JP5850499B2 - Solid electrolytic capacitor - Google Patents

Description

  The present invention relates to a solid electrolytic capacitor, and more particularly to a solid electrolytic capacitor having a fuse.

  2. Description of the Related Art Conventionally, various types of solid electrolytic capacitors having a fuse that blows when an overcurrent flows are known (see, for example, Patent Documents 1 to 3).

  In Patent Documents 1 and 2, as shown in FIG. 6, a multilayer substrate 2E having upper surface electrodes 5a and 6a on the upper surface and lower surface electrodes 5c and 6c on the lower surface, and placed on the upper surface of the multilayer substrate 2E, the upper surface electrode 5a , 6a, and the exterior resin 4 provided on the upper surface side of the multilayer substrate 2E so as to cover the capacitor element 3, and the fuse 8E is connected to the upper surface electrode (upper surface cathode electrode) 6a. A solid electrolytic capacitor 1E to which is connected is disclosed. In this solid electrolytic capacitor 1E, a protective layer 12 made of silicone resin is provided on the upper surface of the fuse 8E so that the melted fuse 8E does not adhere to the cathode portion 3b of the capacitor element 3.

  Further, in Patent Document 3, as shown in FIGS. 7 and 8, solid electrolytic in which a fuse 8F is connected between an anode lead (anode portion) 3a of a capacitor element 3 and an upper surface anode electrode 5a of a multilayer substrate 2F. A capacitor 1F is disclosed. In this solid electrolytic capacitor 1F, both ends of the fuse 8F are exposed from the exterior resin 4 so that the melted fuse 8F flows out of the exterior resin 4 in order to surely blow the fuse 8F.

Japanese Patent No. 4688704 JP 2007-19054 A Japanese Patent No. 4663303

  In the solid electrolytic capacitor 1E described in Patent Documents 1 and 2, since the protective layer 12 made of silicone resin is provided in a part of the place where the conductive adhesive 10 is to be applied, the conductive adhesive 10 There is a problem in that the amount of the adhesive strength between the capacitor element 3 and the multilayer substrate 2E decreases due to a shortage of the amount. Further, in this solid electrolytic capacitor 1E, cracks are likely to occur between the protective layer 12 and the multilayer substrate 2E, or between the protective layer 12 and the exterior resin 4, and the adhesion between the multilayer substrate 2E and the exterior resin 4 is improved. There is also a problem that the adhesion strength between the capacitor element 3 and the multilayer substrate 2E is lowered.

  In the solid electrolytic capacitor 1F described in Patent Document 3, the anode lead 3a of the capacitor element 3 and the fuse 8F, and the fuse 8F and the upper surface anode electrode 5a are joined by the conductive adhesive 10 (or solder). Therefore, compared to the case where the anode lead 3a and the upper surface anode electrode 5a are joined directly or by welding via a metal strip, there is a problem that the fixing strength between the capacitor element 3 and the multilayer substrate 2F is reduced. there were.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a solid electrolytic capacitor capable of preventing a decrease in fixing strength between the capacitor element and the multilayer substrate due to the connection of the fuse. There is to do.

  In order to solve the above problems, a solid electrolytic capacitor according to the present invention includes: (1) a multilayer substrate having an upper surface electrode on the upper surface and a lower surface electrode on the lower surface; A solid electrolytic capacitor comprising a connected capacitor element and an exterior resin provided on the upper surface side of the multilayer substrate so as to cover the capacitor element, wherein the multilayer substrate is interposed between the upper surface electrode and the lower surface electrode. And further having one or more inner layer electrodes electrically connected to the upper surface electrode and the lower surface electrode, and melting and fusing when an overcurrent flows to at least one inner layer electrode of the one or more inner layer electrodes. A fuse is connected, and the electrical connection between the upper surface electrode and the lower surface electrode is interrupted by melting the fuse.

  In this configuration, since the fuse is connected to the inner layer electrode of the multilayer substrate, it is not necessary to cover the fuse with a protective layer made of a silicone resin, and peeling and cracks caused by the protective layer do not occur. Further, in this configuration, the anode part and the upper surface electrode of the capacitor element can be joined directly or by welding via a metal strip or the like. Therefore, according to this configuration, it is possible to prevent a decrease in the fixing strength between the capacitor element and the multilayer substrate due to the connection of the fuse.

  In the solid electrolytic capacitor of (1), it is preferable that (2) the multilayer substrate is provided with a space portion adjacent to the fuse so as not to be exposed from the lower surface of the multilayer substrate.

  According to this configuration, since the fuse melted by the overcurrent flows into the space, the fuse can be surely blown.

  In the solid electrolytic capacitor of (1) above, (3) when a space is provided in the multilayer substrate at a position away from the fuse, the portion between the fuse and the space of the multilayer substrate is caused by an overcurrent flowing through the fuse. It preferably has a thickness that can be deformed by heat.

  According to this configuration, the space between the fuse and the space portion of the multilayer substrate is deformed by the heat caused by the overcurrent flowing through the fuse (swells toward the space portion side), so that an open space is created around the fuse. Since the melted fuse flows into the space, the fuse can be surely blown.

  In the solid electrolytic capacitor of (3) above, for example, (4) the space portion may be exposed from the lower surface of the multilayer substrate.

  In the solid electrolytic capacitors (1) to (4) described above, for example, (5) the upper surface electrode is electrically connected to the upper surface anode electrode electrically connected to the anode portion of the capacitor and the cathode portion of the capacitor. The inner surface electrode has an inner layer anode electrode electrically connected to the upper surface anode electrode, and an inner layer cathode electrode electrically connected to the upper surface cathode electrode, and the lower surface electrode has The lower surface anode electrode electrically connected to the inner layer anode electrode and the lower surface cathode electrode electrically connected to the inner layer cathode electrode, the fuse is connected to the inner layer cathode electrode, and the fuse is connected The inner layer cathode electrode may be divided into two via a fuse.

  ADVANTAGE OF THE INVENTION According to this invention, the solid electrolytic capacitor which can prevent the fall of the adhesion strength of the capacitor | condenser element and multilayer board | substrate by connecting a fuse can be provided.

It is a sectional side view of the solid electrolytic capacitor which concerns on Example 1 of this invention. It is a top view which shows the relationship between an upper surface cathode electrode and a fuse. It is a sectional side view of the solid electrolytic capacitor which concerns on Example 2 of this invention. It is a sectional side view of the solid electrolytic capacitor which concerns on Example 3 of this invention. It is a sectional side view of the solid electrolytic capacitor which concerns on Example 4 of this invention. It is a sectional side view of the solid electrolytic capacitor in the prior art example 1 of this invention. It is a sectional side view of the solid electrolytic capacitor in the prior art example 2 of this invention. It is the sectional side view which looked at the solid electrolytic capacitor of FIG. 7 from the protrusion direction side of the anode lead. It is a figure which shows the result of having measured the adhesive strength of a capacitor | condenser element and a multilayer board | substrate in the solid electrolytic capacitor of Examples 1-4 and the prior art examples 1 and 2. FIG.

  Hereinafter, preferred embodiments of a solid electrolytic capacitor according to the present invention will be described with reference to the accompanying drawings. In the following description, the horizontal direction in FIG. 1 is the length direction, the vertical direction in FIG. 2 is the width direction, and the vertical direction in FIG. 1 is the height (thickness) direction.

[Example 1]
FIG. 1 shows a solid electrolytic capacitor 1A according to Embodiment 1 of the present invention. As shown in the figure, a solid electrolytic capacitor 1A according to the present embodiment includes a multilayer substrate 2A, a capacitor element 3 placed on the upper surface of the multilayer substrate 2A, and a multilayer substrate 2A so as to cover the capacitor element 3. And an exterior resin 4 provided on the upper surface side. The solid electrolytic capacitor 1A has a length of 2.0 mm, a width of 1.2 mm, and a height of 0.9 mm.

  Capacitor element 3 includes anode lead 3a embedded in tantalum powder, press-molded, sintered to produce a rectangular parallelepiped porous body (sintered body), and a dielectric oxide film on the surface of the produced porous body The solid electrolyte layer and the cathode lead layer 3b are sequentially formed. In the capacitor element 3, the protruding portion of the anode lead 3a corresponds to the anode portion, and the cathode lead layer 3b corresponds to the cathode portion.

  The multilayer substrate 2A is a substrate in which insulating layers and electrode layers are alternately stacked. The multilayer substrate 2A has, as electrode layers, an upper surface anode electrode 5a and an upper surface cathode electrode 6a on the upper surface, a lower surface anode electrode 5c and a lower surface cathode electrode 6c on the lower surface, and an inner layer anode electrode 5b and an inner layer cathode electrode 6b between the upper surface and the lower surface. doing. The upper surface anode electrode 5a, the inner layer anode electrode 5b, and the lower surface anode electrode 5c are electrically connected by a through hole 7 or the like. The upper surface cathode electrode 6a, the inner layer cathode electrode 6b, and the lower surface cathode electrode 6c are also electrically connected by a through hole 7 or the like.

  The upper surface anode electrode 5a is electrically connected to the anode lead 3a of the capacitor element 3 via a plate-shaped metal strip 9 made of an iron-nickel alloy. Upper surface anode electrode 5a and metal strip 9, and metal strip 9 and anode lead 3a are joined by welding such as resistance welding or laser welding. On the other hand, the upper surface cathode electrode 6 a is electrically connected to the cathode lead layer 3 b of the capacitor element 3 through the conductive adhesive 10.

  As shown in FIG. 2, the inner layer cathode electrode 6b is divided into two in the length direction, the left electrode in the figure is connected to the upper cathode electrode 6a, and the right electrode in the figure is connected to the lower cathode electrode 6c. It is connected. A fuse 8 that melts and blows when an overcurrent flows is connected between the inner layer cathode electrodes 6b. The fuse 8 is made of copper and patterned in a zigzag manner. The fuse 8 has dimensions of a total length of 3 mm, a pattern width of 20 μm, and a thickness of 16 μm. In this embodiment, when the fuse 8 is melted, the electrical connection between the upper surface cathode electrode 6a and the lower surface cathode electrode 6c is interrupted.

[Example 2]
FIG. 3 shows a solid electrolytic capacitor 1B according to the second embodiment of the present invention. As shown in the figure, the solid electrolytic capacitor 1B according to this example is the same as that of Example 1 except that the space portion 11 is provided so as to be separated from the fuse 8 and exposed from the lower surface of the multilayer substrate 2B. In common with the solid electrolytic capacitor 1A.

  The space portion 11 is a concave portion formed by dicing, and has dimensions of a length of 0.08 mm, a width of 1.2 mm, and a height (depth) of 0.01 mm. The insulating layer of the multilayer substrate 2 </ b> B between the fuse 8 and the space portion 11 has a thickness that can be deformed by heat caused by overcurrent flowing through the fuse 8.

[Example 3]
FIG. 4 shows a solid electrolytic capacitor 1C according to the third embodiment of the present invention. As shown in the figure, the solid electrolytic capacitor 1C according to this example is the same as that of Example 1 except that a space portion 11 is provided at a position that is separated from the fuse 8 and is not exposed from the lower surface of the multilayer substrate 2B. In common with the solid electrolytic capacitor 1A.

  The space 11 has dimensions of a length of 0.08 mm, a width of 1.2 mm, and a height of 0.01 mm. The space portion 11 is formed by scraping the multilayer substrate 2C to form a space having a length of 0.08 mm, a width of 1.2 mm, and a height of 0.02 mm. The space has a length of 0.08 mm and a width of 1.2 mm or more. The polyimide tape is formed by inserting a polyimide tape having a height of 0.01 mm, sealing with a liquid resin, curing the liquid resin, and then pulling out the polyimide tape.

  The insulating layer of the multilayer substrate 2 </ b> C between the fuse 8 and the space portion 11 has a thickness that can be deformed by heat due to overcurrent flowing through the fuse 8. In this embodiment, even if the insulating layer of the multilayer substrate 2C between the fuse 8 and the space portion 11 is broken, the space portion 11 is not exposed from the lower surface of the multilayer substrate 2C. It is possible to store a melted fuse.

[Example 4]
FIG. 5 shows a solid electrolytic capacitor 1D according to Embodiment 4 of the present invention. As shown in the figure, the solid electrolytic capacitor 1D according to this example is similar to the example 1 except that a space portion 11 is provided at a position adjacent to the fuse 8 and not exposed from the lower surface of the multilayer substrate 2D. In common with the solid electrolytic capacitor 1A.

  The space portion 11 is a space formed by the same method as in the third embodiment, and has dimensions of a length of 0.08 mm, a width of 1.2 mm, and a height of 0.01 mm.

[Conventional example 1]
FIG. 6 shows a solid electrolytic capacitor 1E in Conventional Example 1. As shown in the figure, the solid electrolytic capacitor 1E in Conventional Example 1 is provided with a fuse 8E connected to the upper surface cathode electrode 6a and a protective layer 12 made of silicone resin covering the upper surface of the fuse 8E. This is the same as the solid electrolytic capacitor 1A of the first embodiment except that the inner layer anode electrode 5b and the inner layer cathode electrode 6b are not provided on the multilayer substrate 2E.

[Conventional example 2]
FIG. 7 shows a solid electrolytic capacitor 1F in Conventional Example 2. As shown in the figure, in the solid electrolytic capacitor 1F in Conventional Example 2, the fuse 8F is connected between the anode lead 3a and the upper surface anode electrode 5a of the capacitor element 3, and the protective layer 12 made of silicone resin. Is the same as the solid electrolytic capacitor 1E in the conventional example 1 except that is not provided.

  In the solid electrolytic capacitor 1 </ b> F in Conventional Example 2, the anode lead 3 a and the fuse 8 </ b> F, and the fuse 8 </ b> F and the upper surface anode electrode 5 a are joined by the conductive adhesive 10. The fuse 8F is made of a tin-silver-copper alloy formed in a plate shape, and both ends thereof are exposed from the exterior resin 4 as shown in FIG.

[Comparative Experiment 1]
In comparative experiment 1, solid electrolytic capacitors 1A to 1F of Examples 1 to 4 and Conventional Examples 1 and 2 (rated voltage of 10 V, rated capacity of 47 μF) were mounted on an evaluation board with solder, and solids were formed by a push-pull gauge. The adhesion strength of the multilayer substrates 2A to 2F and the exterior resin 4 (capacitor element 3) was measured by pulling the electrolytic capacitors 1A to 1F and peeling the exterior resin 4 of the solid electrolytic capacitors 1A to 1F from the multilayer substrates 2A to 2F. . In Comparative Experiment 1, the adhesion strength of each of the twelve solid electrolytic capacitors 1A to 1F was measured.

  As shown in FIG. 9, the average value of the fixing strength is 24.9N for the solid electrolytic capacitor 1A of Example 1, 23.9N for the solid electrolytic capacitor 1B of Example 2, and 23 for the solid electrolytic capacitor 1C of Example 3. The solid electrolytic capacitor 1D of Example 4 was 22.2N, whereas the solid electrolytic capacitor 1E of Conventional Example 1 was 13.2N, and the solid electrolytic capacitor 1F of Conventional Example 2 was 11.1N. It was. That is, the solid electrolytic capacitors 1E and 1F of the conventional examples 1 and 2 had lower fixing strength than the solid electrolytic capacitors 1A to 1D of Examples 1 to 4.

  The solid electrolytic capacitor 1E of Conventional Example 1 has a low fixing strength because the solid electrolytic capacitor 1E should be coated with the conductive adhesive 10 that joins the cathode lead layer 3b of the capacitor element 3 and the upper surface cathode electrode 6a. Since the protective layer 12 made of silicone resin is formed in a part of the place, the amount of the conductive adhesive 10 is insufficient and the adhesion between the capacitor element 3 and the multilayer substrate 2E is lowered. And the peripheral materials (the exterior resin 4 and the multilayer substrate 2E) are different in thermal expansion coefficient between the protective layer 12 and the multilayer substrate 2E and the protective layer 12 and the exterior resin 4 during the heat treatment and reflow in the process. It is thought that cracks and peeling occurred during the period.

  The solid electrolytic capacitor 1F of Conventional Example 2 has a low fixing strength because in the solid electrolytic capacitor 1F, the anode lead 3a and the fuse 8F, and the fuse 8F and the upper surface anode electrode 5a are joined by the conductive adhesive 10. Compared with the solid electrolytic capacitors 1A to 1D of Examples 1 to 4 in which the anode lead 3a and the upper surface anode electrode 5a are joined by welding via the metal strip 9, the capacitor element 3 and the multilayer substrate 2F are more closely attached. This is thought to be due to a decline in sex.

[Comparative Experiment 2]
In Comparative Experiment 2, a combustion test was performed on the solid electrolytic capacitors 1A to 1F of Examples 1 to 4 and Conventional Examples 1 and 2, and the number of burned products (solid electrolytic capacitors 1A to 1F) and The mounting board was checked for contamination. In the combustion test, a reverse voltage of 5V (limit current 2A) was applied to 100 solid electrolytic capacitors 1A to 1F for 1 minute.

  As shown in Table 1, in the solid electrolytic capacitor 1E of Conventional Example 1, 39 out of 100 burned, whereas in Solid Electrolytic Capacitor 1A of Example 1, 33 out of 100 burned, and Conventional Example 2 In the solid electrolytic capacitors 1B to 1D and 1F of Examples 2 to 4, combustion was not confirmed. Further, in the solid electrolytic capacitor 1F of the conventional example 2, contamination of the mounting substrate was confirmed, whereas in the solid electrolytic capacitors 1A to 1E of the conventional example 1 and Examples 1 to 4, contamination of the mounting substrate was confirmed. There wasn't.

  Combustion was confirmed in some solid electrolytic capacitors 1E and 1A among the solid electrolytic capacitors 1E and 1A of Conventional Example 1 and Example 1 because the fuses 8E and 8 did not function sufficiently during the combustion test. Conceivable. Specifically, in the solid electrolytic capacitor 1E of the conventional example 1, the fuse 8E is surrounded by the protective layer 12 and the insulating layer of the multilayer substrate 2E. In the solid electrolytic capacitor 1A of the first example, the fuse 8 is the multilayer substrate. This is probably because the melted fuses 8E, 8 are not escaped because they are surrounded by the 2A insulating layer, and the fuses 8E, 8 are not melted, or the melted fuses 8E, 8 are fused again. On the other hand, among the solid electrolytic capacitors 1E and 1A of the conventional example 1 and the first embodiment, the remaining solid electrolytic capacitors 1E and 1A were not confirmed to be combusted because of the heat generated in the fuses 8E and 8 and the multilayer substrate 2E It is considered that 2A is slightly deformed to form a space in the vicinity of the fuses 8E and 8, the melted fuses 8E and 8 flow into the space, and the fuses 8E and 8 are blown.

  The reason why the combustion was not confirmed at all in the solid electrolytic capacitors 1B to 1D of Examples 2 to 4 is considered that the fuse 8 functions stably. Specifically, in the solid electrolytic capacitor 1D of the fourth embodiment, it is considered that the fuse 8 was blown by the molten fuse 8 flowing into the space portion 11, and in the solid electrolytic capacitors 1B and 1C of the second and third embodiments, The insulating layers of the multilayer substrates 2B and 2C between the fuse 8 and the space portion 11 swell to the space portion 11 side due to the heat generated by the fuse 8, creating a space opened around the fuse 8, and melting in the space This is considered to be because the fuse 8 was blown by the flow of the fuse 8 that had been melted.

  The solid electrolytic capacitor 1F according to the conventional example 2 did not show any combustion at all. In the solid electrolytic capacitor 1F, both ends of the fuse 8F are exposed from the exterior resin 4, so that the melted fuse 8F is outside the exterior resin 4. This is considered to be because the fuse 8F was blown out by flowing into the area.

  In addition, it was considered that the mounting substrate was contaminated by the solid electrolytic capacitor 1F of Conventional Example 2 because the molten fuse 8F flowed out of the exterior resin 4 as described above.

  After all, according to the solid electrolytic capacitors 1A to 1D of Examples 1 to 4, it is possible to prevent a decrease in the fixing strength between the capacitor element 3 and the multilayer substrates 2A to 2D due to the connection of the fuse 8. Furthermore, according to the solid electrolytic capacitors 1B to 1D of Examples 2 to 4, since the space 11 is formed, the fuse 8 can be surely blown without causing contamination of the mounting substrate.

  As mentioned above, although the preferable Example of the solid electrolytic capacitor which concerns on this invention was described, this invention is not limited to said each Example.

  In each of the above embodiments, the fuse 8 has a total length of 3 mm, a pattern width of 20 μm, and a thickness of 16 μm, but the total length, pattern width, and thickness can be arbitrarily changed according to the fusing characteristics.

  In each of the above embodiments, the fuse 8 is connected to the inner layer cathode electrode 6b. However, the fuse 8 may be connected to the inner layer anode electrode 5b, and the multilayer substrates 2A to 2D have four or more electrode layers (2 In the case of having an inner layer electrode equal to or more than one layer, the fuse 8 may be connected to at least one of the inner layer anode electrode 5b and the inner layer cathode electrode 6b.

  Although the position of the fuse 8 can be arbitrarily changed, from the viewpoint of securing the space 11, the center in the length direction between the through hole 7 connected to the upper surface cathode electrode 6 a and the lower surface cathode electrode 6 c is preferable. The shape of the fuse 8 can also be arbitrarily changed. For example, a shape that is a straight line, a combination of a straight line and a spell fold, a shape in which a part thereof is partially narrowed, or the like can be considered.

  The fuse 8 may be formed by etching a part of the inner layer cathode electrode 6b or the inner layer anode electrode 5b, or formed of a material different from the inner layer cathode electrode 6b or the inner layer anode electrode 5b. It may be. As a material of the fuse 8, not only copper but also any hot-melt metal such as aluminum, gold, and other alloys can be used.

  Moreover, in the said Examples 2-4, the space part 11 of the dimension of length 0.08mm, width 1.2mm, and height 0.01mm is formed between the fuse 8 and the lower surface of multilayer substrate 2B-2D. However, if the melted fuse 8 flows into the space portion 11 or a space opened around the fuse 8 by heat due to overcurrent flowing through the fuse 8, the size, position, and shape of the space portion 11 are arbitrary. Can be changed. For example, the position of the space 11 may be above the fuse 8 or on the same plane of the fuse 8.

  As a manufacturing method of the space portion 11, any method can be adopted, and for example, a method using laser or mechanical cutting can be adopted.

  The space portion 11 may not be a cavity, and for example, a pore material or a heat shrink material may be provided in the space portion 11.

  Further, in each of the above embodiments, a tantalum sintered body is used as the material of the capacitor element 3, but a valve action metal sintered body such as niobium or aluminum or a roughened foil-like valve action metal may be used. Good. In the case of a foil-like valve action metal, for example, an electrochemically etched surface of an aluminum foil having a thickness of 0.1 mm can be used.

1A to 1F Solid electrolytic capacitors 2A to 2F Multilayer substrate 3 Capacitor element 3a Anode lead (anode portion)
3b Cathode extraction layer (cathode part)
4 exterior resin 5a upper surface anode electrode 5b inner layer anode electrode 5c lower surface anode electrode 6a upper surface cathode electrode 6b inner layer cathode electrode 6c lower surface cathode electrode 7 through hole 8, 8E, 8F fuse 9 metal strip 10 conductive adhesive 11 space 12 protection layer

Claims (5)

A multilayer substrate having a top electrode on the top surface and a bottom electrode on the bottom surface;
A capacitor element mounted on the upper surface of the multilayer substrate and electrically connected to the upper surface electrode;
An exterior resin provided on the upper surface side of the multilayer substrate so as to cover the capacitor element;
A solid electrolytic capacitor comprising:
The multilayer substrate further includes one or more inner layer electrodes electrically connected to the upper surface electrode and the lower surface electrode between the upper surface electrode and the lower surface electrode,
A fuse that melts and blows when an overcurrent flows is connected to at least one of the one or more inner layer electrodes. When the fuse is blown, the upper surface electrode and the lower surface electrode Solid electrolytic capacitor characterized in that electrical connection with is cut off.   The solid electrolytic capacitor according to claim 1, wherein the multilayer substrate is provided with a space portion adjacent to the fuse so as not to be exposed from the lower surface of the multilayer substrate. The multilayer board is provided with a space at a position away from the fuse,
2. The solid electrolytic capacitor according to claim 1, wherein a portion between the fuse and the space portion of the multilayer substrate has a thickness that is deformed by heat due to an overcurrent flowing through the fuse. .   The solid electrolytic capacitor according to claim 3, wherein the space portion is exposed from a lower surface of the multilayer substrate. The upper surface electrode has an upper surface anode electrode electrically connected to the anode portion of the capacitor, and an upper surface cathode electrode electrically connected to the cathode portion of the capacitor,
The inner layer electrode has an inner layer anode electrode electrically connected to the upper surface anode electrode, and an inner layer cathode electrode electrically connected to the upper surface cathode electrode,
The lower surface electrode has a lower surface anode electrode electrically connected to the inner layer anode electrode, and a lower surface cathode electrode electrically connected to the inner layer cathode electrode,
The fuse is connected to the inner layer cathode electrode;
5. The solid electrolytic capacitor according to claim 1, wherein the inner layer cathode electrode to which the fuse is connected is divided into two via the fuse.

Images