JP5852341B2 - Etching pattern creation apparatus, etching pattern creation method, program, and computer-readable recording medium - Google Patents

Description

  The present invention relates to an etching pattern creation apparatus, an etching pattern creation method, a program, and a computer-readable recording medium, and more specifically, an etching pattern used when forming a conductor pattern on an electronic board such as a printed board and a semiconductor package board. The present invention relates to an etching pattern creation apparatus, an etching pattern creation method, a program, and a computer-readable recording medium.

  2. Description of the Related Art Conventionally, in the manufacture of an electronic substrate, an etching substrate is used to create an electronic substrate based on design data created by an electronic substrate design apparatus such as CAD (Computer Aided Design) or CAM (Computer Aided Manufacturing). An etching pattern, which is a pattern for applying an etching resist formed in the same shape as the conductor pattern to be formed, was created.

Then, the formed etching pattern is formed on the conductor surface made of the copper foil of the electronic substrate, and then the etching process that dissolves the portion of the conductor surface where the etching pattern is not formed by the etching solution on the electronic substrate. A desired conductor pattern is formed.

  Hereinafter, the case where an etching process is performed using an etching pattern created by an etching pattern creation apparatus will be described in detail with reference to FIG.

  FIG. 1A shows a perspective explanatory view of an electronic substrate on which a mask on which an etching pattern created by an etching pattern creation apparatus is formed is placed, and FIG. 1A is a cross-sectional view taken along line I-I in FIG. 1A, and FIG. 1C is a perspective explanatory view of the electronic substrate in a state where an etching resist is filled in the etching pattern. FIG. 1D shows a cross-sectional view taken along the line II-II in FIG. 1C, and FIG. 1E shows an etching resist after removing the mask. FIG. 1 (f) shows a cross-sectional view taken along line III-III in FIG. 1 (e). FIG. 1 (f) shows a perspective view of the electronic substrate in a state where the conductor other than the portion filled with is dissolved by etching. The figure is shown, and in FIG. Patterns are perspective view of an electronic substrate which is formed shown, also in FIG. 1 (h) is a cross-sectional view is shown, according to line IV-IV in FIG. 1 (g).

  In the etching process in the electronic substrate 10 shown in FIG. 1, first, in the electronic substrate 10 in which the conductor 14 is provided on the upper surface 12 a of the insulating base material 12, the mask 16 in which the etching pattern created in the etching pattern creation device is formed. Is placed on the conductor 14 (see FIGS. 1A and 1B).

  Next, the etching resist 18 is filled in the etching pattern formed on the mask 16 (see FIGS. 1C and 1D), and the mask 16 is removed, so that the etching resist 18 is the same as the conductor pattern. An etching pattern formed in a shape is formed.

Thereafter, the electronic substrate 10 on which the etching pattern is formed on the conductor 14 is etched, that is, the conductor other than the portion on which the etching pattern is formed is dissolved by the etching solution (see FIGS. 1E and 1F). ), The desired resist pattern is formed on the insulating substrate 12 by removing the etching resist 18.

  However, in the etching process using the etching pattern as described above, there is a difference in the shape between the etching pattern formed on the conductor 14 of the electronic substrate 10 and the conductive pattern formed on the electronic substrate 10 by the etching process. It has been pointed out as a problem.

  That is, a so-called side etching occurs in which the etching solution penetrates from the side of the conductor portion sandwiched between the insulating base material 12 and the etching resist 18 and dissolves the conductor 14. The conductor pattern is formed thinner than the etching pattern (see FIG. 2).

  Furthermore, in recent years, as the functionality of electronic circuits and the miniaturization of products have progressed, patterns such as wiring and lands that form electronic substrates have been miniaturized, so conductor patterns formed on insulating substrates are assumed. It has been pointed out as a problem that the yield of manufactured electronic substrates is adversely affected, such as thinning and disconnection.

For this reason, a technique that can deal with these various problems at the design stage of the etching pattern, that is, an etching pattern applied to the miniaturized conductor pattern portion can be created in consideration of side etching. Technical proposals were strongly desired.

  Note that the prior art that the applicant of the present application knows at the time of filing a patent application is not an invention related to a known literature invention, and therefore there is no prior art document information to be described in the present specification.

  The present invention has been made in view of the above-described demands of the prior art, and an object of the present invention is to provide an etching pattern creation apparatus and an etching pattern creation device capable of creating an etching pattern in consideration of side etching. An object is to provide a pattern creation method, a program, and a computer-readable recording medium.

  An object of the present invention is to provide an etching pattern creating apparatus and an etching pattern that can create an etching pattern by performing predetermined correction according to the attribute of the conductor constituting the conductor pattern and the region where the conductor is located. An object is to provide a creation method, a program, and a computer-readable recording medium.

  In order to achieve the above object, the present invention forms an outline shape of a conductor pattern from electronic board data created by an electronic board design apparatus or the like, and the land, line, An etching pattern is created by increasing the outer shape of a conductor shape such as a surface by a correction value.

  For the correction of the conductor shape, create a calculation formula for the linear function from the relationship between the clearance value representing the shortest distance between the conductors and the correction value corresponding to the clearance value of the several points. If the conductor shape is corrected by using the correction, and the clearance cannot be secured by the correction, the linear spacing that corrects the conductor shape by a predetermined ratio to further secure the clearance and the set correction value are used uniformly. Correction method of either of two types of correction methods, equal spacing, which corrects the conductor shape and corrects the conductor shape by a ratio set according to the attribute of the conductor in order to ensure the clearance between the conductors It was made to correct by.

  In the following description, the clearance in the statement that the clearance is secured is synonymous with the minimum distance between the corrected conductors, that is, the minimum clearance.

Therefore, according to the present invention, it is possible to create an etching pattern in consideration of a manufacturing error by an etching process, and it is possible to create an etching pattern with a continuous shape.

That is, the etching pattern creating apparatus according to the present invention includes an outline shape creating unit that creates an outline shape that is an outer shape of the conductor pattern from design data including the conductor pattern, and an adjacent outline shape created by the outline shape creating unit. Setting two or more correction values according to the distance between them, and setting between two or more correction values that are set continuously by correcting adjacent correction values with straight lines or curves And an etching pattern creation means for creating an etching pattern by correcting the outline shape created by the outline shape creation means by the correction value set by the setting means.

The etching pattern creation apparatus according to the present invention further determines whether or not the distance between adjacent outline shapes after correction by the etching pattern creation means is shorter than a preset set distance in the above-described invention. The etching pattern creating means, when the determining means determines that the distance between the predetermined outline shape and the outline shape adjacent to the predetermined outline shape is shorter than the set distance. The predetermined outline shape is reduced beyond the outline shape before correction, or the predetermined outline shape and the adjacent outline shape are reduced beyond the outline shapes before correction, respectively . Is.

The etching pattern creation apparatus according to the present invention further determines whether or not the distance between adjacent outline shapes after correction by the etching pattern creation means is shorter than a preset set distance in the above-described invention. Determining means, and the setting means is preset when the distance between adjacent outline shapes corrected by the set correction value is determined to be shorter than the set distance by the determining means. Based on the reduction ratio, a predetermined reduction ratio is set based on the attribute combination and size of the outline shapes, and the etching pattern creating means has a distance between adjacent outline shapes that is shorter than the set distance by the determination means. Is determined based on a preset reduction ratio between adjacent outline shapes. Te, in which so as to reduce the outline shape adjacent without exceeding the outline shape before correcting.

Further, in the etching pattern creating apparatus according to the present invention, in the above-described invention, the setting means sets the priority order of the target area where the outline shape to be corrected is located based on the input priority order, and inputs the priority order. A correction rule is set for each target region based on the corrected correction rule, and the etching pattern creating means determines the priority of the outline shape to be corrected according to the arrangement position of the outline shape to be corrected. Is corrected based on a correction rule set in a target region having a high .

The etching pattern creation apparatus according to the present invention further includes a measurement point setting means for setting a plurality of measurement points on the outline shape for measuring the interval between adjacent outline shapes in the above-described invention. The setting means sets a correction value for the outline shape for each measurement point set by the measurement point setting means .

An etching pattern creation method according to the present invention is an etching pattern creation method for creating an etching pattern from design data including a conductor pattern by an etching pattern creation apparatus. An outline shape that is an outer shape of the conductor pattern is obtained from the design data. Two or more correction values are set in accordance with the distance between the outline shape creation step to be created and the adjacent outline shapes created in the outline shape creation step , and the two or more correction values set are adjacent to each other. Compensate the outline shape created in the outline shape creation process by the setting process to set the correction value that changes continuously by complementing the correction value with a straight line or curve, and the correction value set in the setting process Etching pattern to create etching pattern And emissions generation step is obtained as the etching pattern forming apparatus executes.

The etching pattern creation method according to the present invention further includes a determination step for determining whether a distance between adjacent outline shapes after correction in the etching pattern creation step is shorter than a preset set distance, and the etching When the pattern creation device executes and the etching pattern creation step determines that the distance between the predetermined outline shape and the outline shape adjacent to the predetermined outline shape is shorter than the set distance in the determination step The predetermined outline shape is reduced beyond the outline shape before correction, or the predetermined outline shape and the adjacent outline shape are reduced beyond the outline shapes before correction, respectively . Is.

In the etching pattern creation method according to the present invention, in the above-described invention, it is further determined whether or not a distance between adjacent outline shapes after correction in the etching pattern creation step is shorter than a preset set distance. When the etching pattern creating apparatus executes the determination step, and it is determined in the setting step that the distance between adjacent outline shapes corrected by the set correction value is shorter than the set distance in the determination step A predetermined reduction ratio is set based on a combination and size of attributes between the outline shapes from a preset reduction ratio, and the etching pattern creation step includes a distance between adjacent outline shapes in the determination step. When it is determined that is shorter than the set distance, a preset adjacent outline Based on the reduction ratio between Jo, in which so as to reduce the outline shape adjacent without exceeding the outline shape before correcting.

In the etching pattern creation method according to the present invention, in the above-described invention, in the setting step, the priority order of the target region where the outline shape to be corrected is positioned is set based on the input priority order, and the input is performed. A correction rule is set for each target region based on the corrected correction rule. In the etching pattern creation step, the outline shape to be corrected is assigned a priority according to the arrangement position of the outline shape to be corrected. Is corrected based on a correction rule set in a target region having a high .

In the etching pattern creation method according to the present invention, in the above-described invention, the etching point further includes a measurement point setting step for setting, on the outline shape, a plurality of measurement points for measuring an interval between adjacent outline shapes. The pattern creating apparatus executes, and in the setting step, a correction value for the outline shape is set for each measurement point set by the measurement point setting means .

  Further, the present invention is a program for causing a computer to function as the etching pattern creation apparatus described in the above-described invention.

  Moreover, this invention is a program for making a computer perform the etching pattern creation method as described in the above-mentioned invention.

  The present invention is also a computer-readable recording medium on which the program described in the above invention is recorded.

  Since the present invention is configured as described above, it has an excellent effect that an etching pattern can be created in consideration of side etching.

  In addition, the present invention has an excellent effect that an etching pattern can be created by performing a predetermined correction according to the attribute of the conductor constituting the conductor pattern and the region where the conductor is located.

FIG. 1A is a perspective explanatory view of an electronic substrate showing a state where a mask on which an etching pattern created by an etching pattern creation apparatus is formed is mounted, and FIG. 1B is a perspective view of FIG. ) Is a cross-sectional view taken along the line II of FIG. 1, and FIG. 1C is a perspective explanatory view of the electronic substrate showing a state in which the etching resist is filled in the etching pattern, and FIG. FIG. 1C is a cross-sectional view taken along the line II-II in FIG. 1C, and FIG. 1E is an electron showing a state in which the conductor other than the portion filled with the etching resist is dissolved by the etching process after the mask is removed. FIG. 1 (f) is a sectional view taken along line III-III in FIG. 1 (e), and FIG. 1 (g) is an electronic substrate on which a conductor pattern is formed. It is a perspective explanatory view, and FIG. It is a sectional view taken along line IV-IV (g). FIG. 2 is an end view of the electronic substrate in a side-etched state. FIG. 3 is a block diagram showing a hardware configuration of the etching pattern creating apparatus according to the present invention. FIG. 4 is a block configuration explanatory diagram showing a functional configuration of the etching pattern creating apparatus according to the present invention. FIG. 5 is a flowchart showing the processing routine of the etching pattern creation processing according to the present invention. FIG. 6A is an explanatory diagram showing a state in which the land is outlined, FIG. 6B is an explanatory diagram showing a state in which the line is outlined, and FIG. FIG. 6 is an explanatory diagram showing a state in which a surface having an outer peripheral width is outlined, and FIG. 6D is an explanatory diagram showing a state in which a surface displayed by a polygon is outlined. FIG. 7 is an explanatory diagram showing a state in which the entire conductor pattern is outlined. FIG. 8A is an explanatory diagram showing an outline shape of a bent line, and FIG. 8B is an explanatory diagram showing a state in which an outline is generated in a line segment connecting an end point and an intermediate point. 8C is an explanatory diagram showing a state in which an arcuate outline is generated from the end point in FIG. 8B, and FIG. 8D is a diagram showing FIG. 8C. It is explanatory drawing which shows the state which generated the outline in the line segment which connects the intermediate point which adjoins, and FIG.8 (e) is explanatory drawing which shows the state which connected outlines. FIG. 9 is an explanatory diagram showing a state in which an outline shape is created from electronic board data. FIG. 10 is a flowchart showing the processing routine of the setting process. FIG. 11 is an explanatory diagram showing display contents in the linear / equal correction setting window. FIG. 12 is a graph created by linearly complementing the relationship between the set clearance value and the correction value. FIG. 13A is an explanatory diagram showing a state in which a linear rule is set for each attribute conductor when the correction method is linear spacing in the normal rule, and FIG. 13B is a diagram in the normal rule. FIG. 10 is an explanatory diagram showing a state in which the size and linear rule are set for the conductor of each attribute when the correction method is a linear spacing festival. FIG. 14 is an explanatory diagram showing a state in which a correction value and a minimum clearance are set for conductors of each attribute when the correction method is equal spacing in the normal rule. FIG. 15A is an explanatory diagram showing a state in which a net subject to a net rule is selected by a net group, and FIG. 15B is an explanatory diagram showing a target region in the in-part rule. FIG. 15C is an explanatory diagram showing a target region in the rules-by area. FIG. 16 is an explanatory diagram showing the display contents of the detailed setting window. FIG. 17 is an explanatory diagram showing display contents in the option setting window. FIG. 18A is an explanatory diagram showing a conductor shape after correction created by applying a correction value for each correction point, and FIG. 18B is a correction created while maintaining the shape of the land. It is explanatory drawing which shows the back conductor shape. FIG. 19A is an explanatory diagram showing the outline shape of the conductor pattern before processing when considering the teardrop shape of the surface, and FIG. 19B is a diagram after the correction processing of FIG. 19A. FIG. 19C is an explanatory view showing a wire bond pad that has been corrected in advance, and FIG. 19D has been corrected in advance. It is explanatory drawing which shows the state which does not change the shape of a wire bond pad, and FIG.19 (e) is explanatory drawing which shows the state which changed the shape of the wire bond pad which correct | amended previously. FIG. 20A is an explanatory diagram showing in-plane lands and pads, and FIG. 20B is an explanatory diagram showing a state in which all the in-plane shapes are corrected. FIG. 20C is an explanatory diagram showing a state in which only the in-plane lands and pads are corrected with the input allowable values. FIG. 21A is an explanatory diagram illustrating a state where the meander pattern is corrected without performing correction by linear spacing, and FIG. 21B is a state where the meander pattern is corrected by linear spacing. FIG. 21C is an enlarged explanatory view of a part of FIG. 21B, and FIG. 21D is a clearance between the conductor shapes after correction. FIG. 21E is a diagram illustrating a state in which the conductor shape is reduced beyond the conductor shape before correction, and FIG. 21E permits cutting of the original shape or more when securing the clearance. It is explanatory drawing which shows an example at the time of setting. FIG. 22A is an explanatory diagram showing a state in which the clearance between the conductor shapes after correction is ensured without performing the minus correction of the surface, and FIG. It is explanatory drawing which shows the state which ensured the clearance between the conductor shapes after correction | amendment. FIG. 23A is an explanatory diagram showing the display content in the correction ratio setting window, and FIG. 23B is an explanatory diagram showing the display content of the correction ratio pre-down between land and land and between line and line. FIG. 23C is an explanatory diagram showing a method for setting a correction ratio between land-line, line-plane, and land-plane, and FIGS. 23D and 23E. (f), (g), and (h) are explanatory views showing conductor shapes that have been corrected by the settings in the correction ratio setting window. FIG. 24 is a flowchart showing the processing routine of the etching pattern creation process. FIG. 25A is an explanatory diagram showing a state in which measurement points are set on lands, and FIG. 25B is an explanatory diagram showing a state in which measurement points are set on lines, and FIG. (C) is explanatory drawing which shows the state which set the setting point to the surface. FIG. 26A is an explanatory diagram showing a direction for sequentially setting the setting points when setting the measurement points on the line, and FIG. 26B shows the measurement points set on the line. It is explanatory drawing which shows a state, and FIG.26 (c) is the expansion explanatory drawing which expanded a part of FIG.26 (c). Fig.27 (a) is explanatory drawing which shows the clearance of the measurement point provided in the conductor shape, and the measurement point adjacent to the said conductor shape, and FIG.27 (b) demonstrates how to take a clearance. FIG. 27C is an explanatory diagram for explaining from clearance measurement to creation of correction points. FIG. 28 is an explanatory diagram for explaining generation of a conductor shape after correction from the generated correction point. FIGS. 29A, 29B, and 29C are explanatory views showing the conductor shape after correction of the target conductor, and FIG. 31D shows FIGS. 29A, 29B, and 29C. It is explanatory drawing which shows the object area | region correction | amendment conductor pattern shape produced by combining these. FIG. 30A is an explanatory view showing a part of the conductor pattern, and FIG. 30B is a part of the corrected conductor pattern shape created by correcting the conductor in FIG. 30A. FIG. 30C is an explanatory diagram showing a portion that needs to be reduced in order to secure the clearance in FIG. 30B, and FIG. 30D is a diagram of FIG. 30C. It is explanatory drawing which expands a part and demonstrates reduction of a conductor shape. FIG. 31 (a) is an explanatory view showing the conductor shape after correction after securing the clearance, and FIG. 31 (b) is an enlarged explanatory view showing a part of FIG. 31 (a) enlarged. . FIG. 32A is an explanatory diagram showing a state in which the conductor shape after the correction between the land and the line is reduced by 50:50 in order to secure the clearance in the correction by equal spacing, and FIG. ) Is an enlarged explanatory view of a part of FIG. 32 (a), and FIG. 32 (c) is a diagram for ensuring clearance in the conductor shape after correction of land and line in correction by equal spacing. For this reason, FIG. 32D is a diagram illustrating a state in which the conductor shape after the correction of the land and the line is corrected in order to ensure the clearance in the correction by equal spacing. It is explanatory drawing which shows the state reduced by 30. FIG. FIG. 33A is an explanatory diagram showing a state in which the conductor shape after correction between lands is reduced at the same ratio in order to ensure clearance in the correction by equal spacing, and FIG. FIG. 33C is an explanatory diagram showing a state in which the conductor shape after correction between lands is reduced at a ratio corresponding to the land size in order to secure clearance in the correction by equal spacing, and FIG. 33C is an equal spacing. FIG. 33D is a diagram illustrating a state in which the conductor shape after the correction between the lines is reduced at the same ratio in order to secure the clearance, and FIG. 33D is a diagram illustrating the correction between the lines in the correction based on equal spacing. It is explanatory drawing which shows the state which reduced the conductor shape after correction | amendment by the ratio according to line size in order to ensure clearance. FIG. 34 is an explanatory diagram illustrating a state before and after securing the clearance between the conductor shapes after correction in correction in equal spacing. FIG. 35 is an explanatory diagram showing an input screen for inputting a clearance range, a correction value change rate, and a base correction value in a modification of the linear rule setting. FIG. 36A is an explanatory diagram in which the contents set in FIG. 35 are graphed, and FIG. 36B is a case where there is an overlap or missing clearance range in the contents set in FIG. It is explanatory drawing which shows the error display made. FIG. 37 is an explanatory diagram showing a correction method for a mesh extraction shape. FIG. 38 is an explanatory diagram showing an example of correcting lines over different areas. FIGS. 39A and 39B are explanatory diagrams showing correction examples of lands over different areas. 40 (a) and 40 (b) are explanatory diagrams showing correction examples of surfaces over different areas. FIG. 41 is a graph showing the relationship between the set clearance value and the correction value as a curve. FIG. 42A is an explanatory view showing a state in which a line-shaped etching pattern reduced in a predetermined shape at the bent portion is applied on the electronic substrate, and FIG. 42B is a diagram showing FIG. FIG. 42 (c) is an explanatory view showing a conductor pattern after etching the electronic substrate shown in FIG. 42, and FIG. 42 (c) applies a line-shaped etching pattern that is not reduced in a predetermined shape on the electronic substrate on the electronic substrate. FIG. 42D is an explanatory view showing the conductor pattern after the electronic substrate shown in FIG. 42C is etched. FIG. 43 (a) is an explanatory view showing a state in which a surface-shaped etching pattern in which a predetermined shape is added at the corner is applied on the electronic substrate, and FIG. 43 (b) is a diagram of FIG. 43 (a). It is explanatory drawing which shows the conductor pattern after carrying out the etching process of the electronic substrate shown in FIG. 43, and FIG.43 (c) is the state which apply | coated the surface-shaped etching pattern which does not add a predetermined shape in a corner | angular part on the electronic substrate FIG. 43D is an explanatory diagram showing a conductor pattern after the electronic substrate shown in FIG. 43C is etched. FIG. 44 is an explanatory diagram for explaining the setting of a predetermined shape to be deleted inside at a bent portion and a predetermined shape to be added outside at a corner portion. FIG. 45A is an explanatory diagram showing the shortest distance of the measurement point in the conductor to be corrected, and FIG. 45B shows the clearance value corresponding to the measurement point in FIG. FIG. 45C is a chart showing a correction value calculated from the clearance value, and FIG. 45C is an explanatory diagram showing a conductor shape after correction created by using the correction value described in FIG. 45B. FIG. 46A is an explanatory diagram showing a state in which a correction point is created on the clearance, and FIG. 46B is a diagram in which the measurement point is moved in the direction perpendicular to the side where the measurement point is provided. It is explanatory drawing which shows the state which created the correction point.

Hereinafter, an example of an embodiment of an etching pattern creation device, an etching pattern creation method, a program, and a computer-readable recording medium according to the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 3 is a block diagram showing the hardware configuration of the etching pattern creating apparatus according to the present invention.

  That is, the etching pattern creating apparatus 50 according to the present invention is realized by a known personal computer or general-purpose computer, and is configured to control its operation using a central processing unit (CPU) 32.

The CPU 32 includes a read-only memory (ROM) for storing a program for controlling the CPU 32 and various data via the bus 34, a storage area used as a working area for the CPU 32, and the like. A storage device 36 including a random access memory (RAM), a display device 38 having a screen such as a CRT or a liquid crystal panel for performing various displays based on the control of the CPU 32, and a display screen of the display device 38 A pointing device 40 such as a mouse as an input device for designating an arbitrary position, a character input device 42 such as a keyboard as an input device for inputting an arbitrary character, and an input / output interface circuit for various devices connected to the outside ( I / O) 44 is connected.

  In the etching pattern creating apparatus 50, an external storage device 46 such as a hard disk is connected via an I / O 44, and a computer-readable medium such as a compact disk (CD) or a digital versatile disk (DVD) can be used. Various data generated based on the control of the CPU is written and stored in an appropriate recording medium (hereinafter simply referred to as “recording medium”) 30, or the various data stored in the recording medium 30 is stored in the recording device 36. A read / write device 48 for reading is connected via the I / O 44.

Here, a program for executing an etching pattern creation process by the etching pattern creation apparatus 50 described later and various data used for the creation process are stored in advance in a read-only memory or a random access memory of the storage device 36. Alternatively, the random access memory of the storage device 36 may be read from the external storage device 46 or the recording medium 30.

  Further, by providing a communication function in the etching pattern creating apparatus 50, a program for executing an etching pattern creating process by the etching pattern designing apparatus 50 to be described later and various data used for the creating process are transmitted from the outside by communication. You may make it read into the random access memory of the memory | storage device 36 of the design apparatus 30. FIG.

In the following description, in order to facilitate the understanding of the etching pattern creation device 50, a program for executing the etching pattern creation processing by the etching pattern creation device 50 in the storage device 36 and various types used for the creation processing. Assume that data is stored in advance.

  Next, the etching pattern creation apparatus 50 according to the present invention will be described in detail with reference to FIG. FIG. 4 is a block configuration explanatory diagram showing a functional configuration of the etching pattern creating apparatus according to the present invention.

  The etching pattern creation device 50 includes an electronic substrate data reading unit 52 that reads electronic substrate data that is design data of an electronic substrate created by an electronic substrate design device such as CAD or CAM, and an electronic substrate data reading unit 52. An outline shape creation unit 54 that outlines a conductor pattern from the read electronic board data to create an outline shape of the conductor pattern, and lands, lines, and lines that form the conductor pattern that forms the outline shape created in the outline shape creation unit 54 A setting unit 56 that performs various settings for correcting the conductor shape for a conductor having a surface attribute, and the conductor shape is corrected based on the setting content set in the setting unit 56, and the target In the region where the conductor shape of all conductors is corrected Create a corrected conductor pattern shape for each target area, create a corrected conductor pattern shape for the entire electronic board, and create a clearance between conductors in the created corrected conductor pattern shape. And an etching pattern creation processing unit 58 for creating an etching pattern while securing the above.

Here, the conductor, the conductor shape, the target region corrected conductor pattern shape, and the corrected conductor pattern shape will be described. The conductor is a component of a conductor pattern having attributes such as a land, a line, or a surface constituting the conductor pattern. Yes, the conductor shape is the outline shape that is the outer shape of the conductor that is a component of the conductor pattern, and the target area correction conductor pattern shape is the set target area (the normal rule, net This is a region set in the four correction rules of the rule, the in-part rule, and the rules-by area.) The conductor shape of all conductors is corrected (clearance has not been secured yet). The shape of the conductor pattern is the corrected conductor pattern shape created in each target area. A a composite of the elephant area correction conductor pattern, is that the shape of the conductive pattern in which all of the conductor pattern shape on the electronic board is corrected (still ensuring clearance is not performed).

More specifically, the setting unit 56 is used at the time of correction by linear spacing and is the shortest between a predetermined conductor and an adjacent conductor in a conductor pattern composed of conductors having line, land, and surface attributes. A linear rule setting unit 62 for setting a linear rule related to a clearance value as a distance and a correction value, and a detailed rule for correcting a conductor shape in a conductor pattern for the entire electronic substrate (hereinafter referred to as “conductor shape”). "Detailed rule for correcting" is simply referred to as "correction rule" as appropriate.) Among the conductor shapes of the conductor pattern, a net indicating a correction rule for a specified net Among the conductor shapes of the rule and conductor pattern, the in-part rule indicating the correction rule for the specified part and the conductor of the conductor pattern Correction content setting unit for setting the correction method and the correction content in the target area in the correction rules in the four areas of the rules-by-area indicating the correction rule for the specified area. 64 and a correction rule priority order that sets a priority order of which correction rule is given priority among the correction rules in the four areas of the normal rule, net rule, in-part rule, and rules-by-area. At the time of correction by the setting unit 66 and linear spacing, a conductor whose conductor shape has been corrected in the etching pattern creation processing unit 58 and a conductor adjacent to the conductor whose conductor shape has been corrected (the conductor shape of this adjacent conductor is also corrected) Between the conductor shapes (that is, correction) In order to ensure the clearance of the later conductor shape), the specified attribute (for example, the surface) is corrected by reducing it beyond the conductor shape before the correction (hereinafter, referred to as “surface”). A negative correction permission setting unit 68 for setting whether or not to permit “to perform correction by reducing beyond the shape of the conductor before correction” will be referred to as “minus correction”. At the time of correction by pacing, the clearance between the corrected conductor obtained by correcting the conductor shape in the etching pattern creation processing unit 58 and the conductor adjacent to the corrected conductor (the conductor shape of the adjacent conductor is also corrected). Is provided with a ratio correction setting unit 70 that sets a reduction ratio for reducing each conductor shape (that is, the conductor shape after correction) by a predetermined ratio.

  In the etching pattern creation processing unit 58, a plurality of measurement points are created and created at the time of correction by linear spacing while giving priority to the correction rule in the high priority region set by the correction rule priority setting unit 66. For each measurement point, a correction equation set by the correction content setting unit 64 and a linear expression set by the linear rule set by the linear rule setting unit 62 are used to create a calculation formula using a linear function where the distance between conductors is X and the correction value is Y. , Calculate the correction value by substituting the measured value of the shortest distance between the conductors into the calculation formula, and correct the conductor shape of the target conductor based on the calculated correction value. To reduce the weight of the data by deleting the component points (corresponding to correction points described later) and arcing the fine line, etc. Then, a target region corrected conductor pattern shape is created in a state where all the conductor shapes are corrected, and at the time of correction by equal spacing, all conductors in the target region are based on the correction rule set by the correction content setting unit 64. A target region corrected conductor pattern shape in a state where the conductor shape is corrected is created.

Further, the etching pattern creation processing unit 58 creates a corrected conductor pattern shape by synthesizing the target region corrected conductor pattern shape in each target region, and when correcting by linear spacing, It is determined whether the clearance is secured, and if it is determined that the clearance between the conductors is not secured, the conductor shape of the target conductor is reduced at a predetermined ratio (for example, 50:50). If necessary, negative correction of the conductor shape is performed based on whether or not the negative correction permission set in the negative correction permission setting unit 68 is permitted, and the corrected conductor pattern shape in which the clearance between the conductors is secured is etched. An etching pattern is created as a pattern. On the other hand, at the time of correction by equal spacing, it is determined whether or not the clearance between conductors is secured in the created corrected conductor pattern shape, and if it is determined that the clearance between conductors is not secured, ratio correction Based on the reduction ratio set in the setting unit 70, the conductor shape of the target conductor is reduced, and an etching pattern is created using the corrected conductor pattern shape with the clearance between the conductors as an etching pattern. Then, the etching pattern thus created is written in the electronic substrate data.

  In the above configuration, the contents of the etching pattern creation process created by the etching pattern creation apparatus 50 according to the present invention will be described with reference to the flowchart shown in FIG.

This etching pattern creation apparatus 50 is connected to a conventionally known electronic substrate design apparatus (not shown), and etching described below using design data created by this electronic substrate design apparatus. Pattern creation work processing is performed.

  FIG. 5 shows a flowchart of the processing routine of the etching pattern creation work process.

  First, when the etching pattern creation device 50 is activated, the etching pattern creation work process shown in FIG. 5 is activated, and the electronic substrate data reading unit 52 uses the electronic substrate design data stored in the storage device 36 in advance. The substrate data is read (step S502).

  When the reading of the electronic board data is completed, the outline shape creating unit 54 next creates an outline of the conductor pattern based on the read electronic board data, and creates an outline shape of the conductor pattern (step S504).

  Specifically, a conductor pattern to be processed is acquired from a specified layer, and data of three attributes indicating shapes such as lands, lines, and surfaces that form the conductor pattern is outlined (FIG. 6 ( a) (b) (c) and (d) are referred to), and the entire conductor pattern is outlined (see FIG. 7). At this time, it is possible to generate an outline which is the outer shape of the conductor pattern with high accuracy by executing the coordinate value calculation with a double precision real number.

  As for the outline shapes of the end points and the intermediate points in the line, an arc shape having the same diameter as the pen width is generated as an outline (see FIG. 8A).

  That is, as an arc generation method for an end point in a line, first, a line segment that is offset by “pen width / 2.0” is generated with respect to a line segment connecting an end point and an adjacent intermediate point, and the outer circumference of the line Generate a line segment. (See FIG. 8B).

  Next, the line segment on the end point side is connected by an arc (semicircle) having a diameter of “pen width / 2.0”, thereby generating an arc-shaped outline at the end point portion (see FIG. 8C). .)

  In addition, as a method for generating an arc at the midpoint of a line, first, a line segment offset by “pen width / 2.0” is generated with respect to the line segment connecting the midpoints to generate an outer line segment of the line. (Refer to FIG. 8D).

Then, if the angle formed by the outer peripheral segment of less than greater 180 degrees than 0 degrees, the intersections of the outer peripheral line and profile configuration point of outline, in the case of the other angle, "pen width /2.0 "diameter arc connection (see FIG. 8 (e)).

  In addition, in the electronic board data, there are cases where the paint data (LPD data) and the removal data (LPD data) are mixed, and in such electronic board data, the paint data / the removal data are read separately, and FIG. As shown in FIG. 9, first, the composite data 1 is created by synthesizing the extracted data 1 with the paint data 1, and the paint data 2 is synthesized with the created composite shape 1 to create the composite shape 2. Then, the extracted data 2 is synthesized with the created synthesized shape 2 to create a synthesized shape 3, and the created synthesized shape 3 is outlined.

Next, in order to create an etching pattern, various settings required when performing correction processes such as correction methods and correction rules for correcting the conductor shape of the conductors that make up the created conductor pattern A setting process is performed (step S506).

  Here, the flowchart of FIG. 10 shows the detailed contents of the setting process in the process of step S506. In this setting process, first, the operator operates the pointing device 40 to set each conductor. A linear equal correction setting window 1201 (see FIG. 11) for setting a correction method and correction rule for correcting the conductor shape is opened, and an etching pattern is created from the outline shape of the conductor pattern. A rule is set to correct the outline shape of the conductor pattern necessary at the time.

  The linear equal correction in the linear equal correction setting window is linear correction and equal correction. The linear correction is correction by linear spacing. The equal correction is equal to the equal correction. It is correction by spacing.

  As a rule setting for correcting the outline shape of the conductor pattern necessary for creating the etching pattern from the outline shape of the conductor pattern, first, the operator uses the correction rule priority setting unit 66 to set a normal rule, a net rule, and a component. A priority order is set for which of the correction rules in the four areas of the inner rule and the rules-by area is to be executed preferentially (step S1002).

  That is, in the process of step S1002, the entire electronic board corresponding to the normal rule, the specified net corresponding to the net rule, the specified part corresponding to the in-part rule, the specified area corresponding to the rules-by area By setting the priority order for the four areas, the priority order for which correction rule targeted for the area among the correction rules in the four areas is to be executed with priority is set.

  In the process of step S1002, if the correction rule priority setting unit 66 sets the priority to be lower in the order of rules-by-area, in-part rule, net rule, and normal rule, for example, the highest priority is set. The correction rule for the target area set in the ranking will be applied preferentially, and the correction rule for the rules by area will be applied preferentially in the area where the in-part rule and the rules by area overlap. It will be.

  Next, the operator sets the details of the correction rule in each target area, that is, the correction means and the content of correction in the correction content setting unit 64 (step S1004).

In the processing of step S1004 , a case where the correction means and the content of correction in the normal rule are set will be described as an example.

  First, a correction method in the normal rule is selected from “linear spacing” or “equal spacing” by a correction method selection pull-down 1208.

  When “linear spacing” is selected as the correction method, the grayed out linear rule setting button 1210 is canceled and the linear rule setting button 1210 can be clicked, and the attribute names of land, line, and surface A noun input field 1212a for inputting the size, a size setting field 1212b for setting a size to be corrected among the attribute conductors input to the noun input field 1212a, and a linear rule for the target attribute conductor. A linear rule setting field 1212c to be set is displayed.

  Then, first, the linear rule setting button 1210 is clicked to display a linear rule setting window.

In setting the linear rule, in order to set the linear rule in the linear rule setting unit 62, a predetermined conductor shape of a conductor pattern constituted by conductors represented by three attributes of land, line, and surface sets the number points the clearance value between the conductor shape adjacent to the predetermined conductor shape, and a correction value corresponding to the clearance value of the number of points.

  That is, the relationship between the clearance value between the conductor shapes and the correction value corresponding to the clearance value is set for each conductor of land, line, and surface.

  For example, for a line, when the clearance value between the line and the conductor adjacent to the line is 20, the correction value is 4, when the clearance value is 50, the correction value is 7, and when the clearance value is 100, the correction value is When set to 9.5, a graph is created by linearly complementing each set point as shown in FIG. 12, and the relationship between the clearance value and the correction value shown in such a graph is set to WIRE_Rule1.

  Note that when the clearance value exceeds a certain value, the correction value is set to be constant. In the above case, the correction value is set to be constant when the clearance value is 100 or more.

  For the line, in addition to the relationship set as WIRE_Rule1, two types of relationship between the clearance value and the correction value are set, and three types of linear rules of WIRE_Rule1, WIRE_Rule2, and WIRE_Rule3 are set in total.

  The same operation is performed on the land and the surface, and three types of linear rules LAND_Rule1, LAND_Rule2, and LAND_Rule3 are created for the land, and three types of linear rules FACE_Rule1, FACE_Rule2, and FACE_Rule3 are created for the surface.

  Thereafter, in order to set the correction content in the correction content setting unit 64, the land, line, and face attribute names are input to the noun input field 1212a, and the linear rule set for each attribute is input.

  That is, when “line” is input in the noun input field 1212a-1, one of the linear rules of “WIRE_Rule1,” “WIRE_Rule2,” and “WIRE_Rule3” is set in the linear rule setting field 1212c-1. When “Land” is input in the noun input field 1212a-2, any one of “LAND_Rule1,” “LAND_Rule2,” “LAND_Rule3” is set in the linear rule setting field 1212c-2, and the noun input field 1212a− When “surface” is input to 3, any one of “FACE_Rule1,” “FACE_Rule2,” and “FACE_Rule3” is set in the linear rule setting field 1212c-3 (see FIG. 13A). .

  Further, when different linear rules are assigned to conductors having the same attribute for each size, the same attribute name is input in the noun input field 1212a, the size is set in the size setting field 1212b, and the linear rule is set in the linear rule setting field 1212c. To set.

  For example, “Land” is input in the noun input field 1212a-1, “<: 0.0005” is set in the size setting field 1212b-1, and “LAND_Rule1” is set in the linear rule setting field 1212c-1 as the linear rule at this time. ”, The noun input field 1212a-2“ land ”is input, and“ 0.0005: <=: <: 0.01 ”is set in the size setting field 1212b-2, and the linear rule at this time is linear “LAND_Rule2” is set in the rule setting field 1212c-2, “Land” is input in the noun input field 1212a-3, and “0.01: <=” is set in the size setting field 1212b-3. By setting “LAND_Rule3” in the linear rule setting field 1212c-3 as a linear rule, a land of less than 0.5 μm is obtained in the land. Is corrected by the linear rule “LAND_Rule1”, the land of 0.5 to 10 μm is corrected by the linear rule “LAND_Rule2”, and the land of 10 μm or more is corrected by the linear rule “LAND_Rule3” (FIG. 13). (See (b)).

  At this time, the land size is the length of the land diameter, the line size is the line width length, and the surface size is the surface area.

  On the other hand, when “equal spacing” is selected as the correction method in the normal rule in the process of step S1004, the noun input field 1602a for inputting the attribute names of lands, lines, and faces, and the attribute conductors input to the noun input field 1602a Among them, a size setting field 1602b for setting a size to be corrected, a clearance setting field 1602c for setting a clearance before correction between an attribute conductor input in the noun input field 1602a and an adjacent conductor, and an input in the noun input field 1602a The minimum clearance for setting the clearance value that must be secured with the adjacent conductor after the correction processing in the correction value setting field 1602d and the noun input field 1602a for setting the correction value for correcting the conductor having the specified attribute A setting field 1602e is displayed (see FIG. 14). .).

  Then, first, in order to set the correction content in the correction content setting unit 64, the attribute names of land, line, and face are input in the noun input field 1602a, and the attribute conductor input in the correction value setting field 1602d is input. A correction value to be corrected is input, and a clearance value that must be secured after correction processing is set for the conductor having the attribute input in the minimum clearance setting field 1602e.

  That is, as shown in FIG. 14, in the normal rule, when “Land” is input to the noun input field 1602a, “0.00500” is set as the correction value, and “0.03000” is set as the minimum clearance, For the entire substrate, the land is uniformly corrected with a correction value of 0.005, that is, the land outline is uniformly thickened by 5 μm, and the clearance between the corrected land and the corrected conductor adjacent to the corrected land is 30 μm. If it cannot be secured, correction is made so as to secure 30 μm.

  Further, as shown in FIG. 14, in the normal rule, when “line” is input in the noun input field 1602a, “0.01000” is set as the correction value, and “0.04000” is set as the minimum clearance, For the entire board, the line is uniformly corrected with a correction value of 0.01, that is, the line outline is uniformly increased by 10 μm, and the clearance between the corrected line and the corrected conductor adjacent to the corrected line is 40 μm. If it cannot be secured, correction is made so as to secure 40 μm.

  Furthermore, as shown in FIG. 14, in the normal rule, when “surface” is input in the noun input field 1602a, “0.00300” is set as the correction value, and “0.05000” is set as the minimum clearance, For the entire board, the surface is uniformly corrected with a correction value of 0.003, that is, the surface outline is uniformly increased by 3 μm, and the clearance between the corrected surface and the corrected conductor adjacent to the corrected surface is 50 μm. If it cannot be secured, correction is made so as to secure 50 μm.

  As for the size setting field 1602b, in the same way as when linear spacing is selected in the correction method described above, by setting a predetermined size in the size setting field 1602b, one attribute is corrected by the size. This can be corrected by changing.

  Further, regarding the clearance setting field 1602c, the clearance setting field 1602c is set such that, for example, the clearance before correction between the attribute conductor input in the noun input field 1212a and the adjacent conductor is 0.01 or more and less than 0.1. When set, only conductors having attributes having a clearance in this range are corrected by the correction value set in the correction value setting field 1602d. For this reason, it becomes possible to correct one attribute by changing the correction value by changing the range of the clearance before correction between the conductor of the attribute input to the noun input field 1212a and the adjacent conductor.

  In the above-described processing of step S1004, the case where the correction means and the content of the correction in the normal rule are set has been described. However, the setting of the correction means and the correction content in the in-part rule and the rules-by area are subject to This is different from the normal rule only in that the area is set.

  In other words, in the case of the normal rule, since the entire electronic board is the target, it is not necessary to specify in particular. However, in the net rule, the in-part rule, and the rules-by area, it is necessary to set the target areas respectively. .

  In the case of a net rule, when the net rule tab is clicked, the gray-out net group setting button 1214 is canceled and the net group setting button 1214 can be clicked.

  When the net group setting button 1214 is clicked, a net group setting window 4102 is opened. By selecting a net group displayed in the net group setting window 4102, the selected net group name is displayed in the net group selection box 4104. Then, it becomes possible to set the contents of correction in the net group (see FIG. 15A).

  In addition, a target net can be selected by the pointing device 40.

  For the selected net group, the correction contents are set in the same manner as the correction contents in the normal rule.

  In addition, in the case of an in-part rule, by specifying the attribute of the part, the area is set as the target of the in-part rule, and the area where the part with the specified attribute is mounted becomes the target area (see FIG. (See 15 (b)).

  The content of correction is set in the same manner as when the content of correction in the normal rule is set for the area subject to the in-part rule selected in this way.

  Further, in the case of the rules-by area, the target area is selected by surrounding the area designated by the pointing device 40. For example, as shown in FIG. Can be designated as different target areas (in FIG. 15C, the digital part is indicated as target area 1 and the analog part is indicated as target area 2).

  The content of correction is set in the same manner as when the content of correction in the normal rule is set for the area subject to the in-part rule selected in this way.

  Next, in the processing of step S1004, when the setting of the correction means and the content of correction is completed, it is set whether to secure or check the clearance (step S1006).

  In the process of step S1006, the check box 1220 is checked to make a setting for ensuring or checking the clearance between the conductors after correction.

  When the check box 1220 is checked, the grayed out detailed setting button 1218 is canceled and the detailed setting button 1218 can be clicked. When the detailed setting button 1218 is clicked, a detailed setting window 4802 is displayed (FIG. 16).

  In the clearance value group box 4806 for linear spacing, the clearance value to be secured with the adjacent conductor for the land is set in the setting box 4806a, and the clearance value to be secured with the adjacent conductor for the line is set in the setting box 4806b. In the setting box 4806c, a clearance value to be secured with a conductor adjacent to the surface is set.

  In the clearance values set for the land, line, and surface here, for example, in the case of a land, the land and the surrounding conductor shape after correction are the minimum clearance values that should be ensured.

  Here, for example, when the minimum clearance value set for the land is “0.045” and the minimum clearance value set for the line is “0.05”, the clearance between the land and the line is actually When it is “0.045”, it is determined that the clearance is secured at the time of the land clearance securing process, and the clearance is not secured at the time of the line clearance securing process. Thus, the correction for ensuring the clearance is performed at this time.

  Further, in the execution mode group box 4804, when the option button 4804a is selected, the “check clearance” process is set, and when the option button 4804b is selected, the “secure and correct the clearance” process is set. It becomes.

  The “check clearance” process is a process for detecting, as an error, a portion where the corrected conductor shape is less than a set clearance value.

  In addition, the process of “correcting by securing the clearance” is to change the conductor shape after correction so as to secure a clearance value for a portion where the conductor shape after correction is less than the set clearance value. In this process, the clearance between the corrected conductor shapes is checked, and a portion that is less than the set clearance value is detected as an error.

  When the conductor shape after correction is changed so as to secure the clearance value, for example, the same amount of the conductor shape after correction is used in order to ensure the clearance between the conductor shapes after correction at 50:50. Reduce it step by step.

  Next, a process for setting a clearance measurement pitch is performed (step S1008), and when a corrected clearance between conductors is secured or checked, a clearance measurement pitch that is an interval for measuring a clearance between conductors is set.

  That is, when the check box 1222 is checked, a numerical value can be input to the setting box 1222a, and the operator inputs a clearance measurement pitch that is an interval for measuring the clearance between conductors. For example, the setting box When “0.01” of 1222a is input, the clearance between conductors is measured at intervals of 10 μm.

  Thereafter, when the clearance measurement pitch setting is completed in the processing of step S1008, an option setting button 1216 is clicked to open an option setting window (see FIG. 17). Settings for the items are made (step S1010).

  In the processing of step S1010, the correction content displayed in the “common” item in the option settings displayed in the option setting window is set.

  Here, in the option setting window 1702, three items are provided, and the “common” item 1704, which is a correction content commonly applied to linear spacing and equal spacing, and linear spacing only. A “linear spacing” item 1706, which is the content of correction to be applied, and an “equal spacing” item 1708, which is the content of correction applied only to equal spacing, are provided.

  In the process of step S1010, the correction content displayed in the “common” item 1704 is set. Hereinafter, the contents of correction set in the “common” item 1704 will be described.

  In the “shared” item 1704, a check box 1704c for setting whether or not to retain a land shape, a check box 1704f for setting whether or not to consider surface teardrop, and a wire bond pad shape are changed. A check box 1704g for setting whether or not to perform correction and a check box 1704i for setting whether or not only the land / pad is corrected for the in-plane shape are provided.

  First, as to whether or not to retain the land shape, whether or not to retain the land shape (circular shape) in the corrected shape in the conductor shape correction processing by the etching pattern creation processing unit 58 is set. Is.

In other words, when the check box 1704c is not checked, the land shape is not retained by the corrected conductor shape, and the clearance between adjacent conductors is measured for each measurement at the measurement point, and the correction value is obtained for each measurement point. When the check box 1704c is checked, the land shape is maintained in the corrected conductor shape after securing the clearance, and a correction value that can be corrected at the maximum is applied. The shape is corrected (see FIGS. 18A and 18B).

  In addition, regarding the setting of whether or not to consider the tear drop of the surface, when the tear drop shape attached to the land is created by the surface data in the conductor shape correction processing by the etching pattern creation processing unit 58, Whether or not to apply the correction rule in the line to the data of the surface is set.

  That is, when the check box 1704f is not checked, the correction rule for the surface is applied to the teardrop shape created by the surface data, and when the check box 1704f is checked. Then, the correction rule in the line is applied to the teardrop shape created from the plane data (see FIGS. 19A and 19B).

  In addition, regarding whether to change the shape of the wire bond pad, after performing the wire bond pad correction in advance, if the target conductor is corrected, ensuring the clearance between the corrected conductors In doing so, it is set whether or not the wire bond pad shape is to be deformed.

  In other words, if the check box 1704g is not checked, the wire bond pad shape after correction will not be deformed when the clearance between the corrected conductor shapes is secured, and the check box 1704g is checked. In this case, when the clearance between the corrected conductor shapes is secured, the corrected wire bond pad shape is deformed (see FIGS. 19C, 19D, and 19E).

  In addition, regarding the setting of whether or not only the land / pad is corrected for the in-plane shape, whether or not only the land and the pad included in the surface are corrected is set as a correction process for the in-plane. .

  In other words, if the check box 1704i is not checked, all the shapes in the plane are corrected. If the check box 1704i is checked, an allowable value is input to the text box 1704i-1. Thus, an allowable value can be set, and the in-plane shape is corrected only for the land / pad based on the allowable value (see FIGS. 20A, 20B, and 20C).

Specifically, when the check box 1704i is checked, correction is performed only for lands / pads whose amount of protrusion from the surface shape is within the set allowable value range, that is, less than or equal to the set allowable value. Will be performed.

Various option settings in the “common” item 1704 are set in the correction content setting unit 64, and the set content is corrected in the etching pattern creation processing unit 58.

  Next, settings in the “linear spacing” item are performed as various option settings (step S1012).

  In the process of step S1012, the correction content displayed in the “linear spacing” item 1706 displayed in the option setting window 1702 is set. Hereinafter, the contents of correction set in the “linear spacing” item 1706 will be described.

  In the “linear spacing” item 1706, a check box 1706a for setting whether or not the line / surface itself is to be subjected to clearance measurement, and whether or not cutting of the original shape or more is permitted when the clearance is secured. A check box 1706b for setting whether or not, and a check box 1706d for setting whether or not to perform negative correction of the surface are provided.

  First, regarding the setting as to whether or not the line / surface itself is the target of clearance measurement, in the conductor shape correction processing by the etching pattern creation processing unit 58, a series of conductor shapes having the same potential such as a meander pattern are processed. It sets whether to measure clearance in the data.

  In other words, when the check box 1706a is not checked, correction is performed based on the correction content set for the line without measuring the clearance between the meander patterns for the conductor shape having the same potential such as the meander pattern. (That is, correction by linear spacing is not performed between meander patterns), and when the check box 1706b is checked, the same potential conductor shape such as the meander pattern has the same potential. A clearance is measured between the meander patterns to calculate a correction value, and the conductor shape is corrected based on the calculated correction value (that is, the conductor shape is also corrected between the meander patterns by correction by linear spacing). ) (Refer to FIGS. 21A, 21B and 21C.)

  Also, regarding the setting of whether or not to cut more than the original shape when securing the clearance, after securing the conductor shape, when securing the clearance between the conductor shape and the adjacent conductor shape, the original shape That is, it is set whether or not the conductor shape before the correction can be reduced.

  In other words, when the check box 1706b is not checked, when the clearance between the conductor shape and the adjacent conductor shape is ensured after the conductor shape is corrected, the cutting beyond the original shape is not permitted. The clearance is not secured, but the clearance is secured by reducing the conductor shape and the adjacent conductor shape at a predetermined ratio (for example, 50:50) within a range where the original shape is not reduced. is there.

  On the other hand, when the check box 1706b is checked, the check box 1706b-1 for selecting a land, the check box 1706b-2 for selecting a line, and the check box 1706b-3 for selecting a face can be checked. Select at least one line or face. Then, after the conductor shape is corrected, in order to secure a clearance between the conductor shape and the adjacent conductor shape, the conductor shape and the adjacent conductor shape are reduced at a predetermined ratio (for example, 50:50). At this time, the original shape of each conductor is reduced, that is, the reduction beyond the conductor shape before correction is performed to secure the clearance (FIGS. 21D and 21E). refer.).

  In addition, the setting of whether or not to perform the minus correction of the surface is specified when the clearance is ensured while the corrected shape of the land and line is maintained. That is, the land or line adjacent to the surface is set so as to retain the conductor shape after correcting the land or line, that is, the surface: land, line is reduced at a ratio of 100: 0.

  Specifically, when the check box 1706d is not checked, each conductor is set to a predetermined ratio (when a clearance value between the conductor shape and the adjacent conductor shape is secured after the conductor shape is corrected). For example, when the check box 1706d is checked, when the clearance shape between the conductor shape and the adjacent conductor shape is secured after the check box 1706d is checked, Only the surface is reduced (see FIGS. 22A and 22B).

  At that time, when the clearance is ensured even if the conductor shape before the surface correction is cut, the check box 1706b-3 is checked.

  In other words, if the clearance cannot be secured only by the minus correction of the surface, the clearance is secured in combination with the above-described setting whether to cut the original shape or more when securing the clearance. .

It should be noted that the setting of whether or not to negatively correct the surface is only applicable when the clearance between the land and the surface and between the line and the surface is ensured, and between the land and the land and between the line and the line. When securing the clearance between the land and the line, whether or not to reduce more than the conductor shape before correction has nothing to do with the setting of whether or not negative correction of the surface is performed.

Of the various option settings in the “linear spacing” item 1706, the setting as to whether or not the line / surface itself is the target of clearance design is set in the correction content setting unit 64, and the clearance The setting of whether or not to allow cutting of the original shape or more and the setting of whether or not to negatively correct the surface when securing the image is set in the negative correction permission setting unit 68. The contents are corrected by the etching pattern creation processing unit 58.

  Next, settings in the “equal spacing” item are performed as various option settings (step S1014).

  In the process of step S1014, the correction content displayed in the “equal spacing” item 1708 displayed in the option setting window 1702 is set. Hereinafter, the contents of correction set for the “equal spacing” item 1708 will be described.

  In this “equal spacing” item 1708, only a correction ratio setting button 1708a is provided.

  This correction ratio setting reduces each conductor shape when securing clearance in equal spacing correction, that is, when securing the clearance between the conductor shape and the adjacent conductor shape after correcting the conductor shape. Set the correction ratio, which is the ratio to be corrected, to the same ratio regardless of the conductor shape size and conductor attributes, or to change the correction ratio according to the conductor shape size ratio, or according to the combination of conductor attributes The correction ratio is set.

  The size of the conductor shape is the length of the land diameter when the conductor is a land, and the length of the line width when the conductor is a line.

  First, when the correction ratio setting button 1708a is clicked, a correction ratio setting window 2402 is displayed (see FIG. 23A).

  In the displayed correction ratio setting window 2402, a land-land correction ratio selection pull-down 2404a for setting a correction ratio between land and land (in FIG. 23A, indicated by land: land) is used to select a land-land. "Correction with the same ratio" to reduce the correction ratio between lands by the same ratio regardless of the size between lands or "Correction with the ratio of size" to correct the correction ratio between lands and land with the ratio of the sizes between lands Select (refer to FIG. 23B).

  Further, the line-to-line correction ratio is set by a line-to-line correction ratio setting pull-down 2402b for setting the correction ratio between the lines (in FIG. 23A, indicated by lines: lines). “Correction with the same ratio” to reduce by the same ratio regardless of the size of the line, or “Correction with the ratio of size” to correct the correction ratio between the lines to the ratio of the sizes of the lines (FIG. 23B). To see.)

  In other words, with this setting, when “Correction at the same ratio” is selected between land and land and between line and line, the conductor shape after correction at the same ratio from each land and line regardless of size. Will be reduced. On the other hand, when “correction by size ratio” is selected, for example, when the ratio correction between land A and land B that is twice the size of land A is performed, if the reduction amount in land A is 1, The reduction amount of B is 2, and the corrected conductor shape is reduced by a larger reduction amount as the size is larger.

  For this reason, a land having a small size or a line having a narrow line width can be preferentially corrected by such setting (see FIGS. 23D and 23E).

  In the displayed correction ratio setting window 2402, correction ratios according to combinations of attributes of the respective conductors can be set between land-line, line-plane, and land-plane.

  When setting the correction ratio between the land and the line (in FIG. 23 (a) and (c), indicated as land: line), when the land correction ratio is input to the land correction ratio input box 2404a, When the correction ratio of the line is determined according to the input correction ratio of the land, and the correction ratio between the line and the plane (shown as line: plane in FIGS. 23A and 23C) is set. When the line correction ratio is input to the line correction ratio input box 2404b, the surface correction ratio is determined in accordance with the input line correction ratio, and the land-plane (in FIG. 23A and FIG. 23C, land: In the case of setting the correction ratio between the two, if the land correction ratio is input to the land correction ratio input box 2404c, the correction ratio of the surface is set according to the input line correction ratio. There is determined (refer to FIG. 23 (c).).

When the correction ratio based on the combination of conductor attributes is determined in this way, the corrected conductor shape is reduced so as to ensure clearance based on the set correction ratio (FIGS. 23F, 23G, 23H). ).)

Then, when the various settings by the setting process of step S506 described above are completed, next, based on the contents set by the setting process of step S506, in the etching pattern creation processing unit 58, based on the outline shape of the conductor pattern, Etching pattern creation processing is performed to correct the conductor shape of the conductors constituting the conductor pattern to create an etching pattern (step S508).

  Here, the flowchart of FIG. 24 shows the detailed contents of the etching pattern creation process in the process of step S508. In this etching pattern creation process, first, the normal rule, the net rule, the in-part rule, Of the correction rules in the four areas of the rules-by area, the correction rule in the target area having the highest priority is selected (step S2402).

  That is, in the process of step S2402, the correction rule set in the target area with the highest priority is selected based on the priority order of the target area set in the process of step S1002 in the setting process.

  Next, it is determined whether or not the correction method set in the selected correction rule is linear spacing (step S2404).

  That is, in the determination process of step S2404, the correction method selected in setting the correction rule for the target area based on the correction rule for each target area set in step S1004 of the setting process is linear spacing. It is determined whether or not there is.

  If it is determined in step S2404 that the correction method set in the selected correction rule is linear spacing, the attributes of conductors that have not been corrected in the target area of the selected correction rule. Is selected (step S2406).

  In the process of step S2406, for example, if the correction rule is set as shown in FIG. 13A in the normal rule, the correction is still performed from the land, line, and surface input in the noun input field 1212a. Select the attributes of conductors that have not been processed. Specifically, if none of the lands, lines, and surfaces has been corrected yet, select one of the lands, lines, and surfaces, and select the lands, lines, and surfaces. When the correction process is completed for the land and the line and the surface are not corrected, one of the line and the surface is selected, and the land and the line are corrected among the land, the line, and the surface. When the processing is finished and only the surface is not corrected, the surface is selected.

  After selecting an uncorrected conductor attribute, a conductor that has not been corrected is selected from the selected conductor attributes (step S2408).

  That is, in the process of step S2408, for example, when a correction rule is set as shown in FIG. 13A and a land is selected in the process of step S2406, the land is formed from the lands formed on the entire electronic substrate. A land that has not yet been corrected is selected.

  If a conductor that has not yet been corrected is selected in the process of step S2408, then all the conductors adjacent to the conductor selected in the process of step S2408 are selected (step S2410).

  In the process of step S1004, a calculation formula using a linear function is created from the linear rule set for the attribute of the conductor selected in the process of step S2406 (step S2412).

  In the process of step S2412, a calculation formula by a linear function is created from the linear rule set in the process of step S1004. For example, as shown in FIG. When the correction value is 7 when the clearance value is 50 and the correction value is 9.5 when the clearance value is 100, y = 0.2x is derived when the clearance value is 0 to 20, and the clearance value is 20 When ˜50, y = 0.1x + 2 is derived. When the clearance value is 50 to 100, y = 0.05x + 4.5 is derived. When the clearance value 100 is exceeded, y = 9.5 is derived. In this calculation formula, y is a correction value and x is a clearance value.

  Thereafter, a plurality of measurement points are set in the conductor selected in the process of step S2408 (step S2414).

  In the process of step S2414, measurement points are set at predetermined intervals in the conductor selected in the process of step S2408.

  As shown in FIGS. 25 (a), (b), and (c), these measurement points are provided for the outline of the conductor shape, and are points for measuring the clearance between adjacent conductors. The measurement point is set at a preset interval (this interval is the clearance measurement pitch set in step S1008, and hereinafter, this clearance measurement pitch is simply referred to as “measurement pitch” as appropriate. Is set on the outline of the conductor shape.

  Further, such measurement points are sequentially arranged in a predetermined direction from the fulcrum to the end point for each line segment or each arc in the conductor-shaped outline. Specifically, for example, as shown in FIGS. 26 (a), (b), and (c), the measurement points are arranged in order in a predetermined direction on the outline of the line. From the start point P1 to the end point P2 of the line segment A in a predetermined direction, they are arranged at equal intervals at a preset measurement pitch. Arranged at equal intervals at the set measurement pitch, and then arranged at equal intervals at a preset measurement pitch from the start point P5 of the line segment B to the end point P6 of the line segment B in the predetermined direction. The

  For this reason, the interval between the last measurement point in the line segment A and the measurement point at the start point P3 of the arc A, and the interval between the last measurement point in the arc A and the measurement point at the start point P5 of the line segment B is equal to or less than the measurement pitch. It becomes pitch.

  Then, a measurement point for which a correction point has not yet been created is selected from the measurement points set in the process of step S2414 (step S2415).

  In the process of step S2415, among the plurality of measurement points set in the process of step S2414, a measurement point that has not yet been corrected and has not created a correction point that has been moved by correcting the measurement point is created. To choose.

  Thereafter, the shortest distance to the adjacent conductor positioned closest to the measurement point selected in step S2415 is measured (step S2416).

  In the process of step S2416, the shortest clearance to the conductor located closest to the measurement point selected in the process of step S2415 is measured (the measured value of the shortest clearance is the minimum clearance value). (Refer to FIG. 27A). At this time, when the shortest clearance measured from the measurement point selected in the process of step S2415 intersects the conductor shape provided with the measurement point, Such a shortest clearance is not a measurement target, and a shortest clearance that does not intersect the conductor shape provided with the measurement point selected in step S2415 is a measurement target (see FIG. 27B).

  Next, the measured minimum clearance value is substituted into the calculation formula created in step S2412, a correction value is calculated, the measurement point is moved by the calculated correction value, and a correction point is created. (Step S2418).

  In the process of step S2418, the minimum clearance value calculated in the process of step S2416 is created in the process of step S2412 and is substituted into the calculation formula corresponding to the calculated minimum clearance value to calculate the correction value. Further, the correction point is created by moving the measurement point to the outside of the conductor shape provided with the measurement point by a correction value in the direction perpendicular to the side where the measurement point is located. If the side where the measurement point is located is a curve, the measurement point is moved in the direction perpendicular to the tangent at the measurement point (see FIG. 27C).

  Then, after a correction point is created from the measurement point selected in the process of step S2415 by the process of step S2418, there is a measurement point for which a correction point has not yet been created among the measurement points set in the process of step S2414. Is determined (step S2420).

  In the determination process of step S2420, when it is determined that there is a measurement point for which a correction point has not yet been created among the measurement points set in the process of step S2414, the process returns to the process of step S2415, and the correction point is not yet changed. The process which selects the measurement point which has not created is performed, and it progresses to the process after the process of step S2416.

  On the other hand, if it is determined in step S2420 that there is no measurement point that has not yet been created among the measurement points set in step S2414, the corrected conductors are connected by connecting the correction points. A shape is generated (step S2422).

  That is, in the process of step S2422, the corrected conductor shape is generated by connecting the correction points created by the process of adjacent step S2418 with line segments (see FIG. 28).

  Thereafter, the generated conductor shape after correction is subjected to processing such as deletion of constituent points on a straight line (corresponding to correction points) and arcing of continuous fine line segments to reduce data weight ( Step S2424).

  If the corrected conductor shape data generated in the process of step S2424 is reduced in weight, next, whether or not there is a conductor that has not been corrected among the conductor attributes set in the process of step S2406. A determination is made (step S2426).

  That is, in the determination process of step S2426, if the conductor attribute set in the process of step S2406 is a land, it is determined whether there is a land that has not been corrected yet.

  If it is determined in step S2426 that there is an uncorrected conductor among the conductor attributes set in step S2406, the process returns to step S2408, and the conductor has not been corrected yet. Is selected, and the process proceeds to the process after step S2410.

  On the other hand, in the determination process of step S2426, when it is determined that there is no conductor that has not been corrected among the conductor attributes set in the process of step S2406, the correction rule selected in the process of step S2402 still It is determined whether or not there is an uncorrected conductor attribute (step S2428).

  If it is determined in step S2428 that there is a conductor attribute that has not been corrected in the target region of the correction rule selected in step S2402, the process returns to step S2406, and step S2402 is performed. In the target area of the correction rule selected in the process of (2), the attribute of the conductor that has not been corrected is selected, and the process proceeds to the process after step S2408.

  That is, in the determination process of step S2428, when it is determined that the line and the surface are not yet corrected in the target area of the correction rule selected in the process of step S2402, the process returns to the process of step S2406. The line or the surface is selected, and the process proceeds to the process after step S2408.

  On the other hand, in the determination process of step S2428, when it is determined that there are no more corrected conductor attributes in the target area of the correction rule selected in the process of step S2402, all the conductors in the target area are determined. The corrected conductor shapes are combined to create a target region corrected conductor pattern shape in which all the conductor shapes are corrected (step S2434).

  That is, in the process of step S2434, as shown in FIG. 29, the conductor shape after the correction of the surface 312 (see FIG. 29A) and the conductor shape after the correction of the surface 314 (FIG. 29 ( b)) and the conductor shape after correction of the land 314 (see FIG. 29C) are combined to refer to the target region corrected conductor pattern shape (FIG. 29D). ).

Thereafter, it is determined whether there is a correction rule that has not yet been executed (step S2436).

  On the other hand, in the determination process of step S2404, if it is determined that the correction method set in the correction rule target area selected in the process of step S2402 is not linear spacing, that is, equal spacing, In the target region, target region corrected conductor pattern shapes are created for all conductors based on the correction values set in step S1004 in the setting process (step S2435).

  That is, in the process of step S2435, based on the correction value set in the correction value setting field 1602d in the process of step S1004 for all conductors in the target area of the correction rule selected in the process of step S2402. A target area correction conductor pattern shape is created.

  Specifically, correction is performed to thicken all conductor shapes by the correction value set in the correction value setting field 1602d to generate a corrected conductor shape, and a target region corrected conductor pattern shape is created.

Thereafter, the process proceeds to step S2436, and it is determined whether there is a correction rule that has not yet been executed.

  If it is determined in the determination process in step S2436 that there is a correction rule that has not been executed yet, the correction rule for the target region having the highest priority among the correction rules that have not been executed yet is selected (step S2438). Then, the process returns to the determination process in step S2404, and the processes after the process in step S2404 are performed.

  If there is a conductor that has already been corrected in the target area of the correction rule selected in the process of step S2438, the conductor should have been corrected by the correction rule for the target area having a higher priority. It will be excluded from the target. In other words, for conductors that have already been corrected in the target area with the highest priority, even if part or all of the conductor shape is in the target area with the next highest priority, the next highest priority. In the correction within the target area, the correction is not performed.

  In the process of step S2438, based on the priority order of the target area set in the process of step S1002 in the setting process, it is set to the target area with the highest priority among the correction rules that have not yet been executed. The correction rule to be selected is selected.

On the other hand, if it is determined in step S2436 that there is no correction rule that has not been executed, all the target region correction conductor pattern shapes (that is, the entire electronic substrate corrected by the correction rule set in the normal rule). The target area correction conductor pattern shape in the target area, the target area corrected conductor pattern shape in the target net corrected by the correction rule set in the net rule, and the target part corrected by the correction rule set in the in-part rule The target area correction conductor pattern shape in the located area and the target area correction conductor pattern shape in the target area corrected by the correction rule set in the rules-by area) The corrected conductor pattern shape with the corrected is formed (step S2440).
Thereafter, in the corrected conductor pattern shape, a conductor shape for which the clearance between conductor shapes (that is, between the corrected conductor shapes) has not yet been confirmed is selected (step S2442), and adjacent to the selected conductor shape. It is determined whether a clearance between the matching conductor shapes is secured (step S2444).

  In the determination process of step S2444, when it is determined that the clearance between the conductor shape selected in the process of step S2442 and the adjacent conductor shape is secured, the process returns to step S2442, and the process after step S2442 is performed. Perform the process.

  On the other hand, if it is determined in step S2444 that the clearance between the conductor shape selected in step S2442 and the adjacent conductor shape is not secured, the conductor shape selected in step S2442 exists. It is determined whether or not the correction method in the correction rule for the target area with the highest priority is linear spacing (step S2445).

  Here, for example, the priority of the correction rule is lower in the order of rules-by-area, in-part rule, net rule, and normal rule (that is, in the order of the specified area, the specified part, the specified net, and the entire electronic board). And the priority of the target area is lowered.) In addition, the conductor shape selected in the process of step S2442 is within the specified part (area corresponding to the rule in the part) and the specified area (rules-by area). In the processing of step S2445, whether or not the correction method in the rules-by area, which is the correction rule of the highest priority target region in which the conductor shape exists, is linear spacing. Judgment is made.

  In the determination process of step S2445, when it is determined that the correction method in the correction rule for the target region where the conductor shape selected in the process of step S2442 is linear spacing, the process of step S1012 of the setting process is performed. When securing the set clearance, the original shape, that is, the conductor shape before correction, is set according to the setting of whether to allow cutting more than the original shape and whether to perform negative correction of the surface. Judgment is made as to whether or not minus correction is permitted to be corrected by reduction (step S2446).

  In other words, in the determination process of step S2446, when securing the clearance, a check box 1706b for setting whether or not to allow cutting of the original shape or more and a check box for setting whether or not negative correction of the surface is performed. A determination is made as to whether 1706d is checked. Note that the check in the check box 1706d is not essential for the minus correction, and can be combined as a variation.

  Here, normally, in order to ensure the clearance between the conductor shapes, to correct each conductor in the conductor pattern in all target regions, create a corrected conductor pattern shape, and to secure the clearance in the created corrected conductor pattern shape In addition, based on a predetermined ratio (for example, 50:50, such a ratio is set in advance) between conductor shapes for which clearance is not ensured, the target shape is determined according to the attribute of the conductor shape. (See FIGS. 30 (a), (b), (c), and (d)).

  However, if it is determined in step S2446 that the negative correction is permitted, the reduction amount of the conductor shape is large when the target conductor shape is reduced in order to secure the clearance. With respect to a portion that must be reduced beyond the previous conductor shape, each conductor shape to be targeted is reduced while performing a negative correction based on the setting content set in the process of step S1012 of the setting process (step S2448).

  Specifically, in the process of step S1012, if the setting for performing negative correction of the surface is made, as shown in FIGS. 31 (a) and 31 (b), the surface after the correction is corrected beyond the conductor shape before correction. A conductor shape is formed.

  Then, after ensuring the clearance between the target conductor shapes, it is determined whether or not there is a conductor shape for which the clearance has not yet been confirmed in the corrected conductor pattern shape (step S2450).

If it is determined in step S2446 that the minus correction is not permitted, the amount of reduction in the conductor shape is large when reducing each of the target conductor shapes in order to secure the clearance. For parts that must be reduced beyond the conductor shape, the range that does not reduce beyond the conductor shape before correction, that is, up to the same shape as the conductor shape before correction The conductor shape is reduced (step S2452), and then the process proceeds to step S2450.

  On the other hand, in the determination process of step S2445, if it is determined that the correction method in the correction rule of the target region where the conductor shape selected in the process of step S2442 is not linear spacing, that is, equal spacing, Based on the content of the ratio correction setting set in step S1014 of the setting process, each conductor shape is reduced according to the attribute of the conductor shape and the attribute of the adjacent conductor shape (step S2453).

  Specifically, when the target conductor shape is a land and a line, if the land: line correction ratio is set to “50:50” in the ratio correction setting in the process of step S1014, the corrected The land shape and the line shape after securing the clearance are created by the same reduction amount from the land shape and the corrected line shape. (See FIGS. 32A and 32B.)

  If the land: line correction ratio is set to “30:70”, the land shape and line shape after securing the clearance are reduced by 30% from the corrected land shape and 70% from the corrected line shape. (See FIG. 32C), and if the land: line correction ratio is set to “70:30”, 70% from the corrected land shape, and from the corrected line shape. The land shape and the line shape after securing the clearance by 30% are created (refer to FIG. 32D).

  Further, when the target conductor shape is a land and a land, if the land / land correction ratio is set to “correct with the same ratio” in the ratio correction setting in the process of step S1014, the corrected land shape Therefore, the two corrected land-shaped clearances are ensured by the same reduction amount regardless of the size (see FIG. 33A).

  Also, if the land: land correction ratio setting is “correction by size ratio” in the ratio correction setting in the processing of step S1014, the corrected land shape is reduced by a reduction amount corresponding to the size and two corrections are made. The clearance of the later land shape will be ensured (see FIG. 33B).

  Furthermore, if the target conductor shape is line-to-line, if the ratio correction setting in the processing of step S1014 is line: line correction ratio setting is “correction at the same ratio”, the corrected line The shape is reduced by the same reduction amount regardless of the size, and the two corrected line shape clearances are secured (see FIG. 33C).

  Also, if the line: line correction ratio setting is “correction by size ratio” in the ratio correction setting in the process of step S1014, the corrected line shape is reduced by a reduction amount corresponding to the size and two corrections are made. The clearance of the subsequent line shape will be ensured (see FIG. 33 (d)).

  In addition, when each conductor shape is reduced based on the content of the set ratio correction setting, it is not reduced beyond the conductor shape before correction. In other words, when reducing the conductor shape between each conductor based on the content of the ratio correction setting, if the conductor shape before the correction is reduced due to the ratio set in the ratio correction setting, the conductor shape before the correction Reduce within a range that does not exceed.

  FIG. 34 shows the clearance secured between the target conductor shapes.

  In addition, when the conductor shape adjacent to the conductor shape selected in the process of step S2442 is different from the area where the conductor shape selected in the process of step S2442 is present, the adjacent conductor shape The clearance is secured based on the correction method in the correction rule for the region where the shape exists.

Thus, when the clearance between the conductor shape selected in the processing of step S2442 and the adjacent conductor shape is secured by the processing of step S2453 according to the content of the ratio correction, the processing proceeds to step S2450.

  If it is determined in the determination process of step S2450 that there is a conductor shape for which the clearance has not yet been confirmed in the corrected conductor pattern shape, the process returns to step S2442, and there is still a gap between conductor shapes in the corrected conductor pattern shape. A conductor shape whose clearance has not been confirmed is selected, and the processing proceeds to the processing after step S2444.

On the other hand, if it is determined in step S2450 that there is no conductor shape whose clearance has not been confirmed in the corrected conductor pattern shape, the corrected conductor pattern shape in which the clearance between the conductor shapes is secured is determined as the etching pattern shape. As described above, the data is written on the electronic substrate data (step S2454), the etching pattern creation processing is finished, and the etching pattern creation work is finished.

  The content corrected in the conductor shape correction process in the etching pattern creation process is appropriately displayed on the display device 38.

  Further, although not specifically described in the etching pattern creation process described above, the option setting set in the process of step S1010 of the setting process is appropriately processed at a predetermined timing.

  That is, when the setting is to hold the land shape, the processing is performed so as to hold the land shape when the clearance is secured.

If the setting is to change the shape of the wire bond pad, the process of changing the shape of the wire bond pad is performed when the clearance is secured, and if the surface shape is set to correct only the land / pad, If the land / pad included in the surface is subject to correction and the line / surface itself is subject to clearance measurement, the clearance will be subject to clearance measurement when the clearance is secured. Is ensured.

In this way, the etching pattern shape is written in the electronic substrate data by the etching pattern creation processing in step S508 described above, and an etching pattern is created.

  As described above, the etching pattern creating apparatus 50 according to the present invention generates an outline shape of a conductor pattern from electronic board data based on electronic board data created by an electronic board designing apparatus such as CAD or CAM. An etching pattern is created by correcting the conductor shape such as lands, lines, and surfaces constituting the conductor pattern based on the set correction content with respect to the outline shape of the formed conductor pattern. .

  In addition, the etching pattern creating apparatus 50 according to the present invention sets the details of correction for each target area and gives priority to the areas. Then, the conductor shape in the high priority area is corrected based on the correction contents set in the area, and after the correction for each area is completed, the corrected conductor shape is synthesized and etched for each area. A pattern was created.

  Furthermore, the etching pattern creation apparatus 50 according to the present invention creates a calculation formula of a linear function from the relationship between several clearance values representing the shortest distance between conductors and correction values corresponding to the clearance values of the several points, The created calculation formula is used to correct the conductor shape, and further, linear spacing that corrects the conductor shape by a predetermined ratio to ensure clearance, and the conductor shape is corrected uniformly by the set correction value. In order to ensure the clearance between the conductor shapes, equal spacing that corrects the conductor shape by a ratio set in accordance with the attribute of the conductor shape is selected.

  Furthermore, in the case of linear spacing, when the clearance is ensured by setting, it is possible to perform the correction by reducing the conductor shape before the correction.

Thereby, the etching pattern creation apparatus 50 by this invention can create an etching pattern in consideration of a manufacturing error by an etching process, and can create an etching pattern with a continuous shape.

Note that the “minimum clearance between conductor shapes after correction”, “correction value for a predetermined clearance set in the linear rule”, and correction value set when setting equal spacing are determined by the operator. For example, it is determined by the know-how of the company to which the worker belongs and is preset in the etching pattern creating apparatus 10.

  The above-described embodiment can be modified as shown in the following (1) to (12).

  (1) In the embodiment described above, in the correction rule in the target area, linear spacing or equal spacing is selected as the correction means, but it is needless to say that the present invention is not limited to this. The means may be made non-selectable only for linear spacing, or the correction means may be made non-selectable only for equal spacing.

  (2) In the above-described embodiment, when setting the linear rule, several clearance values are set between the target conductor and the adjacent conductor, and correction values corresponding to the clearance values of the several points are set. Then, the calculation formula of the linear function is created from the clearance value and the correction value of the set several points, but of course, it is not limited to this, and the change rate of the correction value for each clearance range Further, a calculation function of a linear function may be created by inputting a base correction value (see FIG. 35. Note that the minimum clearance and maximum clearance in FIG. 35 indicate the range of clearance before correction. .)

  At this time, the set correction rule is graphed and displayed on the display device 38 (see FIG. 36 (a)). If there is overlap or missing in the clearance range specification, an error will occur. A message may be displayed (see FIG. 36B).

  (3) In the above-described embodiment, although not particularly described, the correction for the mesh extraction shape is corrected by linear spacing with the same correction content as the surface, and the size of the mesh extraction shape is measured. The correction is calculated using the value as a clearance value, and the mesh extraction shape is corrected (see FIG. 37).

  (4) In the above-described embodiment, the correction rule for the target region with the lower priority is executed in order from the correction rule for the target region with the higher priority, so that the conductors in the target region with the higher priority are sequentially Although correction processing is performed, it is of course not limited to this, and by executing correction rules for target areas with higher priority in order from correction rules for target areas with lower priority, Corrections may be made in order from the conductors in the lower priority target area. In short, the conductors in the higher priority target areas are corrected according to the correction contents set in the higher priority target areas. If so, the order of the target areas to be corrected may be set in any way.

  (5) In the above-described embodiment, the conductors extending over a plurality of regions are not particularly described, but may be corrected as follows.

  For example, if a line spans the target area, generate an intersection of the line axis and the boundary line of the target area, generate a line segment orthogonal to the line axis at the generated intersection, In the part of the line that is located within the target area with the line segment as the boundary, the part that is corrected based on the content of the correction within the target area and is located outside the target area with the line segment as the boundary In this line, correction may be performed based on the correction contents of the area outside the target area (see FIG. 38).

  In addition, when a land is placed over the target area, when the center point of the land is located outside the target area, the land is based on the correction contents of the area outside the target area. (Refer to FIG. 39A), and when the center point of the land is located in the target area, the land is corrected based on the correction contents in the target area. (Refer to FIG. 39 (b)).

  Furthermore, when the surface is covered in the target region, if all of the surface is located within the target region, the surface is corrected based on the correction contents in the target region ( (See FIG. 40A.) If all of the surfaces are not located in the target region, the surface is corrected based on the correction contents of the region outside the target region. (Refer to FIG. 40 (b)).

  (6) In the above-described embodiment, three types of linear rules are created for the conductors of each attribute. However, the present invention is not limited to this, and the linear rule is 1 or There may be two types, or four or more types.

  Further, a different number of linear rules may be provided for each conductor.

  (7) In the embodiment described above, when setting the linear rule, three clearance values and correction values corresponding to the three clearance values are set, and the set points are linearly supplemented, as shown in FIG. The straight line in the region where the line was complemented from the created graph was expressed by a linear function calculation formula, but it is not limited to this, and each line is set on the set line segment. You may make it derive | lead-out the calculation formula of the linear function of the curve which a set point approximates (refer FIG. 41).

  (8) Although not particularly described in the above-described embodiment, the etching pattern is corrected by correcting the bent portion of the line by reducing the bent portion to the inside with a predetermined shape in the corrected line shape. It may be made (see FIG. 42A), or a correction is performed on the corners of the surface by adding a predetermined shape outside the corners in the corrected surface shape. Thus, an etching pattern may be created (see FIG. 43A).

  In this way, by creating an etching pattern by reducing the bent portion in a predetermined shape inward in the corrected line shape, an etching pattern in which the bent portion is simply bent in the line shape (FIG. 42C). Compared with the case where the etching process is performed, an etching pattern that can surely form a bent portion can be created.

  That is, when the etching pattern is created as shown in FIG. 42 (c), the conductor pattern as shown in FIG. 42 (d) is formed by the etching process, and the bent portion of the line is sufficiently formed. Can not do it. On the other hand, when the etching pattern is created as shown in FIG. 42A, a conductor pattern as shown in FIG. 42B is formed by the etching process, and the bent portion of the line is changed. It can be formed sufficiently.

  Further, an etching pattern is created by correcting the corners in the corrected surface shape by adding a predetermined shape to the outside, thereby creating an etching pattern in which corners are simply formed in the surface shape (FIG. 43 ( Reference is made to c), and an etching pattern capable of reliably forming corners can be created as compared with the case where the etching process is performed according to c).

  That is, when an etching pattern is created as shown in FIG. 43 (c), a conductor pattern as shown in FIG. 43 (d) is formed by the etching process, and the corners of the surface are sufficiently formed. Can not do it. On the other hand, when an etching pattern is created as shown in FIG. 43 (a), a conductor pattern as shown in FIG. 43 (b) is formed by the etching process. It can be formed sufficiently.

  In addition, as shown in FIG. 44, the predetermined shape to be deleted at the bent portion of the line shape and the predetermined shape to be added at the corner of the surface shape can be selected from eight types.

  When the inner tab 4404 is selected in the option group box 4402, the shape generated inside the outer shape is set (that is, the correction content to be reduced is set inside). When the outer tab 4406 is selected. The shape generated outside the outer shape is set (that is, the correction content to be added outside is set).

  Then, a shape selection pull-down 4408 is used to select any one of eight shapes: strip shape, cup shape, wedge shape, rugged shape 1, rugged shape 2, asymmetric shape 1, asymmetric shape 2, and circular shape.

  Thereafter, in the selected shape, a dimension to be set is input to set the predetermined shape described above.

  (9) In the above-described embodiment, in the linear spacing for convenience, the correction value is calculated by substituting the shortest clearance value measured at a certain measurement point into the calculation formula, and the measurement point is moved by the calculated correction value. However, the process of creating correction points at measurement points is performed at all measurement points. However, in fact, there are multiple neighboring outline shapes before correction, so the shortest distance from the measurement point in the middle is present. The object to be the clearance is switched to another adjacent outline shape before correction.

  Therefore, the shortest clearance value at each correction point is substituted into the calculation formula, the correction values at all measurement points are calculated, and the correction points for each measurement point are created from the calculated correction values.

  In this case, first, the clearance is measured at the measurement points arranged at the pitch set for the conductor shape of the target conductor (see FIG. 45 (a)), and the measured clearance value is measured. Thus, the correction value is calculated from the correction rule set above.

  Here, when the correction value calculation formula for calculating the correction value (derived from the correction rule) is “0.3 × clearance value”, as shown in FIG. The correction value is 32.89568 (0.3 × 109.658560).

  Thereafter, a correction point is created for each measurement point, and the corrected conductor shape is created by connecting the correction points (see FIG. 45C).

  (10) In the above-described embodiment, when a correction point is created, the measurement point is moved outward by the correction value in the direction perpendicular to the side where the measurement point is located (FIG. 46). (Refer to (b).) Of course, the present invention is not limited to this, and the measurement point may be moved outward by the correction value on the measured clearance (see FIG. 46A). refer.).

  (11) In the above-described embodiment, in the option setting window 1702, a “common” item 1704 for performing settings commonly executed in linear spacing and equal spacing, and settings executed only in linear spacing. “Linear spacing” item 1706 and “Equal spacing” item 1708 for performing settings only in equal spacing are displayed. The content displayed in the “spacing” item 1708 may be displayed in the “common” item 1704 depending on the operation, and may be set to be commonly executed in linear spacing and equal spacing.

  (12) You may make it combine suitably the embodiment shown above and the modification shown in said (1) thru | or (11).

  The present invention is suitable for use in designing an electronic substrate.

DESCRIPTION OF SYMBOLS 10 Electronic substrate 12 Insulation base material 14 Conductor 16 Mask 18 Etching resist 30 Recording medium 32 CPU
34 Bus 36 Storage device 38 Display device 40 Pointing device 42 Character input device 44 I / O
46 External storage device 48 Read / write device 50 Etching pattern creation device 52 Electronic board data reading unit 54 Outline shape creation unit 56 Setting unit 58 Etching pattern creation processing unit 62 Linear rule setting unit 64 Correction content setting unit 66 Correction rule target region setting unit 68 Negative correction permission setting part 70 Ratio correction setting part

Claims (13)

Outline shape creating means for creating an outline shape that is an outer shape of the conductor pattern from design data including the conductor pattern;
Two or more correction values are set according to the distance between adjacent outline shapes created by the outline shape creating means , and the correction values adjacent to each other are complemented with straight lines or curves between the two or more correction values set. Setting means for setting a continuously changing correction value,
Etching pattern creation means for creating an etching pattern by correcting the outline shape created by the outline shape creation means by the correction value set by the setting means. The etching pattern creating apparatus according to claim 1, further comprising:
Determining means for determining whether a distance between adjacent outline shapes after correction in the etching pattern creating means is shorter than a preset set distance;
The etching pattern generating means, and a predetermined outline shape by the determination unit, the distance between the outline shape adjacent to said predetermined outline shape, when it is determined shorter than the set distance, the predetermined outline shape An etching pattern creating apparatus characterized by reducing the outline shape before correction or reducing the predetermined outline shape and the adjacent outline shape beyond the outline shapes before correction . The etching pattern creating apparatus according to claim 1, further comprising:
Determining means for determining whether a distance between adjacent outline shapes after correction in the etching pattern creating means is shorter than a preset set distance;
When the distance between adjacent outline shapes corrected by the set correction value is determined to be shorter than the set distance by the determination unit, the setting unit calculates the outline shape from a preset reduction ratio. Set a specific reduction ratio based on the combination of attributes and size,
The etching pattern creation means, when the determination means determines that the distance between adjacent outline shapes is shorter than the set distance, before correcting based on a preset reduction ratio between adjacent outline shapes. Etching pattern creation apparatus characterized in that each outline shape adjacent to each other is reduced without exceeding the outline shape. In the etching pattern creation apparatus according to any one of claims 1, 2, or 3,
Said setting means sets the priority of the target area outline shape to be corrected are located on the basis of the input priority, sets the correction rule for each target area based on the inputted correction rule ,
The etching pattern creating means, the outline shape to be corrected, depending on the position of the outline shape to be the correction, that is corrected based on the set correction rule a higher priority target area Etching pattern creation device characterized. The etching pattern creating apparatus according to claim 1, further comprising:
Measuring point setting means for setting a plurality of measurement points for measuring the interval between adjacent outline shapes on the outline shape;
The setting means sets a correction value for the outline shape for each measurement point set by the measurement point setting means.
An etching pattern creating apparatus characterized by that. In an etching pattern creation method for creating an etching pattern from design data including a conductor pattern by an etching pattern creation device,
An outline shape creating step for creating an outline shape which is an outer shape of the conductor pattern from the design data;
Two or more correction values are set according to the distance between adjacent outline shapes created in the outline shape creation step , and correction values adjacent to each other are complemented with straight lines or curves between the two or more correction values set. A setting step for setting a continuously changing correction value,
An etching pattern creating step for creating an etching pattern by correcting the outline shape created in the outline shape creating step by the correction value set in the setting step;
The etching pattern creating apparatus executes the etching pattern creating method. The etching pattern creation method according to claim 6, further comprising:
A determination step of determining whether a distance between adjacent outline shapes after correction in the etching pattern creation step is shorter than a preset set distance;
Is executed by the etching pattern creation device,
In the etching pattern creation step, when it is determined in the determination step that the distance between the predetermined outline shape and the outline shape adjacent to the predetermined outline shape is shorter than the set distance, the predetermined outline shape is An etching pattern creating method comprising: reducing an outline shape before correction, or reducing the predetermined outline shape and the adjacent outline shape beyond an outline shape before correction . The etching pattern creation method according to claim 6, further comprising:
A determination step of determining whether a distance between adjacent outline shapes after correction in the etching pattern creation step is shorter than a preset set distance;
Is executed by the etching pattern creation device,
In the setting step, when it is determined that the distance between adjacent outline shapes corrected by the set correction value is shorter than the set distance in the determination step, the outline shape is calculated from a preset reduction ratio. Set a specific reduction ratio based on the combination of attributes and size,
In the etching pattern creation step, when it is determined in the determination step that the distance between adjacent outline shapes is shorter than the set distance, before correction based on a preset reduction ratio between adjacent outline shapes. Etching pattern creation method characterized by reducing adjacent outline shapes without exceeding the outline shape. In the etching pattern creation method according to any one of claims 6, 7 and 8,
In the setting step sets a priority of the target area where the outline shape to be corrected are located on the basis of the input priority, it sets the correction rule for each target area based on the inputted correction rule ,
In the etching pattern forming step, an outline shape to be corrected, depending on the position of the outline shape to be the correction, that is corrected based on the correction rule set in a higher priority target area Etching pattern creation method characterized. The etching pattern creation method according to claim 6, further comprising:
A measurement point setting step for setting a plurality of measurement points for measuring the distance between adjacent outline shapes on the outline shape;
Is executed by the etching pattern creation device,
In the setting step, a correction value for the outline shape is set for each measurement point set by the measurement point setting means.
Etching pattern creation method characterized by the above-mentioned.   The program for functioning a computer as an etching pattern production apparatus of any one of Claim 1, 2, 3, 4 or 5.   The program for making a computer perform the etching pattern production method of any one of Claim 6, 7, 8, 9, or 10.   The computer-readable recording medium which recorded the program of any one of Claim 11 or 12.