JP5858997B2 - 損失変調シリコンエバネセントレーザー - Google Patents
損失変調シリコンエバネセントレーザー Download PDFInfo
- Publication number
- JP5858997B2 JP5858997B2 JP2013518723A JP2013518723A JP5858997B2 JP 5858997 B2 JP5858997 B2 JP 5858997B2 JP 2013518723 A JP2013518723 A JP 2013518723A JP 2013518723 A JP2013518723 A JP 2013518723A JP 5858997 B2 JP5858997 B2 JP 5858997B2
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- JP
- Japan
- Prior art keywords
- loss
- semiconductor
- waveguide
- type doped
- semiconductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1071—Ring-lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1028—Coupling to elements in the cavity, e.g. coupling to waveguides adjacent the active region, e.g. forward coupled [DFC] structures
- H01S5/1032—Coupling to elements comprising an optical axis that is not aligned with the optical axis of the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/021—Silicon based substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0265—Intensity modulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
- H01S5/06226—Modulation at ultra-high frequencies
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/827,776 US8693509B2 (en) | 2010-06-30 | 2010-06-30 | Loss modulated silicon evanescent lasers |
| US12/827,776 | 2010-06-30 | ||
| PCT/US2011/042633 WO2012003346A1 (en) | 2010-06-30 | 2011-06-30 | Loss modulated silicon evanescent lasers |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013534059A JP2013534059A (ja) | 2013-08-29 |
| JP2013534059A5 JP2013534059A5 (enExample) | 2014-08-14 |
| JP5858997B2 true JP5858997B2 (ja) | 2016-02-10 |
Family
ID=45399696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013518723A Active JP5858997B2 (ja) | 2010-06-30 | 2011-06-30 | 損失変調シリコンエバネセントレーザー |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8693509B2 (enExample) |
| JP (1) | JP5858997B2 (enExample) |
| KR (1) | KR101869414B1 (enExample) |
| CN (1) | CN103119804B (enExample) |
| WO (1) | WO2012003346A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11233374B2 (en) | 2018-01-19 | 2022-01-25 | Samsung Electronics Co., Ltd. | Semiconductor laser device and method of manufacturing the same |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080002929A1 (en) * | 2006-06-30 | 2008-01-03 | Bowers John E | Electrically pumped semiconductor evanescent laser |
| US9316785B2 (en) | 2013-10-09 | 2016-04-19 | Skorpios Technologies, Inc. | Integration of an unprocessed, direct-bandgap chip into a silicon photonic device |
| US8867578B2 (en) | 2009-10-13 | 2014-10-21 | Skorpios Technologies, Inc. | Method and system for hybrid integration of a tunable laser for a cable TV transmitter |
| US8605766B2 (en) | 2009-10-13 | 2013-12-10 | Skorpios Technologies, Inc. | Method and system for hybrid integration of a tunable laser and a mach zehnder modulator |
| US8611388B2 (en) * | 2009-10-13 | 2013-12-17 | Skorpios Technologies, Inc. | Method and system for heterogeneous substrate bonding of waveguide receivers |
| US11181688B2 (en) | 2009-10-13 | 2021-11-23 | Skorpios Technologies, Inc. | Integration of an unprocessed, direct-bandgap chip into a silicon photonic device |
| US9496431B2 (en) | 2013-10-09 | 2016-11-15 | Skorpios Technologies, Inc. | Coplanar integration of a direct-bandgap chip into a silicon photonic device |
| US8559470B2 (en) | 2009-10-13 | 2013-10-15 | Skorpios Technologies, Inc. | Method and system for hybrid integration of a tunable laser and a phase modulator |
| US8630326B2 (en) * | 2009-10-13 | 2014-01-14 | Skorpios Technologies, Inc. | Method and system of heterogeneous substrate bonding for photonic integration |
| US8615025B2 (en) | 2009-10-13 | 2013-12-24 | Skorpios Technologies, Inc. | Method and system for hybrid integration of a tunable laser |
| KR101361058B1 (ko) * | 2009-12-09 | 2014-02-12 | 한국전자통신연구원 | 광 소자를 포함하는 반도체 장치의 형성 방법 |
| US9922967B2 (en) | 2010-12-08 | 2018-03-20 | Skorpios Technologies, Inc. | Multilevel template assisted wafer bonding |
| US9977188B2 (en) | 2011-08-30 | 2018-05-22 | Skorpios Technologies, Inc. | Integrated photonics mode expander |
| CN102856789B (zh) * | 2012-09-19 | 2014-01-01 | 中国科学院半导体研究所 | 基于微结构硅波导选频的混合硅单模环形腔激光器 |
| US8938134B2 (en) | 2012-12-21 | 2015-01-20 | Alcatel Lucent | Hybrid optical modulator for photonic integrated circuit devices |
| WO2014118836A1 (ja) * | 2013-02-01 | 2014-08-07 | 日本電気株式会社 | 光機能集積ユニット及びその製造方法 |
| JP2014165292A (ja) * | 2013-02-25 | 2014-09-08 | Hitachi Ltd | 発光素子及びその製造方法並びに光送受信器 |
| US9306372B2 (en) | 2013-03-14 | 2016-04-05 | Emcore Corporation | Method of fabricating and operating an optical modulator |
| US9059801B1 (en) | 2013-03-14 | 2015-06-16 | Emcore Corporation | Optical modulator |
| US9306672B2 (en) | 2013-03-14 | 2016-04-05 | Encore Corporation | Method of fabricating and operating an optical modulator |
| JP2015089028A (ja) * | 2013-10-31 | 2015-05-07 | 株式会社Nttドコモ | 中央制御局、無線基地局及び無線通信制御方法 |
| US9360623B2 (en) * | 2013-12-20 | 2016-06-07 | The Regents Of The University Of California | Bonding of heterogeneous material grown on silicon to a silicon photonic circuit |
| GB2522410A (en) | 2014-01-20 | 2015-07-29 | Rockley Photonics Ltd | Tunable SOI laser |
| US9664855B2 (en) | 2014-03-07 | 2017-05-30 | Skorpios Technologies, Inc. | Wide shoulder, high order mode filter for thick-silicon waveguides |
| JP2015184375A (ja) * | 2014-03-20 | 2015-10-22 | 株式会社東芝 | 光配線デバイスおよびその製造方法 |
| US10003173B2 (en) | 2014-04-23 | 2018-06-19 | Skorpios Technologies, Inc. | Widely tunable laser control |
| US9658401B2 (en) | 2014-05-27 | 2017-05-23 | Skorpios Technologies, Inc. | Waveguide mode expander having an amorphous-silicon shoulder |
| CN105487263B (zh) * | 2014-06-30 | 2018-04-13 | 硅光电科技股份有限公司 | 硅基脊型波导调制器及其制造方法 |
| US9564733B2 (en) | 2014-09-15 | 2017-02-07 | Emcore Corporation | Method of fabricating and operating an optical modulator |
| JP5902267B1 (ja) | 2014-09-19 | 2016-04-13 | 株式会社東芝 | 半導体発光素子 |
| KR102171268B1 (ko) * | 2014-09-30 | 2020-11-06 | 삼성전자 주식회사 | 하이브리드 실리콘 레이저 제조 방법 |
| EP3286587A4 (en) | 2015-04-20 | 2018-12-26 | Skorpios Technologies, Inc. | Vertical output couplers for photonic devices |
| US10043925B2 (en) | 2015-08-27 | 2018-08-07 | Massachusetts Institute Of Technology | Guided-wave photodetector apparatus employing mid-bandgap states of semiconductor materials, and fabrication methods for same |
| US10074959B2 (en) | 2016-08-03 | 2018-09-11 | Emcore Corporation | Modulated laser source and methods of its fabrication and operation |
| US10693275B2 (en) | 2017-08-08 | 2020-06-23 | Nokia Solutions And Networks Oy | Directly modulated laser having a variable light reflector |
| US10511143B2 (en) * | 2017-08-31 | 2019-12-17 | Globalfoundries Inc. | III-V lasers with on-chip integration |
| US10649148B2 (en) | 2017-10-25 | 2020-05-12 | Skorpios Technologies, Inc. | Multistage spot size converter in silicon photonics |
| US11360263B2 (en) | 2019-01-31 | 2022-06-14 | Skorpios Technologies. Inc. | Self-aligned spot size converter |
| GB2589335B (en) * | 2019-11-26 | 2022-12-14 | Rockley Photonics Ltd | Integrated III-V/silicon optoelectronic device and method of manufacture thereof |
| CN113703201B (zh) | 2020-05-21 | 2025-08-05 | 中兴通讯股份有限公司 | 光调制器及其控制方法 |
| JP7753012B2 (ja) * | 2021-09-16 | 2025-10-14 | 浜松ホトニクス株式会社 | 光半導体素子、光学ユニット及び光学ユニットの製造方法 |
| EP4664168A1 (en) * | 2024-06-11 | 2025-12-17 | Nokia Solutions and Networks Oy | Semiconductor device and semiconductor device fabrication method |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3970959A (en) * | 1973-04-30 | 1976-07-20 | The Regents Of The University Of California | Two dimensional distributed feedback devices and lasers |
| US4563765A (en) * | 1982-01-29 | 1986-01-07 | Massachusetts Institute Of Technology | Intra-cavity loss-modulated diode laser |
| US5086430A (en) * | 1990-12-14 | 1992-02-04 | Bell Communications Research, Inc. | Phase-locked array of reflectivity-modulated surface-emitting lasers |
| JP2002217484A (ja) * | 2001-01-18 | 2002-08-02 | Fujitsu Ltd | 光半導体装置 |
| US7613401B2 (en) * | 2002-12-03 | 2009-11-03 | Finisar Corporation | Optical FM source based on intra-cavity phase and amplitude modulation in lasers |
| US7262902B2 (en) * | 2004-10-20 | 2007-08-28 | Photonic Systems, Inc. | High gain resonant modulator system and method |
| US7751654B2 (en) * | 2005-03-04 | 2010-07-06 | Cornell Research Foundation, Inc. | Electro-optic modulation |
| US8106379B2 (en) * | 2006-04-26 | 2012-01-31 | The Regents Of The University Of California | Hybrid silicon evanescent photodetectors |
| US7257283B1 (en) * | 2006-06-30 | 2007-08-14 | Intel Corporation | Transmitter-receiver with integrated modulator array and hybrid bonded multi-wavelength laser array |
| US20080002929A1 (en) * | 2006-06-30 | 2008-01-03 | Bowers John E | Electrically pumped semiconductor evanescent laser |
| US7982944B2 (en) * | 2007-05-04 | 2011-07-19 | Max-Planck-Gesellschaft Zur Forderung Der Wissenschaften E.V. | Method and apparatus for optical frequency comb generation using a monolithic micro-resonator |
| EP2243152A4 (en) * | 2008-01-18 | 2015-06-17 | Univ California | INTEGRATION PLATFORM CONNECTED TO A HYBRID SILICON-LASER-QUANTUM-TRAY MIXING LAYER FOR ADVANCED PHOTONIC CIRCUITS WITH ELECTRO-ABSORPTION MODULATORS |
| KR20110007617A (ko) * | 2008-05-06 | 2011-01-24 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 마이크로 링 레이저의 시스템 및 방법 |
| JP2010102045A (ja) * | 2008-10-22 | 2010-05-06 | Furukawa Electric Co Ltd:The | モード同期半導体レーザ |
| US8340478B2 (en) * | 2008-12-03 | 2012-12-25 | Massachusetts Institute Of Technology | Resonant optical modulators |
-
2010
- 2010-06-30 US US12/827,776 patent/US8693509B2/en active Active
-
2011
- 2011-06-30 WO PCT/US2011/042633 patent/WO2012003346A1/en not_active Ceased
- 2011-06-30 CN CN201180041417.7A patent/CN103119804B/zh active Active
- 2011-06-30 KR KR1020137002315A patent/KR101869414B1/ko active Active
- 2011-06-30 JP JP2013518723A patent/JP5858997B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11233374B2 (en) | 2018-01-19 | 2022-01-25 | Samsung Electronics Co., Ltd. | Semiconductor laser device and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130102528A (ko) | 2013-09-17 |
| CN103119804B (zh) | 2016-04-13 |
| CN103119804A (zh) | 2013-05-22 |
| US8693509B2 (en) | 2014-04-08 |
| KR101869414B1 (ko) | 2018-07-20 |
| US20120002694A1 (en) | 2012-01-05 |
| WO2012003346A1 (en) | 2012-01-05 |
| JP2013534059A (ja) | 2013-08-29 |
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