JPS5854198B2 - Improved wire tool manufacturing equipment - Google Patents

Description

[Detailed description of the invention] The present invention relates to a wire tool manufacturing device.

The tool needs to be made of an appropriate material and shape depending on the type of workpiece.

Processing such as cutting, cutting, cutting, grinding, or polishing often requires precision, and often involves finishing items with unique shapes.

In some cases, bandsawing or sanding was not sufficient, and in other cases, conventional methods did not provide workability or precision or accuracy.

SUMMARY OF THE INVENTION In view of the drawbacks of conventional methods, it is an object of the present invention to provide an apparatus for producing a wire tool by processing a wire surface, which is superior in workability and finishing performance.

If the workpiece is soft, such as a plastic product, the material or shape of the wire should be selected appropriately.

Wire tools can also be manufactured by using aluminum wire or copper wire as the wire and bonding fine particles such as aluminum oxide or iron oxide to the surface by plating. You can get something that satisfies you.

In the description of the present invention, a wire tool obtained by bonding a high-tensile steel wire with fine grains of metal carbide by plating will be mainly described.

However, as already mentioned, it is necessary that the wire, or at least the surface of the wire, be electrically conductive, but the wire is not limited to steel wire and the adhesive is not limited to metal carbide.

It can also be used in the material and shape of the pond.

The present invention is first characterized by a method and apparatus for obtaining a wire tool, secondly by the obtained tool, and further by an apparatus equipped with the obtained tool for actual processing.

In other words, it is as follows. The present invention first requires a plating solution container.

■Examples will be explained based on the drawings.

FIG. 1 is an explanatory longitudinal cross-sectional view showing one embodiment of the wire tool of the present invention.

A predetermined amount of a plating solution 5 mixed with abrasive grains 4 is charged into a container 2.

There is an outlet 3 for the plating solution 5 in the center of the bottom of the plating solution container 2.
will be established.

The outlet 3 has a structure that can be sealed against a predetermined liquid pressure, and is also an inlet for charging the wire, which is the base material of the wire tool, into the plating solution container.The wire exits the plating container 3 from the upper outlet, but its passage is Also serves as a mouth.

The container 2 has at least one plating solution supply port 1 at the top.
0, and at least one abrasive supply port 11 is provided at the curved end.

At least one of these supply ports 10.11 can also be used.

The supply port 10.11 seals the inlet and allows the liquid pressure to be higher than atmospheric pressure.

The upper lid of the container 3 is provided with a sealed opening in the center thereof that is sealed by a seal 7 and allows the wire tool 1 to be pulled out.

Sealing is actually accomplished by using a doughnut-shaped hollow soft body made of rubber or plastic and filling the hollow part with air.

A predetermined amount of plating solution and abrasive grains are charged into the container 2.

A mechanism is attached to continuously replenish this amount during work.

The wire 1 passes through the hole in the liquid receiver 8 and enters the bottom hole 3 of the plating container.
It passes between the plating solution and the mixed abrasive grains, passes through the lid hole seal 7 of the container 2, and is guided by the upper guide roll 6 and drawn upward.

Before entering the hole 3, the wire 1 is energized to the negative pole of a plating power source by an electrode 6 which also serves as a guide roll, and the plating solution is passed through the container 2 as a positive pole and is energized with a predetermined current density.

When using a plating solution such as nickel plating solution, the wire is placed in the plating solution 5 while the solution is raised to a level higher than atmospheric pressure and the solution is discharged from the sealed portion of the hole 3 through a very small gap between the wire and the wire. When the wire is led upward, the abrasive grains 4 in the liquid are pressed against the surface of the wire 1 inserted near the hole 3 by the outflow pressure of the jet of plating solution, and at the same time they are fixed by electrical plating. The plating is continued while the wire 1 passes through the liquid phase in the container 2, forming a thick plating layer in which the abrasive grains 4 are embedded and firmly fixing the abrasive grains.

The situation is enlarged and shown in FIGS. 2 and 3.

FIG. 2 is an example of conventional composite plating with abrasive grains suspended in a plating solution, and shows a defective wire tool using wire 1.

The adhesion state of the abrasive grains 4 and the nickel phase 9 is as shown in the figure. Between the wire 1 and the abrasive grains 4, 11 is raised or 11 is separated.
is in a state of

Furthermore, the tips of the abrasive grains fixed by plating are irregular.

The difference is huge. Therefore, a thick plating layer 9 is required to sufficiently fix the protruding abrasive grains.

FIG. 3 shows a successful wire tool made according to the invention.

Since the abrasive grains 4 are fixed by plating while being pressed onto the wire 1 by the jetting pressure of the plating solution, the bottom of the abrasive grains 4 is in contact with the wire 1, and the nickel phase 9 firmly adheres the abrasive grains 4 to the wire 1.

Therefore, the fixing effect is stronger than in the state shown in FIG.

The tips of the abrasive grains 4 are fixed uniformly, and there is only a slight difference t due to the difference in the degree of each abrasive grain, outer diameter, shape, size, etc.
A highly accurate tool can be obtained.

Furthermore, since the abrasive grains are uniformly fixed on the wire surface, the fixing plating layer 9 may be thinner than that shown in FIG. 2, and the tool can be manufactured with higher efficiency.

In order to eliminate t, it is of course important to use uniform abrasive grains, but in some cases, abrasive grains are intentionally bonded to create t.

In this case, a mixture of abrasive grains of different sizes may be used.

Furthermore, depending on the application, a surface with a t can be formed using abrasive grains made of several materials or a mixture of abrasive grains made of the same material but of different sizes.

Even if a surface with t is formed using mixed abrasive grains, each abrasive grain 4 is always adhesively fixed to the wire 1, so as shown in Fig. 2, the abrasive grains 4
It does not stand up and the adhesive strength is weak so it does not easily fall off or wear out.

Plating current densities are applied as in normal standard plating operations.

However, since the purpose of plating is mainly adhesion, a thick plating layer with poor color can be formed through overcurrent.

As for the plating current, it is better to apply pulsed current than direct current, or to apply a pulsed current by adding alternating current or high-frequency alternating current to direct current, which allows plating to be performed with a higher current density in a pulsed manner, and the density of the plating layer 9 can be increased. This increases hardness and allows for strong fixing and adhesion.

The wire typically has a round cross section, but when used as a wire tool for filing work, it is preferable to use a wire with a file-shaped surface.

Further, a polygonal, semicircular, or flat plate-shaped wire may be used.

The abrasive grains are typically spherical, but may be plate-like strips or line-cut pieces1. Use the shape of the pond.

Platy strips have yielded good results for adapted applications, but
Because of the plate-like shape, there are many protrusions on the wire surface, and the above-mentioned t may become a dog.

In such cases, it was better to make the wire passing speed and plate size uniform rather than making the plating layer thicker.

It was found that the gripping force of the plating phase is related.

Therefore, selection of plating conditions is also important in wire tool manufacturing.

The method for manufacturing a wire tool and the wire tool have been described above, focusing on Example 2. Next, a processing device using this wire tool will be described.

FIG. 4 shows an embodiment of a processing device equipped with a wire tool of the present invention.

The workpiece 27 is placed on the work table 2 while holding the fixture 28.
Frame 2 of the processing device of the present invention is fixed to 9 and set to slide accurately between fixed frames 24A and 24B.
3 will now be explained about the vertical movement machining operation, and is moved up and down using power-driven crank mechanisms 25 and 26.

The wire tool 21 is passed through the wire tool 21 parallel to the inner surface S of the inner hole, which is the processing surface of the workpiece 27, and tensioned using the tension adjustment units 22A and 22B provided in the head.

When the crank mechanisms 25 and 26 are actuated, the wire tool moves up and down as the frame 23 slides up and down.

Machining can be improved by attaching a unit that gives vibration to the wire tool for both vertical and vertical movements.

Further, with the unit 20 having a built-in control mechanism and the workpiece table feeding mechanisms 32, 33, 34, and 31, accurate, good precision, and stable machining can be performed at all times.

Wire tools are fixed to the wire base material with each abrasive grain pressed and bonded, and are strongly fixed with high gripping force, so the abrasive grains do not fall off or wear out during processing, improving grindability, cutting performance, and service life. We were able to improve the efficiency of machining.

In addition, by using uniform abrasive grains, a tool with high precision in which the abrasive grain tip surfaces were aligned was obtained, and machining using this tool enabled machining with extremely good machining accuracy.

The wires used ranged from 0.01mm in diameter to 20mm in diameter.
It was possible to use up to mrrt regardless of the diameter.

It was also confirmed that a wire tool can be obtained using a plastic wire whose surface is plated with conductive metal.

It was also confirmed that machining can be performed by energizing the tool during machining to activate electrolytic action.

As described above, the wire tool manufacturing method and manufacturing apparatus of the present invention enable precision mechanical machining and multifaceted machining in technical fields that were previously impossible or difficult, and open up many applications. did.

It is expected that this technology can be used to develop new technologies and even new products.

In this way, we believe that the present invention has many industrial applications and will contribute to the development of industry.

[Brief explanation of the drawing]

FIG. 1 is a schematic explanatory diagram of one embodiment of a plating container for manufacturing a wire tool from wire, and a method and apparatus for manufacturing the wire tool. FIG. 2 is a partially enlarged explanatory view of a wire tool obtained by a conventional method. FIG. 3 is a partially enlarged explanatory view of a good wire tool manufactured according to the present invention. FIG. 4 is a schematic explanatory diagram of an embodiment of a processing device equipped with a wire tool. 1: Wire, 2: Plating container, 4: Abrasive grain, 5: Plating solution, 6: Guide roll, electrode, 3: Plating container bottom hole, electrode, 10, 11: Supply port, 21° 1A: Wire tool, A :
Plating phase (layer), t: height difference between abrasive grains, 23: processing device frame equipped with wire tool, 22A, 22B: head,
25, 26: Crank, drive mechanism, 24A, 24B: Vertical sliding unit, 29: Table, 27: Workpiece, 2
8: Fixture, 20, 31 32° 33. 34: Cheeple feed unit.

Claims (1)

[Scope of Claims] 1. A plating solution container containing abrasive grains has a hole at one end that serves as a plating solution outlet and an insertion port for a wire tool base wire, and at least one hole is provided in a part of the container. A sealable plating solution supply port is provided, and a sealing port is provided at the end of the container for guiding outward a wire tool manufactured using the wire as a base material within the container. A plating power supply consisting of a plating electric circuit and a control mechanism is provided between the wire passing through the container and the plating solution, and the wire is connected to one end inside the container. The abrasive-containing plating liquid phase is allowed to pass from the hole to the sealed opening at the bent end, and the outflow pressure of the plating liquid flowing out from the end hole causes the abrasive grains to adhere to the wire under pressure and fix the plating on the wire surface. Features: Wire tool manufacturing equipment. 2. Wire tool manufacturing device 3 according to claim 1, characterized in that the plating liquid pressure is increased, the abrasive grains are always closely pressed and adhered to the wire surface, and the plating is fixed by electroplating. The wire used as the base material has a predetermined strength and hardness and is electrically conductive, and its cross section is uniform over its entire length, giving it a predetermined shape such as round, square, or file shape. The apparatus for manufacturing a wire tool according to claim 1 or 2, characterized in that the wire is passed through from the end of the wire to the end of the wire. 4 The abrasive grains that are broken and fixed on the surface layer of the base wire of the wire tool by electroplating have a predetermined uniform size and shape, and are always pressed and bonded to the wire surface by plating, and the shape can be grains, plates, or strips. , wire pieces are used alone or in combination, and the materials are carbon-based materials such as diamond, metal nitrides such as boron nitride, titanium nitride, boron carbide, tungsten carbide, A metal carbide such as silicon carbide or a metal oxide such as silicon oxide, zirconium oxide, or aluminum oxide, which is used as a machining abrasive material, and is mixed with the plating solution or added to the other supply port. The wire tool manufacturing apparatus according to claim 1, 2 or 3, characterized in that the wire tool is supplied from the container into the container. 5. The wire tool according to claim 1, 2, 3 or 4, wherein the plating electric circuit uses a pulse or a circuit made by adding a high frequency tributary to a direct current to make it pulsed. production equipment.