JP5864672B2 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
- Publication number
- JP5864672B2 JP5864672B2 JP2014106708A JP2014106708A JP5864672B2 JP 5864672 B2 JP5864672 B2 JP 5864672B2 JP 2014106708 A JP2014106708 A JP 2014106708A JP 2014106708 A JP2014106708 A JP 2014106708A JP 5864672 B2 JP5864672 B2 JP 5864672B2
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- JP
- Japan
- Prior art keywords
- pressing
- heat sink
- return apparatus
- semiconductor element
- power return
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims description 40
- 238000003825 pressing Methods 0.000 claims description 36
- 238000003780 insertion Methods 0.000 claims description 25
- 230000037431 insertion Effects 0.000 claims description 25
- 238000005452 bending Methods 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 238000000034 method Methods 0.000 description 7
- 230000005669 field effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005489 elastic deformation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Inverter Devices (AREA)
- Dc-Dc Converters (AREA)
- Rectifiers (AREA)
Description
Claims (9)
- ホールディング部を具備するヒートシンクと、
前記ヒートシンクの上部に位置する複数の半導体素子と、
前記半導体素子を前記ヒートシンクの方に加圧して固定する固定アセンブリと、を含み、
前記固定アセンブリは、
前記半導体素子の上部に位置する下部押圧部と、
弾性を有し、前記下部押圧部の上部で前記下部押圧部を下方に加圧しながら前記ホールディング部に結合される上部押圧部と、を含み、
前記上部押圧部は、下部から上部に行くほど左右方向の距離が遠くなり、前記上部押圧部の中央領域から延長される挿入部を含み、前記挿入部を前記ホールディング部に挿入して固定するための固定バーを含む、電力変換装置。 - 前記ホールディング部は、下部に凹んで形成される溝部を含み、
前記上部押圧部は、一部が下方に突出される中央ベンディング部を含み、
前記中央ベンディング部は弾性を有する、請求項1に記載の電力変換装置。 - 前記中央ベンディング部は、中央部分が下方に向かって突出されて左右両端部に行くほど上方に向かって延長される、請求項1に記載の電力返還装置。
- 前記挿入部は、前記中央ベンディング部から下方に向かって延長される内側部と、前記内側部の下端から上部に向かって延長される外側部と、を含み、
外力が加えられていない状態で前記内側部と前記外側部との間の距離は上部に行くほどより遠くなる、請求項3に記載の電力返還装置。 - 前記外側部には外側に突出される突出部が具備される、請求項4に記載の電力返還装置。
- 前記突出部の外側面は前記外側部の外側面より大きく傾斜する、請求項5に記載の電力返還装置。
- 前記バーの一側面には、前記突出部の内側に挿入可能な突起部が具備される、請求項6に記載の電力返還装置。
- 前記下部押圧部は、前記上部押圧部が結合される切開部を含む、請求項7に記載の電力変換装置。
- 前記下部押圧部は、
左右方向に延長される板状の水平延長部と、
前記水平延長部から上方に向かって延長される上下延長部と、を含み、前記切開部は前記上下延長部の上端に具備される、請求項8に記載の電力返還装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2020130007679U KR200484015Y1 (ko) | 2013-09-12 | 2013-09-12 | 전력 변환 장치 |
KR20-2013-0007679 | 2013-09-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015057037A JP2015057037A (ja) | 2015-03-23 |
JP5864672B2 true JP5864672B2 (ja) | 2016-02-17 |
Family
ID=51211133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014106708A Active JP5864672B2 (ja) | 2013-09-12 | 2014-05-23 | 電力変換装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9554492B2 (ja) |
EP (1) | EP2849222B1 (ja) |
JP (1) | JP5864672B2 (ja) |
KR (1) | KR200484015Y1 (ja) |
CN (1) | CN104470346B (ja) |
ES (1) | ES2762876T3 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2824275B1 (en) * | 2013-07-09 | 2015-09-16 | ABB Technology Ltd | Subsea unit with cooling of electronic devices |
CN109428497B (zh) | 2017-08-23 | 2020-09-18 | 台达电子企业管理(上海)有限公司 | 电源模块的组装结构及其组装方法 |
WO2019215805A1 (ja) * | 2018-05-08 | 2019-11-14 | 三菱電機株式会社 | 締結構造体および締結構造体を用いた電力変換装置 |
JP7288363B2 (ja) * | 2019-07-10 | 2023-06-07 | ダイヤゼブラ電機株式会社 | 電子機器および電子制御装置 |
CN111225544B (zh) * | 2019-12-06 | 2021-11-05 | 法雷奥西门子新能源汽车(深圳)有限公司 | 用于电子元件的散热装置 |
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JPS62160552U (ja) * | 1986-03-31 | 1987-10-13 | ||
US4712159A (en) | 1986-04-14 | 1987-12-08 | Thermalloy Incorporated | Heat sink clip assembly |
US5600540A (en) * | 1995-05-15 | 1997-02-04 | Blomquist; Michael L. | Heat sink and retainer for electronic integrated circuits |
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JPH11233194A (ja) * | 1997-07-23 | 1999-08-27 | Whitaker Corp:The | 回路カードホルダ及びそれを使用するコネクタ組立体 |
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TW484794U (en) * | 2000-12-27 | 2002-04-21 | Hon Hai Prec Ind Co Ltd | Heat sink |
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JP4296508B2 (ja) * | 2004-10-08 | 2009-07-15 | 株式会社デンソー | コンデンサ装置及び電力変換装置 |
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DE102006014145C5 (de) | 2006-03-28 | 2015-12-17 | Semikron Elektronik Gmbh & Co. Kg | Druck kontaktierte Anordnung mit einem Leistungsbauelement, einem Metallformkörper und einer Verbindungseinrichtung |
JP4909712B2 (ja) * | 2006-11-13 | 2012-04-04 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
CN201060864Y (zh) * | 2007-05-24 | 2008-05-14 | 中兴通讯股份有限公司 | 一种功率器件的压块 |
JP4900202B2 (ja) * | 2007-11-20 | 2012-03-21 | 株式会社デンソー | 電力変換装置 |
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JP2013243264A (ja) | 2012-05-21 | 2013-12-05 | Yaskawa Electric Corp | 電子部品取付モジュールおよび電力変換装置 |
-
2013
- 2013-09-12 KR KR2020130007679U patent/KR200484015Y1/ko active IP Right Grant
-
2014
- 2014-04-29 US US14/264,936 patent/US9554492B2/en active Active
- 2014-05-23 JP JP2014106708A patent/JP5864672B2/ja active Active
- 2014-07-22 EP EP14177923.1A patent/EP2849222B1/en active Active
- 2014-07-22 ES ES14177923T patent/ES2762876T3/es active Active
- 2014-08-26 CN CN201410425764.5A patent/CN104470346B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN104470346B (zh) | 2017-09-05 |
JP2015057037A (ja) | 2015-03-23 |
CN104470346A (zh) | 2015-03-25 |
KR20150001206U (ko) | 2015-03-20 |
EP2849222B1 (en) | 2019-10-09 |
US9554492B2 (en) | 2017-01-24 |
ES2762876T3 (es) | 2020-05-26 |
KR200484015Y1 (ko) | 2017-07-20 |
EP2849222A2 (en) | 2015-03-18 |
US20150070847A1 (en) | 2015-03-12 |
EP2849222A3 (en) | 2015-06-17 |
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