JP4106486B2 - System and method for automatically correcting manufacturing data for PWB - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a correction processing system for automatically performing various correction processes for manufacturing on printed wiring board (PWB) data created by CAD (Computer Aided Design).
[0002]
[Prior art]
When manufacturing an actual printed wiring board based on the printed wiring board pattern data and drill data created by CAD, depending on the manufacturing conditions such as construction method, material, thickness, etc. Correction is generally performed. In particular, in an etching process in which a predetermined circuit pattern is formed by dissolving and removing an unnecessary portion of a copper foil by a chemical reaction, the finished conductor width and gap of the fine portion depending on various conditions such as the construction method, material, and copper foil thickness are CAD data. The value is different from the theoretical value of.
[0003]
For example, in the portion where the circuit pattern is sparse, the flow of the etching solution is faster than in the portion where the circuit pattern is dense, and as a result, overetching may occur in the portion where the circuit pattern is sparse. For this reason, in order to obtain a desired finished dimension of the CAD data, a process for correcting the pattern data in advance is performed. Such correction processing for pattern data is also required in each process such as through-hole formation, solder coating, and marking printing other than the etching process, and correction according to each method method is performed.
[0004]
As the actual correction procedure, the person in charge of manufacturing process design decides the optimum correction amount individually considering the CAD data pattern design specifications and manufacturing conditions such as construction method, material, thickness, etc. In general, a person in charge of a CAM (Computer Aided Manufacturing) editing machine performs correction processing individually for each conductor width and each attribute of a pattern based on the instruction.
[0005]
When manufacturing process designers determine the optimum correction amount, conditions such as construction method, material, plate thickness, copper foil thickness, etc. are often known as sales order information, but CAD data pattern design specifications are provided. It is difficult to confirm the exact specifications without checking the CAD data. Usually, the supply data is confirmed by analysis with a CAM editing machine or the like, so that a CAM editing person generally creates a design specification of pattern data required by a manufacturing process designing person.
[0006]
As described above, in order to perform correction processing for manufacturing pattern data, (1) CAD data specification confirmation by a person in charge of CAM editing and creation of “specification confirmation”, and (2) “specification confirmation” and various manufacturing conditions. Procedures such as determination of individual correction amount by production process designer and creation of “correction instruction”, (3) individual correction processing by CAM editing person and validity evaluation after correction from “correction instruction” are required. Become. The “specification confirmation” and “correction instruction” used here are generally created by handwriting. In addition, the individual correction processing is individually processed interactively for each data attribute unit.
[0007]
[Problems to be solved by the invention]
On the other hand, in some cases, such correction processing is generally performed uniformly on the entire pattern, but with the progress of fine patterning in recent years, the conductor width of each pattern, the pattern attribute, and the process individually, and XY There is an increasing demand to change the correction amount for each direction, for each inner diameter and outer diameter.
[0008]
The present invention has been made in view of such circumstances. The present invention eliminates the creation of “specification confirmation” and “correction instruction” by handwriting work by a CAM editing person and a manufacturing process person in charge of the conventional correction process as described above. And a correction processing system for printed wiring board manufacturing data configured to be able to individually indicate the correction amount according to the conductor width, pattern attribute, etc. of each pattern, while greatly reducing the work time of the correction processing for CAD data by automation, and It aims to provide a method.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, in the printed circuit board manufacturing data correction processing system according to the present invention, first, by analyzing CAD data (design data), information on the pattern design specifications included in the design data. Is generated (design data analysis means) and the correction information is received (correction information receiving means). Further, a configuration is made to perform correction processing on the design data based on the received correction information (correction processing means). Since information related to design specifications is automatically generated, it is possible to receive correction information determined by a manufacturing process designer based on this information. Can be collectively corrected.
[0010]
These functions significantly reduce the man-hours for creating a “Specification Confirmation Document” compared to the conventional general procedure, and enable individual correction processing to be performed automatically in a batch, thus greatly reducing man-hours. In addition, it is possible to eliminate a mistake in inputting a correction value based on the “correction instruction”.
[0011]
In addition, it is possible to perform correction for making the annular ring appropriate by configuring the information about the pattern design specification so as to include the information about the annular ring for each drill (claim 2). Become.
[0012]
In addition, it is possible to perform appropriate correction for the aperture for the line by configuring the information regarding the pattern design specification so as to include the information regarding the aperture for the line data for each layer (Claim 3). become.
[0013]
Further, by configuring the information related to the pattern design specifications so as to include information related to the aperture for pad data for each layer (Claim 4), it is possible to perform appropriate correction regarding the aperture for pad data. It becomes possible.
[0014]
The correction information receiving means may include a user interface, and the correction information may be input by the user via the user interface.
[0015]
When the information related to the pattern design specification is generated as an electronic document, the correction information receiving unit can receive the correction information via the input device while displaying the electronic document on the display device. 6).
[0016]
In addition, the electronic document may include a display column for information on pattern design specifications and an input column for correction information.
[0017]
The correction processing means can be configured to correct the design data after fetching all the correction information input in the correction information input field in the electronic document. In this case, correction is performed collectively.
[0018]
The electronic document is configured to include a predetermined display field for displaying that the correction processing has been completed. Further, the correction processing means is configured to write a symbol indicating that the correction processing has been completed in a predetermined display field in the electronic document when the correction to the design data is completed. With this configuration, it is possible to verify whether or not the correction processing has been completed by looking at the electronic document later.
[0019]
In addition, it is good also as a structure further equipped with the adjustment means which adjusts so that a predetermined clearance may be ensured about the data of the part from which the predetermined clearance is no longer ensured as a result of correction | amendment by a correction | amendment process means. ).
[0020]
In order to achieve the above object, the correction processing method is configured to include the following steps.
(1) a first step of analyzing input design data and generating information on a pattern design specification of the design data;
(2) While displaying information on the generated pattern design specification on the display screen, the user is prompted to input correction information for the generated information on the pattern design specification, and the correction information is input via the input device. A second step of receiving,
(3) A third step of correcting the design data based on the received correction information. Information related to the design specification is automatically generated and displayed, and the person in charge of manufacturing process design can input correction information while referring to the display screen. Once the correction information is input, it is possible to perform a collective correction process on the design data using the correction information and the design data.
[0021]
The information related to the pattern design specification can be configured to include information indicating information related to the annular ring for each drill (claim 12). Alternatively, the information related to the pattern design specification may be configured to include information indicating the information related to the aperture for line data for each layer (claim 13). Alternatively, the information related to the pattern design specification may be configured to include information indicating the information related to the aperture for pad data for each layer.
[0022]
In the first step, when the information related to the pattern design specification is generated as an electronic document including a display column for information related to the pattern design specification and an input column for inputting correction information, it is displayed in the second step. The electronic document can be displayed on the screen, and the correction information can be input to the input column of the electronic document via the input device.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
As shown in FIG. 1, a printed wiring board manufacturing data correction processing system 10 according to an embodiment of the present invention is connected to a host computer 1 (workstation) on which a correction processing program is executed via a LAN, and a terminal device (personal computer). ) Realized in a form that can be connected remotely from 3, 5 etc. When inputting correction information to an electronic document or the like generated during the execution of the correction processing program by the host computer 1, it can be performed from the terminal devices 1 and 3. As a form of the correction processing system, in addition to the system shown in FIG. 1, a form in which the correction processing program can be executed in a network license format on another workstation that can be connected to the host computer 1 via a network, etc. There can be various system configurations known in the art, but it goes without saying that such various system configurations may be employed as embodiments of the present invention.
[0024]
The CAD data of the printed wiring board provided by the customer is input to the host computer 1, and the correction processing program described below is executed in the host computer 1. The host computer 1 has a general configuration as a workstation. That is, a CPU for controlling the entire system, a main memory, a ROM, a first interface for network connection, a second interface for receiving CAD data received from a customer, a storage device for storing programs and data, a display, Furthermore, it has general components such as a keyboard for inputting various operation commands and a mouse as a pointing device for designating a position on the screen. The terminal devices 1 and 3 are assumed to have a general configuration as a personal computer. It is assumed that CAD data provided by the customer can be input to the host computer 1 through data communication via a recording medium such as a flexible disk or via a LAN 6 or a transmission line different from the LAN 6.
[0025]
In the actual production of the printed wiring board, for example, based on the production data output by the present system, a photomask is created, each substrate layer is formed by etching, and then laminated to form a multilayer board. In other words, once a photomask with an image of the wiring pattern corresponding to the design data is created, the photoresist is then applied to the core member having a copper foil layer formed on the surface, and the photomask is overlaid for exposure. To do. In the photoresist, a pattern portion corresponding to the photomask is cured. Here, the uncured photoresist is removed, and the copper foil other than the wiring pattern is melted and removed by dipping in an etching solution, and further, the cured photoresist is removed to form one layer of the printed wiring board. Is done.
[0026]
Next, the substrates (double-sided substrates) on which the wiring patterns are formed on both sides as described above are stacked, and the respective layers are made conductive by the through-hole method. The plurality of laminated substrates are pressed and bonded with a prepreg sandwiched therebetween. Note that with the recent increase in functionality and performance of electronic devices, the number of stacked multilayer substrates has increased from several to several tens with the increasing complexity and density of wiring patterns.
[0027]
FIG. 2 shows a flowchart of a correction processing program executed by the host computer 1. The correction process will be described below with reference to FIG. 2 and the related drawings.
[0028]
The printed circuit board design data is prepared by the customer. Usually, the customer first designs an electronic circuit that meets the specifications of the electronic device on which the printed wiring board is to be mounted, and then determines the mounting components and board size to realize the designed electronic circuit. In addition, component placement and wiring pattern design are performed. The wiring pattern data obtained in this way and the drill data created accompanying the wiring pattern are supplied as design data to the board manufacturer who is the user of this correction processing system.
[0029]
There are various formats for design data. As a typical example, a format called Gerber data is used, for example. In this correction process, it is assumed that Gerber data is used as design data. The host computer 1 receives pattern data and drill data in the Gerber data format (S11).
[0030]
[CAD data analysis processing]
When pattern data and drill data are input to the host computer 1 and stored as a file, the host computer 1 executes analysis processing on the input design data (S12). The function of performing CAD data analysis processing in this way is hereinafter referred to as an “information function”. Gerber data is provided in a format in which the layer structure of a substrate is divided into file units, but usually does not include information on what type of substrate layer each file has. Therefore, after storing the CAD data, it is necessary to set the layer type (outer / inner layer, signal layer, power supply layer, solder resist layer, silk data layer, etc.) for each file. Accordingly, here, the host computer 1 performs analysis processing and prompts the CAM editing staff to set the layer type.
[0031]
As a result of the analysis processing here, as information for each layer, it is possible to discriminate between a part (pad) on which a component is mounted and a part (line) only with wiring (in some cases, pad data formed by lines is represented by pad data ( Flash data)), minimum clearance (line-line spacing), minimum pad-line spacing, minimum pad-pad spacing detection, minimum pad width, minimum line width, minimum pitch detection, aperture information, through-hole information, non-through Hall information, IVH information, and substrate size information are acquired. Further, as the interlayer information, drill minimum copper foil remaining information, resist minimum gap information, drill-to-pad correspondence information, resist-to-pad correspondence information, and the like are also analyzed based on the design data.
[0032]
The analysis result is output as data in a format corresponding to a spreadsheet (spreadsheet software) (S13). An example in which the analysis result is displayed on the display screen of the host computer 1 is shown in FIG. The list of analysis results as shown in FIG. 3 is hereinafter referred to as an information list.
[0033]
In the information list 30 shown in FIG. 3, in each column of reference numeral 31 “LAY”, names corresponding to the data file names of the layers of the Gerber data are displayed. The Gerber data input to the host computer 1 is for a printed wiring board having an eight-layer structure. In each column 31 “LAY”, silk data, solder resist data, pattern data of each layer, and the like are stored. The names of 13 types of files including “SLKT”, “SR1”, “1”, “2”, “3”, “4”, “5”, “6”, “7”, “8”, “SR8” , “SLKB”, and “DRIL” are displayed.
[0034]
In each column of reference numeral 32 “Class”, layer type information input by the CAM editor in step S12 is displayed. In FIG. 3, as an example, “SLK” indicating that the data type is “SLK” is input to the data file “SLKT”, and “SR” indicating that the data file “SR1” is a solder resist. ”Is input,“ PAT ”indicating the pattern layer is input to the data files“ 1 ”,“ 2 ”, and“ 4 ”, and the power source layer is input to the data file“ 3 ”. A state in which “Vcc” indicating this is input is shown. Actually, the layer type set by the person in charge of CAM editing is displayed in all fields of reference numeral 32 “Class”.
[0035]
In the information list 30 of FIG. 3, numerical values (unit: mm) of various analysis results are displayed. For example, each column 33 “L” has a minimum line width of each layer, each column 34 “P” has a minimum pad width of each layer, and each column 35 “LL” has a line width of each layer. The minimum gap between lines, each column 36 “PL” is the minimum gap between the pads of each layer, and each column 37 “PP” is the minimum gap between the pads of each layer. Is displayed. Each column of reference numeral 40 “ANU” displays the minimum width of an annular ring (ring between a land outer diameter and a hole in a portion such as a through hole). For example, in each column of reference numeral 41 “TH”, the minimum annular ring width for the through hole is displayed. For the sake of simplicity, FIG. 3 shows the numerical values of the analysis results only for the “SLKT” data file, but actually the numerical values of the analysis results are displayed for the data files of all layers. Is done.
[0036]
[Generate an annular list]
Next, the host computer 1 generates data for the annular list 50 representing a numerical value (unit: mm) relating to the annular width based on the result of the analysis processing in step S13 and the information list 30 (S14). ). The annular list 50 is generated as data in a format corresponding to a spreadsheet (spreadsheet software), and is displayed on the display screen of the host computer 1 as shown in FIG. In this list, information on the annular width in each layer is included for the number of drills. In the annualing list 50, a data input field for inputting a correction value determined by the manufacturing process designer in consideration of the contents and manufacturing conditions described in the annualing list 50 later. Is also included.
[0037]
In the annualing list 50 of FIG. 4, the reference numeral 51 “1” field, reference numeral 52 “2” field, reference numeral 53 “3” field, and reference numeral 54 “4” field are respectively within the thick line frame of the part. The information described in is information about the first drill (drill 1), information about the second drill (drill 2), information about the third drill (drill 3), information about the fourth drill (drill 4) It shows that it is. Information for the number of drills is included in the annular list 50. Here, only a part of the list (information about four drills) is shown. Since the displayed information is common to all drills, the contents of the drill 1 will be described.
[0038]
It is assumed that the drill 1 (column 51 “1”) is a through hole. In this case, as shown in FIG. 4, a numerical value related to the drill 1 is displayed in the column corresponding to the reference numeral 61 “TH” in the annular list 50. The column corresponding to the reference numeral 82 “D” has the D code, the column corresponding to the reference numeral 83 “SH” has the shape information, the column corresponding to the reference numeral 84 “X” has the size in the X direction, In the column corresponding to 85 “Y”, the size in the Y direction is displayed, and in the column corresponding to reference numeral 86 “CNT”, the count number is displayed. That is, the drill 1 is a through hole, and the shape is circular (CI), the size in the X direction is 0.300, the size in the Y direction is 0.300, and the count number is 2430.
[0039]
A column corresponding to reference numeral 87 “ANU” is a portion where an annular ring width value is displayed. The annular ring list 50 includes information on the annular ring width related to the drill 1 as follows. In the column corresponding to the reference numeral 71 “SRT”, numerical values related to the aperture of the pad corresponding to the through hole of the drill 1 in the solder resist layer on the surface and the size of the annular ring in this pad portion are shown. Referring to the annular list 50, the pad aperture corresponding to the through hole of the drill 1 in the solder resist layer on the surface is the aperture of the D code 14, the shape is circular (CI), and the size in the X direction is 0. .800, the size in the Y direction is 0.800, and the count is 2430. And it is shown that the width of the annular ring of this part is 0.250.
[0040]
In the column corresponding to the reference numeral 72 “L1”, the numerical value related to the aperture of the portion corresponding to the through hole of the drill 1 in the first layer pattern and the size of the annular ring in this portion are shown. Referring to the annular list 50, the aperture corresponding to the through hole of the drill 1 in the first layer pattern is the D code 10, the shape is circular (CI), the size in the X direction is 0.600, and the Y direction Has a size of 0.600 and a count of 676. Further, it is shown that the annular ring width of this portion is 0.150.
[0041]
In the column corresponding to the reference numeral 74 “L3”, the numerical value related to the aperture of the portion corresponding to the through hole of the drill 1 and the size of the annular ring in this portion are shown. Similarly, the column corresponding to the reference numeral 74 “L3” has a content related to the third layer pattern, the column corresponding to the reference symbol 75 “L4” has a content related to the fourth layer pattern to the column corresponding to the reference numeral 77 “L6”. Indicates the contents regarding the sixth layer pattern, and the column corresponding to the reference numeral 78 “SRB” indicates the contents regarding the solder resist layer on the back surface.
[0042]
On the other hand, in the annular list 50, the column corresponding to the symbol 88 “RX” and the column corresponding to the symbol 89 “RY” are portions for inputting correction values for the respective apertures. In this input column, a correction value is input later by a manufacturing process designer in step S19. In this case, in the column corresponding to the reference numeral 90 “CLE”, a gap value to be secured between each aperture listed in the annular ring list 50 and another pattern or the like can be designated.
[0043]
As described above, by using the annular ring list 50, it is possible to individually specify the correction value of each aperture and each drill in order to make the width of the annular ring associated with each drill appropriate.
[0044]
[Generate line aperture usage list]
Next, the process (S15, S16) for generating a line aperture list will be described. The above-mentioned annular ring list 50 lists information on each aperture used in a portion such as a through hole for the purpose of making the annular width appropriate. Here, the host computer 1 uses the line aperture usage list 100 representing numerical values (unit: mm) related to the aperture for line data (line aperture) used in each layer based on the result of the analysis processing in step S13. Data for (FIG. 5) is generated. The line aperture usage list 100 is generated as data in a format corresponding to a spreadsheet (spreadsheet software), and is displayed on the display screen of the host computer 1 as shown in FIG. In the line aperture application list 100, data for inputting a correction value determined by a manufacturing process designer in consideration of the contents and manufacturing conditions described in the line aperture application list 100 later. An input field is also included.
[0045]
First, the aperture used as line data for each layer is extracted from the result of the analysis processing in step S12. The extracted line aperture for each layer is displayed in a predetermined column of the line aperture usage list 100. Next, the person in charge of CAM editing inputs and sets the line aperture usage type in a predetermined input field of the line aperture usage list 100. The correction value is input later by a manufacturing process designer in step S19.
[0046]
In the line aperture application list 100 of FIG. 5, the D code for each aperture corresponds to the column corresponding to the reference numeral 112 “D”, and the shape corresponds to the reference numeral 114 “X” in the column corresponding to the reference numeral 113 “SH”. The size in the X direction is displayed in the column, and the size in the Y direction is displayed in the column corresponding to reference numeral 115 “Y”.
[0047]
In the column corresponding to the reference numeral 101 “L1”, the line aperture extracted for the pattern data of the first layer is displayed. Referring to the line aperture application list 100, the first of the line apertures used in the first layer (the column corresponding to the reference numeral 101a) is the aperture of the D code 10, that is, the shape is circular (CI). It is shown that the aperture has an X-direction size of 0.100 and a Y-direction size of 0.100. Also, the second line aperture in the first layer (the column corresponding to the reference numeral 101b) is the aperture of the D code 12, that is, the shape is circular (CI), the X direction size is 0.120, and the Y direction. The size is shown to be 0.120.
[0048]
The column corresponding to reference numeral 120 “Use” is a column in which the person in charge of CAM editing inputs the usage type of each line aperture. When the first line aperture (the line aperture in the column corresponding to the reference numeral 101a) is used as a pad portion for a surface mount component in addition to the signal line, as shown in FIG. In the column corresponding to reference numeral 120 “Use” for the first layer, information “SIGNAL” indicating that the line aperture is a signal and information “SMT” indicating that the line aperture is a pad for surface mounting components Specify both.
[0049]
The host computer 1 uses a GUI (graphical user interface) to perform a series of operations until it is grasped whether the aperture for line data is also used as a pad portion for surface-mounted components and the usage type is set. It is configured to be able to. A series of operations via the GUI may be as follows. 6A and 6B are examples of screen display on the host computer 1 when the correction processing program is executed on the host computer 1. FIG. For example, as shown in FIG. 6A, the printed wiring board pattern display screens 181 and 182 are displayed, and the line aperture usage list 100 is displayed in another window. Then, one part of the line aperture displayed in the line aperture usage list 100 is selected by clicking with the mouse. For example, it is assumed that the aperture of the D code 10 in the first layer (the portion 101a) is selected.
[0050]
Then, portions corresponding to the selected line aperture on the pattern display screens 181 and 182 (signal lines, pad portions, etc. drawn with the line aperture of the first layer D code 10) are highlighted. By checking the highlight portion, the CAM editor can identify whether the selected line aperture is used not only as line data but also as a pad portion of the surface mount component. If the pad portion for the surface mount component is also highlighted, “SIGNAL” and “SMT” are designated as the attributes of the first line aperture as shown in FIG. In this way, the usage type is set in the “Use” column of the line aperture usage list 100.
[0051]
In addition, when performing pad conversion (conversion processing from line data to pad data) for the line patch that designates the “SMT” type, the host computer 1 has changed the fields corresponding to reference numerals 131 to 136. Ensure that the resulting data remains. When pad conversion is performed, for example, as shown in FIG. 5, a “black circle” mark is written in a column corresponding to the reference numeral 131 “PC”, the D code is 70 (the column corresponding to the reference numeral 132 “D”), and the shape is rectangular. (Column corresponding to 133 “SH”), X-direction size is 0.136 (column corresponding to 134 “X”), and Y-direction size is 0.136 mm (column corresponding to 135 “Y”) , It is written that the count number is 200 (a column corresponding to reference numeral 136 “CNT”).
[0052]
For the line aperture of the solid portion, “FILL” is designated as the type. In this way, when the line aperture usage list 100 is completed, the completed data is output to a file or the like (S16).
[0053]
On the other hand, in the line aperture usage list 100, the column corresponding to the reference numeral 141 “RX” and the column corresponding to the reference numeral 142 “RY” are portions for inputting correction values for the respective line apertures. In this input column, a correction value is input later by a manufacturing process designer in step S19. In this case, in the column corresponding to the reference numeral 143 “CLE”, it is possible to specify a gap value to be secured between the line aperture listed in the line aperture usage list 100 and another pattern or the like. Yes.
[0054]
As described above, by using the line aperture usage list 100, it is possible to individually specify the correction value of each line aperture in order to make the width of the pattern formed by each line aperture appropriate.
[0055]
[Generation of SMT / NC size list]
Next, processing (S17, S18) for generating a list of apertures used in pad data for surface mount components (SMT, QFP, etc.) will be described. Here, the host computer 1 generates an SMT / NC size list 200 (FIG. 7) representing numerical values (unit: mm) regarding the aperture of the pad portion. The SMT / NC size list 200 is generated as data in a format corresponding to a spreadsheet (spreadsheet software), and is displayed on the display screen of the host computer 1 as shown in FIG. In the SMT / NC size list 200, a correction value determined by the manufacturing process designer in consideration of the contents described in the SMT / NC size list 200 and the manufacturing conditions is input later. The data entry field is also included.
[0056]
First, an aperture used as pad data or the like for each layer (hereinafter referred to as QFP / NC aperture) is extracted from the result of the analysis processing in step S12. The extracted QFP / NC aperture for each layer is described in a predetermined column of the SMC / NC size list 200. Further, here, the pad interval of the extracted pad is measured by the host computer 1 based on CAD data or the like, and is described in a predetermined column.
[0057]
In the SMC / NC size list 200 of FIG. 7, two types of QFP / NC apertures are displayed as QFP / NC apertures used in the first layer in the column corresponding to the code 201 “L1”. The first QFP / NC aperture (column corresponding to the reference numeral 201a) used in the first layer has a square shape (SQ), an X-direction size of 0.100, and a Y-direction size of 0.200. Yes. Here, it is displayed that the pad interval measured for the first QFP / NC aperture is 0.150 (a column corresponding to reference numeral 220 “CLE”).
[0058]
The second QFP / NC aperture (column corresponding to the reference numeral 201b) used in the first layer has a square shape (SQ), an X-direction size of 0.120, and a Y-direction size of 0.300. It has become. Here, it is displayed that the pad interval measured for the second QFP / NC aperture is 0.180.
[0059]
Thus, when the SMT / NC size list 200 before inputting the correction value is completed, the completed data is output to a file or the like (S18).
[0060]
The SMT / NC size list 200 may also be configured to register information about pads created by the line aperture by an operation using a GUI. For example, when two vertices of a pad portion formed by a line aperture are specified on the display screen using a GUI, information such as the X direction size, Y direction size and shape of the pad portion is registered. (Refer to the column corresponding to reference numeral 201c). In this case, the actual line aperture information of the pad portion is described in the column corresponding to the reference numeral 202.
[0061]
Now, referring to the column 201c of the SMT / NC size list 200 in FIG. 7, the pad portion formed by the line aperture by the operation using the GUI has a quadrangular shape (SQ) and a size in the X direction of 0.1. 500, the Y-direction size is 1.500, and the clearance is 0.100. Referring to the part 202, the line aperture of this part is the D code 10, the shape is circular (CI), the X direction size is 0.100, the Y direction size is 0.100, and the count number is 3780. It is shown.
[0062]
On the other hand, in the SMT / NC size list 200, the column corresponding to the reference numeral 222 “RX” and the column corresponding to the reference numeral 223 “RY” are portions for inputting correction values for the respective apertures. In this input column, a correction value is input later by a manufacturing process designer in step S19. In this case, in the field corresponding to the reference numeral 224 “CLE”, it is possible to specify a gap value to be secured between the apertures listed in the SMT / NC size list 200 and other patterns. Yes.
[0063]
As described above, by using the SMT / NC size list 200, it is possible to individually specify the correction value of each aperture in order to make the width of the pattern formed by each aperture of the pad portion appropriate. Become.
[0064]
The manufacturing process designer is known as sales order information for the annular list 50, the line aperture usage list 100, and the SMT / NC size list 200 generated as data in a format corresponding to the spreadsheet as described above. The correction value is input in consideration of various conditions such as a certain construction method, material, plate thickness, copper foil thickness and the like. The correction value may be input by starting document editing software or the like on the terminal device 3 or 5 and performing editing work from the terminal device 3 or 5 side. 1 may be directly operated.
[0065]
FIG. 8 shows an example of a state where correction values are input by the manufacturing process designer in the annular ring list 50. For example, the size of the through hole of the drill 1 (the column corresponding to the reference numeral 61 “TH”) is 0.300 in the X direction and 0.300 in the Y direction. A correction value of 0.050 (a column corresponding to reference numeral 88 “RX”) and a Y-direction correction value of 0.300 (a column corresponding to reference numeral 89 “RY”) are designated.
[0066]
Further, for the drill 1, the aperture used in the first layer (the column corresponding to the reference numeral 72 “L1”) is the D code 10, the X direction size 0.600, and the Y direction size 0.600. As correction values for the aperture, a correction value in the X direction of 0.025 (a column corresponding to reference numeral 88 “RX”), a correction value in the Y direction of 0.025 (a column corresponding to reference numeral 89 “RY”), and necessary gap information 1.200 (a column corresponding to reference numeral 90 “CLE”) is designated.
[0067]
FIG. 9 shows an example of a state in which correction values are input by the manufacturing process designer in the line aperture usage list 100. For example, for a line aperture for which the type of “SIGNAL” in the first layer is set, the correction value for the X direction size is 0.010 (the column corresponding to reference numeral “RX”), and the correction value for the Y direction size is 0.010 (a column corresponding to reference numeral 142 “RY”) and 0.100 (a column corresponding to reference numeral 143 “CLE”) are designated as a necessary gap.
[0068]
FIG. 10 shows an example of a state in which a correction value is input by the manufacturing process designer in the SMT / NC size list 200. For example, for the first layer D code 21, the X direction size 0.100, and the Y direction size 0.200 aperture (the column corresponding to reference numeral 201 “L1”), the X direction size correction value is 0.020 ( A column corresponding to 222 “RX”), a correction value for the Y-direction size of 0.020 (a column corresponding to 223 “RY”), and a necessary gap of 0.130 (a column corresponding to 224 “CLE”). ) Is specified.
[0069]
When the input of the correction value by the manufacturing process designer is completed and the manufacturing data in the host computer 1 is updated, next, it is designated in the annular ring list 50, the line aperture application list 100, and the SMT / NC size list 200. The correction values are read in a batch (S20). Then, based on the read correction value, correction processing for the CAD data is performed collectively (S21). As described above, the correction can be performed using different values for X and Y, and can also be performed so that a ring-shaped aperture such as NC can be specified by inner diameter and outer diameter. . Next, a correction result is output (S22).
[0070]
After the collective correction is performed in step S21, a record indicating that the correction process has been completed is left in a predetermined column of the annular ring list 50, the line aperture list 100, and the SMT / NC size list 200. As for the annular list 50, as shown in FIG. 8, a symbol “black circle” is recorded in each column corresponding to the reference numeral 91 “C”. Similar processing is performed for the line aperture list 100 (FIG. 9) and the SMT / NC size list 200 (FIG. 10). In this way, by recording in the list when the correction processing is completed, it is possible to verify that the correction processing has been completed by displaying and printing out these lists later. The symbol indicating that the correction processing is completed is not limited to the “black circle” symbol illustrated here, and various symbols or signs may be used as long as the processing is completed.
[0071]
The manufacturing data subjected to the batch correction in step S21 is subjected to MRC (manufacturing rule check) processing (S24). As a result, correction is performed as necessary (S25), and the editing result is output. Alternatively, it may be (S26). The final correction result is output in a form that reflects both the correction result output in step S22 and the editing result output in step S26 (S23). This is used as manufacturing data in a photomask production process or the like.
[0072]
By the correction processing described above (FIG. 2), it is possible to perform automatic correction collectively for each aperture used in line data, pad data, and the like. Although not shown in the flowchart of the correction process of FIG. 2, when a predetermined clearance cannot be secured by the correction process, an automatic adjustment process for securing the clearance is further performed. Adjustment processing may be added to the correction processing in FIG. That is, first, a series of automatic correction processing from step S11 to step S21 is performed, and then the automatic adjustment processing is performed, and then the processing is performed.
[0073]
The automatic adjustment process is performed as follows, for example. FIG. 11A shows a state in which hatched portions are added to the lines L1, L2, and L3 by the correction process (FIG. 2: S11 to S21). A check process is performed to check whether or not a predetermined clearance is secured for the corrected data. For example, it is detected that the predetermined clearance is not secured in the portions d1, d2, and d3 in FIG. In some cases, the data is adjusted so that a pattern is not added to these portions. FIG. 11B shows a state in which the data is adjusted by this adjustment process so as to remove the part (shaded part) added by the correction process for the d1, d2, and d3 parts. In this way, the correction processing after the MRC processing becomes unnecessary by adopting a configuration in which automatic processing is performed in the flow of correction processing and adjustment processing.
[0074]
The flowchart of the correction processing shown in FIG. 2 is an example, and not all the steps included in the present invention are necessarily required to realize the present invention. For example, in the correction process of FIG. 2, three lists, an annular list, a line aperture list, and an SMT / NC size list, are generated based on the CAD data analysis result, and correction values can be input for each of the three lists. However, the correction processing of FIG. 2 may be configured to output only one of these lists. Needless to say, the order of the steps in the correction process of FIG. 2 can be changed as appropriate.
[0075]
【The invention's effect】
As described above, the correction processing system according to the present invention provides the manufacturing process design person with various information that can make correction instructions appropriately, and at the same time, handwriting work by the CAM editing person and the manufacturing process designer. The man-hours for creating the “Specification Confirmation” and “Correction Instruction” at the site are deleted, and the man-hours can be greatly reduced. At the same time, human error can be prevented. Since correction values can be fetched in a batch and CAD data can be collectively corrected, the processing efficiency of the correction process is greatly improved.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a printed wiring board manufacturing data correction processing system as an embodiment of the present invention.
FIG. 2 is a flowchart of a correction processing program executed by the host computer of FIG.
FIG. 3 is a diagram illustrating an information list generated in the process of the correction processing program of FIG.
4 is a diagram showing an annular list generated in the process of the correction processing program of FIG. 2. FIG.
5 is a diagram showing a line aperture usage list generated in the process of the correction processing program of FIG. 2. FIG.
6 is an example of a screen display on the host computer when the correction processing program is executed in the host computer of FIG. 1; FIG.
7 is a diagram showing an SMT / NC aperture size list generated in the process of the correction processing program of FIG. 2; FIG.
FIG. 8 is a diagram showing a state in which correction information is input in the annular list of FIG. 4;
9 is a diagram showing a state in which correction information is input in the line aperture application list of FIG.
10 is a diagram illustrating a state in which correction information is input in the SMT / NC aperture size list of FIG. 7; FIG.
FIG. 11 is a diagram for explaining a state in which adjustment processing for ensuring clearance is performed on data that has been subjected to correction processing;
[Explanation of symbols]
1 Host computer
2,3 Terminal equipment
50 Annual Ring List
100 Line aperture application list
200 SMT / NC aperture size list

Claims (13)

A correction processing system that performs correction for manufacturing based on design data indicating a pattern of a printed wiring board,
The input design data is analyzed, and information related to the pattern design specification of the design data is generated as an electronic document including a display field for information related to the pattern design specification and an input field for correction information for the information related to the pattern design specification. Design data analysis means,
A correction information receiving means comprising a user interface having a display device and an input device, and receiving the correction information by being input by the user via the input device while displaying the electronic document on the display device ;
Correction processing means for correcting the design data based on the correction information received by the correction information receiving means;
A printed wiring board design data correction processing system comprising:   The printed wiring board design data correction processing system according to claim 1, wherein the information related to the pattern design specification includes information indicating information related to annular ring for each drill.   3. The printed wiring board design data correction processing system according to claim 1, wherein the information related to the pattern design specification includes information indicating information related to apertures for line data for each layer. 4.   4. The printed wiring board design data correction processing system according to claim 1, wherein the information related to the pattern design specification includes information indicating information related to an aperture for pad data for each layer. 5. The correction processing unit is configured to perform correction on the design data after fetching all correction information input in an input field of the correction information in the electronic document. The printed wiring board design data correction processing system according to any one of claims 1 to 4 . The electronic document includes a predetermined display field for that displays that the correction processed,
Wherein the correction processing means, when finished the correction to the design data, the predetermined display field in said electronic document, claim from claim 1 to write a symbol indicating that it is a correction processed, and wherein 5 design data correction processing system of a printed wiring board according to any one of. The data of a portion where a predetermined clearance is not secured as a result of performing the correction by the correction processing means is further provided with an adjusting means for adjusting so that the predetermined clearance is secured. The printed wiring board design data correction processing system according to any one of claims 1 to 6 . A correction processing method in which a correction processing system performs correction for manufacturing based on design data indicating a pattern of a printed wiring board,
The design data input to the correction processing system is analyzed, and information related to the pattern design specification of the design data is generated as an electronic document including a display column for information related to the pattern design specification and an input column for the correction information . One step,
A second step of displaying the electronic document on a display screen of the correction processing system ;
The correction information for the information on the pattern design specifications generated and a third step of receiving the user input to the input device of the correction system,
A fourth step of correcting the design data based on the received correction information;
A printed wiring board design data correction processing method characterized by comprising: The printed wiring board design data correction processing method according to claim 8 , wherein the information related to the pattern design specification includes information indicating information related to annular ring for each drill. Information regarding the pattern design specification includes information showing the information about the aperture for the line data for each layer, the design data correction method of the printed wiring board according to claim 8 or claim 9. The information on the pattern design specifications, including information showing the information about the aperture for pad data for each layer, the design data correction method of the printed wiring board according to claim 8 according to claim 10. The method according to claims 8 to claim 11, software for execution by a computer. The method according to claims 8 to claim 11, the storage medium storing the read program executable by the CPU.

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