JP5873699B2 - Electronic component unit - Google Patents

Description

  The present invention relates to an electronic component unit in which an electronic component mounted on a substrate is accommodated in a box-shaped case.

  In an electric appliance or the like, an electronic component unit in which an electronic component mounted on a substrate is accommodated in a box-shaped case is incorporated. When an electric current is supplied to an electronic component housed in such an electronic component unit and operated, heat is generated from the electronic component. When this heat is stored in the case, the performance as an electronic component unit cannot be satisfied. For this reason, it is necessary to efficiently dissipate the heat generated from the electronic components, but in addition, it is important to reduce the temperature deviation in the case. Various proposals have been made (for example, see Patent Document 1).

  FIG. 6 is a diagram for explaining the electronic component unit 900 disclosed in Patent Document 1. In FIG. As shown in FIG. 6, an electronic component unit 900 disclosed in Patent Document 1 (referred to as a conventional electronic component unit 900) includes a first electronic component group G1 having a first electronic component 920 mounted on a substrate 910. And an electronic component unit having a second electronic component group G2 having the second electronic component 930 mounted on the substrate 910, and a case 940 for housing the first electronic component 920 and the second electronic component 930, In the case 940, component housing chambers 950 and 960 corresponding to the electronic component groups G1 and G2 are formed.

  The component housing chamber 950 that houses the first electronic component 920 is filled with a heat radiating resin 970, and the component housing chamber 960 that houses the second electronic component 930 is filled with a heat radiating resin 980.

  In the conventional electronic component unit 900, the first electronic component 920 has a larger amount of heat generation than the second electronic component 930. For this reason, in the conventional electronic component unit 900, the heat-dissipating resin 970 filled in the component-accommodating chamber 950 has better thermal conductivity than the heat-dissipating resin 980 filled in the component-accommodating chamber 960. I am using something.

  In the conventional electronic component unit 900 configured as described above, the heat generated from the first electronic component 920 and the second electronic component 930 is radiated from the case 940 through the heat radiating resins 970 and 980. At this time, the heat generated from the first electronic component 920 having high heat generation is transferred to the case 940 through the heat dissipating resin 970 having excellent heat conductivity to be dissipated. Even if there is, the temperature deviation in the case 940 can be reduced.

JP 2005-294703 A

  By the way, many electronic component units of this type are designed to dissipate heat generated from electronic components also by a cooling fluid (for example, cooling air). In such an electronic component unit, since the temperature rise of the electronic component differs depending on the position of the electronic component with respect to the flow of the cooling air, the temperature deviation in the case becomes large. There is also a problem such as.

  That is, in the case, the downstream side of the cooling air flow (referred to as the leeward side) has a smaller heat dissipation capacity of the cooling air than the upstream side of the cooling air flow (referred to as the leeward side). The temperature deviation in the case increases. This is because when the cooling air flows toward the leeward side, the temperature rises due to the heat of the electronic components existing in the middle, so that the cooling capacity decreases as it goes to the leeward side. For this reason, in order to reduce the temperature deviation in the case, it is important to consider not only the amount of heat generated by the electronic component but also the position of the electronic component relative to the flow of cooling air.

  In view of this, the present invention provides an electronic component unit that radiates heat generated from an electronic component also by a cooling fluid, and leveles the temperature in the entire case by reducing the temperature deviation in the entire case in the electronic component unit. An object of the present invention is to provide an electronic component unit that can be used.

  [1] The electronic component unit of the present invention includes a case in which a plurality of component storage chambers for storing heat-generating electronic components are provided at positions between the upstream side and the downstream side of the flow of the cooling fluid. An electronic component unit comprising: the plurality of components such that a heat conduction amount of heat generated from the electronic component to the case increases sequentially from an upstream side to a downstream side of the flow of the cooling fluid. The amount of heat conduction to the case is adjusted in each component storage chamber of the storage chamber.

  [2] In the electronic component unit of the present invention, a heat radiating member is provided on the bottom surface side of each of the component storage chambers, and the heat radiating member is connected to the cooling fluid from the upstream side of the flow of the cooling fluid. It is preferable that the heat conduction amount of the heat radiating member at the position is adjusted according to the position on the downstream side.

  [3] In the electronic component unit of the present invention, the heat conduction amount of the heat radiating member is preferably adjusted by changing at least one of the amount or material of the heat radiating member.

  [4] In the electronic component unit of the present invention, the amount of the heat radiating member is preferably changed by changing the thickness of the bottom surface side heat radiating member from the bottom surface of each component housing chamber.

  [5] In the electronic component unit of the present invention, the material of the heat radiating member is preferably changed by changing the content of a substance that promotes the thermal conductivity of the heat radiating member.

  [6] In the electronic component unit of the present invention, the bottom surface side heat radiating member is preferably a heat radiating resin.

  [7] In the electronic component unit of the present invention, the bottom surface side heat radiating member is preferably a heat radiating sheet.

  [8] In the electronic component unit of the present invention, the case is preferably an aluminum case.

  The electronic component unit of the present invention is a case in a plurality of component housing chambers so that the amount of heat conduction from the electronic component to the case increases sequentially from the upstream side to the downstream side of the flow of the cooling fluid. The amount of heat conduction to is set. For this reason, when the heat generated from the electronic component is also dissipated by the cooling fluid, the temperature deviation in the entire case in the electronic component unit can be reduced, thereby leveling the temperature in the entire case. be able to. As a result, partial heat storage in the electronic component unit can be suppressed, so that performance as an electronic component can be satisfied.

It is a perspective view shown in order to demonstrate 100 A of electronic component units which concern on Embodiment 1. FIG. It is sectional drawing which expands and shows the principal part of 100 A of electronic component units which concern on Embodiment 1. FIG. It is sectional drawing which expands and shows the principal part of the electronic component unit 100B which concerns on Embodiment 2. FIG. It is sectional drawing which expands and shows the principal part of 100 C of electronic component units which concern on Embodiment 3. FIG. It is a figure shown in order to demonstrate the modification of the electronic component unit 100C which concerns on Embodiment 3. FIG. It is a figure shown in order to demonstrate the electronic component unit 900 currently disclosed by patent document 1. FIG.

  Hereinafter, embodiments of the present invention will be described.

[Embodiment 1]
FIG. 1 is a perspective view for explaining an electronic component unit 100A according to the first embodiment. FIG. 2 is an enlarged cross-sectional view illustrating a main part of the electronic component unit 100A according to the first embodiment. 2 is a cross-sectional view taken along the line aa in FIG.

  As shown in FIG. 1, the electronic component unit 100 </ b> A according to the first embodiment includes a box-shaped case 110, and the inside of the case 110 is partitioned by a plurality of partition plates 120, thereby a plurality of component housing chambers 131. To 135 are formed. And although illustration is abbreviate | omitted in the component storage chambers 131-135, the exothermic electronic components (For example, a choke coil, a semiconductor, a transformer, etc.) are accommodated. The case 110 and the partition plate 120 are made of aluminum. Thus, by making the case 110 and the partition plate 120 made of aluminum, it is possible to further improve the heat dissipation of heat generated from the electronic component.

  1 and 2, an arrow A indicates a direction in which a cooling fluid (referred to as cooling air) flows. The same applies to the other drawings (FIGS. 3, 4 and 5).

  In such an electronic component unit 100A, a heat radiating member for efficiently radiating heat generated from the electronic components to the case 110 is provided on the bottom surface side of each of the component housing chambers 131 to 135. This will be described with reference to FIG. 2 is a cross-sectional view taken along the line aa in FIG. Therefore, here, the component storage chambers 131, 132, and 133 will be described as examples. In the electronic component unit 100A according to the first embodiment, it is assumed that the heat radiating member is a heat radiating resin.

  In the electronic component unit 100A according to the first embodiment, the heat-dissipating resin is injected into the component housing chambers 131, 132, and 133, so that the bottom surfaces 131a, 132a, and 133a are disposed on the sides as shown in FIG. A heat dissipating resin layer is formed. The heat-dissipating resin layer formed in the component housing chamber 131 is formed in the heat-dissipating resin layer 210, and the heat-dissipating resin layer formed in the component housing chamber 132 is formed in the heat-dissipating resin layer 220 and the component housing chamber 133. The heat dissipating resin layer is referred to as a heat dissipating resin layer 230.

  Such heat-dissipating resin layers 210, 220, and 230 can be formed by, for example, injecting molten resin containing a heat conductive filler into each component housing chamber 131, 132, 133 and curing it. In addition, the technique which raises the heat conductivity of the said resin by making a resin contain a heat conductive filler is a well-known technique.

  In the electronic component unit 100A according to the first embodiment, the heat radiating resin layers 210, 220, and 230 formed in the component housing chambers 131, 132, and 133 are located at any position on the leeward side from the leeward side of the cooling airflow. Depending on whether it exists, the heat conduction amount of the heat-dissipating resin layer 210, 220, 230 at the position is adjusted. The heat conduction amount of the heat-dissipating resin layers 210, 220, and 230 is adjusted by changing the amount of the heat-dissipating resin layers 210, 220, and 230. In addition, the change in the amount of the heat-dissipating resin layers 210, 220, 230 is the thickness of the heat-dissipating resin layers 210, 220, 230, that is, the thickness from the bottom surfaces 131a, 132a, 133a of the component housing chambers 131, 132, 133. By changing the.

  By the way, the component storage chamber 131 is positioned on the most leeward side, the component storage chamber 133 is positioned on the most leeward side, and the component storage chamber 132 is positioned in the middle thereof. Therefore, in the following, the component storage chamber 131 is referred to as “windward component storage chamber 131”, the component storage chamber 132 is referred to as “middle component storage chamber 132”, and the component storage chamber 133 is referred to as “leeward component storage chamber 133”. Sometimes called.

  Here, the thickness of the heat dissipating resin layer 210 formed in the windward component housing chamber 131 is t1, the thickness of the heat dissipating resin layer 220 formed in the intermediate component housing chamber 132 is t2, and the component housing chamber on the leeward side. When the thickness of the heat-dissipating resin layer 230 formed on 133 is t3, the thicknesses are set so that t1 <t2 <t3.

  By setting the thicknesses t1, t2, and t3 of the component storage chambers 131, 132, and 133 in this way, the heat conduction amount to the case 110 in each of the component storage chambers 131, 132, and 133 is set to the windward component storage chamber 131. Then, the intermediate component storage chamber 132 and the leeward component storage chamber 133 are sequentially increased.

  As a result, if the electronic components housed in the component housing chambers 131, 132, 133 have substantially the same amount of heat, they are generated from the electronic components housed in the component housing chambers 131, 132, 133. Compared with the amount of heat released by only the heat-dissipating resin layers 210, 220, and 230, the amount of heat released from the component housing chamber 133 on the leeward side is the largest. The storage chamber 131 is ordered.

  On the other hand, in the electronic component unit 100A, the cooling air flows in the direction of arrow A, and when compared with the heat radiation amount only by the cooling air, the component housing chamber 131 on the windward side has the largest heat radiation amount. The chamber 132 is followed by the component housing chamber 133 on the leeward side. For this reason, considering the amount of heat released by the heat-dissipating resin layer and the amount of heat released by the cooling air, the amount of heat released from each electronic component housed in the component housing chambers 131, 132, 133 is The component storage chamber 131, the intermediate component storage chamber 132, and the leeward component storage chamber 133 are substantially the same.

  In addition, when the calorific value of each electronic component accommodated in the component accommodating chambers 131, 132, 133 is greatly different, the calorific value of each electronic component accommodated in the component accommodating chamber 131, 132, 133 is taken into consideration. The thickness of the heat-dissipating resin layers 210, 220, and 230 can be set as appropriate for each of the component housing chambers 131, 132, and 133. For example, in a component housing chamber that houses an electronic component that generates a large amount of heat, the heat-dissipating resin layer is made thicker. Thereby, not only the position of the component housing chambers 131, 132, and 133 with respect to the flow of the cooling air but also the heat radiation amount can be adjusted in consideration of the heat generation amount of each electronic component housed in the component housing chambers 131, 132, and 133. Even when the heat generation amounts of the respective electronic components housed in the component housing chambers 131, 132, and 133 are greatly different, the windward component housing chamber 131, the intermediate component housing chamber 132, and the leeward component housing chamber 133 are provided. Each temperature deviation can be reduced.

  In FIG. 2, only the component housing chambers 131, 132, and 133 have been described. However, in the other component housing chambers 134 and 135, the thickness of the heat-dissipating resin layer to be formed in these component housing chambers 134 and 135 is also described. By appropriately setting, the temperature deviation in the entire case 110 can be reduced, and thereby the temperature in the entire case 110 can be leveled.

[Embodiment 2]
FIG. 3 is an enlarged cross-sectional view illustrating a main part of the electronic component unit 100B according to the second embodiment. 3 corresponds to FIG. 2, and the same members as those in FIG. 2 are denoted by the same reference numerals. Similarly to FIG. 2, the electronic components housed in the component housing chambers 131, 132, and 133 are not shown.

  Also in the electronic component unit 100B according to the second embodiment, as in the electronic component unit 100A according to the first embodiment, the heat-dissipating resin layers 210, 220, and 230 formed in the component housing chambers 131, 132, and 133 are cooled air. The heat conduction amount of the heat-dissipating resin layers 210, 220, and 230 at that position is adjusted according to the position from the windward side to the leeward side of the flow. However, in the electronic component unit 100B according to the second embodiment, the heat conduction amount of the heat-dissipating resin layers 210, 220, and 230 is adjusted by changing the material of the heat-dissipating resin layers 210, 220, and 230.

  In the electronic component unit 100B according to the second embodiment, the component housing chambers 131, 132, and 133 will be described as examples. In the electronic component unit 100B according to the second embodiment, it is assumed that the heat radiating resin layers 210, 220, and 230 formed in the component housing chambers 131, 132, and 133 have the same thickness. Here, the thickness of the heat-dissipating resin layers 210, 220, and 230 is assumed to be t4.

In the electronic component unit 100B according to the second embodiment, the material of the heat-dissipating resin layers 210, 220, and 230 is changed by using a heat-dissipating resin for forming the heat-dissipating resin layers 210, 220, and 230, for example, heat conduction. In the case of a heat-dissipating resin containing a heat conductive filler, the heat conductive filler content is appropriately changed.
In this case, the amount of heat conduction to the case 110 in the component storage chambers 131, 132, 133 is sequentially increased in the order of the windward component storage chamber 131, the intermediate component storage chamber 132, and the leeward component storage chamber 133. In addition, the content of the heat conductive filler is appropriately set.

  By adopting such a configuration, if the electronic components housed in the component housing chambers 131, 132, and 133 have substantially the same amount of heat generation, the heat radiation is the same as in the electronic component unit 100A according to the first embodiment. When considering the heat radiation amount due to the conductive resin layer and the heat radiation amount due to the cooling air, the heat radiation amount generated from each electronic component housed in the component housing chambers 131, 132, 133 is the windward component housing chamber. 131, the intermediate component storage chamber 132, and the leeward component storage chamber 133 are substantially equivalent.

  In this specification, “changing the material of the heat-dissipating resin” includes changing the components of the heat-dissipating resin, such as appropriately changing the content of the heat conductive filler.

  In addition, when the heat generation amounts of the electronic components housed in the component housing chambers 131, 132, and 133 are greatly different, the heat dissipation performance is considered in consideration of the heat generation amount of the electronic components housed in the component housing chambers 131, 132, and 133. It is also possible to appropriately set the content of the thermally conductive filler in the resin layers 210, 220, and 230 in the respective component storage chambers. Thereby, not only the position of the component housing chambers 131, 132, 133 with respect to the flow of the cooling air but also the heat radiation amount can be adjusted in consideration of the heat generation amount of the electronic components housed in the component housing chambers 131, 132, 133. Even if the calorific values of the electronic components housed in the component housing chambers 131, 132, and 133 differ greatly, the leeward component housing chamber 131, the intermediate component housing chamber 132, and the leeward component housing chamber 133, respectively. Temperature deviation can be reduced.

  In FIG. 3, only the component housing chambers 131, 132, and 133 have been described. However, in the other component housing chambers 134 and 135, heat in each heat-dissipating resin layer to be formed in these component housing chambers 134 and 135 is also described. By appropriately setting the content of the conductive filler, the temperature deviation in the entire case 110 can be reduced, and thereby the temperature in the entire case 110 can be leveled.

[Embodiment 3]
FIG. 4 is an enlarged cross-sectional view illustrating a main part of the electronic component unit 100C according to the third embodiment. 4 corresponds to FIG. 2, and the same members as those in FIG. 2 are denoted by the same reference numerals. Similarly to FIG. 2, the electronic components housed in the component housing chambers 131, 132, and 133 are not shown.

  As with the electronic component unit 100A according to the first embodiment, the electronic component unit 100C according to the third embodiment appropriately sets the thickness of the heat-dissipating resin layer in each component storage chamber. However, in the electronic component unit 100C according to the third embodiment, the heat-dissipating resin is obtained by changing the height of the bottom surface in each component storage chamber (the height of the bottom surface in the opening surface direction of the case 110) for each component storage chamber. It differs from the electronic component unit 100A according to the first embodiment in that the thickness of the layer is changed. The setting of “the height of the bottom surface case 110 in the opening surface direction” is performed by raising the bottom surface of each component housing chamber. The amount by which the bottom surface is raised will be referred to as the “bottom raising amount”. Also, the electronic component unit 100C according to the third embodiment will be described by taking the component accommodating chambers 131, 132, and 133 as examples.

  In the electronic component unit 100C according to the third embodiment, as illustrated in FIG. 4, the component storage chamber 133 does not raise the bottom surface 133a of the component storage chamber 133, and the amount of lift is zero. For the above, the bottom surfaces 131a and 132a are raised by a predetermined amount. Here, the bottom surface 133a of the component storage chamber 133 is used as a reference. As shown in FIG. 4, the raised amount of the bottom surface 132a of the component storage chamber 132 is h1, and the raised amount of the bottom surface 131a of the component storage chamber 131 is h2. Note that h1> h2.

  By setting the raising amount of the bottom surfaces 131a and 132a of the component storage chambers 131 and 132 with respect to the bottom surface 133a of the component storage chamber 133 in this way, for example, in a state where the case 110 is installed on a horizontal plane, Is injected so as to be on the same horizontal plane throughout the case 110, the thickness of the heat-dissipating resin layer formed in the component housing chambers 131, 132, 133 is equal to the raised amount of each component housing chamber 131, 132, 133. It becomes the amount according. Here, the thickness of the heat radiating resin layer 210 formed in the component housing chamber 131 is t1, the thickness of the heat radiating resin layer 220 formed in the component housing chamber 132 is t2, and the heat radiating resin formed in the component housing chamber 133. If the thickness of the layer 230 is t3, then inevitably t1 <t2 <t3.

  By setting the thicknesses t1, t2, and t3 of the heat-dissipating resin layers 210, 220, and 230 formed in the component housing chambers 131, 132, and 133 to have such a relationship, the electronic component unit 100A according to the first embodiment is similar to the electronic component unit 100A according to the first embodiment. The effect is obtained.

  In the example illustrated in FIG. 4, when raising the bottom surfaces of the component storage chambers 131, 132, and 133, the entire bottom surface of the component storage chamber is raised for each component storage chamber. As a modified example of the unit 100C, the amount of raising the bottom surface in each component storage chamber may be different depending on the region of the component storage chamber.

  FIG. 5 is a view for explaining a modification of the electronic component unit 100 </ b> C according to the third embodiment. 5 corresponds to FIG. 4, and the same members as those in FIG. 4 are denoted by the same reference numerals. Also, the electronic components housed in the component housing chambers 131, 132, and 133 are not shown in the same manner as in FIG.

  As shown in FIG. 5, a modified example of the electronic component unit 100C according to the third embodiment (referred to as an electronic component unit 100D) has a component storage chamber (referred to as a component storage chamber 131) as shown in FIG. The storage chamber 131 is divided into a plurality of regions, and the bottom is raised for each region. For example, as shown in FIG. 5, when the component storage chamber 131 is divided into two areas W1 and W2 from the windward side to the leeward side, the respective parts W1 and W2 are raised by a predetermined raising amount. Yes. In this case, the raising amount of the bottom surface 131a1 of the upwind area W1 is h3, and the raising amount of the bottom surface 131a2 of the leeward area W2 is h2. Note that h3> h2.

  By adopting such a configuration, for example, when a plurality of types of electronic components are stored in the component storage chamber 131, it is possible to adjust the heat dissipation amount corresponding to each type of electronic component. In FIG. 5, the component storage chamber 131 has been described as an example, but the same can be applied to other component storage chambers. Further, three or more areas may be set in one component storage chamber.

  In the example shown in FIGS. 4 and 5, the case where the heat radiating resin is injected so as to be in the same horizontal plane throughout the case 110 in a state where the case 110 is installed on the horizontal plane is illustrated. Considering the position of the component accommodating chambers 131, 132, 133 with respect to the flow and the amount of heat generated by the electronic components accommodated, the amount of heat-dissipating resin injected into the component accommodating chambers 131, 132, 133 is determined. It is also possible to set appropriately for each 133. In this case, since it is only necessary to inject the heat-dissipating resin into the component housing chambers 131, 132, and 133 in a necessary amount, the amount of the heat-dissipating resin layer can be saved.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention. For example, the following modifications are possible.

  (1) In each of the embodiments described above, a heat-dissipating resin layer is formed in each component storage chamber. However, when the amount of heat generated by an electronic component stored in a certain component storage chamber is small, the component storage chamber In some cases, it is not necessary to form a heat-dissipating resin layer.

  (2) In each of the above embodiments, a heat radiating resin layer is formed in each component housing chamber, and the heat radiation amount of each component housing chamber is adjusted by the heat radiating resin layer. A heat insulating material or the like may be provided in the component housing chamber, and the heat radiation amount may be adjusted by the heat insulating material.

  (3) In each of the above embodiments, the heat radiating member is exemplified by the case where the heat radiating resin layer is formed by injecting the heat radiating resin. However, the present invention is not limited to this, and a heat radiating sheet is laid. It may be. In this case, by adjusting at least one of the thickness and material of the heat dissipating sheet laid in each component housing chamber, the heat radiation amount in each component housing chamber can be adjusted. Accordingly, as in the above embodiments, the temperature deviation in the entire case 110 can be reduced, and the temperature in the entire case 110 can be leveled.

  (4) In each of the embodiments described above, the cooling fluid is assumed to be wind (cooling air), but may be a liquid (cooling fluid) such as water.

  100A, 100B, 100C ... electronic component unit, 110 ... case, 120 ... partition plate, 130-135 ... component storage chamber, 131a, 132a, 133a ... component storage chamber 131,132, 133, 210, 220, 230 ... heat-dissipating resin layer, A ... direction of cooling air flow, h1, h2, h3 ... bottom-up amount, t1, t2, t3, t4 ... heat dissipation Of the conductive resin layer, WI, W2...

Claims (8)

A plurality of component storage chambers for storing heat-generating electronic components are electronic component units having cases provided at respective positions between the upstream side and the downstream side of the flow of the cooling fluid,
Heat conduction amount to the case of the heat generated from the electronic component, wherein the upstream side of the flow the cooling fluid so as to sequentially increase toward the downstream side, the parts yield vessel chamber of said plurality of component receiving chamber The amount of heat conduction to the case has been adjusted in
A heat radiating member is provided on the bottom surface side of each of the component housing chambers, and the heat radiating member depends on where the heat radiating member is located from the upstream side to the downstream side of the flow of the cooling fluid. The amount of heat conduction of the heat dissipation member at the position is adjusted,
The heat conduction amount of the heat dissipation member is adjusted by changing at least one of the amount or material of the heat dissipation member,
The amount of the heat radiating member is changed by changing the thickness of the heat radiating member from the bottom surface of each of the component housing chambers . A plurality of component storage chambers for storing heat-generating electronic components are electronic component units having cases provided at respective positions between the upstream side and the downstream side of the flow of the cooling fluid,
Heat conduction amount to the case of the heat generated from the electronic component, wherein the upstream side of the flow the cooling fluid so as to sequentially increase toward the downstream side, the parts yield vessel chamber of said plurality of component receiving chamber The amount of heat conduction to the case has been adjusted in
A heat radiating member is provided on the bottom surface side of each of the component housing chambers, and the heat radiating member depends on where the heat radiating member is located from the upstream side to the downstream side of the flow of the cooling fluid. The amount of heat conduction of the heat dissipation member at the position is adjusted,
The heat conduction amount of the heat dissipation member is adjusted by changing at least one of the amount or material of the heat dissipation member,
The change of the material of the said heat radiating member is performed by changing content of the substance which accelerates | stimulates the heat conductivity of the said heat radiating member, The electronic component unit characterized by the above-mentioned. The electronic component unit according to claim 1 or 2 ,
The electronic component unit, wherein the heat radiating member is a heat radiating resin. The electronic component unit according to claim 1 or 2 ,
The electronic component unit, wherein the heat radiating member is a heat radiating sheet. A plurality of component storage chambers for storing heat-generating electronic components are electronic component units having cases provided at respective positions between the upstream side and the downstream side of the flow of the cooling fluid,
Heat conduction amount to the case of the heat generated from the electronic component, wherein the upstream side of the flow the cooling fluid so as to sequentially increase toward the downstream side, the parts yield vessel chamber of said plurality of component receiving chamber The amount of heat conduction to the case has been adjusted in
A heat radiating member is provided on the bottom surface side of each of the component housing chambers, and the heat radiating member depends on where the heat radiating member is located from the upstream side to the downstream side of the flow of the cooling fluid. The amount of heat conduction of the heat dissipation member at the position is adjusted,
The electronic component unit , wherein the heat radiating member is a heat radiating resin . A plurality of component storage chambers for storing heat-generating electronic components are electronic component units having cases provided at respective positions between the upstream side and the downstream side of the flow of the cooling fluid,
Heat conduction amount to the case of the heat generated from the electronic component, wherein the upstream side of the flow the cooling fluid so as to sequentially increase toward the downstream side, the parts yield vessel chamber of said plurality of component receiving chamber The amount of heat conduction to the case has been adjusted in
A heat radiating member is provided on the bottom surface side of each of the component housing chambers, and the heat radiating member depends on where the heat radiating member is located from the upstream side to the downstream side of the flow of the cooling fluid. The amount of heat conduction of the heat dissipation member at the position is adjusted,
The electronic component unit , wherein the heat radiating member is a heat radiating sheet . In the electronic component unit according to claim 5 or 6 ,
The amount of heat conduction of the heat radiating member is adjusted by changing at least one of the amount and material of the heat radiating member. In the electronic component unit according to any one of claims 1 to 7,
The electronic component unit, wherein the case is an aluminum case.

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