JP5852479B2 - Plating device and method for manufacturing plated material - Google Patents

Description

  The present invention relates to a plating apparatus and a method for manufacturing a plated product.

Conventionally, a wire saw in which abrasive grains such as diamond are fixed to the outer peripheral surface of a wire is known. This type of wire saw is used when, for example, a semiconductor wafer is cut (cut) from an ingot made of a single crystal or polycrystal.
A number of plating apparatuses for manufacturing wire saws have been developed and put into practical use.

  For example, Patent Document 1 discloses a first drum that supplies a wire, a second drum that winds the wire supplied from the first drum, and a plating solution and an abrasive disposed between the first drum and the second drum. A plating apparatus having a plating tank for storing grains is disclosed.

  In this plating apparatus, when the wire supplied from the first drum passes through the plating tank, the abrasive grains are fixed by applying electroplating to the outer peripheral surface of the wire.

Japanese Unexamined Patent Publication No. 63-22275

  However, in the invention described in Patent Document 1, after inserting a wire from the surface of the precipitation layer precipitated in the plating tank into the precipitation layer, the wire is moved while being moved substantially parallel to the surface of the precipitation layer. Since the grains are adhered, the abrasive grains adhering to the wire rub against other abrasive grains of the precipitated layer, and are easy to fall off from the wire. As a result, there arises a problem that the amount of abrasive grains adhering is reduced, a problem that the distribution of abrasive grains adhering to the wire is increased, and further, it is difficult to control the amount of abrasive grains adhering to the wire. There was a problem.

  Such a problem is also a problem that is commonly applied when, for example, a granular material is adhered to a film, carbon fiber, or the like.

  The present invention was devised from such a viewpoint, and it is possible to suitably secure the amount of adhesion of the granular material, and to reduce the variation in the distribution of the granular material adhering to the object to be plated. It is an object of the present invention to provide a plating apparatus and a method for manufacturing a plated article, which can easily control the amount of granular material to be adhered.

  In order to solve the above-mentioned problems, the present invention provides a plating apparatus for fixing a granular material to the outer surface of an object to be plated by applying an electric plating, wherein the granular material is precipitated in the plating solution and the plating solution. A plating tank for containing the plating layer, and the object to be plated enters the precipitation layer from the bottom or side of the plating tank and moves in a crossing direction with respect to the surface of the precipitation layer. The particulate matter adheres at the intersection with the surface of the precipitation layer.

  According to the present invention, the object to be plated enters the precipitation layer from the bottom or side of the plating tank and moves in the crossing direction with respect to the surface of the precipitation layer, so that it is granular at the intersection with the surface of the precipitation layer. Since the object is adhered, it is possible to prevent the granular material adhering to the object to be plated and the other granular object of the precipitation layer from rubbing, and prevent the granular object from falling off the object to be plated. As a result, the amount of particulate matter adhered can be suitably secured, the variation in the distribution of particulate matter adhered to the object to be plated is reduced, and the amount of particulate matter adhered to the object to be plated can be easily controlled.

  The anode member disposed in the plating tank, a cathode member disposed outside the plating tank and in contact with the object to be plated, and an energizing means for energizing the anode member and the cathode member. The anode member is preferably configured to be in contact with or close to the surface of the precipitation layer.

  According to such a configuration, since the anode member is in contact with or close to the surface of the precipitation layer, an electric field is surely generated in the vicinity of the surface of the precipitation layer. Becomes easier to adhere to the outer surface of the object to be plated.

  The plating tank includes an outer plating tank and an inner plating tank disposed in the outer plating tank. The outer plating tank includes a liquid and heating means for heating the liquid. It is preferable that the inner plating tank contains the plating solution and the precipitation layer.

According to this configuration, the heating means is accommodated in the outer plating tank, and the plating solution and the precipitation layer are accommodated in the inner plating tank, whereby the heating means and the precipitation layer are accommodated in separate plating tanks. Therefore, damage to the heating means due to contact with the granular material can be prevented.
Further, since the heating means is accommodated in the outer plating tank, the space of the inner plating tank can be reduced accordingly, so that the density of the granular material in the inner plating tank is increased and the outer surface of the object to be plated is granular. Objects can be attached quickly.

  The bottom or side of the plating tank is provided with a first insertion hole through which the object to be plated is inserted, and a sealing member for maintaining the sealing property of the plating tank is provided, and the sealing member Preferably, the second insertion hole is formed so as to communicate with the first insertion hole and into which the object to be plated is inserted.

  According to such a configuration, a sealing member that maintains the sealing property of the plating tank is provided at the bottom or side of the plating tank, thereby preventing leakage of the plating solution and the particulate matter from the plating tank.

  Moreover, it is preferable to further comprise a stirring means for stirring the precipitate layer.

  In the precipitation layer, various kinds of large and small particles are deposited, and relatively small (light) particles are likely to be deposited on the surface of the precipitation layer. Since it floats in the plating solution, only small particles can be prevented from adhering to the object to be plated. Thereby, various granular materials can be evenly adhered to the object to be plated.

In order to solve the above-mentioned problem, the present invention is a method for producing a plated object in which a granular material is fixed to the outer surface of an object to be plated by electroplating, and the granular material is contained in the plated liquid and the plated liquid. A plating layer containing the precipitation layer, and an introduction step of introducing the object to be plated into the plating layer. In the introduction step, the object to be plated is transferred from the bottom or side of the plating tank to the precipitation layer. And moving the object to be plated in a crossing direction with respect to the surface of the precipitation layer to attach the granular material to the outer surface of the object to be plated at the intersection with the surface of the precipitation layer. Features.

  According to the present invention, the object to be plated enters the precipitation layer from the bottom or side of the plating tank, and the object to be plated is moved in the intersecting direction with respect to the surface of the precipitation layer, thereby intersecting the surface of the precipitation layer. Since the granular material adheres to the outer surface of the object to be plated at the part, it is avoided that the granular material adhering to the object to be plated and the other granular material of the precipitation layer rub against each other, and the granular material falls off from the object to be plated. Can be prevented. As a result, the amount of particulate matter adhered can be suitably secured, the variation in the distribution of particulate matter adhered to the object to be plated is reduced, and the amount of particulate matter adhered to the object to be plated can be easily controlled.

  According to the present invention, it is possible to suitably secure the amount of particulate matter attached, to reduce the variation in the distribution of particulate matter attached to the object to be plated, and to easily control the amount of particulate matter attached to the object to be plated. A plating apparatus and a method for manufacturing a plated product can be provided.

(A) is a perspective view which shows a wire saw, (b) is the II sectional view taken on the line of (a). It is a schematic block diagram which shows the manufacturing apparatus of the wire saw which concerns on embodiment of this invention. FIG. 3 is a partially enlarged view of FIG. 2. It is the elements on larger scale which show the manufacturing apparatus of the wire saw which concerns on a modification.

Embodiments of the present invention will be described in detail with reference to the drawings. In the description, the same elements are denoted by the same reference numerals, and redundant description is omitted.
In addition, although this embodiment demonstrates the case where the plating apparatus of this invention is applied to the manufacturing apparatus of a wire saw, and makes an abrasive grain adhere to a wire, the intended purpose of the plating apparatus is not limited.

Prior to the description of the manufacturing apparatus 100 for the wire saw 1 according to the embodiment of the present invention, the wire saw 1 as a product will be described with reference to FIG. Fig.1 (a) is a perspective view which shows the wire saw 1, (b) is the II sectional view taken on the line of (a).
The wire saw 1 that is a plated object is a member used when, for example, a semiconductor wafer or the like is cut from an ingot, and includes a wire 2, a plated layer 3, and a plurality of abrasive grains 4 and 4.

<Wire>
The wire 2 that is the object to be plated is a metallic linear member that has a circular shape in cross-section as a core wire of the wire saw 1. The wire 2 of the present embodiment is composed of a piano wire with a brass plating (not shown) applied to the entire outer peripheral surface, but the present invention is not limited to this, and any conductive material can be used. For example, you may comprise a tungsten wire, a molybdenum wire, a stainless steel wire, an aluminum wire, etc. The wire diameter of the wire 2 is appropriately set according to the use of the wire saw 1.

<Plating layer>
The plating layer 3 is a member formed so as to cover the entire outer peripheral surface of the wire 2. The plating layer 3 of this embodiment is made of nickel.

<Abrasive>
The abrasive grains 4 that are granular materials are members that are fixed to the outer peripheral surface of the wire 2 by the plating layer 3 and serve as blade portions for cutting the object to be cut. Although the abrasive grain 4 of this embodiment is comprised with a diamond, this invention is not limited to this, For example, superabrasive grains, such as CBN (cubic boron nitride), a basalt, granite, tuff, etc. are grind | pulverized. Or a general abrasive such as sapphire / ruby / garnet / SiC (silicon carbide), or a combination of two or more of these. The particle size of the abrasive grains 4 is appropriately set according to the use of the wire saw 1.

  Next, with reference to FIG. 2, the manufacturing apparatus 100 of the wire saw 1 which concerns on embodiment of this invention is demonstrated. FIG. 2 is a schematic configuration diagram showing the manufacturing apparatus 100 for the wire saw 1 according to the embodiment of the present invention. The arrows in FIG. 2 indicate the moving direction of the wire 2.

  As shown in FIG. 2, the manufacturing apparatus 100 that is a plating apparatus includes a supply apparatus 10, a pretreatment tank 20, a first plating tank 30, a second plating tank 40, a post-treatment tank 50, and a drying apparatus 60. A winding device 70. Further, a plurality of guide rollers 80a-80x are arranged at appropriate positions of the manufacturing apparatus 100.

<Supply device>
The supply device 10 is a cylindrical device in which the wire 2 is wound and the wire 2 is supplied to the winding device 70. The supply device 10 is configured to be rotatable around a horizontal axis.

<Pretreatment tank>
The pretreatment tank 20 is a treatment tank for cleaning the wire 2 supplied from the supply device 10, and includes a degreasing tank 21, a first water washing tank 22, an acid treatment tank 23, and a second water washing tank 24. . Each tank 21-24 is a box-shaped resin container having an open top, and has a volume of a predetermined space. In addition, you may change suitably the material of each tank 21-24, a shape, a magnitude | size, etc.

<Degreasing tank>
In the degreasing tank 21, for example, a cleaning liquid containing sodium hydroxide is accommodated. The degreasing tank 21 serves to remove dirt such as oil and dust attached to the outer peripheral surface of the wire 2. The degreasing tank 21 is provided with a temperature controller 82 for adjusting the temperature of the stored liquid. The temperature controller 82 includes a temperature sensor 82a for detecting the temperature of the stored liquid, a heater 82b for heating the stored liquid, and a heating amount (ON / OFF included) of the heater 82b based on the temperature detected by the temperature sensor 82a. And a control unit 82c for controlling.

  In this case, the stored liquid is heated to a temperature suitable for removing dirt by the heater 82b. Further, by controlling the heating amount of the heater 82b based on the temperature detected by the temperature sensor 82a, it is possible to prevent the stored liquid from becoming excessively hot and to stabilize the concentration and temperature of the stored liquid.

<First washing tank>
The first flush tank 22 contains water. The first water rinsing tank 22 serves to wash acetone and the like attached to the wire 2 in the degreasing tank 21.

<Acid treatment tank>
In the acid treatment tank 23, for example, hydrochloric acid or the like is accommodated. The acid treatment tank 23 plays a role of removing oxides (such as rust) on the outer peripheral surface of the wire 2.

<Second washing tank>
The second rinsing tank 24 contains water. The second water washing tank 24 plays a role of washing hydrochloric acid and the like attached to the wire 2 in the acid treatment tank 23.

<First plating tank>
The first plating tank 30 serves to temporarily fix the abrasive grains 4 by forming the plating layer 3 on the outer peripheral surface of the wire 2 by applying nickel plating (electric plating). That is, in the first plating tank 30, the abrasive grains 4 are fixed to the wire 2 to such an extent that they do not fall off when the guide rollers 80l and 80m pass. The first plating tank 30 has an outer plating tank 31 and an inner plating tank 32 disposed in the outer plating tank 31. The outer plating tank 31 is a box-shaped resin container whose upper part is open and has a volume of a predetermined space, while the inner plating tank 32 is a box-shaped glass container whose upper part is opened and has a predetermined space. Having a volume of In addition, you may change suitably the material of the outer side plating tank 31 and the inner side plating tank 32, a shape, a magnitude | size, etc.
The outer plating tank 31 and the inner plating tank 32 will be described in detail later with reference to FIG.

<2nd plating tank>
The 2nd plating tank 40 plays the role which strengthens the adhering state of the abrasive grain 4 by performing nickel plating further, and firmly fixes the abrasive grain 4. That is, in the second plating tank 40, the thickness of the plating layer 3 formed in the first plating tank 30 is increased, and the embedding rate of the abrasive grains 4 in the plating layer 3 is increased. 2 is securely fixed. The second plating tank 40 is a box-shaped resin container having an open top, and has a predetermined volume. The second plating tank 40 has a longer width and height than the other tanks 21-24 and 51-53. Note that the material, shape, size, and the like of the second plating tank 40 may be changed as appropriate.

  Inside the second plating tank 40, a plating solution 40a and a plurality of metal plates 40b, 40b are accommodated. The plating solution 40a includes, for example, a sulfamic acid bath containing nickel sulfamate, boric acid, and nickel chloride.

  The metal plate 40b is composed of a strip-shaped nickel plate. The metal plate 40b is connected to the + (plus; positive) pole of the DC power supply 92 via the connection line H3, and functions as an anode member. On the other hand, the-(minus; negative) pole of the DC power source 92 is connected to the guide roller 80m via the connection line H4, and this guide roller 80m functions as a cathode member. Furthermore, the wire 2 is in contact with the guide roller 80m and constitutes a cathode.

  The second plating tank 40 is provided with a temperature controller 86 for adjusting the temperature of the plating solution 40a. The temperature controller 86 includes a temperature sensor 86a for detecting the temperature of the plating solution 40a, a heater 86b for heating the plating solution 40a, and a heating amount (ON / OFF) of the heater 86b based on the temperature detected by the temperature sensor 86a. And a control unit 86c for controlling (including).

  In this case, by heating the plating solution 40a with the heater 86b, the electrical resistance in the plating solution 40a can be reduced, and the flow of electricity can be improved. Further, by controlling the heating amount of the heater 86b based on the temperature detected by the temperature sensor 86a, it is possible to prevent the plating solution 40a from becoming excessively high and to stabilize the concentration and temperature of the plating solution 40a. .

<Aftertreatment tank>
The post-treatment tank 50 is a treatment tank for cleaning the wire 2 that has passed through the first plating tank 30 and the second plating tank 40. The third washing tank 51, the fourth washing tank 52, and the fifth washing tank A tank 53. Each washing tank 51-53 is a box-shaped resin container having an open top, and has a predetermined space. In addition, you may change suitably the material, shape, magnitude | size, etc. of each washing tank 51-53.

<3rd washing tank, 4th washing tank, 5th washing tank>
Each washing tank 51-53 contains water. Each of the water rinsing tanks 51 to 53 serves to wash the plating solutions 31 a and 40 a attached to the wire 2 in the first plating tank 30 and the second plating tank 40.

<Drying device>
The drying device 60 removes (evaporates) water (moisture) adhering to the wire 2 in the rinsing tank 51-53, and also dries the plating layer 3 formed by the first plating tank 30 and the second plating tank 40. Fulfill. The drying device 60 includes a heating unit 61 such as a heating coil or a heater, and a metal box-shaped member 62 that houses the heating unit 61. The heating means 61 is arranged along the moving direction of the wire 2. The box-shaped member 62 has a long shape in the moving direction of the wire 2, and insertion holes 62 a and 62 b through which the wire 2 is inserted are formed at both ends.

<Winding device>
The winding device 70 is a cylindrical device that is disposed at a predetermined interval in the horizontal direction and the vertical direction with respect to the supply device 10 and winds the wire 2 on which the plating layer 3 is formed and the abrasive grains 4 are fixed. is there. The winding device 70 is configured to be rotatable around a horizontal axis. The winding device 70 is configured to be rotated at a predetermined rotational speed by a driving unit (not shown) (for example, a motor) and to wind the wire 2 at a predetermined speed. The rotation speed of the winding device 70 can be adjusted.

<Guide roller>
The guide rollers 80 a to 80 x are columnar members that function as a guide portion that guides the wire 2 from the supply device 10 to the winding device 70. The guide rollers 80a-80x are configured to be rotatable around a horizontal axis. The guide rollers 80a, 80c, 80i, 80l, 80m, and 80q are made of a metal material, and the other guide rollers 80b and the like are made of a resin material. The guide rollers 80 i and 80 m function as a cathode member, and also serve as a power feeding unit that supplies current to the wire 2.

  Next, the outer plating tank 31 and the inner plating tank 32 will be described in detail with reference to FIGS. FIG. 3 is a partially enlarged view of FIG. In FIG. 3, for convenience of explanation, the outer plating tank 31 is omitted.

  As shown in FIG. 2, the outer plating tank 31 has a longer width and height dimension than the other tanks 21-24 and 51-53. A plating solution 31 a is accommodated in the outer plating tank 31. The plating solution 31a is made of an aqueous solution containing, for example, nickel chloride, boric acid, nickel sulfamate, and the like. Note that water or the like may be used instead of the plating solution 31a.

  The outer plating tank 31 is provided with a temperature controller 84 for adjusting the temperature of the plating solution 31a. The temperature controller 84 includes a temperature sensor 84a for detecting the temperature of the plating solution 31a, a heater (heating means) 84b for heating the plating solution 31a, and a heating amount of the heater 84b based on the temperature detected by the temperature sensor 84a. And a control unit 84c that controls (including ON / OFF).

  In this case, by heating the plating solution 31a with the heater 84b, the heat of the plating solution 31a is transmitted to the plating solution 32b (see FIG. 3) of the inner plating tank 32 described later, and the plating solution 32b can be heated. Thereby, while stabilizing the temperature in the plating liquid 32b, decomposition | disassembly of a liquid composition can be prevented by indirect heating, and the flow of electricity can be made favorable. Further, by controlling the heating amount of the heater 84b based on the temperature detected by the temperature sensor 84a, it is possible to prevent the plating solutions 31a and 32b from becoming excessively high and to stabilize the concentration and temperature of the plating solutions 31a and 32b. Can be made.

  As shown in FIG. 2, the inner plating tank 32 is shorter in width and height than the outer plating tank 31. The inner plating tank 32 is fixed to the upper surface of the bottom of the outer plating tank 31 via a plurality of support parts S, S, and the upper opening edge of the outer plating tank 31 via a plurality of connecting parts (not shown). Fixed to.

  As shown in FIG. 3, a minute insertion hole (first insertion hole) 32 a 1 through which the wire 2 is inserted is formed in the bottom 32 a of the inner plating tank 32. On the bottom outer surface 32a2 of the inner plating tank 32, a sealing member 33 for holding the inner plating tank 32 in an airtight or liquid tight manner is provided. The sealing member 33 is formed with a fine insertion hole (second insertion hole) 33a that communicates with the insertion hole 32a1 and through which the wire 2 is inserted. The insertion holes 32a1 and 33a are formed substantially the same as the outer diameter of the wire 2. In addition, although the sealing member 33 of this embodiment is comprised with a sheet-like silicone rubber, if the sealing property of the inner side plating tank 32 can be hold | maintained and the wire 2 is not damaged, the material, The shape and size may be any configuration.

  Inside the inner plating tank 32, a plating solution 32b, a precipitation layer 32c, and a plurality of metal plates 32d and 32d are accommodated. Moreover, the inner side plating tank 32 has an air stirring device 32e.

The plating solution 32b is made of an aqueous solution containing, for example, nickel chloride, boric acid, nickel sulfamate, and the like.
The precipitation layer 32 c is formed by depositing a plurality of abrasive grains 4 and 4 in the plating solution 32 b by its own weight, and is deposited on the bottom inner surface 32 a 3 of the inner plating tank 32. A part of the abrasive grains 4 is suspended in the plating solution 32b.

  The metal plates 32d are, for example, strip-shaped nickel plates, and four are arranged at equal intervals so as to surround the periphery of the wire 2 (only two are shown in FIG. 3). The lower end of the metal plate 32d is in contact with the surface 32c1 of the precipitation layer 32c. The metal plate 32d is connected to the + (plus; positive) pole of the DC power supply 90, which is an energizing means, via the connection line H1, and functions as an anode member. On the other hand, the-(minus; negative) pole of the DC power supply 90 is connected to a guide roller 80i disposed on the upstream side of the precipitation layer 32c via a connection line H2, and this guide roller 80i functions as a cathode member. To do. Further, the wire 2 is in contact with the guide roller 80i and constitutes a cathode.

  In this case, when the DC power supply 90 is turned on and a current is passed through the metal plate 32d, the guide roller 80i, and the wire 2, the abrasive grains 4 adhere to the outer peripheral surface of the wire 2 or nickel ions (metal) in the plating solution 32b. Eutectoid together with ions) and adhere. Further, when the nickel ions adhere, the plating layer 3 is formed on the outer peripheral surface of the wire 2. Thereby, the abrasive grains 4 are temporarily fixed to the outer peripheral surface of the wire 2 by the plating layer 3.

  The lower end of the metal plate 32d may be close to the surface 32c1 of the precipitation layer 32c (that is, the abrasive grains 4 and nickel ions are the outer peripheral surface of the wire 2 at the intersection X with the surface 32c1 of the precipitation layer 32c). Or may be inserted into the precipitation layer 32c so that it can be suitably attached to the surface 32c1). Further, the number, material, shape, size, and the like of the metal plate 32d may be changed as appropriate. For example, the shape of the metal plate 32d may be an annular shape (ring shape) or a semicircular shape.

  The air stirring device 32e as stirring means is a device for sending air into the plating solution 32b and stirring the precipitation layer 32c. The air agitating device 32e includes a delivery pipe 32e1 that sends out air to the sedimentation layer 32c, and a pump 32e2 that is disposed outside the inner plating tank 32 and supplies air to the delivery pipe 32e1. The upper end of the delivery pipe 32e1 is connected to the pump 32e2, while the delivery outlet 32e3 at the lower end is located in the precipitation layer 32c.

  Here, a guide roller 80 k is disposed below the inner plating tank 32, and a guide roller 80 l is disposed above the inner plating tank 32. A portion 80k1 of the outer peripheral surface of the guide roller 80k where the wire 2 is separated, a portion 80l1 of the outer peripheral surface of the guide roller 80l where the wire 2 is first contacted, and the insertion holes 32a1 and 33a of the inner plating tank 32 and the sealing member 33. Is arranged on a straight line along the vertical direction (vertical direction). In this case, the wire 2 introduced into the inner plating tank 32 moves from the lower side to the upper side, and moves in the intersecting direction (orthogonal direction) with respect to the surface 32c1 of the precipitation layer 32c. And the abrasive grain 4 and nickel ion adhere to the outer peripheral surface of the wire 2 in the crossing part X with the surface 32c1 of the precipitation layer 32c.

  In addition, the ratio of the adhesion area of the abrasive grains 4 to the surface area of the wire 2 (adhesion amount of the abrasive grains 4) is appropriately set according to the use of the wire saw 1. In this case, the adhesion amount of the abrasive grains 4 is controlled by appropriately adjusting the current intensity, the moving speed of the wire 2, the air pressure of the air agitator 32e, and the like. Further, the thickness of the plating layer 3 is appropriately set according to the particle size of the abrasive grains 4. In this case, the thickness of the plating layer 3 is adjusted by appropriately adjusting the strength of the current, the moving speed of the wire 2, the dimensions of the inner plating tank 32 and the second plating tank 40 (capacities of the plating solutions 32b and 40a), and the like. Control.

  The manufacturing apparatus 100 according to the embodiment of the present invention is basically configured as described above. Next, the operation will be described with reference to FIGS. 2 and 3 as appropriate.

  First, as shown in FIG. 2, the winding device 70 is rotated by a driving means (not shown), and the wire 2 is unwound from the supply device 10.

Subsequently, the wire 2 unwound from the supply device 10 passes in the order of the degreasing tank 21 → the first water washing tank 22 → the acid treatment tank 23 → the second water washing tank 24.
At this time, dirt, oxides and the like attached to the outer peripheral surface of the wire 2 are removed, and the cleaning liquid containing sodium hydroxide attached in the degreasing tank 21 and the hydrochloric acid attached in the acid treatment tank 23 are washed.

  Subsequently, as shown in FIGS. 2 and 3, the cleaned wire 2 is introduced into the outer plating tank 31 and then from the bottom 32 a via the guide rollers 80 j and 80 k and the insertion holes 33 a and 32 a 1. It is introduced into the inner plating tank 32.

Subsequently, as shown in FIG. 3, the wire 2 introduced into the inner plating tank 32 from the bottom 32a enters the precipitation layer 32c and moves in the crossing direction with respect to the surface 32c1 of the precipitation layer 32c.
Further, current is passed through the metal plate 32d, the guide roller 80i, and the wire 2 by the DC power source 90, and the abrasive grains 4 and nickel ions are applied to the outer peripheral surface of the wire 2 at the intersection X with the surface 32c1 of the precipitation layer 32c. Adhere to.

At this time, since the lower end of the metal plate 32d is in contact with the surface 32c1 of the precipitation layer 32c, an electric field is surely generated in the vicinity of the surface 32c1 of the precipitation layer 32c. Becomes easier to adhere to the outer peripheral surface of the wire 2.
Further, the temperature adjuster 84 adjusts the plating solution 31a of the outer plating tank 31 to a temperature suitable for adhesion of nickel ions, while the heat of the plating solution 31a is transmitted to the plating solution 32b of the inner plating tank 32, and the plating is performed. The liquid 32b has substantially the same temperature as the plating liquid 31a. For this reason, the nickel ions in the plating solution 32 b are likely to adhere to the outer peripheral surface of the wire 2.
Furthermore, the precipitation layer 32c is stirred by the air sent from the air stirring device 32e, and the small abrasive grains 4 deposited on the surface 32c1 of the precipitation layer 32c float in the plating solution 32b. Thereby, it is possible to prevent only small abrasive grains 4 from adhering to the wire 2.

Subsequently, the wire 2 that has passed through the surface 32c1 of the precipitation layer 32c passes through the plating solution 32b above the precipitation layer 32c.
At this time, nickel ions further adhere, and the plating layer 3 is formed on the outer peripheral surface of the wire 2. Thereby, the abrasive grains 4 are temporarily fixed to the outer peripheral surface of the wire 2 by the plating layer 3.

Subsequently, as shown in FIG. 2, the wire 2 to which the abrasive grains 4 are temporarily fixed is introduced into the second plating tank 40 via the guide rollers 80l and 80m.
At this time, the direct current power source 92 causes a current to flow through the metal plate 40b, the guide roller 80m, and the wire 2, and nickel ions further adhere, so that the thickness of the plating layer 3 increases, and the abrasive grains 4 on the plating layer 3 are increased. As a result, the abrasive grains 4 are firmly fixed (mainly fixed) to the wire 2.

Subsequently, the wire 2 to which the abrasive grains 4 are fixed is passed in the order of the third water washing tank 51 → the fourth water washing tank 52 → the fifth water washing tank 53.
At this time, the plating solutions 31a and 40a adhering to the wire 2 are washed in the first plating tank 30 and the second plating tank 40.

Subsequently, the cleaned wire 2 is introduced into the box-shaped member 62 through the insertion hole 62a. The wire 2 introduced into the box-shaped member 62 moves while being heated by the heating means 61.
At this time, the water adhering to the wire 2 in the third washing tank 51 to the fifth washing tank 53 is removed by the heating means 61, and the plating layer 3 formed by the first plating tank 30 and the second plating tank 40. Is dried.

  Then, after the dried wire 2 is led out of the box-shaped member 62 through the insertion hole 62b, it is wound around the outer peripheral surface of the winding device 70.

  According to the present embodiment described above, the wire 2 enters the precipitation layer 32c from the bottom 32a of the inner plating tank 32, and moves in the crossing direction with respect to the surface 32c1 of the precipitation layer 32c, and the surface 32c1 of the precipitation layer 32c. By adhering the abrasive grains 4 at the intersection X with the wire 2, the abrasive grains 4 adhering to the wire 2 and the other abrasive grains 4 of the precipitation layer 32 c are prevented from rubbing, and the abrasive grains 4 from the wire 2 Dropping can be prevented. As a result, the adhesion amount of the abrasive grains 4 can be suitably secured, the variation in the distribution of the abrasive grains 4 adhered to the wire 2 is reduced, and the amount of the abrasive grains 4 adhered to the wire 2 can be easily controlled. Thereby, the fall of the cutting performance of the wire saw 1 which is a finished product can be suppressed.

  In addition, according to the present embodiment, the wire 2 can be prevented from being plated before entering the precipitation layer 32 c by entering the precipitation layer 32 c from the bottom 32 a of the inner plating tank 32. Thereby, after the wire 2 passes through the precipitation layer 32c, the adhesion amount of nickel ions may be adjusted. Therefore, before the wire enters the precipitation layer and after passing through the precipitation layer, the adhesion amount of nickel ions is reduced. Compared with the prior art (invention described in Patent Document 1) that needs to be adjusted, the thickness of the plating layer 3 can be easily managed.

  Further, according to the present embodiment, the wire 2 moves in the intersecting direction with respect to the surface 32c1 of the precipitation layer 32c, and the abrasive grains 4 adhere to the intersection X with the surface 32c1 of the precipitation layer 32c, whereby the wire 2 Since the abrasive grains 4 adhere uniformly over the entire circumference, a high-quality wire saw 1 with little unevenness can be manufactured.

  In addition, according to the present embodiment, since the lower end of the metal plate 32d is in contact with the surface 32c1 of the precipitation layer 32c, an electric field is reliably generated in the vicinity of the surface 32c1 of the precipitation layer 32c. At the intersection X with the surface 32 c 1, the abrasive grains 4 and nickel ions are more likely to adhere to the outer peripheral surface of the wire 2.

  Further, according to the present embodiment, the plating liquid 31a is adjusted to a temperature suitable for the deposition of nickel ions by the temperature controller 84, and the inner plating tank 32 is a glass container. Is transferred to the plating solution 32b of the inner plating tank 32. As a result, the plating solution 32 b has substantially the same temperature as the plating solution 31 a, so that nickel ions in the plating solution 32 b are more likely to adhere to the outer peripheral surface of the wire 2.

  Further, according to the present embodiment, since the heater 84b is accommodated in the outer plating tank 31, the space of the inner plating tank 32 can be reduced accordingly, so that the density of the abrasive grains 4 in the inner plating tank 32 is increased. Thus, the abrasive grains 4 can be quickly attached to the outer peripheral surface of the wire 2.

  Further, according to the present embodiment, when the guide roller 80i disposed on the upstream side of the precipitation layer 32c serves as the cathode member, the guide roller 80l disposed on the downstream side of the precipitation layer 32c serves as the cathode member. In comparison with the above, nickel ions are likely to adhere to the outer peripheral surface of the wire 2 on the side of the intersection X with the surface 32c1 of the precipitation layer 32c.

  In addition, the abrasive layer 4 of various sizes is deposited on the precipitation layer 32c, and relatively small abrasive particles 4 are likely to be deposited on the surface 32c1 of the precipitation layer 32c. In this embodiment, the air agitating device 32e. Thus, since the small abrasive grains 4 float in the plating solution 32b, it is possible to prevent only the small abrasive grains 4 from adhering to the wire 2. On the other hand, when it is desired to attach small abrasive grains 4, after stirring once, the movement of the wire 2 is stopped until the small abrasive grains 4 are deposited again. Thereby, the large and small abrasive grains 4 can be evenly attached to the wire 2.

  Further, according to the present embodiment, the heater 84b and the guide rollers 80j and 80k are accommodated in the outer plating tank 31, and the precipitation layer 32c is accommodated in the inner plating tank 32, whereby the heater 86b and the guide rollers 80j and 80k Since the precipitation layer 32c is accommodated in separate plating tanks, damage to the heater 86b and the guide rollers 80j and 80k due to contact with the abrasive grains 4 can be prevented.

  According to the present embodiment, the bottom outer surface 32a2 of the inner plating tank 32 is provided with the sealing member 33 for holding the inner plating tank 32 in an airtight or liquid-tight manner. 4 and the plating solution 32b can be prevented from leaking out.

  As mentioned above, although embodiment of this invention was described in detail with reference to drawings, this invention is not limited to this, In the range which does not deviate from the main point of invention, it can change suitably.

  In this embodiment, the plating apparatus of the present invention is applied to the manufacturing apparatus 100 of the wire saw 1 and used when the abrasive grains 4 are adhered to the outer peripheral surface of the wire 2. However, the present invention is limited to this. Instead, for example, it may be used when a granular material is attached to the outer surface of a film (band member), the outer surface of a carbon fiber (linear member), or the like.

  In this embodiment, the plating layer 3 is made of nickel. However, the present invention is not limited to this, and may be made of, for example, a nickel alloy, or other metal such as copper, tin, or platinum. It may be made of a material. In this case, the constituent components of the plating solutions 32b and 40a and the constituent materials of the metal plates 32d and 40b are appropriately changed.

  In the present embodiment, the wire 2 moves in a direction orthogonal to the surface 32c1 of the precipitation layer 32c, but the present invention is not limited to this, and is inclined with respect to the surface 32c1 of the precipitation layer 32c (substantially orthogonal direction). To) may move.

  In the present embodiment, the wire 2 has entered the precipitation layer 32c from the bottom 32a of the inner plating tank 32, but the present invention is not limited to this, and as shown in FIG. You may enter into the precipitation layer 32c from 32f. In this case, an insertion hole (first insertion hole) 32f1 is formed in the side portion 32f, and a sealing member 33 is provided on the outer surface of the side portion 32f.

  In the present embodiment, the plating solution 31a is accommodated in the outer plating tank 31, but the present invention is not limited to this, and the outer plating tank 31 may not be accommodated in the outer plating tank 31. 31 itself may be omitted. In this case, the inner plating tank 32 is provided with heating means such as a heater. Further, it is preferable that the guide roller 80k (see FIG. 2) is made of a metal material and is connected to a negative terminal of the DC power supply 90 to form a negative electrode member. As a result, the distance between the guide roller 80k and the surface 32c1 (intersection portion X) of the precipitation layer 32c is shorter than when the guide roller 80i is a negative electrode member as in the present embodiment. The plating performance on the surface 32c1 is improved, and the abrasive grains 4 and nickel ions are more likely to adhere to the outer peripheral surface of the wire 2 at the intersection X with the surface 32c1 of the precipitation layer 32c.

  In the present embodiment, the wire 2 is plated after passing through the precipitation layer 32c. However, the present invention is not limited to this, and the wire 2 is plated before entering the precipitation layer 32c. It is good. In this case, an anode member is separately arranged in the outer plating tank 31.

  Although the second plating tank 40 is provided in the present embodiment, the present invention is not limited to this, and the second plating tank 40 may be omitted. In this case, by increasing the height of the inner plating tank 32, a sufficient thickness of the plating layer 3 is ensured in the inner plating tank 32, and the abrasive grains 4 are firmly fixed to the outer peripheral surface of the wire 2.

  In the present embodiment, the air agitating device 32e is used as the agitating means. However, the present invention is not limited thereto, and includes, for example, a screw that agitates the abrasive grains 4 and a drive motor that drives the screw. Other stirring means may be used.

100 Manufacturing equipment (Plating equipment)
1 Wire saw
2 Wire (Substance to be plated)
3 Plating layer 4 Abrasive grain (granular material)
30 No. 1 plating tank (plating tank)
31 Outer plating tank 31a Plating solution (liquid)
32 inner plating tank 32a bottom 32a1 insertion hole (first insertion hole)
32b plating solution 32c precipitation layer 32c1 surface 32d metal plate (anode member)
32e Air stirrer (stirring means)
32f side portion 32f1 insertion hole (first insertion hole)
33 sealing member 33a insertion hole (second insertion hole)
80i guide roller (cathode member)
84b Heater (heating means)
90 DC power supply (energization means)
X Intersection

Claims (6)

A plating device for fixing granular materials to the outer surface of the object to be plated by applying electroplating,
A plating tank containing a plating solution and a precipitation layer in which the granular material is precipitated in the plating solution;
The object to be plated enters the precipitation layer from the bottom or side of the plating tank, and moves in the crossing direction with respect to the surface of the precipitation layer, so that the granular material is intersected with the surface of the precipitation layer. A plating apparatus to which an object is attached. An anode member disposed in the plating tank;
A cathode member disposed outside the plating tank and in contact with the object to be plated;
Energizing means for energizing the anode member and the cathode member, and
The plating apparatus according to claim 1, wherein the anode member is in contact with or close to the surface of the precipitation layer. The plating tank has an outer plating tank and an inner plating tank disposed in the outer plating tank,
The outer plating tank contains a liquid and a heating means for heating the liquid,
3. The plating apparatus according to claim 1, wherein the plating solution and the precipitation layer are accommodated in the inner plating tank. A first insertion hole through which the object to be plated is inserted is formed at the bottom or side of the plating tank, and a sealing member for maintaining the sealing property of the plating tank is provided,
The plating apparatus according to claim 1, wherein the sealing member is formed with a second insertion hole that communicates with the first insertion hole and through which the object to be plated is inserted. .   The plating apparatus according to claim 1, further comprising a stirring unit that stirs the precipitate layer. A method for producing a plated object, in which a granular material is fixed to the outer surface of an object to be plated by electroplating,
An introduction step of introducing the plating object into a plating tank containing a plating solution and a precipitation layer formed by depositing the granular material in the plating solution;
In the introducing step, the precipitation layer is moved by allowing the plating object to enter the precipitation layer from the bottom or side of the plating tank and moving the plating object in a crossing direction with respect to the surface of the precipitation layer. A method for producing a plated object, comprising depositing the granular material on the outer surface of the object to be plated at an intersection with the surface of the plating object.

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