JP5848114B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- JP5848114B2 JP5848114B2 JP2011278026A JP2011278026A JP5848114B2 JP 5848114 B2 JP5848114 B2 JP 5848114B2 JP 2011278026 A JP2011278026 A JP 2011278026A JP 2011278026 A JP2011278026 A JP 2011278026A JP 5848114 B2 JP5848114 B2 JP 5848114B2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting device
- recess
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 claims description 58
- 239000011347 resin Substances 0.000 claims description 58
- 238000007789 sealing Methods 0.000 claims description 26
- 229920002050 silicone resin Polymers 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000012463 white pigment Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000004408 titanium dioxide Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
Landscapes
- Led Device Packages (AREA)
Description
また、発光素子近傍のクラック発生により、発光素子から発せられた光が反射または減衰させられ、発光装置の光取り出し効率が低下する等の問題が発生していた。
実施例1の発光装置1の評価のため、比較例の発光装置を製造して、これらの比較評価を行った。
11 ハウジング
13 リードフレーム
15 LED素子
17 凹部
17A 底面
17B 内側面
18A 素子搭載領域
18B リセス
19 ボンディングワイヤ
20 素子埋設部
21 緩衝部
22 素子搭載部
23 封止部
25 突起
Claims (8)
- 光放射面側に凹部を備えたハウジングと、
前記凹部の底面に配された素子搭載領域に搭載された発光素子と、
前記凹部内に前記発光素子を埋設するように充填されている樹脂からなる素子埋設部と、を有し、
前記素子埋設部は、前記発光素子を包含する封止部、及び前記封止部の樹脂よりも硬度の小さい樹脂からなる緩衝部からなり、
前記緩衝部は、前記発光素子と前記凹部の内側面との間の領域に、前記発光素子と離間して配されていることを特徴とする発光装置。 - 前記緩衝部は前記素子搭載領域の上面以上の高さまで形成されていることを特徴とする請求項1に記載の発光装置。
- 前記凹部の底部は、前記凹部の底面から突出する素子搭載部と、前記素子搭載部を囲堯するリセス部とからなり、
前記素子搭載領域は、前記素子搭載部上に設けられ、前記緩衝部は前記リセス部を充填するように形成されていることを特徴とする請求項1または2に記載の発光装置。 - 前記緩衝部の少なくとも一部が、前記発光素子の上面を含む平面内に存在していることを特徴とする請求項1乃至3のいずれか1項に記載の発光装置。
- 前記素子搭載領域の周縁部に設けられた突起を有し、前記緩衝部は前記発光素子に対し、前記突起の外側に配置されていることを特徴とする請求項1乃至4のいずれか1項に記載の発光蔵置。
- 前記発光素子は前記ハウジング表面に形成された電極にボンディングワイヤによって接続され、前記封止部は前記発光素子及び前記ボンディングワイヤを包含することを特徴とする請求項1乃至5のいずれか1項に記載の発光装置。
- 前記緩衝部が、前記凹部の前記底面及び前記内側面に接しているリング構造を形成していることを特徴とする請求項1乃至6のいずれか1項に記載の発光装置。
- 前記緩衝部は、JIS−A硬度規格において20〜50の範囲の硬度を有するシリコーン樹脂からなることを特徴とする請求項1乃至7のいずれか1項に記載の発光装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011278026A JP5848114B2 (ja) | 2011-12-20 | 2011-12-20 | 発光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011278026A JP5848114B2 (ja) | 2011-12-20 | 2011-12-20 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013131519A JP2013131519A (ja) | 2013-07-04 |
JP5848114B2 true JP5848114B2 (ja) | 2016-01-27 |
Family
ID=48908878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011278026A Expired - Fee Related JP5848114B2 (ja) | 2011-12-20 | 2011-12-20 | 発光装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5848114B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9966515B2 (en) | 2015-12-26 | 2018-05-08 | Nichia Corporation | Light emitting device and method of manufacturing the light emitting device |
JP6555243B2 (ja) | 2016-12-16 | 2019-08-07 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
JP6555242B2 (ja) * | 2016-12-16 | 2019-08-07 | 日亜化学工業株式会社 | 発光装置および発光装置の製造方法 |
US10411169B2 (en) | 2017-02-03 | 2019-09-10 | Nichia Corporation | Light emitting device having leads in resin package |
US10615319B2 (en) | 2017-10-20 | 2020-04-07 | Nichia Corporation | Light emitting device |
JP7212241B2 (ja) | 2018-06-21 | 2023-01-25 | 日亜化学工業株式会社 | 発光装置 |
JP7181459B2 (ja) * | 2018-11-22 | 2022-12-01 | 日亜化学工業株式会社 | 発光装置 |
JP7181489B2 (ja) * | 2019-01-31 | 2022-12-01 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP6974746B2 (ja) * | 2019-01-31 | 2021-12-01 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US11417808B2 (en) | 2019-09-12 | 2022-08-16 | Nichia Corporation | Light emitting device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4774201B2 (ja) * | 2003-10-08 | 2011-09-14 | 日亜化学工業株式会社 | パッケージ成形体及び半導体装置 |
WO2005043636A1 (ja) * | 2003-11-04 | 2005-05-12 | Shin-Etsu Handotai Co., Ltd. | 発光素子 |
US8735920B2 (en) * | 2006-07-31 | 2014-05-27 | Cree, Inc. | Light emitting diode package with optical element |
JP2008060344A (ja) * | 2006-08-31 | 2008-03-13 | Toshiba Corp | 半導体発光装置 |
-
2011
- 2011-12-20 JP JP2011278026A patent/JP5848114B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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JP2013131519A (ja) | 2013-07-04 |
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