxidation, the upper end surface of the copper foil may not be able to dissipate heat.

Furthermore, in order to make progress in the end use of SMD LED, first, as a first condition, unless the lumen and illuminance are increased to the lumen or illuminance of various conventional bulbs, it will develop in the field of high illumination illumination. It is not possible. Therefore, to replace a conventional bulb-type SMD LED bulb, it is necessary to limit the dimensions of the conventional bulb. Therefore, it is necessary to improve the illumination and illuminance of the SMD LED under the premise according to the dimensions of the conventional bulb, and to effectively dissipate the SMD LED structure to reach the standard of LED light attenuation. Otherwise, the future of SMD LED end use will be constrained.

Accordingly, providing a high heat dissipation structure for use with SMD LEDs is indeed a goal to strive in the LED industry.

Then, an object of this invention is to provide the thermal radiation structure of SMD LED containing a board | substrate, at least 1 SMD LED, and at least 1 coupling member. The substrate includes an upper end surface and a lower end surface, and a plurality of conductive heat conductive copper foils provided at intervals on the upper end surface. Two electrodes, a positive electrode and a negative electrode, are provided on the bottom surface of the SMD LED, and the two electrodes are fixed to two copper foils of the substrate, respectively, so that they are configured as conductive paths. At least one coupling hole penetrates any one copper foil close to the SMD LED, and the upper and lower end surfaces of the substrate. The coupling member is made of a highly heat-conductive metal material, and is inserted into the coupling hole to connect the copper foil and the substrate. Heat generated from the chip of the SMD LED fixed to the copper foil is transmitted to the lower end surface of the substrate through the coupling member, thereby promoting heat dissipation.

According to the heat dissipation structure of the SMD LED according to the present invention, the heat generated from the chip of the SMD LED can be effectively transmitted to the lower end surface of the substrate, and the standard of LED light attenuation can be reached.

It is a schematic diagram of conventional K2 LED. It is a schematic diagram of the conventional SMD LED. FIG. 3 is a top view of the SMD LED of FIG. 2. It is a schematic diagram of the SMD LED module of the first embodiment according to the present invention. It is a schematic diagram of the SMD LED module of the 2nd Example which concerns on this invention. It is a schematic diagram of the SMD LED module of the 3rd Example concerning the present invention. It is a schematic diagram of the SMD LED module of the 4th Example concerning the present invention. It is a schematic diagram of the SMD LED module of the 5th Example concerning the present invention. Fig. 8b is a schematic top view of the SMD LED module of Fig. 8a. It is a bottom surface schematic diagram of the SMD LED module of FIG. 8a. It is a schematic diagram of the SMD LED module of the 6th Example which concerns on this invention. FIG. 9b is a schematic bottom view of the SMD LED module of FIG. 9a. It is the schematic diagram by which the SMD LED module of the 2nd Example of this invention is applied to an LED bulb. It is the schematic diagram by which the SMD LED module of the 2nd Example of this invention is applied to an LED bulb. It is the schematic diagram by which the SMD LED module of the 3rd Example of this invention is applied to an LED bulb. It is the schematic diagram by which the SMD LED module of the 3rd Example of this invention is applied to an LED bulb. It is a schematic diagram by which the SMD LED module of the 4th Example of this invention is applied to an LED bulb. It is a schematic diagram by which the SMD LED module of the 4th Example of this invention is applied to an LED bulb. It is the schematic diagram by which the SMD LED module of the 5th Example of this invention is applied to an LED bulb. It is the schematic diagram by which the SMD LED module of the 5th Example of this invention is applied to an LED bulb. It is the schematic diagram by which the SMD LED module of the 6th Example of this invention is applied to an LED bulb. It is the schematic diagram by which the SMD LED module of the 6th Example of this invention is applied to an LED bulb. 15 to 18 are schematic views of four embodiments in which any two of the SMD LED modules of the second to sixth embodiments of the present invention are included in the LED bulb. 15 to 18 are schematic views of four embodiments in which any two of the SMD LED modules of the second to sixth embodiments of the present invention are included in the LED bulb. 15 to 18 are schematic views of four embodiments in which any two of the SMD LED modules of the second to sixth embodiments of the present invention are included in the LED bulb. 15 to 18 are schematic views of four embodiments in which any two of the SMD LED modules of the second to sixth embodiments of the present invention are included in the LED bulb. It is a schematic diagram of the SMD LED module of the 7th Example of this invention. It is a schematic diagram of the SMD LED module of the 8th Example of this invention. It is the schematic diagram by which the SMD LED module of the 7th Example of this invention is applied to an LED bulb. It is the schematic diagram by which the SMD LED module of the 7th Example of this invention is applied to an LED bulb. It is the schematic diagram by which the SMD LED module of the 8th Example of this invention is applied to an LED bulb. It is the schematic diagram by which the SMD LED module of the 8th Example of this invention is applied to an LED bulb. It is a schematic diagram of the SMD LED module of the 9th Example of this invention. It is a bottom surface schematic diagram of the SMD LED module of FIG. 23a. It is a schematic diagram by which the SMD LED module of the 10th Example of this invention is applied to LED daytime lamp. It is a top schematic diagram of the daytime lamp of FIG. 24a.

FIG. 4 shows a surface-bonded light emitting diode (SMD LED) module 30 and a heat dissipation structure thereof according to the first embodiment of the present invention. The SMD LED module 30 includes a substrate 32, at least one SMD LED 34 (an LED chip is sealed inside the SMD LED 34), and at least one coupling member 36. In this embodiment, the substrate 32 is a metal substrate and includes an upper end surface 38 and a lower end surface 40, and a fiber insulating layer 42 capable of conducting heat is provided on the upper end surface 38, so that the positive and negative electrodes of the SMD LED 34 can be obtained. The substrate 32 is not electrically conductive, and a plurality of conductive heat conductive copper foils 44 are provided on the outer end surface of the fiber insulating layer 42 with a space therebetween. Two conductive heat conductive electrodes 46 constituting positive and negative electrodes are provided on the bottom surface of the SMD LED 34, and the two electrodes 46 are respectively fixed to any two copper foils 44 at intervals. , Configured as a conductive path. Any one copper foil 44 close to the SMD LED 34 is provided with a coupling hole 48 penetrating the copper foil 44, the fiber insulating layer 42, and the upper and lower end surfaces 38, 40 of the substrate 32.

The coupling member 36 is made of a highly heat conductive metal material and is hollow or solid. In this embodiment, the coupling member 36 is a hollow rivet, and the copper foil 44, the fiber insulating layer 42, and the substrate 32 are connected by being inserted into the coupling hole 48. The upper end 50 and the lower end 52 of the coupling member 36 are formed as connection surfaces, respectively, and are coupled to the upper end surface of the copper foil 44 and the lower end surface 40 of the substrate 32, respectively. As a result, the heat generated from the SMD LED 34 fixed to the copper foil 44 is transferred to the coupling member 36 through the two electrodes 46 through the low thermal conductivity fiber insulating layer 42 and directly coupled to the coupling member (rivet). ) 36 is transmitted to the lower end surface 40 of the metal substrate 32 (the lower end surface 40 is not coated with a coating), and the exposed lower end surface 40 of the substrate 32 promotes heat dissipation. Therefore, it can be avoided that the heat generated from the chip of the SMD LED 34 accumulates on the copper foil 44 and the substrate 32 to cause light attenuation of the LED. Since the contact portion between the copper foil 44 and the coupling member 36 is in good contact, it is not necessary to perform coating. In another embodiment, the coupling member 36 is a screw, and is inserted into the coupling hole 48 to connect the copper foil 44, the fiber insulating layer 42, and the substrate 32.

FIG. 5 shows an SMD LED module 30 and a heat dissipation structure thereof according to the second embodiment of the present invention. In this embodiment, the substrate 32 is a metal substrate, and a heat insulating fiber insulating layer 42 is provided on each of the upper and lower end surfaces 38, 40 of the substrate 32. The outer end surfaces of the fiber insulating layers 42 are spaced apart from each other. A plurality of conductive heat conductive copper foils 44 are provided, and the copper foil 44 on the lower end surface 40 is exposed entirely (not coated with any coating). A bonding hole 48 is provided in the copper foil 44 at any one or a plurality of unipolar locations adjacent to the SMD LED 34, and the bonding hole 48 includes the substrate 32, the two fiber insulating layers 42, and the upper and lower end surfaces 38. The copper foil 44, the two fiber insulating layers 42, and the substrate 32 are connected to each other by being inserted into the coupling hole 48 by the coupling member 36. As a result, the heat generated from the chip of the SMD LED 34 is directly transferred from the copper foil 44 on the upper end surface 38 to the copper foil 44 on the lower end surface 40 via the coupling member 36 (the copper foil 44 on the lower end surface 40 is exposed entirely). It is possible to achieve a large area heat dissipation effect.

FIG. 6 shows an SMD LED module 30 and a heat dissipation structure thereof according to a third embodiment of the present invention. In this embodiment, a metal plate 54 (for example, a copper plate) is suspended from the lower end surface 40 of the substrate 32 of the first embodiment, and the lower end 52 of the coupling member 36 is coupled to the metal plate 54. The upper and lower surfaces of the metal plate 54 exposed to the air improve high-speed heat conduction and increase the heat radiation area. FIG. 7 shows the SMD LED module 30 and the heat dissipation structure of the fourth embodiment of the present invention. In this embodiment, a metal plate 54 (for example, a copper plate) is suspended from the lower end surface 40 of the substrate 32 of the second embodiment, and the lower end 52 of the coupling member 36 is coupled to the metal plate 54. The upper and lower surfaces of the metal plate 54 exposed to the air improve high-speed heat conduction and increase the heat radiation area. Specifically, heat generated from the SMD LED 34 is transmitted to the upper end 50 of the coupling member 36 by the positive electrode copper foil 44 having a relatively large area, and is suspended from the substrate 32 along the coupling member 36 located in the coupling hole 48. Heat is conducted by being conducted to the provided metal plate 54. Since the metal plate 54 is suspended from the substrate 32 (that is, a space for heat dissipation is formed between the upper end surface of the metal plate 54 and the lower end surface of the substrate 32), the metal plate 54 is located above and below the metal plate 54. The end surface functions as a large area heat dissipation.

8a, 8b, and 8c show an SMD LED module 30 and a heat dissipation structure thereof according to a fifth embodiment of the present invention. In this embodiment, a metal member 56 (for example, a copper member) is suspended from the lower end surface 40 of the substrate 32 of the first embodiment, and a plurality of conductive materials spaced from each other are provided on the outer end surface of the fiber insulating layer 42. The heat conductive copper foils 44A and 44B are provided, and the copper foil, the fiber insulating layer 42, the substrate 32, and the metal member 56 are connected by the plurality of coupling members 36, so that the upper surface 57 of the metal member 56 is the substrate. The heat conduction paste 58 is filled in the gap between the metal member 56 and the substrate 32. Further, a protruding coupling portion 59 to which a heat radiating tube is attached is provided at the lower end of the metal member 56. In this embodiment, a plurality of heat radiating pipes 60 having different tube diameters are fitted to the lower end of the metal member 56 (or the heat radiating pipes may be integrally formed at the lower end of the metal member 56). A gap is formed between the heat radiating tubes. Thereby, high-speed heat conduction is improved and the heat radiation area is increased. 9a and 9b show an SMD LED 30 and its heat dissipation structure according to a sixth embodiment of the present invention. In this embodiment, a metal member 56 (for example, a copper member) is suspended from the lower end surface 40 of the substrate 32 of the second embodiment, and is coupled to the metal member 56 by the lower ends 52 of the plurality of coupling members 36. Further, a heat sink 62 wound in a spiral shape is assembled to the lower end of the metal member 56. Thereby, high-speed heat conduction is improved and the heat radiation area is increased.

FIGS. 10 a and 10 b show how the SMD LED module 30 of the second embodiment of the present invention is applied to the high-intensity LED bulb 64. The LED bulb 64 includes a lamp head holder 66, a light transmission housing 68, and a lamp holder 70 positioned between the lamp head holder 66 and the light transmission housing 68. A lamp head 72 is attached to the lower end of the lamp head holder 66, and a driver 74 and a circuit board 76 are attached in the lamp head holder 66. The SMD LED module 30 is configured as a light emitting unit by being mounted in the lamp holder 70. When the light emitting unit is electrically connected to the driver 74, the SMD LED module 30 is driven in the direction of the light transmission housing 68 (see FIG. 10a) or the direction of the lamp head 72 (see FIG. 10b). Project light toward. Furthermore, since the heat energy generated from the light emitting unit is directly transmitted to the copper foil 44 on the lower end surface 40 of the substrate 32 via the coupling member 36, the heat dissipation effect is improved.

11a, 11b, 12a, 12b, 13a, 13b, and 14a, 14b, respectively, the SMD LED module 30 of the third, fourth, fifth, and sixth embodiments of the present invention has high illuminance, respectively. A state of applying light to the LED bulb 64 and projecting light toward the light transmitting housing 68 or toward the lamp head 72 is shown.

15, 16, 17, and 18 each include any two of the SMD LED modules 30 according to the second to sixth embodiments of the present invention in the high-intensity LED bulb 64, and one of the SMD LED modules 30 is light. A state in which light is projected toward the transmission housing 68 and the other SMD LED module 30 projects light toward the lamp head 72 is shown.

FIG. 19 shows an SMD LED module 30 and a heat dissipation structure thereof according to the seventh embodiment of the present invention. In this embodiment, the SMD LED module 30 includes a substrate 32 </ b> A, one or more SMD LEDs 34, and a plurality of coupling members 36. The substrate 32A is a fiber substrate, and includes an upper end surface 38 and a lower end surface 40. The upper end surface 38 is provided with a plurality of conductive heat conductive copper foil 44 blocks spaced apart from each other. Is formed with a gap that is not electrically connected to each other. Two electrodes 46, positive and negative, are provided on the bottom surface of each SMD LED 34, and the two electrodes 46 are fixed to any two copper foils 44 spaced apart to form a conductive path. The plurality of SMD LEDs 34 are connected by a series circuit. Any one copper foil 44 adjacent to each SMD LED 34 is provided with a coupling hole 48, and the coupling hole 48 passes through the upper and lower end surfaces 38 and 40 of the copper foil 44 and the substrate 32 </ b> A, and the inner wall of the coupling hole 48. Is covered with a metal layer 78 capable of conducting heat. The coupling member 36 is a rivet, and is inserted into the coupling hole 48 to connect the copper foil 44 and the substrate 32A. A heat conducting metal plate 54 (for example, a copper plate) having substantially the same dimensions as the block of each copper foil 44 is coupled to the lower end 52 of each coupling member 36, so that a plurality of metal plates 54 are suspended from the lower end of the substrate 32A. It is installed. Thereby, the heat generated from the SMD LED 34 is transmitted to the plurality of metal plates 54 via the coupling member 36, thereby functioning as heat dissipation of a large area.

FIG. 20 shows the SMD LED module 30 and the heat dissipation structure thereof according to the eighth embodiment of the present invention. In this embodiment, the SMD LED module 30 includes a substrate 32 </ b> A, one or more SMD LEDs 34, and a plurality of coupling members 36. The substrate 32A is a fiber substrate, and the upper and lower end surfaces 38, 40 are provided with a plurality of corresponding blocks of conductive heat conductive copper foil 44 spaced apart from each other, and the copper foil 44 blocks do not conduct to each other. A gap is formed. Two electrodes 46, positive and negative, are provided on the bottom surface of the SMD LED 34, and the two electrodes 46 are fixed to any two copper foils 44 spaced apart to constitute a conductive path. . A plurality of coupling holes 48 are provided in the substrate 32A, and each coupling hole 48 passes through the copper foil 44, the upper and lower end surfaces 38, 40 of the substrate 32A, and a metal capable of conducting heat on the inner wall of each coupling hole 48. The layer 78 is coated, and the metal layer 78 allows heat generated from the SMD LED 34 to be transferred from the copper foil 44 on the upper end surface 38 to the copper foil 44 on the lower end surface 40 of the substrate 32A. The plurality of coupling members 36 are inserted into some of the coupling holes 48 to connect the copper foil 44 and the substrate 32A. Thereby, the heat generated from the SMD LED 34 can be conducted at high speed and radiated in a large area by the copper foils 44 on the upper and lower end surfaces 38 and 40. A heat conducting metal plate 54 having substantially the same dimensions as the block of each copper foil 44 is coupled to the lower end 52 of each coupling member 36. With the metal plate 54, the chip MD of the SMD LED 34 can dissipate a large area. It becomes.

In each of FIGS. 21a, 21b, 22a and 22b, the SMD LED module 30 of the seventh and eighth embodiments of the present invention is applied to the high-intensity LED bulb 64, respectively, and the direction of the light transmission housing 68 or the lamp head 72 A state in which light is projected toward is shown.

23a and 23b show an SMD LED module 30 and a heat dissipation structure thereof according to the ninth embodiment of the present invention. In this embodiment, the SMD LED module 30 includes a substrate 32, at least one SMD LED 34, and at least one coupling member 36. Two conductive electrodes 46A are provided on the bottom surface of the SMD LED 34, and a heat conducting base 77 is further provided on the bottom surface of the SMD LED 34. The heat conducting base 77 is located between the two conductive electrodes 46A and is separated from the two electrodes 46A. The outer end surface of the fiber insulating layer 42, together with the two conductive copper foil 44C connected with the two electrodes 46 A is configured as a conductive passage be provided, at least one heat-conductive copper that contacts the heat-conducting base 77 A foil 44D is provided. A coupling hole 48 is provided in the heat conducting copper foil 44D adjacent to the SMD LED 34, and the coupling hole 48 passes through the heat conducting copper foil 44D, the fiber insulating layer 42, and the substrate 32, and the lower end surfaces 38, 40. As a result, the coupling hole 48 does not need to be provided in the copper foil at a single pole location, and the heat generated from the SMD LED 34 is not transferred to the coupling member 36 via the two electrodes 46A, but is conducted as a heat conducting material. By being transmitted to the coupling member 36 via the base 77 and further transmitted to the lower end surface 40 via the coupling member 36, a large area heat dissipation effect is possible.

24a and 24b show how the SMD LED module 30 of the tenth embodiment of the present invention is applied to an LED bulb 64 as a daytime lamp. A support plate 80 is provided above the circuit board 76 in the lamp holder 70, and a support metal member 56-1 that is substantially L-shaped and is opposed to the support plate 80 is provided horizontally by a coupling member 82. Yes. A fixed packing base 79 is provided between the two metal members 56-1, and one end face of the substrate 32 is attached to the outer surface of each metal member 56-1. The SMD LED 34 on the left side in FIG. 24a emits direct light toward the traveling direction of the vehicle so that the driver on the opposite side can easily see, and the SMD LED 34 on the right side faces the driver's seat so that the driver Light that is emitted so as to be easily visible (for example, a two-wheeled vehicle or a passerby traveling outside the roadway) is reflected (about 35 degrees on the left and right) and can be directed in the traveling direction of the vehicle. Since the two metal members 56-1 are provided horizontally on one end surface corresponding to the substrate 32 and function as support and heat dissipation, it is possible to contribute to heat conduction of the chip heat degree of the SMD LED 34 and heat dissipation of a large area. .

In the foregoing specification, the invention has been described only with reference to specific embodiments, and various changes or modifications can be made based on the features of the invention. Equivalent changes and modifications made by persons having ordinary knowledge in this technical field based on the claims of the present invention are within the technical scope of the present invention.

As described above, in the present invention, a plurality of copper foils including an upper end surface and a lower end surface are provided on the upper end surface, and at least one copper foil, a metal plate, or a metal member is provided on the lower end surface. The substrate is provided and two electrodes constituting the positive and negative electrodes are provided on the bottom surface, and the two electrodes are respectively fixed to two copper foils on the upper end surface of the substrate to form a conductive path. At least one SMD LED, any one copper foil on the upper end surface of the substrate, at least one coupling hole penetrating the upper and lower end surfaces of the substrate, and a metal material having high heat conductivity, and the at least one At least one coupling member inserted into one coupling hole, having an upper end coupled to the copper foil on the upper end surface, and a lower end coupled to the copper foil or metal plate or metal member on the lower end surface. Special It is an heat radiation structure of SMD LED to.

The coupling member is a rivet or a screw and is hollow or solid, and the metal plate is suspended or horizontally provided on the lower end surface of the substrate.

Further, the metal member is provided on the lower end surface of the substrate, the upper surface of the metal member is flatly adhered to the lower end surface of the substrate, and a heat conductive paste is filled between the metal member and the substrate. The lower end of the metal member is provided with a plurality of spaced apart heat radiating tubes or a heat radiating plate wound in a spiral shape. .

In addition, the upper end surface includes a plurality of copper foil blocks spaced apart from each other, and a gap that is not electrically connected to each other is formed between the plurality of copper foil blocks. A fiber substrate on which one copper foil is provided and at least one metal plate is suspended or provided horizontally, and two electrodes, a positive electrode and a negative electrode, are provided on the bottom surface, and the two electrodes are provided on the fiber substrate. At least one SMD LED configured as a conductive path by being respectively fixed to two copper foils on the upper end surface, and any one copper foil on the upper end surface of the substrate and the upper and lower end surfaces of the fiber substrate At least one coupling hole whose inner wall is covered with a heat-conductive metal layer, and made of a highly heat-conductive metal material, inserted into the at least one coupling hole, and having an upper end at the upper end surface Coupled with the foil, the lower end is intended to comprise the at least one coupling member is coupled to the foil or metal plate in the bottom surface.

The coupling member is a rivet or a screw, the at least one coupling member includes a plurality of coupling holes, and an inner wall of each coupling hole is coated with a heat conductive metal layer, It is assumed that at least one coupling member is coupled to some of the plurality of coupling holes.

According to the heat dissipation structure of the SMD LED according to the present invention, the heat generated from the chip of the SMD LED can be effectively transmitted to the lower end surface of the substrate, and the standard of LED light attenuation can be reached.

10 LED
12 Pedestal 14 Heat conduction copper pillar 15 LED chip 16 Heat conduction bottom 18 Terminal 20 LED
22 Metal substrate 24 Fiber insulation layer 25, 25-1 Copper foil 26 SMD LED
28, 28-1 Electrode 30 SMD LED module 32, 32A Substrate 34 SMD LED
36 coupling member 38 upper end surface 40 lower end surface 42 fiber insulation layers 44, 44A, 44B, 44C, 44D copper foil 46, 46A electrode 48 coupling hole 50 upper end 52 lower end 54 metal plate 56, 56-1 metal member 57 upper surface 58 heat conduction Paste 59 Coupling part 60 Radiation tube 62 Radiation plate 64 LED bulb 66 Lamp head holder 68 Light transmission housing 70 Lamp holder 72 Lamp head 74 Driver 76 Circuit board 77 Heat conduction base 78 Metal layer 79 Fixed packing base 80 Support plate 82 Coupling member

Claims (5)

A substrate having an upper end surface and a lower end surface, a plurality of copper foils spaced apart on the upper end surface side , a substrate provided with a metal plate on the lower end surface side ,
Two electrodes constituting positive and negative electrodes are provided on the bottom surface, and the two electrodes are fixed to two copper foils on the upper end surface of the substrate, respectively, and at least one SMD LED configured as a conductive path; ,
Any one copper foil on the upper end surface of the substrate and at least one coupling hole penetrating the upper and lower end surfaces of the substrate;
At least one coupling member made of a metal material having high heat conductivity, inserted into the at least one coupling hole, coupled to a copper foil on the upper end surface, and coupled to the metal plate at a lower end;
An SMD LED heat dissipation structure comprising :
The metal plate is suspended on the lower end surface side of the substrate, a part of the metal plate is coupled between the coupling member and the lower end surface of the substrate, and the other part of the metal plate and the A heat dissipation structure of an SMD LED in which a heat dissipation space is formed by being separated from the lower end surface of the substrate. The coupling member is rivets, and has a middle empty,
The heat dissipation structure for an SMD LED according to claim 1. A heat conducting base is provided on the bottom surface of the SMD LED, the heat conducting base is disposed between the two electrodes and spaced apart from the electrode, and the plurality of copper foils include two conductive copper foils and one heat conducting base. Including the copper foil, the two conductive copper foils and the two electrodes are conducted, the heat conducting copper foil and the heat conducting base are contacted,
3. The heat dissipation structure for an SMD LED according to claim 1, wherein the coupling hole is provided so as to penetrate the heat conductive copper foil and the upper and lower end surfaces of the substrate. The upper end surface includes a plurality of copper foil blocks spaced apart from each other, a gap that is not electrically connected to each other is formed between the plurality of copper foil blocks, and the lower end surface includes at least one copper foil block. A fiber substrate on which copper foil is provided and at least one metal plate is suspended;
Two electrodes, positive and negative, are provided on the bottom surface, and the two electrodes are fixed to two copper foils on the upper end surface of the fiber substrate, respectively, and at least one SMD LED configured as a conductive path;
Any one copper foil on the upper end surface of the substrate and at least one coupling hole penetrating the upper and lower end surfaces of the fiber substrate and having an inner wall covered with a heat conductive metal layer;
A metal material Koshirubenetsu, the inserted at least one coupling hole, the upper end is coupled with the copper foil in said upper surface, and at least one coupling member lower end is coupled to the front Kikin genus plate,
An SMD LED heat dissipation structure comprising:
A part of the metal plate is coupled between a lower end of the at least one coupling member and a lower end surface of the substrate, and a heat radiation space is formed by separating the other part of the metal plate and the lower end surface of the substrate. The SMD LED heat dissipation structure. The coupling member is a rivet, is hollow,
There are a plurality of the coupling holes, and an inner wall of each coupling hole is coated with a metal layer capable of conducting heat,
The at least one coupling member is coupled to a partial coupling hole of the plurality of coupling holes;
The heat dissipation structure for an SMD LED according to claim 4.

Images