JP5834210B2 - Maintenance method for component mounting equipment - Google Patents

Description

  The present invention relates to a maintenance method for a component mounting apparatus in which components are vacuum-sucked by a suction nozzle and mounted on a substrate.

  The component mounting apparatus has a configuration in which a suction nozzle is detachably attached to a nozzle mounting member of a movable mounting head, and via a pressure line extending from the inside of the nozzle mounting member to the outside of the nozzle mounting member. By switching and supplying the negative pressure and the positive pressure into the suction nozzle, the component is attached to the substrate by vacuum suction of the component by the suction nozzle and detachment of the component on the substrate. In such a component mounting apparatus, if foreign matter such as dust or dust sucked from the suction nozzle during vacuum suction of the component accumulates in the pressure line, the suction force of the component is reduced and a suction error is likely to occur. It is necessary to periodically perform maintenance work to remove foreign matter such as dust and dirt sucked in. This maintenance work is usually performed by supplying a positive pressure into the pressure line and blowing out foreign matter adhering to the pressure line from the tip opening of the suction nozzle (for example, Patent Document 1).

JP-A-5-185390

  However, if dirt or dust that has been sucked up accumulates in the pressure pipe and foreign matter having a large outer diameter is formed in the pressure pipe, the above-mentioned conventional maintenance method removes the foreign matter to the opening at the tip of the suction nozzle. However, there is a problem in that foreign matter continues to remain in the pressure pipe and the suction force is reduced, and a suction error may easily occur.

  Accordingly, the present invention provides a component mounting that prevents foreign matter from remaining in the pressure line that extends from the inside of the nozzle mounting member to the outside of the nozzle mounting member, thereby reducing the frequency of occurrence of suction mistakes. It is an object of the present invention to provide an apparatus maintenance method.

The maintenance method of the component mounting apparatus according to claim 1, wherein the suction nozzle is detachably attached to the nozzle attachment member provided in the movable attachment head, and the pressure pipe extends from the inside of the nozzle attachment member through the outside of the nozzle attachment member. Maintenance method for component mounting equipment that mounts components on the board by vacuum suction of the parts by the suction nozzle and detachment of parts on the board by switching and supplying negative pressure and positive pressure into the suction nozzle through the path A nozzle removing step for removing the suction nozzle from the nozzle mounting member of the mounting head, and supplying the positive pressure into the pressure pipe with the suction nozzle removed from the nozzle mounting member of the mounting head. a blowing step for discharging the foreign material within the external nozzle mounting member seen including, the blowing step is removed the suction nozzle Nozzle mounting member of the state is performed in a state of moving a mounting head so once adsorbed component is positioned above the component disposal unit which is discarded by the suction nozzle.

  In the present invention, the suction nozzle is attached to the mounting head in the blowing step of supplying positive pressure to the pressure line extending from the inside of the nozzle attachment member through the outside of the nozzle attachment member and discharging foreign matter in the pressure line to the outside. This is done in a state where it is removed from the nozzle mounting member, and foreign objects with an outer diameter larger than the inner diameter of the pipe line in the suction nozzle can be discharged, so that large foreign substances continue to remain in the pressure pipe line. Can be prevented, and the frequency of occurrence of adsorption mistakes can be reduced by preventing a decrease in adsorption power. In addition, the blow process is performed in a state where the mounting head is moved so that the nozzle mounting member with the suction nozzle removed is positioned above the component disposal unit, so that foreign matters are not generated during the blow process. It is possible to prevent a situation in which it is scattered around.

Configuration diagram of component mounting apparatus according to an embodiment of the present invention FIG. 3 is a main part configuration diagram of a component mounting apparatus according to an embodiment of the present invention. The flowchart which shows the execution procedure of the component mounting operation | work by the component mounting apparatus in embodiment of this invention The figure which shows the state which is performing the maintenance operation | work of the component mounting apparatus in embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting apparatus 1 shown in FIG. 1 repeatedly performs an operation of mounting a component 4 using an electrode 3 on a substrate 2 as a component mounting target site, a conveyor mechanism 11 provided on a base (not shown), and component supply A mounting head 14 movably provided above the conveyor mechanism 11 by a head moving robot 13 composed of a plurality of parts feeders 12 and a Cartesian coordinate robot, a substrate camera 15 attached to the mounting head 14, and a base The component camera 16 provided between the conveyor mechanism 11 and the parts feeder 12, the nozzle changer 17 provided on the base, the part disposal box 18, and the control device 19 housed in the base are provided.

  1 and 2, the mounting head 14 is provided with a plurality of shaft-like nozzle mounting members 21 extending downward, and suction nozzles 22 are detachably attached to the lower ends of the nozzle mounting members 21. ing. Each nozzle mounting member 21 is moved up and down with respect to the mounting head 14 and rotated about the vertical axis by a nozzle mounting member driving mechanism 23 provided in the mounting head 14.

  In FIG. 2, each nozzle attachment member 21 is provided with a nozzle attachment member inner conduit 21 a, and each suction nozzle 22 is provided with an nozzle inner conduit 22 a. In a state where the suction nozzle 22 is attached to the lower end portion of the nozzle attachment member 21, the nozzle inner conduit 22a of the suction nozzle 22 is connected to the nozzle attachment member inner conduit 21a.

  In FIG. 2, the nozzle attachment member inner pipe 21 a provided in each nozzle attachment member 21 is connected to the nozzle attachment member 21, extends outside the nozzle attachment member 21, and further extends inside the mounting head 14. It is connected to a tube-shaped external conduit 24. The external pipe 24 is branched into a negative pressure supply pipe 24a and a positive pressure supply pipe 24b in the mounting head 14, the negative pressure supply pipe 24a is connected to the negative pressure source 25, and the positive pressure supply pipe 24b is connected to the positive pressure supply pipe 24b. It is connected to the pressure source 26. The negative pressure source 25 and the positive pressure source 26 are provided outside the mounting head 14.

  A negative pressure control valve 27 is interposed in the negative pressure supply line 24a, and a positive pressure control valve 28 is interposed in the positive pressure supply line 24b. The negative pressure control valve 27 can open and close the negative pressure supply line 24a and adjust the opening, and the positive pressure control valve 28 can open and close the positive pressure supply line 24b and adjust the opening.

  The negative pressure control valve 27 opens the negative pressure supply line 24a in a state where the positive pressure supply line 24b is closed by the positive pressure control valve 28, and the negative pressure supplied from the negative pressure source 25 is applied to the external line 24 and the nozzle. It is made to supply in the nozzle internal conduit 22a through the attachment member internal conduit 21a. The level of the negative pressure at this time is adjusted by the opening of the negative pressure supply line 24a by the negative pressure control valve 27.

  The positive pressure control valve 28 opens the positive pressure supply line 24b in a state where the negative pressure supply valve 24a is closed by the negative pressure control valve 27, and the positive pressure supplied from the positive pressure source 26 is applied to the external line 24 and It is made to supply from the nozzle attachment member inner pipe line 21a into the nozzle inner pipe line 22a. The level of the positive pressure at this time is adjusted by the opening degree of the positive pressure supply line 24b by the positive pressure control valve 28.

  Thus, in the present embodiment, the nozzle attachment member inner conduit 21a and the outer conduit 24 are pressure conduits 30 extending from the inside of the nozzle attachment member 21 through the outside of the nozzle attachment member 21 (FIG. 2) The negative pressure control valve 27 and the positive pressure control valve 28 are pressure switching means for switching and supplying the negative pressure and the positive pressure into the suction nozzle 22 via the pressure line 30.

  The conveyor mechanism 11 is controlled by the control device 19 to carry and position the substrate 2, and each part feeder 12 is controlled by the control device 19 to supply the component 4 to a predetermined component supply port 12a (FIG. 1).

  The mounting head 14 is moved when the control device 19 controls the operation of the head moving robot 13, and the control device 19 moves the suction nozzle 22 included in the mounting head 14 up and down and rotates with respect to the mounting head 14. 23 is performed by performing the operation control. In addition, the control device 19 controls the operation of the negative pressure control valve 27 and the positive pressure control valve 28 for switching supply of the negative pressure or the positive pressure to the in-nozzle pipeline 22 a of each suction nozzle 22 provided in the mounting head 14. Made by.

  In FIG. 1, the board camera 15 is provided with the imaging field of view facing downward, and the component camera 16 is provided with the imaging field of view facing upward. The control of the imaging operation by the substrate camera 15 and the imaging operation by the component camera 16 are performed by the control device 19, and the image data obtained by the imaging operation of the substrate camera 15 and the image data obtained by the imaging operation of the component camera 16 are The image is processed by being transmitted to the control device 19.

  The nozzle changer 17 is a place where the suction nozzle 22 attached to the nozzle mounting member 21 is placed. When changing the type of the suction nozzle 22 to be used, the nozzle changer 17 removes a foreign substance W (FIG. 2) in the pressure line 30 to be described later. It is used as a place for temporarily placing the suction nozzle 22 removed from the nozzle mounting member 21 during maintenance to be removed.

  The component disposal box 18 discards a component 4 that is determined to be in a defective state in the process of mounting the component 4 on the substrate 2 by the mounting head 14 described later. That is, the component disposal box 18 is a component disposal section in which the component 4 once adsorbed by the adsorption nozzle 22 is discarded.

  When performing a component mounting operation for mounting the component 4 on each electrode 3 on the substrate 2, the control device 19 of the component mounting apparatus 1 is first sent from another device (not shown) on the upstream process side. Then, the substrate 2 is carried in by the conveyor mechanism 11 and stopped at a predetermined work position to position the substrate 2 (step ST1 shown in FIG. 3).

  After positioning the substrate 2, the control device 19 moves the mounting head 14 to position the substrate camera 15 above the substrate 2, and places a pair of substrate marks 2 m (FIG. 1) on the substrate 2 on the substrate camera 15. Image recognition is performed by imaging. Then, the positional deviation of the substrate 2 from the reference position is obtained by comparing the position of the obtained pair of substrate marks 2m with a preset reference position (step ST2 shown in FIG. 3).

  When the control device 19 obtains a positional deviation from the reference position of the substrate 2, the control device 19 controls the operation of the parts feeder 12 to supply the parts 4 to the parts supply port 12 a, and the lower end portion of the suction nozzle 22 is the parts feeder 12. The mounting head 14 is moved so as to be positioned above the component supply port 12a, and the operation control of the negative pressure control valve 27 and the positive pressure control valve 28 of the pressure line 30 connected to the suction nozzle 22 is performed. Thus, a negative pressure is generated in the nozzle inner pipe line 22a, and the component 4 is sucked by the suction nozzle 22 (step ST3 shown in FIG. 3).

  When the component 19 is attracted to the suction nozzle 22, the control device 19 moves the mounting head 14 so that the component 4 passes above the component camera 16, and causes the component camera 16 to image the component 4 to recognize the image. This is performed (step ST4 shown in FIG. 3). Then, after calculating the positional deviation of the component 4 with respect to the suction nozzle 22 (step ST5 shown in FIG. 3), the mounting head 14 is positioned above the substrate 2.

  When the mounting device 14 is positioned above the substrate 2, the control device 19 lowers the suction nozzle 22 (nozzle mounting member 21) with respect to the substrate 2, while the negative pressure line 30 connected to the suction nozzle 22 is negative. By controlling the operation of the pressure control valve 27 and the positive pressure control valve 28, a positive pressure is generated in the nozzle inner passage 22 a, the component 4 is separated from the suction nozzle 22, and the component 4 is mounted on the electrode 3 on the substrate 2. (Step ST6 shown in FIG. 3). When the component 4 is mounted on the substrate 2, the control device 19 is obtained by the positional deviation of the substrate 2 obtained by imaging the substrate mark 2 m by the substrate camera 15 and the imaging of the component 4 by the component camera 16. The position and rotation direction of the suction nozzle 22 are corrected so that the positional deviation of the component 4 with respect to the suction nozzle 22 is canceled.

  If the control device 19 recognizes that the component 4 is in a defective state as a result of performing the image recognition of the component 4 in step ST4, the control device 19 does not mount the component 4 on the substrate 2 but mounts the mounting head. 14 is moved above the component disposal box 18, positive pressure is supplied into the suction nozzle 22, and the component 4 is dropped into the component disposal box 18 and discarded.

  When the mounting of the components 4 on the board 2 is completed in step ST6, the control device 19 determines whether or not the mounting of all the components 4 to be mounted on the board 2 is completed (step ST7 shown in FIG. 3). . As a result, when all the components 4 to be mounted on the substrate 2 have not been mounted, the process returns to step ST3 to suck the next component 4 by the suction nozzle 22, and all the components 4 to be mounted on the substrate 2 are sucked. When the mounting of the component 4 has been completed, the conveyor mechanism 11 is operated to carry the board 2 out of the component mounting apparatus 1 (step ST8 shown in FIG. 3).

  Next, in the component mounting apparatus 1 having such a configuration, a procedure for performing maintenance work for removing foreign matter W such as dust and dust sucked from the suction nozzle 22 during vacuum suction of the component 4 from the inside of the pressure line 30 will be described. .

  When performing a maintenance operation, the control device 19 of the component mounting apparatus 1 first places the suction nozzle 22 currently attached to the nozzle attachment member 21 on the nozzle changer 17 so as to place the suction nozzle 22 from the nozzle attachment member 21. Is removed (nozzle removal step). Then, after moving the mounting head 14 so that the nozzle mounting member 21 with the suction nozzle 22 removed is positioned above the component disposal box 18 (mounting head moving step), positive pressure is applied in the pressure line 30. To discharge the foreign matter W in the pressure line 30 to the outside of the nozzle mounting member 21 (blow process, FIG. 4).

  Since this blowing step is performed in a state where the suction nozzle 22 is removed from the nozzle mounting member 21, the foreign matter W having an outer diameter larger than the inner diameter of the pipe line in the suction nozzle 22 (nozzle pipe line 22a) is discharged. be able to. For this reason, it can prevent that the big foreign material W continues remaining in the pressure line 30, can prevent the fall of adsorption power, and can reduce the frequency of occurrence of adsorption mistakes.

  Further, the blowing step is performed in a state where the mounting head 14 is moved so that the nozzle mounting member 21 with the suction nozzle 22 removed is positioned above the component disposal box 18 which is a component disposal section. Therefore, it is possible to prevent the foreign matter W from being scattered around during the blowing process.

  A maintenance method for a component mounting apparatus that prevents foreign matter from remaining in a pressure line that extends from the inside of a nozzle mounting member to the outside of the nozzle mounting member, thereby reducing the frequency of occurrence of suction mistakes. provide.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 4 Component 14 Mounting head 18 Component disposal box (component disposal part)
21 Nozzle mounting member 22 Adsorption nozzle 30 Pressure line W Foreign matter

Claims (1)

A suction nozzle is detachably attached to a nozzle mounting member provided in a movable mounting head, and negative pressure and positive pressure are applied to the suction nozzle through a pressure line extending from the inside of the nozzle mounting member to the outside of the nozzle mounting member. It is a maintenance method for a component mounting apparatus that mounts a component on a board by performing vacuum suction of the part by a suction nozzle and detaching the part on the board by switching supply,
A nozzle removing step for removing the suction nozzle from the nozzle mounting member of the mounting head;
Look containing a blowing step of discharging the foreign substances of the said pressure conduit to supply a positive pressure to the pressure conduit in the state of detaching the suction nozzle from the nozzle mounting member of the mounting head outside the nozzle mounting member,
The blowing step is performed in a state where the mounting head is moved so that the nozzle mounting member with the suction nozzle removed is positioned above the component disposal unit where the component once sucked by the suction nozzle is discarded. The maintenance method of the component mounting apparatus characterized.

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