JP5865846B2 - 検査ソケット - Google Patents
検査ソケット Download PDFInfo
- Publication number
- JP5865846B2 JP5865846B2 JP2012553600A JP2012553600A JP5865846B2 JP 5865846 B2 JP5865846 B2 JP 5865846B2 JP 2012553600 A JP2012553600 A JP 2012553600A JP 2012553600 A JP2012553600 A JP 2012553600A JP 5865846 B2 JP5865846 B2 JP 5865846B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contact terminal
- land
- solder ball
- inspection socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Description
前記切替手段は、前記半田ボールおよび前記接触端子の先端部を内部に収納する貫通孔が穿孔され、前記筐体上面に滑動可能に配置され、前記被検査体を搭載する被検査体搭載部である構成を有している。
まず、本実施形態における検査ソケットの構成について説明する。
まず、本実施形態における検査ソケットの構成について説明する。
10 コンタクトプローブ
11 接触端子
11a 先端
12 接触端子保持部
13 ランド接触端子
14 ばね(弾性体)
21 筐体
21a 貫通孔
21b スライド面
22 保持板
30、60 IC搭載部
31、61 IC搭載面
32(32a、32b) 貫通孔
33 係合部
40 IC
41 半田ボール
50 プリント基板
51 ランド
70 スライダ
62(62a、62b) 貫通孔
63 貫通孔
71 接触端子貫通孔
Claims (1)
- 被検査体に設けられた半田ボールとプリント基板に設けられたランドとを電気的に接続する検査ソケットであって、
筐体と、前記筐体上に配置され前記被検査体を搭載する被検査体搭載部とを含み、
前記筐体が、それぞれが前記半田ボールの最大径部より根元寄りの側面に接触する鉤状の先端を有する柱状の接触端子と、前記接触端子を保持する接触端子保持部と、前記ランドに接触するランド接触端子と、一端が前記接触端子保持部に接触し他端が前記ランド接触端子に接触して前記一端と前記他端との間で伸縮する弾性体からなるコンタクトプローブの中の前記接触端子保持部、前記ランド接触端子、および前記弾性体を複数収納するものであり、
前記被検査体搭載部が、前記接触端子の先端部および前記半田ボールを収納する貫通孔が穿孔された天板と、前記接触端子の中央部を内部に収納する枠部と、から成り、
前記被検査体搭載部が、前記接触端子が前記半田ボールの側面に接触する接触状態と前記接触端子が前記半田ボールの側面から離隔する離隔状態とを切り替える切替手段を有し、
前記切替手段が、前記筐体上面に固定された前記被検査体搭載部の前記枠部を水平方向に滑動可能に貫通し、前記接触端子の中央部が貫通する貫通孔が穿孔されたスライダである検査ソケット。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012553600A JP5865846B2 (ja) | 2011-01-19 | 2012-01-12 | 検査ソケット |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011008451 | 2011-01-19 | ||
JP2011008451 | 2011-01-19 | ||
PCT/JP2012/000138 WO2012098837A1 (ja) | 2011-01-19 | 2012-01-12 | 検査ソケット |
JP2012553600A JP5865846B2 (ja) | 2011-01-19 | 2012-01-12 | 検査ソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2012098837A1 JPWO2012098837A1 (ja) | 2014-06-09 |
JP5865846B2 true JP5865846B2 (ja) | 2016-02-17 |
Family
ID=46515473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012553600A Active JP5865846B2 (ja) | 2011-01-19 | 2012-01-12 | 検査ソケット |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5865846B2 (ja) |
WO (1) | WO2012098837A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI514686B (zh) * | 2013-01-28 | 2015-12-21 | Hon Hai Prec Ind Co Ltd | 電連接器及電連接器端子 |
TWI598594B (zh) * | 2016-09-20 | 2017-09-11 | 中華精測科技股份有限公司 | 插銷式探針 |
WO2019159349A1 (ja) * | 2018-02-19 | 2019-08-22 | ユニテクノ株式会社 | コンタクトプローブおよびそれを備えた検査ソケット |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10125377A (ja) * | 1996-10-22 | 1998-05-15 | Enplas Corp | コンタクトピン及び電気的接続装置 |
JPH10144439A (ja) * | 1996-11-15 | 1998-05-29 | Advantest Corp | Bgaパッケージ用icソケット |
JP2000292485A (ja) * | 1999-03-08 | 2000-10-20 | Samsung Electronics Co Ltd | Bgaパッケージの電気的検査のためのソケット及びこれを用いた検査方法 |
US6242932B1 (en) * | 1999-02-19 | 2001-06-05 | Micron Technology, Inc. | Interposer for semiconductor components having contact balls |
JP2002203653A (ja) * | 2000-10-25 | 2002-07-19 | Texas Instr Japan Ltd | ソケット及びこれを備えた電子部品装着装置 |
JP2002350493A (ja) * | 2001-05-23 | 2002-12-04 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
JP2006200975A (ja) * | 2005-01-19 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 半導体装置の検査方法および検査装置および接触端子 |
-
2012
- 2012-01-12 WO PCT/JP2012/000138 patent/WO2012098837A1/ja active Application Filing
- 2012-01-12 JP JP2012553600A patent/JP5865846B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10125377A (ja) * | 1996-10-22 | 1998-05-15 | Enplas Corp | コンタクトピン及び電気的接続装置 |
JPH10144439A (ja) * | 1996-11-15 | 1998-05-29 | Advantest Corp | Bgaパッケージ用icソケット |
US6242932B1 (en) * | 1999-02-19 | 2001-06-05 | Micron Technology, Inc. | Interposer for semiconductor components having contact balls |
JP2000292485A (ja) * | 1999-03-08 | 2000-10-20 | Samsung Electronics Co Ltd | Bgaパッケージの電気的検査のためのソケット及びこれを用いた検査方法 |
JP2002203653A (ja) * | 2000-10-25 | 2002-07-19 | Texas Instr Japan Ltd | ソケット及びこれを備えた電子部品装着装置 |
JP2002350493A (ja) * | 2001-05-23 | 2002-12-04 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
JP2006200975A (ja) * | 2005-01-19 | 2006-08-03 | Matsushita Electric Ind Co Ltd | 半導体装置の検査方法および検査装置および接触端子 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2012098837A1 (ja) | 2014-06-09 |
WO2012098837A1 (ja) | 2012-07-26 |
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