JP5840704B2 - フィルムウェブに第1のフィルムを打抜きラミネートする方法 - Google Patents
フィルムウェブに第1のフィルムを打抜きラミネートする方法 Download PDFInfo
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- JP5840704B2 JP5840704B2 JP2013552867A JP2013552867A JP5840704B2 JP 5840704 B2 JP5840704 B2 JP 5840704B2 JP 2013552867 A JP2013552867 A JP 2013552867A JP 2013552867 A JP2013552867 A JP 2013552867A JP 5840704 B2 JP5840704 B2 JP 5840704B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/20—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of continuous webs only
- B32B37/203—One or more of the layers being plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/06—Embossing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
- B32B38/185—Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
- B32B2038/042—Punching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1808—Handling of layers or the laminate characterised by the laying up of the layers
- B32B38/1816—Cross feeding of one or more of the layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Description
2,62 第2のフィルム/プラスチックフィルム
3 第3のフィルム
5,65 ローラ
6,12,66 工具
7,13 ベース面
8,18,78 残留フィルム
9 巻上げローラ
10 1回ラミネートされたフィルム
16,26,56 ラミネート
17 ラミネートローラ
33,63 サーチホール
34,64 切欠き/エンボス加工部
35,36 ラミネートされた切欠き
67 支持体
68 パンチ
69 ダイ
70 ガイドピン
71 加熱装置
72 セグメント
Claims (12)
- 少なくとも2つのフィルム(1,2,3,31,61,62)からラミネート(10,16,26,56)を製造する方法であって、少なくとも1つの第1のフィルム(1,31,61)を、特定構造を有するように形成し、次いで少なくとも1つの第2のフィルム(2,3,62)によってラミネートする方法において、
少なくとも1つの第2のフィルム(2,3,62)を、少なくとも1つの工具(6,12,66)を用いてただ1つの作業ステップにおいて打ち抜き、かつ同時に、特定構造を備えた第1のフィルム(1,31,61)とラミネートさせ、この際に前記フィルム(1,2,3,31,61,62)を少なくとも時々、前記少なくとも1つの工具(6,12,66)に向かって搬送させ、
打抜きラミネート作業の前に、第1のフィルム(1,31,61)に、位置決めマーキングとしてのサーチホール(33,63)を打ち抜き、少なくとも1つの第2のフィルム(2,3,62)が前記少なくとも1つの工具(6,12,66)によって打ち抜かれて、特定構造を備えた第1のフィルム(1,31,61)とラミネートされる前に、前記少なくとも1つの工具(6,12,66)が、少なくとも1つのガイドピン(70)で前記サーチホール(33,63)内に係合し、これによって第1のフィルム(1,31,61)に対して位置決めされることを特徴とする、ラミネートを製造する方法。 - 第1のフィルム(1,31,61)を、特に打抜きラミネート作業の前に、エンボス加工及び/又は打抜きによって特定構造を有するように形成する、請求項1記載の方法。
- 打抜きラミネート作業の前に、単数の平らな第2のフィルム(2,3,62)又は複数の平らな第2のフィルム(2,3,62)を、特定構造を有するように形成しない、請求項1又は2記載の方法。
- 第1のフィルム(1,31,61)と少なくとも1つの第2のフィルム(2,3,62)とを、部分的に互いに平行に方向付け、好ましくは少なくとも各2つのローラを介して搬送し、この場合、前記フィルム(1,2,3,31,61,62)を、互いに平行に方向付けられた領域において、打抜きラミネートし、前記フィルム(1,2,3,31,61,62)を、好ましくは1mm〜30mmの間隔をおいて、特に好ましくは5mm〜15mmの間隔をおいて、極めて好ましくは10mmの間隔をおいて、互いに平行に方向付ける、請求項1から3までのいずれか1項記載の方法。
- 少なくとも2つの第2のフィルム(2,3,62)を、第1のフィルム(1,31,61)に打抜きラミネートし、この際に第2のフィルム(2,3,62)の打抜きラミネート作業を、相前後して及び/又は対を成して両側において行う、請求項1から4までのいずれか1項記載の方法。
- 第1及び第2のフィルム(1,2,3,31,61,62)として、少なくとも1つの無端のフィルム(1,2,3,31,61,62)を使用し、好ましくはすべてのフィルム(1,2,3,31,61,62)を無端のフィルム(1,2,3,31,61,62)として加工する、請求項1から5までのいずれか1項記載の方法。
- 前記フィルム(1,2,3,31,61,62)を熱によって互いに接着させる、請求項1から6までのいずれか1項記載の方法。
- 第1のフィルム(1,31,61)として金属フィルム(31,61)を使用し、かつ/又は、単数の第2のフィルム(2,3,62)として又は複数の第2のフィルム(2,3)として、1つのプラスチックフィルム(62)又は複数のプラスチックフィルム(62)を使用する、請求項1から7までのいずれか1項記載の方法。
- 請求項1から8までのいずれか1項記載の方法によってラミネート(10,16,26,56)を製造する装置であって、
該装置は、1つの第1のフィルム(1,31,61)及び少なくとも1つの第2のフィルム(2,3,62)を搬送及びラミネート加工するのに適していて、前記フィルム(1,2,3,31,61,62)は、部分的に互いに平行に方向付けられており、この場合前記装置は少なくとも1つの工具(6,12,66)を有し、該工具(6,12,66)によって少なくとも1つの第2のフィルム(2,3,62)は、第1のフィルム(1,31,61)に打抜きラミネート可能であり、
前記工具(6,12,66)は、該工具(6,12,66)を第1のフィルム(1,31,61)のサーチホール(33,63)に位置決めする少なくとも1つのガイドピン(70)を有することを特徴とする、ラミネートを製造する装置。 - 好ましくは、前記フィルム(1,2,3,31,61,62)の、前記工具(6,12,66)の打抜き工具(68)とは反対の側に配置されている、ラミネート面(7,13)及び/又は支持体(67)が、加熱可能であり、好ましくは、前記工具(6,12,66)は、前記ラミネート面(7,13)を加熱する加熱装置(71)、特に電気式の加熱装置(71)を有する、請求項9記載の装置。
- 第1のフィルム(1,31,61)は金属フィルム(31,61)であり、単数の第2のフィルム(2,3,62)はプラスチックフィルム(62)であり、又は複数の第2のフィルム(2,3)はプラスチックフィルム(62)である、請求項9又は10記載の装置。
- 単数又は複数の前記工具(6,12,66)は、前記フィルム(1,2,3,31,61,62)が互いに平行に方向付けられている単数又は複数の領域に配置されており、かつ/又は前記少なくとも1つの工具(6,12,66)は、打抜きエッジ及びラミネート面(7,13)を有する、請求項9から11までのいずれか1項記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011010984.6 | 2011-02-10 | ||
DE102011010984A DE102011010984B4 (de) | 2011-02-10 | 2011-02-10 | Verfahren zum partiellen Laminieren von flexiblen Substraten |
PCT/EP2012/000154 WO2012107157A1 (de) | 2011-02-10 | 2012-01-16 | Verfahren zum stanz-laminieren einer ersten folie auf eine folienbahn |
Publications (2)
Publication Number | Publication Date |
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JP2014509275A JP2014509275A (ja) | 2014-04-17 |
JP5840704B2 true JP5840704B2 (ja) | 2016-01-06 |
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Application Number | Title | Priority Date | Filing Date |
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JP2013552867A Active JP5840704B2 (ja) | 2011-02-10 | 2012-01-16 | フィルムウェブに第1のフィルムを打抜きラミネートする方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20130316122A1 (ja) |
EP (1) | EP2673138B1 (ja) |
JP (1) | JP5840704B2 (ja) |
CN (1) | CN103502008B (ja) |
DE (1) | DE102011010984B4 (ja) |
DK (1) | DK2673138T3 (ja) |
WO (1) | WO2012107157A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102011103598B4 (de) * | 2011-05-30 | 2017-04-06 | Heraeus Deutschland GmbH & Co. KG | Laminat zur Herstellung eines Schalters |
CN103895318B (zh) * | 2012-12-31 | 2015-12-23 | 固笙企业有限公司 | 金属件与绝缘件的冲压及黏合方法 |
DE102014104819A1 (de) | 2014-03-26 | 2015-10-01 | Heraeus Deutschland GmbH & Co. KG | Träger und/oder Clip für Halbleiterelemente, Halbleiterbauelement und Verfahren zur Herstellung |
SI3506468T1 (sl) * | 2015-04-30 | 2021-12-31 | voestalpine Automotive Components, Dettingen GmbH & Co. KG, | Naprava in postopek za povezovanje delov pločevine v paket pločevine |
US10741519B2 (en) | 2016-07-11 | 2020-08-11 | Laird Technologies, Inc. | Systems of applying materials to components |
EP3316457A1 (de) * | 2016-10-27 | 2018-05-02 | voestalpine Automotive Components Deutschland GmbH | Vorrichtung und verfahren zum verbinden von blechteilen zu einem blechpaket |
US11141823B2 (en) * | 2018-04-28 | 2021-10-12 | Laird Technologies, Inc. | Systems and methods of applying materials to components |
DE102018124540A1 (de) * | 2018-10-04 | 2020-04-09 | Adient Engineering and IP GmbH | Verfahren zur herstellung eines bezugsmaterials für einen bezug, bezugsmaterial für einen bezug, sowie fahrzeugsitz |
CN110510446A (zh) * | 2019-06-26 | 2019-11-29 | 浙江商业职业技术学院 | 一种基于物联网的led灯贴胶带装置 |
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JPS5555556A (en) * | 1978-09-29 | 1980-04-23 | Hakutou Kk | Device for adhering non-conductivity tape having plating hole to metallic tape blank |
DE3803997A1 (de) * | 1988-02-10 | 1989-08-24 | Held Kurt | Vorrichtung zur kontinuierlichen herstellung von multilayer-leiterplatten |
FR2673041A1 (fr) | 1991-02-19 | 1992-08-21 | Gemplus Card Int | Procede de fabrication de micromodules de circuit integre et micromodule correspondant. |
USRE35353E (en) * | 1991-05-16 | 1996-10-22 | Shinko Electric Ind. Co, Ltd. | Process for manufacturing a multi-layer lead frame |
JP3051247B2 (ja) * | 1992-01-16 | 2000-06-12 | オークマ株式会社 | 配線用電線のネーマ取付方法 |
JPH0774302A (ja) * | 1993-09-01 | 1995-03-17 | Hitachi Cable Ltd | 多層リードフレームの製造方法 |
EP0656310B1 (de) * | 1993-12-02 | 1998-08-12 | W.C. Heraeus GmbH | Verfahren und Vorrichtung zur Herstellung eines Folienverbundes |
DE4411618A1 (de) * | 1994-04-02 | 1995-10-05 | Heraeus Gmbh W C | Verfahren und Vorrichtung zur Herstellung eines Folienverbundes |
DE4442920C2 (de) * | 1994-12-02 | 2001-02-22 | Heraeus Gmbh W C | Verfahren zur Herstellung eines Folienverbundes |
KR100204098B1 (ko) * | 1995-10-25 | 1999-06-15 | 이해규 | 리이드 프레임 테이핑 장치 및 테이핑 방법 |
JP3931330B2 (ja) * | 2001-09-14 | 2007-06-13 | ソニー株式会社 | 熱プレス用プレートおよびカード製造装置 |
JP2006165193A (ja) * | 2004-12-06 | 2006-06-22 | Denso Corp | 中空積層型圧電素子及びその製造方法 |
JPWO2006103715A1 (ja) * | 2005-03-25 | 2008-09-04 | Jsr株式会社 | 偏光板の製造方法及び偏光板の製造装置 |
DE102005044001B3 (de) * | 2005-09-14 | 2007-04-12 | W.C. Heraeus Gmbh | Laminiertes Substrat für die Montage von elektronischen Bauteilen |
EP2100730A1 (en) * | 2008-03-14 | 2009-09-16 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Laminating device and laminating method |
-
2011
- 2011-02-10 DE DE102011010984A patent/DE102011010984B4/de active Active
-
2012
- 2012-01-16 US US13/984,570 patent/US20130316122A1/en not_active Abandoned
- 2012-01-16 CN CN201280008419.0A patent/CN103502008B/zh active Active
- 2012-01-16 EP EP12703435.3A patent/EP2673138B1/de active Active
- 2012-01-16 WO PCT/EP2012/000154 patent/WO2012107157A1/de active Application Filing
- 2012-01-16 DK DK12703435.3T patent/DK2673138T3/en active
- 2012-01-16 JP JP2013552867A patent/JP5840704B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
EP2673138B1 (de) | 2015-03-04 |
JP2014509275A (ja) | 2014-04-17 |
CN103502008A (zh) | 2014-01-08 |
DE102011010984B4 (de) | 2012-12-27 |
DE102011010984A1 (de) | 2012-08-16 |
DK2673138T3 (en) | 2015-05-26 |
WO2012107157A1 (de) | 2012-08-16 |
EP2673138A1 (de) | 2013-12-18 |
CN103502008B (zh) | 2016-02-24 |
US20130316122A1 (en) | 2013-11-28 |
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